Wafer counting method and device, storage medium and computer program product

Abstract

The invention discloses a wafer counting method and device, a storage medium and a computer program product, and the method comprises the steps: enabling a camera module to be aligned with an opening surface of a wafer storage device, and enabling a light source module to provide backlight illumination for wafers in the wafer storage device; the carrying mechanism drives the camera module to rotate and move parallel to the opening surface of the wafer storage device, so that the camera module acquires slot position images, and meanwhile, the processing module acquires wafer conditions according to the slot position images; the processing module obtains the number of wafers according to the conditions of the wafers and screens out the number of storage grooves and the warping state of the wafer storage device. According to the method and the device, warping and incomplete information of wafer storage and different positions can be accurately identified, and particularly, the warping degree of the wafer can be accurately identified from multiple angles, so that the safety of subsequently taking and placing the wafer can be improved. In addition, the light source module is arranged on the back face of the wafer storage device and is ingeniously integrated in the dust cover, and the formed backlight illumination mode enables the obtained image to be clearer.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a wafer counting method, device, storage medium and computer program product. Background Art

[0002] In the semiconductor process, in order to protect the wafers, they are generally placed in wafer boxes for storage or transportation. Some wafers with high cleanliness requirements also need to be placed in boxes with sealed lids. In the production process, based on manual operation or equipment automation, wafers need to be repeatedly taken out of the wafer box and put back into the wafer box, so wafer leakage may occur. When a wafer is missed in the wafer box, if there is no corresponding wafer counting device to detect the wafers in the wafer box, it will affect the efficiency of picking and placing, and may even break the wafer and cause losses.

[0003] In the prior art, laser sensors + linear motion are usually used to detect wafers in a wafer box. However, the above technical solution is difficult to detect beveled and stacked wafers, and the appearance of beveled and stacked wafers can only be avoided by production management. It is even more impossible to effectively identify warped wafers and dynamically adjust the coordinate values ​​of wafer placement based on the identification results to avoid breaking the wafers. At the same time, as the thickness of wafers becomes thinner and thinner, laser sensors have poor recognition of thin wafers, are prone to omissions, and can only identify single points, making it impossible to monitor the wafers in the wafer box in place. Summary of the invention

[0004] The purpose of the present application is to provide a wafer counting method, device, storage medium and computer program product to solve the technical problem that the existing wafer counting device in the prior art has poor recognition of wafers in a wafer material box. The preferred technical solutions among the many technical solutions provided in the present application can produce many technical effects as described below.

[0005] To achieve the above objectives, this application provides the following technical solutions: The first aspect of the present application provides a wafer counting method, comprising: a camera module is aligned with an opening surface of a wafer storage device, and a light source module provides backlight illumination to the wafers in the wafer storage device; a transport mechanism drives the camera module to rotate and move parallel to the opening surface of the wafer storage device, so that the camera module collects a slot image of each layer of slots in the wafer storage device, and a processing module obtains the wafer status of each layer of slots according to the slot image; the processing module obtains the number of wafers according to the wafer status, and screens out the number of storage slots and the warping status of the wafer storage device.

[0006] In some embodiments, the processing module obtains the wafer condition of each layer of slots according to the slot image, including: the processing module obtains the wafer thickness of the wafer on each layer of slots; for any layer of slots in the wafer storage device, if there is no wafer image in the slot image, the processing module determines that the wafer condition is missing wafers; if the wafer thickness is greater than a preset thickness, the processing module determines that the wafer condition is overlapping wafers; if the bottom of the wafer in the wafer image intersects with the bottom of the slot in the slot image, the processing module determines that the wafer condition is a skewed wafer.

[0007] In some embodiments, the conveying mechanism drives the camera module to rotate and move parallel to the opening surface of the wafer storage device, so that the camera module collects slot images of each layer of slots in the wafer storage device, including: the conveying mechanism drives the camera module to rotate along the horizontal direction of the same layer of slots, so that the camera module collects slot images of the same layer of slots from multiple angles; after collecting the slot images of the same layer of slots, the conveying mechanism drives the camera module to move to another layer of slots along a direction parallel to the opening surface of the wafer storage device, so that the camera module starts to collect slot images of another layer of slots from multiple angles, until the camera module completes collecting slot images of each layer of slots in the wafer storage device.

