Water-interference-resistant processor shell

Abstract

The invention discloses a processor shell resistant to water interference, and relates to the field of processor shells, the processor shell comprises a processor shell used for storing a data processing chip, the processor shell is of a rectangular box body structure, one side of the processor shell is provided with an opening, and a sealing cover is fixed at the opening position through a screw; by means of the arrangement of the automatic control assembly, heat can be discharged from the upper portion of the processor shell all the time, the purpose of good heat dissipation is achieved, and in other words, no matter whether the processor shell is placed in the forward direction or in the inverted direction, the heat dissipation effect is good, and the heat dissipation effect is good. The upper heat dissipation holes corresponding to the upper surface of the processor shell or the lower heat dissipation holes corresponding to the lower surface of the processor shell are correspondingly opened.

Description

Technical Field

[0001] The invention relates to the field of processor housings, and in particular to a processor housing resistant to water interference. Background Art

[0002] At present, when the processor housing is installed, the processor housing body is exposed to the air. When heat dissipation holes are opened on the housing, water easily enters the inside. If the processor housing is sealed as a whole, the heat dissipation efficiency of the processor housing is reduced, and the service life of the processor housing is reduced. Therefore, the processor housing is more seriously affected by the external environment, especially the influence of water on the inside of the processor housing.

[0003] Therefore, it is necessary to invent a processor housing that is resistant to water interference to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a processor housing that is resistant to water interference, so as to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a processor housing resistant to water interference, comprising a processor housing for storing a data processing chip, the processor housing being a rectangular box structure, one side of the processor housing being open, a cover being fixed at the opening position by screws, a metal heat dissipation pipe being arranged inside the processor housing, the metal heat dissipation pipe being arranged in the middle of the processor housing, and two ends of the metal heat dissipation pipe being respectively fixed at two ends of the processor housing, the metal heat dissipation pipe being distributed along the length direction of the processor housing, a rotating ring being rotatably sleeved on the metal heat dissipation pipe, a data processing chip being installed at the upper end of the rotating ring, a counterweight being installed at the lower end of the rotating ring, a heat dissipation channel being arranged inside the metal heat dissipation pipe, a first external pipe being arranged in the middle of one end of the processor housing, and a second external pipe being arranged in the middle of the other end, the second external pipe and the first external pipe being respectively connected to two ends of the heat dissipation channel;

[0006] The processor housing is provided with an anti-interference mechanism for waterproofing and cooling the data processing chip, and the anti-interference mechanism includes an upper heat dissipation hole, a lower heat dissipation hole, an upper baffle and a lower baffle. The upper heat dissipation hole is provided on the upper surface of the processor housing and communicates with the inside and outside of the processor housing. The lower heat dissipation hole is provided on the lower surface of the processor housing and communicates with the inside and outside of the processor housing. The upper baffle is provided inside the upper end of the processor housing and blocks below the upper heat dissipation hole. The lower baffle is provided inside the lower end of the processor housing and blocks above the lower heat dissipation hole. An automatic control component for controlling the lifting of the upper baffle and the lower baffle to realize the opening and closing of the upper heat dissipation hole and the lower heat dissipation hole is provided inside the processor housing.

[0007] Preferably, the automatic control component includes a support plate fixedly welded to the inner wall of the processor housing, a second spring fixedly welded to the surface of the support plate, a group of support plates are provided at the four corners of the upper baffle plate and the lower baffle plate and on one side close to the middle of the processor housing, and one end of the second spring away from the support plate is fixedly welded to the corresponding upper baffle plate and lower baffle plate surfaces.

[0008] The arrangement of the automatic control component in the present invention can realize that heat is always discharged from the top of the processor housing, achieving the purpose of good heat dissipation, that is, no matter when the processor housing is placed forwardly or inverted, the upper heat dissipation holes corresponding to the upper surface of the processor housing or the lower heat dissipation holes corresponding to the lower surface will be opened accordingly, such as: when the processor housing is placed forwardly, the upper heat dissipation holes on the processor housing are located at the upper end of the processor housing, and the upper baffle is opened downward by the automatic control component, so that a heat dissipation gap is generated between the upper baffle and the bottom of the upper heat dissipation hole, and the heat inside the processor housing can be discharged through the outer periphery of the upper baffle, the heat dissipation gap and the upper heat dissipation holes in sequence, and when external water enters through the upper heat dissipation holes, the water will be blocked by the upper baffle, and the water will flow from the outer periphery of the upper baffle into the lower end of the processor housing, so that the water will not affect the data processing chip, and when the processor housing is placed forwardly, the lower baffle is attached to the upper surface of the lower heat dissipation hole, so that the lower heat dissipation hole is closed, and water will not enter the bottom of the processor housing;

[0009] In actual use, the edges of the upper baffle and the lower baffle are preferably turned toward the middle of the processor housing, so that when water enters the surface of the upper baffle or the lower baffle from the corresponding upper heat dissipation hole or the lower heat dissipation hole, it can slide down through the corresponding turning position instead of sliding down to the middle of the upper baffle or the lower baffle and then falling down;

[0010] In the device, the structures of the data processing chip and the metal heat dissipation pipe are reasonably arranged. When the processor housing is placed forwardly or inverted, the counterweight block is always downward due to gravity, and the data processing chip is always located at the upper end of the interior of the processor housing, so that the data processing chip is always protected below by the upper baffle plate or the lower baffle plate. In this way, when external water enters from the upper heat dissipation hole or the lower heat dissipation hole, it will not directly act on the data processing chip to cause damage; the structural design is reasonable.

