Lamp panel, lamp panel mother board, backlight module and terminal equipment

Abstract

The invention provides a lamp panel, a lamp panel mother board, a backlight module and terminal equipment, the lamp panel comprises a substrate, a first solder mask layer, a second solder mask layer, a plurality of light-emitting elements and a protective layer, the substrate comprises at least one substrate layer, the substrate layers are stacked in the thickness direction of the substrate, circuit layers are arranged on the two sides of each substrate layer in the thickness direction of the substrate, and the protective layer is arranged between the first solder mask layer and the second solder mask layer. The substrate layer is insulated from the circuit layer, the circuit layer located on the first outer surface of the substrate layer is a first circuit layer, the circuit layer located on the second outer surface of the substrate layer is a second circuit layer, and the first circuit layer comprises a first inner area and a first avoiding area surrounding the first inner area. The first solder mask layer covers the first circuit layer, and the first solder mask layer comprises a plurality of hollow parts. The second solder mask layer covers the second circuit layer. The plurality of light-emitting elements are electrically connected with the first circuit layer through the hollow part. The protective layer covers the light-emitting element and the first solder mask layer, and the upper surface of the protective layer above the first avoiding area is a plane and is consistent with the upper surface of the protective layer above the first internal area in height.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light board, a light board motherboard, a backlight module and a terminal device. Background Art

[0002] In order to protect the lamp beads from interference from the external environment, the Mini LED light board needs to be encapsulated with a transparent protective layer to protect the micro light-emitting diodes. The processing method of the protective layer generally adopts the dispensing method. After the dispensing is completed, it is heated and cured, and the glue naturally flows level. Due to the flow of glue and the surface tension of the liquid, the thickness of the protective layer on the edges varies greatly. The outermost side forms a slope due to the overflow of glue. About a few millimeters inward, the glue will pile up, and the thickness is significantly higher than the middle area, resulting in poor overall flatness of the protective layer, which affects the overall thickness stacking of the Mini LED light board. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a light board, a light board motherboard, a backlight module and a terminal device to solve the problem of poor overall flatness of the protective layer. The specific technical solution is as follows:

[0004] The first aspect of the present application provides a light board, comprising: a substrate, comprising at least one substrate layer, the substrate layers are stacked along the thickness direction of the substrate, each substrate layer is provided with a circuit layer on both sides along the thickness direction of the substrate, the substrate layer and the circuit layer are insulated, the first circuit layer is located on the first outer surface of the substrate layer, and the second circuit layer is located on the second outer surface of the substrate layer. The first circuit layer includes a first inner area and a first avoidance area arranged around the first inner area, and the first outer surface and the second outer surface refer to two surfaces of the substrate layer that are not covered by the adjacent substrate layer along the thickness direction; a first solder resist layer, covering the first circuit layer, the first solder resist layer including a plurality of hollow portions to expose the first circuit layer; a second solder resist layer, covering the second circuit layer; a plurality of light-emitting elements, electrically connected to the first circuit layer through the hollow portions; a protective layer, covering the light-emitting elements and the first solder resist layer, the upper surface of the protective layer above the first avoidance area is a plane, and the height of the plane is consistent with the height of the upper surface of the protective layer above the first inner area.

[0005] In some embodiments, the first avoidance area exposes the first outer surface.

[0006] In some embodiments, the second circuit layer includes a second inner region and a second avoidance region disposed around the second inner region.

[0007] In some embodiments, the width of the first avoidance zone and the second avoidance zone is greater than 0.2 mm.

[0008] In some embodiments, the width of the first avoidance zone and the second avoidance zone is 0.2 mm-0.5 mm.

[0009] In some embodiments, the light emitting element is a micro light emitting diode or a light emitting diode.

