Multi-station eutectic chip mounter
By setting up a multi-station and multi-dimensional adaptive correction and transfer device in the eutectic chip mounter, the problems of efficiency and alignment accuracy of the eutectic chip mounter are solved, and a high-efficiency and stable eutectic process is achieved.
Patent Information
- Application Number
- CN202411536105.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-01-07
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The overall efficiency of existing eutectic bonding machines is limited by the efficiency of the eutectic station and is difficult to improve. Furthermore, the optimization is difficult after adding a eutectic station, which affects the alignment accuracy and the stability of the equipment operation.
The multi-station eutectic bonding machine is designed with a hollow wafer fixture and chip transfer station in the center, and a substrate fixture and eutectic station on both sides. Combined with a multi-dimensional adaptive bias correction and transfer device, the chip and substrate are transferred between each station to achieve adaptive bias correction and efficient transfer.
It improves space utilization and transfer efficiency, ensures accurate alignment of substrate and chip without manual optimization, and enhances the operational stability and eutectic quality of the equipment.
Smart Images
Figure CN119277757A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a eutectic chip mounter, in particular to a multi-station eutectic chip mounter. Background Art
[0002] At present, common eutectic placement machines often have only one set of eutectic positions, that is, there is only one chip loading position, one substrate loading position and one eutectic position. The overall efficiency of the eutectic placement machine is restricted by the efficiency of the eutectic position and is difficult to improve significantly. At the same time, this group of eutectic positions often corresponds to only one combination of substrate and chip. The various transfer mechanisms on the eutectic placement machine need to be optimized according to the substrate-chip combination corresponding to this group of positions to ensure the alignment accuracy of the substrate-chip during eutectic. Therefore, for common eutectic placement machines, if the eutectic positions are simply increased in order to improve efficiency, in order to meet the alignment accuracy requirements, the number of loading positions, eutectic positions, and transfer mechanisms that need to be optimized and coordinated will increase and will cross-influence each other, which will lead to a sharp increase in the difficulty of optimization. In the end, it is not only difficult to improve the eutectic efficiency, but also a lot of time will be spent on equipment debugging. Moreover, the fault tolerance between each loading position, eutectic position and transfer mechanism will become extremely small. Once the equipment operation fluctuates during operation, it will directly affect the subsequent eutectic quality.
[0003] Therefore, how to overcome the above-mentioned defects has become an important issue to be solved urgently by those skilled in the art. Summary of the invention
[0004] The present invention overcomes the deficiencies of the above-mentioned technologies and provides a multi-station eutectic chip mounter.
[0005] To achieve the above object, the present invention adopts the following technical solutions:
[0006] A multi-station eutectic bonding machine comprises a base 1, wherein a hollow wafer fixture 2 capable of translation along the X-axis and the Y-axis is provided at the central front side of the base 1, wherein the hollow wafer fixture 2 is used to place a wafer with a chip, and a chip transfer table 3 capable of translation along the X-axis and the Y-axis and rotation around the Z-axis for placing the eutectic chip to be placed is provided on the base 1 at the rear side of the hollow wafer fixture 2, wherein the chip transfer table 3 capable of translation along the X-axis and the Y-axis and rotation around the Z-axis is used to place the eutectic chip, and a first multi-dimensional adaptive deviation correction and transfer device 4 for transferring the chip between the hollow wafer fixture 2 and the chip transfer table 3 is provided on the base 1, and the bases 1 on the left and right sides of the hollow wafer fixture 2 are respectively provided with A substrate fixture 5 is used to place the substrate, and the substrate fixture 5 can also be translated along the X-axis and the Y-axis. A eutectic table 6 for carrying the substrate and the chip for eutectic is provided on the base 1 on the rear side of each substrate fixture 5. The eutectic table 6 can be translated along the X-axis and the Y-axis and rotate around the Z-axis. Both sides of the base 1 are respectively provided with a second multi-dimensional adaptive correction and transportation device 7 for transferring the substrate between the substrate fixture 5 and the eutectic table 6 on the corresponding side. The base 1 is also provided with a third multi-dimensional adaptive correction and transportation device 8 for transferring the chip between the chip transfer table 3 and the two eutectic tables 6.
[0007] Preferably, the base 1 is provided with a first Y-axis slide 21 , and the first Y-axis slide 21 is drivingly connected to a first X-axis slide 22 . The hollow wafer fixture 2 is detachably connected to the first X-axis slide 22 and driven to translate by the first X-axis slide 22 .
[0008] Preferably, a second X-axis slide 51 is provided on the base 1 below each substrate fixture 5, and each second X-axis slide 51 is drivingly connected to a second Y-axis slide 52. The substrate fixture 5 can be detachably connected to the corresponding second Y-axis slide 52 below and driven to translate by the second Y-axis slide 52.
[0009] Preferably, a third X-axis slide 31 is provided on the base 1, the third X-axis slide 31 is drivingly connected to the third Y-axis slide 32, the third Y-axis slide 32 is drivingly connected to the first Z-axis turntable 33, and the chip transfer table 3 is detachably connected to the first Z-axis turntable 33 and driven to rotate by the first Z-axis turntable 33.
