Laser pumping source and semiconductor laser

Abstract

The invention discloses a laser pumping source and a semiconductor laser, the laser pumping source comprises an electrode holder and a light emitting unit, an insulating ceramic electrode holder body is adopted, and a welding structure is arranged on an electrode pin, so that the conductivity and the welding quality of the electrode holder are improved; the electrode pins are arranged in the pin connecting parts of the electrode holder body in a penetrating manner, so that the insulativity between the two electrode pins is higher, and the risk of electric leakage is avoided; the first end of the electrode pin is set to be semi-cylindrical and the plane of the first end faces upwards, so that electrical connection between the pin and the chip is facilitated; the second end of the electrode pin is arranged to be the semi-arc-shaped groove, a welding pool can be formed while a wire is supported, soldering tin is prevented from falling out, the welding speed is increased, the welding quality is improved, and the welding time is shortened; therefore, the technical effects that the stability of electrical connection of the pumping source of the laser is improved, high-quality output of pumping laser is ensured, and the overall manufacturing cost is reduced are achieved.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and in particular to a laser pump source and a semiconductor laser. Background Art

[0002] Continuous fiber lasers are lasers that use the special structure of optical fibers to form an all-fiber link with components such as pump sources, pump combiners, rare earth-doped optical fibers, gratings, and output optical cables. The pump source is coupled into an optical fiber output by one or more high-power laser chips, that is, multiple laser chips are connected in series, and then the series-connected chips are connected to the electrode pins outside the pump source. After adding appropriate voltages to the positive and negative electrodes of the electrode pins, the emitted laser can be coupled to an optical fiber output after spatial optical path shaping.

[0003] In the related art, the pump source electrode holder is made of aluminum, and the two electrode pins are separated from the pin mounting holes of the electrode holder by a glass insulating sleeve. However, such a design has disadvantages such as low conductivity, difficulty in welding, weak insulation ability, and high manufacturing cost, which makes it difficult to meet the production and application requirements of laser pump sources. Summary of the invention

[0004] The embodiments of the present application provide a laser pump source and a semiconductor laser to achieve the technical effects of improving the welding quality of the pump source electrode seat, improving the conductivity, reducing the manufacturing cost, increasing the integration, and improving the connection stability of the pump source circuit.

[0005] According to the first aspect of the present application, a laser pump source is provided, comprising: an electrode seat, and a light-emitting unit electrically connected to the electrode seat, wherein the light-emitting unit is arranged above a heat dissipation copper block of a pump source base, the electrode seat is fixed to both ends of the heat dissipation copper block of the pump source base, and the light-emitting unit is electrically connected to a laser driving board through the electrode seat, so that the laser beam emitted by the light-emitting unit is coupled to an optical fiber output after spatial optical path shaping, wherein the electrode seat comprises an electrode seat body and an electrode pin, the electrode seat body adopts an insulating ceramic structure, the electrode pin comprises a welding structure, the electrode seat body is provided with a pin connecting portion, and the electrode pin is penetrated into the pin connecting portion,

[0006] The first end of the electrode pin faces the light emitting unit and is electrically connected to the light emitting unit;

[0007] The second end of the electrode pin is away from the light emitting unit and extends outward to form a groove, and the groove is used to support the wire and form a welding pool.

[0008] Optionally, a semi-cylindrical planar welding portion is formed at the first end of the electrode pin with its plane facing upward, the semi-cylindrical planar welding portion is connected to the light-emitting unit via an aluminum wire, and the current passing through the electrode pin is not less than 100A.

[0009] Optionally, a gap is reserved between the wire welded in the groove and the end surface of the second end of the electrode pin, and is used to fill with solder.

[0010] Optionally, a recessed groove is provided on a side of the pin connection portion close to the light-emitting unit, a pin mounting hole is provided in the recessed groove, and the electrode pin is inserted into the pin mounting hole.

[0011] Optionally, the edges of the electrode holder body and the outer edges of the pin mounting holes are both provided with chamfers, and a metallized welding layer is also provided on the chamfers of the pin mounting holes.

[0012] Optionally, a raised welding structure is formed in the middle of the electrode pin, and a welding surface of the welding structure can be combined and sealed with a metallized welding layer on the pin mounting hole.

[0013] Optionally, the groove comprises a semi-arc groove, and the electrode pin is made of a copper structure with an outer layer plated with nickel.

[0014] Optionally, the light emitting unit includes a first light emitting unit and a second light emitting unit, and the electrode holder includes a first positive electrode holder, a first negative electrode holder, a second positive electrode holder, and a second negative electrode holder.