[0010] The second aspect of the present application provides a light board motherboard, comprising: a substrate motherboard, comprising at least one substrate layer, the substrate layers are stacked along the thickness direction of the substrate motherboard, each substrate layer is provided with a circuit layer on both sides along the thickness direction of the substrate motherboard, the substrate layer is insulated from the circuit layer, the first circuit layer is located on the first outer surface of the substrate layer, and the second circuit layer is located on the second outer surface of the substrate layer; the first circuit layer comprises a first outer area, a third avoidance area and a first inner area, the third avoidance area is arranged around the first inner area and is located between the first outer area and the first inner area, and at least a portion of the substrate motherboard opposite to the first outer area Used for fixing the substrate motherboard, the third avoidance area includes a first sub-area and a second sub-area, the first sub-area is opposite to the first avoidance area of ​​the light board; a first solder mask layer covers the first circuit layer, the first solder mask layer includes a plurality of hollow portions to expose the first circuit layer; a second solder mask layer covers the second circuit layer; a plurality of light-emitting elements are electrically connected to the first circuit layer through the hollow portions; a protective layer covers the third avoidance area and the first solder mask layer and the light-emitting elements above the first internal area, the upper surface of the protective layer located above the first sub-area is a plane, and the height of the plane is consistent with the height of the upper surface of the protective layer in the first internal area.

[0011] In some embodiments, the third avoidance area exposes the first outer surface.

[0012] In some embodiments, the second circuit layer includes a second external area, a fourth avoidance area and a second internal area, the fourth avoidance area is arranged around the second internal area and is located between the second external area and the second internal area, the inner boundary of the third avoidance area is flush with the inner boundary of the fourth avoidance area, and the width of the fourth avoidance area is less than or equal to the width of the third avoidance area.

[0013] In some embodiments, the width of the third avoidance zone is greater than or equal to 7 mm and less than or equal to 10 mm, and the width of the fourth avoidance zone is greater than 0.4 mm.

[0014] In some embodiments, the lamp board motherboard includes a cutting line, the distance between the cutting line and the outer boundary of the first inner area is greater than 0.2 mm, and the lamp board motherboard is cut along the cutting line to obtain the lamp board.

[0015] A third aspect of the present application provides a backlight module, which includes a back panel and a light board arranged on one side of the back panel, and the light board is the light board described above.

[0016] A fourth aspect of the present application provides a terminal device, which includes the backlight module described above.

[0017] Beneficial effects of the embodiments of the present application:

[0018] The lamp board, lamp board motherboard, backlight module and terminal device provided in the embodiments of the present application, the substrate of the lamp board can change the natural leveling effect of the protective layer in the edge area by setting a first avoidance area on the periphery of the first inner area, that is, the raised area at the edge of the protective layer can be located in the first avoidance area, and the thickness of the protective layer there is thereby reduced, and abnormal thickening of the protective layer will not occur, so that the upper surface heights of the protective layer above the first avoidance area and the protective layer above the first inner area are consistent, and the consistency here can be understood as being substantially consistent, so the overall thickness consistency of the lamp board is good, and does not affect the overall thickness stacking effect of the light board.

[0019] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0021] Figure 1 A schematic diagram of the structure of a light board provided in an embodiment of the present application;

[0022] Figure 2 A schematic diagram of the structure of cutting the lamp board motherboard provided in the embodiment of the present application;

[0023] Figure 3 A schematic diagram of the structure of the light board provided in the embodiment of the present application in another embodiment;

[0024] Figure 4 A schematic diagram of the structure of a light board provided in an embodiment of the present application in another embodiment, wherein a first avoidance area retains a part of the circuit layer;

[0025] Figure 5 A top view of the lamp board motherboard provided in the embodiment of the present application;

[0026] Figure 6 for Figure 5Cross-sectional view in the BB direction;

[0027] Figure 7 A schematic diagram of the structure of a lamp board motherboard provided in an embodiment of the present application;

[0028] Figure 8 A schematic diagram of the structure of a lamp board motherboard provided in an embodiment of the present application in another embodiment;

[0029] Fig. 9 A schematic diagram of the structure of a lamp board motherboard in another embodiment of the present application.

[0030] The reference numerals are as follows:

[0031] Lamp board 10; lamp board motherboard 10'; substrate 1; base material layer 11; first circuit layer 12; first avoidance area 121; first internal area 122; second circuit layer 13; second avoidance area 131; second internal area 132; third circuit layer 14; first solder mask 2; hollow portion 21; second solder mask 3; light emitting element 4; protective layer 5; substrate motherboard 1'; third avoidance area 123; first sub-area 1231; second sub-area 1232; first external area 124; fourth avoidance area 133; third sub-area 1331; fourth sub-area 1332; second external area 134; pressing block 6; thickness direction H. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field based on the present application belong to the scope of protection of the present application.

