Self-adaptive chip testing equipment
Through the adaptive chip test equipment, the design of the movable support frame and movable plate, combined with the spring and convex strip structure, the flatness and airtightness of the bare chip test seat are solved, and the consistency of the test data and chip safety are improved.
Patent Information
- Application Number
- CN202310833130.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-10
- Publication Date
- 2025-01-10
AI Technical Summary
The bare chip is thin and the area of the contact area of the test probe is small, which leads to high flatness requirements of the test seat, but it is difficult to detect through sensors. High current and high voltage tests require high air pressure to avoid space discharge, and the existing technology is difficult to ensure the mold closing. The airtightness and smooth fit of the state.
An adaptive chip testing equipment is designed, using a movable support frame and movable plate to achieve the formation of the sealing cavity through grooves and sealing strips, and the spring and convex strip structures are used to maintain the flatness of the upper and lower test seats in the test state. Fitting, providing mold clamping pressure, ensuring the use of high-pressure gas.
It improves the consistency of the test data and the safety of the chip under high current and high voltage tests, enhances the sealing and voltage resistance of the test seat, and avoids spatial discharge and poor contact between the probes.
Smart Images
Figure CN119291445A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to an adaptive chip testing device, belonging to the technical field of semiconductor chip testing. Background Art
[0002] With the development of the semiconductor industry, MCM packaging technology based on bare chips has been increasingly valued by the industry. However, the unknown quality problems of bare chips have led to reduced packaging yield and reliability, which has greatly restricted MCM packaging technology. Among them, KGD testing of bare chips is the key to improving MCM yield and reliability.
[0003] The KGD process requires the chip to be installed in a temporary fixture carrier, complete the test screening, and classify / categorize according to performance differences. KGD chips are known qualified chips, and their full name is Known good die, which means known good chips in Chinese. After the wafers from the previous process are aged and wafer cutting is completed, the bare chip test screening and grading before packaging are performed again based on the test data obtained from the aging process, which is KGD.
[0004] The bare chips of some power chips are generally very thin and the single pad area on them for contact with the test probe is very small. Therefore, the accuracy of the test seat used to load the bare chip to be tested, especially the flatness between the upper and lower test seats after the mold is closed, is extremely high, and the flatness is not convenient for perception and detection by sensors; moreover, the test generally requires ultra-large current and ultra-high voltage. Since it is a high-voltage test, the entire test fixture needs to ensure a high-pressure test atmosphere, and the maximum breakdown voltage is increased by increasing the air pressure around the chip, thereby avoiding spatial discharge between the probes. Therefore, there are also high requirements for airtightness in the closed-mold test state. Summary of the invention
[0005] The purpose of the present invention is to provide an adaptive chip testing device, which can realize the reference conversion after the upper and lower test seats are molded together, ensure smooth fitting, improve the consistency of test data, and improve the safety of the chip under high current and high voltage testing conditions.
[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an adaptive chip testing device, comprising: a support frame movable in the vertical direction and a movable plate movable in the horizontal direction, an upper test seat installed on the support frame, a lower test seat installed on the movable plate that can move with the movable plate to the bottom of the upper test seat, a groove is provided on the lower surface of the upper test seat and / or the upper surface of the lower test seat, when the testing device is in a testing state, the lower surface of the upper test seat is tightly attached to the upper surface of the lower test seat and a sealed cavity for placing the chip to be tested is formed in the groove area, a PCB board and a partition are stacked in sequence above the upper test seat, the fixedly connected upper test seat, PCB board and partition are connected to the support frame through a mounting plate arranged above the partition, one end of a pipeline passes through the mounting plate, the partition, the PCB board and the upper test seat in sequence and is connected to the sealed cavity, and the other end of the pipeline is used to communicate with a high-pressure gas source; A strip through hole is opened on the upper surface of the support frame, and the lower parts of the two opposite inner walls of the strip through hole each have a first convex strip, and the upper parts of the two opposite side surfaces of the mounting plate each have a second convex strip corresponding to and extending to directly above the first convex strip, and a strip block is arranged above each of the second convex strips, one side of the strip block is fixedly connected to the upper surface of the support frame, and the other side extends to directly above the second convex strip and is connected to the second convex strip through at least two springs, when the test device is in a non-testing state, the lower surface of the second convex strip overlaps and contacts with the upper surface of the corresponding first convex strip, and when the test device is in a testing state, the lower surface of the upper test seat is tightly fitted with the upper surface of the lower test seat and a gap is formed between the lower surface of the second convex strip and the upper surface of the corresponding first convex strip.
