Double-row conductive double-foam surface glue wrapping production process

Abstract

The invention discloses a double-row conductive double-foam surface adhesive wrapping production process, and relates to the technical field of foam processing, and the process comprises the following steps: compounding a release film and conductive cloth, cutting wastes, sequentially compounding PI adhesive, copper foil and hot-melting conductive adhesive, compounding conductive foam and double-faced adhesive tape, and integrally compounding on the copper foil, thereby obtaining the double-row conductive double-foam surface adhesive. And the copper foil and the hot melting conductive adhesive are bonded and fixed through bending of a jig, and finally the coiled material product is obtained through slitting. By accurately controlling the product speed, conversion from a sheet to a coiled material is achieved, a heating jig is introduced for shaping, the manual semi-finished product wrapping process is optimized, defective products are remarkably reduced, and the production cost is effectively reduced. Meanwhile, according to the process, the yield of one-time forming wrapping is improved, stable improvement of product quality and production efficiency is ensured, and an efficient and reliable solution is provided for the fields of electronic product packaging, fixing, protection and the like. The whole production process has the advantages of high automation degree, high material utilization rate, high adaptability and the like.

Description

Technical Field

[0001] The invention relates to the technical field of foam processing, and in particular to a double-row conductive double-foam surface adhesive wrapping production process. Background Art

[0002] With the rapid development of modern electronic technology, all kinds of electronic devices are developing towards being thinner, more multifunctional and high-performance. The internal structures of these devices are becoming increasingly complex, which puts higher requirements on the integration of components and space utilization. As an indispensable component of electronic devices, die-cutting products are produced through precision processes such as die-cutting, laminating, and waste discharge, and are widely used to meet various functional requirements such as pasting, fixing, shielding, insulation, buffering, heat dissipation and dust prevention in narrow spaces.

[0003] In the traditional die-cutting product production process, a typical conventional scheme includes the following steps: first, use a specific A knife to die-cut the blue film handle to provide positioning and support for subsequent operations; then, use the A knife to die-cut the conductive cloth again, retain the middle conductive part, remove the internal and external waste, and add facial paper to facilitate subsequent waste discharge; then, laminate the copper foil on the conductive cloth with the sticky side facing up, and use the B knife to die-cut to remove the inner frame and facial paper waste; next, fit the black Mylar to the sticky side of the copper foil, use the C knife to die-cut the hot melt adhesive, remove the inner frame and facial paper waste, and laminate them on both sides of the black Mylar; then, laminate the double-sided tape with the foam, use the D die-cut and transfer it to the middle position of the Mylar; the main part is die-cut with the E knife to remove the outer frame waste; finally, laminate the blue film and use the F knife to cut the edge waste, and complete the entire production process through the galanger rewinding.

[0004] However, this traditional solution has significant shortcomings. First, since multiple parts need to be heated separately during the production process, it not only increases energy consumption, but also may cause changes in material properties, thereby affecting the quality and yield of the final product. In addition, the separate heating step may also extend the production cycle and reduce the overall production efficiency. At the same time, multiple die-cutting, laminating and waste discharge operations increase material loss and increase production costs.

[0005] Therefore, in view of the problems existing in the existing technology, it is necessary to develop a new die-cutting product production process, aiming to reduce the number of heating times, improve production efficiency, reduce material loss, and ensure product quality and yield. This can not only meet the increasingly stringent requirements of current electronic equipment for die-cutting products, but also provide strong support for the sustainable development of the electronics manufacturing industry. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention provides a double-row conductive double-foam surface adhesive wrapping production process, which solves the problems raised by the above-mentioned background technology.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: A double-row conductive double-foam surface adhesive wrapping production process comprises the following steps: S1. Compound the release film and the conductive cloth, and use the A-knife die-cutting process to remove the inner frame waste; S2, compounding PI glue on the adhesive surface of the conductive fabric; S3, compound the rough surface of the copper foil on the adhesive surface of the PI adhesive, and use the B knife die-cutting process to cut the copper foil and remove the inner frame and the surface paper; S4. Use C-knife die-cutting technology to cut the hot-melt conductive adhesive, remove the inner frame, and laminate the cut hot-melt conductive adhesive on the bottom surface of the copper foil; S5, compound the conductive foam and double-sided tape, and use D-knife die-cutting technology to remove the surface paper and outer frame waste; S6, compounding the composite of the conductive foam and the double-sided tape on the top surface of the copper foil again; S7, after being bent by a jig, the copper foil, PI glue, conductive cloth, and release film are bent around the upper part of the conductive foam for one circle, and the copper foil is bonded and fixed with the hot-melt conductive glue; S8. Use E-knife die-cutting process to cut the whole into pieces to obtain coil products.

