Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic products, the electronic equipment comprises a circuit board assembly, the circuit board assembly comprises a first circuit board, a second circuit board and a connector, and the second circuit board is electrically connected with the first circuit board through the connector; the shielding structure comprises a metal reinforcing plate and a shielding cover side wall, the metal reinforcing plate is arranged on the side, away from the first circuit board, of the second circuit board in a stacked mode, and the metal reinforcing plate is further electrically connected with a grounding structure on the first circuit board through the shielding cover side wall; wherein the metal reinforcing plate and the side wall of the shielding case are enclosed to form a shielding space, and the connector and the second circuit board are at least partially located in the shielding space.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and specifically relates to an electronic device. Background Art

[0002] In electronic devices such as mobile phones, in order to avoid mutual interference between functional components such as antennas and connector modules of the electronic devices, a shielding structure that is compatible with functional components such as connector modules is usually provided.

[0003] At present, the shielding structure is usually composed of a shielding cover base arranged on the circuit board and a shielding cover upper cover arranged on the shielding cover base, so as to realize the shielding of functional components such as connector modules. However, in order to make the shielding cover base better mounted on the circuit board, the shielding cover base needs to have a certain width so that the suction cup of the robot arm can adsorb it.

[0004] It can be seen that the shielding structure in the related art has the problem of occupying a large space. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide an electronic device that can solve the problem of large space occupation existing in the shielding structure in the related art.

[0006] The present application provides an electronic device, including:

[0007] A circuit board assembly, the circuit board assembly comprising a first circuit board, a second circuit board and a connector, the second circuit board being electrically connected to the first circuit board through the connector;

[0008] A shielding structure, the shielding structure comprising a metal reinforcement plate and a shielding cover side wall, the metal reinforcement plate is stacked and arranged on a side of the second circuit board away from the first circuit board, and the metal reinforcement plate is also electrically connected to a grounding structure on the first circuit board through the shielding cover side wall;

[0009] The metal reinforcing plate and the side wall of the shielding cover are arranged to form a shielding space, and the connector and the second circuit board are at least partially located in the shielding space.

[0010] In the embodiments of the present application, the metal reinforcement plate used to enclose a shielding space can be understood as the shielding cover upper cover of the shielding structure. Compared with conventional shielding schemes, the shielding structure in the present application does not need to provide an additional shielding cover upper cover on the outside of the metal reinforcement plate, but directly uses the metal reinforcement plate as the shielding cover upper cover of the shielding structure. This can effectively reduce the installation space required for the shielding structure and solve the problem of large space occupation of the shielding structure in related technologies.

[0011] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 It is one of the structural schematic diagrams of the electronic device provided in the embodiment of the present application;

[0014] Figure 2 yes Figure 1 A structural schematic diagram of the first circuit board shown in ;

[0015] Figure 3 yes Figure 1 One of the structural schematic diagrams of the shielding structure shown in;

[0016] Figure 4 yes Figure 1 The second structural schematic diagram of the shielding structure shown in;

[0017] Figure 5 This is the second structural diagram of the electronic device provided in the embodiment of the present application;

[0018] Figure 6 This is the third structural diagram of the electronic device provided in the embodiment of the present application;

[0019] Figure 7 yes Figure 6 A magnified view of the circled area A;

[0020] Figure 8 It is a local explosion of the electronic device provided in the embodiment of the present application Figure 1 ;

[0021] Fig. 9 This is the fourth structural diagram of the electronic device provided in the embodiment of the present application;

[0022] Fig.10 This is the fifth structural diagram of the electronic device provided in the embodiment of the present application;

[0023] Fig.11 yes Fig. 9 A schematic diagram of the shielding structure shown in FIG.