[0007] The further improved scheme in the above technical scheme is as follows: 1. In the above solution, each of the second convex strips is connected to the strip block via 4 to 8 springs that are evenly spaced along the length direction thereof.
[0008] 2. In the above solution, a mounting groove for the end of the spring to be embedded is provided on the upper surface of the second convex strip and / or the lower surface of the strip block.
[0009] 3. The above scheme also includes: a vertically arranged mounting base plate, on one side surface of which two vertical guide rails are installed at intervals and in parallel, the vertical portion of the support frame is connected to each vertical guide rail through at least two vertical sliders, so that the vertical guide rail can move in the vertical direction, and the upper test seat is installed on the horizontal portion of the support frame, and the horizontal portion is located at the upper end of the vertical portion and extends to the other side of the mounting base plate.
[0010] 4. In the above scheme, a horizontal base is installed on the other side surface of the mounting substrate and below the horizontal part of the support frame, and two horizontal guide rails are installed on the upper surface of the horizontal base in parallel and at intervals, and the lower surface of the movable plate is connected to each horizontal guide rail through at least two horizontal sliders.
[0011] 5. In the above scheme, a T-block is provided on the lower surface of the movable plate and between the two horizontal guide rails, a T-slot matching the T-block is provided on the horizontal base, and the T-block can be slidably embedded in the T-slot extending in the horizontal direction.
[0012] 6. In the above solution, a bidirectional slide is installed on the upper surface of the movable plate, and the lower test seat is installed on the bidirectional slide.
[0013] 7. In the above scheme, the lower surface of the lower test seat is connected to a lower substrate, a vacuum air pipe joint is installed on the side surface of the lower substrate, and a vacuum pipeline is arranged inside the lower test seat and the lower substrate, one end of the vacuum pipeline is connected to the sealing cavity, and the other end is connected to the vacuum air pipe joint.
[0014] 8. In the above solution, an annular groove is provided on the upper surface of the lower substrate and is located outside the vacuum pipeline, and an annular sealing strip is embedded and installed in the annular groove.
[0015] 9. In the above solution, a sealing strip is provided between the lower surface of the upper test seat and the upper surface of the lower test seat, and the sealing strip extends continuously along the edges of the upper test seat and the lower test seat.
[0016] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The adaptive chip testing device of the present invention, when in the testing state, the lower surface of the upper test seat and the upper surface of the lower test seat are tightly attached to form a sealed cavity for placing the chip to be tested in the groove area, and a PCB board and a partition are stacked in sequence above the upper test seat, and the fixedly connected upper test seat, PCB board and partition are connected to the support frame through a mounting plate arranged above the partition, one end of a pipeline passes through the mounting plate, the partition, the PCB board and the upper test seat in sequence and is connected to the sealed cavity, and the other end of the pipeline is used to connect with a high-pressure gas source, and the chip is protected by the high-pressure gas, which can improve the safety of the chip in the high-current and high-voltage testing state; further, a strip through hole is opened on the upper surface of the support frame, and the lower parts of the two opposite inner walls of the strip through hole each have a first convex strip, and the upper parts of the two opposite side surfaces of the mounting plate each have a second convex strip corresponding to and extending to the top of the first convex strip, each A strip block is arranged above the second convex strip, one side of the strip block is fixedly connected to the upper surface of the support frame, and the other side extends to directly above the second convex strip and is connected to the second convex strip through at least two springs. When in a non-test state, the lower surface of the second convex strip overlaps and contacts with the upper surface of the corresponding first convex strip. When in a test state, the lower surface of the upper test seat is tightly attached to the upper surface of the lower test seat and a gap is formed between the lower surface of the second convex strip and the upper surface of the corresponding first convex strip. After the upper and lower test seats are molded, the horizontal plane reference of the upper test seat can be transferred to the lower test seat, and the spring can absorb a small offset while continuously providing the mold clamping pressure, thereby ensuring a smooth fit between the upper and lower test seats, which can not only improve the overall sealing and pressure resistance performance of the test seat, but also ensure the consistency of the contact resistance between each test probe and the corresponding pad area on the chip, thereby improving the consistency of the test data. