Separating, inserting, washing and selecting integrated equipment

Abstract

The invention provides a separating, inserting, washing and selecting integrated device, and belongs to the field of silicon wafer processing, the separating, inserting, washing and selecting integrated device comprises a degumming machine, a wafer inserting machine, a cleaning machine, a butt joint device, a sorting machine and a master controller; and the master controller displays and feeds forward to the upstream degumming machine, the sheet inserting machine, the cleaning machine and the docking device according to the sorting result of the sorting machine, and judges whether the corresponding workshop section is shut down for maintenance or not. The silicon wafers are pre-detected in both the degumming stage and the wafer inserting stage, and the butt joint device which gives consideration to downstream conveyed full basket silicon wafer screening and upstream conveyed empty basket detection is additionally arranged, so that the overall efficiency is improved, the sorting yield of the tail end sorting machine is guaranteed, the automation degree is high, and the device is convenient to popularize and apply in the production and manufacturing field of the silicon wafers.

Description

Technical Field

[0001] The invention belongs to the field of silicon wafer processing, and in particular relates to a stripping, plugging, washing and selecting integrated equipment. Background Art

[0002] During the silicon wafer preparation process, it is necessary to go through the steps of cutting, degumming, inserting, cleaning, drying, and sorting. In the existing technology, each step is set up independently, and there is a lack of pre-screening of silicon wafers and quality detection of flower baskets in the process, which leads to problems such as low overall efficiency and high defect rate in the final sorting. Summary of the invention

[0003] In order to overcome the deficiencies of the prior art, the present invention provides an integrated device for removing, inserting, washing and selecting, which can solve the above-mentioned problems.

[0004] A device for stripping, inserting, washing and selecting in one, comprising a stripping machine, a wafer inserting machine, a cleaning machine, a docking device, a sorting machine and a general controller; wherein the stripping machine adopts a spraying and immersion degumming method monitored by a reagent, and adopts a degumming detection component to detect the degumming treatment of silicon wafers in a silicon wafer basket; the wafer inserting machine integrates the sections of wafer separation, wafer extraction, wafer inserting pre-sorting, wafer inserting and basket circulation supply, the basket circulation supply section receives the empty baskets that are OK after the docking device detection, and conveys the full baskets filled with silicon wafers to the cleaning machine; the cleaning machine integrates the sections of immersion, different washing The detergent cleaning and drying section is used for cleaning and drying batches of full baskets; the docking device integrates a full basket detection pre-selection section for silicon wafers and an empty basket detection reflow section, which are used for pre-screening of full basket silicon wafers and appearance inspection and reflow of empty baskets; the sorting machine includes a comprehensive silicon wafer detection section and a silicon wafer sorting section, which realizes the sorting of silicon wafers with different defect types by top suction sorting; the main controller displays the sorting results of the sorting machine and feeds forward to the upstream degumming machine, wafer inserting machine, cleaning machine and docking device to determine whether the corresponding section should be shut down for maintenance.

[0005] Optionally, the degumming machine includes a spraying device, a degumming device, a rinsing device, a degumming workflow line, a degumming frame, a degumming transfer module, a loading trolley, a degumming transverse cover assembly and a degumming detection assembly; the spraying device is arranged at the upstream of the degumming workflow line for spray degumming, and the degumming detection assembly collects images of the glue-attached parts of the silicon wafers in the silicon wafer basket through an optical assembly.

[0006] Optionally, the slice inserting machine includes a slice dividing module, a slice extraction module, a pre-sorting slice inserting conveying module and a quick basket changing module which are arranged in sequence; an empty flower basket flipping module and a full flower basket flipping conveying module are arranged side by side downstream of the quick basket changing module, and a flower basket hoisting module is arranged above the empty flower basket flipping module and the full flower basket flipping conveying module; the quick basket changing module is used for the cyclic transportation of empty flower basket supply and full flower basket withdrawal.

[0007] Optionally, the cleaning machine includes a multi-stage water tank, a drying tank, a throwing mechanism, a slow-pulling mechanism, a basket return line, a hydraulically controlled cleaning system and a basket conveying mechanism. The multi-stage water tanks are arranged side by side and adjacent water tanks with the same type of cleaning liquid adopt a stepped overflow design from downstream to upstream of process cleaning. The drying tank is arranged downstream of the end water tank of the multi-stage water tank. The throwing mechanism and the slow-pulling mechanism are arranged at the water tank of the multi-stage water tank adjacent to the drying tank. The basket return line is arranged at the same side end of the multi-stage water tank and the drying tank. The hydraulically controlled cleaning system is connected to the multi-stage water tank and provides cleaning liquid. The basket conveying mechanism is used for transferring the basket between the multi-stage water tank, the drying tank and the basket return line.

[0008] Optionally, the multi-stage water tank includes a soaking tank, multiple cleaning tanks and multiple washing tanks; the soaking tank is arranged at the upstream end of the cleaning process, and each water tank is provided with a cleaning liquid with corresponding composition, proportion and guaranteed liquid level by a hydraulically controlled cleaning system; each water tank is provided with a temperature detection unit, and ultrasonic vibration units and heating units are arranged at multiple cleaning tanks and multiple washing tanks as needed, the slow pulling mechanism is arranged in the last water tank adjacent to the drying tank, and the throwing mechanism is arranged in multiple upstream water tanks adjacent to the last water tank.