[0010] Preferably, a fourth Y-axis slide 61 is provided on the base 1 below each eutectic table 6, each fourth Y-axis slide 61 is drivingly connected to a fourth X-axis slide 62, each fourth X-axis slide 62 is drivingly connected to a second Z-axis turntable 63, and the eutectic table 6 is detachably connected to the corresponding second Z-axis turntable 63 below and driven to rotate by the second Z-axis turntable 63.
[0011] Preferably, the first multi-dimensional adaptive deviation correction and transfer device 4 includes a first camera 41 fixed on the base 1 facing the area where the hollow wafer fixture 2 is located, the base 1 is provided with a fifth Y-axis slide 42, the fifth Y-axis slide 42 is drivingly connected to the first Z-axis slide 43, the first Z-axis slide 43 is drivingly connected to the third Z-axis turntable 44, the third Z-axis turntable 44 is drivingly connected to a flexible adsorption component 9, the flexible adsorption component 9 is used to adsorb chips to facilitate the transfer of chips, the base 1 is also provided with a chip ejector 45 located below the hollow wafer fixture 2, the chip ejector 45 is used to eject the chip on the hollow wafer fixture 2 upwards to facilitate the flexible adsorption component 9 to adsorb the chip.
[0012] Preferably, the second multi-dimensional adaptive deviation correction and transfer device 7 includes a second camera 71 and a first light source 72 fixed on the base 1 facing the area where the corresponding side substrate fixture 5 is located, and the base 1 is provided with a sixth Y-axis slide 73, and the sixth Y-axis slide 73 is driven and connected to the second Z-axis slide 74, and the second Z-axis slide 74 is driven and connected to the fourth Z-axis turntable 75, and the fourth Z-axis turntable 75 is also connected to a flexible adsorption component 9, and the flexible adsorption component 9 is used to adsorb the substrate to facilitate the transfer of the substrate.
[0013] Preferably, the third multi-dimensional adaptive deviation correction and transfer device 8 includes a third camera 81 and a fourth camera 82 fixed on the base 1, the third camera 81 faces the area where the chip transfer table 3 is located, and the fourth camera 82 has two areas facing respectively the areas where the eutectic table 6 is located, and the base 1 is provided with an X-axis slide rail 83 located on the rear side of the chip transfer table 3 and the eutectic table 6, the X-axis slide rail 83 is connected to a fifth X-axis slide 84, the fifth X-axis slide 84 is driven to be connected to a third Z-axis slide 85, the third Z-axis slide 85 is driven to be connected to a fifth Z-axis turntable 86, the fifth Z-axis turntable 86 is also driven to be connected to a flexible adsorption component 9, and the flexible adsorption component 9 is used to adsorb chips to facilitate the transfer of chips.
[0014] Preferably, the flexible adsorption component 9 includes a first cross bar 91 connected to the Z-axis turntable, a first vertical bar 92 extending downward is fixed at the end of the first cross bar 91, a second cross bar 93 extending in the direction of the rotation axis of the corresponding Z-axis turntable is hingedly connected to the first vertical bar 92, a suction nozzle 94 extending downward is fixed on the second cross bar 93, and the suction nozzle 94 is used to adsorb chips / substrates for easy transportation, and a buffer spring 95 is connected between the first cross bar 91 and the second cross bar 93.
[0015] Preferably, an ion blower 10 facing the hollow wafer fixture 2 area is provided on the base 1 .
[0016] Preferably, the substrate fixture 5 is further provided with a plurality of finished product storage positions 56 for placing finished eutectic substrates.
[0017] Compared with the prior art, the present invention has the following beneficial effects:
[0018] 1. The multi-station eutectic mounter in this case sets the hollow wafer fixture and chip transfer table in the center of the base, and the two sides of the base are respectively provided with substrate fixtures and eutectic tables. In this way, the multi-station eutectic mounter in this case can perform two eutectic processes at the same time. Moreover, by using the arrangement method of setting the hollow wafer fixture and chip transfer table in the center and the substrate fixture and eutectic table on both sides, one set of hollow wafer fixtures and chip transfer tables can be set less, so that the space required for the eutectic mounter can be reduced while meeting the needs of two eutectic table chips, thereby improving space utilization. In addition, precisely because of the distribution of the hollow wafer fixture, chip transfer table, substrate fixture and eutectic table, three multi-dimensional adaptive deviation correction and transfer devices can be respectively set between the hollow wafer fixture and the chip transfer table, between the substrate fixture and the eutectic table, and between the chip transfer table and the eutectic table. In this way, each transfer device can simultaneously perform the rotation of the substrate and the chip without interfering with each other, and the transfer path is also shorter, which can further improve the transfer efficiency.
[0019] 2. The multi-station eutectic bonding machine in this case adopts the first multi-dimensional adaptive deflection correction transfer device, the second multi-dimensional adaptive deflection correction transfer device and the third multi-dimensional adaptive deflection correction transfer device to transfer chips and substrates between each station. During the transfer process, each transfer device can perform adaptive deflection correction on the transferred object, and the hollow wafer fixture, substrate fixture, chip transfer table and eutectic table can adjust their own positions to align with each transfer device. In this way, there is no need to manually optimize the eutectic bonding machine and the accurate alignment of the substrate and chip can be guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 This is one of the schematic diagrams of the multi-station eutectic bonding machine in this case.