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Attached Figure 1 It is a structural schematic diagram of the adaptive chip testing device of the present invention; Attached Figure 2 The local structure diagram of the adaptive chip testing device of the present invention is shown in FIG. Figure 1 ; Attached Figure 3 For attachment Figure 2 Schematic diagram of the cross section along AA; Attached Figure 4 The local structure diagram of the adaptive chip testing device of the present invention is shown in FIG. Figure 2 ; Attached Figure 5 For attachment Figure 4 Schematic diagram of the cross section along BB; Attached Figure 6 For attachment Figure 5 The enlarged schematic diagram of the center C; Attached Figure 7The local structure diagram of the adaptive chip testing device of the present invention is shown in FIG. Figure 3 ; Attached Figure 8 A schematic diagram of an upper test socket of an adaptive chip testing device of the present invention; Attached Fig. 9 The local structure diagram of the adaptive chip testing device of the present invention is shown in FIG. Figure 4 ; Attached Fig.10 For attachment Fig. 9 Schematic diagram of the cross section along DD; Attached Fig.11 A schematic diagram of the film closing state of the adaptive chip testing device of the present invention; Attached Fig.12 For attachment Fig.11 The enlarged schematic diagram of point E in the middle; Attached Fig.13 For attachment Fig.11 Enlarged schematic diagram of point F in the middle.
[0018] In the above figures: 100, chip to be tested; 1, support frame; 101, vertical part; 102, horizontal part; 2, movable plate; 3, upper test seat; 4, lower test seat; 5, mounting plate; 6, strip through hole; 71, first convex strip; 72, second convex strip; 8, strip block; 9, spring; 10, gap; 11, mounting groove; 12, sealing cavity; 13, PCB board; 14, partition; 15, pipeline; 16, groove; 171, limit convex block; 172, avoidance groove; 18, sealing strip; 19, mounting groove; 22, screw Bolt; 23, nut; 24, lifting through hole; 25, lifting bolt; 251, column part; 252, cap body; 26, lifting nut; 27, avoidance groove; 28, countersunk groove; 29, gasket; 31, mounting base plate; 32, vertical guide rail; 33, vertical slider; 34, horizontal base; 35, horizontal guide rail; 36, horizontal slider; 37, T-block; 38, T-slot; 39, two-way slide; 40, lower base plate; 41, vacuum air pipe joint; 42, vacuum pipeline; 43, annular groove; 44, annular sealing strip. Implementation
[0019] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.
[0020] Embodiment 1: An adaptive chip testing device, comprising: a support frame 1 movable in the vertical direction and a movable plate 2 movable in the horizontal direction, an upper test seat 3 is installed on the support frame 1, a lower test seat 4 is installed on the movable plate 2 and can move with the movable plate 2 to the bottom of the upper test seat 3, a groove is provided on the lower surface of the upper test seat 3, when the chip tester is in the testing state, the lower surface of the upper test seat 3 is tightly attached to the upper surface of the lower test seat 4 and a sealed cavity 12 for placing the chip 100 to be tested is formed in the groove area, a PCB board 13 and a partition 14 are stacked in sequence above the upper test seat 3, the upper test seat 3, the PCB board 13 and the partition 14 fixedly connected are connected to the support frame 1 through a mounting plate 5 arranged above the partition 14, one end of a pipeline 15 passes through the mounting plate 5, the partition 14, the PCB board 13 and the upper test seat 3 in sequence and is connected to the sealed cavity 12, and the other end of the pipeline 15 is used to be connected to a high-pressure gas source; Move the movable plate to the loading and unloading station at one end of the horizontal base away from the mounting substrate to facilitate the placement and loading of the chip; The chip to be tested is placed in a designated area on the lower test seat above the movable plate, that is, above the test probes, through the loading mechanism, and multiple test probes are made to correspond one by one to the pad areas on the chip to be tested; A strip