Vapor chamber and electronic equipment

Abstract

The invention discloses a vapor chamber and electronic equipment. The vapor chamber comprises an evaporation wall, a condensation wall and an enclosure frame, the enclosure frame is supported between the evaporation wall and the condensation wall, and a medium phase change cavity is defined by the enclosure frame, the evaporation wall and the condensation wall; the enclosure frame can change between a first form and a second form along with the temperature change; when the enclosure frame is in the first form, the distance between the evaporation wall and the condensation wall is a first distance; when the enclosure frame is in the second form, the distance between the evaporation wall and the condensation wall is a second distance; the second distance is less than the first distance. According to the scheme, the problem that the heat dissipation performance is easily affected due to the fact that the size of the working cavity is too small in a vapor chamber related to the related technology can be solved.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment design, and specifically relates to a heat spreader and electronic equipment. Background Art

[0002] At present, electronic devices are widely used in people's daily life. With the development of science and technology, the functions of electronic devices (such as mobile phones, computers, etc.) are becoming more and more complex, and the thickness of electronic devices is becoming thinner and thinner, which makes the heat generated by the heating elements in the electronic devices more and more when working. In order to dissipate the heat better, the heat sink is generally used to dissipate the heat of the heating elements. At the same time, in order to avoid increasing the thickness of the electronic devices, the thickness of the heat sink is also relatively small.

[0003] The vapor chamber has a working chamber for containing a phase-change fluid. During operation, the phase-change fluid absorbs the heat generated by the heating element and then evaporates in the working chamber. After evaporation, the phase-change fluid condenses to circulate in the working chamber, thereby continuously absorbing heat to dissipate heat from the heating element. However, a reduction in the thickness of the vapor chamber will result in a too small volume of the vapor chamber, thereby affecting the circulation of the phase-change fluid in the working chamber and easily affecting the heat dissipation performance of the vapor chamber. Summary of the invention

[0004] The present invention discloses a vapor chamber and an electronic device, so as to alleviate the problem that the volume of the working chamber of the vapor chamber in the related art is too small and thus the heat dissipation performance is easily affected.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: In a first aspect, the present application discloses a vapor chamber, wherein the vapor chamber comprises an evaporation wall, a condensation wall and a surrounding frame; The enclosure frame is supported between the evaporation wall and the condensation wall, and the enclosure frame, the evaporation wall and the condensation wall form a medium phase change chamber; the enclosure frame can change between a first state and a second state as the temperature changes; When the enclosure is in the first state, the distance between the evaporation wall and the condensation wall is a first distance; when the enclosure is in the second state, the distance between the evaporation wall and the condensation wall is a second distance; the second distance is smaller than the first distance.

[0006] In a second aspect, the present application discloses an electronic device, the disclosed electronic device comprises a heating element and the above-mentioned heat sink, the evaporation wall is connected to the heating element; When the temperature of the heat generating element is higher than or equal to a first threshold, the surrounding frame is in the first state; when the temperature of the heat generating element is lower than the first threshold, the surrounding frame is in the second state.

