Electronic component packaging method and electronic component

Abstract

The invention provides an electronic component packaging method and an electronic component. The electronic component packaging method comprises the following steps: covering a non-packaging element with a peelable material; plastic packaging is carried out on the electronic assembly by using a plastic packaging material; removing part of the plastic packaging material to expose the peelable material; the peelable material is removed to expose the non-packaged component. According to the invention, the non-packaging element is covered by the peelable material, so that the packaging cost of the electronic component is saved when the electronic component is packaged.

Description

Technical Field

[0001] The present invention relates to the field of plastic packaging technology, and more specifically, to an electronic component packaging method and an electronic component. Background Art

[0002] In the prior art, in order to protect the electronic components on the electronic assembly from physical damage and chemical corrosion, and to prevent external electromagnetic interference on the electronic components, the electronic assembly is usually packaged using packaging technology. However, currently, the packaging of different electronic components requires the production of corresponding molds, resulting in a high cost for the packaging of electronic components.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Summary of the invention

[0004] An object of the present invention is to provide a method for packaging an electronic component and a new technical solution for the electronic component.

[0005] According to a first aspect of the present invention, there is provided an electronic component packaging method, wherein the electronic component comprises a non-packaged component and a packaged component, wherein the packaging method comprises:

[0006] Use peelable material to cover non-encapsulated components;

[0007] Using plastic packaging materials to plasticize electronic components;

[0008] Removing a portion of the plastic material to expose the peelable material;

[0009] The strippable material is removed to expose the non-packaged components.

[0010] Optionally, before covering the non-packaged component with the peelable material, the method further comprises:

[0011] Non-packaged components and packaged components are arranged on the substrate.

[0012] Optionally, the non-packaged component and the packaged component are mounted on the substrate using a patch process.

[0013] Optionally, the removable material is glue or adhesive film.

[0014] Optionally, the glue is UV glue, and the UV glue is fixed on the surface of the non-packaged component by ultraviolet irradiation.

[0015] Optionally, the strippable material is removed by a heating process;

[0016] Alternatively, the strippable material is removed by a chemical treatment process.

[0017] Optionally, the molding material includes epoxy resin and silicon dioxide particles.

[0018] Optionally, a grinding process is used to remove part of the plastic packaging material.

[0019] Optionally, an etching process is used to remove part of the plastic packaging material.

[0020] According to a second aspect of the present invention, there is provided an electronic component, wherein the electronic component is prepared by using the electronic component packaging method as described in any one of the first aspects.

[0021] According to an embodiment of the present invention, a packaging method is provided, the packaging method comprising: using a strippable material to cover a non-packaged component; using a plastic packaging material to plasticize an electronic component; removing part of the plastic packaging material to expose the strippable material; removing the strippable material to expose the non-packaged component. In the present application, the strippable material is used to cover the non-packaged component, so that when the electronic component is packaged, the packaging cost of the electronic component is saved.

[0022] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0024] Figure 1 is a flow chart of an electronic component packaging method in one embodiment of the present invention.

[0025] Figure 2 It is a schematic diagram of the structure after packaging components and non-packaging components are arranged on a substrate in one embodiment of the present invention.

[0026] Figure 3 It is a schematic diagram of the structure after a peelable material is used to cover a non-packaged component in one embodiment of the present invention.

[0027] Figure 4 It is a schematic diagram of the structure after the packaging components and non-packaging components are plastic-sealed with plastic packaging materials in one embodiment of the present invention.

[0028] Figure 5 It is a schematic diagram of the structure after part of the plastic packaging material is removed in one embodiment of the present invention.

[0029] Figure 6 It is a schematic diagram of the structure after the strippable material is removed in one embodiment of the present invention.

[0030] Description of reference numerals:

[0031] 1. Substrate; 2. Non-packaged components; 3. Packaged components; 4. Strippable materials; 5. Plastic packaging materials. DETAILED DESCRIPTION

[0032] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0033] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0034] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0035] According to one embodiment of the present application, an electronic component is provided, and the electronic component is applied to an electronic device, and the electronic device can be a mobile phone, a tablet computer, a personal digital assistant, a television, a smart wearable product, a virtual reality terminal device, an augmented reality terminal device, a rechargeable household small appliance (such as a soybean milk machine, a sweeping robot), a drone, a radar, an aerospace equipment, and a vehicle-mounted device. The electronic component is prepared by a selective mold packaging process of an application product, wherein the selective mold packaging process of the product is to selectively package the components installed on the electronic component according to the demand. In addition, in order to distinguish different components on the electronic component, the components that do not need to be packaged on the electronic component are referred to as non-packaged components 2, so that after the electronic component is packaged, the non-packaged components 2 can be connected to the external circuit, or the non-packaged components 2 can be used to expand the performance of the electronic component. At the same time, the components that need to be packaged on the electronic component are referred to as packaged components 3, so that after the electronic component is packaged, the surface wear caused by long-term contact or friction between the packaged component 3 and the external components can be effectively avoided, and at the same time, dust, acidic substances, alkaline substances, sulfides, moisture, oxygen and other substances are effectively prevented from polluting and chemically corroding the packaged component 3.