[0015] The positive electrode of the first light-emitting unit is electrically connected to the first positive electrode seat, the negative electrode of the first light-emitting unit is electrically connected to the first negative electrode seat, and the first positive electrode seat is electrically connected to the second negative electrode seat; the negative electrode of the second light-emitting unit is electrically connected to the second negative electrode seat, and the positive electrode of the second light-emitting unit is electrically connected to the second positive electrode seat.

[0016] Optionally, the first light-emitting unit includes a first laser chip array and a second laser chip array, the second light-emitting unit includes a third laser chip array and a fourth laser chip array, and the plurality of laser chips in each laser chip array are connected in series; the first positive electrode holder, the first negative electrode holder, the second positive electrode holder and the second negative electrode holder each include at least two electrode pins;

[0017] The positive electrode of the first laser chip array is electrically connected to the first pin of the second negative electrode seat through the first pin of the first positive electrode seat, and the first pin of the second negative electrode seat is electrically connected to the negative electrode of the third laser chip array; the negative electrode of the first laser chip array is electrically connected to the first pin of the first negative electrode seat;

[0018] The positive electrode of the third laser chip array is electrically connected to the second pin of the first negative electrode seat through the first pin of the second positive electrode seat, and the second pin of the first negative electrode seat is electrically connected to the negative electrode of the second laser chip array;

[0019] The positive electrode of the second laser chip array is electrically connected to the second pin of the second negative electrode base through the second pin of the first positive electrode base;

[0020] The second pin of the second negative electrode seat is electrically connected to the negative electrode of the fourth laser chip array, and the positive electrode of the fourth laser chip array is electrically connected to the second pin of the second positive electrode seat;

[0021] The second pin of the second positive electrode seat is used as a positive electrode of the pump source to be electrically connected to the positive electrode of the driving plate, and the first pin of the first negative electrode seat is used as a negative electrode of the pump source to be electrically connected to the negative electrode of the driving plate.

[0022] According to a second aspect of the present application, a semiconductor laser is provided, comprising a laser pump source as described in any one of the first aspects above.

[0023] The advantages and beneficial effects of the present application are as follows: a laser pump source and a semiconductor laser are provided, comprising: an electrode seat and a light-emitting unit electrically connected to the electrode seat, wherein the electrode seat comprises an electrode seat body and an electrode pin; by adopting an insulating ceramic electrode seat body and arranging a welding structure on the electrode pin, the conductivity and welding quality of the pump source electrode seat are improved; by inserting the electrode pin into the pin connecting portion of the electrode seat body, the insulation between the two electrode pins is made stronger, thereby avoiding the risk of leakage; by setting the first end of the electrode pin to be semi-cylindrical and with its plane facing upward, it is easier to connect the pin to the chip, thereby improving the stability and reliability of the electrical connection; by setting the second end of the electrode pin to be a semi-arc groove, a welding molten pool can be formed while supporting the wire, thereby avoiding the solder in a molten state from falling out during welding, and improving the welding speed and welding quality, while reducing the welding man-hours and welding costs of the electrode seat. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0025] Figure 1 This is one of the structural schematic diagrams of a laser pump source in one embodiment of the present application;

[0026] Figure 2This is a second structural schematic diagram of a laser pump source in one embodiment of the present application;

[0027] Figure 3 This is one of the structural schematic diagrams of the electrode holder in one embodiment of the present application;

[0028] Figure 4 This is a second structural schematic diagram of an electrode holder in one embodiment of the present application;

[0029] Figure 5 This is one of the structural schematic diagrams of the electrode holder body in one embodiment of the present application;

[0030] Figure 6 This is a second structural schematic diagram of the electrode holder body in one embodiment of the present application;

[0031] Figure 7 This is a schematic diagram of the structure of an electrode pin in one embodiment of the present application;

[0032] Figure 8 This is a schematic diagram of the structure of a laser chip in one embodiment of the present application;

[0033] In the figure: 1, electrode holder; 2, light-emitting unit; 3, heat dissipation copper block of pump source base; 4, wire; 5, cylindrical mirror array; 6, nozzle; 11, electrode holder body; 12, electrode pin; 13, welding structure; 111, pin connection part; 112, sink groove; 113, pin mounting hole; 114, metallized welding layer; 115, countersunk hole; 121, first end of electrode pin; 122, second end of electrode pin; 123, groove; 131, welding surface;

