Electric compressor and method for manufacturing same

Abstract

The invention provides an electric compressor and a manufacturing method thereof, in the electric compressor, heat dissipation performance and anti-vibration performance of a circuit for driving a motor are ensured, complexity of a manufacturing process is avoided, and productivity is improved and miniaturization can be realized by suppressing increase of the number of components. An electric compressor (1) is provided with a housing (2) having a built-in motor (3), a circuit board (8), and a filter circuit unit (7) provided in a predetermined region of the circuit board (8), and the filter circuit unit (7) is housed inside the housing (2) by assembling the circuit board (8) in the housing (2). The filter circuit section (7) has a filter circuit member (70) mounted on the circuit board (8), and an insulating resin section (73) for integrally fixing the filter circuit member (70) to the circuit board (8) by injection molding.

Description

Technical Field

[0001] The present invention relates to an electric compressor in which an inverter circuit for supplying power to a motor and a filter circuit for absorbing high-frequency components of a switching current are mounted in a housing accommodating the motor, and a method for manufacturing the same. Background Art

[0002] Conventionally, as an electric compressor used in a vehicle air conditioner, an inverter-integrated electric compressor is used in which an inverter circuit unit and a filter circuit unit are mounted in a housing that accommodates a motor.

[0003] In the filter circuit section of an inverter-integrated electric compressor, various proposals have been made on cooling structures and vibration-resistant reinforcement structures of electronic components (filter element components) (for example, refer to Patent Documents 1 and 2).

[0004] The electric compressor described in Patent Document 1 has a metal plate disposed on a resin bracket that holds a filter element, an insulating metal plate potting resin is interposed between the metal plate and a housing, and heat generated from a resistor connected to the filter element is dissipated to the housing through the metal plate and the metal plate potting resin.

[0005] In addition, the electric compressor described in Patent Document 2 uses a support component that houses the electrical components of the filter circuit unit as an injection mold, fills the support component with thermosetting resin, integrates the filter circuit substrate and the support component (electrical component), and fixes the support component to the housing by bolts. Prior art literature Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2021-116787 Patent Document 2: Japanese Patent Application Publication No. 2019-143606 Summary of the invention Technical problem to be solved by the invention

[0007] However, for example, in the structure described in Patent Document 1, the number of components increases, the manufacturing process becomes complicated (complex), and the component cost also rises. In addition, in the structure described in Patent Document 2, the electronic components are resin molded by injection molding, but the curing of thermosetting resin takes time and is not suitable for mass production. Thus, in the existing electric compressors, there are limits on the improvement of productivity.

[0008] In view of the above-mentioned actual situation, the present invention provides an electric compressor and a method for manufacturing the same. In the electric compressor, while ensuring the heat dissipation performance and anti-vibration performance of the circuit driving the motor, the complication of the manufacturing process is avoided. In addition, by suppressing the increase in the number of components, miniaturization can be achieved while improving productivity. Technical solutions to technical problems

[0009] The present invention relates to an electric compressor, comprising: a frame body, wherein a compression mechanism and an electric motor for driving the compression mechanism are built in the frame body; a circuit substrate; and a filter circuit unit, wherein the filter circuit unit is arranged in a specified area of ​​the circuit substrate. The electric compressor assembles the circuit substrate to the frame body, thereby accommodating the filter circuit unit inside the frame body. The electric compressor is characterized in that the filter circuit unit has a plurality of filter circuit components mounted on the circuit substrate, and an insulating resin unit that integrates the filter circuit components and the circuit substrate by injection molding.

[0010] In addition, the present invention relates to a method for manufacturing an electric compressor, characterized in that it includes: a process of installing a plurality of filter circuit components on a circuit substrate; a process of integrating the plurality of filter circuit components and the circuit substrate by injection molding so that an insulating resin is interposed between the plurality of filter circuit components and the circuit substrate; and a process of assembling the circuit substrate in a removable manner into a frame having a compression mechanism and an electric motor that drives the compression mechanism. Effects of the Invention

[0011] According to the electric compressor of the present invention, the following excellent effects can be achieved: an electric compressor and a manufacturing method thereof are provided, in which the manufacturing process is avoided to be complicated while ensuring the heat dissipation performance and anti-vibration performance of the circuit driving the motor, and by suppressing the increase in the number of components, miniaturization can be achieved while improving productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a longitudinal cross-sectional view schematically showing an electric compressor according to an embodiment of the present invention. Figure 2 This is a circuit block diagram of an electric compressor according to an embodiment of the present invention. Figure 3 It is a cross-sectional view schematically showing the circuit unit of this embodiment. Figure 4 1 is a diagram for explaining an inverter circuit unit according to the present embodiment. Figure 4 (A) is the appearance stereogram, Figure 4 (B) Yes Figure 4 (A) AA line cross-sectional schematic diagram, Figure 4(C) is a schematic cross-sectional view of a power semiconductor element. Figure 5 It is an external perspective view for explaining the method for manufacturing the inverter circuit unit according to the present embodiment. Figure 6 It is a schematic cross-sectional view for explaining the method for manufacturing the inverter circuit unit according to the present embodiment. Figure 7 1 is a diagram showing a method for manufacturing a filter circuit unit according to the present embodiment. Figure 7 (A) Figure 7 (B) is a top view, Figure 7 (C)~ Figure 7 (F) is a three-dimensional view of the exterior. Figure 8 It is an external perspective view for explaining the assembly method of the circuit unit according to the present embodiment. Fig. 9 It is an external perspective view for explaining the assembling method of the electric compressor according to the present embodiment. DETAILED DESCRIPTION

[0013] Below, refer to Figures 1 to 9 Embodiments of the present invention will be described. Figures 1 to 9 This is an example of a method for implementing the present invention. In the drawings, parts with the same reference numerals represent the same structure. In addition, a part of the structure is appropriately omitted in each figure to simplify the drawings. In addition, in each figure, the shape and size of a part of the structure are appropriately exaggerated.

[0014] <Overall structure of electric compressor> Reference Figure 1 , the overall structure of the electric compressor 1 according to the present embodiment will be described. This figure is a longitudinal sectional view showing the outline of the electric compressor 1 according to the present embodiment, and for the sake of convenience of description, only the main structure is schematically shown.

[0015] The electric compressor 1 of this embodiment is a so-called inverter-integrated electric compressor, and constitutes a part of the refrigerant circuit of a vehicle air conditioning device for performing air conditioning in a vehicle cabin (not shown). The electric compressor 1 has a frame 2, a motor 3 built into the frame 2, a compression mechanism 5 driven by a rotating shaft 4 of the motor 3, a circuit unit 9, etc. The circuit unit 9 has a function as an inverter, and specifically, has a circuit substrate (printed substrate) 8, an inverter circuit unit 6 for driving the motor 3, a filter circuit unit 7 for absorbing high-frequency components of a switching current, and a motor control circuit unit 16, etc.