[0011] Preferably, there are multiple groups of upper heat dissipation holes distributed in a rectangular array, and the bottoms of the multiple groups of upper heat dissipation holes are covered by an upper baffle. The length and width of the upper baffle are respectively smaller than the internal length and width of the processor housing. When the processor housing is placed forward and the upper baffle is located inside the upper end of the processor housing, the upper baffle is pressed against the corresponding second spring below it by gravity, and the upper baffle maintains a heat dissipation gap with the bottom of the upper heat dissipation holes.

[0012] Furthermore, multiple groups of upper heat dissipation holes are provided to maintain good heat dissipation. The second spring plays a role in pulling or pushing the upper baffle, so that when the upper baffle is located inside the upper end of the processor housing, it can compress the second spring and open the lower end of the upper heat dissipation hole, so that the interior of the processor housing can dissipate heat normally.

[0013] Preferably, there are multiple groups of lower heat dissipation holes distributed in a rectangular array, and the upper parts of the multiple groups of lower heat dissipation holes are covered by the lower baffle plate. The length and width of the lower baffle plate are respectively smaller than the internal length and width of the processor housing. When the processor housing is placed forward and the upper baffle plate is located inside the upper end of the processor housing, the lower baffle plate seals and blocks the upper ends of the lower heat dissipation holes below it through the action of gravity, and the corresponding second spring above the lower baffle plate remains in a stretched state.

[0014] Specifically, multiple groups of movable sealing plates are provided to maintain good heat dissipation. The second spring plays the role of pulling or pushing the lower baffle, so that when the lower baffle is located inside the lower end of the processor housing, it can pull the second spring and seal the upper end of the lower heat dissipation hole to prevent external water from entering from the bottom of the processor housing. The waterproof effect is good and overheating or water interference with the device is avoided.

[0015] Preferably, the metal heat dissipation pipe is in a cylindrical structure, and at least one group of the metal heat dissipation pipe is arranged inside the processor housing.

[0016] Among them, according to the width of the processor housing or the number of data processing chips, multiple groups of metal heat dissipation pipes can be correspondingly arranged. The arrangement of the metal heat dissipation pipes allows the data processing chips to rotate around the metal heat dissipation pipes as axes, which is convenient for the data processing chips to dissipate heat and waterproof. The external natural wind can enter and exit through both ends of the metal heat dissipation pipes, and the heat inside the processor housing is transferred to the outside through the inner and outer walls of the metal heat dissipation pipes, which has good heat dissipation.

[0017] Preferably, the data processing chip is opposite to the counterweight block, the gravity of the counterweight block is greater than the gravity of the data processing chip, a first connecting plate is fixedly provided on the upper end of the counterweight block, the first connecting plate is movably fitted on the lower surface of the rotating ring, and the first connecting plate is fixed to the rotating ring by screws, and a second connecting plate is fixedly provided on the lower end of the data processing chip, the second connecting plate is movably fitted on the upper surface of the rotating ring, and the second connecting plate is fixed to the upper surface of the rotating ring by screws.

[0018] In the device, the data processing chip and the counterweight block are detachably connected to the rotating ring, and the position and quantity of the data processing chip and the counterweight block can be set according to actual needs, which has high practicality.

[0019] Preferably, a wiring part is provided at one end of the processor housing, and the wiring part includes an annular groove, and the annular groove is a circular groove structure that runs through the inside and outside of the processor housing. A movable sealing plate is provided in the annular groove, and an annular groove is left between the outer circle of the movable sealing plate and the inner wall of the annular groove. A rubber sealing ring is movably provided in the annular groove, and the rubber sealing ring is rotatably set in the annular groove. The rubber sealing ring is provided with a through hole, and one end of the data processing chip is connected to a wire, and the wire movably passes through the through hole. The movable sealing plate and the processor housing are fixedly connected through a connecting frame spanning the annular groove, and the connecting frame is a concave-shaped structure, and the connecting frame is provided on the outside of the processor housing.

[0020] In order to adapt the data processing chip to be flipped and moved in the processor housing, a wiring part is provided at one end of the processor housing, and the wiring part ensures that the data processing chip is normally connected to the outside through wires;

[0021] Specifically, when the data processing chip is turned over in the processor housing, the wire drives the rubber sealing ring to rotate in the annular groove, thereby changing the position of the wire. The rubber sealing ring ensures the sealing of the annular groove position, and maintains the waterproofness of the wire extension position without affecting the movement of the wire.

[0022] In the device, the movable sealing plate is connected to the processor housing via a connecting frame, so that the processor housing can only be turned back and forth when turned over, and cannot be turned toward one position all the time.

[0023] Preferably, the middle parts of the inner and outer circles of the annular groove are both provided with limiting grooves, and the middle parts of the inner and outer circles of the rubber sealing ring are both integrally provided with limiting rings, and the limiting rings are movably arranged in the corresponding limiting grooves.

[0024] Specifically, the limiting rings provided on the inner and outer rings of the rubber sealing ring are movably provided in the limiting groove, thereby preventing the rubber sealing ring from being easily separated from the annular groove, and providing strong connection stability.

