Fire-fighting shoe cooling device and method based on novel thermoelectric structure

Abstract

The invention discloses a fire-fighting shoe cooling device and method based on a novel thermoelectric structure. The device mainly comprises a fire-fighting shoe, a first semiconductor chilling plate, a temperature sensor, a memory, a controller, a power supply, a heat exchanger and a second semiconductor chilling plate. The first semiconductor chilling plate and all the parts are specifically arranged, so that when a firefighter wears the firefighting shoes to conduct fire extinguishing and rescuing in a high-temperature and high-heat fire scene, the interiors, shoe bodies and feet of the firefighting shoes can be efficiently and rapidly cooled, and the safety risk caused by the high-temperature and high-heat fire environment to the firefighter is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of firefighting shoe cooling, and in particular to a firefighting shoe cooling device and method based on a novel thermoelectric structure. Background Art

[0002] Fire scenes are usually characterized by high temperatures and heat, so firefighters must wear fire shoes when entering a fire scene during firefighting and rescue operations. Fire shoes are fire-resistant and heat-insulating, and have long shoe shafts. Wearing them for a long time can easily cause dampness and heat in the legs and feet, and in severe cases may cause skin abscesses and other problems.

[0003] In view of this problem, among the existing technical solutions, patent CN112956777A discloses a firefighting shoe with protective function, including a sole rubber plate, a shoe body, a lug, a water bag airbag and a water gate valve. The inner surface of the shoe body is provided with a water bag airbag, and a water gate valve is installed above the water bag airbag. The surface is provided with a groove, and the water bag airbag is used to cool the inside of the shoe body. Patent CN114145539A discloses a temperature-adjustable sole and its system, including a sole body, the sole body is cooled by a semiconductor refrigeration element, and the sole body is regulated by a single-chip processor to achieve the purpose of controlling the temperature of the sole. The inventor's prior patent CN212014682U discloses a cooling and dehumidifying firefighting shoe based on a thermoelectric device, in which a semiconductor refrigeration sheet is arranged at the bottom of the insole to cool the inside of the shoe body.

[0004] Although the existing technical solutions can achieve a certain degree of cooling inside the shoes, they still have the following shortcomings: the water bag airbag itself has a very small volume and is not suitable for being made larger in the limited internal space of the shoe shaft, so it is not possible to cool down continuously; for shoes that use semiconductor thermoelectric refrigeration, most of the semiconductor refrigeration plates are traditional flat-plate thermoelectric structures, non-flexible flat-plate structures, generally set on wide soles, which can cool the feet of firefighting shoes, but are not suitable for shoe shafts, and when working, only one side of the inside of the shoe is cooled, and the outside of the shoe dissipates heat, and the shoe body cannot be cooled and protected.

[0005] To this end, we propose a fire shoe cooling device and method based on a new thermoelectric structure to solve the above-mentioned problems. Summary of the invention

[0006] The purpose of the present invention is to provide a fire shoe cooling device and method based on a new thermoelectric structure. By simplifying the configuration of the cooling device and optimizing the thermoelectric structure, dual cooling of the inside of the fire shoe shaft and the outside of the shoe surface can be achieved; in addition, by reasonably arranging thermoelectric elements and improving the heat dissipation method of semiconductor refrigeration plates, the cooling performance of the fire shoes can be further improved.

[0007] In order to solve the above technical problems, this application is specifically implemented through the following technical means:

[0008] According to an embodiment of the present invention, a firefighting shoe cooling device based on a novel thermoelectric structure is provided, comprising a firefighting shoe, a first semiconductor cooling sheet, a temperature sensor, a memory, a controller, a power supply, a heat exchanger and a second semiconductor cooling sheet;

[0009] The first semiconductor cooling sheet is installed in the shoe shaft interlayer of the fire boots, and is used to cool the inside of the shoe shaft and the outer shoe surface of the fire boots; the heat exchanger is arranged in the shoe shaft interlayer, and the hot end of the first semiconductor cooling sheet is connected to the heat exchanger;

[0010] The second semiconductor cooling sheet is installed in the midsole of the firefighting shoes to cool the feet;

[0011] The temperature sensor is installed inside the ankle of the fire shoe to measure the temperature inside the fire shoe and transmit the measured value to the memory;

[0012] The first semiconductor refrigeration chip, the second semiconductor refrigeration chip, the controller and the memory are all electrically connected to the power supply, and the first semiconductor refrigeration chip, the second semiconductor refrigeration chip, the memory and the temperature sensor are respectively electrically connected to the controller.