[0016] The frame 2 includes, for example, a housing 21, a circuit storage section 22, and a cover member 25 covering the circuit storage section 22. The housing 21 stores the motor 3, the rotating shaft 4, and the compression mechanism 5, and the circuit section 9 (the inverter circuit section 6, the filter circuit section 7, and the motor control circuit section 16) is stored in the circuit storage section 22. The circuit storage section 22 includes a first space 221 and a second space 222. The first space 221 is a space adjacent to the housing 21 via a partition wall 23 at one end side in the axial direction of the rotating shaft 4 of the motor 3, and stores the inverter circuit section 6. The second space 222 is a space protruding radially outward of the stator of the motor 3 from the housing 21, and stores the filter circuit section 7. Although described in detail later, in this embodiment, the inverter circuit section 6 and the filter circuit section 7 are formed on a single circuit substrate 8, and the circuit substrate 8 is detachably assembled to the frame 2, so that the inverter circuit section 6 and the filter circuit section 7 are stored inside the frame 2 (circuit storage section 22). In the circuit storage part 22, the opposite surface of the partition wall 23 forms an opening 24, which is closed by a cover member 25 so as to be openable and closable. In addition, in each figure of the present embodiment, the electric compressor 1 is shown in a state where the circuit storage part 22 is arranged at the top, but as a vehicle air conditioning device, the circuit storage part 22 is actually arranged horizontally to form one side. In the present embodiment, for the sake of convenience of explanation, as the definition of the direction of the electric compressor 1, the circuit storage part 22 side is set to the top, the motor 3 side is set to the bottom, and the axial length of the motor 3 of each structure is set to "height".

[0017] The motor 3 is composed of a three-phase synchronous motor (brushless DC motor), and the compression mechanism 5 is, for example, a scroll type compression mechanism. The compression mechanism 5 is driven by the rotating shaft 4 of the motor 3, compresses the refrigerant and discharges it into the refrigerant circuit. In addition, the low-temperature gas refrigerant sucked from the evaporator (also called the absorber) constituting a part of the refrigerant circuit also flows into the shell 21. Therefore, the inside of the shell 21 is cooled, and the partition wall 23 constituting a part of the lower part (bottom) 22B of the circuit storage part 22 is also cooled by the low-temperature gas refrigerant.

[0018] The bottom plate 56 of the inverter circuit unit 6 is in close contact with the upper surface of the partition wall 23 (the bottom 22B of the circuit storage unit 22 on the first space 221 side) via a heat dissipation material (e.g., heat dissipation grease) 101. The insulating resin portion 73 of the filter circuit unit 7 is in close contact with the upper surface of the bottom 22B of the circuit storage unit 22 on the second space 222 side via a heat dissipation material (e.g., an insulating sheet) 102.

[0019] The circuit board 8 is fixed to the housing 2 (the bottom portion 22B of the circuit housing portion 22 ) by bolts 85 .

[0020] Figure 21 is a circuit diagram showing an outline of a circuit for controlling the motor drive of the electric compressor 1. The circuit unit 9 includes a circuit substrate ( Figure 2 The inverter circuit unit 6 includes a plurality of power semiconductor elements 63 (here, 3 groups and 6 in total) composed of switching elements (such as IGBTs) 61 and freewheeling diodes 62. The filter circuit unit 7 includes a filter circuit component 70. In this example, the filter circuit component 70 includes a smoothing capacitor 71 for smoothing the power supplied to the inverter circuit unit 6, and a coil and a capacitor constituting a noise filter 72.

[0021] The electric power from the power source 12 is supplied to the circuit unit 9 via the high-power connector 13 , and is supplied to the inverter circuit unit 6 via the noise filter 72 and the smoothing capacitor 71 .

[0022] In addition, low-voltage power is supplied from the air conditioning control device 18 of the vehicle to the motor control circuit unit 16 via the control signal connector 19. The motor control circuit unit 16 connects (mounts) circuit components such as a microcomputer to the circuit substrate 8, and performs switching control of each power semiconductor element 63 of the inverter circuit unit 6 based on an external command. In addition, the motor control circuit unit 16 has a function of transmitting the driving state of the motor 3 to the outside.

[0023] In the inverter circuit unit 6, the DC from the power supply 12 is converted into a pseudo three-phase AC and output from the circuit unit 9. The output is supplied to each winding 3a of the motor 3 via the motor-side connection terminal 11, so that the motor 3 is driven to rotate and the compression mechanism 5 performs compression.

[0024] <Circuit section (inverter)> Figure 3 The extraction shows Figure 1Schematic diagram of the circuit unit 9 in FIG. The circuit unit 9 is configured such that each electronic component constituting the inverter circuit unit 6 and the filter circuit unit 7 is mounted on a circuit substrate (printed substrate) 8 or is electrically connected to the circuit substrate (printed substrate) 8. In the present embodiment, the inverter circuit unit 6 and the filter circuit unit 7 are provided on one circuit substrate 8. Specifically, the electronic components constituting the motor control circuit unit 16 are directly mounted (mounted) on the first surface Sf1 of the circuit substrate 8 and are electrically connected. Furthermore, the inverter circuit unit 6 is provided in the first area 81 of the second surface Sf2 of the circuit substrate 8, and the filter circuit unit 7 is provided in the second area 82 of the same second surface Sf2. In the inverter circuit unit 6, the power semiconductor element 63 constituting the inverter circuit unit 6 is mounted on a bottom plate 56 independent of the circuit substrate 8, and the terminal 63C of the power semiconductor element 63 is electrically connected to the circuit substrate 8. The filter circuit unit 7 directly mounts (mounts) the noise filter 72 and the smoothing capacitor 71 constituting the filter circuit unit 7 on the circuit substrate 8 and is electrically connected to the circuit substrate 8.

[0025] <Inverter circuit section> Reference Figure 4 The configuration of the inverter circuit unit 6 will be described. Figure 4 is a diagram for explaining the inverter circuit unit 6, Figure 4 (A) is the appearance stereogram, Figure 4 (B) Yes Figure 4 (A) is a schematic cross-sectional view of the AA line section. Figure 4 (C) is a schematic cross-sectional view of the power semiconductor element 63 .

[0026] like Figure 4 (A)~ Figure 4 As shown in (C), the inverter circuit unit 6 has six power semiconductor elements 63 constituting arms of each phase of the three-phase inverter circuit, a base plate 56 on which they are integrally mounted, and an insulating resin portion 67 that covers at least a portion of the power semiconductor elements 63 and integrates the power semiconductor elements 63 and the base plate 56.

[0027] like Figure 4 As shown in (C), each power semiconductor element 63 is a switch element (for example, IGBT) 61 and a freewheeling diode 62 (see Figure 2 ) is placed on one side of a heat sink 64 and housed in a resin package 63P. The outer shape of the resin package 63P is a substantially rectangular parallelepiped shape. In the following description, the two surfaces parallel to (horizontally to) the bottom plate 56 when placed on the bottom plate 56 are referred to as the upper surface US and the lower surface DS of the power semiconductor element 63, and the remaining four surfaces are referred to as the side surfaces SS.

[0028] The three terminals 63C of the power semiconductor element 63 are led out from the side surface SS of the resin package 63P in a direction horizontal to the heat sink 64, and are bent upward in an L shape in cross-section. The other surface of the heat sink 64 is exposed on the lower surface DS of the resin package 63P. In addition, in this embodiment, a conventionally known power semiconductor element 63 is adopted, and a fixing hole portion 63H is provided on the resin package 63P, which passes from its upper surface US to the lower surface DS. The fixing hole portion 63H is a hole portion that was previously used as a screw insertion hole when the power semiconductor element 63 is screwed to a circuit board or other substrate, and the heat sink 64 is repeatedly pulled out in a circular shape corresponding to the fixing hole portion 63H.