[0024] Fig.12 It is a local explosion of the electronic device provided in the embodiment of the present application Figure 2 ;

[0025] Fig.13 It is a local explosion of the electronic device provided in the embodiment of the present application Figure 3 ;

[0026] Fig.14 This is the sixth structural diagram of the electronic device provided in the embodiment of the present application. DETAILED DESCRIPTION

[0027] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0028] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] like Figures 1 to 14As shown, an embodiment of the present application provides an electronic device, which includes a circuit board assembly 10 and a shielding structure 20. The shielding structure 20 can not only reduce the interference signal of the electrical signal on the circuit board assembly 10 to the functional components such as the antenna of the electronic device, but also reduce the interference effect of the electromagnetic signal of the functional components such as the antenna of the electronic device on the circuit board assembly 10.

[0032] The circuit board assembly 10 includes a first circuit board 11 , a second circuit board 12 and a connector 13 . The second circuit board 12 can be electrically connected to the first circuit board 11 through the connector 13 , that is, the second circuit board 12 can be stacked on the first circuit board 11 through the connector 13 .

[0033] In some embodiments, the first circuit board 11 can be understood as the main board of the electronic device; the second circuit board 12 can be understood as the auxiliary circuit board of the electronic device, such as the flexible circuit board of the camera module of the electronic device, or the flexible circuit board of the speaker module of the electronic device; the connector 13 can be understood as a connecting device for realizing the electrical connection between the first circuit board 11 and the second circuit board 12, which can be a board-to-board connector or other types of connectors that can realize electrical connection between two devices.

[0034] In some embodiments, Fig.10 As shown, the connector 13 includes a male connector 132 and a female connector 131; wherein, the male connector 132 can be arranged on the second circuit board 12, and the female connector 131 can be arranged on the first circuit board 11, and the electrical connection between the first circuit board 11 and the second circuit board 12 is achieved through the connection between the male connector 132 and the female connector 131.

[0035] The above-mentioned shielding structure 20 includes a metal reinforcement plate 21 and a shielding cover side wall 22. The metal reinforcement plate 21 is stacked and arranged on the side of the second circuit board 12 away from the first circuit board 11, and the metal reinforcement plate 21 is also electrically connected to the grounding structure on the first circuit board 11 through the shielding cover side wall 22 to achieve grounding of the shielding structure 20.

[0036] In this embodiment, the metal reinforcement plate 21 can not only reinforce the structural strength of the second circuit board 12 to improve the stability of the electrical connection between the second circuit board 12 and the first circuit board 11, but also can be formed with the side wall 22 of the shielding cover to form a shielding space 30, and the connector 13 and the second circuit board 12 are at least partially located in the shielding space 30 to achieve the shielding effect of the shielding structure 20 on the circuit board assembly 10.

[0037] Compared with the conventional shielding structure composed of a shielding cover base and a shielding cover upper cover, the metal reinforcement plate 21 used to enclose a shielding space 30 in the present application can be understood as the shielding cover upper cover of the shielding structure 20. That is, compared with the conventional shielding scheme, the shielding structure 20 in the present application does not need to provide an additional shielding cover on the outside of the metal reinforcement plate 21, but directly uses the metal reinforcement plate 21 as the shielding cover upper cover of the shielding structure 20. This can effectively reduce the installation space required for the shielding structure 20 and solve the problem of large space occupation of the shielding structure in the related technology.

[0038] In some embodiments, Figure 3 and Figure 4 As shown, the shielding cover side wall 22 can be a flange structure extending from the edge area of ​​the metal reinforcement plate 21, that is, the shielding cover side wall 22 and the metal reinforcement plate 21 can be an integral structure. In this way, during the process of mounting the shielding structure 20 on the first circuit board 11, the end face of the metal reinforcement plate 21 can be directly used as the adsorption surface of the suction cup of the robot arm. Compared with the conventional shielding structure, the shielding cover base needs to have a certain width to meet the adsorption of the suction cup of the robot arm, which effectively reduces the thickness requirement of the shielding cover side wall 22 and further reduces the installation space required for the shielding structure 20.

