Transplanting machine for circuit board exposure

Abstract

The invention relates to the technical field of circuit board exposure, in particular to a transplanting machine for circuit board exposure, which comprises a rack, a feeding platform is arranged on one side of the rack, a discharging platform is arranged on the other side of the rack, and a horizontal sliding rail is arranged above the feeding platform and the discharging platform in a crossing manner; the horizontal sliding rail is slidably connected with a first lifting suction lifting assembly and a second lifting suction lifting assembly, the first lifting suction lifting assembly and the second lifting suction lifting assembly are both connected with a driving assembly, the first lifting suction lifting assembly is used for sucking the circuit board on the discharging platform, and the second lifting suction lifting assembly is used for sucking the exposed circuit board; the first lifting suction assembly comprises a suction platform, at least one vibration assembly is arranged on the suction platform in the first lifting suction assembly, and the vibration assembly is used for vibrating the circuit board sucked by the suction platform. The circuit board feeding device has the effect that it is guaranteed that the number of circuit boards fed each time is single.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board exposure, and in particular to a transplanter used for circuit board exposure. Background Art

[0002] Circuit board exposure is an important step in the production of circuit boards. During the production of circuit boards, the pre-designed circuit pattern is printed on a transparent light-transmitting film, and the light-transmitting film is stacked together with a photosensitive film. Through a special exposure device, light passes through the light-transmitting film and the film, so that the light falls on the circuit board to be exposed. Alternatively, laser direct imaging technology is used. Laser direct imaging technology uses laser scanning to directly image the image on the circuit board, and the image is more detailed. During the exposure of the circuit board by the exposure device, the circuit board needs to be placed in the exposure position of the exposure device through a transplanter.

[0003] The related technology discloses a transplanter, including a frame and a first conveying device arranged on the frame, a linear module, a first lifting and suction lifting assembly, a second lifting and suction lifting assembly and a second conveying device that are transmission-connected to the linear module, the linear module drives the first lifting and suction lifting assembly and the second lifting and suction lifting assembly to move in the horizontal direction, the first lifting and suction lifting assembly and the second lifting and suction lifting assembly both include a lifting device that performs lifting movement in the vertical direction, a flat porous suction cup that is transmission-connected to the lifting device, the first lifting and suction lifting assembly is used to move the circuit board to the exposure position through the first conveying device, and the second lifting and suction lifting assembly is used to move the circuit board from the exposure position through the second conveying device.

[0004] However, since there are usually multiple circuit boards stacked at the position where the first lifting and suction lifting assembly sucks up the circuit board, when the first lifting and suction lifting assembly sucks up the top circuit board, a circuit board below may be affected by the suction or adhesion force and move along, so that the number of circuit boards taken at one time is greater than one. Summary of the invention

[0005] In order to ensure that the number of circuit boards loaded each time is single, the present application provides a transplanting machine for circuit board exposure.

[0006] The present application provides a transplanting machine for circuit board exposure, which adopts the following technical solution: A transplanter for circuit board exposure comprises a frame, a material discharge platform is provided on one side of the frame, a material discharge platform is provided on the other side, a horizontal slide rail is provided above the material discharge platform and the material discharge platform, a first lifting and suction lifting assembly and a second lifting and suction lifting assembly are slidably connected to the horizontal slide rail, and the first lifting and suction lifting assembly and the second lifting and suction lifting assembly are both connected to a driving assembly, the first lifting and suction lifting assembly is used to absorb the circuit board on the material discharge platform, the second lifting and suction lifting assembly is used to absorb the circuit board after exposure, the first lifting and suction lifting assembly comprises a suction platform, and at least one vibration assembly is provided on the suction platform of the first lifting and suction lifting assembly, and the vibration assembly is used to vibrate the circuit board absorbed by the suction platform.