[0029] The bottom plate 56 is, for example, a substantially rectangular flat plate of a metal (e.g., aluminum) with high heat dissipation. Six power semiconductor elements 63 are placed in two rows, three per row, on one surface (mounting surface) Sf3. The terminals 63C of the power semiconductor elements 63 in each row are adjacent to each other at a substantially central portion of the bottom plate 56. In addition, for each row, the power semiconductor elements 63 are integrated (molded) by an insulating resin portion 67 and are also integrated with the bottom plate 56. More specifically, the insulating resin portion 67 is, for example, a resin material that can be injection molded, and is a thermoplastic resin material as an example. In this embodiment, three power semiconductor elements 63 are integrated as a group by injection molding (hot melting) of a thermoplastic resin material to cover at least a portion of them, forming power semiconductor element groups 631 and 632, and they are fixed to the bottom plate 56. Alternatively, the bottom plate 56 is fixed to the power semiconductor element groups 631 and 632 (power semiconductor elements 63). In this case, "fixing" (fixing by resin material) means that when the softened (or liquidized) resin is solidified, it abuts (is interposed) on both the power semiconductor element 63 and the base plate 56 to integrate the two. That is, at least four side surfaces SS of the power semiconductor element 63 are surrounded by the resin constituting the insulating resin portion 67, and the resin is continuous to the base plate 56. In the present embodiment, at least four side surfaces SS of the three power semiconductor elements 63 constituting each of the power semiconductor element groups 631 and 632 are surrounded by the resin constituting the insulating resin portion 67, and the resin is continuous to the base plate 56, but the plurality of power semiconductor elements 63 may not be integrated. That is, as long as at least one power semiconductor element 63 is integrated with the base plate 56, it will suffice.

[0030] and then, Figure 4As shown in FIG. 5B , a resin insulating sheet 69 (e.g., a silicone resin sheet) is interposed between the power semiconductor element groups 631 and 632 and the bottom plate 56. The heat sink 64 exposed on the lower surface DS of the resin package 63P of each power semiconductor element 63 abuts against the resin insulating sheet 69 and is in close contact with the bottom plate 56 having good flatness through the resin insulating sheet 69. In addition, a portion of the terminal 63C of each power semiconductor element 63, including the lead-out portion from the resin package 63P, is covered by the insulating resin portion 67, but the other portion, including the front end portion, is exposed from the insulating resin portion 67.

[0031] in addition, Figure 4 (B) and Figure 1 As shown, bolt insertion holes 57 are provided at multiple locations (four locations in this example) on the peripheral portion of the bottom plate 56, and the bolts used to fix the inverter circuit unit 6 to the frame 2 can be inserted through the bolt insertion holes 57, and a sleeve member 65 whose internal space is connected is erected in each bolt insertion hole 57. The sleeve member 65 is also integrated with the power semiconductor element 63 and the bottom plate 56 through the insulating resin portion 67. The sleeve member 65 is a cylindrical member made of metal (for example, aluminum), and it is preferable to use a member having a concave-convex surface and having high adhesion with the insulating resin portion 67. In addition, the height (axial length) of the sleeve members 65 in the inverter circuit unit 6 is equal, and they are arranged at the peripheral portion of the bottom plate 56 separated from each other (roughly at the four corners in this case). The sleeve member 65 is arranged so that its axial direction is parallel to the direction of the rotating shaft 4 of the motor 3 , and a height H1 of the sleeve member 65 is higher than a height H2 of the power semiconductor element groups 631 , 632 (or the resin package 63P of the power semiconductor element 63 ).

[0032] In the present embodiment, as described above, the plurality of power semiconductor elements 63, the base plate 56, and the sleeve member 65 are integrally fixed to each other by, for example, injection molding of a thermoplastic resin, thereby constituting the inverter circuit unit 6 as an integrated electronic component (power semiconductor module). Figure 3 As shown, the inverter circuit unit 6 is electrically connected to the circuit substrate 8 in a state where the upper end (opening) of the sleeve member 65 of the inverter circuit unit 6 is abutted against the circuit substrate 8 to block the upper end (opening). As a result, the bottom plate 56 is separated from the circuit substrate 8 as far as possible and faces the circuit substrate 8, and the upper surface US (upper surface of the insulating resin portion) of the semiconductor element 63 is arranged to be non-contact (separated) and close to the circuit substrate 8. On the circuit substrate 8, a terminal insertion hole 83 is provided at a position corresponding to the terminal 63C of the power semiconductor element 63, and the front end portion of the terminal 63C exposed from the insulating resin portion 67 is led out to the first surface Sf1 side of the circuit substrate 8 through the terminal insertion hole 83, and is appropriately electrically connected to the wiring (not shown) provided on the circuit substrate 8 by welding or the like.

[0033] Thus, according to this embodiment, by molding the insulating resin portion 67 (in this example, by injection molding of a thermoplastic resin material), the plurality of power semiconductor elements 63 can be integrally fixed to the bottom plate 56. The bottom plate 56 is a metal flat plate with good flatness. The bottom plate 56 is arranged on the partition wall 23 of the frame 2 as a cooling surface via a heat dissipation material (e.g., heat dissipation grease) 101 (see Figure 1 ). Compared with, for example, injection molding of thermosetting resin, injection molding has high molding accuracy and good surface flatness (smoothness).

[0034] That is, by injection molding the thermoplastic resin material, the insulating resin portion 67 is formed in close contact with the bottom plate 56, and the flatness (smoothness) between the heat sink 64 of the power semiconductor element 63 and the bottom plate 56 and the partition wall 23 serving as the cooling surface is improved, and the accuracy of the parallel level with respect to the cooling surface (partition wall 23) can be improved. As a result, the heat dissipation performance can be improved compared to the case of thermosetting resin.

[0035] However, it is complicated to adjust and manage the shape (flatness) of the insulating resin portion 67 so as to satisfy the high insulation performance required by the high voltage of electric vehicles only by injection molding. Therefore, in the present embodiment, a resin insulating sheet 69 (e.g., a silicone resin sheet) is arranged between the power semiconductor element 63 and the base plate 56, and the power semiconductor element 63 is fixed to the base plate 56 by injection molding. Thus, the accuracy of the shape (flatness) of the injection molding is not particularly strictly managed (by managing the general level of accuracy suitable for mass production), and the close contact between the power semiconductor element 63 and the heat sink 64, the resin insulating sheet 69 and the base plate 56 can be improved. The heat sink 64 is in good and approximately uniform close contact with the base plate 56 via the resin insulating sheet 69. Thus, the insulation performance can be improved. In addition, compared with the case of screw fixing, the contact area (heat dissipation area) can be increased, so the heat dissipation can be further improved, and the heat dissipation performance (deviation) between the devices can be stabilized.

[0036] In this example, the resin insulating sheet 69 is a rectangular sheet that conforms to the shape of the bottom surface of the power semiconductor element groups 631 and 632 (see Figure 5 (A)), the opening below the fixing hole 63H is completely blocked by the resin insulating sheet 69. Furthermore, the insulating resin portion 67 (resin material constituting the insulating resin portion 67) is embedded inside the fixing hole 63H. That is, the resin insulating sheet 69 or the insulating resin portion 67 is interposed between the opening below the fixing hole 63H and the bottom plate 56, so that they are completely blocked and insulated. As a result, the surface discharge between them can be suppressed (avoided), and the insulation performance can be improved.

[0037] Furthermore, a fastening structure using screws in the fixing holes 63H, which has been conventionally used as a means for fixing the power semiconductor element (switching element) to the mounting plate, is no longer necessary.