[0033] In order to effectively improve the problem of poor consistency of the thickness of the protective layer 5, the present application embodiment provides a light board 10, referring to Figure 1 and Figure 2 , Figure 1 The schematic diagram of the structure of the light board is shown in Figure 1. Figure 2It is a structural schematic diagram of a lamp board motherboard (lamp board before cutting). The lamp board 10 includes a substrate 1, a first solder mask 2, a second solder mask 3, a plurality of light-emitting elements 4 and a protective layer 5. The substrate 1 includes at least one base material layer 11. The base material layers 11 are stacked along the thickness direction H of the substrate 1. Each base material layer 11 is provided with a circuit layer on both sides along the thickness direction H of the substrate 1. The base material layer 11 is insulated from the circuit layers. The first circuit layer 12 is located on the first outer surface of the base material layer 11, and the second circuit layer 13 is located on the second outer surface of the base material layer 11. The first circuit layer 12 includes a first inner area 122 and a first avoidance area 121 arranged around the first inner area 122. The first outer surface and the second outer surface refer to the two surfaces of the base material layer 11 that are not covered by the adjacent base material layer 11 along the thickness direction H. Reference Figure 6 , the first solder mask 2 covers the first circuit layer 12, and the first solder mask 2 includes a plurality of hollow portions 21 to expose the first circuit layer 12. The second solder mask 3 covers the second circuit layer 13. A plurality of light-emitting elements 4 are electrically connected to the first circuit layer 12 through the hollow portions 21. The protective layer 5 covers the light-emitting elements 4 and the first solder mask 2, and the upper surface of the protective layer 5 above the first avoidance area 121 is a plane, and the height of the plane is consistent with the height of the upper surface of the protective layer 5 above the first internal area 122.

[0034] In this embodiment, the first outer surface and the second outer surface refer to two surfaces of the substrate layer 11 that are not covered by the adjacent substrate layer 11 along the thickness direction H. When there is only one substrate layer 11, the first outer surface and the second outer surface are the upper and lower surfaces of the substrate layer 11 along the thickness direction H. Figure 1 As shown. At this time, the first outer surface of the substrate 1 is provided with a first circuit layer 12, and the second outer surface is provided with a second circuit layer 13. When there are two or more substrate layers 11, the first outer surface refers to the upper surface of the top substrate layer 11, and the second outer surface refers to the lower surface of the bottom substrate layer 11. Figure 3 In the light board 10 shown, the substrate 1 includes three layers of substrate layers 11, the first outer surface of the top substrate layer 11 is provided with a first circuit layer 12, the second outer surface of the bottom substrate layer 11 is provided with a second circuit layer 13, and there is also a circuit layer between two adjacent substrate layers 11, which is recorded as the third circuit layer 14, that is, when the substrate 1 is composed of two or more substrate layers 11, the third circuit layer 14 exists. The difference between the third circuit layer 14 and the first circuit layer 12 and the second circuit layer 13 is that there is no avoidance zone in the third circuit layer 14, which can ensure the uniformity of the internal thickness of the substrate 1 and simplify the manufacturing process of the substrate 1. By arranging the third circuit layer 14 between two adjacent substrate layers 11, the wiring space and design flexibility of the substrate 1 can be increased, and high-speed connections can be established between multiple circuit layers, reducing interference and loss during signal transmission, thereby improving the transmission speed and stability of the signal.

[0035] The substrate layer 11 may be a conductive substrate layer 11, for example, including but not limited to an aluminum substrate layer 11, a copper substrate layer 11. If the substrate layer 11 is a conductive substrate layer 11, an additional insulating layer is required for insulation between the circuit layer and the substrate layer 11. The substrate layer 11 may also be an insulating substrate layer 11, for example, including but not limited to an epoxy resin glass fiber composite material substrate layer 11 (FR4 substrate layer 11), a glass substrate layer 11, a ceramic substrate layer 11, etc. In this case, the circuit layer and the substrate layer 11 may be insulated without providing an insulating layer. The circuit layer may be made of, but not limited to, a metal conductive material, such as a copper circuit layer, a titanium circuit layer, an aluminum circuit layer, a molybdenum circuit layer, a silver circuit layer, etc. The protective layer 5 is generally formed by using liquid glue such as silicone, which is naturally leveled by dispensing and heated to cure. By setting a first avoidance area 121 on the periphery of the first internal area 122, the natural leveling effect of the glue in the edge area can be changed, that is, the raised area on the edge of the protective layer 5 can be located in the first avoidance area 121. The thickness of the protective layer 5 there is therefore reduced, and the protective layer 5 will not be abnormally thickened, so that the upper surface heights of the protective layer 5 above the first avoidance area 121 and the protective layer 5 above the first circuit layer 12 are consistent. The consistency here can be understood as being substantially consistent. Therefore, the overall thickness consistency of the lamp board 10 is good, and the overall thickness stacking effect of the lamp board 10 is not affected.