[0009] Optionally, the liquid-controlled cleaning system includes a clean water supply circuit, a heating water tank, a cleaning liquid supply circuit, a cleaning drainage circuit and a water tank self-circulation circuit; the clean water supply circuit is arranged between the multi-stage water tank and the heating water tank, and is used to provide hot water and cold water with adjustable ratios to the multi-stage water tank; the cleaning liquid supply circuit is used to provide cleaning liquids of different types and proportions to the multiple cleaning tanks and washing tanks; the cleaning drainage circuit is connected to each water tank of the multi-stage water tank in a controllable manner; the water tank self-circulation circuit is connected to the corresponding washing tank, and is used for circulating and stirring the washing liquid in the washing tank.

[0010] Optionally, the docking device includes a silicon wafer feeding docking belt line, a full basket defect detection module, a full basket defect rejection module, a docking section basket transfer module, an empty basket teeth detection return line and an empty basket shape detection streamline; the full basket defect detection module and the full basket defect rejection module are arranged at the streamline ends of the silicon wafer feeding docking belt line; the full basket defect rejection module adopts a "U"-shaped material basket supply method with output from the upper layer of the defect basket and inflow and lifting of the lower layer of the repair basket; the docking section basket transfer module is used for spatial transportation of silicon wafer baskets; the empty basket shape detection streamline is arranged downstream of the empty basket teeth detection return line; wherein, a line scan camera for empty basket teeth detection is arranged above the empty basket teeth detection return line, and a surface array camera for empty basket shape detection is arranged above the empty basket shape detection streamline.

[0011] Optionally, the sorting machine includes a sorting system including a sorting loading device, a silicon wafer comprehensive detection device and a non-contact top suction wafer unloading and sorting device; a material type detection device and a sorting segment fragment removal device are arranged between the sorting loading device and the silicon wafer comprehensive detection device, which are used to detect the silicon wafer model and whether it is broken, and remove the broken silicon wafers to prevent the broken silicon wafers from flowing into the silicon wafer comprehensive detection device; the silicon wafer comprehensive detection device is used to perform detection on the silicon wafers including left and right edge chipping, chamfer chipping, thickness, upper and lower dirt, resistivity, hidden crack module, and upper and lower surface chipping, and judge them as OK or NG wafers according to the comparison of corresponding item standards, so as to provide a sorting basis for the unloading and sorting device.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: the silicon wafers are pre-inspected during the degumming and insertion stages of the present application, and a docking device is added to take into account both the downstream full basket screening of silicon wafers and the upstream empty basket detection, thereby improving the overall efficiency, ensuring the sorting yield of the terminal sorting machine, having a high degree of automation, and facilitating promotion and application in the field of silicon wafer production and manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the integrated device for removing, plugging, washing and selecting of the present invention;

[0014] Figure 2 and Figure 3 It is a schematic diagram of a degumming machine;

[0015] Figure 4 and Figure 5 It is a schematic diagram of the inserting machine;

[0016] Figure 6 It is a schematic diagram of the pre-sorting insert conveying module;

[0017] Figure 7 is a schematic diagram of a quick basket change module;

[0018] Figure 8 It is a schematic diagram of the process of the continuous inserting method;

[0019] Fig. 9 and Fig.10 is a schematic diagram of a cleaning machine;

[0020] Fig.11 is a schematic diagram of a docking device;

[0021] Fig.12 This is a schematic diagram of the full basket defect removal module;

[0022] Fig.13 It is a schematic diagram of the empty basket tooth detection flow line, the empty basket shape detection flow line, the line scan camera and the area array camera;

[0023] Fig.14It is a schematic diagram of the return line of the empty basket tooth detection;

[0024] Fig.15 This is a schematic diagram of empty basket handling for empty basket tooth detection return line;

[0025] Fig.16 It is a schematic diagram of the empty basket shape detection streamline;

[0026] Fig.17 Schematic diagram of the sorting machine.

[0027] In the figure,

[0028] 1000, degumming machine; 1100, spraying device; 1200, degumming device; 1210, degumming liquid replenishing mechanism; 1300, rinsing device; 1400, degumming workflow; 1500, degumming rack; 1600, degumming transfer module; 1700, loading car; 1800, degumming transverse cover assembly; 1900, degumming detection assembly;

[0029] 2000, inserting machine; 2100, slicing module; 2200, extracting module; 2300, pre-sorting insert conveying module; 2310, segmented transmission line; 2320, insert fragment detection module; 2330, insert thickness detection module; 2340, insert foreign material removal module; 2350, insert material receiving box; 2360, insert blowing module; 2400, fast basket changing module; 2410, basket changing and transporting installation vertical plate; 2420, basket changing transverse movement module; 2430, basket changing lifting module; 2440, clamping basket; 2500, empty basket turning module; 2600, full basket turning and conveying module; 2700, basket hoisting module;

[0030] 3000, cleaning machine; 3100, multi-stage water tank; 3110, soaking tank; 3120, cleaning tank; 3130, washing tank; 3200, drying tank; 3300, throwing mechanism; 3400, slow pulling mechanism; 3500, basket return line; 3600, hydraulically controlled cleaning system; 3610, clean water supply liquid circuit; 3620, heating water tank; 3630, cleaning liquid supply liquid circuit; 3640, cleaning drainage flow path; 3650, water tank self-circulation flow path; 3660, preheating unit; 3670, circulation tank; 3680, heat exchanger; 3700, cleaning machine external frame; 3800, cleaning section basket hoisting module;