[0039] It should be noted that in the process of assembling the shielding structure on the circuit board, surface mounting technology is usually used; and in the process of assembling the shielding structure on the circuit board by surface mounting technology, the shielding cover base of the shielding structure is usually first assembled on the circuit board through the suction cup on the robotic arm, and then the shielding cover upper cover is installed on the shielding cover base. The shielding cover base must meet the adsorption of the suction cup, and the width of the shielding cover base needs to be larger than the size of the adsorption area of ​​the suction cup, so that the suction cup on the robotic arm can better adsorb on the shielding cover base, thereby ensuring the stability of the adsorption connection between the suction cup of the robotic arm and the shielding cover base.

[0040] In the present application, the shielding cover side wall 22 and the metal reinforcement plate 21 are set as an integral structure, so that during the assembly of the shielding structure 20 on the first circuit board 11, the end surface of the metal reinforcement plate 21 can be directly used as the adsorption surface of the suction cup, thereby effectively reducing the thickness requirement of the shielding cover side wall 22 and further reducing the installation space required for the shielding structure 20.

[0041] In some embodiments, the electronic device also includes an antenna structure and a first frame. The radiator of the antenna structure can be set on the first frame, and the above-mentioned circuit board assembly 10 is arranged adjacent to the radiator of the antenna structure. In order to reduce the mutual interference between the antenna structure and the circuit board assembly 10, a shielding structure 20 adapted to the connector 13 of the circuit board assembly 10 and the second circuit board 12 can be set.

[0042] In some embodiments, the shielding cover side wall 22 includes a first side wall close to and parallel to the first frame, and a second side wall and a third side wall arranged perpendicular to the first frame, so as to ensure the shielding effect of the shielding structure 20; and by setting the side of the shielding structure 20 away from and parallel to the first edge as an open structure, the material cost of the shielding structure 20 can be reduced and the weight of the shielding structure 20 can be reduced while ensuring the shielding effect of the shielding structure 20.

[0043] In some embodiments, Figures 2 to 4 As shown, a first elastic foot structure 221 is provided at one end of the shielding cover side wall 22 away from the metal reinforcing plate 21, and a copper exposed area 111 adapted to the first elastic foot structure 221 is provided on the first circuit board 11;

[0044] Among them, the grounding structure on the first circuit board 11 is the copper foil layer exposed by the copper exposed area 111, and the first spring foot structure 221 is electrically connected to the copper foil layer, that is, the first spring foot structure 221 is electrically connected to the copper foil layer to achieve electrical connection between the shielding cover side wall 22 and the grounding structure on the first circuit board 11.

[0045] In some embodiments, the first spring-pin structure 221 has a certain pre-compression height to achieve abutment between the first spring-pin structure 221 and the copper foil layer exposed in the copper-exposed region 111 .

[0046] In some embodiments, the pre-pressed height of the first elastic foot structure 221 can be much smaller than the buckling height of the male connector 132 and the female connector 131. For example, the buckling height of the male connector 132 and the female connector 131 can be set to 4 to 6 times the pre-pressed height of the first elastic foot structure 221.

[0047] In this way, by setting the pre-compression height of the first elastic foot structure 221 much smaller than the engagement height of the male connector 132 and the female connector 131, that is, by setting the compression amount of the first elastic foot structure 221 to be smaller, while achieving the abutment of the first elastic foot structure 221 with the copper foil layer exposed by the copper exposed area 111, the engagement of the male connector 132 and the female connector 131 will not be bounced open due to the elastic force between the first elastic foot structure 221 and the copper foil layer exposed by the copper exposed area 111, thereby allowing the male connector 132 and the female connector 131 to remain engaged, thereby achieving pre-fixation of the connector 13 and the first circuit board 11 and the second circuit board 12 connected thereto.

[0048] In some embodiments, Figures 9 to 13As shown, the shielding structure 20 includes a shielding cover base 23, which is disposed around the connector 13, and the shielding cover base 23 is also electrically connected to the grounding structure on the first circuit board 11, and the shielding cover base 23 is also electrically connected to the metal reinforcement plate 21 through the shielding cover side wall 22;

[0049] The projection of the shielding cover base 23 on the first circuit board 11 is located within the projection of the metal reinforcement plate 21 on the first circuit board 11 .

[0050] In some embodiments, the shielding cover base 23 is disposed around the female connector 131 of the connector 13 .

