Packaging structure, preparation method of packaging structure and electronic equipment

Abstract

The embodiment of the invention discloses a packaging structure, a preparation method of the packaging structure and electronic equipment, the packaging structure comprises a substrate, a first chip and a connecting plate, one side of the first chip is provided with at least one solder ball, the connecting plate is arranged on the substrate, and the solder ball is arranged on the substrate. The projection area of the connecting plate on the first chip is not greater than the surface area of the first chip; at least one through hole is formed in the connecting plate in the stacking direction of the packaging structure, each solder ball is arranged in the corresponding through hole in a penetrating mode so that the first chip can be connected to the connecting plate in a sealed mode, and the solder balls are electrically connected with the substrate. In addition, due to the arrangement of the connecting plate, the problem of edge glue overflowing caused by bottom glue filling is avoided, a large safety distance between the first chip and the adjacent electronic element does not need to be guaranteed, the size of the packaging structure is reduced conveniently, and therefore miniaturization development of the packaging structure is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and more specifically, to a packaging structure, a method for preparing the packaging structure, and an electronic device. Background Art

[0002] The rapid development of electronic products is the main driving force for the improvement of packaging technology today. Miniaturization, high density, high performance, high reliability and low cost of electronic products are the mainstream development direction of advanced packaging. SiP packaging (System in Package) is one of the most important and most potential technologies to meet this high-density system integration.

[0003] In the existing SiP packaging process, it is usually necessary to first fill the IC chip with bottom glue, then bake and solidify it before the whole plastic packaging. In the process of filling the bottom glue, the glue will overflow from the edge of the IC chip, so that a large safety distance needs to be maintained between the IC chip and other adjacent electronic components, which is not conducive to the miniaturization of the packaging structure. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a packaging structure, a method for preparing the packaging structure and a new technical solution for electronic equipment.

[0005] According to one aspect of the present invention, a packaging structure is provided.

[0006] The packaging structure comprises:

[0007] substrate;

[0008] A first chip and a connecting plate, wherein one side of the first chip has at least one solder ball, the connecting plate is disposed on the substrate, and a projection area of ​​the connecting plate on the first chip is not greater than a surface area of ​​the first chip;

[0009] At least one through hole is opened on the connection board along the stacking direction of the packaging structure, and each solder ball is penetrated into the corresponding through hole to seal the first chip to the connection board, and the solder ball is electrically connected to the substrate.

[0010] Optionally, the connection plate is detachably connected to the base.

[0011] Optionally, at least one solder ball is inserted into the through hole.

[0012] Optionally, a side of the first chip close to the substrate has a plurality of solder balls, and a plurality of through holes are formed on the connecting plate, and the number of the through holes is greater than or equal to the number of the solder balls.

[0013] Optionally, each of the solder balls is located opposite to one of the through holes.

[0014] Optionally, the plurality of through holes are distributed in an array.

[0015] Optionally, the spacing between at least some adjacent two through holes is equal.

[0016] Optionally, the connecting plate is a film, and the film is bonded to the base.

[0017] Optionally, a plastic package is further included, wherein the plastic package is disposed on the substrate and covers the first chip and the connecting board.

[0018] Optionally, a second chip is further included, the substrate includes a first area and a second area, the connecting board is located in the first area, the second chip is arranged in the second area, and the plastic package covers the first chip, the second chip and the connecting board.

[0019] According to another aspect of the present invention, there is provided a method for preparing a packaging structure, comprising:

[0020] Making a base;

[0021] A connecting board and a first chip are manufactured, wherein at least one through hole is provided on the connecting board along the stacking direction of the package structure, at least one solder ball is provided on one side of the first chip, and a projection area of ​​the connecting board on the first chip is not greater than a surface area of ​​the first chip;

[0022] The connecting plate is firstly arranged on the substrate, and then each solder ball is inserted into the corresponding through hole, so that the first chip is sealed and connected to the connecting plate, and the solder ball is electrically connected to the substrate.