[0038] In the past, due to the presence of screws inserted through the fixing hole 63H, it was necessary to ensure the prescribed insulation performance (ensure the creeping distance) between the heat sink of the power semiconductor element (switching element) and the setting plate (or frame) for the fastening screws, which resulted in an increase in the number of components or a failure to miniaturize the device. Specifically, it is necessary to insert a resin covering material between the switching element and the screw, and it is also necessary to form a threaded hole or an area for forming a thread groove (for example, a countersunk portion formed by a depression on the heat dissipation surface of the frame). In addition, with the high voltage of electric vehicles in recent years, the existing screw fastening structure has also caused a problem in that the desired insulation performance cannot be ensured due to the proximity of the screw and the switching element. Furthermore, since a gap is generated between the switching element and the screw with the resin covering material or in the countersunk portion, the thermal resistance is easily increased, and the improvement of the heat dissipation performance is also limited.

[0039] In this embodiment, since the screw fastening structure is not required, the insulation performance can be improved as described above, and the number of components related to the screw fastening structure can be reduced. In addition, no unnecessary gap caused by the screw fastening structure is generated, and the thermal resistance can be suppressed and the heat dissipation can be improved.

[0040] In addition, the bottom plate 56 is provided with a bolt insertion hole 57 through which a bolt can be inserted, but no thread groove is formed. That is, it is not necessary to ensure a plate thickness sufficient to form a thread groove in the bottom plate 56, which contributes to miniaturization (thinning) of the inverter circuit unit 6, and further contributes to miniaturization of the electric compressor 1. In addition, the number of components related to the screw fastening structure can be reduced, and the cost of the electric compressor 1 can be reduced as a result.

[0041] Furthermore, by injection molding of the resin, the use cost of the insulating resin portion 67 for the portion requiring insulation can be optimized, thereby also achieving a lighter and lower-cost device of the electric compressor 1 .

[0042] <Manufacturing Method of Inverter Circuit Unit> Reference Figure 5 and Figure 6 , an example of a method for manufacturing the inverter circuit unit 6 is described. Figure 5 (A)~ Figure 5 (D) is an external perspective view showing an example of a method for manufacturing the inverter circuit unit 6. Figure 6 (A)~ Figure 6 (C) is a schematic cross-sectional view showing an extracted portion of the power semiconductor element 63 .

[0043] First, if Figure 5As shown in FIG. 2A , a resin insulating sheet 69 is arranged in a predetermined area of ​​the mounting surface Sf3 of the bottom plate 56, and a plurality of (here, six) power semiconductor elements 63 are arranged in groups of three in two rows on the resin insulating sheet 69. Figure 5 (B)). Furthermore, an insulating resin portion 67 is formed by, for example, injection molding of a thermoplastic resin material to integrate the three power semiconductor elements 63 and the bottom plate 56. The four side surfaces SS of each of the three power semiconductor elements 63 (power semiconductor element groups 631, 632) in each row are surrounded by a resin constituting the insulating resin portion 67, and the resin is continuous to the bottom plate 56, thereby fixing the three power semiconductor elements 63 as the power semiconductor element groups 631, 632 to the bottom plate 56. A portion of the terminal 63C of the power semiconductor element 63, including the front end, is exposed from the insulating resin portion 67 ( Figure 5 (C)) In addition, the sleeve member 65 is also integrated with the power semiconductor element 63 and the bottom plate 56 through the insulating resin portion 67. The power semiconductor element 63 is also embedded in the insulating resin portion 67 in the fixing hole portion 63H (see Figure 6 (A)).

[0044] The inverter circuit unit 6 manufactured in this way is connected to the circuit substrate 8. Figure 5 As shown in (D), the mounting surface Sf3 of the bottom plate 56 is made to face the second surface Sf2 of the circuit board 8. Here, the inverter circuit unit 6 has a positioning and fixing unit 68 for fixing itself at a predetermined position (the second area 82 of the second surface Sf2) of the circuit board 8. Figure 5 (C) Figure 6 As shown in (A), the positioning and fixing unit 68 is integrally formed with the insulating resin portion 67, and has, for example, a shape in which a cylindrical engaging portion 682 protrudes upward from a truncated cone base portion 681 provided on the upper surface of the insulating resin portion 67. The height H3 from the mounting surface Sf3 of the bottom plate 56 to the front end portion 683 in the protruding direction is set higher than the height H1 of the sleeve member 65. In this example, one (two in total) positioning and fixing unit 68 is provided for each of the power semiconductor element groups 631 and 632. In addition, a positioning hole 88 ( Figure 5 (D) Figure 6 (A)).

[0045] And, if Figure 6 As shown in FIG. (B), when the engaging portion 682 of the positioning and fixing unit 68 is inserted into the positioning hole 88 of the circuit substrate 8 and the upper end of the sleeve member 65 is brought into contact with the second surface Sf2 of the circuit substrate 8, the inverter circuit unit 6 is positioned at a predetermined position of the circuit substrate 8. Figure 6As shown in FIG. 2B , the front end portion 683 of the positioning and fixing unit 68 protrudes from the positioning hole 88 of the circuit board 8 on the first surface Sf1 side. The terminals 63C of the power semiconductor element 63 are inserted through the terminal insertion holes 83 of the circuit board 8 with their front ends protruding on the first surface Sf1 side.

[0046] In the example of this embodiment, six power semiconductor elements 63 are used, and the number of terminals 63C reaches 18. However, two positioning and fixing units 68 improve the alignment accuracy of terminal insertion holes 83 corresponding to the 18 terminals 63C, thereby achieving efficient assembly work.

[0047] The circuit board 8 has bolts 85 (see FIG. 1 ) which can be inserted to fix the circuit board 8 to the frame 2 (partition wall 23) in a later step. Figure 6 (C) Figure 5 (D)) The bolt insertion hole 84. The bolt 85 is also inserted through the sleeve member 65 of the inverter circuit unit 6 and fastened to the frame 2, and by inserting the front end portion 683 of the positioning and fixing unit 68 through the positioning hole 88, the bolt insertion hole 84 and the sleeve member 65 are also positioned and can communicate.

[0048] And, if Figure 6 As shown in (C), the front end portion 683 of the positioning and fixing unit 68 protruding from the first surface Sf1 of the circuit substrate 8 is fixed to the circuit substrate 8 by heat riveting. And, in this state (in a state where the upper end of the sleeve member 65 is in contact with the second surface Sf2 of the circuit substrate 8), the wiring (not shown) provided on the circuit substrate 8 and the terminals 63C) led out to the first surface Sf1 side of the circuit substrate 8 are electrically connected, for example, by welding. At this time, the sleeve member 65 is used as a base, and 18 terminals 63C can be welded, so that the assembly operation can be carried out efficiently. In addition, other electrical connections are also appropriately made to manufacture the inverter circuit unit 6.

[0049] Then, the circuit substrate 8 connected to the inverter circuit unit 6 is housed in the circuit housing portion 22 of the frame 2. Specifically, Figure 6 (C) Figure 1 As shown, a heat dissipation material 101 is arranged at the bottom 22B of the circuit storage section 22 (the upper surface of the partition wall 23), and the inverter circuit section 6 is stored in the circuit storage section 22 so that the lower surface of the bottom plate 56 is in close contact with the bottom 22B (partition wall 23) through the heat dissipation material 101. The heat dissipation material 101 is, for example, heat dissipation grease. Then, from the first surface Sf1 side of the circuit substrate 8, the bolt 85 is inserted through the bolt insertion hole 84 and the sleeve member 65, and is tightened and fixed to the thread groove 26 formed in the frame 2 (partition wall 23). As a result, the inverter circuit section 6 including the circuit substrate 8 is fixed to the frame 2 in a detachable manner.

