Ultrathin backlight lamp structure and processing method of ultrathin backlight lamp structure

Abstract

The invention provides an ultra-thin backlight lamp structure and a processing method of the ultra-thin backlight lamp structure, the ultra-thin backlight lamp structure comprises a circuit board, a plurality of light-emitting modules arrayed on the circuit board, a plurality of light guide plate modules and a shading film, the light-emitting modules are provided with LED light-emitting units, each light guide plate module is arranged corresponding to one light-emitting module, and the shading film is arranged on the circuit board. The light guide plate module comprises LGP plates provided with mounting holes in the axial direction, reflective sheets are arranged on the first end faces of the side walls of the LGP plates in the circumferential direction and the axial direction of the side walls of the LGP plates, dot glue is printed on the reflective sheets located on the first end faces, and the LGP plates are sequentially in butt joint and arranged on the circuit board. The backlight structure solves the problem that in the prior art, in order to enable the backlight structure to evenly emit light, the thickness or cost of the backlight structure is increased.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an ultra-thin backlight structure and a processing method of the ultra-thin backlight structure. Background Art

[0002] In order to achieve uniform illumination of the screen, it may be necessary to improve the backlight structure or add more LED (Light Emitting Diode) light-emitting units to the backlight structure. Specifically, a lens can be added to the LED light-emitting unit to increase the light-emitting angle of the LED light-emitting unit. In this way, the number of LED light-emitting units does not need to be increased, but after adding the lens, the thickness of the entire backlight structure becomes larger, which cannot meet the customer's requirements for ultra-thinness; in the current practice, the LED light-emitting units can also be arranged in a star-studded manner, that is, the purpose of uniform illumination is met by increasing the number of LED light-emitting units, which can make the backlight structure extremely thin. However, when this is set up, the number of LED light-emitting units per unit area increases, and the light diffusion of two adjacent LED light-emitting units is very serious, which will cause the formation of light rhyme in the LCD display screen. In addition, this method of increasing the density of LED light-emitting units will make it difficult to route the PCB circuit because the distance between two adjacent LED light-emitting units is very small. Basically, a double-layer or even four-layer circuit board is required, which greatly increases the cost compared to a single-layer circuit board.

[0003] It can be seen that in the prior art, in order to make the backlight structure emit light uniformly, there is a problem that the thickness of the backlight structure is increased or the cost is increased. Summary of the invention

[0004] The purpose of the present invention is to provide an ultra-thin backlight structure and a processing method of the ultra-thin backlight structure, so as to solve the problem in the prior art that in order to make the backlight structure emit light uniformly, the thickness of the backlight structure is increased or the cost is increased.

[0005] In order to achieve the above-mentioned purpose of the present invention, an embodiment of the present invention provides an ultra-thin backlight structure, including a circuit board, a plurality of light-emitting modules arrayed on the circuit board, and a plurality of light guide plate modules, the light-emitting module having an LED light-emitting unit, each light guide plate module being arranged corresponding to a light-emitting module, the light guide plate module comprising an LGP plate having an axial mounting hole, a reflective sheet being arranged on the side wall circumferentially and on the first end face in the axial direction of the LGP plate, a dot glue being printed on the reflective sheet located on the first end face, a plurality of the LGP plates being butt-jointed in sequence and arranged on the circuit board, so that each of the LED light-emitting units is embedded in the mounting hole of the LGP plate corresponding thereto, and the first end face of the LGP plate is arranged toward the circuit board.

[0006] As a further improvement of an embodiment of the present invention, the LGP board has a second end face in its axial direction, the second end face is arranged opposite to the first end face, and the second end faces of a plurality of LGP boards are connected to form a light-transmitting plane.

[0007] As a further improvement of an embodiment of the present invention, it further includes a light-shielding film, and the light-shielding film is arranged on a side of the mounting hole facing away from the circuit board to shield the mounting hole.

