Crimping type IGBT (Insulated Gate Bipolar Translator) half-bridge assembly and multi-level converter

Abstract

The invention provides a crimping type IGBT half-bridge assembly, and relates to the technical field of semiconductor devices, the crimping type IGBT half-bridge assembly comprises a crimping device, and a first heating device, a first crimping IGBT device, a first heat dissipation device, a second crimping IGBT device, a second heating device, a first diode, a second heat dissipation device, a second diode and a third heat dissipation device which are connected in sequence, and the pressure head is used for being in contact with one end, far away from the first crimping IGBT device, of the first heating device and applying pressure to the first heating device. The invention further provides a multi-level current converter which is provided with the crimping type IGBT half-bridge assembly. According to the crimping type IGBT half-bridge assembly, the occurrence probability of the problem that the performance of an IGBT device is reduced due to the fact that the environment temperature is too low or too high can be reduced or avoided.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor devices, and in particular to a press-fit IGBT half-bridge component and a press-fit IGBT device. Background Art

[0002] Flexible DC transmission technology, relying on fully controlled power semiconductor devices, plays a key role in the construction of the global energy Internet. At present, modular multilevel converter valve (MMC) is the main choice for voltage source DC transmission. As the core of the flexible DC converter valve, the insulated gate bipolar transistor (IGBT) has the advantages of high voltage, high current, low switching loss and high operating frequency, and is particularly suitable for high voltage, high temperature and high frequency application environments. As the basic component of MMC, the IGBT half-bridge component is responsible for maintaining the DC bus voltage during the initial and operating stages of power conversion.

[0003] The temperature of the IGBT half-bridge assembly during operation will change with the change of the control switch logic, and will also be affected by the actual environment. Temperature not only affects the switching characteristics of the IGBT half-bridge assembly, but too high or too low temperature may also cause the IGBT half-bridge assembly to fail. Most of the existing crimped IGBT half-bridge assemblies are only provided with a heat dissipation structure, such as the crimped IGBT packaging structure provided by Chinese patent CN209249451U, which includes a heat dissipation device and an IGBT chip structure. The heat dissipation device is used to dissipate the heat of the IGBT chip structure, and it does not have a heating structure. When the ambient temperature is too low, it will affect the performance and normal use of the IGBT device. Summary of the invention

[0004] The object of the present invention is to provide a crimped IGBT half-bridge assembly to solve the problems existing in the above-mentioned prior art and to reduce or avoid the probability of performance degradation of the IGBT device due to excessively low or high ambient temperature.

[0005] To achieve the above object, the present invention provides the following solutions:

[0006] The present invention provides a crimping type IGBT half-bridge assembly, comprising a crimping device and a first heating device, a first crimping IGBT device, a first heat dissipation device, a second crimping IGBT device, a second heating device, a first diode, a second heat dissipation device, a second diode and a third heat dissipation device connected in sequence, wherein the crimping device comprises a pressing head, and the pressing head is used to contact an end of the first heating device away from the first crimping IGBT device and apply pressure to the first heating device.

[0007] Preferably, the first heating device includes a first conductive heating shell, the second heating device includes a second conductive heating shell, the first heat dissipation device includes a first conductive heat dissipation shell, the second heat dissipation device includes a second conductive heat dissipation shell, and the third heat dissipation device includes a third conductive heat dissipation shell. The first conductive heating shell, the first crimped IGBT device, the first conductive heat dissipation shell, the second crimped IGBT device, the second conductive heating shell, the first diode, the second conductive heat dissipation shell, the second diode and the third conductive heat dissipation shell are connected in sequence. There is a potential difference between the first conductive heating shell and the second conductive heating shell. The first conductive heating shell can be electrically connected to the third conductive heat dissipation shell, and the first conductive heat dissipation shell can be electrically connected to the second conductive heat dissipation shell.

[0008] Preferably, it also includes a first control device and a second control device, the first control device includes a first conductive control shell and a first control body, the second control device includes a second conductive control shell and a second control body, the first heating device also includes a first heating body, the second heating device also includes a second heating body, the first heating body and the second heating body are respectively connected to the first control body and the second control body, the first conductive control shell and the second conductive control shell can be electrically connected to the first conductive heating shell and the second conductive heating shell, respectively, and a distance is left between the first conductive control shell and the second conductive control shell.