[0025] Preferably, the cover is provided with a drainage part, the drainage part includes a drainage hole, and the drainage hole is connected to the interior of the processor housing at the same time. The drainage hole is provided on the cover, and a sealing plug is movably engaged in the drainage hole. The outside of the sealing plug is blocked by a baffle frame, and the baffle frame is a concave structure fixedly welded to the outer surface of the cover, and a first spring is fixedly welded inside the concave shape of the baffle frame for pushing the sealing plug and engaging the sealing plug in the drainage hole. The cross-section of the sealing plug is a convex structure, and the raised part of the convex structure faces the interior of the processor housing, and the shape of the convex structure matches the shape of the drainage hole.

[0026] When too much water enters the processor housing and cannot be drained, the processor housing is turned over 90 degrees as a whole, and the cover on the side of the processor housing is attached to the ground. At this time, the water is pressed against the surface of the sealing plug, so that the sealing plug is moved out of the drainage hole, and the water is drained from the drainage hole. When the water is drained, the sealing plug loses pressure and is reset and sealed in the drainage hole by the elastic force of the first spring, thereby achieving the purpose of opening the drainage hole when draining water and sealing the drainage hole when not draining water.

[0027] For more convenient use, the sealing plug can be manually taken out of and inserted into the drainage hole. The retaining frame also serves the purpose of supporting the first spring and maintaining a drainage gap between the sealing cover and the ground.

[0028] Preferably, there are multiple groups of drainage holes distributed at equal distances on the cover.

[0029] It should be noted that, in order to further drain the water inside the processor housing, multiple groups of drainage holes can be provided according to actual needs;

[0030] In the device, the first external pipe and the second external pipe can be connected to a fan to facilitate rapid heat dissipation.

[0031] Technical effects and advantages of the present invention:

[0032] 1. A processor housing resistant to water interference of the present invention. The setting of the automatic control component in the present invention can realize that heat is always discharged from the top of the processor housing, achieving the purpose of good heat dissipation. That is to say, no matter when the processor housing is placed forward or inverted, the upper heat dissipation holes corresponding to the upper surface of the processor housing or the lower heat dissipation holes corresponding to the lower surface will be opened accordingly, such as: when the processor housing is placed forward, the upper heat dissipation holes on the processor housing are located at the upper end of the processor housing, and the upper baffle is opened downward by the automatic control component, so that a heat dissipation gap is generated between the upper baffle and the bottom of the upper heat dissipation hole, and the heat inside the processor housing can be discharged through the outer periphery of the upper baffle, the heat dissipation gap and the upper heat dissipation hole in sequence, and when external water enters through the upper heat dissipation hole, the water will be blocked by the upper baffle, and the water will flow from the outer periphery of the upper baffle into the lower end of the processor housing, so that the water will not affect the data processing chip, and when the processor housing is placed forward, the lower baffle is attached to the upper surface of the lower heat dissipation hole, so that the lower heat dissipation hole is closed, and the bottom of the processor housing will not enter water;

[0033] 2. In a water-resistant processor housing of the present invention, the edges of the upper baffle and the lower baffle are preferably turned toward the middle of the processor housing, so that when water enters the surface of the upper baffle or the lower baffle from the corresponding upper heat dissipation hole or the lower heat dissipation hole, it can slide down through the corresponding turning position and is not easy to slide down to the middle of the upper baffle or the lower baffle and then fall down;

[0034] 3. The present invention provides a water-resistant processor housing, and the data processing chip and the metal heat dissipation pipe have reasonable structural settings. When the processor housing is placed forward or inverted, the counterweight is always downward due to gravity, and the data processing chip is always located at the upper end of the processor housing, so that the data processing chip is always protected below by the upper baffle or the lower baffle. In this way, when external water enters from the upper heat dissipation hole or the lower heat dissipation hole, it will not directly act on the data processing chip to cause damage; the structural design is reasonable;

[0035] 4. In a water-resistant processor housing of the present invention, a plurality of groups of upper heat dissipation holes are provided, so that the heat dissipation is maintained well, and the second spring plays a role of pulling or pushing the upper baffle, so that when the upper baffle is located inside the upper end of the processor housing, the second spring can be compressed to open the lower end of the upper heat dissipation hole, so that the inside of the processor housing can be normally cooled;

[0036] 5. In the water-resistant processor housing of the present invention, multiple groups of movable sealing plates are provided, so that the heat dissipation is maintained well. The second spring plays a role of pulling or pushing the lower baffle plate, so that when the lower baffle plate is located inside the lower end of the processor housing, it can pull the second spring and seal the upper end of the lower heat dissipation hole to prevent external water from entering from the bottom of the processor housing. The waterproof effect is good, and overheating or water interference with the device is avoided;

[0037] 6. A water-resistant processor housing of the present invention can be provided with multiple groups of metal heat dissipation pipes according to the width of the processor housing or the number of data processing chips. The arrangement of the metal heat dissipation pipes allows the data processing chips to rotate around the metal heat dissipation pipes as axes, which is convenient for the data processing chips to dissipate heat and prevent water. External natural wind can enter and exit through both ends of the metal heat dissipation pipes, and the heat inside the processor housing is transferred outward through the inner and outer walls of the metal heat dissipation pipes, so the heat dissipation is good.

