Transceiving network between common-caliber phased array subarray antennas

Abstract

The invention relates to a transmitting and receiving network between common-caliber phased array subarray antennas. The transmitting and receiving network comprises an active plate, a metal plate and a network plate which are sequentially arranged from top to bottom, the metal plate is used for assisting the active plate in heat dissipation; the active plate at least comprises an amplifier and a power supply; the transmit-receive network board comprises a power division network layer, a power combination network layer and a dielectric layer. A floor, a first dielectric layer, a first transmitting power dividing network layer, an Nth dielectric layer, an Nth transmitting power dividing network layer, an (N + 1) th dielectric layer, a first receiving power combining network layer, an (N + 2) th dielectric layer, a second receiving power combining network layer,..., a 2Nth dielectric layer, an Nth receiving combining network layer, a (2N + 1) th dielectric substrate and a floor are sequentially arranged from top to bottom. And a pp layer and a floor are arranged between any power division network layer and the adjacent dielectric layer and between any power combination network layer and the adjacent dielectric layer. The Wilkinson power divider is adopted to improve the channel isolation, so that the transceiving network is small in size, light in weight, high in isolation and high in amplitude consistency.

Description

Technical Field

[0001] The present invention relates to the field of phased array antenna communication, and in particular to a co-aperture phased array sub-array antenna transceiver network. Background Art

[0002] Due to the congestion of spectrum resources below 6GHz, various communication fields are currently developing towards the millimeter wave band. However, the millimeter wave band has a short wavelength and poor diffraction and penetration capabilities, so the path loss during propagation is large and the signal-to-noise ratio deteriorates. In order to solve this problem, multi-beam antennas and beamforming technologies have been proposed. Multi-beam array antennas can use antenna units with process physical apertures to generate multiple independent high-gain narrow beams in different directions, so they can cover a certain angle range. Phased array antennas are widely used in satellite systems due to their easy processing, low cost, and diverse implementation methods.

[0003] Multi-beam phased array antennas share a physical aperture, making multi-beam networks particularly important. Traditional forms of multi-beam networks are mainly waveguide power division networks and modular networks where standard module devices are connected by cables. However, they all have the disadvantages of being large in size, heavy in weight, and difficult to integrate. Summary of the invention

[0004] In order to solve the technical problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a co-aperture phased array sub-array antenna transceiver network with small size, light weight, low loss, high isolation and high amplitude consistency, which can meet the feeding requirements between tile-type sub-array antennas.

[0005] To achieve the above-mentioned object of the invention, the present invention provides a co-aperture phased array sub-array antenna transceiver network, comprising an active board, a metal board and a network board arranged in sequence from top to bottom;

[0006] The metal plate is used to assist the active plate in heat dissipation;

[0007] The active board includes at least an amplifier and a power supply;

[0008] The transceiver network board includes a power division network layer, a power combination network layer and a dielectric layer, and is sequentially arranged from top to bottom: a floor, a first dielectric layer, a first transmitting power division network layer, a second dielectric layer, a second transmitting power division network layer, ..., an Nth dielectric layer, an Nth transmitting power division network layer, an N+1th dielectric layer, a first receiving power combination network layer, an N+2th dielectric layer, a second receiving power combination network layer, ..., a 2Nth dielectric layer, an Nth receiving combination network layer, a (2N+1)th dielectric substrate, and a floor;

[0009] A PP layer and a floor are arranged between any of the power division network layer, the power combination network layer and the adjacent dielectric layer.

[0010] According to a technical solution of the present invention, the active board and the network board are connected by a wool button, and the wool button passes through the metal plate.

[0011] According to a technical solution of the present invention, the amplifier of the active board is located on a side of the active board close to the network board and above the metal plate.

[0012] According to a technical solution of the present invention, the transceiver network includes N transmit beam networks and N receive beam networks;

[0013] The value range of N is: N≥4.

[0014] According to a technical solution of the present invention, any of the transmit beam networks is a 1-to-12 power division network corresponding to 12 antenna subarrays;

[0015] The one-to-12-way power splitting network comprises two stages of compact one-to-two Wilkinson power splitters and one stage of one-to-three Wilkinson power splitters.

[0016] According to a technical solution of the present invention, any of the receiving beam networks is a one-way-12-way combining network corresponding to 12 antenna subarrays;

[0017] The one-to-12-way combining network comprises two stages of compact one-to-two Wilkinson combiners and one stage of one-to-three Wilkinson combiner.

[0018] According to a technical solution of the present invention, any of the transmit beam networks adopts a stripline power splitter network.