[0036] In the traditional technical solution, different molds need to be customized for each product to meet the requirements of selective molds for different products, resulting in high manufacturing costs for electronic components. However, the present application uses a peelable material 4 to cover the non-packaged component 2, so that when selective molds for different products are required, only one universal mold can be customized to achieve the packaging of different products, effectively saving the packaging cost of electronic components.

[0037] Therefore, if Figures 2 to 6 As shown, according to another embodiment of the present application, an electronic component packaging method is provided, wherein the electronic component packaging method is used to prepare the electronic component.

[0038] Among them, the electronic component packaging method first uses a strippable material 4 to cover the non-packaged component 2, then uses a plastic packaging material 5 to plasticize the electronic component, and then removes part of the plastic packaging material 5 to expose the strippable material 4, and finally removes the strippable material 4 to expose the non-packaged component 2.

[0039] Furthermore, since the present application first uses a strippable material 4 to cover the non-packaged component 2, after the electronic component is subsequently packaged with a plastic packaging material 5, the non-packaged component 2 and the plastic packaging material 5 can be separated, and then the strippable material 4 can be removed to expose the non-packaged component 2, so that in response to the demand for selective molds for different products, only one universal mold can be customized to achieve the packaging of different products, thereby effectively saving the packaging cost of the electronic components.

[0040] In one embodiment, before the non-package component 2 is covered with the strippable material 4 , the non-package component 2 and the package component 3 may be arranged on the substrate 1 first.

[0041] Specifically, the electronic component described in the present application may also include a substrate 1, on which the non-packaged component 2 and the packaged component 3 are arranged. In the traditional technical solution, the selective mold packaging process requires customized molds for each product, so in order to avoid the influence of the plastic packaging material 5 on the non-packaged component 2 during the packaging process, the prior art usually adopts a secondary component setting method to achieve the installation of the non-packaged component 2 and the packaged component 3. For example, before the plastic packaging material 5 is used to plastic-encapsulate the electronic component, the packaged component 3 is only arranged on the substrate 1, so that an area where the plastic packaging material 5 is not used in the packaging process is formed on the substrate 1, and then after the plastic packaging of the electronic component is completed, the non-packaged component 2 is arranged in the area where the plastic packaging material 5 is not used.

[0042] However, although the secondary component arrangement method can prevent the plastic packaging material 5 from affecting the non-packaged components 2 during the packaging process, it also leads to a further increase in the manufacturing cost of the electronic assembly.

[0043] Therefore, if Figures 2 to 6 As shown, since the present application first uses a strippable material 4 to cover the non-packaged component 2, after the electronic component is subsequently packaged with a plastic packaging material 5, the non-packaged component 2 and the plastic packaging material 5 can be separated, that is, by the setting of the strippable material 4, the influence of the plastic packaging material 5 on the non-packaged component 2 during the packaging process is effectively avoided. Therefore, the present application can simultaneously set the non-packaged component 2 and the packaged component 3 on the substrate 1 by a one-time setting of components before using the strippable material 4 to cover the non-packaged component 2, that is, before using the plastic packaging material 5 to package the electronic component, thereby effectively avoiding the problem of further increasing the manufacturing cost of the electronic component due to the secondary setting of components in the prior art.

[0044] In addition, the non-packaged components 2 described in the present application may include radio frequency components, sensors, lead frames, capacitors, resistors and inductors, etc.; the packaged components 3 may include microprocessors, memories, logic circuits, connectors and micro-electromechanical systems, etc. Those skilled in the art may make choices based on actual needs, and the present application does not make any specific restrictions here.

[0045] In one embodiment, the non-packaged component 2 and the packaged component 3 are mounted on the substrate 1 using a patch process.