[0007] By adopting the above technical solution, when in use, the discharge platform arranged on the frame can place multiple circuit boards. When the first lifting and suction lifting component moves to the discharge platform, the top circuit board is sucked, and then the adhered circuit boards can fall off through the vibration of the vibration component, thereby ensuring that the circuit boards are individually located on the first lifting and suction lifting component, and then moved to the exposure position for exposure, and then the exposed circuit boards are sucked by the second lifting and suction lifting component and moved to the discharge platform, thereby improving the accuracy of exposure by making the number of materials loaded each time single, and at the same time reducing the possibility of falling off during movement, thereby improving safety.

[0008] Preferably, a correction assembly is provided on one side of the discharge platform, and the correction assembly includes a horizontal plate, a first pushing frame and a second pushing frame, the first pushing frame and the second pushing frame are respectively located on two mutually perpendicular side edges of the horizontal plate and are both connected to a driving member, and the first pushing frame and the second pushing frame are moved toward the direction of the horizontal plate through the driving member.

[0009] By adopting the above technical solution, a circuit board is placed on the upper surface of the horizontal plate. When the circuit board is deflected, the first pushing frame and the second pushing frame approach the circuit board, so that the circuit board can be straightened under the action of the first pushing frame and the second pushing frame, ensuring that the circuit board can be accurately moved to the exposure position.

[0010] Preferably, a plurality of ventilation holes are provided on the horizontal plate, and the ventilation holes are connected to a suction device, and the ventilation holes are used to adsorb the circuit board on the horizontal plate.

[0011] By adopting the above technical solution, after the ventilation holes on the horizontal plate adsorb the circuit board, the resistance between the horizontal plate and the circuit board increases, and when the first pushing frame and the second pushing frame move the circuit board, the excessive movement position caused by the inertia of the circuit board is reduced.

[0012] Preferably, a thickness detection sensor is arranged above the correction component, and the thickness detection sensor is connected to a movable part, and the movable part is used to move the thickness detection sensor to the circuit board adsorbed by the first lifting and suction lifting component. When the thickness detection sensor detects abnormal thickness, the first lifting and suction lifting component moves the circuit board to the discharge platform.

[0013] By adopting the above technical solution, the thickness detection sensor is connected to the moving part. When the moving part drives the thickness detection sensor to detect the thickness of the circuit board, the number of circuit boards sucked by the first lifting and suction assembly can be confirmed in advance to ensure the correct exposure of the circuit board by the exposure equipment.

[0014] Preferably, the first lifting and suction lifting assembly also includes a linear module, which is vertically arranged, and a slide is fixedly connected to the upper end of the linear module. The slide is slidably connected to the horizontal slide rail, and the suction platform is fixed to the moving part of the linear module. The driving assembly includes a driving motor, a driving wheel and a driving belt. The driving motor is fixed to the horizontal slide rail, and one driving wheel is provided at each end of the horizontal slide rail. The driving belt is drivingly connected to the two driving wheels, and the slide is fixed to the driving belt. The driving motor is used to drive the driving wheel to rotate.

[0015] By adopting the above technical solution, the linear module is used to drive the suction platform to rise and fall, the upper end of the linear module is connected to the slide, and the slide is slidably connected to the horizontal slide rail, and the slide is fixed on the driving belt, so that the driving belt can move the slide along the horizontal slide rail under the drive of the driving motor, thereby moving the circuit board adsorbed by the suction platform between the discharging platform and the discharging platform.

[0016] Preferably, the suction platform includes a crossbeam and a longitudinal beam, the crossbeam is fixed to the moving part of the linear module, at least two longitudinal beams are arranged along the length direction of the crossbeam, and a plurality of suction nozzles are connected to the longitudinal beam along the length direction of the longitudinal beam.

[0017] By adopting the above technical solution, the crossbeam is fixed to the moving part of the linear module, the longitudinal beam is fixed to the crossbeam, and a plurality of suction nozzles are arranged on the longitudinal beam, so that the circuit board can be accurately adsorbed by the plurality of suction nozzles on the plurality of longitudinal beams.