[0038] 7. A water-interference-resistant processor housing of the present invention is provided with a wiring part at one end of the processor housing to adapt to the flipping and movement of the data processing chip in the processor housing. The wiring part ensures that the data processing chip is normally connected to the outside through the wire. Specifically, when the data processing chip flips in the processor housing, the wire drives the rubber sealing ring to rotate in the annular groove, thereby changing the position of the wire. The rubber sealing ring ensures the sealing of the annular groove position, and maintains the waterproofness of the wire extension position without affecting the movement of the wire.

[0039] 8. A processor housing resistant to water interference of the present invention, when too much water enters the processor housing and cannot be discharged, the processor housing is turned over 90 degrees as a whole, and the cover on the side of the processor housing is attached to the ground. At this time, the water is pressed against the surface of the sealing plug, so that the sealing plug is moved out of the drainage hole, and the water is discharged from the drainage hole. When the water is drained, the sealing plug loses pressure and is reset and sealed in the drainage hole by the elastic force of the first spring, thereby achieving the purpose of opening the drainage hole when draining and sealing the drainage hole when not draining. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic diagram of the structure of the present invention.

[0041] Figure 2 It is a schematic diagram of the bottom structure of the present invention.

[0042] Figure 3 It is a schematic diagram of the side structure of the present invention.

[0043] Figure 4 It is a schematic diagram of the structure of the metal heat dissipation pipe of the present invention.

[0044] Figure 5 It is a cross-sectional view of the processor housing of the present invention in the length direction.

[0045] Figure 6 It is a schematic diagram of the structure of the counterweight block of the present invention.

[0046] Figure 7 It is a cross-sectional view of the processor housing of the present invention in the width direction.

[0047] Figure 8 For the present invention Figure 4 A schematic diagram of the enlarged structure in the middle.

[0048] In the figure: processor housing 1, cover 2, upper heat dissipation hole 3, movable sealing plate 4, annular groove 5, rubber sealing ring 6, wire 7, connecting frame 8, first external tube 9, drainage hole 10, baffle 11, sealing plug 12, first spring 13, lower heat dissipation hole 14, second external tube 15, upper baffle 16, data processing chip 17, rotating ring 18, heat dissipation channel 19, metal heat dissipation pipe 20, counterweight block 21, lower baffle 22, limit ring 23, limit groove 24, perforation 25, support plate 26, second spring 27, first connecting plate 28, second connecting plate 29. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] The present invention provides Figure 1-8 A water-interference-resistant processor housing shown in the figure comprises a processor housing 1 for storing a data processing chip. The processor housing 1 is a rectangular box structure. One side of the processor housing 1 is open. A cover 2 is fixed to the opening position by screws. A metal heat dissipation pipe 20 is arranged inside the processor housing 1. The metal heat dissipation pipe 20 is arranged in the middle of the processor housing 1, and two ends of the metal heat dissipation pipe 20 are respectively fixed to two ends of the processor housing 1. The metal heat dissipation pipe 20 is distributed along the length direction of the processor housing 1. A rotating ring 18 is rotatably sleeved on the metal heat dissipation pipe 20. A data processing chip 17 is installed at the upper end of the rotating ring 18. A counterweight block 21 is installed at the lower end of the rotating ring 18. A heat dissipation channel 19 is arranged inside the metal heat dissipation pipe 20. A first external pipe 9 is arranged in the middle of one end of the processor housing 1, and a second external pipe 15 is arranged in the middle of the other end. The second external pipe 15 and the first external pipe 9 are respectively connected to the two ends of the heat dissipation channel 19.

[0051] The processor housing 1 is provided with an anti-interference mechanism for waterproofing and cooling the data processing chip, and the anti-interference mechanism includes an upper heat dissipation hole 3, a lower heat dissipation hole 14, an upper baffle 16 and a lower baffle 22. The upper heat dissipation hole 3 is arranged on the upper surface of the processor housing 1 and connects the inside and outside of the processor housing 1. The lower heat dissipation hole 14 is arranged on the lower surface of the processor housing 1 and connects the inside and outside of the processor housing 1. The upper baffle 16 is arranged inside the upper end of the processor housing 1 and blocks below the upper heat dissipation hole 3. The lower baffle 22 is arranged inside the lower end of the processor housing 1 and blocks above the lower heat dissipation hole 14. The interior of the processor housing 1 is provided with an automatic control component for controlling the lifting and lowering of the upper baffle 16 and the lower baffle 22 to realize the opening and closing of the upper heat dissipation hole 3 and the lower heat dissipation hole 14.

[0052] The automatic control component includes a support plate 26 fixedly welded on the inner wall of the processor housing 1, and a second spring 27 is fixedly welded on the surface of the support plate 26. The support plate 26 is provided with a group of springs at the four corners of the upper baffle 16 and the lower baffle 22 and on one side close to the middle of the processor housing 1. The end of the second spring 27 away from the support plate 26 is fixedly welded to the corresponding surface of the upper baffle 16 and the lower baffle 22.