[0046] Specifically, the patch process refers to a circuit assembly technology that mounts pinless or short-lead surface-mount components on the surface of a substrate 1 and assembles them by soldering through methods such as reflow soldering or dip soldering, and has the characteristics of miniaturization, high-density assembly and high production efficiency. Therefore, since the patch process allows more components to be placed on the same area of ​​the substrate 1, it can better meet the requirements of the present application. Before using the plastic packaging material 5 to plastic-package the electronic components, the non-packaged components 2 and the packaged components 3 are arranged on the substrate 1 in a one-time manner, thereby effectively improving the packaging efficiency of the electronic components.

[0047] In one embodiment, the removable material 4 is glue or adhesive film.

[0048] Specifically, the present application can coat glue on the surface of the non-packaged component 2 and cure it to cover the non-packaged component 2. As a result, since the glue coating is convenient and the preparation process is low in difficulty, the packaging efficiency of the electronic component can be significantly improved, and the packaging cost of the electronic component can be reduced.

[0049] Among them, depending on the type of glue selected, for example, when the glue is cyanoacrylate glue, epoxy resin glue, UV glue or acrylic glue, it can be cured by moisture curing, heat curing, UV (Ultraviolet Rays) curing and visible light curing, etc., and technicians in this field can make a choice according to actual needs, and this application does not make any specific restrictions here.

[0050] In addition, the present application may also use an adhesive film to cover the non-packaged component 2, which can also improve the packaging efficiency of the electronic component and reduce the packaging cost of the electronic component.

[0051] The adhesive film may cover the non-packaged component 2 using a thin film assisted process to further improve the covering quality of the non-packaged component 2 and further avoid the influence of the plastic encapsulation material 5 on the non-packaged component 2 during the encapsulation process.

[0052] In one embodiment, the glue is UV glue, and the UV glue is fixed on the surface of the non-packaged component 2 by ultraviolet irradiation.

[0053] Specifically, the present application adopts the method of irradiating the UV glue with ultraviolet rays to fix the UV glue on the surface of the non-packaged component 2. In this way, since the UV glue has the characteristics of high curing efficiency, high curing accuracy and convenient debonding, the packaging efficiency of the electronic components can be further improved.

[0054] In one embodiment, the strippable material 4 is removed by a heating process; or, the strippable material 4 is removed by a chemical treatment process.

[0055] Specifically, when the strippable material 4 of the present application is UV glue, a heating process can be used to remove the UV glue. For example, the temperature of the UV glue is increased by heating, so that when the UV glue reaches the debonding temperature of the UV glue, the UV glue softens, and it is easy to peel the UV glue off the non-packaged component 2, effectively improving the preparation efficiency of the electronic component.

[0056] In addition, when the strippable material 4 described in the present application is UV glue, chemical solvents such as acetone or alcohol can also be used to soften the UV glue so as to peel the UV glue off the non-packaged component 2.

[0057] In addition, when the removable material 4 described in this application is a film or other materials, this application can also use a heating process or a chemical treatment process to remove the removable material 4. Technical personnel in this field can choose according to actual needs, and this application does not make any specific restrictions here.

[0058] In one embodiment, the molding material 5 includes epoxy resin and silicon dioxide particles.

[0059] Specifically, in the packaging process, the plastic packaging material 5 is usually an epoxy resin molding compound prepared by epoxy resin. The epoxy resin molding compound is a thermosetting chemical material used for electronic component packaging. It can protect electronic components from the influence of the external environment (water vapor, temperature, pollution, etc.) and realize composite functions such as thermal conductivity, insulation, moisture resistance, pressure resistance, and support.

[0060] However, since the epoxy resin molding material directly prepared using epoxy resin has poor performance, which can easily lead to poor packaging quality of electronic components, in order to further improve the packaging quality of the electronic components described in this application, this application prepares the epoxy resin molding material by adding a certain amount of silica particles to the epoxy resin, and then improves the thermal conductivity, hardness, wear resistance, electrical insulation, flame retardancy, resistance to chemicals, water absorption and resistance to ultraviolet rays of the epoxy resin through the silica particles, thereby significantly enhancing the packaging quality of the electronic components.

[0061] In addition, in order to further improve the conductivity, hardness, wear resistance, flame retardancy, resistance to chemicals and resistance to ultraviolet rays of the epoxy resin molding compound, the present application may also add a certain amount of carbon black particles to the epoxy resin after adding the silica particles.

[0062] In one embodiment, a grinding process is used to remove part of the molding material 5 .

[0063] Specifically, the present application may use a grinding block or a grinding wheel made of a ceramic-based diamond composite material to grind part of the plastic packaging material 5 to expose the strippable material 4 .