[0019] Any of the receiving beam networks adopts a stripline combining network;

[0020] The isolation resistor is arranged between the dielectric layer and the PP layer by adopting a buried resistor process.

[0021] According to a technical solution of the present invention, when the one-to-three Wilkinson power divider operates in the Ka band, the volume is less than 2.4 mm x 2.6 mm.

[0022] According to a technical solution of the present invention, a plurality of through holes are arranged in an array on the metal plate.

[0023] According to one solution of the present invention, the routing of the transmit beam network and the receive beam network overlap in the vertical direction, and the backbone network lines share a metal ground hole;

[0024] The transceiver network and the interface connection adopt a quasi-coaxial structure.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] In the present invention, a multilayer board structure is adopted to integrate multiple beam networks on a network board. The main lines of the beam networks are all on the same vertical plane and can share a group of metallized vias to reduce the loss caused by redundant winding. The active board and the network board are connected by a button to reduce signal loss. The metal ground hole and the coaxial structure avoid the leakage of microwave signals, reduce the coupling between the strip lines, and avoid the occurrence of undesirable resonance. The Wilkinson power divider is adopted to improve the channel isolation, so as to realize a small size, light weight, low loss, high isolation and high amplitude consistency transceiver network. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 A block diagram of a receiving network between co-aperture phased sub-array antennas provided by an embodiment of the present invention is schematically shown;

[0029] Figure 2 A block diagram of a transmission network between co-aperture phased sub-array antennas provided by an embodiment of the present invention is schematically shown;

[0030] Figure 3 A schematic diagram of a transceiver network structure provided by an embodiment of the present invention is schematically shown;

[0031] Figure 4 A schematic diagram showing a side view of a transceiver network board between co-aperture phased sub-array antennas provided by an embodiment of the present invention;

[0032] Figure 5 A schematic top view of a co-aperture phased sub-array antenna transceiver network board provided by an embodiment of the present invention is shown;

[0033] Figure 6 A schematic diagram showing a network routing diagram of a transceiver network board between co-aperture phased sub-array antennas provided by an embodiment of the present invention;

[0034] Figure 7 A schematic diagram of a one-to-two Wilkinson diagram of a co-aperture phased sub-array antenna transceiver network board provided by an embodiment of the present invention is shown;

[0035] Figure 8 A one-to-three Wilkinson diagram of a co-aperture phased subarray antenna transceiver network board provided by an embodiment of the present invention is schematically shown.

[0036] in, Figures 1 to 8The corresponding relationship between the reference numerals and the component names is as follows:

[0037] 1. first dielectric layer; 2. second dielectric layer; 3. third dielectric layer; 4. fourth dielectric layer; 5. fifth dielectric layer; 6. sixth dielectric layer; 7. seventh dielectric layer; 8. eighth dielectric layer; 9. ninth dielectric layer;

[0038] 10. First isolation resistor; 11. Second isolation resistor;

[0039] 21. First transmission power division network layer; 22. Second transmission power division network layer; 23. Third transmission power division network layer; 24. Fourth transmission power division network layer; 25. First reception power combination network layer; 26. Second reception power combination network layer; 27. Third reception power combination network layer; 28. Fourth reception power combination network layer;

[0040] 31. The first PP sheet; 32. The second PP sheet; 33. The third PP sheet; 34. The fourth PP sheet; 35. The fifth PP sheet; 36. The sixth PP sheet; 37. The seventh PP sheet; 38. The eighth PP sheet;

[0041] 101, main port; 102, first interface; 103, first interface; 104, first interface; 105, first interface; 106, first interface; 107, first interface; 108, first interface; 109, first interface;

[0042] 111, first port; 112, second port; 113, third port;

[0043] 211, fourth port; 212, fifth port; 213, sixth port; 214, seventh port;

[0044] 301, quasi-coaxial structure;

[0045] 401, first floor; 402, second floor; 403, third floor; 404, fourth floor; 405, fifth floor; 406, sixth floor; 407, seventh floor; 408, eighth floor; 409, ninth floor; 410, tenth floor;

[0046] 501, first signal hole; 502, second signal hole; 503, third signal hole; 504, fourth signal hole; 505, fifth signal hole; 506, sixth signal hole; 507, seventh signal hole; 508, eighth signal hole; 509, metal ground hole. DETAILED DESCRIPTION

[0047] The description of the embodiments of this specification should be combined with the corresponding drawings, which should be considered as part of the complete specification. In the drawings, the shape or thickness of the embodiments may be enlarged and indicated for simplification or convenience. Furthermore, the parts of each structure in the drawings will be described separately. It is worth noting that the elements not shown in the drawings or not described in words are in a form known to ordinary technicians in the relevant technical field.