[0031] 4000, docking device; 4100, silicon wafer feeding docking belt line; 4200, full basket defect detection module; 4300, full basket defect rejection module; 4310, full basket output flow line; 4320, full basket rejection lifting flow line; 4330, full basket inflow flow line; 4340, full basket repair lifting flow line; 4350, full blue defect rejection rack; 4400, docking section flower basket transfer module; 4500, empty basket basket tooth detection return line; 4510, basket tooth detection rack; 4520, lifting and traversing assembly; 4521, lifting flat frame ; 4522, lifting cylinder assembly; 4523, lateral movement carrier; 4524, lateral movement guide rail assembly; 4525, empty basket translation drive assembly; 4530, flower basket guide; 4540, flower basket sensor; 4600, empty basket shape detection streamline; 4610, empty basket shape detection frame; 4620, empty basket shape detection belt assembly; 4630, empty basket temporary storage conveyor belt assembly; 4640, shape detection section flower basket guide; 4700, line scan camera; 4800, area array camera; 4900, silicon wafer flower basket cooling module;

[0032] 5000, sorting machine; 5100, sorting and loading device; 5200, silicon wafer comprehensive detection device; 5300, unloading and sorting device; 5400, material type detection device; 5500, sorting section fragment removal device. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] A kind of integrated equipment for removing, plugging, washing and selecting, see Figure 1 The integrated degumming, inserting, washing and selecting equipment includes a degumming machine 1000, an inserting machine 2000, a cleaning machine 3000, a docking device 4000, a sorting machine 5000 and a general controller.

[0035] Layout relationship: Degumming machine 1000, inserting machine 2000, cleaning machine 3000, docking device 4000, sorting machine 5000 are arranged in sequence. In the example shown in the figure, they are arranged in a straight line. Of course, they can also be arranged in a concave shape or a circular shape according to the actual needs of the factory. They can be arranged in one group or in multiple groups side by side.

[0036] Among them, the degumming machine 1000 adopts the spraying and soaking degumming method monitored by the reagent, and adopts the degumming detection component 1900 to detect the degumming treatment of the silicon wafers in the silicon wafer basket. The inserting machine 2000 integrates the slicing, extraction, inserting pre-sorting, inserting and basket circulation supply sections. The basket circulation supply section receives the empty basket that is OK after the docking device 4000 detects, and conveys the full basket filled with silicon wafers to the cleaning machine 3000. The cleaning machine 3000 integrates the soaking, different detergent cleaning and drying sections for the cleaning and drying of batches of full baskets. The docking device 4000 integrates the silicon wafer full basket detection pre-selection section and the empty basket detection reflow section for the pre-screening of full basket silicon wafers and the appearance inspection and reflow of empty baskets. The sorting machine 5000 includes a silicon wafer comprehensive detection section and a silicon wafer sorting section, and realizes the sorting of silicon wafers of different defect types by top suction slicing.

[0037] The master controller displays and feeds forward the sorting results of the sorting machine 5000 to the upstream degumming machine 1000, the inserting machine 2000, the cleaning machine 3000 and the docking device 4000 to determine whether the corresponding section should be shut down for maintenance. Not shown in the figure, the master controller can be set at the sorting machine 5000 because the temperature there is lower. Of course, it can also be set in other places, such as the control room. Among them, the degumming machine 1000, the inserting machine 2000, the cleaning machine 3000, the docking device 4000 and the sorting machine 5000 have their own sub-controllers.

[0038] Among them, see 2 and Figure 3 The degumming machine 1000 includes a spraying device 1100, a degumming device 1200, a rinsing device 1300, a degumming work line 1400, a degumming frame 1500, a degumming transfer module 1600, a loading vehicle 1700, a degumming transverse cover assembly 1800 and a degumming detection assembly 1900. A degumming liquid replenishing mechanism 1210 is also provided at the degumming device 1200 for replenishing degumming liquid into the degumming tank of the degumming device 1200. Of course, optionally, a spray degumming liquid can also be provided to the spraying device 1100.

[0039] Specifically, multiple degumming troughs (usually two troughs) of the degumming device 1200 share a degumming transverse cover plate assembly 1800, the spray device 1100 is arranged upstream of the degumming workflow 1400 for spray degumming, and the degumming detection assembly 1900 collects images of the glue-attached parts of the silicon wafers in the silicon wafer basket through optical components.

[0040] Among them, the degumming and transferring module 1600 is a gripper module driven by a robot, a mechanical arm or a driving beam, which is used for picking up and spatially transferring the silicon wafer basket. When the gripper module is used, it is installed on the ground around the degumming device 1200 and the rinsing device 1300 and fixed. The gripper module drives the gripper to pick up the flower basket through the X-axis and Y-axis driving beam modules installed on the degumming rack 1500 and its own Z-axis driving module.

[0041] The loading vehicle 1700 is arranged upstream of the degumming workflow 1400, and the degumming device 1200 is arranged at a degumming station downstream of the loading vehicle 1700. The loading vehicle 1700 and the spraying device 1100 are arranged upstream of the degumming workflow 1400.

[0042] The degumming detection component 1900 adopts a fixed and / or mobile image acquisition module, which is arranged on the degumming workflow line 1400, the degumming transfer module 1600 and / or the degumming rack 1500.

[0043] The degumming steps are as follows.

[0044] S11, pre-spraying, the degumming and transferring module 1600 moves the silicon wafer basket delivered by the loading vehicle 1700 into the spraying device 1100 for spray cleaning.

[0045] S12, degumming: the silicon wafer basket is degummed in the degumming device 1200.

[0046] S13, post-cleaning step, moving the debonded silicon wafer basket into the rinsing device 1300 for vibration rinsing.

[0047] S14, degumming detection, the degumming detection component 1900 collects images of the degumming-treated silicon wafer basket. If it meets the degumming standard, the degumming is terminated and the material is unloaded. If it does not meet the degumming standard, the degumming is repeated until it meets the standard.