[0051] In this embodiment, by positioning the projection of the shielding cover base 23 on the first circuit board 11 within the projection of the metal reinforcement plate 21 on the first circuit board 11, that is, arranging the shielding cover base 23 in the area directly below the metal reinforcement plate 21, it is possible to prevent the shielding cover base 23 from exceeding the projection area of ​​the metal reinforcement plate 21 on the first circuit board 11. Compared with a conventional shielding structure in which the shielding cover base needs to be arranged around the metal reinforcement plate 21, the installation space required for the shielding cover base 23 is effectively reduced.

[0052] Since the size of the connector 13 itself is smaller than the size of the metal reinforcement plate 21 and the size of the second circuit board 12, the space between the second circuit board 12 and the first circuit board 11 can be used to layout the shielding cover base 23 and the connector 13, and the shielding cover base 23 is arranged around the female connector 131 of the connector 13. This can effectively reduce the installation space required for the shielding cover base 23, thereby reducing the installation space required for the shielding structure 20.

[0053] In some embodiments, Fig.11 As shown, a second elastic foot structure 222 is disposed at one end of the shielding cover side wall 22 away from the shielding cover base 23 , and the shielding cover side wall 22 abuts against the metal reinforcing plate 21 via the second elastic foot structure 222 .

[0054] In this embodiment, the second elastic foot structure 222 has a certain pre-compression height, so as to achieve the abutment between the second elastic foot structure 222 and the metal reinforcing plate 21 .

[0055] In some embodiments, the pre-compression height of the second elastic foot structure 222 can be much smaller than the buckling height of the male connector 132 and the female connector 131. For example, the buckling height of the male connector 132 and the female connector 131 can be set to 4 to 6 times the pre-compression height of the second elastic foot structure 222.

[0056] In this way, the pre-compression height of the second elastic foot structure 222 is set much smaller than the engagement height of the male connector 132 and the female connector 131, that is, the compression amount of the second elastic foot structure 222 is set smaller, so that while the second elastic foot structure 222 is abutted against the metal reinforcement plate 21, the engagement of the male connector 132 and the female connector 131 will not be bounced open due to the elastic force between the second elastic foot structure 222 and the metal reinforcement plate 21, so that the male connector 132 and the female connector 131 can remain engaged, thereby achieving pre-fixation of the connector 13 and the first circuit board 11 and the second circuit board 12 connected thereto.

[0057] In some embodiments, the shielding cover side wall 22 and the shielding cover base 23 can be an integral structure. In this way, when the shielding cover side wall 22 and the shielding cover base 23 of the integral structure are assembled on the first circuit board 11, they only need to be adsorbed on the adsorption surface of the shielding cover base 23 by the suction cup of the robotic arm. Moreover, since the shielding cover base 23 is located in the area directly below the metal reinforcement plate 21, the setting of the adsorption surface of the shielding cover base 23 will not occupy additional space outside the area directly below the metal reinforcement plate 21, which effectively reduces the thickness requirement of the shielding cover side wall 22 and further reduces the installation space required for the shielding structure 20.

[0058] In some embodiments, the shielding cover base 23 has an adsorption mounting surface 231, and the shielding cover side wall 22 is a flange structure extending from the edge area of ​​the adsorption mounting surface 231. Since the projection of the shielding cover base 23 on the first circuit board 11 is located within the projection of the metal reinforcement plate 21 on the first circuit board 11, it can be avoided that the adsorption mounting surface 231 of the shielding cover base 23 additionally occupies space outside the area directly below the metal reinforcement plate 21.

[0059] In some embodiments, the metal reinforcement plate 21 may be disposed beyond the second circuit board 12 , so that the second elastic foot structure 222 on the shielding cover side wall 22 can better abut against the metal reinforcement plate 21 .

[0060] In some embodiments, the electronic device also includes a circuit board bracket 40, and the end surface of the metal reinforcement plate 21 facing away from the first circuit board 11 is fitted and connected to the circuit board bracket 40 to achieve a zero gap design between the metal reinforcement plate 21 and the circuit board bracket 40, thereby achieving the pre-stressing and fixing effect of the first spring foot structure 221 on the shielding cover side wall 22 or the second spring foot structure 222 on the shielding cover side wall 22 on the connector 13.