[0018] Preferably, the suction nozzle includes a fixing frame, an intermediate rod, a spring and a rubber head, the fixing frame is fixed on the longitudinal beam, the intermediate rod is vertically slidably connected to the fixing frame, the rubber head is fixed to the lower end of the intermediate rod, the spring is sleeved on the intermediate rod, and one end of the spring is fixedly connected to the fixing frame, and the other end is fixedly connected to the intermediate rod.

[0019] By adopting the above technical solution, the middle rod is slidably connected to the fixing frame, one end of the spring is fixed to the fixing frame, and the other end is fixed to the middle rod, so that when the rubber head on the middle rod is connected to the circuit board, the spring contracts to adapt to the vibration of the circuit board, making it easy to remove the excess adsorbed circuit board.

[0020] Preferably, the vibration assembly includes a cylinder and a suction head, the cylinder is fixed on the longitudinal beam, the suction head is fixed on the output end of the cylinder, the cylinder is vertically arranged, and the cylinder is arranged on the longitudinal beam at the end of the cross beam.

[0021] By adopting the above technical solution, the suction head is fixed at the output end of the cylinder, and the expansion and contraction of the cylinder causes the fixed suction head to drive the circuit board to vibrate up and down, so that the excess circuit board adsorbed on the circuit board can fall off.

[0022] Preferably, the placement position of the circuit board sucked by the first lifting and suction lifting assembly after being moved to the discharge platform is offset from the placement position of the circuit board sucked by the second lifting and suction lifting assembly after being moved to the discharge platform.

[0023] By adopting the above technical solution, the circuit boards moved to the unloading platform by the first lifting and suction lifting assembly have not been exposed, and the circuit boards that have been exposed are placed on the unloading platform, which reduces the space on the unloading platform and also enables the staff to distinguish them in time. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application; Figure 2 It is a schematic diagram of the structure inside the rack in an embodiment of the present application; Figure 3 is a schematic diagram of the arrangement position of the horizontal slide rail in an embodiment of the present application; Figure 4 It is a structural schematic diagram of the first lifting suction and lifting assembly in an embodiment of the present application; Figure 5 yes Figure 4 A partial enlarged schematic diagram of part A; Figure 6 is a schematic diagram of the structure of the correction component in the embodiment of the present application; Figure 7 yes Figure 3 A partial enlarged schematic diagram of part B.

[0025] Explanation of the accompanying drawings: 1. Frame; 11. Feed inlet; 12. Discharge outlet; 13. Discharge platform; 14. Discharge platform; 2. Exposure equipment; 3. Circuit board; 4. First lifting and suction lifting assembly; 41. Linear module; 42. Suction platform; 421. Crossbeam; 422. Longitudinal beam; 423. Suction nozzle; 4231. Fixed frame; 4232. Middle rod; 4233. Spring; 4234. Rubber head; 43. Slide; 5. Second lifting and suction lifting assembly; 6. Horizontal slide rail; 7. Drive assembly; 71. Drive motor; 72. Drive wheel; 73. Drive belt; 8. Vibration assembly; 81. Cylinder; 82. Suction head; 9. Correction assembly; 91. Horizontal plate; 92. First push frame; 93. Second push frame; 94. Drive member; 95. Vent; 10. Thickness detection sensor; 101. Moving member. DETAILED DESCRIPTION

[0026] The following is combined with Figure 1-7 This application is described in further detail.