[0048] The debonding detection component 1900 collects the side images, bottom images and top images of the silicon wafer and the wafer tray in the silicon wafer basket, and fits the contour image of the silicon wafer on the glued surface through image processing, and compares it with the standard image to identify whether there is a debonding defect.

[0049] Among them, see Figure 4 and Figure 5The inserting machine 2000 includes a slicing module 2100, a sheet extraction module 2200, a pre-sorting inserting conveying module 2300 and a quick basket changing module 2400 which are arranged in sequence; an empty flower basket turning module 2500 and a full flower basket turning and conveying module 2600 are arranged side by side downstream of the quick basket changing module 2400, and a flower basket hoisting module 2700 is arranged above the empty flower basket turning module 2500 and the full flower basket turning and conveying module 2600; the quick basket changing module 2400 is used for the cyclic transportation of empty flower basket supply and full flower basket withdrawal.

[0050] See also Figure 6 The pre-sorting insert conveying module 2300 adopts a multi-stage conveying structure and speeds up step by step from front to back. The pre-sorting insert conveying module 2300 includes an insert segment fragment detection module 2320, an insert segment thickness detection module 2330, an insert segment foreign material removal module 2340, an insert segment connecting box 2350 and an insert segment blowing module 2360 arranged along the segment transmission line 2310; the insert segment fragment detection module 2320 and the insert segment thickness detection module 2330 are arranged upstream of the insert segment foreign material removal module 2340, and the insert segment connecting box 2350 is arranged downstream of the insert segment foreign material removal module 2340; the insert segment blowing module 2360 is arranged upstream and / or downstream of the insert segment foreign material removal module 2340.

[0051] See also Figure 7 The quick basket changing module 2400 includes two sets of relatively arranged basket changing and transporting mounting vertical plates 2410, a basket changing transverse movement module 2420, a basket changing lifting module 2430 and a clamping basket 2440; the clamping basket 2440 moves along a U-shaped path on the side of the basket changing and transporting mounting vertical plates 2410 under the control of the basket changing transverse movement module 2420 and the basket changing lifting module 2430, thereby realizing the cyclic transportation of empty flower basket supply and full flower basket withdrawal.

[0052] The basket clamping 2440 of the quick basket changing module 2400 is installed on the basket changing lifting module 2430, the basket changing lifting module 2430 is installed on the basket changing transverse movement module 2420, and the basket changing transverse movement module 2420 is installed on the side of the basket changing transfer mounting stand 2410; an end displacement sensor is respectively arranged at both ends of the transverse movement path of the basket changing transverse movement module 2420, and a transverse movement original position sensor is arranged on the inner side of the transverse movement end displacement sensor at the empty flower basket receiving position, and the transverse movement original position sensor is used to enable the basket changing transverse movement module 2420 to quickly return to the original position at the empty flower basket receiving position after emergencies such as emergency stop, shutdown, power failure, etc.

[0053] See also Figure 8 , the continuous inserting method comprises the following steps.

[0054] S21, slicing. The cut silicon wafers are transported to the slicing module 2100 through a flower basket. The vertical silicon wafers in the horizontally placed flower basket are pushed forward in the slicing water tank of the slicing module 2100. While the silicon wafers are moving forward, water is sprayed on both sides to flush and disperse the silicon wafers at the end, thereby achieving slicing.

[0055] S22, extracting wafers: the wafer extraction module 2200 absorbs the adjacent silicon wafers by absorbing water, and lifts and climbs the absorbed silicon wafers to transfer them horizontally;

[0056] S23, pre-sorting horizontal conveying, the pre-sorting wafer conveying module 2300 performs defect detection and thickness detection on the horizontally conveyed silicon wafers and removes unqualified silicon wafers, and horizontally conveys qualified silicon wafers to the wafer inserting station;

[0057] S24, inserting wafers, the quick basket changing module 2400 circulates the supply of empty baskets and transfers the full baskets. At the inserting station, the quick basket changing module 2400 lifts the vertically arranged empty baskets layer by layer and receives the horizontally transported silicon wafers layer by layer. After the baskets are filled with silicon wafers, the quick basket changing module 2400 transfers the full baskets to the in-and-out basket position.

[0058] S25, empty baskets are supplied. The flower basket hoisting module 2700 hoists the prepared empty flower baskets in a horizontal state to the empty flower basket flipping module 2500, and the empty flower basket flipping module 2500 transports and flips the horizontal flower baskets to a vertical state. Finally, the vertical empty flower baskets are transported to the entry and exit positions of the quick basket changing module 2400.

[0059] S26, full basket transfer: the full flower basket located at the entry and exit position of the quick basket changing module 2400 is transferred in a vertical state to the full flower basket turning and conveying module 2600, and the full flower basket is turned over by the full flower basket turning and conveying module 2600 to a horizontal state, and the full flower basket in a horizontal state is transferred to the subsequent workstation by the flower basket hoisting module 2700.

[0060] Among them, see Fig. 9 and Fig.10The cleaning machine 3000 includes a multi-stage water tank 3100, a drying tank 3200, a throwing mechanism 3300, a slow pulling mechanism 3400, a basket return line 3500, a hydraulically controlled cleaning system 3600 and a basket transport mechanism. The multi-stage water tanks 3100 are arranged side by side and have adjacent water tanks with the same cleaning liquid. A stepped overflow design from the downstream to the upstream of the process cleaning is adopted. The drying tank 3200 is arranged downstream of the terminal water tank of the multi-stage water tank 3100. The throwing mechanism 3300 is arranged downstream of the terminal water tank of the multi-stage water tank 3100. The driving mechanism 3300 and the slow pulling mechanism 3400 are arranged at the water tank of the multi-stage water tank 3100 adjacent to the drying tank 3200, the material basket return line 3500 is arranged at the same side end of the multi-stage water tank 3100 and the drying tank 3200, the hydraulically controlled cleaning system 3600 is connected to the multi-stage water tank 3100 and provides cleaning liquid, and the material basket conveying mechanism is used for the transfer of the material basket between the multi-stage water tank 3100, the drying tank 3200 and the material basket return line 3500.

