Curing device and curing method for processor firmware

Abstract

The invention belongs to the field of aviation, and particularly relates to a curing device and method for processor firmware, a burner and a board card. The board card comprises a board card debugging interface, an interface driving chip, a FLASH chip and a processor connected with the FLASH chip; the board card debugging interface is in pluggable connection with the programmer, the board card debugging interface obtains electricity through the programmer and supplies power to the FLASH chip and the interface driving chip through a first power line, an A bus of the interface driving chip is connected with the board card debugging interface, a B bus of the interface driving chip is connected with the FLASH chip, and the FLASH chip is connected with the FLASH chip through a second power line. An enabling pin of the interface driving chip is connected with a bus A and a bus B when the level is low, and is disconnected with the bus A and the bus B when the level is high; and the board card power supply is connected with the FLASH chip power supply interface, the interface driving chip power supply interface, the enabling pin of the interface driving chip and the processor power supply interface through a second power line.

Description

Technical Field

[0001] The present application belongs to the field of aviation, and in particular relates to a processor firmware curing device and curing method. Background Art

[0002] In the existing aviation field, all new projects require 100% national production. In the embedded field, domestic FPGA and domestic DSP have inherited the JTAG debugging and firmware curing capabilities of imported chips, but Feiteng's 2000 series domestic processors do not support JTAG functions, and the original card holder mode is only suitable for ground debugging and verification, and does not meet aviation vibration requirements. Some manufacturers choose to cure first and then weld, but there is a risk of FLASH abnormalities and "bricking" of the board due to misoperation in the later maintenance stage. When a "bricking" failure occurs, the FLASH needs to be re-burned. This method requires removing the chassis cover and module cold plate and other cumbersome operations.

[0003] According to the current situation, there are the following problems:

[0004] (1) The FLASH card holder method recommended by the manufacturer does not meet the aviation vibration conditions;

[0005] (2) Some manufacturers use the method of curing first and then welding. There is a risk of abnormal FLASH data and "bricked" board in the later stage. For example, once the FLASH data is abnormal, it is not able to be cured again, resulting in cumbersome re-curing operation. Summary of the invention

[0006] In order to solve the above problems, the present application provides a processor firmware curing device, including:

[0007] Burner and board;

[0008] The board includes a board debugging interface, an interface driver chip, a FLASH chip, and a processor connected to the FLASH chip;

[0009] The board debugging interface is pluggably connected to the burner, the board debugging interface obtains power through the burner and supplies power to the FLASH chip and the interface driver chip through the first power line, the A bus of the interface driver chip is connected to the board debugging interface, the B bus of the interface driver chip is connected to the FLASH chip, and the enable pin of the interface driver chip connects the A bus and the B bus when the level is low, and disconnects the A bus and the B bus when the level is high;

[0010] The board power supply is connected to the FLASH chip power interface, the interface driver chip power interface, the enable pin of the interface driver chip and the processor power interface through the second power line.

[0011] Preferably, the burner includes a main control machine and a burning tool connected to the main control machine, and the burning tool is pluggably connected to the board debugging interface.

[0012] Preferably, the processor comprises a Feiteng processor of model D2000.

[0013] Preferably, both the board power supply and the board debugging interface provide a 1.8V voltage.

[0014] Preferably, the board power supply includes an external power supply or a board built-in power supply.

[0015] A processor firmware curing method, using the processor firmware curing device:

[0016] Step s1: The board power supply remains off and the board is connected to the burner;

[0017] Step s2: the burner opens the burning software, and the first power line supplies power to the FLASH and the interface driver chip; the board power is turned off, the enable pins of the processor and the interface driver chip are not powered, the A bus and the B bus are connected, and the burner burns the firmware to the FLASH;

[0018] Step s3: After the firmware is successfully burned, the board is disconnected from the burner and the first power line is powered off;

[0019] Step s4: the board power supplies power to the FLASH chip power interface, the interface driver chip power interface, the enable pin of the interface driver chip and the processor power interface through the second power line, and the A bus is disconnected from the B bus; the processor loads the firmware from the FLASH chip.

[0020] The advantages of this application include: the method continues the production and development habits of imported processor boards, realizes the solidification of D2000 firmware through the debugging daughter card, improves the flexibility of the module, and greatly reduces the maintenance cost;

[0021] Since Feiteng processors do not follow the JTAG debugging habits of imported processor boards, the initial curing and subsequent maintenance of the boards are somewhat complicated. For example, some manufacturers cure the FLASH before mounting it. The increase in processes will inevitably lead to increased costs and risks.

[0022] The present invention aims to avoid the costs and risks brought by the above-mentioned mode. Following the debugging habit of imported processor boards, the D2000 firmware is still solidified by the host computer + debugging daughter card. Even if an error operation occurs in the later maintenance, resulting in abnormal FLASH data, it can still be solidified by the above-mentioned method without any hardware operation steps and no longer using the FLASH card holder, which greatly improves reliability, reduces maintenance burden and reduces risks. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of a firmware-cured design circuit based on the Feiteng processor D2000 in a preferred embodiment of the present application;

[0024] Figure 2 This is a firmware curing flow chart based on the Feiteng processor D2000 in a preferred embodiment of the present application. DETAILED DESCRIPTION

[0025] In order to make the technical solution and advantages of the present application clearer, the technical solution of the present application will be further described in detail in detail and in detail in conjunction with the accompanying drawings. It can be understood that the specific embodiments described here are only partial embodiments of the present application, which are only used to explain the present application, not to limit the present application. It should be noted that, for the convenience of description, only the parts related to the present application are shown in the accompanying drawings, and other related parts can refer to the general design. In the absence of conflict, the embodiments in the present application and the technical features in the embodiments can be combined with each other to obtain new embodiments.