through hole 6 is provided on the upper surface of the support frame 1, and the lower parts of the two opposite inner walls of the strip through hole 6 each have a first convex strip 71, and the upper parts of the two opposite side surfaces of the mounting plate 5 each have a second convex strip 72 correspondingly extending to the top of the first convex strip 71, and a strip block 8 is provided above each of the second convex strips 72, one side of the strip block 8 is fixedly connected to the upper surface of the support frame 1, and the other side extends to the top of the second convex strip 72 and is connected to the second convex strip 72 through at least two springs 9. When the chip tester is in a non-testing state, the lower surface of the second convex strip 72 overlaps and contacts with the upper surface of the corresponding first convex strip 71, and when the chip tester is in a testing state, the lower surface of the upper test seat 3 is tightly fitted with the upper surface of the lower test seat 4, and a gap 10 is formed between the lower surface of the second convex strip 72 and the upper surface of the corresponding first convex strip 71; The test seat installed on the mounting plate continues to move downward with the support frame and is subjected to an upward reaction force from the lower support seat. Under the action of the reaction force, the two second convex strips on the mounting plate separate upward from the first convex strips on the support frame, thereby forming a gap between the second convex strips and the first convex strips, and the spring continuously applies a downward pressure to the two second convex strips on the mounting plate as a mold closing pressure. At this time, the upper test seat installed on the mounting plate is in a floating state, and the conversion of the plane reference of the upper test seat from the support frame to the lower test seat is realized, and the slight deviation on the horizontal plane is absorbed and balanced by the spring, thereby achieving a tight and flat fit between the upper and lower test seats.
[0021] Each of the second convex strips 72 is connected to the strip block 8 via five springs 9 which are arranged at equal intervals along the length direction thereof.
[0022] The upper surface of the second protruding strip 72 and the lower surface of the strip block 8 are each provided with a mounting groove 11 for the end of the spring 9 to be embedded.
[0023] The above also includes: a vertically arranged mounting base plate 31, on one side surface of which two vertical guide rails 32 are installed at intervals and in parallel, the vertical portion 101 of the support frame 1 and each vertical guide rail 32 are respectively connected by at least two vertical sliders 33, so that the vertical guide rail 32 can move in the vertical direction, and the upper test seat 3 is installed on the horizontal portion 102 of the support frame 1, and the horizontal portion 102 is located at the upper end of the vertical portion 101 and extends to the other side of the mounting base plate 31.
[0024] A horizontal base 34 is installed on the other side surface of the above-mentioned mounting substrate 31 and below the horizontal portion 102 of the support frame 1. Two horizontal guide rails 35 are installed in parallel and at intervals on the upper surface of the horizontal base 34. The lower surface of the movable plate 2 is connected to each horizontal guide rail 35 through at least two horizontal sliders 36.
[0025] A T-block 37 is disposed on the lower surface of the movable plate 2 and between the two horizontal guide rails 35 . A T-slot 38 cooperating with the T-block 37 is provided on the horizontal base 34 . The T-block 37 can be slidably embedded in the T-slot 38 extending in the horizontal direction.
[0026] A bidirectional slide 39 is installed on the upper surface of the movable plate 2 , and the lower test seat 4 is installed on the bidirectional slide 39 .
[0027] The lower surface of the lower test seat 4 is connected to a lower substrate 40, and a vacuum air pipe joint 41 is installed on the side surface of the lower substrate 40. A vacuum pipeline 42 is arranged inside the lower test seat 4 and the lower substrate 40. One end of the vacuum pipeline 42 is connected to the sealing cavity 12, and the other end is connected to the vacuum air pipe joint 41.
[0028] An annular groove 43 is formed on the upper surface of the lower substrate 40 and outside the vacuum pipe 42 . An annular sealing strip 44 is embedded in the annular groove 43 .
[0029] A sealing strip 18 is disposed between the lower surface of the upper test seat 3 and the upper surface of the lower test seat 4 , and the sealing strip 18 extends continuously along the edges of the upper test seat 3 and the lower test seat 4 .
