Elastic protective film for chip

Abstract

The invention relates to an elastic chip protection film which has reliable antistatic function and reliable elastic chip protection function and does not damage a chip when the chip protection film is torn off, the elastic chip protection film is formed by stacking a basic protection film and an antistatic protection film, and the antistatic protection film is of a latticed structure. The packaging method has the advantages that the conductive layer is formed on the surface of the packaged chip, so that the surface resistivity of the chip is reduced, static electricity generated during packaging, transportation and film tearing of the chip is quickly led in and leaked, accumulation of the static electricity on the surface of the chip is avoided, and the internal structure of the chip is prevented from being damaged by the static electricity.

Description

Technical Field

[0001] This invention relates to a chip protective film that has reliable anti-static properties, can reliably protect the circuitry inside the chip from damage during storage, transportation, and assembly, and will not cause electrostatic damage to the chip when the protective film is peeled off. It belongs to the field of chip protective film manufacturing. Background Technology

[0002] CN210706393U, entitled "High-Cleanliness Antistatic Chip Packaging Film," comprises a protective film and an anti-stick antistatic layer. The protective film includes a substrate film and an adhesive layer coated on the substrate film. The anti-stick antistatic layer is adhered to the protective film and contains a plurality of conductive particles. The anti-stick antistatic layer comprises a polymer film, and the conductive particles are dispersed within the polymer film. The polymer film includes a first surface and a second surface. The first surface is adhered to the protective film, wherein the first surface has a plurality of spaced protrusions, and recesses are formed between adjacent protrusions. The second surface of the polymer film is further provided with a support layer made of plastic. The conductive particles are interconnected to form a path. The path is arranged in a chain-like manner. Its shortcomings are as follows: First, although conductive particles are added to the polymer film in the packaging film, these conductive particles cannot guarantee that 100% of the electrical chains can be formed. Therefore, it is impossible to achieve 100% release of the generated static electricity; it can only relatively reduce the generation of static electricity, thus inevitably leading to chip damage. Second, after the anti-stick and anti-static layer is bonded to the protective film, only the raised parts are bonded to the adhesive layer, while the recessed parts are not bonded to the adhesive layer of the protective film. This reduces the bonding area between the anti-stick and anti-static layer and the protective film, achieving easy tearing between the anti-stick and anti-static layer and the protective film, but not easy tearing between the chip surfaces. Third, air bubbles are generated during the bonding process between the anti-stick and anti-static layer and the protective film. These air bubbles can be transferred from the raised parts to the recessed parts and discharged. Although this achieves the effect of reducing air bubbles, it does not play any role in protecting the chip. Summary of the Invention

[0003] Design objective: To overcome the shortcomings of the prior art, and to design a chip protective film that not only has reliable anti-static properties, but also reliably protects the circuitry inside the chip from damage during storage, transportation, and assembly, while not causing electrostatic damage to the chip when the protective film is peeled off.

[0004] Design Scheme: To achieve the above design objectives, the present invention features the following design aspects: 1. The antistatic protective film is designed with a grid-like structure, which is one of the technical features of the present invention. The purpose of this design is that static electricity is generated due to the imbalance of charges on the surface of an object, and common generation methods include contact, friction, and peeling. In the design and production process of chips, electrostatic discharge (ESD) is a problem that cannot be ignored, as it can damage the internal structure of the chip, causing it to malfunction. The present invention designs the film used to protect the chip with a grid-like structure, and through the contact between the grid-like film and the chip surface, a conductive layer is formed on the chip surface, reducing the surface resistivity. This allows the static electricity generated during packaging, transportation, and film removal to be quickly conducted away, preventing the accumulation of static electricity on the chip surface, thereby achieving the purpose of protecting the internal structure of the chip from damage by static electricity. Because by constructing a conductive path on the material surface, charged particles can quickly contact and conduct, thereby suppressing and reducing the generation of static charge. 2. The grid-like antistatic protective film is composed of multiple polymer resin conductive balls arranged in sequential contact, which is the second technical feature of the present invention. The purpose of this design is that when the mesh-like antistatic protective film is composed of polymer resin conductive spheres, the contact (adhesion) between the mesh-like antistatic protective film and the chip forms a multi-point contact. The advantages of multi-point contact are: a small contact area, but with multiple and fast electrostatic shielding and discharge paths; secondly, because the links formed by the contact (tangential adhesion) between multiple polymer resin conductive spheres are interconnected, airflow is good, ensuring airflow and relative temperature stability during chip transportation, thus ensuring chip transportation safety. 3. The design of using nano-sized polymer resin conductive spheres made by uniformly mixing polymer resin powder, nano-scale graphene powder, and nano-scale aluminum powder is the third technical feature of this invention. The purpose of this design is that graphene has excellent conductivity because its stable lattice structure gives carbon atoms excellent conductivity. When electrons move in their orbits in graphene, they are not scattered due to lattice defects or the introduction of foreign atoms, thus the interference encountered during electron movement is very small. Therefore, the polymer resin conductive spheres prepared by uniformly mixing nano-scale graphene powder, nano-scale aluminum powder, and nano-scale polymer resin powder in this invention not only have good conductivity but also good elasticity. When they come into contact with the chip surface, their good elasticity greatly reduces the impact of gravity and external forces on the chip, ensuring the safety of the chip during storage and transportation. 4. The design of the polymer resin conductive sphere surface as an adhesive bonding surface is the fourth technical feature of this invention.The purpose of this design is as follows: Since the surface of the polymer resin conductive ball is an adhesive surface, and the adhesion between this adhesive surface and the chip surface is a tangential (point) adhesion, when the antistatic protective film adhered to the chip surface needs to be peeled off, the antistatic protective film with its tangential point adhesion forms a natural inclined tearing entry point. Therefore, the antistatic protective film can be peeled off the chip surface naturally, smoothly, and effortlessly without generating static electricity, ensuring that the safety and reliability of the chip before assembly remain unchanged. 5. The design of the base protective film as a conductive protective film is the fifth technical feature of this invention. The purpose of this design is as follows: The function of designing the base protective film as a conductive protective film is: firstly, the conductive protective film serves as the support for the grid-like antistatic protective film, ensuring that the reliability of the grid-like antistatic protective film molding remains unchanged; secondly, because the base protective film has good conductivity and forms an electrostatic discharge conductor with the grid-like conductive chains in the grid-like antistatic protective film located on it, the static electricity in the grid-like antistatic protective film can be quickly discharged.