[0053] The arrangement of the automatic control component in the present invention can realize that heat is always discharged from the top of the processor housing 1, achieving the purpose of good heat dissipation. That is to say, no matter when the processor housing 1 is placed forwardly or inverted, the upper heat dissipation holes 3 corresponding to the upper surface of the processor housing 1 or the lower heat dissipation holes 14 corresponding to the lower surface will be opened accordingly, such as: when the processor housing 1 is placed forwardly, the upper heat dissipation holes 3 on the processor housing 1 are located at the upper end of the processor housing 1, and the upper baffle plate 16 is opened downward by the automatic control component, so that a heat dissipation gap is generated between the upper baffle plate 16 and the bottom of the upper heat dissipation holes 3, and the heat inside the processor housing 1 can be discharged through the outer periphery of the upper baffle plate 16, the heat dissipation gap and the upper heat dissipation holes 3 in sequence, and when external water enters through the upper heat dissipation holes 3, the water will be blocked by the upper baffle plate 16, and the water will flow from the outer periphery of the upper baffle plate 16 into the lower end of the processor housing 1, so that the water will not affect the data processing chip 17, and when the processor housing 1 is placed forwardly, the lower baffle plate 22 is attached to the upper surface of the lower heat dissipation holes 14, so that the lower heat dissipation holes 14 are closed, and the bottom of the processor housing 1 will not be flooded;

[0054] In actual use, the edges of the upper baffle 16 and the lower baffle 22 are preferably turned toward the middle of the processor housing 1, so that when water enters the surface of the upper baffle 16 or the lower baffle 22 from the corresponding upper heat dissipation holes 3 and the lower heat dissipation holes 14, it can slide through the corresponding turning positions instead of sliding to the middle of the upper baffle 16 or the lower baffle 22 and then falling;

[0055] In the device, the structures of the data processing chip 17 and the metal heat dissipation pipe 20 are reasonably arranged. When the processor housing 1 is placed forwardly or inverted, the counterweight block 21 is always downward due to gravity, and the data processing chip 17 is always located at the upper end of the processor housing 1, so that the data processing chip 17 is always protected below by the upper baffle 16 or the lower baffle 22. In this way, when external water enters from the upper heat dissipation hole 3 and the lower heat dissipation hole 14, it will not directly act on the data processing chip 17 to cause damage; the structural design is reasonable.

[0056] There are multiple groups of upper heat dissipation holes 3 distributed in a rectangular array, and the bottoms of the multiple groups of upper heat dissipation holes 3 are covered by the upper baffle 16. The length and width of the upper baffle 16 are respectively smaller than the inner length and width of the processor housing 1. When the processor housing 1 is placed forward and the upper baffle 16 is located inside the upper end of the processor housing 1, the upper baffle 16 is pressed against the corresponding second spring 27 below it by gravity, and the upper baffle 16 and the bottom of the upper heat dissipation holes 3 maintain a heat dissipation gap.

[0057] Furthermore, multiple groups of upper heat dissipation holes 3 are provided to maintain good heat dissipation. The second spring 27 plays a role in pulling or pushing the upper baffle 16, so that when the upper baffle 16 is located inside the upper end of the processor housing 1, it can compress the second spring 27 and open the lower end of the upper heat dissipation hole 3, so that the interior of the processor housing 1 can dissipate heat normally.

[0058] There are multiple groups of lower heat dissipation holes 14 distributed in a rectangular array, and the upper parts of the multiple groups of lower heat dissipation holes 14 are covered by the lower baffle 22. The length and width of the lower baffle 22 are respectively smaller than the inner length and width of the processor housing 1. When the processor housing 1 is placed forward and the upper baffle 16 is located inside the upper end of the processor housing 1, the lower baffle 22 seals and blocks the upper ends of the lower heat dissipation holes 14 below it through the action of gravity, and the corresponding second spring 27 above the lower baffle 22 remains in a stretched state.

[0059] Specifically, the movable sealing plates 4 are provided with multiple groups so that the heat dissipation is maintained at a good level. The second spring 27 plays the role of pulling or pushing the lower baffle 22, so that when the lower baffle 22 is located inside the lower end of the processor housing 1, it can pull the second spring 27 and seal the upper end of the lower heat dissipation hole 14 to prevent external water from entering from the bottom of the processor housing 1. The waterproof effect is good and overheating or water interference with the device is avoided.

[0060] The metal heat dissipation pipe 20 is cylindrical in structure, and at least one group of the metal heat dissipation pipe 20 is disposed inside the processor housing 1 .

[0061] Among them, according to the width of the processor housing 1 or the number of data processing chips 17, multiple groups of metal heat dissipation pipes 20 can be correspondingly arranged. The arrangement of the metal heat dissipation pipes 20 allows the data processing chip 17 to rotate around the metal heat dissipation pipes 20 as the axis, which is convenient for the data processing chip 17 to dissipate heat and waterproof. The external natural wind can enter and exit through the two ends of the metal heat dissipation pipes 20, and the heat inside the processor housing 1 is transferred to the outside through the inner and outer walls of the metal heat dissipation pipes 20, with good heat dissipation.

[0062] The data processing chip 17 is opposite to the counterweight block 21, and the gravity of the counterweight block 21 is greater than the gravity of the data processing chip 17. A first connecting plate 28 is fixedly provided on the upper end of the counterweight block 21, and the first connecting plate 28 is movably fitted on the lower surface of the rotating ring 18, and the first connecting plate 28 is fixed to the rotating ring 18 by screws. A second connecting plate 29 is fixedly provided on the lower end of the data processing chip 17, and the second connecting plate 29 is movably fitted on the upper surface of the rotating ring 18, and the second connecting plate 29 is fixed to the upper surface of the rotating ring 18 by screws.