[0021] Figure 2 This is the second schematic diagram of the multi-station eutectic placement machine in this case.
[0022] Figure 3 It is a schematic diagram of the hollow wafer fixture, chip transfer table and the first multi-dimensional adaptive correction and transfer device in this case.
[0023] Figure 4 It is a schematic diagram of the substrate fixture, eutectic table and the second multi-dimensional adaptive deviation correction and transfer device in this case.
[0024] Figure 5 It is a schematic diagram of the chip transfer table, eutectic table and the third multi-dimensional adaptive deviation correction and transportation device in this case.
[0025] Figure 6 It is a schematic diagram of the flexible adsorption component of this case. DETAILED DESCRIPTION
[0026] The features of the present invention and other related features are further described in detail below through embodiments to facilitate understanding by those skilled in the art:
[0027] like Figures 1 to 5 As shown, a multi-station eutectic bonding machine includes a base 1, a hollow wafer fixture 2 capable of translation along the X-axis and the Y-axis is provided on the central front side of the base 1, the hollow wafer fixture 2 is used to place the wafer with the chip, the base 1 on the rear side of the hollow wafer fixture 2 is provided with a chip transfer table 3 capable of translation along the X-axis and the Y-axis and rotation around the Z-axis for placing the eutectic chip to be placed, the base 1 is provided with a first multi-dimensional adaptive deviation correction and transfer device 4 for transferring the chip between the hollow wafer fixture 2 and the chip transfer table 3, and the bases 1 on the left and right sides of the hollow wafer fixture 2 are respectively provided with A substrate fixture 5 for placing the substrate is provided, and the substrate fixture 5 can also be translated along the X-axis and the Y-axis. A eutectic table 6 for carrying the substrate and the chip for eutectic is provided on the base 1 on the rear side of each substrate fixture 5. The eutectic table 6 can be translated along the X-axis and the Y-axis and rotate around the Z-axis. Both sides of the base 1 are respectively provided with a second multi-dimensional adaptive deviation correction and transportation device 7 for transferring the substrate between the substrate fixture 5 and the eutectic table 6 on the corresponding side. The base 1 is also provided with a third multi-dimensional adaptive deviation correction and transportation device 8 for transferring the chip between the chip transfer table 3 and the two eutectic tables 6.
[0028] The multi-station eutectic bonding machine in this case is provided with a hollow wafer fixture 2 and a chip transfer table 3 distributed front and back in the center of the base 1, and the left and right sides of the base 1 are respectively provided with a substrate fixture 5 and a eutectic table 6 distributed front and back. At the same time, a first multi-dimensional adaptive deviation correction and transportation device 4 for transferring chips is also provided between the hollow wafer fixture 2 and the chip transfer table 3, and a second multi-dimensional adaptive deviation correction and transportation device 7 for transferring substrates is also provided between the substrate fixture 5 and the eutectic table 6 on the same side, and a third multi-dimensional adaptive deviation correction and transportation device 8 for transferring chips between the chip transfer table 3 and the two eutectic tables 6 is also provided on the base 1. In this way, when the multi-station eutectic bonding machine of this case is working, the chip in the wafer placed on the hollow wafer fixture 2 can be transferred to the chip transfer table 3 through the first multi-dimensional adaptive deflection correction and transfer device 4. During the transfer, the hollow wafer fixture 2 can align the chip to be transferred with the first multi-dimensional adaptive deflection correction and transfer device 4 through translation in the X-axis and Y-axis directions so that the first multi-dimensional adaptive deflection correction and transfer device 4 can accurately take the chip away. The first multi-dimensional adaptive deflection correction and transfer device 4 can correct the chip during the process of transferring the chip to the chip transfer table 3, and the chip transfer table 3 can also adjust its own position through translation in the X-axis and Y-axis directions and rotation in the Z-axis direction to more accurately receive the chip transferred by the first multi-dimensional adaptive deflection correction and transfer device 4.
[0029] While the first multi-dimensional adaptive deflection correction and transfer device 4 is transferring the chip, the transfer of the substrate is also carried out synchronously. Similarly, the substrate placed on the substrate fixture 5 can be transferred to the eutectic table 6 through the second multi-dimensional adaptive deflection correction and transfer device 7. During the transfer, the substrate fixture 5 can align the substrate to be transferred with the second multi-dimensional adaptive deflection correction and transfer device 7 through its own translation in the X-axis and Y-axis directions so that the second multi-dimensional adaptive deflection correction and transfer device 7 can accurately take away the substrate. The second multi-dimensional adaptive deflection correction and transfer device 7 can also correct the substrate in the process of transferring the substrate. The eutectic table 6 can also adjust its own position through translation in the X-axis and Y-axis directions and rotation in the Z-axis direction to more accurately receive the substrate transferred by the second multi-dimensional adaptive deflection correction and transfer device 7.
[0030] When a chip is transferred to the chip transfer table 3, the third multi-dimensional adaptive deflection correction and transportation device 8 will operate to transfer the chip on the chip transfer table 3 to one of the eutectic tables 6 on the left or right sides according to the idle situation of the eutectic table 6. Similarly, the chip transfer table 3 and the eutectic table 6 can also better cooperate with the third multi-dimensional adaptive deflection correction and transportation device 8 through translation in the X-axis and Y-axis directions and rotation in the Z-axis direction during this transportation process. The third multi-dimensional adaptive deflection correction and transportation device 8 will also correct the chip again when transporting the chip.