[0008] In some embodiments, the processing module obtains the wafer status of each layer of slots according to the slot image, and also includes: the processing module obtains the warpage and safety distance of the wafer on each layer of slots.

[0009] In some embodiments, the transport mechanism includes a robotic arm; the wafer counting method also includes: the processing module obtains the coordinate information of the wafer according to the number of storage slots of the wafer storage device and the warping state; the processing module obtains the safe transport coordinates of the wafer according to the coordinate information, the warping degree and the safety distance; the transport mechanism instructs the robotic arm to take or store the wafer from the wafer storage device according to the safe transport coordinates.

[0010] In some embodiments, the wafer counting method further includes: a propulsion mechanism drives the wafer storage device to move in a direction close to the camera module.

[0011] In some embodiments, the wafer storage device includes a front cover; the wafer counting method further includes: a cover opening mechanism unlocks and removes the front cover.

[0012] The second aspect of the present application provides a wafer counting device, comprising: a material loading and unloading module, a light source module and a wafer storage device, wherein the material loading and unloading module comprises a camera module, a conveying mechanism and a processing module; the camera module is aligned with the opening surface of the wafer storage device; the light source module provides backlight illumination to the wafers in the wafer storage device; the conveying mechanism drives the camera module to rotate and move parallel to the opening surface of the wafer storage device, so that the camera module collects a slot image of each layer of slots in the wafer storage device; the processing module obtains the wafer status of each layer of slots according to the slot image, obtains the number of wafers according to the wafer status, and screens out the number of storage slots and the warping status of the wafer storage device.

[0013] A third aspect of the present application provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed, the wafer counting method as described above is implemented.

[0014] A fourth aspect of the present application provides a computer program product, which is stored on a data carrier and is designed to execute the wafer counting method as described above.

[0015] Implementing one of the above technical solutions of the present application has the following advantages or beneficial effects: In the present application, a transport mechanism is used to drive the camera module to rotate and move parallel to the opening surface of the wafer storage device to collect the slot image of each slot layer; the processing module obtains the wafer condition, number of wafers, number of storage slots and warping state of each slot layer according to the slot image. In this case, the camera module can collect multiple positions of each slot layer based on multiple angles and a large range, and can more accurately identify storage problems such as missing wafers, oblique wafers, and stacked wafers. At the same time, it can also obtain the warping or incomplete information of different positions of the wafer, especially the degree of wafer warping can be accurately identified from multiple angles, thereby improving the safety of subsequent wafer placement. In addition, the present application cleverly integrates the light source module into the dust cover by setting it on the back of the wafer storage device, and the backlighting method formed makes the obtained image clearer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. It is obvious that the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work. In the drawings: Figure 1 1 is a schematic diagram of a process of a wafer counting method according to an embodiment of the present application; Figure 2It is a schematic diagram of an application scenario of an embodiment of the present application; Figure 3 is another schematic diagram of an application scenario of an embodiment of the present application; Figure 4 It is a schematic diagram of the two sides of the rotating acquisition slot of the camera module in an embodiment of the present application; Figure 5 is a schematic diagram of a moving path of a transport mechanism according to an embodiment of the present application; Figure 6 is a schematic diagram of a wafer condition of an embodiment of the present application; Figure 7 It is a schematic diagram of the warpage and safety distance of the wafer according to an embodiment of the present application.

[0017] In the figure: 1. light source module; 2. wafer storage device; 3. propulsion mechanism; 4. cover opening mechanism; 5. camera module; 6. transport mechanism; 60. robotic arm. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the present application clearer, the various exemplary embodiments to be described below will refer to the corresponding drawings, which constitute a part of the exemplary embodiments, wherein various exemplary embodiments that may be used to implement the present application are described. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation methods described in the following exemplary embodiments do not represent all implementation methods consistent with the present disclosure. It should be understood that they are only examples of processes, methods, and devices that are consistent with some aspects disclosed in the present application as detailed in the attached claims, and other embodiments may also be used, or the embodiments listed herein may be modified in structure and function without departing from the scope and essence of the present application.