[0063] In the device, the data processing chip 17 and the counterweight block 21 are detachably connected to the rotating ring 18. The position and quantity of the data processing chip 17 and the counterweight block 21 can be set according to actual needs, and the practicability is high.

[0064] A wiring part is provided at one end of the processor housing 1, and the wiring part includes an annular groove 5. The annular groove 5 is a circular groove structure that runs through the inside and outside of the processor housing 1. A movable sealing plate 4 is provided in the annular groove 5. An annular groove is left between the outer circle of the movable sealing plate 4 and the inner wall of the annular groove 5. A rubber sealing ring 6 is movably provided in the annular groove. The rubber sealing ring 6 is rotatably set in the annular groove. A through hole 25 is provided on the rubber sealing ring 6. A wire 7 is connected to one end of the data processing chip 17. The wire 7 movably passes through the through hole 25. The movable sealing plate 4 and the processor housing 1 are fixedly connected through a connecting frame 8 that spans the annular groove 5. The connecting frame 8 is a concave structure, and the connecting frame 8 is provided outside the processor housing 1.

[0065] In order to adapt the data processing chip 17 to be flippable and movable in the processor housing 1, a wiring part is provided at one end of the processor housing 1, and the wiring part ensures that the data processing chip 17 is normally connected to the outside through the wire 7;

[0066] Specifically, when the data processing chip 17 is turned over in the processor housing 1, the wire 7 drives the rubber sealing ring 6 to rotate in the annular groove 5, thereby changing the position of the wire 7. The rubber sealing ring 6 ensures the sealing of the position of the annular groove 5, and maintains the waterproofness of the extended position of the wire 7 without affecting the movement of the wire 7.

[0067] In the device, the movable sealing plate 4 is connected to the processor housing 1 via a connecting frame 8, so that the processor housing 1 can only be turned back and forth when turned over, and cannot be turned toward one position all the time.

[0068] The inner and outer rings of the annular groove are both provided with limiting grooves 24 in the middle, and the inner and outer rings of the rubber sealing ring 6 are both provided with limiting rings 23 in the middle, and the limiting rings 23 are movably arranged in the corresponding limiting grooves 24 .

[0069] Specifically, the limiting rings 23 provided on the inner and outer rings of the rubber sealing ring 6 are movably provided in the limiting groove 24, thereby preventing the rubber sealing ring 6 from being easily separated from the annular groove 5, and providing strong connection stability.

[0070] A drainage part is provided on the cover 2, and the drainage part includes a drainage hole 10. The drainage hole 10 is connected to the interior of the processor housing 1 at the same time. The drainage hole 10 is provided on the cover 2, and a sealing plug 12 is movably engaged in the drainage hole 10. The outside of the sealing plug 12 is blocked by a baffle frame 11. The baffle frame 11 is a concave structure and is fixedly welded to the outer surface of the cover 2. A first spring 13 is fixedly welded inside the concave shape of the baffle frame 11 for pushing the sealing plug 12 and engaging the sealing plug 12 in the drainage hole 10. The cross-section of the sealing plug 12 is a convex structure, and the convex part of the convex structure faces the interior of the processor housing 1, and the shape of the convex structure matches the shape of the drainage hole 10.

[0071] When too much water enters the processor housing 1 and cannot be drained, the processor housing 1 is turned over 90 degrees as a whole, and the cover 2 on the side of the processor housing 1 is attached to the ground. At this time, the water is pressed against the surface of the sealing plug 12, so that the sealing plug 12 is moved out of the drainage hole 10, and the water is drained from the drainage hole 10. When the water is drained, the sealing plug 12 loses pressure and is restored and sealed in the drainage hole 10 by the elastic force of the first spring 13, thereby achieving the purpose of opening the drainage hole 10 when draining water and sealing the drainage hole 10 when not draining water;

[0072] For more convenient use, the sealing plug 12 can be manually removed from and inserted into the drainage hole 10 . The retaining frame 11 also serves to support the first spring 13 and maintain a drainage gap between the sealing cover 2 and the ground.

[0073] There are multiple groups of drainage holes 10 distributed at equal distances on the cover 2.

[0074] It should be noted that, in order to further drain the water inside the processor housing 1, multiple groups of drainage holes 10 can be provided according to actual needs;

[0075] In the device, the first external pipe 9 and the second external pipe 15 can be connected to a fan to facilitate rapid heat dissipation.

[0076] Working principle: The setting of the automatic control component in the present invention can realize that heat is always discharged from the top of the processor housing 1, achieving the purpose of good heat dissipation, that is, no matter when the processor housing 1 is placed forwardly or inverted, the upper heat dissipation holes 3 corresponding to the upper surface of the processor housing 1 or the lower heat dissipation holes 14 corresponding to the lower surface will be opened accordingly, such as: when the processor housing 1 is placed forwardly, the upper heat dissipation holes 3 on the processor housing 1 are located at the upper end of the processor housing 1, and the upper baffle 16 is opened downward by the automatic control component, so that a heat dissipation gap is generated between the upper baffle 16 and the bottom of the upper heat dissipation holes 3, and the heat inside the processor housing 1 can be discharged through the outer periphery of the upper baffle 16, the heat dissipation gap and the upper heat dissipation holes 3 in sequence, and when external water enters through the upper heat dissipation holes 3, the water will be blocked by the upper baffle 16, and the water will flow from the outer periphery of the upper baffle 16 into the lower end of the processor housing 1, so that the water will not affect the data processing chip 17, and when the processor housing 1 is placed forwardly, the lower baffle 22 is attached to the upper surface of the lower heat dissipation holes 14, so that the lower heat dissipation holes 14 are closed, and the bottom of the processor housing 1 will not be flooded;