[0061] See also Fig.10 The multi-stage water tank 3100 includes a soaking tank 3110, multiple cleaning tanks 3120 and multiple washing tanks 3130; the soaking tank 3110 is arranged at the upstream end of the cleaning process, and each water tank is provided with a cleaning liquid with corresponding composition, proportion and guaranteed liquid level by a liquid-controlled cleaning system 3600; each water tank is provided with a temperature detection unit, and ultrasonic vibration units and heating units are arranged at multiple cleaning tanks 3120 and multiple washing tanks 3130 as needed, the slow-pulling mechanism 3400 is arranged in the last water tank adjacent to the drying tank 3200, and the throwing mechanism 3300 is arranged in multiple upstream water tanks adjacent to the last water tank.

[0062] Among them, the liquid-controlled cleaning system 3600 includes a clean water supply liquid circuit 3610, a heating water tank 3620, a cleaning liquid supply liquid circuit 3630, a cleaning drainage flow circuit 3640 and a water tank self-circulation flow circuit 3650; the clean water supply liquid circuit 3610 is arranged between the multi-stage water tank 3100 and the heating water tank 3620, and is used to provide hot water and cold water with adjustable ratios to the multi-stage water tank 3100; the cleaning liquid supply liquid circuit 3630 is used to provide cleaning liquids of different types and proportions to the multiple cleaning tanks 3120 and washing tanks 3130; the cleaning drainage flow circuit 3640 is connected to each water tank of the multi-stage water tank 3100 in a controllable manner; the water tank self-circulation flow circuit 3650 is connected to the corresponding washing tank 3130, and is used for circulating and stirring the cleaning liquid in the washing tank 3130.

[0063] The clean water supply path 3610 includes a clean water supply main pipe, a hot water supply path and a cold water supply path connected to each water tank, and the heating water tank 3620 is disposed upstream of the hot water supply path.

[0064] The cleaning liquid supply circuit 3630 includes a cleaning liquid supply station, multiple cleaning liquid pipes for conveying different types of cleaning liquids, and a liquid replenishment control valve; the cleaning liquid supply station includes different types of washing liquid tanks, and the cleaning liquid pipes are controllably connected to the corresponding cleaning tank 3120 and the washing tank 3130 under the control of the liquid replenishment control valve.

[0065] In a specific example, the cleaning liquid supply liquid circuit 3630 can provide four cleaning liquid tanks of Class A cleaning liquid, Class B cleaning liquid, Class C liquid and Class D liquid, each of which is connected to the corresponding cleaning tank 3120 and the washing tank 3130 through a cleaning liquid pipe and a liquid replenishment control valve, wherein the cleaning tank 3120 can be controllably connected to the cleaning liquid tank of Class A cleaning liquid or Class B cleaning liquid, and the washing tank 3130 can be controllably connected to the cleaning liquid tanks of Class C liquid and Class D liquid. For example, the cleaning liquid of Class A, Class B, Class C and Class D can be conventional cleaning liquids, but their matching methods and concentrations are different, such as the cleaning liquid of Class A and Class C are both alkaline liquids, but the concentration of Class C is higher or lower than that of Class A, and the cleaning liquid of Class B and Class D are both acidic liquids, but the acidity of Class D is higher or lower than that of Class B.

[0066] The cleaning drainage flow path 3640 includes a drainage manifold and a drainage main pipe. A drainage manifold controlled by a drainage control valve is arranged at the lower part of each water tank end plate of the multi-stage water tank 3100, and all drainage manifolds are connected to the drainage main pipe.

[0067] The water tank self-circulation flow path 3650 includes a self-circulation pump and a self-circulation pipe valve, and the circulation pipe of the self-circulation pipe valve is connected to the corresponding washing tank 3130. The self-circulation pipe valve includes a self-circulation water outlet pipe valve and a self-circulation water inlet pipe valve. One end of the washing tank 3130 is connected to the self-circulation water outlet pipe valve, and the other end of the self-circulation water outlet pipe valve is connected to the self-circulation pump. The water outlet end of the self-circulation pump is connected to the water inlet end of the self-circulation water inlet pipe valve, and the self-circulation water inlet pipe valve is connected to the other end face of the washing tank 3130.

[0068] The hydraulically controlled cleaning system 3600 also includes a preheating unit 3660 and a plurality of circulation tanks 3670, wherein the circulation tanks 3670 are used to circulate the cleaning liquid in the immersion tank 3110 and the plurality of cleaning tanks 3120 after defoaming, and the circulation supply direction includes a water tank with the same property of the cleaning liquid, and an inserting machine or a degumming machine at an upstream workstation.

[0069] Furthermore, the liquid-controlled cleaning system 3600 also includes a heat exchanger 3680 , which is disposed between the circulation tank 3670 and a water tank that circulates and supplies cleaning fluid of the same property, and is used to heat the branch direct supply liquid circuit of the clean water supply liquid circuit 3610 .

[0070] Each slot is described below.