[0009] Preferably, it also includes at least two temperature detection devices, and at least one of the temperature detection devices is provided on the first heating device and the second heating device. All the temperature detection devices of the first heating device are connected to the first control device by signal, and all the temperature detection devices of the second heating device are connected to the second control device by signal.

[0010] Preferably, the crimping device also includes a first pressure plate, a second pressure plate and a first support frame, the first pressure plate and the second pressure plate are respectively fixedly connected to the two ends of the first support frame in a detachable manner, the first pressure plate is provided with a threaded hole, the pressure head is threadedly connected to the first pressure plate through the threaded hole, the first heating device, the first crimping IGBT device, the first heat dissipation device, the second crimping IGBT device, the second heating device, the first diode, the second heat dissipation device, the second diode and the third heat dissipation device are stacked and connected in sequence to form a half-bridge body, the half-bridge body is arranged between the first pressure plate and the second pressure plate, and the end of the pressure head close to the first heating device can pass through the threaded hole and apply pressure to the first heating device.

[0011] Preferably, it also includes a pressure detection device, the two ends of which are respectively in contact with the second pressure plate and an end of the third heat dissipation device away from the second diode, and the pressure head and the second pressure plate can press the half-bridge body and the pressure detection device.

[0012] Preferably, it also includes a pressure compensation device, which is arranged between the pressure head and the first heating device, and the pressure head and the second pressure plate can press the pressure compensation device, the half-bridge body and the pressure detection device.

[0013] Preferably, the first conductive heat dissipation shell, the second conductive heat dissipation shell and the third conductive heat dissipation shell are all provided with cooling medium channels, and the two end faces of the first conductive heat dissipation shell connected to the first crimped IGBT device and the second crimped IGBT device, the two end faces of the second conductive heat dissipation shell connected to the first diode and the second diode, and the end face of the third conductive heat dissipation shell connected to the second diode are all provided with thermal conductive layers.

[0014] Preferably, it also includes a first insulating support component, a second insulating support component and a second support frame, the first insulating support component and the second insulating support component are respectively fixedly connected to the two ends of the second support frame, the first control device is used to be set on the upper surface of the first insulating support component, and the second control device is used to be set on the upper surface of the second insulating support component.

[0015] The present invention also provides a multi-level converter provided with the crimped IGBT half-bridge assembly.

[0016] Compared with the prior art, the present invention has achieved the following technical effects:

[0017] The present invention provides a crimping type IGBT half-bridge assembly, comprising a crimping device and a first heating device, a first crimping IGBT device, a first heat sink, a second crimping IGBT device, a second heating device, a first diode, a second heat sink, a second diode and a third heat sink connected in sequence, the crimping device comprising a pressure head, the pressure head is used to contact with an end of the first heating device away from the first crimping IGBT device and apply pressure to the first heating device. The first heating device and the second heating device can heat the IGBT device and the diode, reducing or avoiding the probability of the problem of performance degradation of the IGBT device due to too low ambient temperature; when the temperature of the IGBT device and the diode is too high, the heat sink can dissipate heat and cool them, reducing or avoiding the probability of the problem of performance degradation of the IGBT device due to too high ambient temperature, and ensuring the normal use of the crimping type IGBT half-bridge assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic structural diagram of a press-fit IGBT half-bridge assembly provided in Example 1;

[0020] Figure 2 A schematic diagram of the structure of the crimping device and the half-bridge body provided in Example 1;

[0021] Figure 3 A schematic diagram of the structure of the temperature control device (first control device, second control device, etc.) provided in Example 1;

[0022] In the figure: 100, crimping type IGBT half-bridge assembly; 1, crimping device; 101, crimping head; 102, first pressing plate; 103, second pressing plate; 104, first supporting frame; 2, first heating device; 201, first conductive heating shell; 3, first crimping IGBT device; 4, first heat dissipation device; 401, first conductive heat dissipation shell; 5, second crimping IGBT device; 6, second heating device; 601, second conductive heating shell; 7, first diode; 8, second heat dissipation device; 801, second conductive heat dissipation shell; 9, second diode; 10, third heat dissipation device; 1001, A third conductive heat dissipation housing; 11. a first control device; 1101. a first conductive control housing; 12. a second control device; 1201. a second conductive control housing; 13. a temperature detection device; 14. a pressure detection device; 15. a pressure compensation device; 16. a first insulating support component; 17. a second insulating support component; 18. a second support frame; 19. a first conductive busbar; 20. a second conductive busbar; 21. a third conductive busbar; 22. a first potential connection cable; 23. a second potential connection cable; 24. a first pressure-resistant thermally conductive cable; 25. a second pressure-resistant thermally conductive cable; 26. a third support frame. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] The object of the present invention is to provide a crimped IGBT half-bridge assembly to solve the problems existing in the above-mentioned prior art and to reduce or avoid the probability of performance degradation of the IGBT device due to excessively low or high ambient temperature.