[0050] In the present embodiment, since the inverter circuit unit 6 including the circuit substrate 8 is detachably fixed to the frame 2 by bolts 85, the inverter circuit unit 6 can be easily detached from the circuit substrate 8, compared with a structure in which, for example, a part of the frame 2 is used as an injection mold and the electronic components of the inverter circuit unit are directly fixed to the frame (resin molding), thereby improving the maintainability of the electronic components when a failure occurs.

[0051] In addition, in the present embodiment, the second surface Sf2 of the circuit substrate 8 is brought into contact with the upper end of the sleeve member 65 provided around the bottom plate 56, that is, the terminal 63C of the power semiconductor element 63 is connected (welded) to the wiring of the circuit substrate 8 while the circuit substrate 8 is supported by the bottom plate 56 and the sleeve member 65. Moreover, in the manufacture of the inverter circuit unit 6, in particular, after the circuit substrate 8 and the terminal 63C are welded in advance (through a secondary line), the inverter circuit unit 6 is housed in the frame 2 and connected. When welding the circuit substrate 8 and the terminal 63C, preheating is required. At this time, when the welding process is performed after the inverter circuit unit 6 and the circuit substrate 8 are housed in the frame 2 (circuit housing 22), the electric compressor 1 including the motor 3 must be preheated as a whole, which deteriorates the workability. In this embodiment, since the bottom plate 56 and the sleeve member 65 serve as a base for supporting the circuit board 8, the inverter circuit unit 6 and the circuit board 8 can be soldered before being housed in the frame 2, and preheating can be minimized, thereby improving workability.

[0052] In addition, since the circuit substrate 8 is supported by the four sleeve members 65, the circuit substrate 8 can be maintained horizontally relative to the bottom plate 56. The bottom plate 56 is a metal flat plate, and is placed on the circuit storage portion 22 (partition wall 23). That is, when the circuit substrate 8 is stored in the circuit storage portion 22, the circuit substrate 8 is maintained horizontally relative to the partition wall 23. Therefore, the assembly performance when the circuit substrate 8 and the frame 2 are fastened by the bolts 85 is good, the working efficiency is improved, and the deviation of the assembly state between the electric compressors 1 can be avoided.

[0053] In addition, in the present embodiment, the circuit substrate 8 and the sleeve member 65 are not directly fixed, and the inverter circuit unit 6 (bottom plate 56) is fixed (connected) to the circuit substrate 8 by welding of the terminal 63C and heat riveting of the positioning and fixing unit 68. Since the upper surface of the insulating resin portion 67 is separated from the circuit substrate 8, the inverter circuit unit 6 is in a state of hanging from the circuit substrate 8. Therefore, when the inverter circuit unit 6 is supported only by welding of the terminal 63C, a load is involved in the connection portion. In the present embodiment, since the inverter circuit unit 6 can also be supported by the positioning and fixing unit 68, the load involved in the connection portion of the terminal 63C can be reduced.

[0054] In addition, the heat caulking of the front end portion 683 of the positioning and fixing unit 68 needs to be performed by pressing the circuit board 8. Therefore, in this embodiment, the heat caulking of the front end portion 683 is performed before the welding of the terminal 63C to reduce the load on the connection portion of the terminal 63C.

[0055] In addition, if Figure 6 As shown in (C), the circuit substrate 8 is fixed to the frame 2 (partition wall 23) by bolts 85. The bolts 85 are fastened to the thread grooves 26 provided on the frame 2, and the bolt insertion holes 84 of the circuit substrate 8 and the sleeve member 65 are only inserted with the bolts 85. That is, the thread grooves are not required on the bottom plate 56, and the bottom plate 56 can be a minimum plate thickness that supports the plurality of power semiconductor elements 63 and can obtain flatness at the interface with the power semiconductor elements 63 and the interface with the partition wall 23, so that the height dimension of the circuit storage portion 22 can be reduced compared with a structure in which the power semiconductor elements 63 are fixed to the bottom plate 56 by screw stop, for example.

[0056] In addition, compared with a structure in which a part of the frame 2 is used as an injection mold and the inverter circuit unit is directly resin-molded on the frame 2, the freedom of layout of the inverter circuit unit 6 can be improved, and the frame 2 can be miniaturized and the electric compressor 1 can be lightweight as a result.

[0057] In addition, the insulating resin portion 67 only needs to integrate the plurality of (three) power semiconductor elements 63 and fix them on the bottom plate 56, as shown in FIG. Figure 6 As shown in (C), a part of the power semiconductor element 63 may be exposed on the upper surface side thereof, or the power semiconductor element 63 may be entirely covered by the insulating resin portion 67 except for a part of the terminal 63C. In addition, the insulating resin portion 67 of the inverter circuit portion 6 may be made of a thermosetting resin.

[0058] <Filter circuit section> Next, refer to Figure 3 The filter circuit unit 7 is described. The filter circuit unit 7 includes a filter circuit component 70 mounted on a predetermined area (a second area 82 of a second surface Sf2 of the circuit substrate 8) of the circuit substrate 8, and an insulating resin portion 73 that integrates the filter circuit component 70 and the circuit substrate 8 by injection molding. The insulating resin portion 73 of the filter circuit unit 7 is made of a thermoplastic resin material.

[0059] The filter circuit component 70 includes a smoothing capacitor 71 and a noise filter 72, and Figure 3The coil not shown in the figure. Compared with the electronic components constituting the motor control circuit unit 16 or the inverter circuit unit 6, these filter circuit components 70 are large, heavy, and have a higher height from the substrate mounting surface, and are easily affected by the vibration of the machine or the vibration of the compressor itself. Therefore, the filter circuit components 70 are installed in a concentrated manner on the second area 82 of the circuit substrate 8. In addition, in order to enhance the anti-vibration of the filter circuit components 70, they are integrally covered with an insulating resin portion 73 and fixed to the circuit substrate 8. The "fixing" (fixing by resin material) at this time is also the same as that of the inverter circuit unit 6. That is, when the softened resin is cured, it abuts against (between) each of the filter circuit components 70 and the circuit substrate 8, respectively, so that the two are integrated. That is, in the filter circuit component 70, the smoothing capacitor 71, the noise filter 72, and the coil as the filter circuit component 70, which are centrally arranged, are surrounded by the resin constituting the insulating resin portion 73, and the resin is continuous to the circuit substrate 8. Furthermore, the end (distal end) of the filter circuit unit 7 farthest from the circuit substrate 8 in the vertical direction (the extending direction of the rotating shaft 4 of the motor 3) does not expose the filter circuit component 70, but is covered by the insulating resin portion 73. That is, the bottom surface of the filter circuit unit 7 is the bottom 73B of the insulating resin portion 73.

[0060] The insulating resin part 73 is, for example, a resin material capable of injection molding, and is, as an example, a thermoplastic resin material. In this embodiment, the filter circuit component 70 is integrally covered (molded) by injection molding (hot melting) of the thermoplastic resin material, and is fixed to the circuit substrate 8 (or the circuit substrate 8 is fixed to the filter circuit component 70) by the insulating resin part 73, thereby forming the filter circuit part 7. The filter circuit components 70 are respectively and appropriately electrically connected to the wiring (not shown) provided on the circuit substrate 8. Thus, the filter circuit part 7 is formed.