[0036] By setting the first avoidance area 121 on the periphery of the first inner area 122, the flatness of the protective layer 5 can be effectively improved, so that the thickness consistency of the protective layer 5 can be reduced from ±50 to 60 μm by 20% to 50%, which is equivalent to the thickness consistency of the molded protective layer 5. It should be noted that the flatness of the protective layer 5 formed by the dispensing process is relatively low, usually ±50 μm-60 μm, and the flatness of the protective layer 5 formed by the molding process is usually less than ±30 μm.

[0037] In the conventional technology, the protective layer 5 is formed by a glue dispensing process. Without setting the first avoidance area 121, in order to obtain a lamp board 10 of a desired size, it is necessary to enlarge the size of the lamp board motherboard 10', thereby shifting the raised area of ​​the protective layer 5 to a position outside the cutting line, so that when cutting along the cutting line, a lamp board 10 with a qualified stacking thickness can be obtained, which increases the cost of the lamp board motherboard 10' to a certain extent.

[0038] Among them, Figure 4 As shown, the first avoidance area 121 may have a circuit layer, but the thickness of the circuit layer is relatively thin, and the first avoidance area 121 will not expose the first outer surface. Figure 1 and Figure 3As shown, the first avoidance area 121 may also be free of a circuit layer, in which case the first avoidance area 121 exposes the first outer surface. The first avoidance area 121 may be formed by etching the circuit layer in the area, or by other feasible methods, such as special evaporation process, deposition process, etc.

[0039] Since the thickness of the first circuit layer 12 itself is relatively small, the first avoidance area 121 exposes the first outer surface, that is, there is no circuit layer in this area. In this way, the avoidance space of the first avoidance area 121 is larger, which can better alleviate the problem of abnormal stacking and thickening of the protective layer 5 at the edge, so that the upper surface of the protective layer 5 tends to be flat, thereby making the thickness stacking consistency of the lamp board 10 better.

[0040] In some embodiments of the present application, reference Figure 1 , Figure 3 and Figure 4 As shown, the second circuit layer 13 includes a second inner area 132 and a second avoidance area 131 arranged around the second inner area 132 .

[0041] In this embodiment, Figure 4 As shown, the second avoidance area 131 may have a circuit layer, but the thickness of the circuit layer is relatively thin, and the second avoidance area 131 will not expose the second outer surface. Figure 1 and Figure 3 As shown, the second avoidance area 131 may not have a circuit layer, in which case the second avoidance area 131 exposes the second outer surface. The second avoidance area 131 may be formed by etching the circuit layer in the area, or by other feasible methods, such as special evaporation process, deposition process, etc.

[0042] The circuit layer part in the first avoidance area 121 may or may not exist, and the circuit layer part in the second avoidance area 131 may or may not exist. The missing part of the circuit layer in the first avoidance area 121 will be filled by the protective layer 5, and the hardness of the protective layer 5 is less than the hardness of the circuit layer. Therefore, when cutting the light board motherboard 10', due to the existence of the first avoidance area 121 and the second avoidance area 131, the wear degree of the tool when cutting the first avoidance area 121 and the second avoidance area 131 can be greatly reduced. Therefore, setting the second avoidance area 131 on the periphery of the second inner area 132 can further reduce the wear degree of the tool.

[0043] In some embodiments of the present application, Figure 1 , Figure 3 and Figure 4 As shown, the width of the first avoidance area 121 and the second avoidance area 131 is greater than 0.2 mm, for example, it can be 0.25 mm, 0.3 mm, 0.4 mm, 0.5 mm, etc.