[0007] The technical solution adopted by the present invention can achieve the following technical effects: The heat spreader disclosed in the embodiment of the present application improves the structure of the heat spreader involved in the related art, and sets a frame that can change between a first form and a second form as the temperature changes, so that the distance between the evaporation wall and the condensation wall can be switched between the first distance and the second distance, so that when the frame is in the first form, the frame can drive the evaporation wall and the condensation wall away from each other to a first relative position, so that the distance between the evaporation wall and the condensation wall is the first distance, so that the volume of the medium phase change chamber becomes the first volume, and when the frame is in the second form, the frame can drive the evaporation wall and the condensation wall close to each other to a second relative position, so that the distance between the evaporation wall and the condensation wall is the second distance, so that the volume of the medium phase change chamber becomes the second volume, and the second distance is smaller than the first distance, so that the second volume is smaller than the first volume. In this structure, the frame changes between the first form and the second form as the temperature changes, so that the distance between the evaporation wall and the condensation wall switches between the first distance and the second distance, thereby changing the volume of the medium phase change cavity, so that when the heat spreader is dissipating heat, the frame can be in the first form, so that the distance between the evaporation wall and the condensation wall is the larger first distance, and the volume of the medium phase change cavity is the larger first volume, so as to facilitate the circulation of the heat dissipation medium in the medium phase change cavity, which is beneficial to improving the heat transfer efficiency, and further can enhance the heat dissipation performance of the heat spreader. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is an exploded view of a vapor chamber disclosed in an embodiment of the present application; Figure 2 is a schematic structural diagram of a vapor chamber disclosed in an embodiment of the present application when the surrounding frame is in a first state; Figure 3 is a schematic structural diagram of a vapor chamber disclosed in an embodiment of the present application when the surrounding frame is in a second state; Figure 4 is a cross-sectional view of a vapor chamber disclosed in an embodiment of the present application when the surrounding frame is in a first state; Figure 5 is a cross-sectional view of a vapor chamber disclosed in an embodiment of the present application when the surrounding frame is in a second state; Figure 6 is a partial cross-sectional view of a vapor chamber disclosed in an embodiment of the present application; Figure 7 It is a partial structural schematic diagram of a heat sink disclosed in an embodiment of the present application; Figure 8 It is another partial structural schematic diagram of a vapor chamber disclosed in an embodiment of the present application; Fig. 9 It is a partial structural schematic diagram of another type of heat sink disclosed in the embodiment of the present application; Fig.10 It is another partial structural schematic diagram of another type of heat spreader disclosed in an embodiment of the present application.

[0009] Description of reference numerals: 100-evaporation wall, 200-condensation wall, 300-enclosing frame, 310-reinforcement part, 320-frame wall, 400-Dielectric phase change cavity, 500-Supporting part, 600-heat absorbing core, 610-avoidance hole. DETAILED DESCRIPTION

[0010] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0011] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0012] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0013] Please refer to Figures 1 to 10 The embodiment of the present application discloses a vapor chamber, and the disclosed vapor chamber includes an evaporation wall 100 , a condensation wall 200 and a surrounding frame 300 .

[0014] The frame 300 is supported between the evaporation wall 100 and the condensation wall 200, and the frame 300, the evaporation wall 100 and the condensation wall 200 enclose a dielectric phase change chamber 400, and the dielectric phase change chamber 400 can be used to accommodate a phase change fluid, and the phase change fluid is used to transfer the heat of the evaporation wall 100 to the condensation wall 200, so that the heat spreader can dissipate heat efficiently. Specifically, the frame 300, the evaporation wall 100 and the condensation wall 200 can be sealed and connected, so that the dielectric phase change chamber 400 can be a sealed chamber, thereby minimizing the leakage of the phase change fluid from the dielectric phase change chamber 400, which may affect the heat dissipation of the heat spreader or the normal operation of the heating element.

[0015] In a specific working process, the evaporation wall 100 is used to evaporate the phase change fluid in the medium phase change chamber 400, so that the phase change fluid absorbs heat and changes from a liquid state to a gaseous state, and the condensation wall 200 is used to condense the phase change fluid in a gaseous state after evaporation, so that the phase change fluid releases heat and changes from a gaseous state to a liquid state, so that the phase change fluid can be used to transfer the heat of the evaporation wall 100 to the condensation wall 200. Under the action of the evaporation wall 100 and the condensation wall 200, the phase change fluid can circulate between the gaseous state and the liquid state, so that the heat of the evaporation wall 100 can be continuously transferred to the condensation wall 200.

[0016] The frame 300 is also used in the vapor chamber to change the distance between the evaporation wall 100 and the condensation wall 200, thereby changing the volume of the medium phase change chamber 400. The frame 300 can change between the first form and the second form as the temperature changes, thereby changing the distance between the evaporation wall 100 and the condensation wall 200.