[0008] As a further improvement of an embodiment of the present invention, a support film and a multi-layer optical film are sequentially overlapped on the second end surface in a direction away from the circuit board, and the light shielding film is formed on the support film; And / or, a transparent light-transmitting layer and / or a diffusion plate layer are further arranged between the light-shielding film and the multiple layers of the optical film.

[0009] As a further improvement of one embodiment of the present invention, the light-emitting module includes a double-sided PCB board, the LED light-emitting unit is arranged on one side of the double-sided PCB board through the SMT method, and the other side of the double-sided PCB board is connected to the circuit board through the SMT method.

[0010] As a further improvement of an embodiment of the present invention, at least three positioning feet that are not located on the same straight line are provided on the first end face of the LGP board, and the LGP board is connected to the circuit board through the positioning feet. In the direction parallel to the axial direction of the LGP board, the height of the positioning feet is not less than the thickness of the double-sided PCB board.

[0011] As a further improvement of an embodiment of the present invention, the positioning pin is connected to the circuit board through SMT.

[0012] As a further improvement of one embodiment of the present invention, the LED light-emitting unit includes a light-emitting body, an LED substrate, and a first reflective layer and a second reflective layer arranged in sequence along a direction away from the circuit board, the first reflective layer and the second reflective layer are arranged opposite to each other, and the light-emitting body is welded on the LED substrate and is located between the first reflective layer and the second reflective layer.

[0013] As a further improvement of an embodiment of the present invention, the light-emitting body is configured as any one of an LED chip, a blue light LED and an LED with phosphor.

[0014] An embodiment of the present invention further provides a method for processing an ultra-thin backlight structure, comprising the following steps: Solder multiple light-emitting modules to the circuit board through SMT method; The LED light-emitting unit of each light-emitting module is embedded into the mounting hole of the LGP board in a corresponding light guide plate module; A plurality of LGP boards are sequentially butt-jointed on the circuit board and the first end surface of each LGP board faces the circuit board.

[0015] As a further improvement of an embodiment of the present invention, after the step of “arranging a plurality of LGP boards on the circuit board in sequence and making the first end surface of each LGP board face the circuit board”, the following is further included: The light shielding film is arranged on the side of the mounting hole facing away from the circuit board.

[0016] As a further improvement of an embodiment of the present invention, before the step of “arranging the light shielding film on the side of the mounting hole facing away from the circuit board”, the following steps are further included: growing a light-shielding layer on the support film; The light-shielding layer is cured to form a light-shielding film; After “arranging the light shielding film on the side of the mounting hole facing away from the circuit board”, the method further includes: stacking multiple layers of optical films in sequence on the supporting film in a direction away from the circuit board; And / or, a transparent light-transmitting layer and / or a diffusion plate layer is further arranged between the support film and the multi-layer optical film.

[0017] As a further improvement of an embodiment of the present invention, before the step of “welding the plurality of light-emitting modules to the circuit board by SMT”, the following steps are further included: forming a light-emitting module; The “forming a light-emitting module” specifically includes: Generate LED light-emitting units; The LED light-emitting unit is soldered to one side of the double-sided PCB board by SMT method.

[0018] As a further improvement of an embodiment of the present invention, the “soldering the plurality of light-emitting modules onto the circuit board by SMT” is specifically: The other side of the double-sided PCB is soldered to the circuit board by SMT.

[0019] As a further improvement of an embodiment of the present invention, the “generating LED light emitting unit” is specifically: The upper surface of the LED substrate is plated with mirror silver to form a first reflective layer; The light-emitting body die bonding wire is glued onto the LED substrate, wherein the light-emitting body is any one of an LED chip, a blue light LED and an LED with phosphor; The second reflective layer is formed by plating bright silver on the side of the glue away from the first reflective layer.

[0020] As a further improvement of an embodiment of the present invention, before “embedding the LED light-emitting unit of each light-emitting module into the mounting hole of the LGP board in a corresponding light guide plate module”, the following steps are further included: forming a light guide plate module; The “forming a light guide plate module” specifically includes: Get the LGP board and set mounting holes along its axis; A reflective sheet is attached to the circumference of the side wall of the LGP board; Obtain a reflective sheet for attaching to a first end surface of the LGP plate in the axial direction; Applying a dot glue on the reflective sheet for attachment to the first end surface and curing the dot glue; The reflective sheet coated with the dotted glue is attached to the first end surface.

