Power device testing device, dynamic testing equipment and power device testing system

Abstract

The invention provides a power device testing device, dynamic testing equipment and a power device testing system, and the power device testing device comprises a wireless communication module, a pulse signal transmitting module and a power supply module. The output end of the wireless communication module is connected with the input end of the pulse signal sending module, and the wireless communication module is used for sending a test instruction to the pulse signal sending module after receiving the test instruction sent by the dynamic test equipment. The output end of the pulse signal sending module is connected with the input end of the to-be-tested power device and used for sending a pulse signal to the to-be-tested power device according to the test instruction. The output end of the power supply module is connected with the power supply end of the wireless communication module and the power supply end of the pulse signal sending module, and the power supply module is used for supplying power to the wireless communication module and the pulse signal sending module. Through wireless communication and battery power supply, a communication wire harness and a power supply wire harness do not need to be arranged, the test distance is increased, the size of the drive board is reduced, and meanwhile the effect of reducing cost can be achieved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a power device testing apparatus, a dynamic testing device and a power device testing system. Background Art

[0002] Power devices are indispensable components in power electronic systems. Their performance and reliability directly affect the overall working efficiency and safety of electronic systems. In order to ensure the performance and reliability of power devices, comprehensive static and dynamic tests are required to detect and repair problems in a timely manner.

[0003] When performing dynamic testing in the prior art, power supply and signal communication are generally provided to the power device driver board through a wiring harness and a host computer. The dynamic test equipment provides driving power to the power device driver board through a power wiring harness and provides driving signals to the power device driver board through a signal wiring harness.

[0004] However, connecting through a harness will affect the test distance and test position. On the other hand, the harness needs to be arranged in a low-voltage environment, while the test environment is a high-voltage environment, so additional isolation devices need to be added to the driver board, which will also increase the size of the driver board and increase production costs. Summary of the invention

[0005] The purpose of the present application is to provide a power device testing device, a dynamic testing equipment and a power device testing system to address the deficiencies in the above-mentioned prior art, so as to solve the problems in the prior art that the wiring harness connection limits the test distance and test position, and the need to add isolation devices leads to an increase in the volume of the driver board, thereby increasing the production cost.

[0006] To achieve the above objectives, the technical solutions adopted in this application are as follows:

[0007] In a first aspect, the present application provides a power device testing device, comprising: a wireless communication module, a pulse signal sending module and a power supply module, wherein the power device testing device is arranged in a high voltage testing environment;

[0008] The output end of the wireless communication module is connected to the input end of the pulse signal sending module, and the wireless communication module is used to send the test instruction to the pulse signal sending module after receiving the test instruction sent by the dynamic test equipment;

[0009] The output end of the pulse signal sending module is used to connect to the input end of the power device to be tested, and the pulse signal sending module is used to send a pulse signal to the power device to be tested according to the test instruction;

[0010] The output end of the power supply module is connected to the power supply end of the wireless communication module and the power supply end of the pulse signal sending module, and is used to supply power to the wireless communication module and the pulse signal sending module.

[0011] In an optional embodiment, the pulse signal sending module includes: a micro control unit and an amplifier circuit; the wireless communication module is communicatively connected to the input end of the micro control unit, the output end of the micro control unit is connected to the input end of the amplifier circuit, and the output end of the amplifier circuit is used to connect to the input end of the power device to be tested;

[0012] The wireless communication module is specifically used to send the test instruction to the micro control unit after receiving the test instruction of the dynamic test device;

[0013] The micro control unit is used to send an initial pulse signal to the amplifying circuit according to the test instruction;

[0014] The amplifier circuit is used to amplify the initial pulse signal to obtain the pulse signal, and send the pulse signal to the power device to be tested.

[0015] In an optional implementation, the amplifier circuit is a push-pull circuit.

[0016] In an optional embodiment, the power supply module includes: an energy storage submodule, a first power supply submodule and a second power supply submodule;

[0017] The output end of the energy storage submodule is connected to the input end of the first power supply submodule and the input end of the second power supply submodule, the output end of the first power supply submodule is connected to the power supply end of the wireless communication module and the power supply end of the micro control unit, and the output end of the second power supply submodule is connected to the power supply end of the amplifier circuit;

[0018] The first power supply submodule is used to supply power to the wireless communication module and the micro control unit, and the second power supply submodule is used to supply power to the amplifying circuit.