[0017] In a specific working process, when the frame 300 is in the first form, the frame 300 can drive the evaporation wall 100 and the condensation wall 200 away from each other to a first relative position, which makes the distance between the evaporation wall 100 and the condensation wall 200 the first distance, so that the volume of the dielectric phase change cavity 400 becomes the first volume, thereby increasing the volume of the dielectric phase change cavity 400. The larger volume of the dielectric phase change cavity 400 allows the gaseous phase change fluid to diffuse freely in a larger range, reducing the resistance to the flow of the gaseous phase change fluid, thereby more effectively transferring heat from the evaporation wall 100 to the condensation wall 200, which is beneficial to improving the heat transfer efficiency, and further beneficial to improving the heat dissipation performance of the heat spreader.

[0018] When the enclosure 300 is in the second form, the enclosure 300 drives the evaporation wall 100 and the condensation wall 200 to approach to the second relative position, so that the distance between the evaporation wall 100 and the condensation wall 200 is the second distance, so that the volume of the dielectric phase change cavity 400 becomes the second volume, so that the volume of the dielectric phase change cavity 400 can be reduced to reduce the space occupied by the heat spreader. Among them, the heat spreader can be more easily installed in the inner cavity of the electronic device, and the space occupied by the heat spreader is small, so that the inner cavity can reserve a smaller space for the heat spreader. In this case, the enclosure 300 can be assembled when it is in the second form, so that the heat spreader can be normally assembled into the inner cavity, thereby facilitating the installation of the heat spreader into the inner cavity. Of course, the second distance is smaller than the first distance, which makes the second volume smaller than the first volume.

[0019] It should be noted that the electronic device can be assembled by multiple components to form an inner cavity. In the actual assembly process, there are assembly tolerances between the multiple components, which makes it easy to form an assembly gap between the multiple components, so that the volume of the inner cavity can be increased through the assembly gap. This causes the distance between the evaporation wall 100 and the condensation wall 200 to increase when the enclosure 300 switches from the second form to the first form, thereby increasing the volume of the medium phase change cavity 400, and then when the space occupied by the heat spreader increases, the increased volume of the heat spreader can be accommodated through the assembly gap, so that the heat spreader can be normally installed in the inner cavity. It should be emphasized that when the enclosure 300 is in the second form, the heat spreader also has the ability to dissipate heat, but compared with when the enclosure 300 is in the first form, when the enclosure 300 is in the second form, the heat spreader has a weaker heat dissipation ability.

[0020] The heat spreader disclosed in the embodiment of the present application improves the structure of the heat spreader involved in the related art, and sets a frame 300 that can change between a first form and a second form as the temperature changes, so that the distance between the evaporation wall 100 and the condensation wall 200 can be switched between the first distance and the second distance, so that when the frame 300 is in the first form, the frame 300 can drive the evaporation wall 100 and the condensation wall 200 away from each other to a first relative position, so that the distance between the evaporation wall 100 and the condensation wall 200 is the first distance, so that the volume of the medium phase change cavity 400 becomes the first volume, and when the frame is in the second form, the frame 300 can drive the evaporation wall 100 and the condensation wall 200 close to the second relative position, so that the distance between the evaporation wall 100 and the condensation wall 200 is the second distance, so that the volume of the medium phase change cavity 400 becomes the second volume, and the second distance is smaller than the first distance, so that the second volume is smaller than the first volume.