[0044] In this embodiment, the width of the first avoidance area 121 and the second avoidance area 131 is greater than 0.2 mm, so that when cutting the lamp board motherboard 10', the space of more than 0.2 mm is sufficient to avoid the width of the tool, making the tool selection more extensive. When cutting, even if it deviates slightly, it is not easy to cut the position outside the first avoidance area 121 and the second avoidance area 131, which can protect the tool and reduce the risk of damaging the lamp board 10.

[0045] At the same time, the width of the first avoidance area 121 and the second avoidance area 131 is greater than 0.2 mm, so that the cutting position has a certain distance from the internal circuit layer and is not likely to affect the circuit layer.

[0046] Optionally, the width of the first avoidance area 121 and the second avoidance area 131 is 0.2 mm-0.5 mm.

[0047] In this embodiment, the width of the first avoidance area 121 and the second avoidance area 131 should not be too wide while meeting the avoidance requirements, such as being greater than 0.2 mm, because otherwise the size of the area of ​​the light board 10 used for display will be lost.

[0048] In some embodiments of the present application, the light emitting element 4 is a light emitting diode (LED), a sub-millimeter light emitting diode (Mini Light-Emitting Diode, Mini LED) or a micro light emitting diode (Micro Light Emitting Diode, Micro LED).

[0049] Traditional LEDs have the characteristics of low power consumption, low heat generation, high brightness, and long life, and are widely used in lighting, signal indication, display screens, traffic lights, and other fields. As the backlight source of LCD screens, they can enhance the color performance of LCD screens.

[0050] Mini LED has good performance in thickness, color gamut, contrast and response time, especially in power saving. Mini LED is suitable for high-end TVs, monitors, laptops and other devices that require high contrast and color performance.

[0051] Micro LED has shown greater advantages in brightness, resolution, contrast, energy consumption, service life, response speed and thermal stability. This makes Micro LED one of the important development directions of future display technology. Micro LED is suitable for application scenarios that require high brightness, high resolution and high contrast, such as outdoor billboards, professional displays, high-end TVs, etc.

[0052] The second aspect of the present application provides a light board motherboard 10 ', referring to Figure 2 , Figure 5 and Figure 6 , Figure 5 is a top view of the lamp board motherboard 10', Figure 6 for Figure 5 The cross-sectional view along the BB direction. The lamp board motherboard 10' comprises a substrate motherboard 1', a first solder mask 2, a second solder mask 3, a plurality of light-emitting elements 4 and a protective layer 5. The substrate motherboard 1' comprises at least one substrate layer 11. The substrate layers 11 are stacked along the thickness direction of the substrate motherboard 1'. Each substrate layer 11 is provided with a circuit layer on both sides of the thickness direction H of the substrate motherboard 1'. The thickness direction of the substrate motherboard 1' is the same as that of the substrate 1 and is no longer distinguished. The substrate layer 11 is insulated from the circuit layer. The first circuit layer 12 is located on the first outer surface of the substrate layer 11, the second circuit layer 13 is located on the second outer surface of the substrate layer 11, and the third circuit layer 14 is located between adjacent substrate layers 11. The first circuit layer 12 includes a first external area 124, a third avoidance area 123 and a first internal area 122. The third avoidance area 123 is arranged around the first internal area 122 and is located between the first external area 124 and the first internal area 122. At least a portion of the substrate motherboard 1' opposite to the first external area 124 is used for fixing. The third avoidance area 123 includes a first sub-area 1231 and a second sub-area 1232. The first sub-area 1231 is opposite to the first avoidance area 121 of the light board 10. The first solder mask 2 covers the first circuit layer 12, and the first solder mask 2 includes a plurality of hollow portions 21 to expose the first circuit layer 12; the second solder mask 3 covers the second circuit layer 13; a plurality of light-emitting elements 4 are electrically connected to the first circuit layer 12 through the hollow portions 21; the protective layer 5 covers the first solder mask 2 and the light-emitting elements 4 above the third avoidance area 123 and the first internal area 122, and the upper surface of the protective layer 5 located above the first sub-area 1231 is a plane, and the height of the plane is consistent with the height of the upper surface of the protective layer 5 in the first internal area 122.

[0053] It should be noted that the concepts of the first circuit layer 12 , the second circuit layer 13 and the third circuit layer 14 in the substrate motherboard 1 ′ are the same as those in the substrate 1 , and will not be described in detail herein.