[0023] Optionally, after the connecting plate is arranged on the base, the method further comprises:

[0024] A second chip is manufactured and disposed on the substrate.

[0025] Optionally, after each solder ball is inserted into the corresponding through hole so that the first chip can be detachably connected to the connecting board, the method further includes:

[0026] Plastic packaging is performed to form a plastic packaging component, and the plastic packaging component can cover the first chip, the second chip and the connecting board.

[0027] According to yet another aspect of the present invention, there is provided an electronic device comprising the above-mentioned packaging structure.

[0028] One technical effect of the embodiments of the present disclosure is:

[0029] The packaging structure includes a substrate, a first chip and a connecting plate, one side of the first chip has at least one solder ball, the connecting plate is arranged on the substrate, and the projection area of ​​the connecting plate on the first chip is not larger than the surface area of ​​the first chip; along the stacking direction of the packaging structure, at least one through hole is opened on the connecting plate, and each of the solder balls is penetrated into the corresponding through hole to seal the first chip to the connecting plate, and the solder balls are electrically connected to the substrate.

[0030] In this way, the first chip can be fixed and sealed by the connection board and the first chip. Compared with the traditional bottom filling process, the waiting time for the glue to cure is eliminated, the process flow is greatly shortened, and the production efficiency is improved. In addition, the setting of the connection board also avoids the edge overflow problem caused by the bottom filling, and there is no need to ensure a large safety distance between the first chip and the adjacent electronic components, which is convenient for reducing the size of the packaging structure, thereby facilitating the miniaturization of the packaging structure.

[0031] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0033] Figure 1 is a schematic diagram of a packaging structure according to an embodiment of the present disclosure;

[0034] Figure 2 is another schematic diagram of a packaging structure according to an embodiment of the present disclosure;

[0035] Figure 3 is another schematic diagram of a packaging structure according to an embodiment of the present disclosure;

[0036] Figure 4 It is another schematic diagram of a packaging structure of an embodiment of the present disclosure.

[0037] Description of reference numerals:

[0038] 1. substrate; 2. first chip; 3. connecting board; 31. through hole; 4. plastic package; 5. second chip. DETAILED DESCRIPTION

[0039] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0040] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0041] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0042] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0043] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0044] The invention provides a packaging structure.

[0045] like Figures 1 to 4 As shown, the packaging structure provided by the embodiment of the present invention includes:

[0046] Base 1;

[0047] A first chip 2 and a connecting plate 3, wherein one side of the first chip 2 has at least one solder ball, the connecting plate 3 is arranged on the substrate 1, and the projection area of ​​the connecting plate 3 on the first chip 2 is not larger than the surface area of ​​the first chip 2;

[0048] Along the stacking direction of the packaging structure, at least one through hole 31 is opened on the connecting board 3, and each solder ball is penetrated into the corresponding through hole 31 to seal the first chip 2 to the connecting board 3, and the solder ball is electrically connected to the substrate 1.

[0049] Specifically, the substrate 1 may be a PCB (Printed Circuit Board), so that the substrate 1 can be used as a support carrier and a connection carrier for electronic components. The substrate 1 may include a first surface and a second surface relative to each other, i.e., an upper surface and a lower surface, wherein the first surface is also the upper surface of the substrate 1, and the second surface is also the lower surface of the substrate 1. Different electronic components may also be arranged on the first surface and the second surface of the substrate 1, respectively, to meet the requirements of the corresponding packaging structure. The substrate 1 is generally a rectangular plate, which can facilitate the arrangement of electronic components thereon.

[0050] The substrate 1, as the support and heat dissipation basis of the packaging structure, can be made of materials with high thermal conductivity and good mechanical strength, such as ceramics, metals (such as copper, aluminum) or composite materials with high thermal conductivity. The surface of the substrate 1 can be designed with a circuit wiring layer as needed to achieve connection with external circuits and transmission of internal signals. At the same time, a heat dissipation structure, such as a heat dissipation fin or a microchannel cooling structure, can also be set on the substrate 1 to enhance the overall heat dissipation performance.