[0021] As a further improvement of an embodiment of the present invention, the “arranging a plurality of LGP boards in sequence on a circuit board with the first end surface of each LGP board facing the circuit board” is specifically: A plurality of positioning pins are arranged on the first end surface of each LGP board, wherein the plurality of positioning pins include at least three positioning pins that are not located on the same straight line; The positioning feet of the plurality of LGP boards are connected to the circuit board and the second end faces of the plurality of LGP boards in the axial direction are butted in sequence.

[0022] Compared with the prior art, the present invention has the following beneficial effects: The light emitted by the LED light-emitting unit enters the LGP board through the hole wall of the mounting hole, and is reflected by the reflective sheet on the side wall of the LGP board and the reflective sheet on the first end surface, so that the light is evenly transmitted outward relative to the first end surface. The mesh glue can cause the light to be refracted and reflected multiple times inside the LGP board 31, thereby improving the overall performance and display quality of the backlight source. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of an ultra-thin backlight structure provided by an embodiment of the present invention; Figure 2 for Figure 1 A structural schematic diagram of a light emitting module and a light guide plate module cooperating therewith; Figure 3 for Figure 2 A schematic diagram of the structure of the middle light guide plate module; Figure 4 for Figure 2 A schematic diagram of the structure of the light-emitting module; Figure 5 A flow chart of a method for processing an ultra-thin backlight structure provided by the present invention; Figure 6 A flow chart of forming a light-emitting module in the ultra-thin backlight structure processing method provided by the present invention; Figure 7 The present invention provides a flow chart for forming a light guide plate module in the method for processing the ultra-thin backlight structure.

[0024] The above description of the drawings includes the following reference numerals: 1. Circuit board; 2. Light-emitting module; 21. LED light-emitting unit; 211. Light-emitting body; 212. LED substrate; 213. First reflection layer; 214. Second reflection layer; 22. Double-sided PCB board; 3. Light guide plate module; 31. LGP plate; 311. Mounting hole; 312, 313. Reflector; 3131. Grid glue; 314. First end surface; 315. Positioning foot; 316. Second end surface; 4. Shading film; 5. Support film; 6. Optical film; 7. Transparent light-transmitting layer; 8. Diffuser layer; 9. Back panel. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0026] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0027] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention.

[0028] In order to solve the problem in the prior art that the thickness of the backlight structure is increased or the cost is increased in order to make the backlight structure emit light uniformly, the present invention provides an ultra-thin backlight structure and a processing method of the ultra-thin backlight structure.

[0029] like Figure 1-4As shown, an embodiment of the present invention provides an ultra-thin backlight structure, including a circuit board 1, a plurality of light-emitting modules 2 arrayed on the circuit board, a plurality of light guide plate modules 3 and a shading film 4, the light-emitting module 2 having an LED light-emitting unit 21, each light guide plate module 3 corresponding to a light-emitting module 2, the light guide plate module 3 including an LGP plate 31 having an axial mounting hole 311, a side wall of the LGP plate 31 having a circumferential direction and a first end face 314 in an axial direction thereof provided with reflective sheets 312 and 313, a dot glue 3131 is printed on the reflective sheet 313 located on the first end face, a plurality of the LGP plates 31 are sequentially butt-jointed and arranged on the circuit board 1, so that each of the LED light-emitting units 21 is embedded in the corresponding mounting hole 311 of the LGP plate, and the first end face 314 of the LGP plate is arranged toward the circuit board 1.

[0030] With such arrangement, the light emitted by the LED light-emitting unit enters the LGP board through the hole wall of the mounting hole 311, and is reflected by the reflective sheet 312 on the side wall of the LGP board and the reflective sheet 313 on the first end surface, thereby uniformly transmitting light outward relative to the first end surface. The mesh glue 3131 can cause the light to be refracted and reflected multiple times inside the LGP board 31, thereby improving the overall performance and display quality of the backlight source.