[0031] As described above, the multi-station eutectic bonding machine of this case sets the hollow wafer fixture 2 and the chip transfer table 3 in the center of the base 1, and the base 1 is respectively provided with a substrate fixture 5 and a eutectic table 6 on both sides. In this way, the multi-station eutectic bonding machine of this case can perform two eutectic processes at the same time. Moreover, by using the arrangement that the hollow wafer fixture 2 and the chip transfer table 3 are arranged in the center and the substrate fixture 5 and the eutectic table 6 are distributed on both sides, one set of hollow wafer fixture 2 and chip transfer table 3 can be reduced. In this way, the space required for the eutectic mounter can be reduced while meeting the chip requirements of two eutectic tables 6, thereby improving space utilization. In addition, precisely because of the distribution of the hollow wafer fixture 2, the chip transfer table 3, the substrate fixture 5 and the eutectic table 6, three multi-dimensional adaptive correction and transfer devices can be respectively arranged between the hollow wafer fixture 2 and the chip transfer table 3, between the substrate fixture 5 and the eutectic table 6, and between the chip transfer table 3 and the eutectic table 6. In this way, each transfer device can simultaneously rotate the substrate and the chip without interfering with each other. At the same time, the transfer path is also shorter, which can further improve the transfer efficiency. At the same time, since the multi-station eutectic bonding machine in this case adopts the first multi-dimensional adaptive deflection correction transfer device 4, the second multi-dimensional adaptive deflection correction transfer device 7 and the third multi-dimensional adaptive deflection correction transfer device 8 to transfer chips and substrates between each station, each transfer device can perform adaptive deflection correction on the transferred object during the transfer process, and the hollow wafer fixture 2, substrate fixture 5, chip transfer table 3 and eutectic table 6 can adjust their own positions to align with each transfer device, so there is no need to manually optimize the eutectic bonding machine and can ensure accurate alignment of the substrate and chip.
[0032] like Figures 1 to 3 As shown, preferably, a first Y-axis slide 21 is provided on the base 1, and the first Y-axis slide 21 is driven and connected to the first X-axis slide 22. The hollow wafer fixture 2 is detachably connected to the first X-axis slide 22 and driven to translate by the first X-axis slide 22. In this way, the hollow wafer fixture 2 can be driven to translate along the X-axis direction by the first X-axis slide 22, and the first Y-axis slide 21 can indirectly drive the hollow wafer fixture 2 to translate along the Y-axis direction by driving the first X-axis slide 22 to translate along the Y-axis steering wheel. In this way, the first Y-axis slide 21 and the first X-axis slide 22 cooperate to realize the translation of the hollow wafer fixture 2 in the X-axis and Y-axis directions, so that the hollow wafer fixture 2 can adjust the position of the chip and cooperate with the first multi-dimensional adaptive deviation correction and transportation device 4 to transport the chip.
[0033] like Figure 1 , Figure 2 , Figure 4As shown, preferably, a second X-axis slide 51 is provided on the base 1 below each substrate fixture 5, and each second X-axis slide 51 is driven and connected to a second Y-axis slide 52. The substrate fixture 5 can be detachably connected to the corresponding second Y-axis slide 52 below and driven to translate by the second Y-axis slide 52. In this way, the substrate fixture 5 can be driven to translate along the Y-axis direction by the second Y-axis slide 52, and the second X-axis slide 51 can indirectly drive the substrate fixture 5 to translate along the X-axis direction by driving the second Y-axis slide 52 to translate along the X-axis direction. In this way, the second X-axis slide 51 and the second Y-axis slide 52 can cooperate to realize the translation of the substrate fixture 5 in the X-axis and Y-axis directions, so that the substrate fixture 5 can adjust the position of the chip and cooperate with the second multi-dimensional adaptive deviation correction and transportation device 7 to transport the substrate.
[0034] like Figure 1 , Figure 2 , Figure 3 , Figure 5 As shown, preferably, a third X-axis slide 31 is provided on the base 1, and the third X-axis slide 31 is driven and connected to the third Y-axis slide 32, and the third Y-axis slide 32 is driven and connected to the first Z-axis turntable 33, and the chip turntable 3 is detachably connected to the first Z-axis turntable 33 and driven to rotate by the first Z-axis turntable 33, so that the third Y-axis slide 32 can be driven to translate along the X-axis direction by the third X-axis slide 31, and the third Y-axis slide 32 can drive the first Z-axis turntable 33 to translate along the Y-axis direction, and at the same time, the third X-axis slide 31 can also indirectly drive the first Z-axis turntable 33 to translate along the X-axis direction, so that the translation of the first Z-axis turntable 33 along the X-axis and Y-axis directions is realized. Since the chip transfer table 3 is installed on the first Z-axis turntable 33 and can be driven by the first Z-axis turntable 33 to rotate around the Z-axis, the third X-axis slide 31 and the third Y-axis slide 32 can also indirectly drive the chip transfer table 3 to translate along the X-axis and Y-axis directions. In this way, the chip transfer table 3 can translate along the X-axis and Y-axis and rotate around the Z-axis under the coordinated drive of the third X-axis slide 31, the third Y-axis slide 32 and the first Z-axis turntable 33, thereby adjusting its own position angle to more accurately receive the chip sent by the first multi-dimensional adaptive correction and transfer device 4.