[0051] Specifically, the first chip 2 can be arranged on the first surface of the substrate 1, so as to facilitate the electrical connection between the first chip 2 and the external device on the upper surface side of the substrate 1. The first chip 2 can be an IC chip (Integrated CircuitChip, microelectronic device). Moreover, the first chip 2 and the substrate 1 can be electrically connected through leads, or directly through solder balls at the bottom of the first chip 2, so that the signal transmission between the first chip 2 and the substrate 1 can be realized, and the high-speed and high-reliability data transmission requirements are also met.

[0052] like Figure 2 and Figure 3 As shown, one side of the first chip 2 has at least one solder ball, also called a solder ball, which serves as a medium for electrical connection and mechanical fixation of the first chip 2. The number and layout of the solder balls can be flexibly designed according to the pin distribution and packaging requirements of the first chip 2.

[0053] The connecting plate 3 is usually in a plate-like or sheet-like structure, and the thickness can be adjusted to reduce the height of the package structure. The connecting plate 3 can be made of a material compatible with the substrate 1 and the first chip 2. The connecting plate 3 has good mechanical strength and temperature resistance, and can be made of, for example, high-temperature resistant plastic, ceramic, resin or metal alloy. The thickness of the connecting plate 3 can also be between 100 microns and 200 microns.

[0054] like Figures 1 to 4 As shown, along the stacking direction of the package structure, that is, the height direction of the package structure, the connection board 3 is provided with at least one through hole 31. The diameter and depth of the through hole 31 match the solder ball, so as to ensure that the solder ball can be accurately inserted and fixed. The position of the through hole 31 can correspond to the solder ball on the first chip 2 one by one, so as to facilitate rapid assembly.

[0055] like Figures 1 to 3As shown, in the packaging process, the connecting board 3 is first fixed to the substrate 1 by bonding, welding, etc., and then the multiple solder balls of the first chip 2 are aligned with the through holes 31 of the connecting board 3, and pressure is applied to penetrate the solder balls into the corresponding through holes 31 to seal the first chip 2 and the connecting board 3. In this way, the connecting board 3 can be used to form a sealing protection for the multiple solder balls of the first chip 2, and the gap between the first chip 2 and the substrate 1 can be filled by the connecting board 3 to avoid the subsequent plastic packaging process from affecting the first chip 2, thereby improving the reliability of the packaging structure.

[0056] The solder balls and through holes 31 can be matched one-to-one, that is, each solder ball is inserted into a corresponding through hole 31; the solder balls and through holes 31 can also be matched many-to-one, that is, some adjacent solder balls are inserted into a corresponding through hole 31, which can meet different assembly requirements. Moreover, the close fit between the solder balls and through holes 31 also reduces thermal resistance, so that the heat generated by the first chip 2 can be more quickly transferred to the substrate 1 and dissipated, thereby ensuring the stable operation of the first chip 2 and extending its service life.

[0057] In the embodiment of the present invention, the connecting plate 3 is first arranged on the substrate 1, and then the first chip 2 is assembled on the connecting plate 3. The first chip 2 can be fixed and sealed by the cooperation between the connecting plate 3 and the first chip 2. Compared with the traditional bottom filling process, the waiting time for the glue to cure is eliminated, the process flow is greatly shortened, and the production efficiency is improved. Moreover, a suitable connecting plate 3 can be matched according to the specific structure of the first chip 2, and there is no need to reserve a space for filling glue, which is also convenient for saving the internal space of the packaging structure, and it is convenient to accommodate more electronic components in the limited volume of the packaging structure, and also meets the requirements of miniaturization and high integration of electronic devices using the packaging structure.

[0058] Furthermore, the setting of the connecting board 3 also avoids the problem of edge overflow caused by the traditional bottom filling process, and there is no need to ensure a large safety distance between the first chip 2 and the adjacent electronic components, and the distance can be shortened as needed. Moreover, along the length and / or width direction of the connecting board 3, the size of the connecting board 3 can be set to be smaller than or equal to the size of the first chip 2, which is also convenient for shortening the distance between the first chip 2 and the adjacent electronic components, and for reducing the size of the packaging structure, thereby facilitating the miniaturization of the packaging structure.