[0034] 201, first light-emitting unit; 202, second light-emitting unit; 2011, first laser chip array; 2012, second laser chip array; 2021, third laser chip array; 2022, fourth laser chip array; 211, chip body; 212, aluminum nitride ceramic sheet; 213, copper plating layer; 214, solder layer; 215, gold wire;

[0035] 101, first positive electrode seat; 102, first negative electrode seat; 103, second positive electrode seat; 104, second negative electrode seat; 1011, first pin of first positive electrode seat; 1012, second pin of first positive electrode seat; 1021, first pin of first negative electrode seat; 1022, second pin of first negative electrode seat; 1031, first pin of second positive electrode seat; 1032, second pin of second positive electrode seat; 1041, first pin of second negative electrode seat; 1042, second pin of second negative electrode seat;

[0036] S represents a reserved gap between the welding end surface of the wire and the end surface of the second end of the electrode pin. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0038] As mentioned above, the pump source electrode holder in the prior art is mostly made of aluminum material, and the two electrode pins are separated from the pin mounting holes of the electrode holder by a glass insulating sleeve. For example, during the production process, one end of the electrode pin is first processed into a shovel-shaped structure, and then a glass insulating ring is put on and set in the two cylindrical pin mounting holes pre-processed in the electrode holder. Then, through high-temperature sintering, the molten glass is cooled and the electrode pin is fixed on the electrode holder to achieve the insulation function.

[0039] However, this electrode holder design has the following disadvantages: First, the thermal expansion and contraction of the electrode pin material must be consistent with that of the glass insulating ring, otherwise the glass insulating ring will break, and the electrode cannot be fixed or insulated, thus limiting the choice of electrode pin material. For example, a copper core pin is usually coated with a high-cost kovar alloy, but this type of pin has poor conductivity and is not easy to weld; second, the manufacturing process requires that the other end of the electrode pin must be cylindrical so that the cylindrical insulating ring can be put on the electrode pin, but this shape is not conducive to welding with external connecting wires; third, the glass insulating ring is thin, about 2.5 mm, and has defects such as easy breakage, weak insulation performance, and easy leakage; in addition, this structure limits the maximum size of the electrode pin, thereby limiting the current that the electrode pin can carry, for example, a diameter of 3.5 mm and a cross-sectional area of ​​5.5 mm 2 The theoretical current carrying limit of the electrode pin does not exceed 50A; of course, in addition to the high cost of the electrode pin material itself, the processing cost of the entire structure is also relatively high.

[0040] Based on this, the present application provides a laser pump source and a semiconductor laser to achieve the technical effects of improving the welding quality of the pump source electrode seat, improving conductivity, reducing manufacturing costs, higher integration, and improving the stability of the pump source circuit structure.

[0041] The technical concept of the present application is that, on the one hand, the electrode base material is improved from traditional aluminum to an insulating ceramic structure, and the material of the electrode pin is copper with nickel plating on the surface, thereby not only maintaining a high conductivity but also having better weldability; on the other hand, one end of the electrode pin is set to a semi-cylindrical shape to facilitate the circuit connection between it and the laser chip, thereby improving the stability and reliability of the circuit connection; the other end of the electrode pin can be set to other shapes suitable for automatic welding, and the front end of the electrode pin at this end is set to a semi-arc groove, thereby supporting the wire while forming a welding molten pool, which not only avoids the fall of the molten solder during the welding process, but also can further improve the welding speed and welding quality.

[0042] The technical solutions provided by various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0043] The present application embodiment provides a laser pump source, such as Figure 1 and Figure 2 As shown, a schematic diagram of the structure of the laser pump source is provided respectively; the laser pump source comprises: an electrode holder 1, and a light-emitting unit 2 electrically connected to the electrode holder, the light-emitting unit 2 is arranged above a heat-dissipating copper block 3 of the pump source base, the electrode holder 1 is fixed to both ends of the heat-dissipating copper block 3 of the pump source base, and the light-emitting unit 2 is electrically connected to the laser driving board through the electrode holder 1, so that the laser beam emitted by the light-emitting unit 2 is coupled to an optical fiber output after spatial optical path shaping;

[0044] like Figure 3 and Figure 4 As shown, schematic diagrams of the structures of the electrode holder are provided respectively; wherein, the electrode holder 1 includes an electrode holder body 11 and an electrode pin 12, the electrode holder body 11 adopts an insulating ceramic structure, the electrode pin 12 includes a welding structure 13, the electrode holder body 11 is provided with a pin connecting portion 111, the electrode pin 12 is inserted into the pin connecting portion 111, the first end 121 of the electrode pin faces the light-emitting unit 2, and the first end 121 of the electrode pin is electrically connected to the light-emitting unit 2; the second end 122 of the electrode pin is away from the light-emitting unit 2, and extends outward to form a groove 123, the groove 123 is used to support the wire 4 and form a welding molten pool.