[0048] The description of the embodiments herein and any reference to directions and orientations are only for the convenience of description and are not to be construed as any limitation on the scope of protection of the present invention. The following description of the preferred embodiments may involve combinations of features, which may exist independently or in combination, and the present invention is not particularly limited to the preferred embodiments. The scope of the present invention is defined by the claims.

[0049] like Figure 1 As shown, each antenna subarray outputs 12 signals, and the receiving network branch has 12 equal-amplitude and equal-phase low-noise amplifiers. Then a two-in-one combiner is used to combine two signals into one, and then a three-in-one combiner is used to combine three signals into one. Finally, a two-in-one combiner is used to combine three signals into one. After every 12 signals are combined into one, the corresponding output is down-converted. Each amplifier corresponds to the output port of the receiving subarray one by one.

[0050] like Figure 2 As shown, any transmit beam network is a 12-way power division network corresponding to 12 antenna subarrays.

[0051] The 12-way power splitter network includes two stages of compact 1-to-2 Wilkinson power splitters and one stage of 1-to-3 Wilkinson power splitters. When the 1-to-3 Wilkinson power splitter works in the Ka band, its volume is less than 2.4mmx2.6mm, and a plurality of through holes are arranged in an array on the metal plate.

[0052] Any receiving beam network is a one-way 12-way combining network corresponding to the 12 antenna subarrays;

[0053] The 1-to-12-way combining network comprises two stages of compact 1-to-2 Wilkinson combiners and one stage of 1-to-3 Wilkinson combiner.

[0054] The transmitting network is divided into two signals through a first-level one-to-two power splitter, then divided into six signals through a first-level one-to-three power splitter, and finally outputs 12 signals through a first-level one-to-two power splitter. The 12 signals are respectively connected to a power amplifier to output the signals to 12 antenna sub-arrays.

[0055] Due to the use of a unified multi-layer board structure, the transmission characteristics of the signal in each power division network layer and power combination network layer can be guaranteed to be consistent, which is conducive to maintaining the amplitude and phase consistency of the signal.

[0056] like Figure 3 As shown, a co-aperture phased array sub-array antenna transceiver network includes an active board, a metal board and a network board arranged in sequence from top to bottom;

[0057] The metal plate is used to assist the active board in heat dissipation. The use of the metal plate helps to dissipate heat from the amplifier and power supply on the active board, ensuring stable performance of the device under long-term operation.

[0058] The active board includes at least an amplifier and a power supply;

[0059] The transceiver network board includes a power division network layer, a power combination network layer and a dielectric layer, and is arranged from top to bottom in sequence: a floor, a first dielectric layer 1, a first transmitting power division network layer 21, a second dielectric layer 2, a second transmitting power division network layer 22, ..., the Nth dielectric layer, the Nth transmitting power division network layer, the N+1th dielectric layer, the first receiving power combination network layer 25, the N+2th dielectric layer, the second receiving power combination network layer 26, ..., the 2Nth dielectric layer, the Nth receiving combination network layer, the (2N+1)th dielectric substrate, and a floor.

[0060] The use of a unified multi-layer board structure can ensure that the transmission characteristics of the signal in each power division network layer and power combination network layer are consistent, which is conducive to maintaining the amplitude and phase consistency of the signal. The standardized hierarchical structure helps to reduce production costs and improve production efficiency.

[0061] A PP layer and a floor are arranged between any power division network layer, power combination network layer and the adjacent dielectric layer.

[0062] A pp layer and a floor are arranged between the power division network layer, the power combination network layer and the dielectric layer. Such a multi-layer structure helps to reduce the signal loss during transmission and improve the signal transmission efficiency. In addition, the use of the pp layer can be used as isolation between dielectric layers, reduce mutual interference between different network layers, and improve signal isolation.

[0063] In the present application, the active board and the network board are connected by a button, and the button passes through the metal plate. This connection method helps to reduce the loss of signals during transmission. The active board and the network board are connected by plugging the button, and a hole is opened on the metal plate to allow the button to pass during installation. The amplifier is located on the side of the active network board close to the network board and above the metal plate.

[0064] The amplifier of the active board is located on the side of the active board close to the network board and above the metal plate. The metal plate and the floor can serve as a shielding layer to reduce electromagnetic interference and improve the electromagnetic compatibility of the system.

