Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel comprises a driving substrate, a conductive adhesive layer and a light-emitting chip. The conductive adhesive layer is arranged on one side of the driving substrate and at least comprises a first adhesive layer, the first adhesive layer comprises conductive particles, and a guide groove is formed in the side, away from the driving substrate, of the first adhesive layer; the light-emitting chip is arranged on the side, away from the driving substrate, of the conductive adhesive layer, the light-emitting chip and the guide groove are arranged in an aligned mode, and at least the electric contact portion of the light-emitting chip and the first adhesive layer is contained in the guide groove. According to the display panel and the display device, the problem of chip deviation occurring when a light-emitting chip is bonded through a conductive adhesive in the prior art can be effectively solved, and the bonding yield of the light-emitting chip is increased.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] As flat panel display technology matures, many display companies have invested in the development of next-generation displays. Light Emitting Diodes (LEDs) have become a research hotspot in the current display industry due to their good reliability (no need for special pixel-level packaging), small light-emitting unit size, and high brightness. In the display industry, small-pitch RGB LED direct displays can bring an excellent viewing experience, and their market share continues to grow.

[0003] Micro LED chips are small in size, and are usually transferred to the target substrate by transfer. Currently, Micro LED bonding can be achieved by anisotropic conductive film (ACF) bonding or solder melting. Since metal melting materials are still under development, ACF has become the main mass production material on the market. However, ACF has chip offset during actual transfer bonding, which seriously affects the bonding yield of Micro LED chips. Summary of the invention

[0004] The embodiments of the present application provide a display panel and a display device, which can effectively improve the chip deviation problem that occurs when light-emitting chips are bonded with conductive adhesive in the prior art, and improve the bonding yield of the light-emitting chips.

[0005] In order to achieve the above object, according to a first aspect of the present application, a display panel is provided, comprising:

[0006] Driver substrate;

[0007] A conductive adhesive layer, disposed on one side of the driving substrate, comprising at least a first adhesive layer, wherein the first adhesive layer comprises conductive particles, and a guide groove is disposed on a side of the first adhesive layer away from the driving substrate; and

[0008] The light emitting chip is arranged on a side of the first adhesive layer away from the driving substrate. The light emitting chip is aligned with the guide groove, and at least the electrical contact portion between the light emitting chip and the first adhesive layer is accommodated in the guide groove.

[0009] In some embodiments, the light-emitting chip includes a light-emitting body and an electrode pin located on one side of the light-emitting body close to the conductive adhesive layer, the electrode pin is aligned with the guide groove, the electrode pin is in electrical contact with the first adhesive layer, and the electrode pin is at least partially accommodated in the guide groove.

[0010] In some embodiments, the conductive adhesive layer further includes a second adhesive layer and a third adhesive layer, and the first adhesive layer is located between the second adhesive layer and the third adhesive layer;

[0011] The elastic modulus of the first adhesive layer is greater than the elastic modulus of the second adhesive layer and the elastic modulus of the third adhesive layer.

[0012] In some embodiments, the elastic modulus of the first adhesive layer is in the range of 1 Gpa to 100 Gpa, and the elastic modulus of the second adhesive layer and the elastic modulus of the third adhesive layer are in the range of 0.1 Gpa to 10 Gpa.

[0013] In some embodiments, the thickness of the first adhesive layer ranges from 5 μm to 10 μm, and the thickness of the second adhesive layer and the thickness of the third adhesive layer ranges from 1 μm to 5 μm.

[0014] In some embodiments, the guide groove includes a bottom wall and a side wall surrounding the bottom wall, the side wall is inclined, and an angle between the side wall and the plane where the driving substrate is located ranges from 30° to 60°.

[0015] In some embodiments, the guide groove has a depth ranging from 2 μm to 5 μm.

[0016] In some embodiments, the width of the guide groove is 1 μm to 2 μm greater than the width of the electrode pin.

[0017] In some embodiments, the light-emitting chip includes a positive pin and a negative pin, the second glue layer includes a first guide groove corresponding to the positive pin and a second guide groove corresponding to the negative pin, and the distance between the edge of the first guide groove and the edge of the second guide groove ranges from 5μm to 50μm.