[0045] Specifically, in this embodiment, the laser pump source includes: an electrode base 1, a light emitting unit 2 electrically connected to the electrode base, a heat dissipating copper block 3 and a wire 4 at the pump source base, and a Figure 1As shown, the electrode holder 1 can be fixedly mounted on one side of the heat dissipation copper block 3 of the pump source base. Preferably, the electrode holder 1 can be fixedly mounted on both ends of the heat dissipation copper block 3 of the pump source base through the countersunk hole 115 arranged under the electrode holder body 11; at the same time, multiple electrode holders 1 can be electrically connected through the wire 4, and the light-emitting unit 2 and the electrode holder 1 are electrically connected by aluminum wire; in addition, the heat dissipation copper block 3 of the pump source base can be used as a heat sink of the pump source, preferably a copper material structure, so that a pump source cooling channel is arranged inside the heat dissipation copper block 3 of the pump source base to achieve heat dissipation of the pump source.

[0046] Furthermore, the embodiment of the present application improves the electrode holder body 11 from traditional aluminum material to a sintered insulating ceramic structure, and metalizes the two pin mounting holes 113 on the electrode holder body 11, and at the same time, a welding structure 13 is set on the electrode pin 12, so that the two electrode pins 12 can be fixed to the electrode holder body 11 by brazing. Since the brazing temperature is much higher than that of tin soldering, the subsequent connection of the wire 4 and the electrode pin 12 by the tin soldering process will not affect the fixation of the electrode pin 12 on the electrode holder body 11; preferably, the electrode pin 12 adopts a copper structure with nickel plating on the surface. Since the copper structure has a higher conductivity, it not only improves the conductivity of the electrode pin, but also has good weldability.

[0047] Furthermore, combined with Figures 1 to 4 As shown, the two electrode pins 12 are respectively inserted into the two pin mounting holes 113 of the pin connecting portion 111. Since the two electrode pins 12 are separated by an insulating ceramic structure instead of a thin glass insulating ring, the insulation performance depends on the spacing between the two electrode pins 12. The spacing can be adjusted according to the actual situation and determined according to the withstand voltage level, thereby greatly improving the insulation strength, avoiding the risk of leakage, and eliminating the need for leakage testing.

[0048] Continue to refer Figures 1 to 4 It can be seen that the first end 121 of each electrode pin faces the light-emitting unit 2, and the first end 121 of the electrode pin is electrically connected to the light-emitting unit 2; the second end 122 of each electrode pin faces away from the light-emitting unit 2, and the front end of the second end 122 of the electrode pin extends outward to form a groove 123, and the groove 123 is preferably a semi-arc groove, and the groove 123 is used to support the wire 4 and form a welding molten pool, which can prevent the solder in a molten state from falling off during the welding process, thereby further improving the welding speed and welding quality, and reducing the overall processing cost of the electrode holder.

[0049] It should be noted that the present application does not limit the polarity of the two electrode pins on the pump source electrode seat. For example, when only one pump source electrode seat is used, the polarity of the two electrode pins can be set to be different, that is, set to be a positive electrode pin and a negative electrode pin respectively, and the pump source electrode seat is fixed to one side of the heat dissipation copper block of the pump source base; for another example, see Figure 1 As shown, when more than two electrode holders are used, the polarities of the two electrode pins can be set to be the same, that is, both are positive pins or both are negative pins, and multiple pump source electrode holders are respectively fixed at both ends of the heat dissipation copper block of the pump source base; of course, the above descriptions of the material, quantity, size, polarity and connection relationship of the electrode holder 1 and the light-emitting unit 2 are only exemplary descriptions and cannot be understood as limitations on the present application.

[0050] It can be seen that, different from the existing design of aluminum electrode holder and glass insulating ring, the technical solution of the laser pump source of the embodiment of the present application improves the conductivity and welding quality of the pump source electrode holder by adopting an insulating ceramic electrode holder body and setting a welding structure on the electrode pin; by inserting the electrode pin into the pin connection part of the electrode holder body, the insulation between the two electrode pins is stronger, avoiding the risk of leakage; by setting the first end of the electrode pin to a semi-cylindrical shape and making it face upward, it is more convenient to connect the pin to the chip, and improves the stability and reliability of the electrical connection; at the same time, by setting the second end of the electrode pin to a semi-arc groove, a welding pool can be formed while supporting the wire, which not only avoids the solder in a molten state from falling out during the welding process, but also improves the welding speed and welding quality of the pump source electrode holder. At the same time, the welding man-hours and welding costs of the electrode holder are also reduced.