[0059] Optionally, the connecting board 3 can be detachably connected to the substrate 1. For example, the connecting board 3 can be detachably connected to the surface of the substrate 1 by bonding, snapping, etc., which can facilitate matching different connecting boards 3 according to the first chip 2, and also facilitate the maintenance and replacement of the connecting board 3, thereby improving the assembly efficiency and maintenance efficiency of the packaging structure.

[0060] Optionally, at least one solder ball is inserted into the through hole 31 .

[0061] Specifically, the solder balls and the through holes 31 can be matched one-to-one, that is, each solder ball is inserted into a corresponding through hole 31; the solder balls and the through holes 31 can also be matched many-to-one, that is, some adjacent solder balls are inserted into a corresponding through hole 31, which can adapt to different assembly requirements.

[0062] Optionally, the size of the through hole 31 matches the size of the solder ball.

[0063] Specifically, the sizes of the through hole 31 and the solder ball can be matched. On the one hand, this can facilitate the assembly of the first chip 2 and fill the gap between the first chip 2 and the substrate 1 through the connecting plate 3, thereby avoiding the impact of the subsequent plastic packaging process on the first chip 2, thereby improving the reliability of the packaging structure; on the other hand, it can also reduce thermal resistance, so that the heat generated by the first chip 2 can be more quickly conducted to the substrate 1 and dissipated, thereby ensuring the stable operation of the first chip 2 and extending the service life.

[0064] Optionally, a side of the first chip 2 close to the substrate 1 has a plurality of solder balls, and a plurality of through holes 31 are formed on the connecting plate 3 , and the number of the through holes 31 is greater than or equal to the number of the solder balls.

[0065] like Figure 4 As shown, a plurality of through holes 31 may be provided on the connection board 3, and the arrangement positions of the plurality of through holes 31 are adapted to the positions of the plurality of solder balls on the first chip 2, so as to facilitate the reliable assembly of the first chip 2. Furthermore, a plurality of solder balls are provided on the side of the first chip 2 close to the substrate 1, so that the reliability of the connection of the first chip 2 can be enhanced through the cooperation of the plurality of solder balls with the plurality of through holes 31, thereby improving the reliability of the packaging structure.

[0066] The number of through holes 31 can be set equal to the number of solder balls, so that each solder ball on the first chip 2 has a corresponding assembly position, which is convenient for quick assembly. The number of through holes 31 can also be set to be greater than the number of solder balls, which can facilitate the connection board 3 to adapt to different first chips 2 and save the process time caused by replacing the connection board 3.

[0067] Optionally, each solder ball is opposite to a through hole 31, so that each solder ball on the first chip 2 has a corresponding assembly position, which is convenient for quick assembly. Moreover, the shape of the through hole 31 is adapted to the solder ball, that is, the through hole 31 is mostly circular, so as to form a sealing protection for the solder ball from the circumferential direction.

[0068] Optionally, the plurality of through holes 31 are distributed in an array.

[0069] Specifically, the distribution of the plurality of through holes 31 matches the positions of the plurality of solder balls on the first chip 2, so as to facilitate reliable assembly of the first chip 2. For example, the distribution of the plurality of through holes 31 includes but is not limited to array, discrete and radial.

[0070] Optionally, the intervals between at least some adjacent two through holes 31 are equal.

[0071] Specifically, according to the specific distribution of the multiple through holes 31 on the connecting plate 3, the spacing between some adjacent two through holes 31 can be set equal, or the spacing between all adjacent two through holes 31 can be set equal, which can simplify the processing and forming of the multiple through holes 31 on the connecting plate 3 to a certain extent, thereby reducing the production difficulty of the packaging structure and improving production efficiency.

[0072] Optionally, the connecting plate 3 is a film, and the film is bonded to the substrate 1, so as to simplify the mounting process of the connecting plate 3, reduce the production difficulty of the packaging structure, and improve the production efficiency.