[0013] In addition, the firefighting shoe cooling device based on the novel thermoelectric structure according to the present invention may also have the following additional technical features:

[0014] In some of the embodiments, the first semiconductor refrigeration plate is a chain-type semiconductor refrigeration plate.

[0015] In some of the embodiments, the second semiconductor refrigeration chip is a flat-plate semiconductor refrigeration chip.

[0016] In some embodiments, the chain-type semiconductor refrigeration sheet is composed of a plurality of thermoelectric units electrically connected in parallel, and one thermoelectric unit includes a first metal sheet, a first N-type semiconductor, a first threaded metal column, a second N-type semiconductor, a second metal sheet, a first P-type semiconductor, a second threaded metal column, a second P-type semiconductor, a third metal sheet, a first heat absorbing sheet, a second heat absorbing sheet, a third heat absorbing sheet, and a fourth heat absorbing sheet, the first metal sheet is connected to the positive electrode of the power supply, and the third metal sheet is connected to the negative electrode of the power supply;

[0017] The first metal sheet, the first N-type semiconductor, the first threaded metal column, the second N-type semiconductor, the second metal sheet, the first P-type semiconductor, the second threaded metal column, the second P-type semiconductor and the third metal sheet are sequentially sandwiched between the first heat absorbing sheet and the second heat absorbing sheet, and the first heat absorbing sheet is connected to the second heat absorbing sheet only through the second metal sheet;

[0018] The first metal sheet is connected to the first N-type semiconductor and the fourth heat absorption sheet at two sides respectively, the first N-type semiconductor is connected to the second N-type semiconductor via the first threaded metal column, the second N-type semiconductor is connected to the first P-type semiconductor via the second metal sheet, the first P-type semiconductor is connected to the second P-type semiconductor via the second threaded metal column, and the third metal sheet is connected to the second P-type semiconductor and the third heat absorption sheet respectively.

[0019] In some embodiments, the first heat absorbing plate and the second heat absorbing plate are in an arc shape.

[0020] In some of the embodiments, a plurality of thermoelectric units are connected end to end to form a chain.

[0021] In some of the embodiments, the first N-type semiconductor, the second N-type semiconductor, the first P-type semiconductor, the second P-type semiconductor and the second semiconductor refrigeration plate are all made of bismuth telluride material, the first metal sheet, the second metal sheet, the third metal sheet, the first threaded metal column and the second threaded metal column are made of pure copper, and the first heat absorption plate, the second heat absorption plate, the third heat absorption plate and the fourth heat absorption plate are made of aluminum oxide.

[0022] In some of the embodiments, in each thermoelectric unit, the end surfaces of the third heat absorbing plate and the fourth heat absorbing plate are hot-end heat dissipation, and the first heat absorbing plate and the second heat absorbing plate are cold-end heat absorption.

[0023] In some embodiments, the third heat absorbing fin and the fourth heat absorbing fin in each thermoelectric unit contact the evaporation section of the heat exchanger.

[0024] In some of the embodiments, the heat exchanger uses a pulsating heat pipe, and the pulsating heat pipe is installed on the third heat absorbing plate and the fourth heat absorbing plate in a pin-type manner.

[0025] In some of the embodiments, ventilation holes are provided on the shoe shaft corresponding to the condensation section of the pulsating heat pipe.

[0026] In some of the embodiments, the memory compares the temperature value measured by the temperature sensor with a preset threshold value and feeds back to the controller, and then the controller controls the power supply to achieve different degrees of cooling effect.