[0077] The edges of the upper baffle 16 and the lower baffle 22 are preferably turned toward the middle of the processor housing 1, so that when water enters the surface of the upper baffle 16 or the lower baffle 22 from the corresponding upper heat dissipation holes 3 and the lower heat dissipation holes 14, it can slide through the corresponding turning positions instead of sliding to the middle of the upper baffle 16 or the lower baffle 22 and then falling;

[0078] The structural arrangement of the data processing chip 17 and the metal heat dissipation pipe 20 is reasonable. When the processor housing 1 is placed forward or inverted, the counterweight block 21 is always downward due to gravity, and the data processing chip 17 is always located at the upper end of the processor housing 1, so that the data processing chip 17 is always protected below by the upper baffle 16 or the lower baffle 22. In this way, when external water enters from the upper heat dissipation hole 3 and the lower heat dissipation hole 14, it will not directly act on the data processing chip 17 to cause damage; the structural design is reasonable.

[0079] According to the width of the processor housing 1 or the number of data processing chips 17, multiple groups of metal heat dissipation pipes 20 can be correspondingly arranged. The arrangement of the metal heat dissipation pipes 20 allows the data processing chips 17 to rotate around the metal heat dissipation pipes 20 as an axis, which is convenient for the data processing chips 17 to dissipate heat and prevent water. The external natural wind can enter and exit through both ends of the metal heat dissipation pipes 20, and the heat inside the processor housing 1 is transferred to the outside through the inner and outer walls of the metal heat dissipation pipes 20, so that the heat dissipation is good.

[0080] The data processing chip 17 and the counterweight block 21 are detachably connected to the rotating ring 18. The positions and quantities of the data processing chip 17 and the counterweight block 21 can be set according to actual needs, and the practicality is relatively high. In order to adapt to the data processing chip 17 being able to flip and move in the processor housing 1, a wiring part is provided at one end of the processor housing 1, and the wiring part ensures that the data processing chip 17 is normally connected to the outside through the wire 7. When the data processing chip 17 flips in the processor housing 1, the wire 7 drives the rubber sealing ring 6 to rotate in the annular groove 5, thereby changing the position of the wire 7. The rubber sealing ring 6 ensures the sealing of the position of the annular groove 5, and maintains the waterproofness of the extended position of the wire 7 without affecting the movement of the wire 7.

[0081] When too much water enters the processor housing 1 and cannot be drained, the processor housing 1 is turned over 90 degrees as a whole, and the cover 2 on the side of the processor housing 1 is attached to the ground. At this time, the water is pressed against the surface of the sealing plug 12, so that the sealing plug 12 is moved out of the drainage hole 10, and the water is drained from the drainage hole 10. When the water is drained, the sealing plug 12 loses pressure and is restored to be sealed in the drainage hole 10 by the elastic force of the first spring 13, so that the drainage hole 10 is opened when draining and sealed when not draining.

[0082] For easier use, the sealing plug 12 can be manually removed from and inserted into the drain hole 10. The baffle 11 also supports the first spring 13 and maintains a drainage gap between the cover 2 and the ground. In order to further drain the water inside the processor housing 1, multiple groups of drain holes 10 can be provided according to actual needs. The first external pipe 9 and the second external pipe 15 can be connected to a fan to facilitate rapid heat dissipation.

Claims

1. A water-resistant processor housing, comprising a processor housing (1) for storing a data processing chip, characterized in that: The processor housing (1) is in a rectangular box structure. One side of the processor housing (1) is open, and a cover (2) is fixed at the opening position by screws. A metal heat dissipation pipe (20) is arranged inside the processor housing (1). The metal heat dissipation pipe (20) is arranged in the middle of the processor housing (1), and two ends of the metal heat dissipation pipe (20) are respectively fixed to two ends of the processor housing (1). The metal heat dissipation pipe (20) is distributed along the length direction of the processor housing (1). A rotating ring (18) is rotatably sleeved on the metal heat dissipation pipe (20). A data processing chip (17) is installed at the upper end of the rotating ring (18), and a counterweight (21) is installed at the lower end of the rotating ring (18). A heat dissipation channel (19) is arranged inside the metal heat dissipation pipe (20). A first external pipe (9) is arranged in the middle of one end of the processor housing (1), and a second external pipe (15) is arranged in the middle of the other end. The second external pipe (15) and the first external pipe (9) are respectively connected to the two ends of the heat dissipation channel (19). The processor housing (1) is provided with an anti-interference mechanism for providing waterproof heat dissipation to the data processing chip, the anti-interference mechanism comprising an upper heat dissipation hole (3), a lower heat dissipation hole (14), an upper baffle (16) and a lower baffle (22); the upper heat dissipation hole (3) is provided on the upper surface of the processor housing (1) and is connected to the inside and outside of the processor housing (1); the lower heat dissipation hole (14) is provided on the lower surface of the processor housing (1) and is connected to the inside and outside of the processor housing (1); the upper baffle (16) is provided inside the upper end of the processor housing (1) and is blocked below the upper heat dissipation hole (3); the lower baffle (22) is provided inside the lower end of the processor housing (1) and is blocked above the lower heat dissipation hole (14); and an automatic control component for controlling the lifting of the upper baffle (16) and the lower baffle (22) to realize the opening and closing of the upper heat dissipation hole (3) and the lower heat dissipation hole (14) is provided inside the processor housing (1).