[0019] In an optional embodiment, the second power supply submodule includes: a first adjustment unit and a second adjustment unit;

[0020] The input end of the first adjustment unit and the input end of the second adjustment unit are respectively connected to the output end of the energy storage submodule;

[0021] The output end of the first adjustment unit is connected to the power supply end of the amplifier circuit, and the first adjustment unit is used to convert the output voltage of the energy storage submodule into a positive voltage and output the positive voltage to the amplifier circuit;

[0022] The output end of the second adjustment unit is connected to the power supply end of the amplifier circuit, and the second adjustment unit is used to convert the output voltage of the energy storage submodule into a negative voltage and output the negative voltage to the amplifier circuit.

[0023] In an optional embodiment, the first power supply submodule is a step-down circuit, and the first power supply submodule is used to step down the output voltage of the power supply submodule and output the stepped-down voltage to the wireless communication module and the micro control unit.

[0024] In an optional implementation, the wireless communication module is further configured to send the sleep instruction to the pulse signal sending module after receiving the sleep instruction of the dynamic test device;

[0025] The pulse signal sending module is further used to stop sending the pulse signal to the power device to be tested according to the sleep instruction.

[0026] In an optional implementation, the power supply module is connected to a high-voltage power supply in a high-voltage test environment, and draws power from the high-voltage power supply.

[0027] In a second aspect, the present application provides a dynamic testing device, which is wirelessly connected to the power testing device described in the first aspect and sends a test instruction or a sleep instruction to the power testing device.

[0028] In a third aspect, an embodiment of the present application further provides a power device testing system, comprising the power device testing apparatus described in the first aspect and the dynamic testing equipment described in the second aspect.

[0029] The beneficial effects of the present application are as follows: the power device test device includes a wireless communication module, a pulse signal sending module and a power supply module, and the power device test device is arranged in a high-voltage test environment. The output end of the wireless communication module is connected to the input end of the pulse signal sending module, and the wireless communication module is used to send the test instruction to the pulse signal sending module after receiving the test instruction sent by the dynamic test equipment. The output end of the pulse signal sending module is used to connect the input end of the power device to be tested, and the pulse signal sending module is used to send a pulse signal to the power device to be tested according to the test instruction. The output end of the power supply module is connected to the power supply end of the wireless communication module and the power supply end of the pulse signal sending module, and is used to supply power to the wireless communication module and the pulse signal sending module. The power device test device communicates wirelessly with the dynamic test equipment, is powered by a built-in battery, and is connected to the power device. Through wireless communication and battery power supply, the power device test device does not need to be connected to the dynamic test equipment through a wiring harness, so that there is no need to set a communication wiring harness and a power supply wiring harness, which increases the test distance. At the same time, since there is no need to set a wiring harness in the present application, the power device test device can be arranged in a high-voltage test environment, so the isolation device can be cancelled, and the cost can be reduced while reducing the volume of the driver board.

[0030] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 A schematic diagram of the structure of a power device testing device in the prior art is shown;

[0033] Figure 2 A schematic diagram of the structure of a power device testing system provided by an embodiment of the present application is shown;

[0034] Figure 3 A schematic diagram of the structure of a power device testing device provided in an embodiment of the present application is shown;

[0035] Figure 4 A schematic diagram of the structure of another power device testing device provided in an embodiment of the present application is shown;

[0036] Figure 5A schematic diagram of the structure of another power device testing device provided in an embodiment of the present application is shown;

[0037] Figure 6 A schematic diagram of the structure of another power device testing device provided in an embodiment of the present application is shown;

[0038] Figure 7 A structural schematic diagram of a dynamic testing device provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0039] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0040] It should be noted that the term "comprising" will be used in the embodiments of the present application to indicate the existence of the features declared thereafter, but does not exclude the addition of other features.

[0041] When performing dynamic testing in the prior art, power supply and signal communication are generally provided to the power device driver board through a wiring harness and a host computer. The dynamic test equipment provides driving power to the power device driver board through a power wiring harness and provides driving signals to the power device driver board through a signal wiring harness.

[0042] like Figure 1 The figure shows a schematic diagram of the structure of a device used in power testing in the prior art. The dynamic test equipment supplies power to the driving power supply of the power device through the power harness, and provides PWM (Pulse Width Modulation) signals to the signal driving module of the power device through the signal harness. The test environment of the dynamic test is generally a high voltage environment, refer to Figure 1 , dynamic test equipment provides a DC (Direct Current) high voltage environment. In order to avoid device failure in a high voltage environment, and thus affect the wiring harness and the host computer and front-end equipment connected to the wiring harness, the wiring harness needs to be set in a low voltage environment. Figure 1 Power isolation devices and signal isolation devices are added at the positions shown to isolate the high-voltage test environment where the power device is located from the wiring harness, the host computer, and the front-end equipment.