[0005] Compared with the prior art, this invention has two advantages: First, when the antistatic protective film has a grid structure, a conductive layer is formed on the surface of the packaged chip, thereby reducing the surface resistivity of the chip. This allows static electricity generated during packaging, transportation, and film removal to be quickly conducted and leaked, preventing the accumulation of static electricity on the chip surface and ensuring that the internal structure of the chip is not damaged by static electricity. Second, the grid-like antistatic protective film, composed of multiple polymer resin conductive balls arranged in sequential contact, forms a multi-point contact between the grid-like antistatic protective film and the chip. This not only results in a small contact area and rapid static electricity discharge due to multiple exit paths, but also ensures good air circulation and relative temperature stability during chip transportation, as the conductive links formed by the tangential contact between the conductive balls create V-shaped grooves that are interconnected. This ensures good air circulation and relatively stable temperature during chip transportation, thereby ensuring the chip's internal structure is protected. The safety of chip transportation is ensured; thirdly, conductive polymer resin balls are made by uniformly mixing nano-grade polymer resin powder, nano-grade graphene powder, and nano-aluminum powder. Due to the good conductivity and elasticity of the conductive balls, the safety of the chip during storage and transportation is greatly reduced; fourthly, the surface of the polymer resin conductive balls is an adhesive bonding surface. The bonding point between the adhesive bonding surface and the chip surface forms a natural inclined tearing entry point, so the antistatic protective film can be torn off the chip surface naturally, smoothly, and effortlessly without generating static electricity, ensuring that the antistatic protective film on the chip will not generate static electricity when torn off; fifthly, when the base protective film is a conductive protective film, it can not only support the grid-like antistatic protective film, but also allow the static electricity conducted by the grid-like conductive chains in the grid-like antistatic protective film located on it to be quickly discharged through the base protective film. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of the structure of the chip's elastic protective film.

[0007] Figure 2 yes Figure 1 A partial structural diagram of the antistatic protective film.

[0008] Figure 3 This is a schematic diagram showing the detailed structure of the chip's elastic protective film. Detailed Implementation

[0009] Example 1: Refer to Appendix Figure 1-3 A chip elastic protective film is composed of a base protective film 1 and an antistatic protective film 2 stacked together, wherein the antistatic protective film 2 has a mesh-like structure. The mesh-like antistatic protective film 2 is composed of multiple polymer resin conductive spheres arranged in sequential contact. The polymer resin conductive spheres are made by uniformly mixing nano-sized polymer resin powder and nano-sized graphene powder. The nano-sized graphene powder in the antistatic protective film is selected within the range of 30-60% and includes end values. The fabrication of the polymer resin conductive spheres is existing technology and will not be described here. The conductive film in the base protective film and the multiple polymer resin conductive spheres in the antistatic protective film are bonded together tangentially.

[0010] The polymer resin in the conductive spheres has an electrical conductivity greater than 1000 S / cm. Nanopolymer resin refers to nanoscale polymer adhesives. The surface of the conductive spheres is a viscous conductive film, such as a film composed of graphene conductive adhesive.