[0027] In addition, according to an embodiment of the present invention, a method for cooling firefighting shoes based on a novel thermoelectric structure is also provided, and the method uses the firefighting shoes cooling device based on the novel thermoelectric structure, including the following steps:

[0028] S1: Before entering the fire scene, the firefighter puts on fire shoes, turns on the controller to form a closed circuit, and starts the first semiconductor refrigeration sheet and the second semiconductor refrigeration sheet to work;

[0029] S2: After the firefighters enter the fire scene, the temperature sensor senses the internal temperature change of the fire boots and feeds back the temperature measurement value to the memory. The memory compares the temperature measurement value with the preset temperature threshold. If the temperature measurement value is lower than the set temperature threshold, the power is temporarily turned off by the controller. When the temperature sensor senses that the temperature measurement value of the fire boots reaches or exceeds the preset temperature threshold, the controller turns on the power to increase the output power. The first semiconductor refrigeration plate and the second semiconductor refrigeration plate enhance the cooling efficiency. At the same time, after sensing the temperature change at its hot end, the heat exchanger also starts to work accordingly to reduce the hot end temperature, thereby cooling the inside and outside of the shoe shaft and the foot of the fire boots.

[0030] Implementing the technical solution of this application has at least the following beneficial effects:

[0031] By optimizing the structure of the thermoelectric unit of the first semiconductor cooling plate, compared with the P-type semiconductor of the same material volume, the first P-type semiconductor and the second P-type semiconductor are only the original volumes are divided equally, and a threaded metal column is added between the two to connect them. The middle threaded metal column of this design separates the cold end and the hot end of the thermoelectric unit by one end without affecting the conductivity, reducing the Fourier heat transfer from the hot end of the thermoelectric unit directly to the cold end, which can reduce the internal energy loss caused by the Fourier effect. At the same time, the threaded metal column itself acts as a heat sink, and the thread is similar to a fin, which dissipates the heat transferred from the hot end to the cold end, and also reduces the heat transferred from the hot end to the cold end, reducing the negative impact of the Fourier effect, thereby obtaining a larger cooling capacity. Similarly, the first N-type semiconductor and the second N-type semiconductor are also the same.

[0032] The threaded metal column and metal sheet of the thermoelectric unit connect the semiconductor in a chain, which is convenient for clamping in the first heat absorbing sheet and the second heat absorbing sheet. Especially when the first heat absorbing sheet and the second heat absorbing sheet are arranged in an arc shape, the first heat absorbing sheet is close to the inside of the shoe shaft, and the second heat absorbing sheet is close to the outside of the shoe shaft, which is convenient for installation in the shoe shaft interlayer of the firefighting shoes. In addition, multiple thermoelectric units can be connected end to end to form a ring, which can effectively cool down each space of the entire shoe shaft.

[0033] The first heat absorbing sheet and the second heat absorbing sheet are only connected to the second metal sheet, and both are used as cold ends, so as to realize cooling inside and outside of the shoe shaft of the firefighting shoes at the same time, improve the cooling effect on the legs of the firefighters, and fully protect the shoe body outside the shoe shaft. At this time, the third heat absorbing sheet and the fourth heat absorbing sheet are respectively attached to the third metal sheet and the first metal sheet, and as hot ends, the heat is conducted out of the air holes of the shoe shaft through the pulsating heat pipe, and there is no heat dissipation device protruding from the upper to hinder wearing and working.

[0034] Since the upper and the sole are generally not connected, it is inconvenient to set up a chain link type. Therefore, a second semiconductor cooling plate, especially a flat semiconductor cooling plate, is set in the sole interlayer of the fire boots at the same time, and the wide plane space of the sole is fully utilized to set the flat semiconductor cooling plate to cool the feet.

[0035] The memory compares the temperature value measured by the temperature sensor with the preset threshold value and feeds it back to the controller, which then controls the power supply to achieve different degrees of cooling effect, which can save power consumption and extend the use time.

[0036] Additional aspects and advantages of the present application will be given in part in the following description, and in part will become obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a schematic diagram of a firefighting shoe cooling device based on a novel thermoelectric structure according to the present invention.

[0038] Figure 2 This is a structural diagram of the chain-ring semiconductor refrigeration plate of the present invention.

[0039] Figure 3 It is a three-dimensional schematic diagram of the chain-ring semiconductor refrigeration plate of the present invention.

[0040] Figure 4 It is a schematic diagram of the structure of the heat exchanger of the present invention.