[0043] However, connecting through a wiring harness affects the test distance and test position. On the other hand, adding an additional isolation device to the driver board will also increase the size of the driver board, thereby increasing the production cost.

[0044] Based on this, the present application proposes a power device test device, which communicates wirelessly with a dynamic test device, is powered by a built-in battery, and is connected to a power device. Through wireless communication and battery power supply, the power device test device does not need to be connected to the wiring harness of the dynamic test device, which reduces the communication wiring harness and the power supply wiring harness, increases the test distance, and eliminates the isolation device, thereby reducing the size of the driver board and achieving the purpose of reducing costs.

[0045] like Figure 2 FIG. 1 is a schematic diagram of the architecture of a power device testing system provided in the present application. Figure 2 The power device test system includes the power device test device, dynamic test equipment and the power device to be tested described in the present application. The power device test device communicates wirelessly with the dynamic test equipment and can be set in a high-voltage test environment. The dynamic test equipment may include a host computer for controlling the dynamic test process and a front-end device for providing a high-voltage test environment and other test conditions. The host computer may be, for example, an electronic device that issues instructions during the dynamic test process.

[0046] Figure 3 3 is a schematic diagram of the structure of a power device testing device 30 provided in this application. Figure 3 The power device testing device 30 includes a wireless communication module 31, a pulse signal sending module 32 and a power supply module 33. The power device testing device 30 is arranged in a high voltage testing environment, and the high voltage testing environment can be provided with DC high voltage by a dynamic testing device.

[0047] The output end of the wireless communication module 31 is connected to the input end of the pulse signal sending module 32 . The wireless communication module 31 is used to send the test instruction to the pulse signal sending module 32 after receiving the test instruction sent by the dynamic test equipment.

[0048] The output end of the pulse signal sending module 32 is used to connect to the input end of the power device to be tested 40 , and the pulse signal sending module 32 is used to send a pulse signal to the power device to be tested 40 according to the test instruction.

[0049] The output end of the power supply module 33 is connected to the power supply end of the wireless communication module 31 and the power supply end of the pulse signal sending module 32 , and is used to supply power to the wireless communication module 31 and the pulse signal sending module 32 .

[0050] The power device may be a semiconductor switching device such as an IGBT (Insulated Gate Bipolar Transistor), a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), etc. When a power device is dynamically tested, the general test environment is a high-voltage test environment. The power device test device 30 of the present application is connected to the power device 40 to be tested and can be deployed at any position in the high-voltage test environment.

[0051] Reference Figure 2 The dynamic test equipment can provide a high-voltage test environment for the power device 40 to be tested, and communicate wirelessly with the power device test device 30. The dynamic test equipment can send a test instruction to the power device test device 30 to control the power device test device 30 to perform a dynamic test on the power device 40 to be tested. At the same time, the dynamic test equipment can also collect current parameter information of the power device 40 to be tested to obtain the current test status of the power device 40 to be tested. The dynamic test can be a double pulse test on the power device 40 to be tested, that is, sending two pulses to test the dynamic characteristics of the power device.

[0052] It should be noted that the dynamic test equipment and the power device test device 30 may include corresponding wireless communication modules 31. Taking the wireless communication method as communication based on the Zigbee protocol as an example, the Zigbee protocol is a low-speed, short-distance transmission wireless network protocol, and the bottom layer is the media access layer and physical layer of the IEEE 802.15.4 standard specification. The dynamic test equipment may include a Zigbee main control module, and the power device test device 30 includes a Zigbee module. The dynamic test equipment sends instructions to the power device test device 30 through the Zigbee main control module, and the power device test device 30 receives the instructions sent by the dynamic test equipment through the Zigbee module.

[0053] Among them, the wireless communication methods include but are not limited to the following: communication based on Zigbee protocol, Bluetooth communication or local area network protocol, etc.