[0030] Embodiment 2: A chip testing machine comprises: a support frame 1 movable in the vertical direction and a movable plate 2 movable in the horizontal direction, an upper test seat 3 is installed on the support frame 1, a lower test seat 4 is installed on the movable plate 2 and can move with the movable plate 2 to the bottom of the upper test seat 3, a groove is provided on the lower surface of the upper test seat 3 and the upper surface of the lower test seat 4, when the chip testing machine is in a testing state, the lower surface of the upper test seat 3 is tightly attached to the upper surface of the lower test seat 4 and a sealed cavity 12 for placing a chip 100 to be tested is formed in the groove area, a PCB board 13 and a partition 14 are stacked in sequence above the upper test seat 3, the upper test seat 3, the PCB board 13 and the partition 14 fixedly connected are connected to the support frame 1 through a mounting plate 5 arranged above the partition 14, one end of a pipeline 15 passes through the mounting plate 5, the partition 14, the PCB board 13 and the upper test seat 3 in sequence and is connected to the sealed cavity 12, and the other end of the pipeline 15 is used to be connected to a high-pressure gas source; The movable plate is pushed to move along the horizontal guide rail toward the mounting base plate by a horizontal driving component (such as a motor, a lead screw or a cylinder) until the lower test seat is moved to the test station directly below the upper test seat; The support frame is driven downward by a vertical drive component (such as a motor, a lead screw or a cylinder), during this process; After the upper and lower test seats are molded together, high-pressure nitrogen is injected into the sealed cavity for protection before testing; A strip through hole 6 is provided on the upper surface of the support frame 1, and the lower parts of the two opposite inner walls of the strip through hole 6 each have a first convex strip 71, and the upper parts of the two opposite side surfaces of the mounting plate 5 each have a second convex strip 72 correspondingly extending to the top of the first convex strip 71, and a strip block 8 is provided above each of the second convex strips 72, one side of the strip block 8 is fixedly connected to the upper surface of the support frame 1, and the other side extends to the top of the second convex strip 72 and is connected to the second convex strip 72 through at least two springs 9. When the chip tester is in a non-testing state, the lower surface of the second convex strip 72 overlaps and contacts with the upper surface of the corresponding first convex strip 71, and when the chip tester is in a testing state, the lower surface of the upper test seat 3 is tightly fitted with the upper surface of the lower test seat 4, and a gap 10 is formed between the lower surface of the second convex strip 72 and the upper surface of the corresponding first convex strip 71; As the support frame moves downward, the lower surface of the upper test seat first contacts the upper surface of the lower test seat, but there is still a slight deviation, which makes it impossible for the upper and lower test seats to completely fit together. The slight deviation on the horizontal plane is absorbed and balanced by the spring, thereby achieving a tight and flat fit between the upper and lower test seats.
[0031] Each of the second convex strips 72 is connected to the strip block 8 via seven springs 9 which are arranged at equal intervals along the length direction thereof.
[0032] A mounting groove 11 for the end of the spring 9 to be embedded is provided on the lower surface of the strip block 8 .
[0033] A bidirectional slide 39 is installed on the upper surface of the movable plate 2 , and the lower test seat 4 is installed on the bidirectional slide 39 .
[0034] The lower surface of the lower test seat 4 is connected to a lower substrate 40, and a vacuum air pipe joint 41 is installed on the side surface of the lower substrate 40. A vacuum pipeline 42 is arranged inside the lower test seat 4 and the lower substrate 40. One end of the vacuum pipeline 42 is connected to the sealing cavity 12, and the other end is connected to the vacuum air pipe joint 41.
[0035] An installation groove 19 for the lower portion of the sealing strip 18 to be embedded is provided at the edge of the upper surface of the lower test seat 4 , and the upper surface of the sealing strip 18 is higher than the upper surface of the lower test seat 4 .
[0036] The stacked partition 14, PCB board 13 and upper test seat 3 are fixedly connected by at least two sets of bolts 22 and nuts 23. A plurality of lifting through holes 24 are opened on the upper surface of the mounting plate 5. A lifting bolt 25 passes through the lifting through hole 24 and is threadedly connected with a lifting nut 26 embedded and installed on the partition 14. The inner diameter of the lifting through hole 24 is larger than the outer diameter of the columnar portion 251 of the lifting bolt 25. A gasket 26 is mounted on the columnar portion 251 of the lifting bolt 25. The gasket 26 is located between the upper surface of the mounting plate 5 and the cap portion 252 of the lifting bolt 25. The mounting plate 5 is installed on a support frame 1 that can move in the vertical direction.