[0041] Among them: 1-fire shoes; 2-first semiconductor cooling plate; 3-temperature sensor; 4-memory; 5-controller; 6-power supply; 7-heat exchanger; 8-conducting wire; 9-second semiconductor cooling plate; 201-first metal sheet; 202-first N-type semiconductor; 203-first threaded metal column; 204-second N-type semiconductor; 205-second metal sheet; 206-first P-type semiconductor; 207-second threaded metal column; 208-second P-type semiconductor; 209-third metal sheet; 210-first heat absorbing plate; 211-second heat absorbing plate; 212-third heat absorbing plate; 213-fourth heat absorbing plate. DETAILED DESCRIPTION

[0042] In the description of the present invention, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise clearly and specifically limited. In the embodiment of the present invention, all directional indications (such as up, down, left, right, front, back, top, bottom ...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0043] In addition, reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] As analyzed in the background technology, the existing firefighting shoes still have certain shortcomings, especially the problem of cooling the inside and outside of the shoe shaft, and no effective solution has been proposed. For example, the related technology using water cooling, air cooling and / or flat semiconductor refrigeration cannot solve the problem of cooling the inside and outside of the shoe shaft.

[0046] In view of this, the embodiment of the present application provides a firefighting shoe cooling device based on a novel thermoelectric structure, which mainly realizes cooling inside and outside the shoe shaft through an improved chain-ring semiconductor cooling sheet. The specific technical solution is described below.

[0047] See also Figures 1 to 4As shown, in some embodiments, a fire shoe cooling device based on a novel thermoelectric structure is provided, comprising: a fire shoe 1, a first semiconductor cooling sheet 2, a temperature sensor 3, a memory 4, a controller 5, a power supply 6, a heat exchanger 7, a wire 8, and a second semiconductor cooling sheet 9. The first semiconductor cooling sheet 2 is installed in the shoe shaft interlayer of the fire shoe 1, and is used to cool the inside and outside of the shoe shaft of the fire shoe 1; the heat exchanger 7 is arranged in the shoe shaft interlayer, and the hot end of the first semiconductor cooling sheet 2 is connected to the heat exchanger 7; the second semiconductor cooling sheet 9 is installed in the sole interlayer of the fire shoe 1, and is used to cool the foot; the temperature sensor 3 is installed inside the ankle part of the fire shoe 1, and is used to measure the temperature inside the fire shoe 1, and transmit the measured value to the memory 4;

[0048] The first semiconductor refrigeration chip 2, the second semiconductor refrigeration chip 9, the controller 5 and the memory 4 are all electrically connected to the power supply 6 through the wire 8, and the first semiconductor refrigeration chip 2, the second semiconductor refrigeration chip 9, the memory 4 and the temperature sensor 3 are respectively electrically connected to the controller 5 through the wire 8 (control line).

[0049] In some preferred embodiments, the first semiconductor refrigeration sheet 2 is a chain-type semiconductor refrigeration sheet.

[0050] In some preferred embodiments, the chain-ring semiconductor refrigeration plate is composed of multiple thermoelectric units electrically connected in parallel, mainly including a first metal sheet 201; a first N-type semiconductor 202; a first threaded metal column 203; a second N-type semiconductor 204; a second metal sheet 205; a first P-type semiconductor 206; a second threaded metal column 207; a second P-type semiconductor 208; a third metal sheet 209; a first heat absorbing sheet 210; and a second heat absorbing sheet 211.

[0051] In a specific embodiment, the first metal sheet 201 is in contact with the fourth heat absorption sheet 213 and the first N-type semiconductor 202 on both sides respectively, and the first metal sheet 201 is connected to the positive electrode of the power source 6 as a current input end; the second metal sheet 205 is sandwiched between the second N-type semiconductor 204 and the first P-type semiconductor 206; the third metal sheet 209 is in contact with the third heat absorption sheet 212 and the second P-type semiconductor 208 on both sides respectively, and the third metal sheet 209 is connected to the negative electrode of the power source 6 as a current output end.

[0052] In a specific embodiment, the first threaded metal pillar 203 is located between the first N-type semiconductor 202 and the second N-type semiconductor 204 , and the second threaded metal pillar 207 is located between the first P-type semiconductor 206 and the second P-type semiconductor 208 .

[0053] In some preferred embodiments, the first metal sheet 201, the second metal sheet 205, and the third metal sheet 209 are made of copper material, and the first threaded metal column 203 and the second threaded metal column 207 are all made of copper material. On the one hand, they are used for normal conduction of the circuit, and on the other hand, they are used to dissipate the heat generated in the semiconductor more promptly and efficiently to avoid damage to the semiconductor refrigeration sheet due to high temperature.