[0054] The lamp board motherboard 10' is the lamp board 10 before cutting. The third avoidance area 123 separates the first outer area 124 from the first inner area 122, and the part of the substrate motherboard 1' that is opposite to a part or all of the first outer area 124 is used to fix the substrate motherboard 1'. Figure 2 As shown, the substrate motherboard 1' opposite to the first outer area 124 is Figure 2 The A part shown in FIG. Figure 2In the illustrated embodiment, A is not partially fixed by a pressing block 6. The fixation between the substrate motherboard 1' and the carrier (not shown in the figure) can also be achieved by bonding with an adhesive tape. The third avoidance area 123 here can be divided into a first sub-area 1231 and a second sub-area 1232, wherein the first sub-area 1231 corresponds to the first avoidance area 121 in the light board 10, that is, the area within the cutting line, and the second sub-area 1232 is the area outside the cutting line. After the substrate motherboard 1' is fixed, the light-emitting element 4 is welded, and after the light-emitting element 4 is welded, the protective layer 5 is coated by dispensing. Since the first circuit layer 12 has a third avoidance area 123, the raised area of ​​the protective layer 5 when it is naturally leveled can be located in the third avoidance area 123, and the thickness of the protective layer 5 there is therefore reduced, thereby improving the thickness consistency of the protective layer 5. The third avoidance area 123 includes a first sub-area 1231 corresponding to the first avoidance area 121 in the lamp board 10 and a second sub-area 1232 located outside the cutting line, so that the slope area formed by the natural leveling of the protective layer 5 is located in the second sub-area 1232, and when cutting along the cutting line, it can ensure that the overall thickness consistency of the obtained lamp board 10 is good. The protective layer 5 is coated as a whole layer, covering the third avoidance area 123 and the first solder mask 2 and the light-emitting element 4 above the first internal area 122, isolating the internal components from the outside, and can protect the light-emitting element 4 and the internal circuit.

[0055] It is understandable that the circuit layer of the third avoidance area 123 may partially exist or not exist. The third avoidance area 123 exposes the first outer surface, so that the accommodation space of the third avoidance area 123 is larger, which can better alleviate the problem of abnormal stacking and thickening of the protective layer 5 at the edge, so that the upper surface of the protective layer 5 tends to be flat, so that the thickness stacking consistency of the light board 10 is better.

[0056] refer to Figure 7 , Figure 8 , Figure 7 The schematic diagram of the structure of the base plate motherboard 10' of the lamp board motherboard 1' only includes a substrate layer 11, Figure 8 The schematic diagram of the structure of the substrate motherboard 1' of the lamp board motherboard 10' includes three layers of substrate layers 11. When there is only one layer of substrate layer 11, the first outer surface and the second outer surface are the upper and lower surfaces of the substrate layer 11 along the thickness direction H, the first circuit layer 12 is arranged on the first outer surface, the second circuit layer 13 is arranged on the second outer surface, and the substrate motherboard 1' does not include the third circuit layer 14. When there are two or more substrate layers 11, for example, three layers, the first outer surface refers to the upper surface of the top substrate layer 11, and the second outer surface refers to the lower surface of the bottom substrate layer 11. The first circuit layer 12 is arranged on the first outer surface, the second circuit layer 13 is arranged on the second outer surface, and the third circuit layer 14 is arranged between the top substrate layer 11 and the middle substrate layer 11, and between the bottom substrate layer 11 and the middle substrate layer 11.

[0057] In some embodiments of the present application, reference Figure 7 , Figure 8 and Fig. 9 The second circuit layer 13 includes a fourth avoidance area 133 , an inner boundary of the third avoidance area 123 is flush with an inner boundary of the fourth avoidance area 133 , and a width of the fourth avoidance area 133 is less than or equal to a width of the third avoidance area 123 .