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] Example 1

[0027] like Figure 1-3 As shown, this embodiment provides a crimping type IGBT half-bridge assembly 100, including a crimping device 1 and a first heating device 2, a first crimping IGBT device 3, a first heat sink 4, a second crimping IGBT device 5, a second heating device 6, a first diode 7, a second heat sink 8, a second diode 9 and a third heat sink 10 connected in sequence, the crimping device 1 includes a pressing head 101, the pressing head 101 is used to contact with an end of the first heating device 2 away from the first crimping IGBT device 3 and apply pressure to the first heating device 2.

[0028] In this embodiment, the first heating device 2 includes a first conductive heating shell 201, the second heating device 6 includes a second conductive heating shell 601, the first heat dissipation device 4 includes a first conductive heat dissipation shell 401, the second heat dissipation device 8 includes a second conductive heat dissipation shell 801, and the third heat dissipation device 10 includes a third conductive heat dissipation shell 1001. The first conductive heating shell 201, the first crimped IGBT device 3, the first conductive heat dissipation shell 401, the second crimped IGBT device 5, the second conductive heating shell 601, the first diode 7, the second conductive heat dissipation shell 801, the second diode 9 and the third conductive heat dissipation shell 1001 are connected in sequence. There is a potential difference between the first conductive heating shell 201 and the second conductive heating shell 601. The first conductive heating shell 201 can be electrically connected to the third conductive heat dissipation shell 1001, and the first conductive heat dissipation shell 401 can be electrically connected to the second conductive heat dissipation shell 801.

[0029] As a preferred embodiment, the first conductive heating housing 201 can be connected to the third conductive heat dissipation housing 1001 through the first conductive busbar 19, and the first conductive heat dissipation housing 401 can be connected to the second conductive heat dissipation housing 801 through the second conductive busbar 20. The first conductive heating housing 201 and the second conductive heating housing 601 are respectively connected to the positive and negative electrodes of the capacitor through the third conductive busbar 21, so that there is a potential difference between the first conductive heating housing 201 and the second conductive heating housing 601.

[0030] In this embodiment, the first control device 11 and the second control device 12 are also included. The first control device 11 includes a first conductive control housing 1101 and a first control body, the second control device 12 includes a second conductive control housing 1201 and a second control body, the first heating device 2 also includes a first heating body, the second heating device 6 also includes a second heating body, the first heating body and the second heating body are connected to the first control body and the second control body respectively, the first conductive control housing 1101 and the second conductive control housing 1201 can be electrically connected to the first conductive heating housing 201 and the second conductive heating housing 601 respectively, the first conductive control housing 1101 and the second conductive control housing 1201 are used to connect to the mains and ground respectively, and there is a distance between the first conductive control housing 1101 and the second conductive control housing 1201. As a preferred embodiment, the distance is greater than 150 mm to ensure that there is sufficient insulation clearance between the first control device 11 and the second control device 12.

[0031] As a preferred embodiment, the isolation transformer is integrated on the first control body, and an isolation transformer is provided between the first heating body and the mains to isolate the potential of the mains and the heating device.

[0032] As a preferred embodiment, the first conductive control shell 1101 is connected to the first conductive heating shell 201 through a first potential connection cable 22, and the second conductive control shell 1201 is connected to the second conductive heating shell 601 through a second potential connection cable 23; the first conductive heating shell 201 can be electrically connected to the emitter of the first crimped IGBT device 3, and the second conductive heating shell 601 can be electrically connected to the emitter of the second crimped IGBT device 5, so that the potential of the first conductive heating shell 201 and the first conductive control shell 1101 is consistent with the first crimped IGBT device 3, and the potential of the second conductive heating shell 601 and the second conductive control shell 1201 is consistent with the second crimped IGBT device 5.