[0065] like Figure 4As shown, the network board includes the first floor 401, the first dielectric layer 1, the first transmitting power division network layer 21, and the first PP plate 31 in sequence; the second floor 402, the second dielectric layer 2, the second transmitting power division network layer 22, the second PP plate 32, the third floor 403, the third dielectric layer 3, the third transmitting power division network layer 23, the third PP plate 33, the fourth floor 404, the fourth dielectric layer 4, the fourth transmitting power division network layer 24, the fourth PP plate 34, the fifth floor 405, the fifth dielectric layer 5, the first receiving power combination network layer 25, the fifth PP plate 35, the sixth floor 406, the sixth dielectric layer 6, the second receiving power combination network layer 26, the sixth PP plate 36, the seventh floor 407, the seventh dielectric layer 7, the third receiving power combination network layer 27, the seventh PP plate 37, the eighth floor 408, the eighth dielectric layer 8, the fourth receiving power combination network layer 28, the eighth PP plate 38, the ninth floor 409, the ninth dielectric layer 9, and the tenth floor 410. It also includes the signal holes from each corresponding transceiver network to the top layer, which are the first signal hole 501, the second signal hole 502, the third signal hole 503, the fourth signal hole 504, the fifth signal hole 505, the sixth signal hole 506, the seventh signal hole 507 and the eighth signal hole 508. The signal holes are respectively from the first transmission beam 21, the second transmission beam 22, the third transmission beam 23, the fourth transmission beam 24, the fifth transmission beam 25, the sixth transmission beam 26, the seventh transmission beam 27, and the eighth transmission beam 28. The power division network layer is punched to the side of the network board close to the active board. Back drilling will be performed on each layer of the power division during processing. Metal ground holes 509 are punched around the network auxiliary line. The first isolation resistor 10 and the second isolation resistor 11 are located between each power division network layer and the pp layer using a buried resistance process, which saves board layout space and reduces punching. When N=4, the thickness of the entire network board is 4.36mm.

[0066] By stacking multiple layers of dielectric substrates and pp layers, a highly integrated circuit design is achieved, which helps to reduce the volume of the entire network board. By setting pp layers between dielectric substrates, crosstalk and cross interference between different signal layers can be reduced, and the signal transmission quality can be improved. Back drilling at the signal hole can reduce reflection and loss during signal transmission and improve signal transmission efficiency. The design of the signal hole allows the signal to be transmitted directly from the power division network layer to the side close to the active board, simplifying the wiring and reducing the signal path length.

[0067] like Figure 5As shown, it includes a main port 101 of a multi-beam network, and the main port 101 is located on the side of the network board away from the active board. The beam outlet 101 includes a total of 8 beam main ports 101 outlets, including 4 outlets for transmitting beams and 4 outlets for receiving beams. Each beam network includes two stages of one-to-two Wilkinson power splitters / combiners 202, one stage of one-to-three Wilkinson power splitters / combiners 201, and some auxiliary feeders 203. The interfaces between the transmitting beam 1 to the receiving beam 4 and the antenna are the first interface 102, the second interface 103, the third interface 104, the fourth interface 105, the fifth interface 106, the sixth interface 107, the seventh interface 108, and the eighth interface 109, respectively. The antenna array has a total of 12 sub-array outlets, so the transmitting beam 1 has a total of 12 102 interfaces, and the other beams have corresponding 12 corresponding outlets. The first interface 102, the second interface 103, the third interface 104, the fourth interface 105, the fifth interface 106, the sixth interface 107, the seventh interface 108, and the eighth interface 109 are located on the side of the network board close to the active board. The phase consistency of the same beam is less than ±5° and the amplitude consistency is less than 1dB, which helps to ensure the consistency and stability of the signal.

[0068] like Figure 6 As shown, the transceiver network includes N transmit beam networks and N receive beam networks; the value range of N is: N≥4.

[0069] The design of N transmit beam networks and N receive beam networks allows more beams to be implemented in a limited space, improving the system integration. Since the value range of N is N≥4, the system design can expand more beams as needed while meeting the minimum requirements, maintaining the flexibility and consistency of the design.

[0070] Any transmit beam network uses a stripline power splitter network.

[0071] Any receive beam network uses a stripline combiner network.

[0072] The use of a stripline power splitter / combiner network can reduce signal loss during transmission and improve signal transmission efficiency.

[0073] The isolation resistor is arranged between the dielectric layer and the PP layer by using a buried resistor process.

[0074] The routing of the transmitting beam network and the receiving beam network overlap in the vertical direction, and the backbone network lines share metal ground holes. The routing of the transmitting beam network and the receiving beam network overlap in the vertical direction, and the backbone network lines share metal ground holes, which effectively saves space and improves space utilization.