[0058] In this embodiment, the second circuit layer 13 includes a fourth avoidance area 133 and a second outer area 134 and a second inner area 132 located on both sides of the fourth avoidance area 133, and the fourth avoidance area 133 is arranged around the second inner area 132. The fourth avoidance area 133 here can be divided into a third sub-area 1331 and a fourth sub-area 1332, wherein the third sub-area 1331 corresponds to the second avoidance area 131 in the light board 10, that is, the area where the light board motherboard 10' is located within the cutting line, and the second sub-area 1232 is the area outside the cutting line. The inner boundary of the fourth avoidance area 133 is flush with the inner boundary of the third avoidance area 123, as shown in FIG. Figure 7 , Figure 8 As shown, the width of the fourth avoidance area 133 can be equal to the width of the third avoidance area 123. In this way, after the protective layer 5 has completed encapsulation of the light-emitting element 4, when the light board motherboard 10' is cut, the circuit layer of the third avoidance area 123 on the upper surface of the substrate motherboard 1' can be thinned or there is no circuit layer, and the circuit layer thickness of the fourth avoidance area 133 on the lower surface of the substrate motherboard 1' can be thinned or there is no circuit layer, so the wear degree of the tool during cutting can be reduced.

[0059] like Fig. 9 As shown, the width of the fourth avoidance area 133 can also be smaller than the width of the third avoidance area 123, that is, the third avoidance area 123 and the fourth avoidance area 133 can be designed asymmetrically, because the fourth avoidance area 133 does not affect the flatness of the protective layer 5 on the top surface of the substrate motherboard 1', and the width of the fourth avoidance area 133 only satisfies the avoidance of the tool width during cutting. In this way, since the width of the fourth avoidance area 133 is reduced, the strength of the substrate motherboard 1' is enhanced to a certain extent, and the tool wear rate can be reduced.

[0060] In some embodiments of the present application, reference Fig. 9 The width of the third avoidance zone 123 is greater than or equal to 7 mm and less than or equal to 10 mm, for example, it can be 7 mm, 8 mm, 9 mm, etc. The width of the fourth avoidance zone 133 is greater than 0.4 mm, for example, it can be 0.45 mm, 0.5 mm, 0.6 mm, etc.

[0061] The width of the third avoidance area 123 is sufficient to avoid the undulating area of ​​the edge of the protective layer 5. The specific size is related to the performance of the glue actually used, usually less than 10 mm, and as small as possible to save the cost of the substrate motherboard 1'. The width of the fourth avoidance area 133 has nothing to do with the flatness of the protective layer 5, and only needs to meet the avoidance of the tool width. Generally, it can be twice the width of the first avoidance area 121, which can reduce the wear on the tool.

[0062] In some embodiments of the present application, reference Figure 7 , Figure 8 and Fig. 9 The lamp board motherboard 10 ′ includes a cutting line, and the distance between the cutting line and the outer boundary of the first inner area 122 is greater than 0.2 mm. The lamp board motherboard 10 ′ is cut along the cutting line to obtain the lamp board 10 .

[0063] In this embodiment, the outer boundary of the first internal area 122 is also the inner boundary of the third avoidance area 123. The inner boundary of the third avoidance area 123 is flush with the inner boundary of the fourth avoidance area 133, so the distance between the cutting line and the inner boundary of the third avoidance area 123 is equal to the distance between the cutting line and the inner boundary of the fourth avoidance area 133. The distance between the position of the cutting line and the inner boundaries of the third avoidance area 123 and the fourth avoidance area 133 is usually greater than 0.2 mm, that is, the width of the first avoidance area 121 of the lamp board 10 is usually greater than 0.2 mm. In this way, on the one hand, the avoidance of the tool width can be satisfied, and on the other hand, a certain distance can be left between the internal circuit layer to prevent the internal circuit layer from being cut by mistake.

[0064] The third aspect of the embodiment of the present application provides a backlight module, which includes a back plate and a light board 10 arranged on one side of the back plate, and the light board 10 is the light board 10 described above. The light board 10 has a uniform thickness when stacked as a whole, and after being arranged on the backlight module, the thickness of the backlight module is uniform due to its uniform height, and it is not easy to warp, which is conducive to improving the packaging effect of the backlight module.

[0065] The fourth aspect of the embodiment of the present application provides a terminal device, which can be but is not limited to a display screen, a computer, a laptop computer, a mobile phone, etc. The light board 10 of the backlight module of the terminal device has a uniform overall stacking thickness. After being arranged on the backlight module, the thickness of the backlight module is uniform due to its uniform height, and it is not prone to warping, which is beneficial to improving the packaging effect of the backlight module, thereby helping to improve the service life of the terminal device.