[0037] The inner diameter of the hanging through hole 24 is larger than the outer diameter of the cap body 252 of the hanging bolt 25 .
[0038] Each of the four bolts 22 passes through the upper test seat 3 , the PCB board 13 and the partition 14 in sequence from bottom to top and is threadedly connected with the nut 23 located above the partition 14 .
[0039] The lower surface of the mounting plate 5 is provided with four avoidance grooves 27 for the nuts 23 to be inserted into, and the inner diameter of the avoidance grooves 27 is much larger than the outer diameter of the nuts 23 .
[0040] The lower surface of the upper test seat 3 is provided with a countersunk groove 28 for the head of the nut 23 to be embedded.
[0041] The working principle of the present invention is as follows: Move the movable plate to the loading and unloading station at one end of the horizontal base away from the mounting substrate to facilitate the placement and loading of the chip; The chip to be tested is placed on a designated area on the lower test seat above the movable plate through a loading mechanism (i.e., above the test probes, and multiple test probes correspond to pad areas on the chip to be tested one by one); The movable plate is pushed to move along the horizontal guide rail toward the mounting base plate by a horizontal driving component (such as a motor, a lead screw or a cylinder) until the lower test seat is moved to the test station directly below the upper test seat; The support frame is driven downward by a vertical drive component (such as a motor, a lead screw or a cylinder). During this process: First, the lower surface of the upper test seat that moves downward with the support frame first contacts the upper surface of the lower test seat, but there is still a slight deviation so that the upper and lower test seats cannot be completely fitted together; Next, the test seat installed on the mounting plate continues to move downward with the support frame and is subjected to an upward reaction force from the lower support seat. Under the action of the reaction force, the two second convex strips on the mounting plate separate upward from the first convex strip on the support frame, thereby forming a gap between the second convex strip and the first convex strip, and the spring continuously applies a downward pressure to the two second convex strips on the mounting plate as a mold clamping pressure. At this time, the upper test seat installed on the mounting plate is in a floating state, and the conversion of the upper test seat plane reference from the support frame to the lower test seat is realized, and the slight deviation on the horizontal plane is balanced by the spring, thereby achieving a tight and flat fit between the upper and lower test seats, which can not only improve the overall sealing and pressure resistance of the test seat, but also ensure the consistency of the contact resistance between each test probe and the corresponding pad area on the chip, thereby improving the consistency of the test data and avoiding sparking and probe ablation caused by poor contact under high pressure environment; After the upper and lower test seats are molded together, high-pressure nitrogen is injected into the sealed cavity for protection before testing; After the test is completed, the mold is opened, and the movable plate drives the lower test seat to move back to the loading and unloading station. The chip that has completed the test is then taken away by the unloading mechanism, and the loading mechanism re-inserts the next chip to be tested.
[0042] When the above-mentioned chip testing machine is used, it protects the chip through high-pressure gas, which can improve the safety of the chip under high-current and high-voltage testing conditions; after the upper and lower test seats are molded, the horizontal plane reference of the upper test seat can be transferred to the lower test seat, and the spring can be used to absorb slight offsets while continuously providing mold clamping pressure, thereby ensuring a smooth fit between the upper and lower test seats, which can not only improve the overall sealing and pressure resistance of the test seat, but also ensure the consistency of the contact resistance between each test probe and the corresponding pad area on the chip, thereby improving the consistency of the test data.
[0043] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.