[0054] It should be pointed out that the first threaded metal column 203 not only facilitates the connection between the first N-type semiconductor 202 and the second N-type semiconductor 204 to form a chain-shaped thermoelectric unit, but its main function is to separate the cold end and the hot end of the thermoelectric unit at a distance without affecting the conductivity, thereby reducing the Fourier heat transfer from the hot end of the thermoelectric unit directly to the cold end, and reducing the internal energy loss caused by the Fourier effect. At the same time, the threaded metal column itself acts as a heat sink, and the thread is similar to a fin, which dissipates the heat transferred from the hot end to the cold end, and also reduces the heat transferred from the hot end to the cold end, reducing the negative impact of the Fourier effect, thereby obtaining a larger cooling capacity. Similarly, using the second threaded metal column 207 to connect the first P-type semiconductor 206 and the second P-type semiconductor 208 also plays the same role.

[0055] In a specific embodiment of the present invention, the first heat absorbing sheet 210 and the second heat absorbing sheet 211 sandwich the first metal sheet 201, the first N-type semiconductor 202, the first threaded metal column 203, the second N-type semiconductor 204, the second metal sheet 205, the first P-type semiconductor 206, the second threaded metal column 207, the second P-type semiconductor 208 and the third metal sheet 209 therebetween.

[0056] Among them, when the first semiconductor refrigeration sheet 2 is installed in the interlayer of the shoe shaft of the fire boots 1, the first heat absorption sheet 210 cools the shoe body of the fire boots 1 in the outer layer to protect the shoe body, and is equivalent to performing the first cooling of the inside of the shoe shaft, and also improves the effect of the second heat absorption sheet 211 in the inner layer to cool the inside of the shoe shaft of the fire boots 1. The double-layer cooling greatly improves the protection of the legs. By way of example, the material of the first heat absorption sheet 210 and the second heat absorption sheet 211 is aluminum oxide. Of course, other insulating materials with excellent thermal conductivity can also be used.

[0057] In some preferred embodiments, the first heat absorbing sheet and the second heat absorbing sheet are in an arc shape to adapt to the annular cross-sectional structure of the shoe shaft interlayer, so as to facilitate installation in the shoe shaft interlayer of the fire boots.

[0058] In a specific embodiment of the present invention, the first N-type semiconductor 202 , the second N-type semiconductor 204 , the first P-type semiconductor 206 , and the second P-type semiconductor 208 are of the same size.

[0059] Exemplarily, the first N-type semiconductor 202, the second N-type semiconductor 204, the first P-type semiconductor 206, the second P-type semiconductor 208 and the flat-plate semiconductor cooling plate 9 are all made of bismuth telluride. In some embodiments, bismuth selenide or other semiconductor materials that produce a Peltier effect when powered on may also be used.

[0060] It should be noted that the present application does not limit the specific number of thermoelectric units, and as an example, the number of thermoelectric units is 3, and the 3 thermoelectric units are connected end to end to form a ring. In this way, each space of the entire shoe shaft can be effectively cooled.

[0061] In some preferred embodiments, a fourth heat absorbing sheet 213 is closely disposed on one side of the first metal sheet 201, and a third heat absorbing sheet 212 is closely disposed on one side of the third metal sheet 209. The fourth heat absorbing sheet 213 and the third heat absorbing sheet 212 act as hot end heat sinks to remove the heat conducted to the first metal sheet 201 and the third metal sheet 209. Exemplarily, the third heat absorbing sheet 212 and the fourth heat absorbing sheet 213 are made of aluminum oxide, and other insulating materials with excellent thermal conductivity may also be used.

[0062] In some preferred embodiments, corresponding fixing mechanisms, such as buckles, are provided on the third heat absorbing plate 212 and the fourth heat absorbing plate 213 to facilitate connection with the heat exchanger 7 and contact heat exchange.

[0063] In a specific embodiment, the heat exchanger 7 adopts a pulsating heat pipe, which is installed on the third heat absorbing plate 212 and the fourth heat absorbing plate 213 in a latch-type manner, and is fastened by the fixing mechanism on the third heat absorbing plate 212 and the fourth heat absorbing plate 213. The third heat absorbing plate 212 and the fourth heat absorbing plate 213 are in contact with the evaporation section of the pulsating heat pipe to transfer heat to the condensation section of the pulsating heat pipe.