[0021] In this structure, the enclosure 300 changes between the first form and the second form as the temperature changes, so that the distance between the evaporation wall 100 and the condensation wall 200 switches between the first distance and the second distance, thereby changing the volume of the dielectric phase change cavity 400, so that when the heat spreader is dissipating heat, the enclosure 300 can be in the first form, so that the distance between the evaporation wall 100 and the condensation wall 200 is the larger first distance, so that the volume of the dielectric phase change cavity 400 is the larger first volume, so as to facilitate the circulation of the heat dissipation medium in the dielectric phase change cavity 400, which is conducive to improving the heat transfer efficiency, and thus can enhance the heat dissipation performance of the heat spreader. At the same time, when the enclosure 300 is in the second form, the heat spreader has the ability to dissipate heat, and can also be more conveniently installed in electronic equipment with a smaller occupied space, which is more suitable for the increasingly thin structure of electronic equipment.

[0022] In a further technical solution, Figures 2 to 5 As shown, when the enclosure 300 is in the first form, the enclosure 300 can be in a straightened state, so that the distance between the evaporation wall 100 and the condensation wall 200 can be the first distance. The enclosure 300 can be in a straightened state by straightening and deforming. During the deformation process, the enclosure 300 can be straightened along the distribution direction of the evaporation wall 100 and the condensation wall 200 to drive the evaporation wall 100 and the condensation wall 200 away from the first relative position, so that the distance between the evaporation wall 100 and the condensation wall 200 can be switched to the first distance by the straightening and deformation.

[0023] When the enclosure 300 is in the second state, the enclosure 300 may be in a bent state, so that the distance between the evaporation wall 100 and the condensation wall 200 may be the second distance. The enclosure 300 may be in a bent state by bending deformation, and during the deformation process, the enclosure 300 may be bent toward the inside of the dielectric phase change cavity 400 or outside of the dielectric phase change cavity 400 to drive the evaporation wall 100 and the condensation wall 200 to approach the second relative position, so that the distance between the evaporation wall 100 and the condensation wall 200 may be switched to the second distance by bending deformation.

[0024] In this structure, the frame 300 can play a certain elastic buffering role when bending and deforming, which helps to absorb the vibration easily caused by the movement of the evaporation wall 100 and the condensation wall 200, thereby protecting the internal components of the heat spreader from damage, which is conducive to improving the stability and durability of the heat spreader. In addition, this structure generates less noise when deforming, which is conducive to realizing a silent design, thereby improving the user experience.

[0025] It should be noted that the heat spreader can be used to dissipate heat for the heating element described later. In the specific working process, when the enclosure 300 is in the first form, the temperature of the heating element can be higher than or equal to the first threshold value. In this case, the temperature of the heating element is relatively high, and the temperature of the heating element can be transmitted to the enclosure 300 to affect the enclosure 300. The enclosure 300 can be straightened and deformed with the temperature change, so that the heat spreader can be in a state with a strong heat dissipation capacity. When the enclosure 300 is in the second form, the temperature of the heating element can be lower than the first threshold value. In this case, the temperature of the heating element is relatively low, and the temperature of the heating element can be transmitted to the enclosure 300 to affect the enclosure 300. The enclosure 300 can be bent and deformed, so that the heat spreader can be in a state with a weak heat dissipation capacity.

[0026] In other embodiments, when the enclosure 300 is in the first state, the enclosure 300 may be in an extended state, so that the enclosure 300 can drive the evaporation wall 100 and the condensation wall 200 away from each other through the extension deformation, so that the distance between the evaporation wall 100 and the condensation wall 200 can be switched to the first distance. When the enclosure 300 is in the second state, the enclosure 300 may be in a shortened state, so that the enclosure 300 can drive the evaporation wall 100 and the condensation wall 200 to approach each other through the shortening deformation, so that the distance between the evaporation wall 100 and the condensation wall 200 can be switched to the second distance. In this structure, the extension deformation and the shortening deformation are relatively simple and easier to achieve, which is conducive to reducing the design difficulty.