[0035] like Figure 1 , Figure 2 , Figure 4 , Figure 5As shown, preferably, a fourth Y-axis slide 61 is provided on the base 1 below each eutectic table 6, each fourth Y-axis slide 61 is driven and connected to a fourth X-axis slide 62, and each fourth X-axis slide 62 is driven and connected to a second Z-axis turntable 63, and the eutectic table 6 is detachably connected to the corresponding second Z-axis turntable 63 below and driven to rotate by the second Z-axis turntable 63, so that the fourth Y-axis slide 61 can drive the fourth X-axis slide 62 to translate along the Y-axis direction, and the fourth X-axis slide 62 can drive the second Z-axis turntable 63 to translate along the X-axis direction, and at the same time, the fourth Y-axis slide 61 can also indirectly drive the second Z-axis turntable 63 to translate along the Y-axis direction, thereby realizing the translation of the second Z-axis turntable 63 along the X-axis and Y-axis directions. Since the eutectic table 6 is installed on the second Z-axis turntable 63 and can be driven by the second Z-axis turntable 63 to rotate around the Z-axis, the fourth Y-axis slide 61 and the fourth X-axis slide 62 can also indirectly drive the eutectic table 6 to translate along the X-axis and Y-axis directions. In this way, the eutectic table 6 can translate along the X-axis and Y-axis and rotate around the Z-axis under the coordinated drive of the fourth Y-axis slide 61, the fourth X-axis slide 62 and the second Z-axis turntable 63, thereby adjusting its own position angle to more accurately receive the substrate sent by the second multi-dimensional adaptive deflection correction and transfer device 7 and the chip sent by the third multi-dimensional adaptive deflection correction and transfer device 8.
[0036] like Figure 1 , Figure 2 , Figure 3 , Figure 6 As shown, preferably, the first multi-dimensional adaptive deviation correction and transfer device 4 includes a first camera 41 fixed on the base 1 facing the area where the hollow wafer fixture 2 is located, the base 1 is provided with a fifth Y-axis slide 42, the fifth Y-axis slide 42 is driven and connected to the first Z-axis slide 43, the first Z-axis slide 43 is driven and connected to the third Z-axis turntable 44, the third Z-axis turntable 44 is driven and connected to a flexible adsorption component 9, the flexible adsorption component 9 is used to adsorb chips to facilitate the transfer of chips, the base 1 is also provided with a chip ejector 45 located below the hollow wafer fixture 2, the chip ejector 45 is used to eject the chip on the hollow wafer fixture 2 upwards to facilitate the flexible adsorption component 9 to adsorb the chip.
[0037] As described above, the first multi-dimensional adaptive deviation correction and transfer device 4 in this case includes a chip ejector pin 45 located below the hollow wafer fixture 2. The hollow wafer fixture 2 can move the chip to be transferred to the top of the chip ejector pin 45 by translation in the X-axis and Y-axis directions, and the chip in the wafer on the hollow wafer fixture 2 can be ejected with the help of the chip ejector pin 45. In addition, the base 1 is also provided with a first camera 41 facing the hollow wafer fixture 2, so that the image information of the chip on the wafer in the hollow wafer fixture 2 can be obtained through the first camera 41, and the specific position and offset of the chip can be determined by image recognition. At the same time, the base 1 is also provided with a fifth Y-axis slide 42, through which the first Z-axis slide 43 can be driven to translate along the Y-axis direction, and through the first Z-axis slide 43, the third Z-axis turntable 44 can be driven to translate up and down along the Z-axis, and the third Z-axis turntable 44 is connected to a flexible adsorption component 9. In this way, the fifth Y-axis slide 42 can indirectly drive the flexible adsorption component 9 to move back and forth between the hollow wafer fixture 2 and the chip transfer table 3 along the Y axis, and the first Z-axis slide 43 can indirectly drive the flexible adsorption component 9 to move up and down along the Z axis so as to lift the chip from the hollow wafer fixture 2 and put it down on the chip transfer table 3. The third Z-axis turntable 44 can drive the flexible adsorption component 9 to rotate and adjust the angle of the chip according to the chip image information obtained by the first camera 41. In this way, the first multi-dimensional adaptive deviation correction and transportation device 4 can adsorb the chip through the flexible adsorption component 9, and then transfer the chip from the hollow wafer fixture 2 to the chip transfer table 3 with the cooperation of the fifth Y-axis slide 42 and the first Z-axis slide 43, and during the transportation process, the angle of the chip can also be adjusted through the third Z-axis turntable 44 according to the image information obtained by the first camera 41, so as to realize the deviation correction processing of the chip while transporting.