[0064] It should be pointed out that the pulsating heat pipe is a metal capillary bent into a serpentine structure, and its tube diameter is very small (the inner diameter is generally 0.5-3mm), which is suitable for being set in a smaller shoe tube interlayer space. One end of the elbow is the evaporation section and the other end is the condensation section. This embodiment does not limit the specific structure or form of the pulsating heat pipe, and a pulsating heat pipe that can achieve heat extraction is sufficient.

[0065] In some preferred embodiments, when a pulsating heat pipe is provided in the shoe shaft interlayer, a vent hole is provided on the shoe shaft corresponding to the condensation section of the pulsating heat pipe to prevent heat from accumulating in the shoe shaft interlayer and deteriorating the heat conduction effect. At the same time, since there is no extra heat dissipation device on the outer surface of the shoe, it does not hinder wearing and working.

[0066] In some preferred embodiments, there may be multiple first semiconductor refrigeration sheets 2 (chain-type semiconductor refrigeration sheets), which are sequentially arranged in the interlayer space of the shoe shaft to fully cool the entire shoe shaft inside and outside.

[0067] In some preferred embodiments, the second semiconductor cooling sheet 9 is a flat semiconductor cooling sheet. Compared with the inconvenient arrangement of the flat semiconductor cooling sheet on the shoe shaft and the upper, the wide plane space of the sole is provided with the flat semiconductor cooling sheet to cool the foot, and the flat semiconductor cooling sheet works together with the first semiconductor cooling sheet to cool the leg in the shoe shaft, so that the legs and feet of the firefighters can be well cooled and protected. It should be pointed out that the flat semiconductor cooling sheet can adopt a conventional semiconductor cooling sheet, which includes a necessary heat dissipation part, and the heat dissipation part can dissipate heat through the sole.

[0068] In order to facilitate cooling and power control, in a specific embodiment of the present invention, the temperature sensor 3 is installed inside the ankle of the fire shoe 1. The temperature sensor 3 is used to measure the temperature inside the fire shoe 1, and transmit the measured value to the memory 4 through the wire 8 for comparison with the preset threshold value of 40°C, and then the output of the power supply 6 is controlled by the controller 5, so that the first semiconductor refrigeration plate 2 and / or the second semiconductor refrigeration plate 9 can achieve different degrees of cooling effect, ensuring the safety and comfort of the legs and feet of the firefighters. It should be pointed out that the temperature control method in this embodiment can be implemented by any control circuit in the prior art, as long as it can achieve temperature control, and this embodiment does not limit the specific structural form of these circuit components.

[0069] It should be understood that the power supply 6 can be any form of power supply, such as a battery. For example, the battery is installed in the body of the fire boot or in the fire suit, and is connected to the controller 5, the memory 4 and the cooling plate 2 by setting corresponding connecting lines.

[0070] In a specific embodiment of the present invention, a firefighting shoe cooling method based on a novel thermoelectric structure is also provided, and the specific method is as follows:

[0071] S1: Before entering the fire scene, the firefighter puts on fire shoes, turns on the controller 5 to form a closed circuit, and starts the first semiconductor refrigeration sheet 2 and the second semiconductor refrigeration sheet 9 to work;

[0072] S2: After the firefighters enter the fire scene, the temperature sensor 3 senses the internal temperature change of the fire boots 1 and feeds back the temperature measurement value to the memory 4. The memory 4 compares the temperature measurement value with the preset temperature threshold. If the temperature measurement value is lower than the set temperature threshold, the power supply 6 is temporarily turned off through the controller 5. When the temperature measurement value reaches or exceeds the preset temperature threshold, the controller 5 turns on the power supply 6 to increase the output power. The first semiconductor refrigeration plate 2 and the second semiconductor refrigeration plate 9 enhance the cooling efficiency. At the same time, after sensing the temperature change at its hot end, the heat exchanger 7 also starts to work accordingly to reduce the hot end temperature, thereby cooling the inside and outside of the shoe shaft and the foot of the fire boots 1.

