Smart card strip coating process

Abstract

The invention discloses an intelligent card strip coating process which comprises the following steps: step 1, plating nickel gold or nickel palladium: 1.1, cleaning; 1.2, washing is conducted; 1.3, bonding wire surface film pasting; 1.4, chemical nickel plating; 1.5, electroplating gold or palladium; 1.6, washing is conducted; 1.7, drying is conducted; 1.8, stripping a bonding wire surface; 1.9, pasting a film on the contact surface; step 2, a silver immersion or silver plating process flow of a bonding wire surface: 2.1, oil removal; 2.2, micro-etching is carried out; 2.3, presoaking is carried out; 2.4, silver deposition; 2.5, washing with deionized water; 2.6, drying is conducted; and 2.7, stripping the film on the contact surface. The invention belongs to the technical field of card strip production, and particularly relates to an intelligent card strip coating process which aims at improving the conductivity, corrosion resistance and reliability of an intelligent card chip strip and optimizing the welding and contact performance of the intelligent card chip strip through the combination of a nickel gold plating or nickel palladium plating process and a silver deposition process and introduction of film pasting and film removing treatment in key steps. The low-cost processing of the high-performance plating layer and the bonding wire surface of the contact surface of the intelligent card chip is realized, and the performance and the reliability of the intelligent card chip are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of card strip production, and specifically refers to a smart card strip plating process. Background Art

[0002] With the rapid development of mobile communication technology, smart card chips, as an important part of mobile phones, are increasingly valued by the industry for their performance and reliability. The surface treatment technology of smart card chip strips directly affects their electrical performance, durability and compatibility with other components. Traditional surface treatment processes have problems such as high cost and low efficiency, and are difficult to meet the needs of the current market. Therefore, it is urgent to propose a card strip production process that can achieve low-cost processing, improve the performance and reliability of smart card chips, and reduce costs. Summary of the invention

[0003] In view of the above situation, in order to overcome the defects of the prior art, the present invention proposes a smart card strip plating process, which combines the nickel-gold or nickel-palladium plating process with the silver immersion process, and introduces film sticking and film stripping treatment in the key steps, aiming to improve the conductivity, corrosion resistance and reliability of the smart card chip strip, while optimizing its welding and contact performance, achieving high-performance plating on the contact surface of the smart card chip and low-cost processing of the welding line surface, effectively improving the performance and reliability of the smart card chip, while reducing production costs.

[0004] The technical solution adopted by the present invention is as follows: The present invention provides a smart card strip plating process, comprising the following steps:

[0005] Step 1: Nickel-gold or nickel-palladium plating:

[0006] 1.1: Cleaning: Use a special cleaning agent to remove oil, dust and other impurities on the surface of the chip strip to ensure that the subsequent coating can be evenly attached;

[0007] 1.2: Washing: Rinse the chip surface thoroughly with water to remove the cleaning agent residue and provide a clean base for the next process;

[0008] 1.3: Film on the welding line surface: Protect the non-welding line surface area to avoid unnecessary contamination or damage during the subsequent plating process. Select the film material to ensure stability during subsequent processing;

[0009] 1.4: Chemical nickel plating: In the absence of electricity, a layer of nickel is evenly deposited on the surface of the chip through chemical reaction. The nickel layer, as a base, can enhance the adhesion of the gold or palladium plating and improve the overall performance of the plating;

[0010] 1.5: Electroplating of gold or palladium: A layer of gold or palladium is deposited on the nickel layer through an electroplating process to form a contact surface coating with good conductivity, corrosion resistance and aesthetics;

[0011] 1.6: Washing: Wash the chip surface with water again to remove the residues produced during the electroplating process;

[0012] 1.7: Drying: Place the chip in a drying device to dry it to ensure that the coating is firm and dry;

[0013] 1.8: Stripping of the bonding wire surface: After the nickel-gold or nickel-palladium plating process is completed, remove the protective film on the bonding wire surface to prepare for subsequent silver immersion or silver plating treatment;

[0014] 1.9: Contact surface film: To protect or isolate the contact surface, high-quality film should also be selected to prepare for subsequent silver immersion or silver plating treatment;

[0015] Step 2: Silver immersion or silver plating process of wire bonding:

[0016] 2.1 Degreasing: Degreasing the welding line surface to ensure that the surface is clean and free of oil stains;