[0033] The first heating body is connected to the first control body through the first pressure-resistant heat-conductive cable 24, and the second heating body is connected to the second control body through the second pressure-resistant heat-conductive cable 25. The sides of the first conductive control housing 1101 are provided with holes for connecting with the first pressure-resistant heat-conductive cable 24 and the first potential connection cable 22, and the sides of the second conductive control housing 1201 are provided with holes for connecting with the second pressure-resistant heat-conductive cable 25 and the second potential connection cable 23.

[0034] In this embodiment, at least two temperature detection devices 13 are also included. At least one temperature detection device 13 is provided on each of the first heating device 2 and the second heating device 6. All temperature detection devices 13 of the first heating device 2 are connected to the first control device 11 by signal, and all temperature detection devices 13 of the second heating device 6 are connected to the second control device 12 by signal. Preferably, a temperature detection device 13 is provided inside the first heating device 2 and inside the second heating device 6, respectively. The temperature detection device 13 is preferably a thermocouple or a temperature sensor. The first heating body and the second heating body are preferably heating coils. The temperature of the first heating device 2 and the second heating device 6 are monitored respectively by the temperature detection device 13. The first control device 11 and the second control device 12 can monitor the temperature and adjust the heating temperature of the first heating device 2 and the second heating device 6 in real time respectively.

[0035] In this embodiment, the crimping device 1 also includes a first pressing plate 102, a second pressing plate 103 and a first support frame 104. The first pressing plate 102 and the second pressing plate 103 are respectively fixedly connected to the two ends of the first support frame 104 in a detachable manner. The first pressing plate 102 is provided with a threaded hole. The pressing head 101 is threadedly connected to the first pressing plate 102 through the threaded hole. The first heating device 2, the first crimped IGBT device 3, the first heat sink 4, the second crimped IGBT device 5, the second heating device 6, the first diode 7, the second heat sink 8, the second diode 9 and the third heat sink 10 are stacked and connected in sequence to form a half-bridge body. The half-bridge body is arranged between the first pressing plate 102 and the second pressing plate 103. The end of the pressing head 101 close to the first heating device 2 can pass through the threaded hole and apply pressure to the first heating device 2. By twisting the pressing head 101, the pressure of the pressing head 101 on the first heating device 2 can be adjusted.

[0036] As a preferred embodiment, the first support frame 104 includes at least two positioning columns, more preferably, there are four positioning columns, and four positioning holes are respectively provided on the first pressing plate 102 and the second pressing plate 103, and the two ends of each positioning column are respectively connected to a positioning hole of the first pressing plate 102 and a corresponding positioning hole of the second pressing plate 103. The positioning column is connected to each positioning hole by a bolt.

[0037] In this embodiment, a pressure detection device 14 is also included. The two ends of the pressure detection device 14 are respectively in contact with the second pressure plate 103 and the end of the third heat sink 10 away from the second diode 9. The pressure head 101 and the second pressure plate 103 can press the half-bridge body and the pressure detection device 14. The pressure detection device 14 is preferably a pressure sensor. The pressure of the pressure head 101 on the first heating device 2 is transmitted from top to bottom. The pressure detection device 14 can detect the pressure of the half-bridge body, and the pressure value detected by the pressure detection device 14 can be obtained as a basis for adjusting the pressure of the pressure head 101, so as to achieve quantitative control of the pressure.

[0038] As a preferred embodiment, a groove is formed on the surface of the second pressing plate 103 close to the first pressing plate 102, and the two ends of the pressure detection device 14 are respectively in contact with the inner wall of the groove and the third conductive heat dissipation housing 1001. The groove can limit the pressure detection device 14 in the horizontal direction.

[0039] In this embodiment, a pressure compensation device 15 is further included. The pressure compensation device 15 is arranged between the pressure head 101 and the first heating device 2. The pressure head 101 and the second pressure plate 103 can press the pressure compensation device 15, the half-bridge body and the pressure detection device 14. The pressure compensation device 15 is preferably an elastic component, and the elastic component is preferably a disc spring. The pressure compensation device 15 can perform pressure compensation for the deformation of the components of the half-bridge body caused by heat.