Claims
1. An adaptive chip testing device, comprising: A support frame (1) movable in the vertical direction and a movable plate (2) movable in the horizontal direction, an upper test seat (3) being mounted on the support frame (1), and a lower test seat (4) being mounted on the movable plate (2) and being movable with the movable plate (2) to be directly below the upper test seat (3), characterized in that a groove is provided on the lower surface of the upper test seat (3) and / or the upper surface of the lower test seat (4), and when the test device is in a test state, the lower surface of the upper test seat (3) is tightly attached to the upper surface of the lower test seat (4) and a groove for placing the test device is formed in the groove area. A sealed cavity (12) is provided with a chip to be tested (100), a PCB board (13) and a partition (14) are sequentially stacked above the upper test seat (3), the upper test seat (3), the PCB board (13) and the partition (14) being fixedly connected are connected to the support frame (1) via a mounting plate (5) disposed above the partition (14), one end of a pipeline (15) passes through the mounting plate (5), the partition (14), the PCB board (13) and the upper test seat (3) in sequence and is in communication with the sealed cavity (12), and the other end of the pipeline (15) is used to be in communication with a high-pressure gas source; The upper surface of the support frame (1) is provided with a strip through hole (6), and the lower parts of the two opposite inner walls of the strip through hole (6) each have a first convex strip (71). The upper parts of the two opposite side surfaces of the mounting plate (5) each have a second convex strip (72) corresponding to and extending to the top of the first convex strip (71). A strip block (8) is provided above each of the second convex strips (72), one side of the strip block (8) is fixedly connected to the upper surface of the support frame (1), and the other side extends to the top of the second convex strip (72) and is connected to the second convex strip (72) via at least two springs (9). When the test device is in a non-testing state, the lower surface of the second convex strip (72) overlaps and contacts the upper surface of the corresponding first convex strip (71). When the test device is in a testing state, the lower surface of the upper test seat (3) is tightly fitted with the upper surface of the lower test seat (4), and a gap (10) is formed between the lower surface of the second convex strip (72) and the upper surface of the corresponding first convex strip (71).
2. The adaptive chip testing device according to claim 1, characterized in that: Each of the second convex strips (72) is connected to the strip-shaped block (8) via 4 to 8 springs (9) arranged at equal intervals along the length direction thereof.
3. The adaptive chip testing device according to claim 1 or 2, characterized in that: An installation groove (11) for the end of the spring (9) to be embedded is provided on the upper surface of the second convex strip (72) and / or the lower surface of the strip block (8).
4. The adaptive chip testing device according to claim 1, characterized in that: Also includes: A mounting base plate (31) is arranged vertically, and two vertical guide rails (32) are installed on a surface of one side of the mounting base plate (31) at intervals and in parallel. The vertical portion (101) of the support frame (1) and each vertical guide rail (32) are respectively connected by at least two vertical sliders (33) so that the vertical guide rails (32) can move in the vertical direction. The upper test seat (3) is installed on the horizontal portion (102) of the support frame (1), and the horizontal portion (102) is located at the upper end of the vertical portion (101) and extends to the other side of the mounting base plate (31).
5. The adaptive chip testing device according to claim 4, characterized in that: A horizontal base (34) is installed on the other side surface of the mounting substrate (31) and below the horizontal portion (102) of the support frame (1). Two horizontal guide rails (35) are installed in parallel and at intervals on the upper surface of the horizontal base (34). The lower surface of the movable plate (2) is connected to each horizontal guide rail (35) via at least two horizontal sliders (36).
6. The adaptive chip testing device according to claim 5, characterized in that: A T-shaped block (37) is provided on the lower surface of the movable plate (2) and between the two horizontal guide rails (35); a T-shaped slot (38) cooperating with the T-shaped block (37) is provided on the horizontal base (34); the T-shaped block (37) is slidably embedded in the T-shaped slot (38) extending in the horizontal direction.
7. The adaptive chip testing device according to claim 1, characterized in that: A bidirectional slide table (39) is installed on the upper surface of the movable plate (2), and the lower test seat (4) is installed on the bidirectional slide table (39).
8. The adaptive chip testing device according to claim 1, characterized in that: The lower surface of the lower test seat (4) is connected to a lower base plate (40), a vacuum air pipe joint (41) is installed on the side surface of the lower base plate (40), and a vacuum pipeline (42) is arranged inside the lower test seat (4) and the lower base plate (40), one end of the vacuum pipeline (42) is connected to the sealing cavity (12), and the other end is connected to the vacuum air pipe joint (41).
9. The adaptive chip testing device according to claim 9, characterized in that: An annular groove (43) is provided on the upper surface of the lower substrate (40) and located outside the vacuum pipeline (42), and an annular sealing strip (44) is embedded and installed in the annular groove (43).
10. The adaptive chip testing device according to claim 1, characterized in that: A sealing strip (18) is provided between the lower surface of the upper test seat (3) and the upper surface of the lower test seat (4), and the sealing strip (18) extends continuously along the edges of the upper test seat (3) and the lower test seat (4).