[0054] Reference Figure 3 The output end of the wireless communication module 31 is connected to the input end of the pulse signal sending module 32, and the output end of the pulse signal sending module 32 is connected to the input end of the power device to be tested 40. When the wireless communication module 31 receives a test instruction from the dynamic test device, the test instruction can be sent to the pulse signal sending module 32, and the pulse signal sending module 32 can send a pulse signal to the device to be tested based on the test instruction.

[0055] The power supply module 33 may be a battery built into the power device test apparatus 30. As a possible implementation, the high voltage current provided by the dynamic test equipment may be reduced in voltage by the power supply module 33, and the reduced current may be used as the output current of the power supply module 33.

[0056] In the embodiment of the present application, the power device test device communicates wirelessly with the dynamic test equipment, is powered by a built-in battery, and is connected to the power device. Through wireless communication and battery power supply, the power device test device does not need to be connected to the dynamic test equipment through a harness, so there is no need to set up a communication harness and a power supply harness, which increases the test distance. At the same time, since there is no need to set up a harness in the present application, the power device test device can be set in a high-voltage test environment, so the isolation device can be eliminated, and the cost can be reduced while reducing the size of the driver board.

[0057] The following is a further description of the pulse signal sending module 32 . Figure 4 3 is a specific structural diagram of a pulse signal sending module 32 provided in this application. Figure 4 The pulse signal sending module 32 includes: a micro control unit 321 and an amplifier circuit 322 .

[0058] The wireless communication module 31 is communicatively connected to the input end of the micro control unit 321 , the output end of the micro control unit 321 is connected to the input end of the amplifier circuit 322 , and the output end of the amplifier circuit 322 is used to connect to the input end of the power device 40 to be tested.

[0059] The wireless communication module 31 is specifically used to send the test instruction to the micro control unit 321 after receiving the test instruction of the dynamic test equipment.

[0060] The micro control unit 321 is used to send an initial pulse signal to the amplifier circuit 322 according to the test instruction.

[0061] The amplifier circuit 322 is used to amplify the initial pulse signal to obtain a pulse signal, and send the pulse signal to the power device 40 to be tested.

[0062] The microcontroller unit 321 may be an MCU (Microcontroller Unit), which receives a test instruction sent by the wireless communication module 31. The test instruction is used to indicate test conditions such as the voltage and pulse duration used in the current test. After receiving the test instruction, the MCU can determine the duration, waveform, amplitude, width, and repetition frequency of the pulse signal of the current test according to the test instruction, and generate and send an initial pulse signal to the amplifier circuit 322.

[0063] Optionally, the amplifier circuit 322 may be a push-pull circuit, which is used to amplify the initial pulse signal to obtain a pulse signal for actual testing, and send the pulse signal to the input end of the power device 40 to be tested. When performing a double pulse test, the initial pulse signal may be a double pulse signal.

[0064] It should be noted that the present application only describes the push-pull circuit as a possible implementation method. It should be understood that other circuits capable of implementing pulse signal amplification processing can also be used as the amplifier circuit 322, and there is no limitation here.

[0065] Further, such as Figure 5 As shown, the power supply module 33 in the present application includes: an energy storage submodule 331 , a first power supply submodule 332 and a second power supply submodule 333 .

[0066] The output end of the energy storage submodule 331 is connected to the input end of the first power supply submodule 332 and the input end of the second power supply submodule 333, the output end of the first power supply submodule 332 is connected to the power supply end of the wireless communication module 31 and the power supply end of the micro control unit 321, and the output end of the second power supply submodule 33 is connected to the power supply end of the amplifier circuit 322.

[0067] The first power supply submodule 332 is used to supply power to the wireless communication module 31 and the micro control unit 321 , and the second power supply submodule 333 is used to supply power to the amplifying circuit 322 .

[0068] The energy storage submodule 331 may be a rechargeable lithium battery or a voltage conversion device. Specifically, the voltage conversion device may be connected to a high-voltage power supply of the dynamic test equipment, draw power from the high-voltage power supply, and convert the high-voltage power provided by the dynamic test equipment into a power supply that can be used by the first power supply submodule 332 and the second power supply submodule 333.

[0069] The first power supply submodule 332 may be a BUCK circuit, which is used to convert the voltage of the energy storage submodule 331 and provide the converted voltage to the wireless communication module 31 and the micro control unit 321 .