[0040] In this embodiment, the first conductive heat dissipation housing 401, the second conductive heat dissipation housing 801 and the third conductive heat dissipation housing 1001 are all provided with cooling medium channels, and the two end surfaces of the first conductive heat dissipation housing 401 connected to the first crimped IGBT device 3 and the second crimped IGBT device 5, the two end surfaces of the second conductive heat dissipation housing 801 connected to the first diode 7 and the second diode 9, and the end surface of the third conductive heat dissipation housing 1001 connected to the second diode 9 are all provided with heat conductive layers. The heat conductive layer is preferably heat conductive silicone grease, which can improve the heat conductive effect.

[0041] In this embodiment, it also includes a first insulating support component 16, a second insulating support component 17 and a second support frame 18. The first insulating support component 16 and the second insulating support component 17 are respectively fixedly connected to the two ends of the second support frame 18. The first control device 11 is used to be arranged on the upper surface of the first insulating support component 16, and the second control device 12 is used to be arranged on the upper surface of the second insulating support component 17.

[0042] As a preferred embodiment, the second support frame 18 includes at least two first insulating columns, preferably four first insulating columns, and openings are provided at the four symmetrical positions of the first insulating support part 16 and the second insulating support part 17. The two ends of each first insulating column are respectively detachably fixedly connected to an opening of the first insulating support part 16 and the corresponding opening of the second insulating support part 17, so as to maintain an insulating clearance between the first control device 11 and the second control device 12, thereby avoiding the first control device 11 and the second control device 12 from being punctured due to excessive potential difference between the first conductive control shell 1101 and the second control conductive shell.

[0043] As a preferred embodiment, a third support frame 26 is further included, and the third support frame 26 includes at least two second insulating columns, each of which is used to be detachably fixedly connected to an end of the second insulating support component 17 away from the first insulating column. More preferably, there are four second insulating columns, and the four second insulating columns are connected to the four symmetrical positions of the second insulating support component 17, and the four first insulating columns on the second insulating support component 17 and the four second insulating columns under the second insulating support component 17 are arranged one by one, and each first insulating column is coaxial with a corresponding second insulating column below.

[0044] As a preferred embodiment, any two adjacent components among the first heating device 2, the first crimped IGBT device 3, the first heat sink 4, the second crimped IGBT device 5, the second heating device 6, the first diode 7, the second heat sink 8, the second diode 9 and the third heat sink 10 are positioned by locating pins to ensure that the vertical center lines of the first heating device 2, the first crimped IGBT device 3, the first heat sink 4, the second crimped IGBT device 5, the second heating device 6, the first diode 7, the second heat sink 8, the second diode 9 and the third heat sink 10 are collinear.

[0045] The working mode of the press-fit IGBT half-bridge assembly 100 provided in this embodiment is as follows:

[0046] Place the first crimped IGBT device 3, the second crimped IGBT device 5, the first diode 7 and the second diode 9 in the corresponding positions, and align them with the positioning pin holes, then tighten the bolts corresponding to the four positioning columns to achieve the limit and tightening of the press-fit module. Use a torque wrench to twist the pressure head 101, which applies pressure to the half-bridge body. The pressure sensor can feedback the pressure size, which is convenient for quantitative control of the pressing force of the pressure head 101. The pressure is transmitted from top to bottom, and pressure balance and automatic compensation are achieved through the pressure compensation device 15. The corresponding temperature detection device 13 can realize real-time monitoring of the first heating device 2 and the second heating device 6. The first control device 11 and the second control device 12 can set the heating temperature according to the corresponding temperature detection value, and are connected to the first heating body and the second heating body respectively through the first pressure-resistant heat-conductive cable 24 and the second pressure-resistant heat-conductive cable 25 and energize them, and heat them using the principle of electromagnetic induction. Both sides of the first conductive heating housing 201, the second conductive heating housing, the first conductive heat dissipation housing and the second conductive heat dissipation housing 801 are coated with thermal grease to achieve good temperature transfer and improve the temperature control effect.

[0047] Example 2

[0048] This embodiment provides a multi-level converter, which is provided with the press-fit IGBT half-bridge assembly 100 in Embodiment 1.

[0049] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A crimp-type IGBT half-bridge assembly, characterized in that: The invention comprises a crimping device and a first heating device, a first crimping IGBT device, a first heat dissipation device, a second crimping IGBT device, a second heating device, a first diode, a second heat dissipation device, a second diode and a third heat dissipation device connected in sequence. The crimping device comprises a pressing head, which is used to contact an end of the first heating device away from the first crimping IGBT device and apply pressure to the first heating device.