[0017] 2.2: Micro-etching: Through micro-etching treatment, the welding line surface is slightly corroded to improve its surface roughness and increase the bonding strength between the silver layer and the substrate;

[0018] 2.3: Pre-dip: Immerse the chip in the pre-dip liquid to adjust the surface state of the wire bonding surface and create good conditions for the subsequent silver immersion process;

[0019] 2.4: Silver immersion: Silver immersion is performed on the solder wire surface after pre-immersion;

[0020] 2.5: Deionized water washing: Use deionized water to thoroughly clean the wire surface to remove any residues produced during the silver immersion process;

[0021] 2.6: Drying: Place the chip in a drying device to dry it to ensure that the silver layer is completely solidified and moisture is removed;

[0022] 2.7: Contact surface film removal: After the silver immersion process is completed, remove the protective film on the contact surface.

[0023] Furthermore, the stain removal method in step 1.1 adopts one of physical or chemical methods.

[0024] Furthermore, the water used for cleaning in step 1.2 and step 1.6 is deionized water.

[0025] Furthermore, the film material in step 1.3 is required to be a film material that is resistant to high temperature and chemical corrosion.

[0026] Furthermore, the degreasing treatment method in step 2.1 is a high-efficiency degreasing agent.

[0027] Furthermore, in the step 2.4, the silver deposition uses a chemical reaction to deposit a uniform silver layer on the surface, and the silver layer has excellent electrical conductivity and solderability.

[0028] The beneficial effects achieved by the present invention using the above structure are as follows:

[0029] 1. High-performance plating: By plating nickel-gold or nickel-palladium on the contact surface of the smart card chip, the conductivity and corrosion resistance of the contact surface are effectively improved, ensuring stable connection and reliable communication between the smart card chip and the communication equipment;

[0030] 2. Low-cost processing: The silver immersion or silver plating process is used on the bonding wire surface, which is lower in cost than the traditional electroplating gold process, while ensuring good conductivity of the bonding wire surface;

[0031] 3. Process optimization: By optimizing the process and using film treatment, the production cost can be reduced while ensuring the performance;

[0032] 4. Environmental protection and energy saving: The use of environmentally friendly cleaning and electroplating solutions reduces pollution emissions during the production process and complies with the green and environmentally friendly production concept;

[0033] 5. Easy to operate: The whole process is simple and clear, easy to operate and control, and suitable for large-scale production. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a production process flow chart of a smart card strip plating process proposed by the present invention. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention.

[0036] Embodiment 1:

[0037] A smart card strip plating process comprises the following steps:

[0038] Step 1: Nickel-gold or nickel-palladium plating:

[0039] 1.1: Cleaning: Use a special cleaning agent to remove oil, dust and other impurities on the surface of the chip strip to ensure that the subsequent coating can be evenly attached;

[0040] 1.2: Washing: Rinse the chip surface thoroughly with water to remove the cleaning agent residue and provide a clean base for the next process;

[0041] 1.3: Film on the welding line surface: Protect the non-welding line surface area to avoid unnecessary contamination or damage during the subsequent plating process. Select the film material to ensure stability during subsequent processing;

[0042] 1.4: Chemical nickel plating: In the absence of electricity, a layer of nickel is evenly deposited on the surface of the chip through chemical reaction. The nickel layer, as a base, can enhance the adhesion of the gold or palladium plating and improve the overall performance of the plating;

[0043] 1.5: Electroplating of gold or palladium: A layer of gold or palladium is deposited on the nickel layer through an electroplating process to form a contact surface coating with good conductivity, corrosion resistance and aesthetics;

[0044] 1.6: Washing: Wash the chip surface with water again to remove the residues produced during the electroplating process;

[0045] 1.7: Drying: Place the chip in a drying device to dry it to ensure that the coating is firm and dry;

[0046] 1.8: Stripping of the bonding wire surface: After the nickel-gold or nickel-palladium plating process is completed, remove the protective film on the bonding wire surface to prepare for subsequent silver immersion or silver plating treatment;

[0047] 1.9: Contact surface film: To protect or isolate the contact surface, high-quality film should also be selected to prepare for subsequent silver immersion or silver plating treatment;

[0048] Step 2: Silver immersion or silver plating process of wire bonding:

[0049] 2.1 Degreasing: Degreasing the welding line surface to ensure that the surface is clean and free of oil stains;