[0064] When the grinding process is used to remove part of the plastic encapsulation material 5, a special grinding block or grinding wheel can be installed on a fully automatic precision grinding machine, and then the grinding block or grinding wheel is used to grind off part of the plastic encapsulation material 5 as required to expose the strippable material 4. Therefore, the grinding equipment such as the grinding block or grinding wheel can not only effectively improve the removal efficiency of the plastic encapsulation material 5, but also ensure the surface roughness and smoothness of the grinding surface of the plastic encapsulation material 5, thereby significantly enhancing the packaging quality of the electronic component.

[0065] In addition, the present application may also use a heating process to soften part of the plastic encapsulation material 5 so as to facilitate peeling off part of the plastic encapsulation material 5 .

[0066] In one embodiment, an etching process is used to remove part of the plastic packaging material 5 .

[0067] Specifically, since the etching process can accurately control parameters in the etching process, such as gas flow, pressure, power, temperature and etching time, the packaging quality of the electronic component can be significantly improved.

[0068] Among them, since the chemical method uses a substance that is easily reactive with the designated material to undergo a chemical reaction, but does not react with the non-designated material, it is preferred to use a chemical method to remove the molding material 5 to significantly improve the removal efficiency of the molding material 5.

[0069] According to an electronic component packaging method provided in an embodiment of the present application, see Figure 1 The packaging method includes the following steps S101 to S104:

[0070] S101, covering the non-packaged component 2 with a peelable material 4;

[0071] like Figure 2 and Figure 3 As shown, here, using the strippable material 4 to cover the non-packaged component 2 means using the strippable material 4 to separate the non-packaged component 2 from the subsequent plastic encapsulation material 5. The strippable material 4 covering the non-packaged component 2 can be a fluid strippable material 4 solidified to cover the non-packaged component 2, or a solid strippable material 4 can directly cover the non-packaged component 2.

[0072] S102, using a plastic packaging material 5 to plastic-package the electronic components;

[0073] like Figure 4 As shown, the electronic component here includes a packaging component 3 and a non-packaging component 2 covered with a strippable material 4. In one embodiment, the electronic component includes a substrate 1, and the packaging component 3 and the non-packaging component 2 are arranged on the substrate 1, so that the packaging material 5 can plastic-encapsulate the packaging component 3 and the non-packaging component 2 on the substrate 1.

[0074] S103, removing part of the plastic packaging material 5 to expose the strippable material 4;

[0075] like Figure 4 and Figure 5 As shown, here, since the plastic encapsulation material 5 encapsulates the electronic component into a plastic encapsulation part with a certain thickness, the plastic encapsulation material 5 on the surface of the non-packaged component 2 covered with the strippable material 4 needs to be removed to expose the strippable material 4, thereby facilitating the subsequent removal of the strippable material 4.

[0076] S104, removing the strippable material 4 to expose the non-packaged component 2;

[0077] like Figure 6As shown, the exposed non-packaged components 2 here refer to components on the electronic assembly that do not need to be packaged in the selective mold packaging process.

[0078] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0079] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A method for packaging an electronic component, wherein the electronic component comprises a non-packaged component (2) and a packaged component (3), characterized in that: The packaging method comprises: Covering the non-packaged component (2) with a peelable material (4); Using a plastic packaging material (5) to plastic-package the electronic components; Removing part of the plastic packaging material (5) to expose the peelable material (4); The strippable material (4) is removed to expose the non-encapsulated component (2).

2. The packaging method according to claim 1, characterized in that: Before the non-packaged component (2) is covered with the peelable material (4), the method further comprises: A non-packaged component (2) and a packaged component (3) are arranged on a substrate (1).

3. The packaging method according to claim 2, characterized in that: The non-packaged component (2) and the packaged component (3) are mounted on the substrate (1) using a patch process.

4. The packaging method according to claim 1, characterized in that: The removable material (4) is glue or adhesive film.

5. The packaging method according to claim 4, characterized in that: The glue is UV glue, and the UV glue is fixed on the surface of the non-packaged component (2) by means of ultraviolet irradiation.

6. The packaging method according to claim 1, characterized in that: Removing the strippable material (4) by a heating process; Alternatively, the strippable material (4) is removed by a chemical treatment process.

7. The packaging method according to claim 1, characterized in that: The plastic packaging material (5) comprises epoxy resin and silicon dioxide particles.

8. The packaging method according to claim 1, characterized in that: A grinding process is used to remove part of the plastic packaging material (5).

9. The packaging method according to claim 1, characterized in that: A portion of the plastic packaging material (5) is removed by an etching process.

10. An electronic component, characterized in that: The electronic component is prepared by the electronic component packaging method according to any one of claims 1 to 9.

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