[0026] like Figure 1-Figure 2 As shown, the present application provides a processor firmware curing device, including:

[0027] Burner and board;

[0028] The board includes a board debugging interface, an interface driver chip, a FLASH chip, and a processor connected to the FLASH chip;

[0029] The board debugging interface is pluggably connected to the burner, the board debugging interface obtains power through the burner and supplies power to the FLASH chip and the interface driver chip through the first power line, the A bus of the interface driver chip is connected to the board debugging interface, the B bus of the interface driver chip is connected to the FLASH chip, and the enable pin of the interface driver chip connects the A bus and the B bus when the level is low, and disconnects the A bus and the B bus when the level is high;

[0030] The board power supply is connected to the FLASH chip power interface, the interface driver chip power interface, the enable pin of the interface driver chip and the processor power interface through the second power line.

[0031] Among them, the interface driver chip: supports controllable interface direction and controllable interface three-state. Take TI's SN74LVC4T245 or Shenzhen Guowei SM4T245 as examples:

[0032] Enable pin OE_n Direction control pin DIR Bus Operation Low Low B bus to A bus Low high A bus to B bus high Low or High High Configuration

[0033] FLASH: FLASH supports SPI and QSPI adaptive capabilities;

[0034] The computer supports USB interface and has the FLASH burner host software installed.

[0035] Board: Yes Figure 1 The circuit shown is an interface driver chip SM4T245 (which completes the SPI interface switching from FALSH to the debugging interface). It requires that the interface driver chip and FLASH can receive the power supply of the board itself and the burner. The enable pin OE_N is connected to the power supply of the board itself, and a 1K-10K ohm pull-down resistor is connected to ensure that the interface is automatically switched on and off under different power supplies.

[0036] Burner: used to convert USB to SPI bus, connected to the SPI of the board debug interface, and provide 1.8V power supply and ground;

[0037] Software: Install the FLASH burner host software to burn the firmware file into FLASH;

[0038] Hardware: PC with USB interface.

[0039] Preferably, the burner includes a main control machine and a burning tool connected to the main control machine, and the burning tool is pluggably connected to the board debugging interface.

[0040] Preferably, the processor comprises a Feiteng processor of model D2000.

[0041] A processor firmware curing method, using the processor firmware curing device:

[0042] The board remains unpowered;

[0043] The main control machine is connected to the burner, the burner is connected to the debug daughter card, and the debug daughter card is inserted into the board debug interface;

[0044] The host computer opens the burning software, and the burning machine provides 1.8V power to the FLASH and interface driver chip. Since the D2000 has no power supply, the SPI bus from the FLASH to the D2000 is disconnected;

[0045] Since the board is not powered and does not provide 1.8V power, the interface driver chip OE_n is low, automatically opening the SPI path from FLASH to the burner, and the host computer starts to burn the firmware into FLASH;

[0046] If the FLASH firmware is not burned successfully, reconnect and burn;

[0047] If the firmware is successfully burned, disconnect the burner from the debug daughter card, and the burner will no longer supply power to the FLASH and interface driver chip;

[0048] The board is powered normally, D2000, FLASH and the interface driver chip receive the board power. At this time, the interface driver chip OE_n is high, automatically disconnecting the SPI path from FLASH to the burner, and D2000 loads the firmware from FLASH normally;

[0049] If D2000 is loaded successfully, it means the firmware is successfully solidified. If D2000 fails to load, check the firmware version and re-burn it.

[0050] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A processor firmware curing device, characterized in that: include: Burner and board; The board includes a board debugging interface, an interface driver chip, a FLASH chip to be burned, and a processor connected to the FLASH chip; The board debugging interface is pluggably connected to the burner, the board debugging interface can obtain power through the burner and supply power to the FLASH chip and the interface driver chip through the first power line, the A bus of the interface driver chip is connected to the board debugging interface, the B bus of the interface driver chip is connected to the FLASH chip, and the enable pin of the interface driver chip connects the A bus and the B bus when the level is low, and disconnects the A bus and the B bus when the level is high; The board power supply is connected to the FLASH chip power interface, the interface driver chip power interface, the enable pin of the interface driver chip and the processor power interface through the second power line.

2. The processor firmware curing device according to claim 1, characterized in that: The burner comprises a main control machine and a burning tool connected to the main control machine, and the burning tool is pluggably connected to the board debugging interface.

3. The processor firmware curing device according to claim 1, characterized in that: The processor includes the Feiteng processor model D2000.

4. The processor firmware curing device according to claim 1, characterized in that: The board power supply and board debug interface both provide 1.8V voltage.

5. The processor firmware curing device according to claim 1, characterized in that: The board power supply includes an external power supply or a board built-in power supply.

6. A processor firmware curing method, using the processor firmware curing device according to any one of claims 1 to 5, characterized in that: Step s1: The board power supply remains off and the board is connected to the burner; Step s2: the burner opens the burning software, and the first power line supplies power to the FLASH and the interface driver chip; the board power is turned off, the enable pins of the processor and the interface driver chip are not powered, the A bus and the B bus are connected, and the burner burns the firmware to the FLASH; Step s3: After the firmware is successfully burned, the board is disconnected from the burner and the first power line is powered off; Step s4: the board power supplies power to the FLASH chip power interface, the interface driver chip power interface, the enable pin of the interface driver chip, and the processor power interface through the second power line, and the A bus is disconnected from the B bus; The processor loads the firmware from the FLASH chip.

Images