[0070] As a possible implementation, the first power supply submodule 332 is a buck circuit, and the first power supply submodule 332 is used to buck the output voltage of the power supply submodule, and output the bucked voltage to the wireless communication module 31 and the micro control unit 321. Specifically, if the voltage required to be provided by the first power supply submodule 332 is less than the voltage provided by the energy storage submodule 331, the first power supply submodule 332 may be a BUCK buck circuit, which bucks the voltage provided by the energy storage submodule 331 and provides the bucked voltage to the wireless communication module 31 and the micro control unit 321. Exemplarily, the energy storage submodule 331 provides a voltage of 24V, and the first power supply submodule 332 can convert the 24V voltage into a voltage of 3.3V, and provide the 3.3V voltage to the wireless communication module 31 and the micro control unit 321.

[0071] As another possible implementation, if the voltage required to be provided by the first power supply submodule 332 is greater than the voltage provided by the energy storage submodule 331, the first power supply submodule 332 may be a BUCK boost circuit, which boosts the voltage provided by the energy storage submodule 331 and provides the boosted voltage to the wireless communication module 31 and the micro control unit 321. Exemplarily, the energy storage submodule 331 provides a voltage of 2.4V, and the first power supply submodule 332 may convert the 2.4V voltage into a 3.3V voltage, and provide the 3.3V voltage to the wireless communication module 31 and the micro control unit 321.

[0072] The second power supply submodule 333 can convert the voltage of the energy storage submodule 331 into a positive voltage and a negative voltage, and provide the positive voltage and the negative voltage to the amplification circuit 322 .

[0073] Next, the second power supply submodule 333 is further described. Figure 6 As shown, the second power supply submodule 333 includes: a first adjustment unit 3331 and a second adjustment unit 3332 .

[0074] An input end of the first adjustment unit 3331 and an input end of the second adjustment unit 3332 are respectively connected to an output end of the energy storage submodule 331 .

[0075] The output end of the first adjustment unit 3331 is connected to the power supply end of the amplifier circuit 322 . The first adjustment unit 3331 is used to convert the output voltage of the energy storage submodule 331 into a positive voltage and output the positive voltage to the amplifier circuit 322 .

[0076] The output end of the second adjustment unit 3332 is connected to the power supply end of the amplifier circuit 322 . The second adjustment unit 3332 is used to convert the output voltage of the energy storage submodule 331 into a negative voltage and output the negative voltage to the amplifier circuit 322 .

[0077] The first adjustment unit 3331 and the second adjustment unit 3332 may be BUCK-BOOST circuits, which are commonly used DC / DC conversion circuits, whose output voltage may be lower than or higher than the input voltage, and whose output voltage polarity may be either positive or negative.

[0078] If the output voltage of the energy storage submodule 331 is different from the input driving positive voltage required by the amplifier circuit 322, the first adjustment unit 3331 can boost or buck the output voltage of the energy storage submodule 331 so that the output voltage of the energy storage submodule 331 is the same as the input driving positive voltage required by the amplifier circuit 322.

[0079] The second adjustment unit 3332 can convert the output voltage of the energy storage submodule 331 into a negative voltage, and use the negative voltage as an input driving voltage of the amplifier circuit 322 .

[0080] Optionally, the wireless communication module 31 is further configured to send a sleep instruction to the pulse signal sending module 32 after receiving the sleep instruction of the dynamic test device.

[0081] The pulse signal sending module 32 is further configured to stop sending the pulse signal to the power device to be tested 40 according to the sleep instruction.

[0082] In the embodiment of the present application, the user can send a sleep instruction to the power device test device through the dynamic test device, and the sleep instruction is used to instruct the power device test device to stop testing and enter a sleep state. In the sleep state, each module operates at minimum power to reduce the power loss of the power device test device.

[0083] After receiving the sleep instruction, the wireless communication module 31 can send the sleep instruction to the pulse signal sending module 32. The pulse signal sending module 32 can stop sending pulse signals to the power device 40 to be tested based on the sleep instruction to stop the current test and put the power device testing device 30 into a sleep state.

[0084] Figure 7 The structure diagram of a dynamic test device provided by an embodiment of the present application is shown, and the electronic device may be an electronic device. Figure 7 The electronic device includes: a processor 701, a storage medium 702 and a bus 703. The storage medium 702 stores machine-readable instructions executable by the processor 701. When the electronic device is running, the processor 701 communicates with the storage medium 702 through the bus 703, and the processor 701 executes the machine-readable instructions. The processor 701 is used to send test instructions or sleep instructions to the power device testing device and receive test results of the power device to be tested.