[0008] Furthermore, the double-row conductive double foam includes a release film, a conductive cloth, a conductive foam, a double-sided adhesive, a hot-melt conductive adhesive, a copper foil, and a PI adhesive. These components are combined and processed through steps S1 to S8 to form a double-row conductive double foam adhesive wrapping material with excellent conductive properties and structural stability.

[0009] Furthermore, in step S1, the composite process of the release film and the conductive cloth is carried out under strictly controlled environmental conditions to ensure the firmness of the composite and the integrity of the materials.

[0010] Furthermore, in step S3, the copper foil lamination and cutting process uses a high-precision mold to ensure the precise position of the copper foil and the flatness of the cutting edge.

[0011] Furthermore, in step S4, the cutting and compounding process of the hot-melt conductive adhesive is precisely controlled by temperature and time to ensure a firm bond between the hot-melt conductive adhesive and the copper foil.

[0012] Furthermore, in step S5, glue or adhesive is used in the composite process of the conductive foam and the double-sided tape to ensure a firm bond and conductive performance between the two.

[0013] Furthermore, in step S7, the bending process of the jig is precisely controlled to ensure that the shape and size of the copper foil, PI glue, conductive cloth and release film after being bent around the upper part of the conductive foam meet the design requirements.

[0014] Furthermore, in step S8, the use of the E-knife die-cutting process ensures accurate slitting of the entire material, thereby obtaining a coil product that meets specification requirements.

[0015] Furthermore, the production process is suitable for manufacturing double-row conductive double-foam adhesive packaging materials with excellent conductive properties and structural stability, and is particularly suitable for the packaging, fixing and protection of electronic products.

[0016] Furthermore, the production process also includes quality inspection and control steps for the final product to ensure that the product's electrical conductivity, structural stability and appearance quality meet the design requirements.

[0017] The present invention provides a double-row conductive double-foam surface adhesive wrapping production process. Compared with the prior art, it has the following beneficial effects: 1. By precisely controlling the product speed, the original sheet material is changed to coil material before entering the heating fixture for shaping, which optimizes the manual semi-finished product packaging, reduces the generation of defects, reduces costs, and improves the yield of one-time molding packaging.

[0018] 2. The double-row conductive double-foam adhesive wrapping production process of the present invention greatly shortens the production cycle and improves production efficiency through a series of automated and precisely controlled steps, such as precise cutting using a die-cutting process, temperature and time control during the composite process, etc.

[0019] 3. High-precision molds and fixtures are used in the production process to ensure the precise position and size of each component. At the same time, through strict control of composite temperature, pressure and other parameters, the conductivity, structural stability and appearance quality of the product are guaranteed.

[0020] 4. In the production process, through precise cutting and compounding process, the generation of inner frame waste, face paper and outer frame waste is effectively reduced, the utilization rate of materials is improved and the production cost is reduced.

[0021] 5. The production process of the present invention is not only suitable for double-row conductive double-foam adhesive wrapping materials of specific specifications, but can also adapt to the production needs of different materials and specifications by adjusting process parameters, thereby enhancing the flexibility and adaptability of the production line.

[0022] 6. The production process uses automated and precisely controlled equipment to reduce manual operations and energy waste. At the same time, by optimizing parameters such as composite temperature and pressure, energy consumption and emissions are reduced, meeting the requirements of environmental protection and energy conservation.