[0027] Optionally, the material of the frame 300 may be a shape memory alloy. Of course, the shape memory alloy may have a two-way shape memory effect, so that the frame 300 may be deformed accordingly with temperature changes, so that it may be switched between the first form and the second form through corresponding deformation, so that the distance between the evaporation wall 100 and the condensation wall 200 may be the first distance or the second distance, respectively. Specifically, those skilled in the art may set a preset shape or internal microstructure of the shape memory alloy so that the shape memory alloy in the first form may be extended or straightened, and the shape memory alloy in the second form may be shortened or bent. The above technical means may be implemented by those skilled in the art, and this part is not the invention point of the present application, so it will not be repeated.

[0028] In addition, the shape memory alloy may be a nickel-titanium based alloy, a copper-based alloy or an iron-based alloy, and the embodiments of the present application do not limit the specific material of the shape memory alloy.

[0029] In a feasible technical solution, the heat spreader may further include a support portion 500, which may be disposed in the dielectric phase change chamber 400 and may be fixedly connected to the evaporation wall 100 or the condensation wall 200. The support portion 500 may be used to support the evaporation wall 100 and the condensation wall 200, so as to provide support for the evaporation wall 100 and the condensation wall 200, thereby reducing the risk of collapse of the evaporation wall 100 or the condensation wall 200.

[0030] During the specific working process, when the frame 300 is in the first form, the frame 300 can drive one of the evaporation wall 100 and the condensation wall 200 that is fixedly connected to the support part 500 to drive the support part 500 away from the other of the evaporation wall 100 and the condensation wall 200, so that the support part 500 is separated from the evaporation wall 100 or the condensation wall 200.

[0031] When the frame 300 is in the second form, the frame 300 can drive one of the evaporation wall 100 and the condensation wall 200 that is fixedly connected to the support part 500 to drive the support part 500 to contact the other of the evaporation wall 100 and the condensation wall 200, so that the support part 500 is supported between the evaporation wall 100 and the condensation wall 200, thereby providing support for the evaporation wall 100 and the condensation wall 200, reducing the risk of collapse of the evaporation wall 100 or the condensation wall 200, and thus helping to improve the strength of the heat spreader.

[0032] Optionally, when the support portion 500 is fixedly connected to the evaporation wall 100, the support portion 500 and the evaporation wall 100 may be an integrated structure, so as to facilitate manufacturing, and avoid the need to fix the support portion 500 and the evaporation wall 100 through an additional process, which is conducive to reducing the difficulty of installation. Of course, when the support portion 500 is fixedly connected to the condensation wall 200, the support portion 500 and the condensation wall 200 may also be an integrated structure, so as to facilitate manufacturing, and avoid the need to fix the support portion 500 and the condensation wall 200 through an additional process, which is conducive to reducing the difficulty of installation.

[0033] In one embodiment, the support portion 500 may be a support column, and there may be multiple support columns. The multiple support columns may be spaced and evenly connected to the evaporation wall 100 or the condensation wall 200, and the distribution direction of the evaporation wall 100 and the condensation wall 200 may be parallel to the extension direction of the multiple support columns. This structure can provide support for the evaporation wall 100 and the condensation wall 200 more stably through multiple support columns, thereby further reducing the risk of collapse of the evaporation wall 100 or the condensation wall 200, and thus helping to further improve the strength of the heat spreader. In addition, the multiple support columns evenly distributed can evenly provide support for the evaporation wall 100 and the condensation wall 200, thereby reducing local stress concentration, which is conducive to extending the service life of the heat spreader.

[0034] In another embodiment, the support portion 500 may be a support bar, and there may be a plurality of support bars, and the plurality of support bars may be spaced and evenly connected to the evaporation wall 100 or the condensation wall 200, and the distribution direction of the evaporation wall 100 and the condensation wall 200 may be perpendicular to the extension direction of the plurality of support bars. In this structure, the contact area between the support bar and the evaporation wall 100 and the condensation wall 200 is larger than that of the support column, so that the support bar can be more stably supported between the evaporation wall 100 and the condensation wall 200, and is more conducive to dispersing stress, further reducing local stress concentration, and thus further extending the service life of the vapor chamber.