[0027] The present application embodiment discloses a transplanter for circuit board exposure, referring to Figure 1 and Figure 2 , including a frame 1, the interior of the frame 1 is a hollow structure, and the rear of the frame 1 is used to place an exposure device 2, the exposure position of the exposure device 2 is inserted into the interior of the frame 1 and arranged horizontally, one side of the frame 1 is a feed port 11, and the other side is a discharge port 12, and the feed port 11 and the discharge port 12 are both provided with door bodies, so that the feed port 11 and the discharge port 12 of the frame 1 can be closed during exposure to prevent the exposure light from irradiating the outside of the frame 1. A discharge platform 13 is provided on one side of the feed port 11 on the frame 1, and a discharge platform 14 is provided on one side of the discharge port 12 on the frame 1, the position of the discharge platform 13 is used to place multiple circuit boards 3 at a time, and the discharge platform 14 is used to store the exposed circuit boards 3.

[0028] refer to Figure 2 and Figure 3 A first lifting and sucking assembly 4 is arranged above the material discharging platform 13, a second lifting and sucking assembly 5 is arranged above the material discharging platform 14, and a horizontal slide rail 6 is arranged above the frame 1. The horizontal slide rail 6 is arranged horizontally and extends from the top of the material discharging platform 14 to the top of the material discharging platform 13, so that the first lifting and sucking assembly 4 and the second lifting and sucking assembly 5 are both slidably connected to the horizontal slide rail 6. When in use, the first lifting and sucking assembly 4 sucks the circuit board 3 on the material discharging platform 13 and moves along the horizontal slide rail 6 to reach the exposure position. Two exposure positions are arranged in sequence in a direction parallel to the horizontal slide rail 6, so that the two exposure positions can complete the exposure of the circuit board 3 faster, thereby improving the utilization rate of the first lifting and sucking assembly 4 and the second lifting and sucking assembly 5.

[0029] refer to Figure 4 A driving assembly 7 is installed on the horizontal slide rail 6. Two driving assemblies 7 are provided. One driving assembly 7 is used to drive the first lifting and suction lifting assembly 4 to move along the horizontal slide rail 6, and the other driving assembly 7 is used to drive the second lifting and suction lifting assembly 5 to move along the horizontal slide rail 6. The driving assembly 7 includes a driving motor 71, a driving wheel 72 and a driving belt 73. The driving motor 71 is fixedly connected to the slide rail. A driving wheel 72 is rotatably arranged at each end of the horizontal slide rail 6. The driving belt 73 is transmission-connected to the two driving wheels 72. The first lifting and suction lifting assembly 4 and the second lifting and suction lifting assembly 5 are respectively fixed on the two driving belts 73. When the driving motor 71 drives the driving wheel 72 to rotate, the driving belt 73 can drive the first lifting and suction lifting assembly 4 and the second lifting and suction lifting assembly 5 to move along the horizontal slide rail 6, so that the circuit board 3 can be moved along the horizontal slide rail 6.

[0030] The first lifting and suction lifting assembly 4 includes a linear module 41 and a suction platform 42. A slide 43 is provided at the upper end of the linear module 41. The linear module 41 is vertically fixed on the slide 43. The slide 43 is slidably connected to the horizontal slide rail 6, and the slide 43 is fixed on the driving belt 73. The suction platform 42 is fixed to the moving part of the linear module 41, and the suction platform 42 is lifted up and down by the linear module 41. The second lifting and suction lifting assembly 5 includes a linear module 41 and a suction platform 42. The upper end of the linear module 41 in the second lifting and suction lifting assembly 5 is also connected to a slide 43. The slide 43 in the second lifting and suction lifting assembly 5 and the slide 43 in the first lifting and suction lifting assembly 4 are respectively connected to two driving belts 73 in a one-to-one correspondence.