[0061] like Figure 3 and Figure 1 As shown, the filter circuit part 7 has a sleeve component 75 for a bolt 85 to pass through, and the bolt 85 is used to fix the circuit substrate 8 to the frame 2. The sleeve component 75 is also integrated with the filter circuit component 70 and the circuit substrate 8 by injection molding of the insulating resin part 73. The sleeve component 75 is a cylindrical member made of metal (such as aluminum), and it is preferably a member with a concave-convex surface and high adhesion to the insulating resin part 73. The sleeve component 75 is exposed and opened on the upper surface and the lower surface of the insulating resin part 73. A bolt insertion hole 86 connected to the internal space of the sleeve component 75 is provided at a position of the circuit substrate 8 corresponding to the sleeve component 75.

[0062] Reference Figure 1The filter circuit portion 7 is accommodated in the circuit accommodating portion 22 so that the bottom of the filter circuit portion 7 (the bottom 73B of the insulating resin portion 73) faces the circuit accommodating portion 22 (refer to Figure 1 ). A heat dissipation material 102 (a sheet with heat dissipation properties) is arranged between the bottom 73B of the insulating resin part 73 and the circuit storage part 22. The heat dissipation material 102 is, for example, a silicone resin sheet. The bottom (distal end) of the filter circuit part 7 farthest from the circuit substrate 8 is covered by the insulating resin part 73, and the distal end is in close contact with the frame 2 (the bottom 22B of the circuit storage part 22) through the heat dissipation material 102 to form a heat dissipation surface. The contact area between the heat dissipation surface and the inside of the circuit storage part 22 is large, and good heat dissipation characteristics can be obtained when the close contact is high, which is preferred. Since the insulating resin part 73 of the present embodiment is formed by injection molding, the flatness (smoothness) of the heat dissipation surface (the bottom 73B of the insulating resin part 73) is good compared to molding performed by injection molding of, for example, a thermoplastic resin, and the accuracy of the parallel (horizontal) level of the bottom 73B and the circuit substrate 8 or the bottom 22B of the circuit storage part 22 becomes higher. Therefore, the close contact with the bottom portion 22B of the circuit housing portion 22 via the heat dissipation material 102 is enhanced, and the uniformity of the contact is also improved, so that the heat dissipation can be further improved.

[0063] In addition, since the deviation of the gap between the frame 2 (the bottom 22B of the circuit storage part 22) and the bottom 73B of the insulating resin part 73 can be suppressed, the thickness of the heat dissipation material (heat sink) arranged between the two can be reduced. That is, even if the thickness of the heat dissipation material (heat sink) is reduced, the adhesion is improved, the heat dissipation performance can be improved (or maintained), and the miniaturization of the device can be achieved. As the heat sink, for example, when a silicone resin sheet is used, since the thickness can be reduced, the cost can also be reduced.

[0064] Furthermore, if Figure 1 As shown, guides 76 are formed at the edge of the insulating resin portion 73. The guides 76 restrict positional deviation when the power connection terminal 31 is electrically connected to the circuit board 8 and ensure an insulation distance between the power connection terminal 31 and the filter circuit portion 7.

[0065] <Manufacturing Method of Inverter Circuit Unit> Reference Figure 7 And then refer to Figure 3 , an example of a method for manufacturing the inverter circuit unit 7 is described. Figure 7 This is a diagram showing the circuit board 8 as viewed from the second surface Sf2 side. Figure 7 (A) Figure 7 (B) is a plan view of the second surface Sf2 viewed from below, Figure 7 (C) Figure 7 (D) is a stereoscopic view of the second surface Sf2 viewed from below, Figure 7 (E) Figure 7 (F) Yes Figure 7 (D) Stereoscopic image in the sagittal V direction. Figure 7 (A) Figure 7 (C) is a state before the insulating resin portion 73 is formed. Figure 7 (B) Figure 7 (D)~ Figure 7 (F) is a state after the insulating resin portion 73 is formed. Figure 7 (E) is a diagram showing the vicinity of the guide portion 76. Figure 7 (F) is a diagram showing the vicinity of the guide portion 76 in a state where the power-side connection terminal 31 is mounted.

[0066] First, if Figure 7 (A) Figure 7 As shown in FIG. 1 , the filter circuit component 70 is mounted on the second area 82 of the second surface Sf2 of the circuit substrate 8. Here, the filter circuit component 70 includes at least a smoothing capacitor 71, a capacitor 721 constituting a noise filter 72, and coils 722 and 723. A terminal insertion hole 80 (see FIG. 1 ) is provided at a predetermined position of the circuit substrate 8, through which the terminals 70C of the smoothing capacitor 71 and the noise filter 72 can be inserted. Figure 3 ), the terminal 70C is led out to the first surface Sf1 side of the circuit board 8 through the terminal insertion hole 80. It is electrically connected to the wiring of the circuit board 8 by appropriate soldering or the like.

[0067] Furthermore, a sleeve member 75 is disposed at a predetermined position on the periphery of the filter circuit member 70. The sleeve member 75 is disposed at a position where the internal space thereof communicates with the bolt insertion hole 86 provided on the circuit substrate 8 ( Figure 3 Then, by injection molding (hot melting) of thermoplastic resin, an insulating resin portion 73 ( Figure 7 (B) Figure 7 (D)). The insulating resin portion 73 is formed into a shell shape, and the filter circuit component 70 is accommodated therein. In addition, in the case where a gap is formed between the filter circuit components 70, the resin constituting the insulating resin portion 73 is also buried in the gap, and the filter circuit components 70 are integrated with each other. In addition, the insulating resin portion 73 also abuts against the circuit substrate 8, and the filter circuit component 70 is sealed by the circuit substrate and the insulating resin portion 73. In addition, around the filter circuit component 70, the sleeve component 75 is held by the insulating resin portion 73 and fixed integrally with the filter circuit component 70 and the circuit substrate 8. In addition, as Figure 7 (E) Figure 7 As shown in (F), a guide portion 76 is formed by recessing a part of the periphery of the insulating resin portion 73 toward the inner side.

[0068] Then, the circuit substrate 8 provided with the inverter circuit unit 7 is housed in the circuit housing portion 22 of the frame 2. Specifically, Figure 1 As shown, a heat dissipation material 102 is arranged on the bottom 22B of the circuit storage part 22, and the filter circuit part 7 is stored in the circuit storage part 22, so that the bottom 73B of the insulating resin part 73 is in close contact with the bottom 22B through the heat dissipation material 102. Then, from the first surface Sf1 side of the circuit substrate 8, the bolt 85 is inserted through the bolt insertion hole 86 and the sleeve member 75, and is fastened and fixed to the thread groove 26 provided on the frame 2. Thus, the filter circuit part 7 including the circuit substrate 8 is fixed to the frame 2 in a detachable manner. In addition, the power supply side connection terminal 31 connected to the high-power connector 13 is inserted into the connection terminal insertion hole 87 of the circuit substrate 8 along the guide part 76 while ensuring the insulation distance with the filter circuit part 7.

[0069] In the case where the filter circuit component 70 is fixed to the circuit substrate by injection molding of a thermosetting resin (epoxy resin) as in the past, thermal curing takes time and there is a limit to the improvement of productivity. In this embodiment, the filter circuit component 70 is integrally covered by injection molding of a thermoplastic resin material to form an insulating resin portion 73 fixed to the circuit substrate 8. Thus, compared with the case of resin molding by injection molding, molding can be performed in a short time, and productivity is improved.