[0066] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0067] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0068] The above description is only a preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. A light board, characterized in that: include: A substrate, comprising at least one substrate layer, wherein the substrate layers are stacked along the thickness direction of the substrate, each substrate layer is provided with circuit layers on both sides along the thickness direction of the substrate, the substrate layers are insulated from each other, the first circuit layer is located on the first outer surface of the substrate layer, and the second circuit layer is located on the second outer surface of the substrate layer, the first circuit layer comprises a first inner area and a first avoidance area arranged around the first inner area, and the first outer surface and the second outer surface refer to two surfaces of the substrate layer that are not covered by the adjacent substrate layer along the thickness direction; a first solder resist layer, covering the first circuit layer, wherein the first solder resist layer comprises a plurality of hollow portions to expose the first circuit layer; A second solder mask layer, covering the second circuit layer; A plurality of light-emitting elements are electrically connected to the first circuit layer through the hollow portion; A protective layer covers the light emitting element and the first solder resist, wherein the upper surface of the protective layer above the first avoidance area is a plane, and the height of the plane is consistent with the height of the upper surface of the protective layer above the first internal area.

2. The light board according to claim 1, characterized in that: The first avoidance area exposes the first outer surface.

3. The light board according to claim 1, characterized in that: The second circuit layer includes a second inner region and a second avoidance region arranged around the second inner region.

4. The light board according to claim 3, characterized in that: The width of the first avoidance zone and the second avoidance zone is greater than 0.2 mm.

5. The light board according to claim 3, characterized in that: The width of the first avoidance zone and the second avoidance zone is 0.2 mm-0.5 mm.

6. The light board according to any one of claims 1 to 5, characterized in that: The light emitting element is a micro light emitting diode or a light emitting diode.

7. A lamp board motherboard, used for cutting to obtain the lamp board according to any one of claims 1 to 6, characterized in that: include: A substrate motherboard, comprising at least one substrate layer, wherein the substrate layers are stacked along the thickness direction of the substrate motherboard, each substrate layer is provided with circuit layers on both sides along the thickness direction of the substrate motherboard, the substrate layers are insulated from each other, the first circuit layer is located on the first outer surface of the substrate layer, and the second circuit layer is located on the second outer surface of the substrate layer; The first circuit layer includes a first outer area, a third avoidance area and a first inner area, the third avoidance area is arranged around the first inner area and is located between the first outer area and the first inner area, at least a portion of the substrate motherboard opposite to the first outer area is used for fixing, the third avoidance area includes a first sub-area and a second sub-area, and the first sub-area is opposite to the first avoidance area of ​​the light board; a first solder resist layer, covering the first circuit layer, wherein the first solder resist layer comprises a plurality of hollow portions to expose the first circuit layer; A second solder mask layer, covering the second circuit layer; A plurality of light-emitting elements are electrically connected to the first circuit layer through the hollow portion; A protective layer covers the third avoidance area, the first solder mask layer above the first internal area, and the light-emitting element. The upper surface of the protective layer above the first sub-area is a plane, and the height of the plane is consistent with the height of the upper surface of the protective layer in the first internal area.

8. The lamp board motherboard according to claim 7, characterized in that: The third avoidance area exposes the first outer surface.

9. The lamp board motherboard according to claim 7, characterized in that: The second circuit layer includes a fourth avoidance area, an inner boundary of the third avoidance area is flush with an inner boundary of the fourth avoidance area, and a width of the fourth avoidance area is less than or equal to a width of the third avoidance area.

10. The lamp board motherboard according to claim 9, characterized in that: The width of the third avoidance zone is greater than or equal to 7 mm and less than or equal to 10 mm, and the width of the fourth avoidance zone is greater than 0.4 mm.

11. The lamp board motherboard according to claim 7, characterized in that: The lamp board motherboard comprises a cutting line, the distance between the cutting line and the outer boundary of the first inner area is greater than 0.2 mm, and the lamp board motherboard is cut along the cutting line to obtain a lamp board.

12. A backlight module, characterized in that the backlight module comprises a back plate and a light board arranged on one side of the back plate, and the light board is the light board according to any one of claims 1 to 6.

13. A terminal device, characterized in that: The terminal device comprises the backlight module according to claim 12.

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