[0019] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", etc. indicate the orientation or positional relationship based on the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the elements referred to must have a specific orientation, be constructed and operated in a specific orientation. The terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The term "multiple" means two or more. The terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a communication connection, a direct connection, an indirect connection through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more related listed items. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0020] In order to illustrate the technical solution described in the present application, a specific embodiment is provided below, and only the parts related to the embodiment of the present application are shown.

[0021] like Figure 1 As shown, the present application provides a wafer counting method, which may include the following steps (step S1 to step S3): S1 . The camera module 5 is aligned with the opening surface of the wafer storage device 2 , and the light source module 1 provides backlight illumination to the wafer in the wafer storage device 2 .

[0022] In some embodiments, the wafer counting method of the embodiment of the present application can be applied to a material handling module, and the material handling module can be configured to obtain the wafer status in the wafer storage device 2, and take out or store the wafer from the wafer storage device 2 according to the wafer status.

[0023] In some embodiments, Figure 2 As shown, the loading and unloading module may include a camera module 5 and a conveying mechanism 6. The camera module 5 may be configured to collect slot images; the conveying mechanism 6 may be configured to drive the camera module 5 to rotate and move. The wafer storage device 2 may include multiple layers of slots for placing wafers, and the camera module 5 may collect slot images of each layer of slots. The wafer condition of the wafer on each layer of slots may be determined through the slot images of each layer of slots.

[0024] In some embodiments, the light source module 1 may be disposed on the back side of the wafer storage device 2. The light source module 1 may be integrated into a dust cover to form backlighting.

[0025] In some embodiments, the opening surface of the wafer storage device 2 may have an opening. The camera module 5 is aligned with the opening surface of the wafer storage device 2 may refer to the opening of the camera module 5 facing the wafer storage device 2. The opening surface of the wafer storage device 2 may refer to the front side of the wafer storage device 2. The light source module 1 may be arranged relative to the pick-and-place module with respect to the wafer storage device 2.

[0026] In some embodiments, the camera module 5 may be a CCD camera. A CCD camera may include a charge coupled device (CCD); a charge coupled device can convert light signals into electrical signals. Specifically, when light is focused on the CCD chip through the camera lens, each pixel on the chip will generate corresponding charges according to the received light intensity, and these charges can be converted into voltage signals, and finally converted into digital signals through an analog-to-digital converter (ADC), and finally form a slot image.

[0027] In some embodiments, the light source module 1 can be used to provide a backlight source for the wafer storage device 2 to illuminate the wafer in the wafer storage device 2. Generally speaking, the light reflected by the thin wafer thickness direction is not enough to produce an image area with sufficient brightness difference to be distinguished, so by setting the light source module 1 on the back of the wafer storage device 2 to provide backlighting, the captured slot image can be made clearer.

[0028] In some embodiments, the wafer counting method may further include: the propulsion mechanism 3 drives the wafer storage device 2 to move in a direction close to the camera module 5 .

[0029] In some embodiments, the propulsion mechanism 3 can be used to carry the wafer storage device 2. The propulsion mechanism 3 can drive the wafer storage device 2 to a preset position; when the wafer storage device 2 is at the preset position, the loading and unloading module can collect the slot image in the wafer storage device 2, and can take out or store the wafer from the wafer storage device 2.

[0030] In some embodiments, the wafer storage device 2 may include a front cover. The wafer counting method may further include: the cover opening mechanism 4 unlocks and removes the front cover.