[0038] like Figure 1 , Figure 2 , Figure 4 , Figure 6 As shown, preferably, the second multi-dimensional adaptive deviation correction and transfer device 7 includes a second camera 71 and a first light source 72 fixed on the base 1 facing the area where the corresponding side substrate fixture 5 is located, and the base 1 is provided with a sixth Y-axis slide 73, and the sixth Y-axis slide 73 is driven and connected to the second Z-axis slide 74, and the second Z-axis slide 74 is driven and connected to the fourth Z-axis turntable 75, and the fourth Z-axis turntable 75 is also connected to a flexible adsorption component 9, and the flexible adsorption component 9 is used to adsorb the substrate to facilitate the transfer of the substrate.
[0039] As described above, the second multi-dimensional adaptive deviation correction and transfer device 7 in this case includes a second camera 71 and a first light source 72 arranged toward the substrate fixture 5, so that the substrate image information on the substrate fixture 5 can be obtained through the second camera 71, and the specific position and offset of the substrate can be determined through image recognition. At the same time, a sixth Y-axis slide 73 is also provided on the base 1, through which the second Z-axis slide 74 can be driven to translate along the Y-axis direction, and through the second Z-axis slide 74, the fourth Z-axis turntable 75 can be driven to translate up and down along the Z-axis, and the fourth Z-axis turntable 75 is also connected to a flexible adsorption component 9. In this way, the sixth Y-axis slide 73 can indirectly drive the flexible adsorption component 9 to move back and forth between the substrate fixture 5 and the eutectic table 6 along the Y axis, and the second Z-axis slide 74 can indirectly drive the flexible adsorption component 9 to move up and down along the Z axis so as to lift the substrate from the substrate fixture 5 and put it down at the eutectic table 6. The fourth Z-axis turntable 75 can drive the flexible adsorption component 9 to rotate and adjust the angle of the substrate according to the substrate image information obtained by the second camera 71. In this way, the second multi-dimensional adaptive deviation correction and transportation device 7 can adsorb the substrate through the flexible adsorption component 9, and then transfer the substrate from the substrate fixture 5 to the eutectic table 6 with the cooperation of the sixth Y-axis slide 73 and the second Z-axis slide 74, and during the transportation process, the angle of the substrate can be adjusted through the fourth Z-axis turntable 75 according to the image information obtained by the second camera 71, so as to realize the deviation correction processing of the substrate during transportation.
[0040] like Figure 1 , Figure 2 , Figure 5 , Figure 6 As shown, preferably, the third multi-dimensional adaptive deviation correction and transfer device 8 includes a third camera 81 and a fourth camera 82 fixed on the base 1, the third camera 81 faces the area where the chip transfer table 3 is located, and the fourth camera 82 has two areas facing respectively the areas where the eutectic table 6 is located, and the base 1 is provided with an X-axis slide rail 83 located on the rear side of the chip transfer table 3 and the eutectic table 6, the X-axis slide rail 83 is connected to a fifth X-axis slide 84, the fifth X-axis slide 84 is driven to be connected to a third Z-axis slide 85, the third Z-axis slide 85 is driven to be connected to a fifth Z-axis turntable 86, the fifth Z-axis turntable 86 is also driven to be connected to a flexible adsorption component 9, and the flexible adsorption component 9 is used to adsorb chips to facilitate the transfer of chips.
[0041] As described above, the third multi-dimensional adaptive deviation correction and transfer device 8 in this case includes a third camera 81 facing the chip transfer table 3 and a fourth camera 82 facing the eutectic table 6, so that the image information of the chip on the chip transfer table 3 and the substrate on the eutectic table 6 can be obtained respectively through the third camera 81 and the fourth camera 82, and the specific position and offset of the substrate and chip to be eutectic can be determined through image recognition. At the same time, an X-axis slide rail 83 is also provided on the base 1, and a fifth X-axis slide 84 that can move along the X-axis is connected to the X-axis slide rail 83, so that the fifth X-axis slide 84 can drive the third Z-axis slide 85 to translate along the X-axis, and the third Z-axis slide 85 can drive the fifth Z-axis turntable 86 to move up and down along the Z-axis, and the fifth Z-axis turntable 86 is also connected to a flexible adsorption component 9. In this way, the fifth X-axis slide 84 can indirectly drive the flexible adsorption component 9 to move back and forth between the chip transfer table 3 and the eutectic table 6, and the third Z-axis slide 85 can indirectly drive the flexible adsorption component 9 to move up and down along the Z axis so as to lift the chip from the chip transfer table 3 and put it down at the eutectic table 6, and the fifth Z-axis turntable 86 can rotate the flexible adsorption component 9 according to the image information of the substrate and the chip obtained by the third camera 81 and the fourth camera 82, so as to correct the chip and adjust the angle of the chip so that the chip and the substrate to be eutectic can be accurately aligned and combined. In this way, the third multi-dimensional adaptive correction and transportation device 8 can adsorb the chip through the flexible adsorption component 9, and then the chip is transferred from the chip transfer table 3 to the eutectic table 6 by the cooperation of the fifth X-axis slide 84 and the third Z-axis slide 85, and the angle of the chip can be adjusted by the fifth Z-axis turntable 86 during the transportation process according to the image information obtained by the third camera 81 and the fourth camera 82, so as to correct the chip again according to the actual situation of the substrate and the chip before eutectic.
