Moving beam laser shock peening light path device for inner surface of semi-closed structure

Abstract

The invention relates to the technical field of laser processing, in particular to a semi-closed structure inner surface moving beam laser shock peening light path device which comprises a beam angle regulator, a reflective processing head and a movement mechanism. The movement mechanism is connected with the light beam angle adjuster and the reflective machining head and used for driving the light beam angle adjuster and the reflective machining head to move, and the light beam angle adjuster can rotate around the optical axis and is used for adjusting the incident angle of a laser beam entering the reflective machining head. The reflection type machining head is used for conducting laser machining on the inner surface of the part. The moving beam laser shock peening light path device for the inner surface of the semi-closed structure aims at solving the problems that the laser shock peening difficulty of the complex inner surface of the semi-closed structure of a part is large, and the performance is poor.

Description

Technical Field

[0001] The invention relates to the technical field of laser processing, and in particular to an optical path device for laser shock strengthening of the inner surface of a semi-enclosed structure with a dynamic beam. Background Art

[0002] Laser shock peening can form a deep residual compressive stress layer on the surface of key parts of metal parts, which can significantly improve the fatigue performance of metal parts. When the surface of the metal part to be strengthened has good openness, the laser beam is usually nearly perpendicular to the strengthened surface for laser shock peening. When the surface of the metal part to be strengthened has poor openness, due to the interference between the part structure and the laser beam, it is impossible to adjust the laser beam to be nearly perpendicular to the strengthened surface for laser shock peening. The laser beam must be irradiated on the surface to be strengthened by oblique incidence, reflection, or refraction.

[0003] When laser shock strengthening is adopted with oblique incident laser beam, the larger the angle between the incident laser beam and the normal direction of the strengthened surface, that is, the larger the inclination angle, the larger the strengthening spot area projected by the laser beam on the strengthened surface, the smaller the laser power density in the corresponding strengthening spot, and the worse the strengthening effect.

[0004] Changing the laser transmission route by reflection or refraction can reduce the interference between the part structure and the laser beam, thereby reducing the inclination angle of the laser beam before reaching the part surface. However, when the strengthening surface of the fixed part is a complex three-dimensional surface, it is necessary to frequently change the relative position of the reflected or refracted beam and the part, and constantly replace the reflection or refraction device, which greatly reduces the strengthening efficiency and cannot meet practical applications.

[0005] When semi-enclosed structural parts are stationary or only have simple movements, the laser beam accessibility becomes poor when laser shock hardening is performed on their inner surface, and it is difficult to obtain an excellent laser shock hardened surface. When laser shock hardening is adopted with the laser beam directly incident at an angle, when the laser beam inclination angle increases, the laser power density of the strengthening spot is not enough to produce plastic strain on the surface of the part, which will lead to uneven strengthening performance or strengthening failure. When the laser shock hardening method of reflection or refraction is adopted, the direction of the reflected or refracted light beam is relatively fixed, and it is impossible to provide changes in the laser beam inclination angle according to the strengthening requirements of complex surfaces.

[0006] Therefore, the inventor provides a semi-enclosed structure inner surface dynamic beam laser shock strengthening optical path device. Summary of the invention

[0007] (1) Technical issues to be solved

[0008] The embodiment of the present invention provides an optical path device for dynamic beam laser shock peening of the inner surface of a semi-enclosed structure, which solves the technical problems of great difficulty and poor performance in laser shock peening of the complex inner surface of a semi-enclosed structure of a part.

[0009] (2) Technical solution

[0010] The present invention provides an optical path device for dynamic beam laser shock strengthening of the inner surface of a semi-enclosed structure, comprising a beam angle adjuster, a reflective processing head and a motion mechanism, wherein the motion mechanism is respectively connected to the beam angle adjuster and the reflective processing head and is used to drive the beam angle adjuster and the reflective processing head to move, the beam angle adjuster can rotate around the optical axis and is used to adjust the incident angle of the laser beam entering the reflective processing head, and the reflective processing head is used to perform laser processing on the inner surface of a part.