[0018] According to a second aspect of the present application, a display device is provided, comprising the display panel as described in the first aspect.

[0019] In the display panel and display panel provided in the embodiments of the present application, the light-emitting chip is bonded to the driving substrate through a conductive adhesive layer, and the conductive adhesive layer at least includes a first adhesive layer containing conductive particles. The first adhesive layer realizes conduction between the light-emitting chip and the driving substrate while bonding the two. The first adhesive layer of the present application is a patterned film layer, and a guide groove is provided on the side of the first adhesive layer away from the driving substrate. When the light-emitting chip is bonded to the driving substrate, the light-emitting chip is made to correspond to the guide groove, and pressure is applied to the light-emitting chip, and the light-emitting chip will deviate into the guide groove, thereby correcting the position of the light-emitting chip, and further improving the bonding yield of the light-emitting chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0021] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0022] Figure 1 It is a cross-sectional view of a display panel provided by the prior art;

[0023] Figure 2 It is a top view of a display panel provided by the prior art;

[0024] Figure 3 is a cross-sectional view of a display panel provided in an embodiment of the present application;

[0025] Figure 4 is a top view of a first adhesive layer of a display panel provided in an embodiment of the present application;

[0026] Figure 5 is a top view of a display panel provided by an embodiment of the present application;

[0027] Figure 6 yes Figure 4 An AA cross-sectional view of the first adhesive layer is provided;

[0028] Figure 7 is a cross-sectional view of a conductive adhesive layer provided in an embodiment of the present application;

[0029] Figure 8 It is a schematic diagram of misalignment correction of a display panel provided in an embodiment of the present application.

[0030] Description of reference numerals:

[0031] 100, display panel; 110, driving substrate; 120, conductive adhesive layer; 121, first adhesive layer; 122, conductive particles; 123, guide groove; 1231, side wall; 1232, bottom wall; 1233, first guide groove; 1234, second guide groove; 124, second adhesive layer; 125, third adhesive layer; 130, light-emitting chip; 1301, red light-emitting chip; 1302, green light-emitting chip; 1303, blue light-emitting chip; 131, light-emitting body; 132, electrode pin; 1321, positive pin; 1322, negative pin; 120', conductive adhesive; 121', first adhesive material; 123', second adhesive material. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0033] See also Figure 1-Figure 2 , Figure 1 is a cross-sectional view of a display panel provided by the prior art. Figure 2 is a top view of a display panel provided by the prior art. Figure 1 The display panel of the prior art includes a driving substrate 110, a conductive adhesive 120' located on one side of the driving substrate 110, and a light emitting chip 130 located on the side of the conductive adhesive 120' away from the driving substrate 110, wherein the conductive adhesive 120' contains conductive particles 122 for realizing electrical connection between the light emitting chip 130 and the driving substrate 110. In some prior arts, the conductive adhesive 120' may include a first adhesive material 121' and a second adhesive material 123', wherein the first adhesive material 121' contains conductive particles 122, and the second adhesive material 123' is located between the first adhesive material 121' and the light emitting chip 130 to play a bonding role. Please refer to Figure 2 The conductive adhesive 120' in the prior art is usually a planar film layer, that is, the surface of the conductive adhesive 120' is a flat surface. When the light-emitting chip 130 is bonded to the conductive adhesive 120', since the surface of the conductive adhesive 120' is a flat surface, the light-emitting chip 130 is prone to displacement under the pressure of bonding, which seriously affects the bonding yield of the light-emitting chip 130.

[0034] See also Figure 3 , Figure 3 The cross-sectional structure diagram of a display panel 100 provided in an embodiment of the present application. The present application provides a display panel 100, which can improve the chip offset problem when the conductive adhesive 120' is used to bond the light emitting chip 130 in the prior art, and improve the bonding yield of the light emitting chip 130.

[0035] The display panel 100 of the present application includes a driving substrate 110 , a conductive adhesive layer 120 and a light emitting chip 130 .