[0042] like Figures 1 to 6 As shown, preferably, the flexible adsorption component 9 includes a first cross bar 91 connected to the Z-axis turntable, a first vertical bar 92 extending downward is fixed at the end of the first cross bar 91, a second cross bar 93 extending in the direction of the rotation axis of the corresponding Z-axis turntable is hingedly connected to the first vertical bar 92, a suction nozzle 94 extending downward is fixed to the second cross bar 93, and the suction nozzle 94 is used for adsorbing chips / substrates for easy transportation, and a buffer spring 95 is connected between the first cross bar 91 and the second cross bar 93.
[0043] As described above, the flexible adsorption component 9 of the present case includes a first crossbar 91 connected to the corresponding Z-axis turntable, and the first crossbar 91 is hinged with a second crossbar 93 through a first vertical bar 92, a suction nozzle 94 is fixed on the second crossbar 93, and the suction nozzle 94 coincides with the axis of the rotation axis of the corresponding Z-axis turntable, so that when the Z-axis turntable rotates, the suction nozzle 94 can rotate synchronously to adjust the angle of the substrate / chip adsorbed by the suction nozzle 94 to achieve deviation correction. In addition, since a buffer spring 95 is connected between the first crossbar 91 and the second crossbar 93, when the suction nozzle 94 contacts the substrate / chip, the buffer spring 95 can change the distance between the first crossbar 91 and the second crossbar 93 to achieve buffering, thereby avoiding damage to the substrate / chip caused by the hard contact between the suction nozzle 94 and the substrate / chip, and at the same time, it can also reduce the position displacement of the substrate / chip caused by contact with the suction nozzle 94.
[0044] like Figure 1 As shown, preferably, the base 1 is provided with an ion blower 10 facing the hollow wafer fixture 2 area, so that the static electricity near the wafer can be effectively removed by the ion blower 10, reducing the probability of chip damage due to static electricity and improving the yield rate.
[0045] like Figure 1 , Figure 2 , Figure 4 As shown, preferably, the substrate fixture 5 is also provided with a plurality of finished product storage positions 56 for placing finished eutectic substrates.
[0046] As described above, the substrate fixture 5 is also provided with a finished product storage position 56 for placing finished substrates that have completed eutecticization. In addition to being able to transfer the substrates of the first generation of eutecticization on the substrate fixture 5 to the eutectic table 6, the first multi-dimensional adaptive correction and transfer device 4 can also transfer the finished substrates that have completed eutecticization on the eutectic table 6 back to the finished product storage position 56 of the substrate fixture 5 to wait for being taken out, thereby improving the circulation efficiency of the substrates in the eutectic bonding machine in this case.
[0047] like Figure 1 , Figure 2 , Figure 4 As shown, preferably, the second Z-axis slide 74, the fourth Z-axis turntable 75 and the flexible adsorption component 9 connected to the fourth Z-axis turntable 75 together form a first flexible deflection correction and transfer component, and two groups of first flexible deflection correction and transfer components are arranged side by side on the sixth Y-axis slide 73. In this way, by arranging two groups of first flexible deflection correction and transfer components on the sixth Y-axis slide 73, the two substrates can be transferred synchronously during the second multi-dimensional adaptive deflection correction and transfer device 7 going back and forth between the substrate fixture 5 and the eutectic table 6 once, without the need to complete the transfer of one substrate first and then return completely empty before transferring the other substrate, thereby greatly improving the circulation efficiency.
[0048] like Figure 1 , Figure 2 , Figure 5 As shown, preferably, the fifth X-axis slide 84, the third Z-axis slide 85, the fifth Z-axis turntable 86 and the flexible adsorption component 9 connected to the fifth Z-axis turntable 86 together constitute a second flexible deflection correction and transfer component, and two groups of second flexible deflection correction and transfer components are connected to the X-axis slide rail 83. In this way, by arranging two groups of second flexible deflection correction and transfer components on the X-axis slide rail 83, the second flexible deflection correction and transfer components can correspond one by one with the left and right eutectic tables 6 to transfer chips, thereby greatly improving the chip transfer efficiency.
[0049] As mentioned above, this case protects a multi-station eutectic bonding machine, and all technical solutions that are the same or similar to this case should be deemed to fall within the scope of protection of this case.
Claims
1. A multi-station eutectic bonding machine, characterized in that The invention comprises a base (1), wherein a hollow wafer fixture (2) capable of translating along an X-axis and a Y-axis is provided on the central front side of the base (1), wherein the hollow wafer fixture (2) is used to place a wafer with a chip, and a chip transfer table (3) capable of translating along an X-axis and a Y-axis and rotating around a Z-axis for placing a chip to be eutectic is provided on the base (1) at the rear side of the hollow wafer fixture (2), wherein the chip transfer table (3) for placing the chip to be eutectic is provided, and a first multi-dimensional adaptive deviation correction and transfer device (4) for transferring the chip between the hollow wafer fixture (2) and the chip transfer table (3) is provided on the base (1), and the bases (1) on the left and right sides of the hollow wafer fixture (2) are respectively provided with a substrate transfer device (4) for placing a substrate A substrate fixture (5) is provided, wherein the substrate fixture (5) can also translate along the X-axis and the Y-axis. A eutectic table (6) for carrying the substrate and the chip for eutectic formation is provided on the base (1) at the rear side of each substrate fixture (5). The eutectic table (6) can translate along the X-axis and the Y-axis and rotate around the Z-axis. A second multi-dimensional adaptive deviation correction and transportation device (7) for transferring the substrate between the substrate fixture (5) and the eutectic table (6) on the corresponding side is provided on both sides of the base (1). A third multi-dimensional adaptive deviation correction and transportation device (8) for transferring the chip between the chip transfer table (3) and the two eutectic tables (6) is also provided on the base (1).