2. The water-resistant processor housing according to claim 1, characterized in that: The automatic control component comprises a support plate (26) fixedly welded on the inner wall of the processor housing (1), a second spring (27) fixedly welded on the surface of the support plate (26), a group of the support plate (26) is arranged at the four corners of the upper baffle plate (16) and the lower baffle plate (22) and on one side close to the middle of the processor housing (1), and one end of the second spring (27) away from the support plate (26) is fixedly welded on the corresponding surface of the upper baffle plate (16) and the lower baffle plate (22).

3. The water-resistant processor housing according to claim 2, characterized in that: The upper heat dissipation holes (3) are distributed in a plurality of groups in a rectangular array, and the lower parts of the plurality of upper heat dissipation holes (3) are covered by an upper baffle (16). The length and width of the upper baffle (16) are respectively smaller than the inner length and width of the processor housing (1). When the processor housing (1) is placed in a forward direction and the upper baffle (16) is located inside the upper end of the processor housing (1), the upper baffle (16) is pressed against the corresponding second spring (27) below it by gravity, and a heat dissipation gap is maintained between the upper baffle (16) and the bottom of the upper heat dissipation holes (3).

4. The water-resistant processor housing according to claim 3, characterized in that: The lower heat dissipation holes (14) are distributed in a plurality of groups in a rectangular array, and the upper parts of the plurality of groups of lower heat dissipation holes (14) are covered by a lower baffle (22). The length and width of the lower baffle (22) are respectively smaller than the inner length and width of the processor housing (1). When the processor housing (1) is placed in a forward direction and the upper baffle (16) is located inside the upper end of the processor housing (1), the lower baffle (22) seals and blocks the upper ends of the lower heat dissipation holes (14) therebelow by gravity, and the corresponding second spring (27) above the lower baffle (22) remains in a stretched state.

5. The water-resistant processor housing according to claim 4, characterized in that: The metal heat dissipation pipe (20) is in a cylindrical structure, and at least one group of the metal heat dissipation pipe (20) is arranged inside the processor housing (1).

6. The water-resistant processor housing according to claim 5, characterized in that: The data processing chip (17) is opposite to the counterweight block (21), the gravity of the counterweight block (21) is greater than the gravity of the data processing chip (17), a first connecting plate (28) is fixedly provided at the upper end of the counterweight block (21), the first connecting plate (28) is movably fitted on the lower surface of the rotating ring (18), and the first connecting plate (28) is fixed to the rotating ring (18) by screws, and a second connecting plate (29) is fixedly provided at the lower end of the data processing chip (17), the second connecting plate (29) is movably fitted on the upper surface of the rotating ring (18), and the second connecting plate (29) is fixed to the upper surface of the rotating ring (18) by screws.

7. The water-resistant processor housing according to claim 6, characterized in that: A wiring part is provided at one end of the processor housing (1), and the wiring part includes an annular groove (5). The annular groove (5) is in a circular groove structure and penetrates inside and outside the processor housing (1). A movable sealing plate (4) is provided in the annular groove (5). An annular groove is left between the outer ring of the movable sealing plate (4) and the inner wall of the annular groove (5). A rubber sealing ring (6) is movably provided in the annular groove. The rubber sealing ring (6) is rotatably provided in the annular groove. A through hole (25) is provided on the rubber sealing ring (6). A wire (7) is connected to one end of the data processing chip (17). The wire (7) movably passes through the through hole (25). The movable sealing plate (4) and the processor housing (1) are fixedly connected via a connecting frame (8) spanning the annular groove (5). The connecting frame (8) is in a concave shape and is provided outside the processor housing (1).

8. The water-resistant processor housing according to claim 7, characterized in that: The inner and outer rings of the annular groove are both provided with a limiting groove (24) in the middle, and the inner and outer rings of the rubber sealing ring (6) are both provided with a limiting ring (23) in the middle, and the limiting ring (23) is movably arranged in the corresponding limiting groove (24).

9. The water-resistant processor housing according to claim 8, characterized in that: The cover (2) is provided with a drainage part, the drainage part comprising a drainage hole (10), the drainage hole (10) being connected to the interior of the processor housing (1) at the same time, the drainage hole (10) being provided on the cover (2), a sealing plug (12) being movably engaged in the drainage hole (10), a blocking frame (11) being shielded outside the sealing plug (12), the blocking frame (11) being a concave-shaped structure fixedly welded to the outer surface of the cover (2), a first spring (13) being fixedly welded inside the concave-shaped structure of the blocking frame (11) for pushing the sealing plug (12) and engaging the sealing plug (12) in the drainage hole (10), the cross section of the sealing plug (12) being a convex-shaped structure, the convex part of the convex-shaped structure facing the interior of the processor housing (1), and the shape of the convex-shaped structure matching the shape of the drainage hole (10).

10. The water-resistant processor housing according to claim 9, characterized in that: The drainage holes (10) are arranged in multiple groups and are evenly spaced on the cover (2).

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