[0061] In some embodiments, the electronic device further includes a camera module 50 , and a photosensitive chip of the camera module 50 is electrically connected to the first circuit board 11 via the second circuit board 12 .

[0062] In this embodiment, the second circuit board 12 can be understood as a flexible circuit board of the camera module 50, which is used to realize the electrical connection between the photosensitive chip of the camera module and the first circuit board 11, that is, to realize the electrical connection between the photosensitive chip of the camera module and the mainboard of the electronic device.

[0063] In some embodiments, the electronic device further includes an adhesive layer 60 , and the metal reinforcement plate 21 may be disposed on the second circuit board 12 through the adhesive layer 60 .

[0064] The adhesive layer 60 may be an adhesive layer structure made of hot melt adhesive material.

[0065] In some embodiments, the first elastic foot structure 221 on the shielding cover side wall 22 can be configured as a spring structure with pre-compression performance, which can be made of conductive materials such as conductive silicone, conductive silver paste, conductive glue, etc.

[0066] In some embodiments, the second elastic foot structure 222 on the shielding cover side wall 22 can be configured as a spring structure with pre-compression performance, which can be made of conductive materials such as conductive silicone, conductive silver paste, conductive glue, etc.

[0067] In some embodiments, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA).

[0068] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0069] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A circuit board assembly, the circuit board assembly comprising a first circuit board, a second circuit board and a connector, the second circuit board being electrically connected to the first circuit board through the connector; A shielding structure, the shielding structure comprising a metal reinforcement plate and a shielding cover side wall, the metal reinforcement plate is stacked and arranged on a side of the second circuit board away from the first circuit board, and the metal reinforcement plate is also electrically connected to a grounding structure on the first circuit board through the shielding cover side wall; The metal reinforcing plate and the side wall of the shielding cover are arranged to form a shielding space, and the connector and the second circuit board are at least partially located in the shielding space.

2. The electronic device according to claim 1, characterized in that: The shielding cover side wall and the metal reinforcement plate are an integrated structure.

3. The electronic device according to claim 2, characterized in that: A first elastic foot structure is provided at one end of the side wall of the shielding cover away from the metal reinforcing plate, and a copper exposed area adapted to the first elastic foot structure is provided on the first circuit board; The grounding structure on the first circuit board is the copper foil layer exposed in the copper exposed area, and the first spring foot structure is electrically connected to the copper foil layer.

4. The electronic device according to claim 1, characterized in that: The shielding structure further includes a shielding cover base, which is disposed around the connector and is also electrically connected to a grounding structure on the first circuit board. The shielding cover base is also electrically connected to the metal reinforcement plate through the shielding cover side wall. Wherein, the projection of the shielding cover base on the first circuit board is located within the projection of the metal reinforcement plate on the first circuit board.

5. The electronic device according to claim 4, characterized in that: A second elastic foot structure is provided at one end of the shielding cover side wall away from the shielding cover base, and the shielding cover side wall is abutted against the metal reinforcing plate through the second elastic foot structure.

6. The electronic device according to claim 5, characterized in that: The shielding cover base and the shielding cover side wall are an integrated structure.

7. The electronic device according to claim 5, characterized in that: The shielding cover base has an adsorption mounting surface, and the shielding cover side wall is a flange structure formed by extending from the edge area of ​​the adsorption mounting surface.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The electronic device further comprises a circuit board bracket, and the end surface of the metal reinforcement plate facing away from the first circuit board is fitted and connected to the circuit board bracket.

9. The electronic device according to any one of claims 1 to 7, characterized in that: The electronic device also includes a camera module, and the photosensitive chip of the camera module is electrically connected to the first circuit board through the second circuit board.

10. The electronic device according to any one of claims 1 to 7, characterized in that: The electronic device further includes an adhesive layer, and the metal reinforcement plate is arranged on the second circuit board through the adhesive layer.

Images