[0036] The driving substrate 110 includes a substrate and an array circuit disposed on the substrate. The driving substrate 110 is used to drive the light-emitting chip 130 to emit light. The substrate may be a flexible substrate or a rigid substrate. The flexible substrate may be, for example, polyimide (PI), and the rigid substrate may be, for example, glass. The array circuit may be a thin film transistor formed on the substrate and arranged in an array. The thin film transistor may include a gate, an active layer, a source electrode, a drain electrode, an insulating layer, and the like. The specific structure of the thin film transistor may refer to the prior art and will not be described in detail herein.

[0037] The conductive adhesive layer 120 is disposed on one side of the driving substrate 110, and includes a first adhesive layer 121. The material of the first adhesive layer 121 can be epoxy resin, acrylic, etc., but is not limited thereto. The first adhesive layer 121 includes conductive particles 122. The conductive particles 122 are evenly distributed in the first adhesive layer 121. The material of the conductive particles 122 can be metal particles such as Ag, Au, Cu, Al, etc., but is not limited thereto. In the present application, the first adhesive layer 121 is a patterned film layer, and a guide groove 123 is disposed on the side of the first adhesive layer 121 away from the driving substrate 110. Please refer to Figure 4 , Figure 4 1 is a top view of a first adhesive layer 121 of a display panel 100 provided in an embodiment of the present application, wherein the surface of the first adhesive layer 121 (i.e., the side of the first adhesive layer 121 close to the light-emitting chip 130) has a patterned structure, and the patterned structure can be a plurality of grooves arranged in an array on the surface of the first adhesive layer 121, and the guide grooves 123 on the surface of the first adhesive layer 121 can be formed by embossing or the like, but are not limited thereto. The position and number of the guide grooves 123 on the first adhesive layer 121 correspond to the position and number of the light-emitting chips 130 to be bonded.

[0038] The light-emitting chip 130 is arranged on a side of the conductive adhesive layer 120 away from the driving substrate 110. The display panel 100 may include a plurality of light-emitting chips 130, and the plurality of light-emitting chips 130 are arranged in an array on the driving substrate 110, and the plurality of light-emitting chips 130 are bonded and fixed to the driving substrate 110 through the conductive adhesive layer 120. The light-emitting chip 130 may be an LED chip, a Mini LED chip or a MicroLED chip, but is not limited thereto. The light-emitting chip 130 may be a red light-emitting chip, a blue light-emitting chip or a green light-emitting chip. In the present application, the light-emitting chip 130 is aligned with the guide groove 123 and is electrically connected to the conductive adhesive layer 120, and one end of the light-emitting chip 130 close to the first adhesive layer 121 contacts the conductive particles 122 in the first adhesive layer 121 to achieve electrical connection. In the present application, at least the electrical contact portion of the light emitting chip 130 and the first adhesive layer 121 (i.e., the end portion of the light emitting chip 130 contacting the first adhesive layer 121 ) is received in the corresponding guide groove 123 to achieve position correction of the light emitting chip 130 by the guide groove 123 .

[0039] When the light-emitting chip 130 is bonded to the driving substrate 110, the light-emitting chip 130 is aligned with the corresponding guide groove 123, that is, the light-emitting chip 130 is located directly above the corresponding guide groove 123, and pressure is applied to the light-emitting chip 130, so that the light-emitting chip 130 will deviate into the corresponding guide groove 123, so that the end of the light-emitting chip 130 close to the conductive adhesive layer 120 is deviated into the range of the guide groove 123 and contacts the bottom wall 1232 of the guide groove 123, and the end of the light-emitting chip 130 close to the conductive adhesive layer 120 is accommodated in the guide groove 123, and the side wall 1231 of the guide groove 123 plays a certain limiting role on the light-emitting chip 130. Therefore, in the process of bonding the light-emitting chip 130 to the driving substrate 110, the guide groove 123 on the conductive adhesive layer 120 can correct the position of the light-emitting chip 130 to avoid the deviation of the light-emitting chip 130, thereby effectively improving the bonding yield of the light-emitting chip 130.