[0031] It should be noted that in Figure 1 In 2, arrows are used to mark the propagation paths of light inside and on the surface of the LGP board. This marking is only to make it easier for observers to understand the technical solution.

[0032] refer to Figure 1-3 It is shown that the LGP plate has a second end face 315 in the axial direction, and the second end face 315 is arranged opposite to the first end face 314. The second end faces 315 of the plurality of LGP plates are connected to form a light-transmitting plane. In this way, the light-transmitting plane can form a surface light source, and the remaining film materials for adjusting light can be evenly laid on the light-transmitting plane.

[0033] Further, refer to Figure 1 As shown, the ultra-thin backlight structure further includes a light shielding film 4, which is disposed on the side of the mounting hole 311 facing away from the circuit board 1 to shield the mounting hole 311. This prevents the light emitted by the LED light-emitting unit 21 from leaking out of the mounting hole 311. This makes the overall lighting effect of the ultra-thin backlight structure better and avoids local bright spots.

[0034] In the backlight field, it is understandable that other films and a multilayer optical film 6 are usually disposed on the second end surface 316. Optionally, the other films can be configured as a support film 5 for fixing the light-shielding film.

[0035] Specifically, the support film 5 and the multi-layer optical film 6 can be sequentially overlapped and arranged on the second end surface 316 in a direction away from the circuit board 1 , and the light shielding film 4 is formed on the support film 5 .

[0036] In this arrangement, the shading film 4 can block the light emitted by the LED light-emitting unit located in the mounting hole 311 away from the circuit board 1, the supporting film 5 can allow the light transmitted from the light-transmitting plane formed by the plurality of second end faces 316 to pass through, and the multi-layer optical film 6 can adjust the light emitted from the LGP board 31 to reduce light diffusion, thereby reducing the light rhyme generated during regional control.

[0037] Furthermore, a transparent light-transmitting layer 7 and / or a diffusion plate layer 8 may be provided between the light-shielding film 4 and the multi-layer optical film 6 to further adjust the light transmitted from the light-transmitting plane.

[0038] Next reference Figure 2 As shown in FIG4 , the light emitting module 2 includes a double-sided PCB board 22, the LED light emitting unit 21 is arranged on one side of the double-sided PCB 22 by SMT, and the other side of the double-sided PCB board 22 is connected to the circuit board 1 by SMT.

[0039] In this embodiment, the material of the double-sided PCB board can be FR4 or CM-3 or other specifications, and the present invention does not limit this, and those skilled in the art can set it according to actual needs.

[0040] It should be noted that in the present embodiment, the electrical connections between the LED light-emitting unit 21 and the double-sided PCB board, and between the double-sided PCB board and the circuit board are all connected through SMT (Surface Mount Technology). This surface mounting technology has high assembly density, high reliability, and good high-frequency characteristics; moreover, it has strong design flexibility and is also conducive to automated production to reduce costs.

[0041] Next, refer to Figure 3 As best shown, at least three positioning pins 315 which are not located in the same straight line are provided on the first end surface 314 of the LGP board. At least three positioning pins 315 which are not located in the same straight line can define a plane. The LGP board 31 is connected to the circuit board 1 through the positioning pins 315, so as to form a stable fixing effect.

[0042] Furthermore, in the direction parallel to the axial direction of the LGP board 31, the height of the positioning pin 315 is not less than the thickness of the double-sided PCB board 22. The double-sided PCB board 22 can be set to a very thin style, and the positioning pin 315 can be set according to the thickness of the double-sided PCB board. In general, the entire backlight structure can be set to be relatively thin.

[0043] It can be understood that there is a certain space between the LGP board 31 and the back plate 9, and there is a gap between the positioning feet 315 and the double-sided PCB board. In this gap, the circuit board 1 can be riveted to the back plate 9 of the BLU (BackLight Unit) by screw riveting.

[0044] Optionally, in this embodiment, the positioning pins 315 are connected to the circuit board 1 by SMT. Such connection is fast and convenient.