[0031] In some embodiments, Figure 3 As shown, the cover opening mechanism 4 can carry the front cover away from the wafer storage device 2. For example, it can be lowered in a direction parallel to the opening surface of the wafer storage device 2. In this way, space can be freed up for the transport mechanism 6 to perform image acquisition and take and place materials. The direction parallel to the opening surface of the wafer storage device 2 can refer to the Z-axis direction of the wafer storage device 2.

[0032] S2. The transport mechanism 6 drives the camera module 5 to rotate and move parallel to the opening surface of the wafer storage device 2, so that the camera module 5 collects the slot image of each layer of the slot in the wafer storage device 2, and the processing module obtains the wafer status of each layer of the slot according to the slot image.

[0033] In some embodiments, the transport mechanism 6 drives the camera module 5 to rotate and move parallel to the opening surface of the wafer storage device 2, so that the camera module 5 collects the slot image of each layer of slots in the wafer storage device 2, which may include: the transport mechanism 6 drives the camera module 5 to rotate along the horizontal direction of the same layer of slots, so that the camera module 5 collects the slot image of the same layer of slots from multiple angles; after collecting the slot image of the same layer of slots, the transport mechanism 6 drives the camera module 5 to move to another layer of slots in a direction parallel to the opening surface of the wafer storage device 2, so that the camera module 5 starts to collect the slot image of another layer of slots from multiple angles, until the camera module 5 collects the slot image of each layer of slots in the wafer storage device 2. In this case, the camera module 5 can collect the slot image of each layer of slots layer by layer from multiple angles, so that the wafer condition of each layer of slots can be accurately judged and the error can be reduced.

[0034] In some embodiments, Figure 4 As shown, the transport mechanism 6 can drive the camera module 5 to rotate along the R axis; the R axis direction can be parallel to the horizontal direction of the slot. Specifically, the transport mechanism 6 can align the center of the field of view of the camera module 5 with one side of the slot, and then the transport mechanism 6 can drive the camera module 5 to rotate so that the center of the field of view of the camera module 5 is aligned with the other side of the slot; at this time, the camera module 5 can scan from one side of the slot to the other side of the slot to collect the slot image. Therefore, as the transport mechanism 6 switches multiple angles to scan, the camera module 5 can obtain the warping information or incomplete information of different positions of the wafer on the slot, so that the posture of the warped wafer can be identified in a large range.

[0035] In other embodiments, the transport mechanism 6 can also align the field of view of the camera module 5 with the center of the slot to directly capture the slot image. Specifically, the transport mechanism 6 can rotate the camera module 5 directly to face the center of the slot to capture the slot image; the camera module 5 can also capture the slot image when passing through the center of the slot as the transport mechanism 6 rotates. In this way, it is more convenient to perform conventional scanning by the camera module 5 to obtain the slot image.

[0036] In some embodiments, the transport mechanism 6 can drive the camera module 5 to move to the next slot in a direction parallel to the opening surface of the wafer storage device 2, so that the center of the camera module 5's field of view is aligned with the other side of the next slot; then the transport mechanism 6 can drive the camera module 5 to rotate, so that the camera module 5 starts to collect the slot image of this layer; when the center of the camera module 5's field of view is aligned with one side of the slot in the same layer, it can be considered that the slot image collection of this layer is completed. As described above, the camera module 5 can scan from the other side of the slot to the one side of the slot to collect the slot image of the next slot.

[0037] In some embodiments, Figure 5 As shown, the moving paths of the transport mechanism 6 on two adjacent layers can be opposite. Therefore, by optimizing the moving path, the efficiency of the camera module 5 in collecting images can be improved on the one hand, and the collected images can be made more complete on the other hand. The transport mechanism 6 can drive the camera module 5 to collect the slot images of each slot layer by layer.

[0038] In some embodiments, the processing module obtains the wafer condition of each layer of slots according to the slot image, which may include: the processing module obtains the wafer thickness of the wafer on each layer of slots; for any layer of slots in the wafer storage device 2, if there is no wafer image in the slot image, the processing module determines that the wafer condition is missing wafers; if the wafer thickness is greater than or equal to the preset thickness, the processing module determines that the wafer condition is overlapped wafers; if the bottom of the wafer in the wafer image intersects with the bottom of the slot in the slot image, the wafer condition is determined to be a skewed wafer.