[0031] The suction platform 42 includes a crossbeam 421 and a longitudinal beam 422 arranged on the crossbeam 421. The longitudinal beam 422 is arranged perpendicular to the crossbeam 421, and at least two longitudinal beams 422 are arranged along the length direction of the crossbeam 421, and three or four longitudinal beams 422 can be arranged at intervals. The crossbeam 421 is fixed to the moving part of the linear module 41, and a plurality of suction nozzles 423 are installed on the longitudinal beam 422. The suction nozzle 423 is connected to an exhaust device, so that after the suction nozzle 423 contacts the surface of the circuit board 3, the circuit board 3 is sucked by the exhaust device, and a plurality of suction nozzles 423 are arranged at intervals along the length direction of the longitudinal beam 422. A vibration component 8 is also arranged on the suction platform 42 of the first lifting suction and hanging component 4. The vibration component 8 is used to vibrate after the suction platform 42 lifts the circuit board 3. When two or more circuit boards 3 are connected due to suction or bonding, the circuit board 3 below is separated by the vibration component 8, so that only one circuit board 3 is moved to the exposure position each time.

[0032] refer to Figure 5The suction nozzle 423 includes a fixing frame 4231, an intermediate rod 4232, a spring 4233 and a rubber head 4234, the rubber head 4234 is used to contact with the circuit board 3 and form a sealed space, the fixing frame 4231 is fixed on the longitudinal beam 422, the intermediate rod 4232 is vertically arranged and the upper part of the intermediate rod 4232 is slidably connected to the fixing frame 4231, and the rubber head 4234 at the lower end is fixedly connected, the intermediate rod 4232 is a hollow structure, and the upper end of the intermediate rod 4232 is used to connect the exhaust device, the spring 4233 is sleeved on the intermediate rod 4232, and the upper end of the spring 4233 is fixedly connected to the fixing frame 4231, and the lower end of the spring 4233 is fixedly connected to the intermediate rod 4232, so that the spring 4233 can be connected between the intermediate rod 4232 and the fixing frame 4231 to adapt to the up and down movement of the rubber head 4234. The vibration assembly 8 includes a cylinder 81 and a suction head 82. The cylinder 81 is fixed on the longitudinal beam 422. The cylinder 81 is vertically arranged. The suction head 82 is fixed on the output end of the cylinder 81. The cylinder 81 can be extended and retracted after being connected to the air source. When the suction head 82 is sucked on or abutted against the circuit board 3, the circuit board 3 can vibrate up and down through the extension and retraction of the cylinder 81. The vibration assembly 8 is arranged on the longitudinal beam 422 near the end of the cross beam 421. When the vibration assembly 8 vibrates the circuit board 3, one side of the circuit board 3 can vibrate more, making it easier to detach the adhered circuit board 3.

[0033] refer to Figure 6 A correction component 9 is provided on the side of the discharge platform 13 close to the exposure position. The circuit board 3 that falls due to adhesion during the absorption process usually cannot be accurately positioned and may deviate from the position. If it is directly placed at the exposure position, the exposed circuit may exceed the edge of the circuit board 3 due to excessive deviation. The correction component 9 is used to position the circuit board 3 so that the position of the first lifting suction component 4 is relatively accurate each time after being absorbed from the correction component 9. The correction component 9 includes a horizontal plate 91, a first push frame 92 and a second push frame 93. The first push frame 92 and the second push frame 93 are respectively located on two mutually perpendicular sides of the horizontal plate 91. A driving member 94 is connected to the first push frame 92 and the second push frame 93. The driving member 94 can be selected as an electric cylinder, a pneumatic cylinder or a hydraulic cylinder. The driving member 94 drives the first push frame 92 and the second push frame 93 to move in a direction perpendicular to the side of the corresponding horizontal plate 91. When the first push frame 92 and the second push frame 93 are at the end of the movement, the first push frame 92 and the second push frame 93 are at the end of the movement. The movable frame 92 and the second pushing frame 93 straighten the deflected circuit board 3. A plurality of ventilation holes 95 are provided on the horizontal plate 91 close to the first pushing frame 92 and the second pushing frame 93. The lower part of the ventilation holes 95 is connected to the exhaust device, so that when the circuit board 3 is placed on the horizontal plate 91, the ventilation holes 95 can increase the resistance between the circuit board 3 and the upper surface of the horizontal plate 91. In the process of the first pushing frame 92 and the second pushing frame 93 moving the circuit board 3, the excessive movement of the circuit board 3 due to the inertia force is reduced, thereby ensuring the accuracy of the position of the circuit board 3 after movement.