2. A multi-station eutectic bonding machine according to claim 1, characterized in that The base (1) is provided with a first Y-axis slide (21), the first Y-axis slide (21) is drivingly connected to a first X-axis slide (22), and the hollow wafer fixture (2) is detachably connected to the first X-axis slide (22) and driven to translate by the first X-axis slide (22); A second X-axis slide (51) is provided on the base (1) below each substrate fixture (5), and each second X-axis slide (51) is drivingly connected to a second Y-axis slide (52). The substrate fixture (5) is detachably connected to the corresponding second Y-axis slide (52) below and is driven to translate by the second Y-axis slide (52).
3. A multi-station eutectic bonding machine according to claim 1, characterized in that The base (1) is provided with a third X-axis slide (31), the third X-axis slide (31) is drivingly connected to a third Y-axis slide (32), the third Y-axis slide (32) is drivingly connected to a first Z-axis turntable (33), and the chip transfer table (3) is detachably connected to the first Z-axis turntable (33) and driven to rotate by the first Z-axis turntable (33); A fourth Y-axis slide (61) is provided on the base (1) below each eutectic table (6), each fourth Y-axis slide (61) is drivingly connected to a fourth X-axis slide (62), each fourth X-axis slide (62) is drivingly connected to a second Z-axis turntable (63), and the eutectic table (6) is detachably connected to the corresponding second Z-axis turntable (63) below and driven to rotate by the second Z-axis turntable (63).
4. A multi-station eutectic bonding machine according to claim 1, characterized in that The first multi-dimensional adaptive deviation correction and transfer device (4) comprises a first camera (41) fixed on the base (1) and facing the area where the hollow wafer fixture (2) is located; the base (1) is provided with a fifth Y-axis slide (42); the fifth Y-axis slide (42) is drivably connected to a first Z-axis slide (43); the first Z-axis slide (43) is drivably connected to a third Z-axis turntable (44); the third Z-axis turntable (44) is drivably connected to a flexible adsorption component (9); the flexible adsorption component (9) is used to adsorb chips to facilitate the transfer of chips; the base (1) is also provided with a chip ejector (45) located below the hollow wafer fixture (2); the chip ejector (45) is used to eject the chip on the hollow wafer fixture (2) upwards to facilitate the flexible adsorption component (9) to adsorb the chip.
5. The multi-station eutectic bonding machine according to claim 1, characterized in that The second multi-dimensional adaptive deviation correction and transfer device (7) comprises a second camera (71) and a first light source (72) fixed on the base (1) and facing the area where the corresponding side substrate fixture (5) is located; the base (1) is provided with a sixth Y-axis slide (73); the sixth Y-axis slide (73) is drivably connected to a second Z-axis slide (74); the second Z-axis slide (74) is drivably connected to a fourth Z-axis turntable (75); the fourth Z-axis turntable (75) is also connected to a flexible adsorption component (9); the flexible adsorption component (9) is used to adsorb the substrate to facilitate the transfer of the substrate.
6. The multi-station eutectic bonding machine according to claim 1, characterized in that The third multi-dimensional self-adaptive deviation correction and transfer device (8) comprises a third camera (81) and a fourth camera (82) fixed on the base (1), wherein the third camera (81) faces the area where the chip transfer table (3) is located, and the fourth camera (82) has two areas respectively facing a eutectic table (6). The base (1) is provided with an X-axis slide rail (83) located at the rear side of the chip transfer table (3) and the eutectic table (6), the X-axis slide rail (83) is connected to a fifth X-axis slide table (84), the fifth X-axis slide table (84) is driven to be connected to a third Z-axis slide table (85), the third Z-axis slide table (85) is driven to be connected to a fifth Z-axis turntable (86), and the fifth Z-axis turntable (86) is also driven to be connected to a flexible adsorption component (9), and the flexible adsorption component (9) is used to adsorb the chip to facilitate the transfer of the chip.
7. A multi-station eutectic bonding machine according to any one of claims 4 to 6, characterized in that The flexible adsorption component (9) comprises a first cross bar (91) connected to the Z-axis turntable, a first vertical bar (92) extending downward is fixed at the end of the first cross bar (91), a second cross bar (93) extending in the direction of the rotation axis of the corresponding Z-axis turntable is hingedly connected to the first vertical bar (92), a suction nozzle (94) extending downward is fixed to the second cross bar (93), and the suction nozzle (94) is used to adsorb chips / substrates for easy transportation, and a buffer spring (95) is connected between the first cross bar (91) and the second cross bar (93).
8. The multi-station eutectic bonding machine according to claim 1, characterized in that The base (1) is provided with an ion blower (10) facing the hollow wafer fixture (2) area.
9. The multi-station eutectic bonding machine according to claim 1, characterized in that The substrate fixture (5) is also provided with a plurality of finished product storage positions (56) for placing finished eutectic substrates.