[0073] Optionally, it further comprises a plastic package 4, wherein the plastic package 4 is disposed on the substrate 1 and covers the first chip 2 and the connecting plate 3. Figure 3 As shown, the first chip 2 is packaged after being mounted, which can provide all-round and reliable protection for the first chip 2. The connecting plate 3 is sandwiched between the first chip 2 and the substrate 1. Compared with the traditional bottom filling process, it can avoid the influence of glue overflow on the plastic packaging process and also facilitate reducing the overall size of the packaging structure.

[0074] Optionally, a second chip 5 is further included, the substrate 1 includes a first area and a second area, the connecting board 3 is located in the first area, the second chip 5 is arranged in the second area, and the plastic package 4 covers the first chip 2, the second chip 5 and the connecting board 3, so that the first chip 2 and the second chip 5 can be fully and reliably protected by the plastic package 4. The second chip 5 can be other chips such as resistors and inductors.

[0075] The embodiment of the present invention further provides a method for preparing the aforementioned packaging structure, comprising:

[0076] Prepare a base 1;

[0077] A connecting board 3 and a first chip 2 are manufactured, wherein at least one through hole 31 is provided on the connecting board 3 along the stacking direction of the package structure, at least one solder ball is provided on one side of the first chip 2, and a projection area of ​​the connecting board 3 on the first chip 2 is not greater than a surface area of ​​the first chip 2;

[0078] The connecting plate 3 is firstly arranged on the substrate 1 , and then each solder ball is passed through the corresponding through hole 31 , so that the first chip 2 is sealedly connected to the connecting plate 3 , and the solder ball is electrically connected to the substrate 1 .

[0079] During the packaging process, the connecting board 3 is first fixed to the substrate 1 by bonding, welding, etc., and then the multiple solder balls of the first chip 2 are aligned with the through holes 31 of the connecting board 3, and pressure is applied to penetrate the solder balls into the corresponding through holes 31 to connect the first chip 2 to the connecting board 3. In this way, the connecting board 3 can be used to form a sealing protection for the multiple solder balls of the first chip 2, and the gap between the first chip 2 and the substrate 1 can be filled by the connecting board 3 to avoid the subsequent plastic packaging process from affecting the first chip 2, thereby improving the reliability of the packaging structure.

[0080] In the embodiment of the present invention, the connecting plate 3 is first arranged on the substrate 1, and then the first chip 2 is arranged on the connecting plate 3, and the first chip 2 is fixed and sealed by the cooperation between the connecting plate 3 and the first chip 2. Compared with the traditional bottom filling process, the waiting time for the glue to cure is eliminated, the process flow is greatly shortened, and the production efficiency is improved. Moreover, a suitable connecting plate 3 can be matched according to the specific structure of the first chip 2, and there is no need to reserve a space for filling glue, which is also convenient for saving the internal space of the packaging structure, and it is convenient to accommodate more electronic components in the limited volume of the packaging structure, and also meets the requirements of miniaturization and high integration of electronic devices using the packaging structure.

[0081] Furthermore, the setting of the connecting board 3 also avoids the problem of edge overflow caused by the traditional bottom filling process, and there is no need to ensure a large safety distance between the first chip 2 and the adjacent electronic components, and the distance can be shortened as needed. Moreover, along the length and / or width direction of the connecting board 3, the size of the connecting board 3 can be set to be smaller than or equal to the size of the first chip 2, which is also convenient for shortening the distance between the first chip 2 and the adjacent electronic components, and for reducing the size of the packaging structure, thereby facilitating the miniaturization of the packaging structure.

[0082] Optionally, after the connecting plate 3 is arranged on the base 1, the method further comprises:

[0083] A second chip 5 is manufactured and disposed on the substrate 1 .

[0084] Specifically, the mounting of the connection board 3 and the mounting of the second chip 5 can be performed simultaneously, so as to improve the processing efficiency of the packaging structure.