[0039] In some embodiments, the wafer angle may refer to the angle between the wafer of the wafer image and the horizontal direction. In some embodiments, if the wafer angle is greater than or equal to a preset angle, the processing module may also determine that the wafer condition is a tilted wafer.

[0040] In some embodiments, when the wafer condition is a wafer with fewer wafers, stacked wafers, or tilted wafers, the layer may be considered as an abnormal layer number.

[0041] In some embodiments, if the wafer thickness is equal to the initial thickness of the wafer, or the wafer thickness is within a preset range of the initial thickness, and the bottom of the wafer in the wafer image is parallel to the bottom of the slot in the slot image, the processing module can determine that the wafer condition is a normal wafer, that is, the layer is a normal layer number. For example, when the initial thickness of the wafer is t, the preset range of the initial thickness can be 0.9t to 1.1t.

[0042] In some embodiments, Figure 6As shown, the preset thickness can be twice the initial thickness, that is, if the wafer thickness is greater than or equal to 2t, the processing module can determine that the wafer condition is a stacked wafer. For thin wafers whose thickness is close to or even less than the sensor resolution, traditional recognition methods are prone to missed detection or failure to recognize stacked wafers, resulting in errors in the judgment of the wafer condition and causing losses. In an embodiment of the present application, on the one hand, the light source module 1 provides backlight illumination, which can make the collected slot image clearer; on the other hand, the camera module 5 collects slot images layer by layer from multiple angles, which can improve the accuracy of recognizing the wafer condition and warping state of the wafer, thereby improving efficiency.

[0043] In some embodiments, the processing module obtains the wafer status of each layer of wafers according to the wafer image, and may also include: the processing module obtains the warpage and safety distance of the wafers on each layer of slots.

[0044] In some embodiments, Figure 7 As shown, the warpage can refer to the vertical distance between the center of the wafer and the horizontal plane where the slot is located, and the safety distance can refer to the vertical distance between the center of the wafer and the horizontal plane where two points of the wafer on the next slot are located, where the two points of the wafer on the next slot can be selected according to actual needs; the safety distance can be greater than the vertical distance between the center of the wafer and the horizontal plane where the next slot is located. By obtaining the warpage and safety distance of the wafer, the wafer can be picked and placed according to the actual warpage posture information of the wafer, which can improve safety.

[0045] S3 , the processing module obtains the number of wafers according to the wafer conditions, and selects the number of storage slots and the warping state of the wafer storage device 2 .

[0046] In some embodiments, the transport mechanism 6 may include a robot arm 60 , and the robot arm 60 may be configured to take or store the wafer from the wafer storage device 2 .

[0047] In some embodiments, the wafer counting method may further include: the processing module obtains the coordinate information of the wafer according to the number of storage slots and the warping state of the wafer storage device 2; the processing module obtains the safe handling coordinates of the wafer according to the coordinate information, the warping degree and the safe distance; the handling mechanism 6 makes the robot 60 take or store the wafer from the wafer storage device 2 according to the safe handling coordinates. In this case, the handling mechanism 6 can avoid the abnormal number of layers in the wafer storage device 2, improve the efficiency of taking and placing the wafer, and avoid the risk of wafer damage; at the same time, by obtaining the safe handling coordinates of the wafer and dynamically adjusting the height of the robot 60 for taking and placing the wafer, the robot 60 can take or store the wafer more accurately, thereby improving the accuracy of taking and placing the material and reducing the risk of smashing the wafer.

[0048] In some embodiments, the normal number of layers of the wafer storage device 2 can be obtained according to the number of storage slots. The processing module can obtain the coordinate information of the wafer on the normal number of layers and the safe transportation coordinates.

[0049] In some embodiments, the coordinate information of the wafer may refer to the coordinates of a normal layer wafer in the Z-axis direction.