[0035] In the embodiment of the present application, the heat sink may further include a phase change fluid and a heat absorption core 600, which may be both disposed in the medium phase change cavity 400, and the heat absorption core 600 may be connected to the evaporation wall 100, and may be used to transport the phase change fluid to the evaporation wall 100. Specifically, the heat absorption core 600 may be a sintered powder core, a mesh core, a channel core, or a fiber core, and the embodiment of the present application does not limit the specific type of the heat absorption core 600.

[0036] In this structure, the heat absorption core 600 can return the liquid phase change fluid on the condensation wall 200 to the evaporation wall 100 through capillary action to facilitate evaporation of the evaporation wall 100, so that the phase change fluid can circulate efficiently in the medium phase change cavity 400, which is beneficial to improve the heat transfer efficiency, so as to improve the heat dissipation performance of the heat spreader.

[0037] Optionally, the heat absorption core 600 may include an avoidance hole 610, which can be used to avoid cooperation with the support part 500. In a specific working process, when the frame 300 is in the second form, the support part 500 can pass through the avoidance hole 610 to be supported between the evaporation wall 100 and the condensation wall 200, wherein the support part 500 can pass through the avoidance hole 610 and contact the evaporation wall 100 or the condensation wall 200, thereby avoiding the support part 500 from contacting the heat absorption core 600 and easily affecting the normal operation of the heat absorption core 600, which is beneficial to improve the reliability of the heat sink. Of course, when there are multiple support parts 500, there can also be multiple avoidance holes 610, so that when the frame 300 is in the second form, the multiple support parts 500 can respectively pass through the multiple avoidance holes 610 and be supported between the evaporation wall 100 and the condensation wall 200, wherein the multiple support parts 500 can respectively pass through the multiple avoidance holes 610 and contact the evaporation wall 100 or the condensation wall 200.

[0038] In addition, the shape of the avoidance hole 610 can match the shape of the support part 500, so that when the support part 500 is a support column or a support bar, the avoidance hole 610 can normally avoid the support part 500, and can minimize the problem that the avoidance hole 610 is too large and easily affects the working efficiency of the heat absorption core 600.

[0039] In the embodiment of the present application, the frame 300 may include a plurality of reinforcing portions 310 and a plurality of frame walls 320. The plurality of frame walls 320 may be connected end to end in sequence, and a reinforcing portion 310 may be provided at the connection between two adjacent frame walls 320, that is, the plurality of reinforcing portions 310 may be respectively provided at the connection between two adjacent frame walls 320, and the two adjacent frame walls 320 are respectively connected to the corresponding reinforcing portions 310, thereby improving the reliability of the connection between the two adjacent frame walls 320 and facilitating improving the strength of the frame 300.

[0040] Based on the heat spreader disclosed in the embodiment of the present application, the embodiment of the present application further discloses an electronic device, the disclosed electronic device includes a heating element and the heat spreader described in any one of the above embodiments, and the evaporation wall 100 is connected to the heating element so that the heat generated by the heating element can be transferred to the evaporation wall 100, so that the heat spreader can dissipate heat for the heating element. Specifically, the heating element can be a graphics card or a central processing unit, and the embodiment of the present application does not limit the specific type of the heating element.

[0041] In a specific working process, when the temperature of the heating element is higher than or equal to the first threshold value, the frame 300 is in a first form. In this case, the evaporation wall 100 and the condensation wall 200 are away from each other, so that the distance between the evaporation wall 100 and the condensation wall 200 is the first distance, which makes the volume of the medium phase change cavity 400 a relatively large first volume, so as to facilitate the circulation of the phase change fluid in the medium phase change cavity 400, so as to dissipate the heat of the heating element in time.