[0075] The connection between the transceiver network and the interface adopts a quasi-coaxial structure 301, which provides good signal transmission characteristics and reduces reflection and loss of signals at the interface.

[0076] The multi-beam network is a 1-to-12-way and 12-way-in-1 network, including a first transmitting power division network layer 21, a second transmitting power division network layer 22, a third transmitting power division network layer 23, a fourth transmitting power division network layer 24, a first receiving power combination network layer 25, a second receiving power combination network layer 26, a third receiving power combination network layer 27, and a fourth receiving power combination network layer 28. The beam interface positions all adopt a quasi-coaxial structure 301. The main lines of the beam network are all on the same vertical plane and can share a set of metallized vias. This form reduces winding, makes the network board smaller, has lower losses, and makes wiring simpler and clearer. The metal ground hole and the quasi-coaxial structure 301 avoid the leakage of microwave signals, reduce the coupling between strip lines, and avoid the occurrence of undesirable resonance.

[0077] like Figure 7 As shown, the first port 111, the second port 112, the third port 113 and the first isolation resistor 10, the second isolation resistor 11, use of a Wilkinson power divider can improve the isolation between output signals, and the isolation between the network board output ports is greater than 20dB.

[0078] like Figure 8 The fourth port 211, the fifth port 212, the sixth port 213, the seventh port 214 and the isolation resistor 11, the one-to-three branch line adopts the arc winding form, which can make the power divider smaller.

[0079] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A co-aperture phased array sub-array antenna transceiver network, characterized in that: It includes an active board, a metal board and a network board which are arranged in sequence from top to bottom; The metal plate is used to assist the active plate in heat dissipation; The active board at least includes an amplifier and a power supply; The transceiver network board comprises a power division network layer, a power combination network layer and a dielectric layer, and is sequentially arranged from top to bottom: a floor, a first dielectric layer (1), a first transmitting power division network layer (21), a second dielectric layer (2), a second transmitting power division network layer (22), ..., an Nth dielectric layer, an Nth transmitting power division network layer, an N+1th dielectric layer, a first receiving power combination network layer, an N+2th dielectric layer, a second receiving power combination network layer, ..., a 2Nth dielectric layer, an Nth receiving combination network layer, a (2N+1)th dielectric substrate and a floor; A PP layer and a floor are arranged between any of the power division network layer, the power combination network layer and the adjacent dielectric layer.

2. The co-aperture phased array sub-array antenna transceiver network according to claim 1, characterized in that: The active board and the network board are connected by a wool button, and the wool button passes through the metal plate.

3. The co-aperture phased array sub-array antenna transceiver network according to claim 1, characterized in that: The amplifier of the active board is located on a side of the active board close to the network board and above the metal board.

4. The co-aperture phased array sub-array antenna transceiver network according to claim 1, characterized in that: The transceiver network includes N transmit beam networks and N receive beam networks; The value range of N is: N≥4.

5. The co-aperture phased array sub-array antenna transceiver network according to claim 4, characterized in that: Any of the transmit beam networks is a 1-to-12 power division network corresponding to the 12 antenna subarrays; The one-to-12-way power splitting network comprises two stages of compact one-to-two Wilkinson power splitters and one stage of one-to-three Wilkinson power splitters.

6. The co-aperture phased array sub-array antenna transceiver network according to claim 4, characterized in that: Any of the receiving beam networks is a one-way-12-way combining network corresponding to the 12 antenna subarrays; The one-to-12-way combining network comprises two stages of compact one-to-two Wilkinson combiners and one stage of one-to-three Wilkinson combiner.

7. The co-aperture phased array sub-array antenna transceiver network according to claim 4, characterized in that: Any of the transmit beam networks uses a stripline power splitter network, Any of the receiving beam networks adopts a stripline combining network; The isolation resistor is arranged between the dielectric layer and the PP layer by adopting a buried resistor process.

8. The co-aperture phased array sub-array antenna transceiver network according to claim 5, characterized in that: When the one-to-three Wilkinson power divider operates in the Ka band, the volume is less than 2.4 mm x 2.6 mm.

9. The co-aperture phased array sub-array antenna transceiver network according to claim 8, characterized in that: The metal plate is provided with a plurality of through holes in an array.

10. The co-aperture phased array sub-array antenna transceiver network according to claim 4, characterized in that: The routing of the transmitting beam network and the receiving beam network overlap in the vertical direction, and the trunk network lines share a metal ground hole (509); The transceiver network and the interface connection adopt a quasi-coaxial structure (301).

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