[0070] In addition, since the bolt 85 is inserted into the sleeve member 75 integrally formed with the insulating resin portion 73 and fixed to the frame 2, the vibration suppression force of the insulating resin portion 73 is improved, and the shock resistance can be improved. In addition, since the sleeve member 75 is integrally formed, the heat dissipation is improved. In addition, if there is no problem with the shock resistance, the sleeve member 75 may not be integrally provided. That is, the bolt 85 may not be inserted through the sleeve member 75 to be fastened to the frame 2, and the circuit substrate 8 may be directly fastened to the frame 2 with the bolt 85.

[0071] <Method for manufacturing electric compressor> Reference Figure 8 and Fig. 9 , a method for manufacturing the electric compressor 1, particularly a method for assembling the circuit unit 9 in the electric compressor 1, and a method for mounting the circuit unit 9 to the frame 2 will be described. Figure 8 1 is a perspective view showing a method of assembling the circuit unit 9. Fig. 9 It is a perspective view for explaining the method of mounting the circuit unit 9 on the frame 2. The details of the inverter circuit unit 6 and the filter circuit unit 7 are as described above, and part of the overlapping description is omitted below.

[0072] As described above, in this embodiment, the inverter circuit unit 6 , the motor control circuit unit 16 , and the filter circuit unit 7 are mounted or electrically connected on one circuit board 8 to form the circuit unit (inverter module) 9 .

[0073] First, if Figure 8 As shown in (A), the filter circuit component 70 is installed in the second area 82 of the second surface Sf2 of the circuit substrate 8. Each terminal 70C of the filter circuit component 70 is led out on the first surface Sf1 side through the terminal insertion hole 80 provided on the circuit substrate 8, and is electrically connected to the wiring (not shown) provided on the circuit substrate 8 by welding or the like. Thereafter, the filter circuit component 70 is integrally covered by injection molding of the insulating resin portion (thermoplastic resin material) 73 and integrated with the circuit substrate 8. The filter circuit component 70 is sealed by the insulating resin portion 73 and the circuit substrate 8. At the same time, the sleeve portion 75 is also integrated with the filter circuit component 70 and the circuit substrate 8 through the insulating resin portion 73 to form a guide portion 76. In addition, predetermined electronic components such as the motor control circuit portion 16 are installed on the first surface Sf1 of the circuit substrate 8.

[0074] Then, the inverter circuit unit 6 manufactured separately by the above method is fixed to the first area 81 of the second surface Sf2 of the circuit substrate 8. That is, the loading surface Sf3 of the bottom plate 56 is made to face the second surface Sf2 of the circuit substrate 8, and the front end portions 683 of the two positioning and fixing units 68 are inserted through the positioning holes 88 of the circuit substrate 8, and at the same time, the end portion of the sleeve component 65 is made to abut against the second surface Sf2 of the circuit substrate 8. As a result, the 18 terminals 63C of the six power semiconductor elements 63 are accurately aligned with the corresponding terminal insertion holes 83, and are led out on the first surface Sf1 side through the terminal insertion holes 83 provided on the circuit substrate 8. In addition, the bolt insertion holes 84 provided on the circuit substrate 8 and the sleeve component 65 of the inverter circuit unit 6 are also accurately aligned. Afterwards, the front end portion 683 of the positioning and fixing unit 68 is heat-riveted on the first surface Sf1 of the circuit substrate 8 to be fixed to the circuit substrate 8 ( Figure 8 (B)).

[0075] Then, each terminal 63C led out on the first surface Sf1 side of the circuit substrate 8 through the terminal insertion hole 83 is electrically connected to the wiring (not shown) provided on the circuit substrate 8 by welding or the like. At this time, since the four sleeve members 65 of the inverter circuit unit 6 can be used as a base to support the circuit substrate 8, the assembly work of welding the 18 terminals 63C can be effectively performed. In addition, the circuit substrate 8 can be maintained horizontally relative to the bottom plate 56, and further, the circuit substrate 8 can be maintained horizontally relative to the partition wall 23.

[0076] like Figure 2As shown in FIG. 1 , the inverter circuit unit 6 converts the DC power supplied from the vehicle power source 12 into three-phase AC power and supplies the power to the winding 3a of the motor 3. Therefore, in each terminal 63C, the terminal 63C leading out from the connection point CP of the switching element 61 on the upper arm side and the switching element 61 on the lower arm side of each phase is wired to be connected to the three-phase AC power provided in the inverter circuit unit 63C. Figure 8 (B) is connected to the motor-side connection terminal 11 on the circuit board 8.

[0077] In this way, Figure 8 (B) Figure 8 As shown in FIG. 5(C), a circuit unit 9 is manufactured on a single circuit board 8, and the motor control circuit unit 16, the inverter circuit unit 6 and the filter circuit unit 7 are mounted and / or electrically connected to the circuit unit 9.

[0078] Then, if Fig. 9 As shown in FIG. 1 , a circuit substrate 8 connected to an inverter circuit unit 6, a motor control circuit unit 16, and a filter circuit unit 7 is stored in the circuit storage unit 22 of the frame 2. Specifically, a heat dissipation material 101 (e.g., heat dissipation grease) not shown is arranged (applied) at the bottom 22B of the first space 221 of the circuit storage unit 22 (the upper surface of the partition wall 23), and the inverter circuit unit 6 is stored in the circuit storage unit 22 so that the lower surface of the bottom plate 56 is in close contact with the bottom 22B of the circuit storage unit 22 via the heat dissipation material 101 (see FIG. 1 ). Figure 1 ). At the same time, a bottom 22B of the second space 222 of the circuit storage portion 22 is configured. Fig. 9 The filter circuit portion 7 is accommodated in the circuit accommodating portion 22 by a heat dissipation material (e.g., a heat sink) not shown in (A) so that the bottom 73B of the insulating resin portion 73 is in close contact with the bottom 22B of the circuit accommodating portion 22 via the heat sink (see Figure 1 ).

[0079] The circuit storage section 22 is provided with a lead terminal 30 that penetrates the partition wall 23 and is connected to the winding 3a in the housing 21, and a high-power connector 13 that is connected to the power supply via a power harness (not shown). The circuit substrate 8 is stored in the circuit storage section 22, and the lead terminal 30 that penetrates the circuit substrate 8 and protrudes on the first surface Sf1 side is connected to the motor side connection terminal 11 of the circuit section 9. In addition, the power side connection terminal 31 that is led out on the first surface Sf1 side via the connection terminal insertion hole 87 provided on the circuit substrate 8 is connected to the power supply (collector) terminal and the ground (emitter) terminal among the terminals 63C of the inverter circuit section 6.

[0080] The circuit substrate 8 is provided with bolt insertion holes 84, 86, and 89. The bolt insertion hole 84 is a hole communicating with the internal space of the sleeve member 65 of the inverter circuit unit 6, the bolt insertion hole 86 is a hole communicating with the internal space of the sleeve member 75 of the filter circuit unit 7, and the bolt insertion hole 89 is a hole provided at a position offset from the sleeve members 65 and 75. The bolt 85 is inserted through the bolt insertion hole 84 and the sleeve member 65 of the inverter circuit unit 6 from the first surface Sf1 of the circuit substrate 8, and is fastened to the thread groove 26 provided on the partition wall 23 (see FIG. 2 ). Figure 6 (C) Figure 1 ). In addition, the bolt 85 is inserted through the bolt insertion hole 86 and the sleeve member 75 of the filter circuit unit 7 from the first surface Sf1 of the circuit substrate 8, and is fastened to the thread groove 26 provided on the bottom 22B of the circuit storage unit 22 (see Figure 1 ). In addition, the bolt 85 is inserted through the bolt insertion hole 89 from the first surface Sf1 of the circuit substrate 8 and is fastened to the thread groove 26 provided at the bottom 22B of the circuit storage portion 22. Fig. 9 As shown in (B), the circuit unit 9 including the circuit board 8 is detachably fixed to the frame 2.