2. The press-fit IGBT half-bridge assembly according to claim 1, characterized in that: The first heating device includes a first conductive heating shell, the second heating device includes a second conductive heating shell, the first heat dissipation device includes a first conductive heat dissipation shell, the second heat dissipation device includes a second conductive heat dissipation shell, and the third heat dissipation device includes a third conductive heat dissipation shell. The first conductive heating shell, the first crimped IGBT device, the first conductive heat dissipation shell, the second crimped IGBT device, the second conductive heating shell, the first diode, the second conductive heat dissipation shell, the second diode and the third conductive heat dissipation shell are connected in sequence. There is a potential difference between the first conductive heating shell and the second conductive heating shell. The first conductive heating shell can be electrically connected to the third conductive heat dissipation shell, and the first conductive heat dissipation shell can be electrically connected to the second conductive heat dissipation shell.

3. The press-fit IGBT half-bridge assembly according to claim 2, characterized in that: It also includes a first control device and a second control device, the first control device includes a first conductive control shell and a first control body, the second control device includes a second conductive control shell and a second control body, the first heating device also includes a first heating body, the second heating device also includes a second heating body, the first heating body and the second heating body are respectively connected to the first control body and the second control body, the first conductive control shell and the second conductive control shell can be electrically connected to the first conductive heating shell and the second conductive heating shell, respectively, and a distance is left between the first conductive control shell and the second conductive control shell.

4. The press-fit IGBT half-bridge assembly according to claim 3, characterized in that: It also includes at least two temperature detection devices, at least one of which is provided on the first heating device and the second heating device, all of the temperature detection devices of the first heating device are connected to the first control device by signal, and all of the temperature detection devices of the second heating device are connected to the second control device by signal.

5. The press-fit IGBT half-bridge assembly according to claim 1, characterized in that: The crimping device also includes a first pressing plate, a second pressing plate and a first supporting frame, the first pressing plate and the second pressing plate are respectively fixedly connected to the two ends of the first supporting frame in a detachable manner, a threaded hole is provided on the first pressing plate, the pressing head is threadedly connected to the first pressing plate through the threaded hole, the first heating device, the first crimping IGBT device, the first heat dissipation device, the second crimping IGBT device, the second heating device, the first diode, the second heat dissipation device, the second diode and the third heat dissipation device are stacked and connected in sequence to form a half-bridge body, the half-bridge body is arranged between the first pressing plate and the second pressing plate, and the end of the pressing head close to the first heating device can pass through the threaded hole and apply pressure to the first heating device.

6. The press-fit IGBT half-bridge assembly according to claim 5, characterized in that: It also includes a pressure detection device, both ends of which are in contact with the second pressure plate and one end of the third heat sink away from the second diode respectively, and the pressure head and the second pressure plate can press the half-bridge body and the pressure detection device tightly.

7. The press-fit IGBT half-bridge assembly according to claim 6, characterized in that: It also includes a pressure compensation device, which is arranged between the pressure head and the first heating device. The pressure head and the second pressure plate can press the pressure compensation device, the half-bridge body and the pressure detection device.

8. The press-fit IGBT half-bridge assembly according to claim 2, characterized in that: The first conductive heat dissipation shell, the second conductive heat dissipation shell and the third conductive heat dissipation shell are all provided with cooling medium channels, and the two end surfaces of the first conductive heat dissipation shell connected to the first crimped IGBT device and the second crimped IGBT device, the two end surfaces of the second conductive heat dissipation shell connected to the first diode and the second diode, and the end surface of the third conductive heat dissipation shell connected to the second diode are all provided with heat conductive layers.

9. The press-fit IGBT half-bridge assembly according to claim 1, characterized in that: It also includes a first insulating support component, a second insulating support component and a second support frame, the first insulating support component and the second insulating support component are respectively fixedly connected to the two ends of the second support frame, the first control device is used to be set on the upper surface of the first insulating support component, and the second control device is used to be set on the upper surface of the second insulating support component.

10. A multilevel converter, characterized in that: A press-fit IGBT half-bridge assembly as claimed in any one of claims 1 to 9 is provided.

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