[0011] Example 2: Based on Example 1, the polymer resin conductive spheres are made by uniformly mixing nano-sized polymer resin powder, nano-sized graphene powder, and nano-sized aluminum powder. The nano-sized graphene powder accounts for 30-50% of the polymer resin conductive spheres, and the nano-sized aluminum powder content is selected within the range of 10-20%, including end values.

[0012] Example 3: Based on Example 1, the polymer resin conductive spheres are made by uniformly mixing nano-sized polymer resin powder, nano-sized graphene powder, nano-sized aluminum powder, and nano-sized silver powder. The nano-sized graphene powder accounts for 30-50%, the nano-sized aluminum powder accounts for 10-20%, and the nano-sized silver powder accounts for 1-5%, selected within the range of extreme values.

[0013] Example 4: Based on Example 1, refer to Appendix Figure 3 The basic protective film is composed of an outer basic protective film and an inner basic protective film; the inner basic protective film is a conductive film, and the outer basic protective film is a discharge film. The proportion of nano-sized graphene powder in the conductive film and the discharge film is selected within the range of 30-60%, including the end value.

[0014] Example 5: Based on Example 4, the proportion of nano-scale graphene powder in the conductive film and the discharge film is selected within the range of 30-50% and the proportion of nano-scale aluminum powder is selected within the range of 10-20%, including the extreme values.

[0015] Example 6: Based on Example 4, the conductive film and discharge film contain 30-50% nano-scale graphene powder, 10-20% nano-scale aluminum powder, and 1-5% nano-scale silver powder, including the extreme values.

[0016] The nanoscale polymer resin film used in this invention is a combination of one or more polymer resin powders, and its manufacturing process is existing technology and will not be described here.

[0017] It should be understood that although the above embodiments provide a relatively detailed textual description of the design concept of the present invention, these textual descriptions are merely simple textual descriptions of the design concept of the present invention, and not limitations on the design concept of the present invention. Any combination, addition, or modification that does not exceed the design concept of the present invention falls within the protection scope of the present invention.

Claims

1. A chip elastic protective film, characterized in that It is composed of a basic protective film and an antistatic protective film stacked together, and the antistatic protective film is in a grid-like structure.

2. The chip elastic protection film according to claim 1, characterized in that: The grid-shaped antistatic protective film is composed of a plurality of polymer resin conductive balls arranged in sequence and in contact with each other.

3. The chip elastic protection film according to claim 2, characterized in that: The polymer resin conductive ball is made by uniformly mixing nano-scale polymer resin powder and nano-scale graphene powder.

4. The chip elastic protection film according to claim 3, characterized in that: Nano-graphene powder accounts for 30-60% in the antistatic protective film.

5. The chip elastic protection film according to claim 2, characterized in that: The polymer resin conductive ball is made by uniformly mixing nano-polymer resin powder, nano-graphene powder and nano-aluminum powder.

6. The chip elastic protection film according to claim 5, characterized in that: Nano-graphene powder accounts for 30-50% of the polymer resin conductive ball, and nano-aluminum powder accounts for 10-20%.

7. The chip elastic protection film according to claim 2, characterized in that: The polymer resin conductive ball is made by uniformly mixing nano-polymer resin powder, nano-graphene powder, nano-aluminum powder and nano-silver powder.

8. The chip elastic protection film according to claim 1, characterized in that: The nano-graphene powder in the antistatic protective film accounts for 30-50%, the nano-aluminum powder accounts for 10-20%, and the nano-silver powder accounts for 1-5%.

9. The chip elastic protection film according to claim 2, characterized in that: The conductivity of the nano-group polymer resin in the polymer resin conductive ball is greater than 1000S / cm.

10. The chip elastic protection film according to claim 3, 5 or 7, characterized in that: Nano-polymer resin refers to nano-scale polymer rubber.

11. The chip elastic protection film according to claim 2, characterized in that: The surface of the polymer resin conductive ball is a sticky conductive adhesive film.

12. The chip elastic protection film according to claim 1, characterized in that: The base protective film is composed of an outer base protective film and an inner base protective film; the inner base protective film is a conductive film, and the outer base protective film is a discharge film.

13. The chip elastic protection film according to claim 12, characterized in that: Nano-graphene powder accounts for 30-60% of the conductive film and discharge film.

14. The chip elastic protection film according to claim 12, characterized in that: The conductive film and the discharge film contain 30-50% of nano-graphene powder and 10-20% of nano-aluminum powder.

15. The chip elastic protection film according to claim 12, characterized in that: In the conductive film and the discharge film, nano-graphene powder accounts for 30-50%, nano-aluminum powder accounts for 10-20%, and nano-silver powder accounts for 1-5%.

16. The chip elastic protection film according to claim 11, characterized in that: The conductive film in the base protective film and the plurality of high molecular resin conductive spherical surfaces in the antistatic protective film surface are formed by tangent point-to-surface bonding.

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