[0081] Finally, the cover member 25 is detachably mounted on the opening 24 of the circuit housing portion 22 to close the opening 24 in an openable and closable manner.

[0082] like Figure 1 As shown, in the inverter circuit unit 6, since the bottom plate 56 abuts against the partition wall 23 via the heat dissipation material 101, the power semiconductor element 63 is in heat exchange relationship with the partition wall 23 via the heat dissipation plate 14, the bottom plate 56, the heat dissipation material 101, and is cooled by the low-temperature gas refrigerant.

[0083] In the filter circuit unit 7, since the insulating resin portion 73 is in contact with the partition wall 23 via the heat dissipation material (heat sink) 102, the filter circuit component 70 is in a heat exchange relationship with the partition wall 23 via the heat dissipation material 102 while maintaining vibration resistance, and is cooled by the low-temperature gas refrigerant.

[0084] In the present embodiment, since the inverter circuit unit 6, the filter circuit unit 7, and the motor control circuit unit 16 are provided on a single circuit substrate 8, and the circuit substrate 8 is detachably fixed to the frame 2 by bolts 85, the efficiency of assembly and maintenance is improved compared to a structure in which at least a portion of the inverter circuit unit 6, the filter circuit unit 7, and the motor control circuit unit 16 are separately mounted on the frame 2. In particular, in the case of a structure in which, for example, a portion of the frame 2 is used as an injection mold and the inverter circuit unit 6 and the filter circuit unit 7 are mounted on the frame 2 by a thermosetting resin material, it becomes very difficult to disassemble the circuit when a circuit failure occurs. According to the present embodiment, by releasing the tightening of the bolts 85, the circuit unit 9 (circuit substrate 8) can be easily detached from the frame 2, so the maintainability is also good.

[0085] Furthermore, for example, compared with a configuration in which the inverter circuit unit 6 and the filter circuit unit 7 are connected to separate (independent) circuit boards, the number of components can be reduced, thereby achieving cost reduction.

[0086] Furthermore, the guide portion 76 provided on the filter circuit portion 7 by injection molding restricts the positional deviation of each power-side connection terminal 31, thereby improving the workability of the fastening bolt 85 and ensuring the insulation distance between each power-side connection terminal 31. In addition, the device is miniaturized and low-cost.

[0087] In addition, since the bottom plate 56 is a metal flat plate and is placed on the circuit storage portion 22 (partition wall 23), when the circuit substrate 8 is stored in the circuit storage portion 22, the circuit substrate 8 is maintained horizontally relative to the partition wall 23. In addition, in a state where the sleeve members 65 and 75 are in contact with the frame 2 (using the sleeve members 65 and 75 as support members), the bolts 85 can be inserted and fastened to them. Therefore, the assembly performance when the circuit substrate 8 and the frame 2 are fastened is good, the working efficiency is improved, and the deviation of the assembly state between the electric compressors 1 can also be avoided.

[0088] In addition, after the circuit unit 9 is manufactured in advance, it can be installed on the frame 2. Preheating is required when welding the circuit substrate 8 and the terminals 63C, 70C, etc. That is, when the circuit substrate 8 including the circuit unit 9 is stored in the frame 2 (circuit storage part 22) and the welding process is performed, the electric compressor 1 including the motor 3 must be preheated as a whole, and the workability is deteriorated. In this embodiment, the inverter circuit unit 6, the filter circuit unit 7, and the motor control circuit unit 16 can be welded to the circuit substrate 8 before being stored in the frame 2, and the preheating can be minimized, so the workability is improved.

[0089] The electric compressor 1 of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. Industrial Applicability

[0090] The invention can be used in the field of electric compressors. Description of symbols

[0091] 1 Electric compressor 2 Frame 3 Electric Motor 3a winding 4 Rotation Axes 5Compression mechanism 6Inverter circuit 7. Filter circuit part 8Circuit board (printed circuit board) 9 Circuit Department 11 Motor side connection terminal 12 Power Supply 13High power connector 14 heat sink 16 Motor control circuit 19Control signal connector 21 Shell 22 Circuit storage unit 22 Frame 2 (circuit storage portion 22B lower part (bottom) 22B bottom 23 partition wall 30 Lead Terminal 31 Power supply side connection terminal 56 base plate 57 Bolt insertion hole 61 Switching elements 62 Reflux Diode 63 Power semiconductor components 63C terminal 63C, 70C terminal 63H Fixing hole 63P resin package 63S semiconductor chip 64 heat sink 65, 75 sleeve parts 67, 73 Insulation resin part 68 Positioning and fixing unit 69 resin insulation sheet 70 filter circuit components 71 Smoothing capacitor 72 Noise Filter 73 Insulation resin part 73B bottom 76 Guidance Department 80, 83 terminal insertion hole 81 First Area 82 Second Area 84, 86, 89 bolt insertion holes 85 bolt 87 Connecting terminal through hole 101, 102 heat dissipation materials.

Claims

1. An electric compressor comprising: A frame body, wherein the frame body has a compression mechanism and a motor driving the compression mechanism built therein; Circuit board; as well as a filter circuit unit, the filter circuit unit being provided in a predetermined area of ​​the circuit substrate, The electric compressor is characterized in that the circuit substrate is assembled into the frame, so that the filter circuit unit is accommodated inside the frame. The filter circuit portion includes a plurality of filter circuit components mounted on the circuit substrate, and an insulating resin portion formed by integrating the filter circuit components and the circuit substrate by injection molding.

2. The electric compressor according to claim 1, characterized in that: The insulating resin portion is made of a thermoplastic resin material.

3. The electric compressor according to claim 1, characterized in that: The frame has a circuit storage portion. The filter circuit portion is housed in the circuit housing portion so that the insulating resin portion faces the circuit housing portion. A sheet having heat dissipation properties is arranged between the insulating resin portion and the circuit housing portion.

4. The electric compressor according to claim 1, characterized in that: A sleeve member is provided for passing a bolt for fixing the circuit substrate to the frame body. The sleeve component is integrated with the filter circuit component via the insulating resin portion.

5. The electric compressor according to claim 1, characterized in that: An inverter circuit unit and a motor control circuit unit are formed in other areas of the circuit board.

6. The electric compressor according to claim 1, characterized in that: The circuit board is detachably assembled to the frame.

7. The electric compressor according to claim 5, characterized in that: The inverter circuit unit includes a plurality of semiconductor elements electrically connected to the circuit substrate and another insulating resin unit integrating the plurality of semiconductor elements by injection molding. A portion of the terminal of the semiconductor element is covered by the other insulating resin portion, and the other portion of the terminal is connected to the circuit board.

8. The electric compressor according to claim 1, characterized in that: The end of the filter circuit portion that is away from the circuit substrate is covered by the insulating resin portion.

9. A method for manufacturing an electric compressor, characterized in that: include: The process of mounting a plurality of filter circuit components on a circuit substrate; A step of interposing an insulating resin between the plurality of filter circuit components and the circuit substrate by injection molding to thereby integrate the two; as well as A step of detachably assembling the circuit board to a housing that houses a compression mechanism and a motor that drives the compression mechanism.

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