[0023] In summary, the double-row conductive double-foam surface adhesive wrapping production process of the present invention has significant beneficial effects in improving production efficiency, ensuring product quality, improving material utilization, enhancing adaptability and environmental protection and energy saving, and provides reliable technical support for the fields of electronic product packaging, fixation and protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the split structure of the double-row conductive double foam of the present invention; Figure 2 It is a structural schematic diagram of step S1 in the present invention; Figure 3 It is a structural schematic diagram of step S2 in the present invention; Figure 4 It is a structural schematic diagram of step S3 in the present invention; Figure 5 It is a structural schematic diagram of step S4 in the present invention; Figure 6 It is a structural schematic diagram of step S5 in the present invention; Figure 7 It is a structural schematic diagram of step S6 in the present invention; Figure 8 It is a structural schematic diagram of step S7 in the present invention; Fig. 9 It is a schematic diagram of the structure of the copper foil after being bent by a jig in the present invention.

[0025] In the figure: 1. Release film; 2. Conductive cloth; 3. Conductive foam; 4. Double-sided tape; 5. Hot-melt conductive adhesive; 6. Copper foil; 7. PI adhesive. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] See also Figure 2-8 The present invention provides a technical solution: a double-row conductive double-foam surface adhesive wrapping production process, comprising the following steps: S1. Compounding the release film 1 and the conductive cloth 2 (the compounding process of the release film 1 and the conductive cloth 2 is carried out under strictly controlled environmental conditions to ensure the firmness of the compound and the integrity of the materials), and using the A-knife die-cutting process to remove the inner frame waste; S2, compounding the PI glue 7 on the glue surface of the conductive fabric 2; S3, compound the matte surface of the copper foil 6 on the adhesive surface of the PI adhesive 7, and use the B knife die-cutting process to cut the copper foil 6, and remove the inner frame and the surface paper (the compounding and cutting process of the copper foil 6 uses a high-precision mold to ensure the precise position of the copper foil 6 and the flatness of the cutting edge); S4. Use C-knife die-cutting process to cut the hot-melt conductive adhesive 5, remove the inner frame, and compound the cut hot-melt conductive adhesive 5 on the bottom surface of the copper foil 6 (the cutting and compounding process of the hot-melt conductive adhesive 5 is precisely controlled by temperature and time to ensure a firm bond between the hot-melt conductive adhesive 5 and the copper foil 6); S5, compound the conductive foam 3 and the double-sided adhesive 4, and use a D-knife die-cutting process to remove the surface paper and outer frame waste (the compounding process of the conductive foam 3 and the double-sided adhesive 4 uses glue or adhesive to ensure a firm bond and conductive performance between the two); S6, compounding the composite of the conductive foam 3 and the double-sided tape 4 on the top surface of the copper foil 6 again; S7, after the copper foil 6, PI glue 7, conductive cloth 2, and release film 1 are bent around the upper part of the conductive foam 3 for one circle by the jig, the copper foil 6 is bonded and fixed to the hot-melt conductive glue 5 (the bending process of the jig is precisely controlled to ensure that the shape and size of the copper foil 6, PI glue 7, conductive cloth 2, and release film 1 after being bent around the upper part of the conductive foam 3 meet the design requirements); S8. Use E-knife die-cutting technology to cut the whole material into pieces to obtain coil products (the use of E-knife die-cutting technology ensures accurate cutting of the whole material, thereby obtaining coil products that meet the specification requirements); S9. Quality inspection and control steps for the final product to ensure that the product's conductivity, structural stability and appearance quality meet the design requirements.

[0028] See also Figure 1 and 7 The double-row conductive double foam prepared by the above process includes a release film 1, a conductive cloth 2, a conductive foam 3, a double-sided adhesive 4, a hot-melt conductive adhesive 5, a copper foil 6, and a PI adhesive 7, forming a double-row conductive double foam surface adhesive wrapping material with excellent conductive performance and structural stability.

[0029] In addition, this production process is suitable for manufacturing double-row conductive double-foam surface adhesive packaging materials with excellent conductive properties and structural stability, and is particularly suitable for the packaging, fixation and protection of electronic products.

[0030] In summary, the double-row conductive double-foam adhesive wrapping production process achieves the transition from sheet to coil by precisely controlling the product speed, and introduces a heating fixture for shaping, which optimizes the manual semi-finished product wrapping process, significantly reduces the production of defective products, and effectively reduces production costs. At the same time, this process improves the yield of one-time molding wrapping, ensures the stable improvement of product quality and production efficiency, and provides efficient and reliable solutions for the fields of electronic product packaging, fixation and protection. The entire production process has the advantages of high degree of automation, high material utilization, and strong adaptability.