[0085] Optionally, after each solder ball is inserted into the corresponding through hole 31 so that the first chip 2 can be detachably connected to the connecting board 3, the method further includes:

[0086] Plastic sealing is performed to form a plastic sealing member 4 , which can cover the first chip 2 , the second chip 5 and the connecting board 3 , so that the plastic sealing member 4 can provide all-round and reliable protection for the first chip 2 and the second chip 5 .

[0087] In addition, the setting of the connecting board 3 can avoid the impact of the edge overflow problem caused by the traditional bottom filling process on the subsequent plastic packaging process. There is no need to ensure a large safety distance between the first chip 2 and adjacent electronic components. The distance can be shortened as needed, which is also convenient for reducing the overall size of the packaging structure.

[0088] The present invention also provides an electronic device, comprising the above-mentioned packaging structure, wherein the electronic device includes but is not limited to a mobile phone, a tablet and a computer.

[0089] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0090] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A packaging structure, characterized in that: include: Base (1); A first chip (2) and a connecting plate (3), wherein one side of the first chip (2) has at least one solder ball, the connecting plate (3) is arranged on the substrate (1), and the projection area of ​​the connecting plate (3) on the first chip (2) is not greater than the surface area of ​​the first chip (2); At least one through hole (31) is provided on the connecting board (3) along the stacking direction of the packaging structure, and each of the solder balls is inserted into a corresponding through hole (31) so as to seal the first chip (2) to the connecting board (3), and the solder balls are electrically connected to the substrate (1).

2. The packaging structure according to claim 1, characterized in that: The connecting plate (3) is detachably connected to the base (1).

3. The packaging structure according to claim 1, characterized in that: At least one solder ball is inserted into the through hole (31).

4. The packaging structure according to claim 1, characterized in that: The first chip (2) has a plurality of solder balls on a side close to the substrate (1), and the connecting plate (3) is provided with a plurality of through holes (31), the number of the through holes (31) being greater than or equal to the number of the solder balls.

5. The packaging structure according to claim 4, characterized in that: Each of the solder balls is located opposite to a through hole (31).

6. The packaging structure according to claim 4, characterized in that: The plurality of through holes (31) are distributed in an array.

7. The packaging structure according to claim 4, characterized in that: The spacing between at least two adjacent through holes (31) is equal.

8. The packaging structure according to claim 1, characterized in that: The connecting plate (3) is a film, and the film is bonded to the base (1).

9. The packaging structure according to claim 1, characterized in that: It also comprises a plastic packaging component (4), wherein the plastic packaging component (4) is arranged on the substrate (1), and the plastic packaging component (4) covers the first chip (2) and the connecting board (3).

10. The packaging structure according to claim 98, characterized in that: The invention also comprises a second chip (5), the substrate (1) comprises a first area and a second area, the connecting board (3) is located in the first area, the second chip (5) is arranged in the second area, and the plastic package (4) covers the first chip (2), the second chip (5) and the connecting board (3).

11. A method for preparing a packaging structure according to any one of claims 1 to 10, characterized in that: include: Making a base; A connecting board and a first chip are manufactured, wherein at least one through hole is provided on the connecting board along the stacking direction of the package structure, at least one solder ball is provided on one side of the first chip, and a projection area of ​​the connecting board on the first chip is not greater than a surface area of ​​the first chip; The connecting plate is firstly arranged on the substrate, and then each solder ball is inserted into the corresponding through hole, so that the first chip is sealed and connected to the connecting plate, and the solder ball is electrically connected to the substrate.

12. The preparation method according to claim 11, characterized in that: After the connecting plate is arranged on the base, the method further comprises: A second chip is manufactured and disposed on the substrate.

13. The preparation method according to claim 12, characterized in that: After each solder ball is inserted into the corresponding through hole so that the first chip can be detachably connected to the connecting board, the method further includes: Plastic packaging is performed to form a plastic packaging component, and the plastic packaging component can cover the first chip, the second chip and the connecting board.

14. An electronic device, characterized in that: A packaging structure comprising any one of claims 1 to 10.

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