[0051] In some embodiments of the present application, reference Figure 2 As shown, the laser pump source also includes: a cylindrical mirror array 5 corresponding to the light-emitting unit 2, a FAC focusing lens arranged at the front end of each laser chip, a nozzle 6 for connecting the optical fiber, and optical devices such as output optical fiber, cylindrical lens, cylindrical mirror bracket, etc. It can be understood that inside the laser pump source, multiple laser chips in the light-emitting unit 2 are connected in series, and then each group of chip arrays after series connection are respectively connected to different electrode holders 1. When the electrode pins of the electrode holder are applied with appropriate voltages, these series-connected laser chips can emit light at the same time, and the emitted light beams pass through a series of optical devices such as the FAC focusing lens, the cylindrical mirror array 5, and can be coupled to an optical fiber output after spatial light path shaping, thereby obtaining a high-power pump laser. In addition, the shaping and coupling of the laser spatial light path are not the improvement points of this application, which can be implemented with reference to the existing scheme, and will not be repeated here.

[0052] In some embodiments of the present application, Figure 7As shown, a schematic diagram of the structure of an electrode pin is provided, combined with Figures 1 to 7 As shown, the first end 121 of the electrode pin is formed with a semi-cylindrical planar welding portion, which is connected to the light-emitting unit 2 through an aluminum wire, and the current passing through the electrode pin 12 is not less than 100A. In other words, unlike the electrode pins with limited structures in the prior art, the size of the electrode pin 12 in the embodiment of the present application is no longer limited, so the current that can be carried is no longer limited; for example, the length of the semi-cylindrical planar welding portion of the present embodiment is not less than 4mm, and its radius is not less than 4mm; for another example, the diameter of the wire welded to the groove 123 is 5.5mm, and its cross-sectional area is 23.74mm 2 , which is 4.3 times the cross-sectional area of ​​the existing electrode pin. The inner diameter of the groove is preferably 6mm, the outer diameter is preferably 8mm, and the length is preferably 8.5mm. Therefore, the maximum current value theoretically passing through the electrode pin 12 in this embodiment is not less than 100A, which further improves the conductivity while ensuring the welding quality.

[0053] In some preferred embodiments, continue to refer to Figure 7 As shown, the groove 123 includes a semi-arc groove, and the electrode pin 12 adopts a copper structure with an outer layer of nickel plating; that is, the front end of the second end 122 of the electrode pin extends outward to form a semi-arc groove, thereby supporting the wire while forming a welding molten pool, which not only avoids the solder in a molten state from falling out during welding, but also improves the welding speed and quality.

[0054] In some embodiments, Figure 4 As shown, a gap S is reserved between the wire 4 welded in the groove 123 and the end surface of the second end 122 of the electrode pin, and is used to fill the solder. In addition, to ensure the conductivity and welding quality, the optimal size of the gap S should be determined by process tests. Preferably, the gap S between the welding end surface of the wire 4 and the second end 122 of the electrode pin is 1.5 mm.

[0055] In some embodiments, Figure 5 and Figure 6 As shown, schematic diagrams of the structure of the electrode holder body are provided respectively; a recess 112 is provided on one side of the pin connection portion 111 close to the light-emitting unit 2, a pin mounting hole 113 is provided in the recess 112, and the electrode pin 12 is inserted into the pin mounting hole 113.

[0056] Specifically, in order to facilitate the dry pressing of the insulating ceramic structure, the depth range of the sink 112 is set to 1.5mm-3.5mm, preferably 1.5mm, and the distance range from the edge of the sink 112 to the side wall is 0.7mm-1mm, preferably 0.7mm. Figure 6As shown, the sinking depth of the countersunk hole 115 is set to 2.5 mm-5.5 mm, preferably 2.5 mm.

[0057] In some preferred embodiments, continue to refer to Figure 5 and Figure 6 As shown, each edge of the electrode holder body 11 and the outer edge of the pin mounting hole 113 and the outer edge of the countersunk hole 115 are provided with chamfers to prevent the product from breaking during processing and improve the strength and aesthetics of the parts. Preferably, the chamfers include a fillet of R0.2mm-R0.3mm or a 45° chamfer of C0.2mm-C0.3mm.