[0050] 2.2: Micro-etching: Through micro-etching treatment, the welding line surface is slightly corroded to improve its surface roughness and increase the bonding strength between the silver layer and the substrate;

[0051] 2.3: Pre-dip: Immerse the chip in the pre-dip liquid to adjust the surface state of the wire bonding surface and create good conditions for the subsequent silver immersion process;

[0052] 2.4: Silver immersion: Silver immersion is performed on the solder wire surface after pre-immersion;

[0053] 2.5: Deionized water washing: Use deionized water to thoroughly clean the wire surface to remove any residues produced during the silver immersion process;

[0054] 2.6: Drying: Place the chip in a drying device to dry it to ensure that the silver layer is completely solidified and moisture is removed;

[0055] 2.7: Contact surface film removal: After the silver immersion process is completed, remove the protective film on the contact surface.

[0056] The stain removal method in step 1.1 adopts one of physical or chemical methods.

[0057] The water used for washing in step 1.2 and step 1.6 is deionized water.

[0058] The film material in step 1.3 is required to be high temperature resistant and chemical corrosion resistant.

[0059] The degreasing treatment method used in step 2.1 is a high-efficiency degreasing agent.

[0060] In the step 2.4, the silver deposition uses a chemical reaction to deposit a uniform silver layer on the surface, and the silver layer has excellent electrical conductivity and solderability.

[0061] The above-mentioned embodiment only expresses one implementation mode of the present invention, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. A smart card strip coating process, characterized in that it includes the following steps: Step 1: Nickel-gold or nickel-palladium plating: 1.1: Cleaning: Use special cleaning agent to remove oil, dust and other impurities on the surface of chip strips; 1.2: Washing: Rinse the chip surface thoroughly with water to remove the cleaning agent residue and provide a clean base for the next process; 1.3: Film on the welding line surface: protect the non-welding line surface area and select film materials to ensure stability in subsequent processing; 1.4: Chemical nickel plating: In the absence of electricity, a layer of nickel is evenly deposited on the surface of the chip through chemical reaction, and the nickel layer serves as the base; 1.5: Electroplating gold or palladium: A layer of gold or palladium is deposited on the nickel layer through an electroplating process to form a contact surface coating; 1.6: Washing: Clean the chip surface with water again; 1.7: Drying: Place the chip in a drying device for drying; 1.8: Stripping of the bonding wire surface: After the nickel-gold or nickel-palladium plating process is completed, remove the protective film on the bonding wire surface to prepare for subsequent silver immersion or silver plating treatment; 1.9: Contact surface film: To protect or isolate the contact surface, high-quality film should also be selected to prepare for subsequent silver immersion or silver plating treatment; Step 2: Silver immersion or silver plating process of wire bonding: 2.1 Degreasing: Degreasing the welding line surface; 2.2: Micro-etching: Through micro-etching treatment, the welding line surface is slightly corroded to improve its surface roughness and increase the bonding strength between the silver layer and the substrate; 2.3: Pre-dip: Immerse the chip in the pre-dip liquid to adjust the surface state of the wire bonding surface and create good conditions for the subsequent silver immersion process; 2.4: Silver immersion: Silver immersion is performed on the solder wire surface after pre-immersion; 2.5: Deionized water washing: Use deionized water to thoroughly clean the wire surface to remove any residues produced during the silver immersion process; 2.6: Drying: Place the chip in a drying device to dry it to ensure that the silver layer is completely solidified and moisture is removed; 2.7: Contact surface film removal: After the silver immersion process is completed, remove the protective film on the contact surface.

2. A smart card strip coating process according to claim 1, characterized in that: The stain removal method in step 1.1 adopts one of physical or chemical methods.

3. A smart card strip coating process according to claim 1, characterized in that: The water used for washing in step 1.2 and step 1.6 is deionized water.

4. A smart card strip coating process according to claim 1, characterized in that: The film material in step 1.3 is required to be high temperature resistant and chemical corrosion resistant.

5. A smart card strip coating process according to claim 1, characterized in that: The degreasing treatment method used in step 2.1 is a high-efficiency degreasing agent.

6. A smart card strip coating process according to claim 1, characterized in that: In step 2.4, the silver deposition uses a chemical reaction to deposit a uniform silver layer on the surface.

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