[0040] See also Figure 5 , Figure 5 1 is a top view of a display panel 100 provided in an embodiment of the present application, specifically a top view of a structure after a conductive adhesive layer 120 is attached to a driving substrate 110 and a light-emitting chip 130 is bonded. The display panel 100 includes a driving substrate 110, a conductive adhesive layer 120 located on the driving substrate 110, and a light-emitting chip 130 located on the conductive adhesive layer 120. The light-emitting chip 130 includes a red light-emitting chip 1301, a green light-emitting chip 1302, and a blue light-emitting chip 1303. The red light-emitting chip 1301, the green light-emitting chip 1302, and the blue light-emitting chip 1303 are arranged in an array on the conductive adhesive layer 120.

[0041] In some embodiments, see Figure 3The light emitting chip 130 includes a light emitting body 131 and an electrode pin 132 located on a side of the light emitting body 131 close to the conductive adhesive layer 120. The electrode pin 132 is in electrical contact with the first adhesive layer 121. The electrode pin 132 is connected to the driving substrate 110 through the conductive adhesive layer 120 so that the light emitting body 131 can emit light. In this embodiment, the electrode pin 132 is aligned with the guide groove 123 so that at least part of the electrode pin 132 is accommodated in the guide groove 123, that is, the guide groove 123 is set at the position of the first adhesive layer 121 corresponding to the electrode pin 132, and the bonding position of the electrode pin 132 is corrected by the guide groove 123 to avoid the deviation of the light emitting chip 130. Specifically, when the light-emitting chip 130 is bonded to the driving substrate 110, the electrode pin 132 of the light-emitting chip 130 is aligned with the corresponding guide groove 123, that is, the electrode pin 132 is located directly above the corresponding guide groove 123, and pressure is applied to the light-emitting chip 130, so that the electrode pin 132 will deviate into the corresponding guide groove 123, so that the end of the electrode pin 132 close to the conductive adhesive layer 120 is deviated to the range of the guide groove 123 and contacts the bottom wall 1232 of the guide groove 123, and the end of the electrode pin 132 close to the first adhesive layer 121 is accommodated in the guide groove 123, and the side wall 1231 of the guide groove 123 plays a certain limiting role on the electrode pin 132. Therefore, in the process of bonding the light-emitting chip 130 to the driving substrate 110, the guide groove 123 on the conductive adhesive layer 120 can correct the position of the electrode pin 132, thereby avoiding the deviation of the light-emitting chip 130, further improving the bonding accuracy, and improving the bonding yield of the light-emitting chip 130.

[0042] In some embodiments, see Figure 3 A light emitting chip 130 may include two electrode pins 132 . For example, a light emitting chip 130 may include a positive electrode pin 1321 and a negative electrode pin 1322 . The positive electrode pin 1321 is connected to the positive electrode of the driving substrate 110 , and the negative electrode pin 1322 is connected to the negative electrode of the driving substrate 110 .

[0043] See also Figure 4 and Figure 6 , Figure 6 yes Figure 4The AA cross-sectional view of the first adhesive layer 121 is provided. In the present application, the second adhesive layer 124 includes a first guide groove 1233 corresponding to the positive pin 1321 and a second guide groove 1234 corresponding to the negative pin 1322, and the distance between the edge of the first guide groove 1233 and the edge of the second guide groove 1234 is smaller than the distance between the positive pin 1321 and the negative pin 1322 of the light-emitting chip 130, so as to ensure that the positive pin 1321 and the negative pin 1322 have sufficient offset space for position correction. Further, the distance X1 between the edge of the first guide groove 1233 and the edge of the second guide groove 1234 can range from 5μm to 50μm, which can be specifically designed according to the size of the light-emitting chip 130.

[0044] In some embodiments, see Figure 7 , Figure 7 1 is a cross-sectional view of a conductive adhesive layer 120 provided in an embodiment of the present application. The conductive adhesive layer 120 further includes a second adhesive layer 124 and a third adhesive layer 125, and the first adhesive layer 121 is located between the second adhesive layer 124 and the third adhesive layer 125. The second adhesive layer 124 is located on a side of the first adhesive layer 121 close to the light-emitting chip 130, and is used to bond the light-emitting chip 130. The third adhesive layer 125 is located on a side of the first adhesive layer 121 close to the driving substrate 110, and is used to bond the driving substrate 110. The second adhesive layer 124 and the third adhesive layer 125 can enhance the bonding effect of the conductive adhesive layer 120, so that the light-emitting chip 130 is stably bonded to the driving substrate 110. The materials of the second adhesive layer 124 and the third adhesive layer 125 can be epoxy resin, acrylic, etc., but are not limited thereto.