[0058] At the same time, a metallized welding layer 114 is also provided on the chamfer of the pin mounting hole 113 so as to be welded with the welding surface 131 on the electrode pin 12. The height of the metallized welding layer 114 is preferably 0.5 mm, and the single-side gap between the electrode pin 12 and the pin mounting hole 113 is preferably 0.1 mm.

[0059] In some embodiments, a radially protruding welding structure 13 is formed in the middle of the electrode pin 12, and the welding surface 131 of the welding structure 13 can be combined and sealed with the metallized welding layer 114 on the pin mounting hole 113; for example, the surface of the metallized welding layer 114 is printed with molybdenum manganese slurry and metallized, and the sealing is treated with silver and copper, so that the welding air tightness can reach 1x10 -10 Pa*m 3 / s, further improving the welding quality.

[0060] In some embodiments of the present application, Figure 1 As shown, the light-emitting unit 2 includes a first light-emitting unit 201 and a second light-emitting unit 202, the electrode seat 1 includes a first positive electrode seat 101, a first negative electrode seat 102, a second positive electrode seat 103 and a second negative electrode seat 104, the positive electrode of the first light-emitting unit 201 is electrically connected to the first positive electrode seat 101, the negative electrode of the first light-emitting unit 201 is electrically connected to the first negative electrode seat 102, and the first positive electrode seat 101 is electrically connected to the second negative electrode seat 104; the negative electrode of the second light-emitting unit 202 is electrically connected to the second negative electrode seat 104, and the positive electrode of the second light-emitting unit 202 is electrically connected to the second positive electrode seat 103.

[0061] In some embodiments, the first light-emitting unit 201 includes a first laser chip array 2011 and a second laser chip array 2012, the second light-emitting unit 202 includes a third laser chip array 2021 and a fourth laser chip array 2022, and the multiple laser chips in each laser chip array are connected in series; the first positive electrode seat 101, the first negative electrode seat 102, the second positive electrode seat 103 and the second negative electrode seat 104 each include at least two electrode pins; the positive electrode of the first laser chip array 2011 is electrically connected to the first pin 1041 of the second negative electrode seat through the first pin 1011 of the first positive electrode seat, and the first pin 1041 of the second negative electrode seat is electrically connected to the negative electrode of the third laser chip array 2021; the negative electrode of the first laser chip array 2011 is electrically connected to the first pin 1021 of the first negative electrode seat; The positive electrode of the three laser chip arrays 2021 is electrically connected to the second pin 1022 of the first negative electrode seat through the first pin 1031 of the second positive electrode seat, and the second pin 1022 of the first negative electrode seat is electrically connected to the negative electrode of the second laser chip array 2012; the positive electrode of the second laser chip array 2012 is electrically connected to the second pin 1042 of the second negative electrode seat through the second pin 1012 of the first positive electrode seat; the second pin 1042 of the second negative electrode seat is electrically connected to the negative electrode of the fourth laser chip array 2022, and the positive electrode of the fourth laser chip array 2022 is electrically connected to the second pin 1032 of the second positive electrode seat; the second pin 1032 of the second positive electrode seat is used as the positive electrode of the pump source to be electrically connected to the positive electrode of the driving board, and the first pin 1021 of the first negative electrode seat is used as the negative electrode of the pump source to be electrically connected to the negative electrode of the driving board.

[0062] Specifically, after applying voltage to the electrode pins of each electrode holder, the laser chips in each laser chip array emit light at the same time; for example, in this embodiment, the series paths of each laser chip array are: the positive electrode of the driving plate, the fourth laser chip array 2022, the second laser chip array 2012, the third laser chip array 2021, the first laser chip array 2011, and the negative electrode of the driving plate, which will not be described here; it can be seen that this embodiment, through the above circuit arrangement, on the one hand, realizes the electrical connection between multiple laser chip arrays and their corresponding electrode holders, and the connection arrangement is more compact, the integration is higher, and the volume is smaller; on the other hand, multiple laser chip arrays connected in series can emit light at the same time after power is turned on, and then the emitted light is coupled to an optical fiber output after spatial optical path shaping, so as to obtain a more stable output of high-quality pump laser. Of course, the above contents about the number, layout position and connection relationship of the laser chip arrays and the electrode holders are only exemplary embodiments and cannot be understood as limitations on the present application.