[0042] When the temperature of the heating element is lower than the first threshold, the frame 300 is in the second state. In this case, the evaporation wall 100 and the condensation wall 200 are close to each other, so that the distance between the evaporation wall 100 and the condensation wall 200 is the second distance, which makes the volume of the phase change cavity 400 a relatively small second volume, thereby reducing the space occupied by the heat spreader.

[0043] In the examples of the present application, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a smart wearable device, an e-book reader, an electronic game console, or the like. The embodiments of the present application do not limit the specific types of electronic devices.

[0044] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features of the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0045] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A heat sink, characterized in that: It includes an evaporation wall, a condensation wall and a surrounding frame; The enclosure frame is supported between the evaporation wall and the condensation wall, and the enclosure frame, the evaporation wall and the condensation wall form a medium phase change chamber; The enclosure can change between a first state and a second state in response to temperature changes; When the enclosure is in the first state, the distance between the evaporation wall and the condensation wall is a first distance; when the enclosure is in the second state, the distance between the evaporation wall and the condensation wall is a second distance; the second distance is smaller than the first distance.

2. The vapor chamber according to claim 1, characterized in that: When the enclosure is in the first state, the enclosure is in a straightened state so that the distance between the evaporation wall and the condensation wall is the first distance; When the surrounding frame is in the second form, so that the surrounding frame is in a bent state, the distance between the evaporation wall and the condensation wall is the second distance.

3. The vapor chamber according to claim 1, characterized in that: The heat spreader also includes a support portion, which is disposed in the medium phase change chamber and fixedly connected to the evaporation wall or the condensation wall, and is used to support the evaporation wall and the condensation wall; When the enclosure is in the first state, the enclosure drives one of the evaporation wall and the condensation wall that is fixedly connected to the support portion to drive the support portion away from the other of the evaporation wall and the condensation wall; When the frame is in the second form, the frame drives one of the evaporation wall and the condensation wall that is fixedly connected to the support portion to drive the support portion to contact the other of the evaporation wall and the condensation wall, so that the support portion is supported between the evaporation wall and the condensation wall.

4. The heat sink according to claim 3, characterized in that: The supporting part is a supporting column, and there are multiple supporting columns. The multiple supporting columns are spaced and evenly connected to the evaporation wall or the condensation wall. The distribution direction of the evaporation wall and the condensation wall is parallel to the extension direction of the multiple supporting columns.

5. The vapor chamber according to claim 3, characterized in that: The support portion is a support bar, and there are multiple support bars. The multiple support bars are spaced and evenly connected to the evaporation wall or the condensation wall. The distribution direction of the evaporation wall and the condensation wall is perpendicular to the extension direction of the multiple support bars.

6. The vapor chamber according to claim 3, characterized in that: The heat sink also includes a phase change fluid and a heat absorption core, both of which are arranged in the medium phase change cavity, and the heat absorption core is connected to the evaporation wall for conveying the phase change fluid to the evaporation wall.

7. The vapor chamber according to claim 6, characterized in that: The heat absorption core comprises an avoidance hole, and when the surrounding frame is in the second state, the support portion passes through the avoidance hole and is supported between the evaporation wall and the condensation wall.

8. The vapor chamber according to claim 1, characterized in that: The material of the surrounding frame is shape memory alloy.

9. The vapor chamber according to claim 1, characterized in that: The surrounding frame includes a plurality of reinforcing parts and a plurality of frame walls, the plurality of frame walls are connected end to end in sequence, the reinforcing parts are provided at the connection between two adjacent frame walls, and the two adjacent frame walls are respectively connected to the corresponding reinforcing parts.

10. An electronic device, characterized in that: It comprises a heating element and a vapor chamber according to any one of claims 1 to 9, wherein the evaporation wall is connected to the heating element; When the temperature of the heat generating element is higher than or equal to a first threshold, the surrounding frame is in the first state; when the temperature of the heat generating element is lower than the first threshold, the surrounding frame is in the second state.

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