[0045] In some embodiments, the elastic modulus of the first adhesive layer 121 is greater than the elastic modulus of the second adhesive layer 124 and the elastic modulus of the third adhesive layer 125. The larger the elastic modulus of the material, the greater the rigidity and the less likely the film layer is to deform. In the present application, by increasing the elastic modulus of the first adhesive layer 121, when the light-emitting chip 130 is bonded, in the process of applying pressure to the light-emitting chip 130, the first adhesive layer 121 is not easily deformed, thereby making the guide groove 123 not easily deformed and shifted, so as to ensure that the guide groove 123 on the first adhesive layer 121 can play a role in correcting the deviation of the light-emitting chip 130. In addition, since the first adhesive layer 121 has a higher elastic modulus, the particle aggregation phenomenon caused by the flow of the conductive particles 122 in the first adhesive layer 121 is also avoided, thereby improving the conductive uniformity of the conductive adhesive layer 120 and improving the luminous uniformity of the display panel 100. Furthermore, the elastic modulus of the first adhesive layer 121 is in the range of 1 GPa to 100 GPa, and the elastic modulus of the second adhesive layer 124 and the third adhesive layer 125 are in the range of 0.1 GPa to 10 GPa, wherein the elastic modulus refers to Young's modulus. The elastic modulus of the first adhesive layer 121 and the elastic modulus of the third adhesive layer 125 may be the same or different.

[0046] In some embodiments, since the first glue layer 121 needs a certain rigidity and hardness to maintain the stability of its surface pattern structure, that is, to maintain the shape stability of the guide groove 123 on the first glue layer 121, and the second glue layer 124 and the third glue layer 125 mainly play a bonding role, the thickness of the first glue layer 121 can be greater than the thickness of the second glue layer 124 and the thickness of the third glue layer 125. Further, the thickness of the first glue layer 121 can range from 5 μm to 10 μm, and the thickness of the second glue layer 124 and the thickness of the third glue layer 125 can range from 1 μm to 5 μm. Specifically, the thickness of the first glue layer 121, the second glue layer 124, and the third glue layer 125 can be designed according to the size of the light emitting chip 130 and the size of the display panel 100.

[0047] In some embodiments, see Figure 7 The guide groove 123 includes a bottom wall 1232 and a side wall 1231 surrounding the bottom wall 1232, and the side wall 1231 can be inclined. Figure 8 , Figure 8 1 is a schematic diagram of the deviation correction of a display panel 100 provided by an embodiment of the present application, wherein the dotted line indicates the position where the light-emitting chip 130 is deviated, and the solid line indicates the position of the light-emitting chip 130 after the deviation correction. When the light-emitting chip 130 is deviated from the driving substrate 110, in the process of applying pressure to the light-emitting chip 130, the electrode pin 132 of the light-emitting chip 130 contacts the side wall 1231 of the guide groove 123. Since the side wall 1231 of the guide groove 123 is inclined and has a certain slope, under the action of pressure, the electrode pin 132 of the light-emitting chip 130 gradually moves toward the center of the guide groove 123 along the inclined side wall 1231 of the guide groove 123, and finally the electrode pin 132 of the chip moves into the guide groove 123 and contacts the bottom wall 1232 of the guide groove 123, thereby realizing the position correction of the light-emitting chip 130. Therefore, the side wall 1231 of the guide groove 123 is designed with a slope, which is more conducive to the position correction of the light-emitting chip 130. Specifically, the angle α between the side wall 1231 and the plane where the driving substrate 110 is located ranges from 30° to 60°.

[0048] In some embodiments, see Figure 7 , the depth H of the guide groove 123 ranges from 2 μm to 5 μm. In the present application, the guide groove 123 needs to have a certain depth to satisfy the limiting effect on the light-emitting chip 130, stabilize the position of the corrected light-emitting chip 130, and prevent the light-emitting chip 130 from easily escaping from the guide groove 123. Specifically, the depth of the guide groove 123 can be designed according to the size of the light-emitting chip 130 or the thickness of the electrode pin 132.