[0034] refer to Figure 3 and Figure 7 A thickness detection sensor 10 is also arranged above the correction component 9. The thickness detection sensor 10 is connected to a moving part 101. The moving part 101 adopts an electric cylinder, a pneumatic cylinder or a hydraulic cylinder. The moving direction of the moving part 101 is set horizontally, and the thickness detection sensor 10 is installed on the moving part of the moving part 101. The moving part 101 is fixed on the frame 1. When the circuit board 3 that has been corrected by the correction component 9 is sucked again by the first lifting and sucking component 4, and the circuit board 3 is raised to a position at the same height as the thickness detection sensor 10, the moving part 101 moves the thickness detection sensor 10 close to the position of the circuit board 3, and passes through the upper and lower positions. Distance detection is performed to complete the detection of the thickness of the circuit board 3. When the thickness is greater than that of one circuit board 3, the movement of the vibration component 8 cannot separate the extra circuit boards 3, thereby completing the next step of exposure. The circuit boards 3 sucked at this time need to be moved directly to the position of the discharge platform 14 through the first lifting and suction lifting component 4. When the first lifting and suction lifting component 4 places the circuit board 3 on the discharge platform 14, the position of the circuit board 3 placed on the discharge platform 14 by the second lifting and suction lifting component 5 is staggered. When the staff takes out the circuit board 3 from the position of the discharge platform 14, the circuit board 3 placed by the first lifting and suction lifting component 4 can be distinguished in time.

[0035] The working process of this embodiment: First, the staff puts a plurality of stacked circuit boards 3 on the position of the discharge platform 13, and then the first lifting suction lifting component 4 will suck the circuit boards 3 from top to bottom in sequence. After sucking one circuit board 3 and when the height is raised to 2-5cm of the next circuit board 3, the sucked circuit board 3 is vibrated by the vibration component 8 to make some of the extra sucked circuit boards 3 fall off, and then the circuit board 3 is placed at the position of the correction component 9 to correct the position of the circuit board 3, and then sucked by the first lifting suction lifting component 4 and reaches the position of the thickness detection sensor 10, and the thickness detection sensor 10 confirms the sucked quantity again. The number of circuit boards 3 with appropriate thickness is one, which is horizontally moved and placed to the exposure position by the first lifting suction lifting component 4. The number of circuit boards 3 with excessive thickness exceeding one is directly placed on the discharge platform 14 by the first lifting suction lifting component 4, waiting for the staff to take them out for adjustment. After exposure, the circuit board 3 is sucked by the second lifting suction lifting component 5 and placed on the discharge platform 14. The circuit boards 3 placed by the first lifting suction lifting component 4 and the second lifting suction lifting component 5 are staggered with each other on the discharge platform 14 for distinction.

[0036] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A transplanter for circuit board exposure, comprising a frame (1), characterized in that: A material discharge platform (13) is provided on one side of the frame (1), and a material discharge platform (14) is provided on the other side. A horizontal slide rail (6) is arranged above the material discharge platform (13) and the material discharge platform (14). A first lifting and suction lifting assembly (4) and a second lifting and suction lifting assembly (5) are slidably connected to the horizontal slide rail (6). Both the first lifting and suction lifting assembly (4) and the second lifting and suction lifting assembly (5) are connected to a driving assembly (7). The first lifting and suction lifting assembly (4) is used to absorb the circuit board (3) on the material discharge platform (13), and the second lifting and suction lifting assembly (5) is used to absorb the circuit board (3) after exposure. The first lifting and suction lifting assembly (4) includes a suction platform (42). At least one vibration assembly (8) is provided on the suction platform (42) of the first lifting and suction lifting assembly (4), and the vibration assembly (8) is used to vibrate the circuit board (3) absorbed by the suction platform (42).