[0045] Next reference Figure 4 As shown, the LED light-emitting unit 21 includes a light-emitting body 211, an LED substrate 212, and a first reflective layer 213 and a second reflective layer 214 sequentially arranged in a direction away from the circuit board 1, the first reflective layer 213 and the second reflective layer 214 are arranged opposite to each other, and the light-emitting body 211 is welded on the LED substrate 212 and is located between the first reflective layer 213 and the second reflective layer 214. The first reflective layer 213 and the second reflective layer 214 are substantially perpendicular to the axial direction of the LGP board 31, so the first reflective layer 213 and the second reflective layer 214 can limit the light emitted by the light-emitting body 211 to be emitted into the LGP board 31 in a direction substantially perpendicular to the axial direction of the LGP board 31, thereby ensuring that sufficient light enters the LGP board 31.

[0046] Optionally, in this embodiment, the light emitting body can be configured as any one of an LED chip, a blue light LED, and an LED with phosphor.

[0047] An embodiment of the present invention further provides a method for processing an ultra-thin backlight structure. The method for processing an ultra-thin backlight structure is implemented based on the above-mentioned ultra-thin backlight structure.

[0048] Among them, reference Figure 5 As shown, the processing method of the ultra-thin backlight structure mainly includes the following steps: S201: soldering a plurality of light-emitting modules 2 to a circuit board 1 by SMT method; S202: embedding the LED light-emitting unit 21 of each light-emitting module into the mounting hole 311 of the LGP plate 31 in a corresponding light guide plate module; S203: multiple LGP plates 31 are sequentially butt-jointed on the circuit board 1 and the first end surface 314 of each LGP plate faces the circuit board 1.

[0049] Furthermore, in this embodiment, after step S203, the following steps are further included: S204: The light shielding film 4 is arranged on the side of the mounting hole 311 facing away from the circuit board 1. This can prevent the light emitted by the LED light emitting unit 21 from leaking out from the side of the mounting hole 311 facing away from the circuit board 1, and effectively avoid the bright spots generated locally by the ultra-thin backlight structure.

[0050] Optionally, before “arranging the light shielding film on the side of the mounting hole facing away from the circuit board”, the method further includes: Growing a light shielding layer on the support film 5; The light shielding layer is cured to form the light shielding film 4. The main process is to form the light shielding film 4 on the support film 5.

[0051] Further, after “arranging the light shielding film on the side of the mounting hole facing away from the circuit board”, the method further includes: A plurality of optical films 6 are sequentially stacked on the support film 5 in a direction away from the circuit board 1; And / or, a transparent light-transmitting layer 7 and / or a diffusion plate layer 8 is further disposed between the support film 5 and the multilayer optical film 6 .

[0052] In an embodiment of the present invention, before "welding the plurality of light-emitting modules onto the circuit board by SMT method", the step further includes: forming the light-emitting modules.

[0053] The process of forming the light-emitting module can be specifically referred to Figure 6 As shown, it includes the following steps, specifically: Generate LED light-emitting units; S214: soldering the LED light emitting unit to one side of the double-sided PCB board by SMT method.

[0054] In this embodiment, generating the LED light-emitting unit further includes the following steps: S211: plating mirror silver on the upper surface of the LED substrate to form a first reflective layer; S212: Pressing the bonding wires of the light-emitting body onto the LED substrate, wherein the light-emitting body is any one of an LED chip, a blue light LED, and an LED with phosphor; S213: Plating bright silver on the side of the adhesive away from the first reflective layer to form a second reflective layer.

[0055] It can be understood that in this embodiment, the “soldering the plurality of light-emitting modules onto the circuit board by SMT” specifically includes: The other side of the double-sided PCB is soldered to the circuit board by SMT.

[0056] In this embodiment, before “embedding the LED light-emitting unit of each light-emitting module into the mounting hole of the LGP board in a corresponding light guide plate module”, the following steps are also included: A light guide plate module is formed.