[0071] Sink No. 0 is a soaking tank 3110, sinks No. 1, 6, 9-13 are cleaning tanks 3120, sinks No. 2-5, 7 and 8 are washing tanks 3130, and the end overflow pipe of sink No. 0 is connected to the external circulation tank 3670, and the outlet pipe of the circulation tank 3670 is connected to other workstations to pump clean water thereto, such as a sheet inserter or a degumming machine. Sinks No. 2-5 are each provided with the aforementioned water tank self-circulation flow path 3650; sinks No. 6-9 are provided with a circulation tank 3670; and sinks No. 14-15 are drying tanks 3200, which provide hot air for drying. Temperature sensors are provided on sinks No. 1-13 and No. 14-15. The water temperature of sinks No. 0-13 is gradually or stagedly increased from 40° to about 90°.

[0072] The basket handling mechanism adopts a cleaning section basket hoisting module 3800 or a handling robot; the cleaning section basket hoisting module 3800 is controlled to move in space and is installed on the outer frame 3700 of the cleaning machine.

[0073] Among them, see Figure 11-Figure 16 The docking device 4000 is arranged between the cleaning machine 3000 and the sorting machine 5000, taking into account the defect detection of the full basket and the appearance detection and reflow of the empty basket. Specifically, the docking device 4000 includes a silicon wafer feeding docking belt line 4100, a full basket defect detection module 4200, a full basket defect rejection module 4300, a docking section basket transfer module 4400, an empty basket tooth detection reflow line 4500 and an empty basket appearance detection streamline 4600.

[0074] Layout relationship: the full basket defect detection module 4200 and the full basket defect rejection module 4300 are arranged at the streamline end of the silicon wafer feeding and docking belt line 4100; the full basket defect rejection module 4300 adopts a "U"-shaped material basket supply method with the upper layer of the defect basket output and the lower layer of the repair basket inflow and lifting; the docking section flower basket transfer module 4400 is used for the spatial transfer of silicon wafer flower baskets; the empty basket shape detection streamline 4600 is arranged downstream of the empty basket basket tooth detection return line 4500; wherein, a line scan camera 4700 for empty basket basket tooth detection is arranged above the empty basket basket tooth detection return line 4500, and a surface array camera 4800 for empty basket shape detection is arranged above the empty basket shape detection streamline 4600.

[0075] The docking device 4000 includes a silicon wafer basket cooling module 4900, which is arranged across the silicon wafer feeding docking belt line 4100 to cool the full wafer basket below.

[0076] The full basket defect detection module 4200 includes an upper layer detection component of the flower basket and a lower layer detection component, both of which include a defect detection camera unit, a detection light source and a detection outer sealing plate arranged on a detection frame, wherein the defect detection camera unit and the detection light source of the upper layer detection component of the flower basket are arranged downward, and the defect detection camera unit and the detection light source of the lower layer detection component of the flower basket are arranged upward.

[0077] See also Fig.12 The full basket defect removal module 4300 includes a full basket output flow line 4310, a full basket removal lifting flow line 4320, a full basket inflow flow line 4330 and a full basket repair lifting flow line 4340 arranged on a full blue defect removal rack 4350; the full basket output flow line 4310 and the full basket inflow flow line 4330 are arranged on the full blue defect removal rack 4350 with intervals up and down, the full basket removal lifting flow line 4320 is vertically arranged at the outer end of the full basket output flow line 4310, and the full basket repair lifting flow line 4340 is vertically arranged at the inner end of the full basket inflow flow line 4330.

[0078] The empty basket tooth detection return line 4500 includes a basket tooth detection frame 4510 and a lifting and transverse movement assembly 4520, wherein the basket tooth detection frame 4510 adopts a double-layer flat frame design, and the lifting and transverse movement assembly 4520 is arranged at the double-layer flat frame of the basket tooth detection frame 4510, and is used to lift and transversely move the flower basket.

[0079] The basket gear detection frame 4510 includes a basket gear detection external frame, an upper supporting flat frame and a lower transverse supporting flat frame; the upper supporting flat frame is horizontally arranged on the top layer of the basket gear detection external frame, and the lower transverse supporting flat frame is horizontally arranged below the upper supporting flat frame, and the height difference between the two is adapted to the height of the flower basket; a plurality of flower basket guides 4530 and a flower basket sensor 4540 are arranged on the upper supporting flat frame for supporting and sensing the flower basket.

[0080] The lifting and transverse movement assembly 4520 includes a lifting flat frame 4521, a lifting cylinder assembly 4522, a transverse movement carrier plate 4523, a transverse movement guide rail assembly 4524 and an empty basket translation drive assembly 4525; the transverse movement carrier plate 4523 is slidably arranged on the lower transverse support flat frame of the basket gear detection frame 4510 through the transverse movement guide rail assembly 4524, the empty basket translation drive assembly 4525 is connected to the transverse movement carrier plate 4523, the lifting cylinder assembly 4522 is arranged between the lifting flat frame 4521 and the transverse movement carrier plate 4523, and the outer width of the lifting flat frame 4521 is smaller than the inner width of the upper support flat frame.

[0081] The lifting and transverse movement assembly 4520 moves in a "U"-shaped space as a whole, lifting, transversely moving, and lowering the flower basket on the flower basket cache position of the basket tooth detection frame 4510 to the line scan detection position. The line scan camera 4700 above the line scan detection position collects line scan images of the flower basket, and the processor performs image processing to determine whether the basket teeth of the flower basket are damaged.

[0082] The empty basket shape detection streamline 4600 includes an empty basket shape detection frame 4610, an empty basket shape detection belt assembly 4620, an empty basket temporary storage conveyor belt assembly 4630 and a shape detection section basket guide 4640; the empty basket shape detection belt assembly 4620 and the empty basket temporary storage conveyor belt assembly 4630 are arranged on the same horizontal plane on the empty basket shape detection frame 4610, and the shape detection section basket guide 4640 is arranged above the empty basket temporary storage conveyor belt assembly 4630; the area array camera 4800 is arranged above the empty basket shape detection belt assembly 4620.