2. A transplanter for circuit board exposure according to claim 1, characterized in that: A correction component (9) is provided on one side of the material discharging platform (13), and the correction component (9) comprises a horizontal plate (91), a first pushing frame (92) and a second pushing frame (93). The first pushing frame (92) and the second pushing frame (93) are respectively located on two mutually perpendicular sides of the horizontal plate (91) and are both connected to a driving member (94). The first pushing frame (92) and the second pushing frame (93) are moved toward the horizontal plate (91) via the driving member (94).

3. A transplanter for circuit board exposure according to claim 2, characterized in that: The horizontal plate (91) is provided with a plurality of ventilation holes (95), the ventilation holes (95) being connected to an air extraction device, and the ventilation holes (95) being used to adsorb the circuit board (3) on the horizontal plate (91).

4. A transplanter for circuit board exposure according to claim 2, characterized in that: A thickness detection sensor (10) is arranged above the correction component (9), and the thickness detection sensor (10) is connected to a moving part (101). The moving part (101) is used to move the thickness detection sensor (10) to the circuit board (3) adsorbed by the first lifting and suction lifting component (4). When the thickness detection sensor (10) detects that the thickness is abnormal, the first lifting and suction lifting component (4) moves the circuit board (3) to the discharge platform (14).

5. The transplanter for circuit board exposure according to claim 1, characterized in that: The first lifting and suction lifting assembly (4) further comprises a linear module (41), the linear module (41) being arranged vertically, the upper end of the linear module (41) being fixedly connected with a slide (43), the slide (43) being slidably connected to a horizontal slide rail (6), the suction platform (42) being fixed to a moving part of the linear module (41), the driving assembly (7) comprising a driving motor (71), a driving wheel (72) and a driving belt (73), the driving motor (71) being fixed to the horizontal slide rail (6), one driving wheel (72) being arranged at each end of the horizontal slide rail (6), the driving belt (73) being drivingly connected to the two driving wheels (72), the slide (43) being fixed to the driving belt (73), and the driving motor (71) being used to drive the driving wheel (72) to rotate.

6. A transplanter for circuit board exposure according to claim 5, characterized in that: The suction platform (42) comprises a crossbeam (421) and a longitudinal beam (422); the crossbeam (421) is fixed to a moving part of the linear module (41); at least two longitudinal beams (422) are arranged along the length direction of the crossbeam (421); and a plurality of suction nozzles (423) are connected to the longitudinal beam (422) along the length direction of the longitudinal beam (422).

7. A transplanter for circuit board exposure according to claim 6, characterized in that: The suction nozzle (423) comprises a fixing frame (4231), an intermediate rod (4232), a spring (4233) and a rubber head (4234); the fixing frame (4231) is fixed on the longitudinal beam (422); the intermediate rod (4232) is vertically slidably connected to the fixing frame (4231); the rubber head (4234) is fixed to the lower end of the intermediate rod (4232); the spring (4233) is sleeved on the intermediate rod (4232); one end of the spring (4233) is fixedly connected to the fixing frame (4231) and the other end is fixedly connected to the intermediate rod (4232).

8. The transplanting machine for circuit board exposure according to claim 7, characterized in that: The vibration component (8) comprises a cylinder (81) and a suction head (82); the cylinder (81) is fixed on a longitudinal beam (422); the suction head (82) is fixed on an output end of the cylinder (81); the cylinder (81) is arranged vertically; the cylinder (81) is arranged on the longitudinal beam (422) at the end of a cross beam (421).

9. The transplanter for circuit board exposure according to claim 4, characterized in that: The placement position of the circuit board (3) sucked by the first lifting suction lifting assembly (4) after being moved to the discharge platform (14) is offset from the placement position of the circuit board (3) sucked by the second lifting suction lifting assembly (5) after being moved to the discharge platform (14).

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