[0057] Specifically, refer to Figure 7 As shown, the “forming a light guide plate module” is specifically: S221: Obtain the LGP board and set mounting holes along its axis; S222: attaching a reflective sheet on the circumferential direction of the side wall of the LGP board; S223: Obtain a reflective sheet for attaching to the first end surface of the LGP board in the axial direction; S224: applying a dot glue on the reflective sheet to be attached to the first end surface and curing the dot glue; S225: Attach the reflective sheet coated with the dotted glue to the first end surface.

[0058] Further, in this embodiment, the “arrange a plurality of LGPs on the circuit board in sequence and make the first end surface of each LGP board face the circuit board” is specifically: A plurality of positioning pins are arranged on the first end surface of each LGP board, wherein the plurality of positioning pins include at least three positioning pins that are not located on the same straight line; The positioning feet of the plurality of LGP boards are connected to the circuit board and the second end faces of the plurality of LGP boards in the axial direction are butted in sequence.

[0059] In summary, the embodiments of the present invention achieve the following technical effects: 1) The light emitted by the LED light-emitting unit enters the LGP board through the hole wall of the mounting hole 311, and is reflected by the reflective sheet 312 on the side wall of the LGP board and the reflective sheet 313 on the first end surface, so that the light is evenly transmitted outward relative to the first end surface. The mesh glue 3131 can cause the light to be refracted and reflected multiple times inside the LGP board 31, thereby improving the overall performance and display quality of the backlight source; 2) The light shielding film is arranged on the side of the mounting hole facing away from the circuit board 1, which can prevent the light emitted by the LED light emitting unit 21 from leaking out of the mounting hole 311. This makes the overall lighting effect of the entire ultra-thin backlight structure better and avoids local bright spots.

[0060] Obviously, the embodiments described above are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0061] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0062] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0063] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An ultra-thin backlight structure, characterized in that: It includes a circuit board, a plurality of light-emitting modules arrayed on the circuit board, and a plurality of light guide plate modules, wherein the light-emitting module has an LED light-emitting unit, and each light guide plate module is arranged corresponding to a light-emitting module, and the light guide plate module includes an LGP plate with an axial mounting hole, and a reflective sheet is arranged on the circumferential direction of the side wall of the LGP plate and the first end face in the axial direction, and a dot glue is printed on the reflective sheet located on the first end face, and the plurality of LGP plates are sequentially connected and arranged on the circuit board, so that each of the LED light-emitting units is embedded in the mounting hole of the LGP plate corresponding thereto, and the first end face of the LGP plate is arranged toward the circuit board.

2. The ultra-thin backlight structure according to claim 1, characterized in that: The LGP plate has a second end surface in the axial direction thereof, the second end surface is arranged opposite to the first end surface, and the second end surfaces of a plurality of LGP plates are connected to form a light-transmitting plane.

3. The ultra-thin backlight structure according to claim 2, characterized in that: It also includes a light shielding film, which is arranged on a side of the mounting hole facing away from the circuit board to shield the mounting hole.

4. The ultra-thin backlight structure according to claim 3, characterized in that: A support film and a multi-layer optical film are sequentially overlapped on the second end surface in a direction away from the circuit board, and the light shielding film is formed on the support film; And / or, a transparent light-transmitting layer and / or a diffusion plate layer are further arranged between the light-shielding film and the multiple layers of the optical film.

5. The ultra-thin backlight structure according to claim 1, characterized in that: The light-emitting module comprises a double-sided PCB board, the LED light-emitting unit is arranged on one side of the double-sided PCB board by SMT, and the other side of the double-sided PCB board is connected to the circuit board by SMT.

6. The ultra-thin backlight structure according to claim 5, characterized in that: At least three positioning feet that are not located on the same straight line are provided on the first end surface of the LGP board. The LGP board is connected to the circuit board through the positioning feet. In the direction parallel to the axial direction of the LGP board, the height of the positioning feet is not less than the thickness of the double-sided PCB board.

7. The ultra-thin backlight mechanism according to claim 6, characterized in that: The positioning pins are connected to the circuit board via SMT.