[0083] Among them, see Fig.17 The sorting machine 5000 includes a sorting system including a sorting loading device 5100, a silicon wafer comprehensive detection device 5200 and a non-contact top suction slice unloading sorting device 5300; a material type detection device 5400 and a sorting segment fragment removal device 5500 are arranged between the sorting loading device 5100 and the silicon wafer comprehensive detection device 5200, which are used to detect the silicon wafer model and whether it is broken, and remove the broken silicon wafers to prevent the broken silicon wafers from flowing into the silicon wafer comprehensive detection device 5200; the silicon wafer comprehensive detection device 5200 is used to detect the left and right edge collapse, chamfer collapse, thickness, upper and lower dirt, resistivity, hidden crack module, and upper and lower surface collapse of the silicon wafer, and judge it as an OK wafer or NG wafer according to the comparison of the corresponding item standards, providing a sorting basis for the unloading sorting device 5300.

[0084] The steps for silicon wafer sorting are as follows.

[0085] S51, continuous flipping and loading, through the sorting and loading device 5100, continuous flipping and loading.

[0086] S52, debris removal, pre-detecting the incoming silicon wafers from the sorting and loading device 5100 through the material type detection device 5400, and removing broken silicon wafers through the sorting segment debris removal device 5500, and transporting the intact silicon wafers downstream to the silicon wafer comprehensive detection device 5200.

[0087] S53, defect detection, the silicon wafers passing through are inspected by the silicon wafer comprehensive inspection device 5200 for left and right chipping, chamfer chipping, thickness, upper and lower dirt, resistivity, hidden crack module, and upper and lower surface chipping, so as to determine whether the silicon wafers meet the corresponding standards and judge them as OK or NG wafers.

[0088] S54, material sorting: the material sorting device 5300 performs top suction sorting on the incoming materials according to the detection results of the silicon wafer comprehensive detection device 5200 and puts them into the corresponding NG material box, OK material box or tail material box.

[0089] The above-mentioned sorting machine 5000 can adopt our company's prior sorting machine related patents, such as CN220239307U, CN116274007A, CN116371751A, CN220111668U, CN219378063U, WO2023216737A1, WO2023216740A1, WO2023216738A1, WO2023216739A1, C All or part of the functional modules or components in N219238486U, CN114733795A, CN114733796A, CN217120941U, CN114873272A, CN114871127A, CN114871156A, CN114871157B, CN114871153B, CN114871154B, etc. will not be described in detail again.

[0090] The degumming machine 1000 and the inserting machine 2000 are both arranged in parallel with multiple streamlines, and the sorting machine 5000 is arranged in parallel with multiple sorting streamlines, thereby improving the overall efficiency and production capacity.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for removing, inserting, washing and selecting, characterized in that: The integrated degumming, inserting, washing and sorting equipment comprises a degumming machine (1000), an inserting machine (2000), a cleaning machine (3000), a docking device (4000), a sorting machine (5000) and a general controller; The degumming machine (1000) adopts a spraying and immersion degumming method monitored by a reagent, and uses a degumming detection component (1900) to detect the degumming treatment of the silicon wafers in the silicon wafer basket; The wafer inserting machine (2000) integrates wafer separation, wafer extraction, wafer inserting pre-sorting, wafer inserting and flower basket circulation supply sections. The flower basket circulation supply section receives empty flower baskets that have been detected as OK by the docking device (4000) and delivers full flower baskets filled with silicon wafers to the cleaning machine (3000); The cleaning machine (3000) integrates soaking, cleaning with different detergents and drying processes, and is used for cleaning and drying batches of full flower baskets; The docking device (4000) integrates a full basket detection pre-selection section for silicon wafers and an empty basket detection reflow section, and is used for pre-screening of full basket silicon wafers and appearance detection and reflow of empty baskets; The sorting machine (5000) comprises a silicon wafer comprehensive detection section and a silicon wafer sorting section, and realizes the sorting of silicon wafers with different defect types by top suction sorting; The master controller displays the sorting results of the sorting machine (5000) and feeds forward to the upstream degumming machine (1000), the inserting machine (2000), the cleaning machine (3000) and the docking device (4000), and determines whether the corresponding section should be shut down for maintenance.

2. The integrated equipment for removing, inserting, washing and selecting according to claim 1, characterized in that: The degumming machine (1000) comprises a spraying device (1100), a degumming device (1200), a rinsing device (1300), a degumming workflow (1400), a degumming frame (1500), a degumming transfer module (1600), a loading vehicle (1700), a degumming transverse cover assembly (1800) and a degumming detection assembly (1900); the spraying device (1100) is arranged at the upstream of the degumming workflow (1400) to perform spray degumming, and the degumming detection assembly (1900) collects images of the glued areas of silicon wafers in the silicon wafer basket through an optical assembly.

3. The integrated equipment for removing, inserting, washing and selecting according to claim 1, characterized in that: The slice inserting machine (2000) comprises a slice separation module (2100), a slice extraction module (2200), a pre-sorting slice inserting conveying module (2300) and a quick basket changing module (2400) which are arranged in sequence; an empty flower basket turning module (2500) and a full flower basket turning and conveying module (2600) are arranged side by side downstream of the quick basket changing module (2400); a flower basket hoisting module (2700) is arranged above the empty flower basket turning module (2500) and the full flower basket turning and conveying module (2600); the quick basket changing module (2400) is used for the cyclic transportation of empty flower basket supply and full flower basket withdrawal.