[0073] The firefighting shoe cooling device and method based on a new thermoelectric structure provided by the present invention has the following beneficial effects: when firefighters are wearing firefighting shoes at a high temperature and heat fire scene, they can use the firefighting shoe cooling device and method based on a new thermoelectric structure to cool down. By rationally optimizing the structure of the thermoelectric unit of the first semiconductor refrigeration plate, the distance and time of the current flow are reduced, and a low-temperature cold end can be obtained more effectively; it is easy to install in the interlayer of the shoe shaft of the firefighting shoe, and effectively cool down each space of the entire shoe shaft; the inside and outside of the shoe shaft of the firefighting shoe are cooled at the same time, improving the cooling effect on the legs of the firefighters, and fully protecting the shoe body on the outside of the shoe shaft; there is no heat dissipation device protruding from the upper to hinder wearing and working; different degrees of cooling effect can be achieved, saving power consumption, and extending the use time; reducing a series of safety risks caused by high temperature and high heat fire environment to firefighters.

[0074] The basic principle of the present invention is described above in conjunction with specific embodiments. However, it should be pointed out that the advantages, strengths, effects, etc. mentioned in the present invention are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. must be possessed by each embodiment of the present invention. In addition, the specific details disclosed above are only for the purpose of illustration and facilitation of understanding, rather than limitation, and the above details do not limit the present invention to being implemented by adopting the above specific details.

[0075] The block diagrams of the devices, apparatuses, equipment, and systems involved in the present invention are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The word "such as" used here refers to the phrase "such as but not limited to", and can be used interchangeably with it.

[0076] It should also be noted that in the device, apparatus and method of the present invention, each component or each step can be decomposed and / or reassembled, and such decomposition and / or reassembly should be regarded as an equivalent solution of the present invention.

Claims

1. A firefighting shoe cooling device based on a new thermoelectric structure, characterized in that: It comprises a firefighting shoe (1), a first semiconductor cooling plate (2), a temperature sensor (3), a memory (4), a controller (5), a power supply (6), a heat exchanger (7) and a second semiconductor cooling plate (9); The first semiconductor cooling sheet (2) is installed in the shoe shaft interlayer of the fire boots (1) and is used to cool the inside and outside of the shoe shaft of the fire boots (1); the heat exchanger (7) is arranged in the shoe shaft interlayer, and the hot end of the first semiconductor cooling sheet (2) is connected to the heat exchanger (7); The second semiconductor cooling sheet (9) is installed in the midsole of the firefighting shoes (1) and is used to cool the feet; The temperature sensor (3) is installed inside the ankle portion of the firefighting shoe (1) and is used to measure the temperature inside the firefighting shoe (1) and transmit the measured value to the memory (4); The first semiconductor refrigeration sheet (2), the second semiconductor refrigeration sheet (9), the controller (5) and the memory (4) are all electrically connected to the power supply (6), and the first semiconductor refrigeration sheet (2), the second semiconductor refrigeration sheet (9), the memory (4) and the temperature sensor (3) are respectively electrically connected to the controller (5).

2. The firefighting shoe cooling device based on the novel thermoelectric structure according to claim 1 is characterized in that: The first semiconductor refrigeration sheet (2) is a chain-ring type semiconductor refrigeration sheet; The chain-type semiconductor refrigeration plate is composed of a plurality of thermoelectric units electrically connected in parallel, wherein one thermoelectric unit comprises a first metal sheet (201), a first N-type semiconductor (202), a first threaded metal column (203), a second N-type semiconductor (204), a second metal sheet (205), a first P-type semiconductor (206), a second threaded metal column (207), a second P-type semiconductor (208), a third metal sheet (209), a first heat absorbing sheet (210), a second heat absorbing sheet (211), a third heat absorbing sheet (212) and a fourth heat absorbing sheet (213); the first metal sheet (201) is connected to the positive electrode of a power source (6), and the third metal sheet (209) is connected to the negative electrode of the power source (6); The first metal sheet (201), the first N-type semiconductor (202), the first threaded metal column (203), the second N-type semiconductor (204), the second metal sheet (205), the first P-type semiconductor (206), the second threaded metal column (207), the second P-type semiconductor (208) and the third metal sheet (209) are sequentially sandwiched between the first heat absorbing sheet (210) and the second heat absorbing sheet (211), and the first heat absorbing sheet (210) is connected to the second heat absorbing sheet (211) only through the second metal sheet (205); The first metal sheet (201) is connected to the first N-type semiconductor (202) and the fourth heat absorbing sheet (213) on both sides respectively; the first N-type semiconductor (202) and the second N-type semiconductor (204) are connected via the first threaded metal column (203); the second N-type semiconductor (204) and the first P-type semiconductor (206) are connected via the second metal sheet (205); the first P-type semiconductor (206) and the second P-type semiconductor (208) are connected via the second threaded metal column (207); and the third metal sheet (209) is connected to the second P-type semiconductor (208) and the third heat absorbing sheet (212) respectively.