Claims

1. A double-row conductive double-foam surface adhesive wrapping production process, characterized in that: The steps include: S1, compounding the release film (1) and the conductive fabric (2), and using an A-knife die-cutting process to remove the inner frame waste; S2, compounding the PI glue (7) on the glue surface of the conductive fabric (2); S3, laminating the rough surface of the copper foil (6) onto the adhesive surface of the PI adhesive (7), and using a B-knife die-cutting process to cut the copper foil (6) and remove the inner frame and the surface paper; S4, using a C-knife die-cutting process to cut the hot-melt conductive adhesive (5), remove the inner frame, and laminate the cut hot-melt conductive adhesive (5) onto the bottom surface of the copper foil (6); S5, compounding the conductive foam (3) and the double-sided adhesive tape (4), and using a D-knife die-cutting process to remove the surface paper and outer frame waste; S6, compounding the composite of the conductive foam (3) and the double-sided adhesive (4) on the top surface of the copper foil (6); S7, after being bent by a jig, the copper foil (6), PI glue (7), conductive cloth (2), and release film (1) are bent around the upper part of the conductive foam (3) for one circle, and the copper foil (6) is bonded and fixed to the hot-melt conductive glue (5); S8. Use E-knife die-cutting process to cut the whole into pieces to obtain coil products.

2. A double-row conductive double-foam surface adhesive wrapping production process according to claim 1, characterized in that: The double-row conductive double foam comprises a release film (1), a conductive cloth (2), a conductive foam (3), a double-sided adhesive (4), a hot-melt conductive adhesive (5), a copper foil (6), and a PI adhesive (7). These components are combined and processed through steps S1 to S8 to form a double-row conductive double foam surface adhesive wrapping material with excellent conductive properties and structural stability.

3. The double-row conductive double-foam adhesive wrapping production process according to claim 1 is characterized in that: In step S1, the lamination process of the release film (1) and the conductive fabric (2) is carried out under strictly controlled environmental conditions to ensure the firmness of the lamination and the integrity of the materials.

4. The double-row conductive double-foam adhesive wrapping production process according to claim 1 is characterized in that: In step S3, the copper foil (6) is compounded and cut using a high-precision mold to ensure the precise position of the copper foil (6) and the flatness of the cut edge.

5. The double-row conductive double-foam adhesive wrapping production process according to claim 1 is characterized in that: In step S4, the cutting and compounding process of the hot-melt conductive adhesive (5) is precisely controlled by temperature and time to ensure a firm bond between the hot-melt conductive adhesive (5) and the copper foil (6).

6. The double-row conductive double-foam surface adhesive wrapping production process according to claim 1 is characterized in that: In step S5, the conductive foam (3) and the double-sided tape (4) are compounded using glue or adhesive to ensure a firm bond and conductive performance between the two.

7. The double-row conductive double-foam adhesive wrapping production process according to claim 1 is characterized in that: In step S7, the bending process of the jig is precisely controlled to ensure that the shape and size of the copper foil (6), PI glue (7), conductive cloth (2) and release film (1) after being bent around the upper part of the conductive foam (3) meet the design requirements.

8. The double-row conductive double-foam adhesive wrapping production process according to claim 1 is characterized in that: In step S8, the use of the E-knife die-cutting process ensures accurate slitting of the entire material, thereby obtaining a coil product that meets the specification requirements.

9. The double-row conductive double-foam adhesive wrapping production process according to any one of claims 1 to 8, characterized in that: This production process is suitable for manufacturing double-row conductive double-foam surface adhesive packaging materials with excellent conductive properties and structural stability, and is particularly suitable for the packaging, fixation and protection of electronic products.

10. The double-row conductive double-foam adhesive wrapping production process according to any one of claims 1 to 8, characterized in that: The production process also includes quality inspection and control steps for the final product to ensure that the product's conductivity, structural stability and appearance quality meet the design requirements.

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