4. The integrated device for removing, inserting, washing and selecting according to claim 1, characterized in that: The cleaning machine (3000) comprises a multi-stage water tank (3100), a drying tank (3200), a throwing mechanism (3300), a slow pulling mechanism (3400), a basket return line (3500), a hydraulically controlled cleaning system (3600) and a basket transport mechanism. The multi-stage water tanks (3100) are arranged side by side and a stepped overflow design from the downstream to the upstream of the process cleaning is adopted between adjacent water tanks with the same type of cleaning liquid. The drying tank (3200) is arranged downstream of the terminal water tank of the multi-stage water tank (3100). The throwing mechanism The structure (3300) and the slow-pull mechanism (3400) are arranged at the water tank of the multi-stage water tank (3100) adjacent to the drying tank (3200), the material basket return line (3500) is arranged at the same side end of the multi-stage water tank (3100) and the drying tank (3200), the hydraulically controlled cleaning system (3600) is connected to the multi-stage water tank (3100) and provides cleaning liquid, and the material basket conveying mechanism is used for the transfer of the material basket between the multi-stage water tank (3100), the drying tank (3200) and the material basket return line (3500).

5. The integrated device for removing, inserting, washing and selecting according to claim 4 is characterized in that: The multi-stage water tank (3100) includes a soaking tank (3110), a plurality of cleaning tanks (3120) and a plurality of washing tanks (3130); the soaking tank (3110) is arranged at the upstream end of the cleaning process, and each water tank is provided with a cleaning liquid with corresponding composition, proportion and guaranteed liquid level by a liquid-controlled cleaning system (3600); each water tank is provided with a temperature detection unit, and ultrasonic vibration units and heating units are arranged at the plurality of cleaning tanks (3120) and the plurality of washing tanks (3130) as required; the slow-pulling mechanism (3400) is arranged in the last water tank adjacent to the drying tank (3200), and the throwing mechanism (3300) is arranged in the plurality of upstream water tanks adjacent to the last water tank.

6. The integrated device for removing, inserting, washing and selecting according to claim 5, characterized in that: The liquid-controlled cleaning system (3600) comprises a clean water supply circuit (3610), a heating water tank (3620), a cleaning liquid supply circuit (3630), a cleaning drainage circuit (3640) and a water tank self-circulation circuit (3650); the clean water supply circuit (3610) is arranged between the multi-stage water tank (3100) and the heating water tank (3620), and is used to provide hot water and cold water with adjustable ratios to the multi-stage water tank (3100); the cleaning liquid supply circuit (3630) is used to provide cleaning liquids of different types and ratios to the plurality of cleaning tanks (3120) and washing tanks (3130); the cleaning drainage circuit (3640) is connected to each water tank of the multi-stage water tank (3100) in a controllable manner; the water tank self-circulation circuit (3650) is connected to the corresponding washing tank (3130), and is used to circulate and stir the cleaning liquid in the washing tank (3130).

7. The integrated equipment for removing, inserting, washing and selecting according to claim 1, characterized in that: The docking device (4000) comprises a silicon wafer feeding docking belt line (4100), a full basket defect detection module (4200), a full basket defect rejection module (4300), a docking section flower basket transfer module (4400), an empty basket tooth detection return line (4500) and an empty basket shape detection streamline (4600); the full basket defect detection module (4200) and the full basket defect rejection module (4300) are arranged at the streamline end of the silicon wafer feeding docking belt line (4100); the full basket defect rejection module (4300) adopts a defect basket upper The invention discloses a "U"-shaped material basket supply method for layer output and repair basket lower layer inflow and lifting; the docking section basket transfer module (4400) is used for spatial transfer of silicon wafer baskets; the empty basket shape detection streamline (4600) is arranged downstream of the empty basket tooth detection return line (4500); wherein, a line scan camera (4700) for empty basket tooth detection is arranged above the empty basket tooth detection return line (4500), and a surface array camera (4800) for empty basket shape detection is arranged above the empty basket shape detection streamline (4600).

8. The integrated device for removing, inserting, washing and selecting according to claim 7 is characterized in that: The docking device (4000) comprises a silicon wafer basket cooling module (4900), and the silicon wafer basket cooling module (4900) is arranged across the silicon wafer feeding docking belt line (4100) and is used to cool the full wafer basket below.

9. The integrated equipment for removing, inserting, washing and selecting according to claim 1, characterized in that: The sorting machine (5000) comprises a sorting system including a sorting and loading device (5100), a silicon wafer comprehensive detection device (5200) and a non-contact top suction chip unloading and sorting device (5300); a material type detection device (5400) and a sorting segment fragment removal device (5500) are arranged between the sorting and loading device (5100) and the silicon wafer comprehensive detection device (5200) to detect the silicon wafer type and whether it is broken, and remove the broken silicon wafers to prevent the broken silicon wafers from flowing into the silicon wafer comprehensive detection device (5200); the silicon wafer comprehensive detection device (5200) performs detection on the silicon wafers including left and right edge chipping, chamfer chipping, thickness, upper and lower dirt, resistivity, hidden crack module, and upper and lower surface chipping, and determines whether it is an OK wafer or an NG wafer according to the comparison of the corresponding item standards, so as to provide a sorting basis for the unloading and sorting device (5300).

10. The integrated equipment for removing, inserting, washing and selecting according to claim 1, characterized in that: The degumming machine (1000) and the sheet inserting machine (2000) both adopt a parallel multi-streamline arrangement, and the sorting machine (5000) adopts a parallel multi-sorting streamline arrangement.

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