[0085] An embodiment of the present application also provides a computer-readable storage medium, on which a computer program is stored. The computer program is executed when a processor is running. The processor is used to send a test instruction or a sleep instruction to a power device testing device and receive a test result of a power device to be tested.

[0086] The present application also provides a power device testing system. Figure 2 The power device test system includes a power device test device and a dynamic test device. The power device test system is connected to the power device to be tested, and the dynamic test device can send a test instruction to the power device test device so that the power device test device can perform a dynamic test on the power device to be tested based on the test instruction.

[0087] In the embodiments provided in the present application, it should be understood that the disclosed devices and systems can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0088] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0089] In addition, each functional unit in the embodiments provided in the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0090] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0091] It should be noted that similar numbers and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and are not to be understood as indicating or implying relative importance.

[0092] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-mentioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-mentioned embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application. They should all be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A power device testing device, characterized in that: include: A wireless communication module, a pulse signal sending module and a power supply module, wherein the power device testing device is arranged in a high voltage testing environment; The output end of the wireless communication module is connected to the input end of the pulse signal sending module, and the wireless communication module is used to send the test instruction to the pulse signal sending module after receiving the test instruction sent by the dynamic test equipment; The output end of the pulse signal sending module is used to connect to the input end of the power device to be tested, and the pulse signal sending module is used to send a pulse signal to the power device to be tested according to the test instruction; The output end of the power supply module is connected to the power supply end of the wireless communication module and the power supply end of the pulse signal sending module, and is used to supply power to the wireless communication module and the pulse signal sending module.

2. The device according to claim 1, characterized in that The pulse signal sending module includes: a micro control unit and an amplifier circuit; the wireless communication module is communicatively connected to the input end of the micro control unit, the output end of the micro control unit is connected to the input end of the amplifier circuit, and the output end of the amplifier circuit is used to connect to the input end of the power device to be tested; The wireless communication module is specifically used to send the test instruction to the micro control unit after receiving the test instruction of the dynamic test device; The micro control unit is used to send an initial pulse signal to the amplifying circuit according to the test instruction; The amplifier circuit is used to amplify the initial pulse signal to obtain the pulse signal, and send the pulse signal to the power device to be tested.

3. The device according to claim 2, characterized in that The amplifier circuit is a push-pull circuit.

4. The device according to claim 2, characterized in that The power supply module comprises: an energy storage submodule, a first power supply submodule and a second power supply submodule; The output end of the energy storage submodule is connected to the input end of the first power supply submodule and the input end of the second power supply submodule, the output end of the first power supply submodule is connected to the power supply end of the wireless communication module and the power supply end of the micro control unit, and the output end of the second power supply submodule is connected to the power supply end of the amplifier circuit; The first power supply submodule is used to supply power to the wireless communication module and the micro control unit, and the second power supply submodule is used to supply power to the amplifying circuit.

5. The device according to claim 4, characterized in that The second power supply submodule includes: a first adjustment unit and a second adjustment unit; The input end of the first adjustment unit and the input end of the second adjustment unit are respectively connected to the output end of the energy storage submodule; The output end of the first adjustment unit is connected to the power supply end of the amplifier circuit, and the first adjustment unit is used to convert the output voltage of the energy storage submodule into a positive voltage and output the positive voltage to the amplifier circuit; The output end of the second adjustment unit is connected to the power supply end of the amplifier circuit, and the second adjustment unit is used to convert the output voltage of the energy storage submodule into a negative voltage and output the negative voltage to the amplifier circuit.

6. The device according to claim 4, characterized in that The first power supply submodule is a step-down circuit, which is used to step down the output voltage of the power supply submodule and output the stepped-down voltage to the wireless communication module and the micro control unit.

7. The device according to claim 1, characterized in that The wireless communication module is also used to send the sleep instruction to the pulse signal sending module after receiving the sleep instruction of the dynamic test equipment; The pulse signal sending module is further configured to stop sending the pulse signal to the power device to be tested according to the sleep instruction.

8. The device according to claim 1, characterized in that The power supply module is connected to a high-voltage power supply in a high-voltage test environment and draws power from the high-voltage power supply.

9. A dynamic testing device, characterized in that: The dynamic testing device is wirelessly connected to the power testing device according to any one of claims 1 to 8, and sends a test instruction or a sleep instruction to the power testing device.

10. A power device testing system, characterized in that: It comprises the power device testing device according to any one of claims 1 to 8 and the dynamic testing equipment according to claim 9.

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