[0063] Preferably, if Figure 8As shown, a schematic diagram of the structure of a laser chip is provided, and the laser chip at least includes a chip body 211, an aluminum nitride ceramic sheet 212, a copper-plated layer 213, a solder layer 214 and a gold wire 215; wherein the chip body 211 is welded on the upper side of the aluminum nitride ceramic sheet 212 with insulation and heat conduction function through the solder layer 214, and copper is plated on the left side (with a gap with the laser chip) of the aluminum nitride ceramic sheet 212, the lower side of the laser chip 212 and the right side area, and then the chip is sintered on the aluminum nitride ceramic sheet 212; at this time, the lower side of the laser chip 212 is connected to the copper-plated layer, that is, it serves as an anode, and the laser chip 212 is connected to the copper-plated layer in the left area through the gold wire 215, that is, it serves as a cathode, and at the same time, a FAC focusing lens can be attached to the front light-emitting area of ​​each laser chip 212 using an ultraviolet adhesive strip to form a COS chip packaging unit (chip on The COS chip packaging unit is welded above the heat dissipation copper block 3 of the pump source base, so that two adjacent chips are connected in series through aluminum wires, thereby forming a laser chip array including multiple series-connected chips. It can be understood that by increasing the number of series-connected laser chips, the output power of the laser pump source can be increased, and high-quality, high-power pump lasers can be obtained. Of course, the present application does not limit the structure, number, connection relationship, etc. of the laser chip, and the above content cannot be understood as a limitation of the present application.

[0064] In another embodiment of the present application, a semiconductor laser is also proposed, including a laser pump source as in any of the aforementioned embodiments. The pump source in the aforementioned embodiment is applied to the semiconductor laser, which improves the reliability of the electrical connection while ensuring the overall performance of the laser, improving the stability of the laser output power, and reducing the manufacturing cost. Of course, the relevant explanations about the laser pump source are applicable to the semiconductor laser in this embodiment and will not be repeated here.

[0065] In summary, the present application has achieved at least the following technical effects: the laser pump source of the embodiment of the present application, first, by adopting an insulating ceramic electrode holder body and setting a welding structure on the electrode pin, the conductivity and welding quality of the pump source electrode holder are improved. Secondly, by inserting the electrode pin into the pin connection part of the electrode holder body, the insulation between the two electrode pins is stronger, avoiding the risk of leakage. Thirdly, by setting the first end of the electrode pin to a semi-cylindrical shape and facing the light-emitting unit, it is more convenient to connect the pin to the chip, and the stability and reliability of the electrical connection are improved; at the same time, by setting the second end of the electrode pin to a semi-arc groove, a welding pool can be formed while supporting the external wire, which not only avoids the solder in a molten state from falling out during the welding process, but also can improve the welding speed and welding quality, and reduce the welding time and welding cost. Finally, by applying the above-mentioned pump source to a semiconductor laser, while improving the reliability of the electrical connection, the overall performance of the laser is guaranteed, the stability of the laser output power is improved, and the manufacturing cost is reduced.

[0066] Optionally, when the temperature of the pump source is relatively low, the electrode seat body can adopt a plastic structure, so that the electrode pins can be directly packaged on the electrode seat body by a plastic molding method without the need to open metallized pin mounting holes, thereby eliminating the process of welding the electrode pins to the electrode seat body and saving manufacturing time.

[0067] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "front", "back", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0068] In the present invention, unless otherwise clearly specified and limited, the terms such as "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0069] It should be noted that, in the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more. It should also be noted that the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of further restrictions, the elements defined by the sentence "include one..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0070] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0071] The above is only a specific embodiment of the present invention. Under the above teachings of the present invention, those skilled in the art can make other improvements or modifications on the basis of the above embodiments. Those skilled in the art should understand that the above specific description is only to better explain the purpose of the present invention, and the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A laser pump source, characterized in that: include: An electrode seat (1), and a light-emitting unit (2) electrically connected to the electrode seat, wherein the light-emitting unit (2) is arranged above a heat-dissipating copper block (3) of a pump source base, the electrode seat (1) is fixed to both ends of the heat-dissipating copper block (3) of the pump source base, and the light-emitting unit (2) is electrically connected to a laser driving board via the electrode seat (1), so that the laser beam emitted by the light-emitting unit (2) is coupled to an optical fiber output after spatial optical path shaping, wherein: The electrode seat (1) comprises an electrode seat body (11) and an electrode pin (12); the electrode seat body (11) adopts an insulating ceramic structure; the electrode pin (12) comprises a welding structure (13); the electrode seat body (11) is provided with a pin connection portion (111); the electrode pin (12) is inserted into the pin connection portion (111); The first end (121) of the electrode pin faces the light-emitting unit (2) and is electrically connected to the light-emitting unit (2); The second end (122) of the electrode pin faces away from the light-emitting unit (2) and extends outward to form a groove (123), wherein the groove (123) is used to support the wire (4) and form a welding molten pool.