[0049] In some embodiments, since there may be a certain error in the alignment of the light emitting chip 130 and the driving substrate 110, the size of the guide groove 123 can be designed to be slightly larger than the size of the electrode pin 132, that is, the orthographic projection of the electrode pin 132 on the driving substrate 110 is located within the orthographic projection range of the guide groove 123 on the driving substrate 110. For details, please refer to Figure 3 When the electrode pin 132 is rectangular, the width a of the guide groove 123 is 1 μm to 2 μm larger than the width b of the electrode pin 132 .

[0050] The present application also provides a display device, which includes the above-mentioned display panel 100. The display device has all the beneficial effects of the above-mentioned display panel 100, which will not be described in detail in the present application.

[0051] The display device may be a television, tablet, computer, car-mounted display product, etc., but is not limited thereto.

[0052] In the display panel and display panel provided in the embodiments of the present application, the light-emitting chip is bonded to the driving substrate through the conductive adhesive layer 120. The conductive adhesive layer at least includes a first adhesive layer containing conductive particles. The first adhesive layer realizes conduction between the light-emitting chip and the driving substrate while bonding the two. The first adhesive layer of the present application is a patterned film layer. A guide groove is provided on the side of the first adhesive layer away from the driving substrate. When the light-emitting chip is bonded to the driving substrate, the light-emitting chip is made to correspond to the guide groove. When pressure is applied to the light-emitting chip, the light-emitting chip will deviate into the guide groove, thereby correcting the position of the light-emitting chip, thereby improving the bonding yield of the light-emitting chip.

[0053] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0054] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0055] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0056] The above are only preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display panel, characterized in that: include: Driver substrate; A conductive adhesive layer, disposed on one side of the driving substrate, comprising at least a first adhesive layer, wherein the first adhesive layer comprises conductive particles, and a guide groove is disposed on a side of the first adhesive layer away from the driving substrate; and The light emitting chip is arranged on a side of the first adhesive layer away from the driving substrate. The light emitting chip is aligned with the guide groove, and at least the electrical contact portion between the light emitting chip and the first adhesive layer is accommodated in the guide groove.

2. The display panel according to claim 1, characterized in that: The light emitting chip comprises a light emitting body and an electrode pin located on a side of the light emitting body close to the conductive adhesive layer. The electrode pin is aligned with the guide groove, the electrode pin is in electrical contact with the first adhesive layer, and the electrode pin is at least partially received in the guide groove.

3. The display panel according to claim 2, characterized in that: The conductive adhesive layer further includes a second adhesive layer and a third adhesive layer, wherein the first adhesive layer is located between the second adhesive layer and the third adhesive layer; The elastic modulus of the first adhesive layer is greater than the elastic modulus of the second adhesive layer and the elastic modulus of the third adhesive layer.

4. The display panel according to claim 3, characterized in that: The elastic modulus of the first adhesive layer is in the range of 1 Gpa to 100 Gpa, and the elastic modulus of the second adhesive layer and the elastic modulus of the third adhesive layer are in the range of 0.1 Gpa to 10 Gpa.

5. The display panel according to claim 3, characterized in that: The thickness of the first adhesive layer is in a range of 5 μm to 10 μm, and the thickness of the second adhesive layer and the thickness of the third adhesive layer are in a range of 1 μm to 5 μm.

6. The display panel according to any one of claims 1 to 5, characterized in that: The guide groove comprises a bottom wall and a side wall surrounding the bottom wall. The side wall is inclined, and an angle between the side wall and the plane where the drive substrate is located is in a range of 30° to 60°.

7. The display panel according to any one of claims 1 to 5, characterized in that: The depth of the guide groove ranges from 2 μm to 5 μm.

8. The display panel according to any one of claims 2 to 5, characterized in that: The width of the guide groove is 1 μm to 2 μm greater than the width of the electrode pin.

9. The display panel according to any one of claims 2 to 5, characterized in that: The light emitting chip includes a positive pin and a negative pin, the second glue layer includes a first guide groove corresponding to the positive pin and a second guide groove corresponding to the negative pin, and the distance between the edge of the first guide groove and the edge of the second guide groove ranges from 5μm to 50μm.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 9.

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