8. The ultra-thin backlight structure according to claim 1, characterized in that: The LED light-emitting unit includes a light-emitting body, an LED substrate, and a first reflective layer and a second reflective layer arranged in sequence in a direction away from the circuit board. The first reflective layer and the second reflective layer are arranged opposite to each other. The light-emitting body is welded on the LED substrate and is located between the first reflective layer and the second reflective layer.

9. The ultra-thin backlight structure according to claim 8, characterized in that: The light emitting body is configured to be any one of an LED chip, a blue light LED and an LED with phosphor.

10. A method for processing an ultra-thin backlight structure, characterized in that: The steps include: Solder multiple light-emitting modules to the circuit board through SMT method; The LED light-emitting unit of each light-emitting module is embedded into the mounting hole of the LGP board in a corresponding light guide plate module; A plurality of LGP boards are sequentially butt-jointed on the circuit board and the first end surface of each LGP board faces the circuit board.

11. The method for processing an ultra-thin backlight structure according to claim 10, characterized in that: After the step of "arranging a plurality of LGP boards in sequence on the circuit board and making the first end surface of each LGP board face the circuit board", the method further includes: The light shielding film is arranged on the side of the mounting hole facing away from the circuit board.

12. The processing method of the ultra-thin backlight structure according to claim 11, characterized in that: Before the step of “arranging the light shielding film on the side of the mounting hole facing away from the circuit board”, the method further includes: growing a light-shielding layer on the support film; The light-shielding layer is cured to form a light-shielding film; After the step of “arranging the light shielding film on the side of the mounting hole facing away from the circuit board”, the method further includes: stacking multiple layers of optical films in sequence on the supporting film in a direction away from the circuit board; And / or, a transparent light-transmitting layer and / or a diffusion plate layer is further arranged between the support film and the multi-layer optical film.

13. The method for processing an ultra-thin backlight structure according to claim 10, characterized in that: The method of "welding a plurality of light-emitting modules to a circuit board by SMT" also includes: forming a light-emitting module; Wherein, the “forming a light-emitting module” specifically includes: Generate LED light-emitting units; The LED light-emitting unit is soldered to one side of the double-sided PCB board by SMT method.

14. The method for processing an ultra-thin backlight structure according to claim 13, characterized in that: The “soldering a plurality of light-emitting modules onto a circuit board by SMT” specifically includes: The other side of the double-sided PCB is soldered to the circuit board by SMT.

15. The method for processing an ultra-thin backlight structure according to claim 13, characterized in that: The "generating LED light emitting unit" is specifically: The upper surface of the LED substrate is plated with mirror silver to form a first reflective layer; The light-emitting body die bonding wire is glued onto the LED substrate, wherein the light-emitting body is any one of an LED chip, a blue light LED and an LED with phosphor; The second reflective layer is formed by plating bright silver on the side of the glue away from the first reflective layer.

16. The method for processing an ultra-thin backlight structure according to claim 10, characterized in that: Before "embedding the LED light-emitting unit of each light-emitting module into the mounting hole of the LGP board in a corresponding light guide plate module", the method further includes: forming a light guide plate module; Wherein, the “forming a light guide plate module” is specifically: Obtain an LGP board and set mounting holes along its axial direction; A reflective sheet is attached to the circumference of the side wall of the LGP board; Obtain a reflective sheet for attaching to a first end surface of the LGP plate in the axial direction; Applying mesh glue on the reflective sheet for attachment to the first end surface and curing the mesh glue; The reflective sheet coated with the dotted glue is attached to the first end surface.

17. The processing method of the ultra-thin backlight structure according to claim 16, characterized in that: The "arrange a plurality of LGP boards on the circuit board in sequence and make the first end surface of each LGP board face the circuit board" specifically includes: A plurality of positioning pins are arranged on the first end surface of each LGP board, wherein the plurality of positioning pins include at least three positioning pins that are not located on the same straight line; The positioning feet of the plurality of LGP boards are connected to the circuit board and the second end faces of the plurality of LGP boards in the axial direction are butted in sequence.

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