[0050] In some embodiments, the safe handling coordinates can be obtained according to the following formula: Z=Z 0 -h-0.5I, Among them, Z 0 It can represent the coordinate information of the wafer on the normal layer, h can refer to the warpage, and I can refer to the safety distance.

[0051] In some embodiments, the transport mechanism 6 can drive the robot arm 60 to move to a corresponding position in a direction parallel to the opening surface of the wafer storage device 2 based on the coordinate information and / or the safe transport coordinates, so that the robot arm 60 can take out or store the wafer. In this case, the robot arm 60 can be dynamically adjusted to an accurate height for taking and placing materials, and the robot arm 60 of the transport mechanism 6 can be prevented from penetrating into the wafer storage device 2 to take out or store the wafer at an incorrect height and thus breaking the wafer.

[0052] In the present application, the transport mechanism 6 is used to drive the camera module 5 to rotate and move parallel to the opening surface of the wafer storage device 2 to collect the slot image of each layer of slots; the processing module obtains the wafer condition, number of wafers, number of storage slots and warping state of each layer of slots based on the slot image. In this case, the camera module 5 can collect multiple positions of each layer of slots based on multiple angles and a large range, and can more accurately identify storage problems such as wafer shortage, oblique wafers, and stacked wafers. At the same time, it can also obtain the warping or incomplete information of different positions of the wafer, especially the degree of wafer warping can be accurately identified from multiple angles, thereby improving the safety of subsequent wafer placement. In addition, the present application cleverly integrates the light source module 1 into the dust cover by setting it on the back of the wafer storage device 2, and the backlighting method formed makes the obtained image clearer.

[0053] The present application also relates to a wafer counting device.

[0054] In some embodiments, the wafer counting device may include a loading and unloading module, a light source module 1 and a wafer storage device 2 , wherein the loading and unloading module may include a camera module 5 , a transport mechanism 6 and a processing module.

[0055] In some embodiments, the camera module 5 may be aligned with the opening surface of the wafer storage device 2 .

[0056] In some embodiments, the light source module 1 may provide backlight illumination to the wafers in the wafer storage device 2 .

[0057] In some embodiments, the transport mechanism 6 can drive the camera module 5 to rotate and move parallel to the opening surface of the wafer storage device 2 , so that the camera module 5 can collect slot images of each layer of slots in the wafer storage device 2 .

[0058] In some embodiments, the processing module can obtain the wafer status of each slot layer according to the slot image, obtain the number of wafers according to the wafer status, and filter out the number of storage slots and the warping status of the wafer storage device 2.

[0059] Those skilled in the art can understand that all or part of the features / steps of the above-mentioned method embodiments can be implemented by methods, data processing systems or computer programs, and these features can be implemented without hardware, entirely by software, or by a combination of hardware and software. The aforementioned computer program can be stored in one or more computer-readable storage media, and the storage medium stores the computer program. When the computer program is executed (such as by a processor), the steps of the above-mentioned wafer counting method embodiment are executed.

[0060] The aforementioned storage media that can store program codes include: static hard disks, solid-state hard disks, random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), optical storage devices, magnetic storage devices, flash memory, magnetic disks or optical disks and / or combinations of the above devices, that is, they can be implemented by any type of volatile or non-volatile storage device or a combination thereof.

[0061] The present application also provides an embodiment of a processing device, comprising one or more processors and a memory; wherein the memory is used to store one or more computer programs, and the one or more processors are used to execute one or more computer programs stored in the memory, so that the processor performs the features / steps of the above-mentioned wafer counting method embodiment.

[0062] The present application also provides a computer program product, which is stored on a data carrier and is designed to perform the wafer counting method as described above. Therefore, the computer program product according to the present application produces the same advantages as those described in detail with reference to the device according to the present application. The computer program product can be executed as a computer-readable instruction code in each appropriate programming language such as JAVA, C++, etc. In addition, the computer program product can be provided on a network, such as the Internet, or a network, such as an Internet user, can download the computer program product from a network, such as the Internet when needed. The computer program product can be implemented by means of a computer program, i.e., software, or by means of one or more dedicated electronic circuits, i.e., hardware, or in any mixed form, i.e., by means of software components and hardware components, or in a mixed form of software, hardware, or software and hardware.