3. The firefighting shoe cooling device based on the novel thermoelectric structure according to claim 2 is characterized in that: Multiple thermoelectric units are connected end to end to form a chain.

4. The firefighting shoe cooling device based on the novel thermoelectric structure according to claim 2 or 3 is characterized in that: The second semiconductor refrigeration plate (9) is a flat-plate semiconductor refrigeration plate.

5. The firefighting shoe cooling device based on a novel thermoelectric structure according to any one of claims 2 to 4, characterized in that: The first N-type semiconductor (202), the second N-type semiconductor (204), the first P-type semiconductor (206), the second P-type semiconductor (208) and the second semiconductor cooling plate (9) are all made of bismuth telluride material; the first metal plate (201), the second metal plate (205), the third metal plate (209), the first threaded metal column (203) and the second threaded metal column (207) are made of pure copper; and the first heat absorbing plate (210), the second heat absorbing plate (211), the third heat absorbing plate (212) and the fourth heat absorbing plate (213) are made of aluminum oxide.

6. The firefighting shoe cooling device based on a novel thermoelectric structure according to any one of claims 2 to 4, characterized in that: In each thermoelectric unit, the end surfaces of the third heat absorbing plate (212) and the fourth heat absorbing plate (213) are hot-end heat dissipation, and the first heat absorbing plate (210) and the second heat absorbing plate (211) are cold-end heat absorption.

7. The firefighting shoe cooling device based on the novel thermoelectric structure according to claim 6 is characterized in that: The third heat absorbing plate (212) and the fourth heat absorbing plate (213) in each thermoelectric unit contact the evaporation section of the heat exchanger (7).

8. The firefighting shoe cooling device based on the novel thermoelectric structure according to claim 7 is characterized in that: The heat exchanger (7) adopts a pulsating heat pipe, and the pulsating heat pipe is installed on the third heat absorbing plate (212) and the fourth heat absorbing plate (213) in a bolt-type manner.

9. The firefighting shoe cooling device based on the novel thermoelectric structure according to claim 8 is characterized in that: A ventilation hole is provided on the shoe shaft corresponding to the condensation section of the pulsating heat pipe.

10. The firefighting shoe cooling device based on a novel thermoelectric structure according to any one of claims 1 to 9, characterized in that: The memory (4) compares the temperature value measured by the temperature sensor (3) with a preset threshold value and feeds back the value to the controller (5), and then the controller (5) controls the power supply (6) to achieve different degrees of cooling effect.

11. A firefighting shoe cooling method based on a novel thermoelectric structure, characterized in that: The firefighting shoe cooling device based on the novel thermoelectric structure according to any one of claims 1 to 10 comprises the following steps: S1: before entering the fire scene, the firefighter puts on firefighting shoes, turns on the controller (5) to form a closed circuit, and starts the first semiconductor cooling sheet (2) and the second semiconductor cooling sheet (9) to work; S2: After the firefighter enters the fire scene, the temperature sensor (3) senses the internal temperature change of the fire boots (1) and feeds back the measured value to the memory (4). The memory (4) compares the measured temperature with a preset temperature threshold. If the measured temperature is lower than the preset temperature threshold, the power supply (6) is temporarily turned off through the controller (5). When the temperature sensor (3) senses that the internal temperature measurement value of the fire boots (1) reaches or exceeds the preset temperature threshold, the controller (5) turns on the power supply (6) to increase the output power. The first semiconductor cooling plate (2) and the second semiconductor cooling plate (9) enhance the cooling efficiency. At the same time, after sensing the temperature change at its hot end, the heat exchanger (7) also starts to work accordingly to reduce the hot end temperature, thereby cooling the inside and outside of the shoe shaft of the fire boots (1) and the foot.

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