2. The pump source according to claim 1, characterized in that: A semi-cylindrical planar welding portion is formed at the first end (121) of the electrode pin and its plane faces upwards; the semi-cylindrical planar welding portion is connected to the light-emitting unit (2) via an aluminum wire, and a current passing through the electrode pin (12) is not less than 100A.

3. The pump source according to claim 1, characterized in that: A gap is reserved between the wire (4) welded in the groove (123) and the end surface of the second end (122) of the electrode pin, and is used to fill with solder.

4. The pump source according to claim 1, characterized in that: A recessed groove (112) is provided on one side of the pin connection portion (111) close to the light-emitting unit (2), a pin mounting hole (113) is provided in the recessed groove (112), and the electrode pin (12) is inserted into the pin mounting hole (113).

5. The pump source according to claim 4, characterized in that: The edges of the electrode seat body (11) and the outer edges of the pin mounting holes (113) are both provided with chamfers, and a metallized welding layer (114) is also provided on the chamfers of the pin mounting holes (113).

6. The pump source according to claim 5, characterized in that: A protruding welding structure (13) is formed in the middle of the electrode pin (12), and a welding surface (131) of the welding structure (13) can be combined and sealed with a metallized welding layer (114) on the pin mounting hole (113).

7. The pump source according to claim 1, characterized in that: The groove (123) comprises a semi-arc groove, and the electrode pin (12) is made of a copper structure with an outer layer plated with nickel.

8. The pump source according to claim 1, characterized in that: The light-emitting unit (2) comprises a first light-emitting unit (201) and a second light-emitting unit (202); the electrode base (1) comprises a first positive electrode base (101), a first negative electrode base (102), a second positive electrode base (103) and a second negative electrode base (104); The positive electrode of the first light-emitting unit (201) is electrically connected to the first positive electrode seat (101), the negative electrode of the first light-emitting unit (201) is electrically connected to the first negative electrode seat (102), and the first positive electrode seat (101) is electrically connected to the second negative electrode seat (104); the negative electrode of the second light-emitting unit (202) is electrically connected to the second negative electrode seat (104), and the positive electrode of the second light-emitting unit (202) is electrically connected to the second positive electrode seat (103).

9. The pump source according to claim 8, characterized in that: The first light-emitting unit (201) comprises a first laser chip array (2011) and a second laser chip array (2012); the second light-emitting unit (202) comprises a third laser chip array (2021) and a fourth laser chip array (2022); and a plurality of laser chips in each laser chip array are connected in series; the first positive electrode holder (101), the first negative electrode holder (102), the second positive electrode holder (103) and the second negative electrode holder (104) each comprise at least two electrode pins; The positive electrode of the first laser chip array (2011) is electrically connected to the first pin (1041) of the second negative electrode seat through the first pin (1011) of the first positive electrode seat, and the first pin (1041) of the second negative electrode seat is electrically connected to the negative electrode of the third laser chip array (2021); the negative electrode of the first laser chip array (2011) is electrically connected to the first pin (1021) of the first negative electrode seat; The positive electrode of the third laser chip array (2021) is electrically connected to the second pin (1022) of the first negative electrode seat via the first pin (1031) of the second positive electrode seat, and the second pin (1022) of the first negative electrode seat is electrically connected to the negative electrode of the second laser chip array (2012); The positive electrode of the second laser chip array (2012) is electrically connected to the second pin (1042) of the second negative electrode base via the second pin (1012) of the first positive electrode base; The second pin (1042) of the second negative electrode seat is electrically connected to the negative electrode of the fourth laser chip array (2022), and the positive electrode of the fourth laser chip array (2022) is electrically connected to the second pin (1032) of the second positive electrode seat; The second pin (1032) of the second positive electrode seat is used as a pump source positive electrode to be electrically connected to the positive electrode of the driving plate, and the first pin (1021) of the first negative electrode seat is used as a pump source negative electrode to be electrically connected to the negative electrode of the driving plate.

10. A semiconductor laser, characterized in that: Comprising the laser pump source according to any one of claims 1 to 9.

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