[0063] The above is only the preferred embodiment of the present application. Those skilled in the art will appreciate that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present application. In addition, under the guidance of the present application, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application belong to the protection scope of the present application.

Claims

1. A wafer counting method, characterized in that: include: The camera module is aligned with the opening surface of the wafer storage device, and the light source module provides backlight illumination to the wafer in the wafer storage device; The transport mechanism drives the camera module to rotate and move parallel to the opening surface of the wafer storage device, so that the camera module collects the slot image of each slot layer in the wafer storage device, and the processing module obtains the wafer status of each slot layer according to the slot image; The processing module obtains the number of wafers according to the wafer status, and selects the number of storage slots and the warping status of the wafer storage device.

2. The wafer counting method according to claim 1, characterized in that: The processing module obtains the wafer status of each layer of slots according to the slot image, including: the processing module obtains the wafer thickness of the wafer on each layer of slots; for any layer of slots in the wafer storage device, if there is no wafer image in the slot image, the processing module determines that the wafer status is a missing wafer; if the wafer thickness is greater than a preset thickness, the processing module determines that the wafer status is a stacked wafer; if the bottom of the wafer in the wafer image intersects with the bottom of the slot in the slot image, the processing module determines that the wafer status is a skewed wafer.

3. The wafer counting method according to claim 1, characterized in that: The conveying mechanism drives the camera module to rotate and move parallel to the opening surface of the wafer storage device, so that the camera module collects slot images of each layer of slots in the wafer storage device, including: the conveying mechanism drives the camera module to rotate along the horizontal direction of the same layer of slots, so that the camera module collects slot images of the same layer of slots from multiple angles; after collecting the slot images of the same layer of slots, the conveying mechanism drives the camera module to move to another layer of slots along the direction parallel to the opening surface of the wafer storage device, so that the camera module starts to collect slot images of another layer of slots from multiple angles, until the camera module completes collecting the slot images of each layer of slots in the wafer storage device.

4. The wafer counting method according to claim 1, characterized in that: The processing module obtains the wafer status of each layer of slots according to the slot image, and also includes: the processing module obtains the warpage and safety distance of the wafer on each layer of slots.

5. The wafer counting method according to claim 4, characterized in that: The transport mechanism includes a robotic arm; the wafer counting method also includes: the processing module obtains the coordinate information of the wafer according to the number of storage slots of the wafer storage device and the warping state; the processing module obtains the safe transport coordinates of the wafer according to the coordinate information, the warping degree and the safety distance; the transport mechanism instructs the robotic arm to take or store the wafer from the wafer storage device according to the safe transport coordinates.

6. The wafer counting method according to claim 1, characterized in that: The wafer counting method further includes: a propulsion mechanism drives the wafer storage device to move in a direction close to the camera module.

7. The wafer counting method according to claim 1, characterized in that: The wafer storage device comprises a front cover; the wafer counting method further comprises: a cover opening mechanism unlocks and takes out the front cover.

8. A wafer counting device, characterized in that: include: A material handling module, a light source module and a wafer storage device, wherein the material handling module includes a camera module, a transport mechanism and a processing module; The camera module is aligned with the opening surface of the wafer storage device; The light source module provides backlight illumination to the wafer in the wafer storage device; The transport mechanism drives the camera module to rotate and move parallel to the opening surface of the wafer storage device, so that the camera module collects slot images of each layer of slots in the wafer storage device; The processing module obtains the wafer status of each slot layer according to the slot image, obtains the number of wafers according to the wafer status, and selects the number of storage slots and the warping status of the wafer storage device.

9. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed, the wafer counting method according to any one of claims 1 to 7 is implemented.

10. A computer program product, characterized in that The computer program product is stored on a data carrier and is designed to execute the wafer counting method according to any one of claims 1 to 7.

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