[0011] Furthermore, the beam angle adjuster includes a first reflecting mirror, a first wedge mirror, a second wedge mirror and a multi-angle wedge mirror, the first wedge mirror is used to refract the first reflected laser beam reflected by the first reflecting mirror to form a first refracted laser beam, the second wedge mirror is used to refract the first refracted laser beam to form a second refracted laser beam parallel to the optical axis, and the multi-angle wedge mirror is used to refract the second refracted laser beam to form a third refracted laser beam.

[0012] Furthermore, the beam angle adjuster also includes a beam angle adjuster base, and the first reflector, the first wedge mirror, the second wedge mirror and the multi-angle wedge mirror are all installed inside the beam angle adjuster base along the direction of the optical axis.

[0013] Furthermore, the first wedge-shaped mirror is movably arranged along the direction of the optical axis to adjust the distance between the second refracted laser beam and the optical axis.

[0014] Furthermore, the beam angle adjuster also includes a rotational motion module, a first motion module, a second motion module, a third motion module and a fixed seat, the fixed seat is installed on the rotational motion module, the first motion module, the second motion module, and the third motion module are all installed on the fixed seat and rotate synchronously with the fixed seat; the first wedge mirror is installed on the first motion module, the second wedge mirror is installed on the third motion module, the multi-angle wedge mirror is installed on the second motion module, and the rotational motion module is used to drive the fixed seat to rotate around the optical axis.

[0015] Furthermore, the laser output surface of the multi-angle wedge mirror has a plurality of wedge surfaces whose wedge angles increase one by one from top to bottom along the z-axis; wherein the number of the wedge surfaces is at least, and the z-direction width of each wedge surface is greater than 1.2φ, where φ is the diameter of the original input laser beam.

[0016] Furthermore, the reflective processing head includes a second reflector, a third reflector, a first shaping mirror, a first rotating mechanism and a second rotating mechanism, the first rotating mechanism is connected to the second reflector and is used to drive the second reflector to rotate, the second rotating mechanism is connected to the third reflector and is used to drive the third reflector to rotate; the second reflector is used to reflect the third refracted laser beam to form a second reflected laser beam, and the first shaping mirror is used to form the second reflected laser beam reflected by the third reflector into a first processing beam that irradiates the inner surface of the part.

[0017] Furthermore, the reflective processing head also includes a processing head base, and the second reflector, the third reflector, the first shaping mirror, the first rotating mechanism and the second rotating mechanism are all installed inside the processing head base.

[0018] Furthermore, the reflective processing head also includes a fourth reflector, a second shaping mirror and a third rotating mechanism, the third rotating mechanism is connected to the fourth reflector and is used to drive the fourth reflector to rotate; the second shaping mirror is used to form the second reflected laser beam reflected by the fourth reflector into a second processing beam that irradiates the inner surface of the part.

[0019] Furthermore, the reflective processing head also includes a fifth reflector, a third shaping mirror and a fourth rotating mechanism, the fourth rotating mechanism is connected to the fifth reflector and is used to drive the fifth reflector to rotate; the third shaping mirror is used to form the second reflected laser beam reflected by the fifth reflector into a third processing beam that irradiates the inner surface of the part.

[0020] (3) Beneficial effects

[0021] In summary, the present invention controls the motion mechanism to drive the beam angle adjuster and the reflective processing head to move as a whole. The beam angle adjuster can rotate around the optical axis and is used to adjust the incident angle of the laser beam entering the reflective processing head, thereby realizing the movement from the previous processing position to the next processing position. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a schematic structural diagram of an optical path device for laser shock peening of a surface with a dynamic beam in a semi-enclosed structure provided in Example 1 of the present invention;

[0024] Figure 2 It is a structural schematic diagram of a semi-enclosed structure inner surface dynamic beam laser shock strengthening optical path device provided in Example 2 of the present invention.

[0025] In the figure:

[0026] 100-beam angle adjuster; 1-first reflector; 2-first wedge mirror; 3-second wedge mirror; 4-multi-angle wedge mirror; 10-beam angle adjuster base; 35-rotational motion module; 36-first motion module; 37-second motion module; 38-third motion module; 39-fixed seat; 200-reflective processing head; 11-second reflector; 12-third reflector; 13-fourth reflector; 14-fifth reflector; 15-first shaping mirror; 16-second shaping mirror; 17-third shaping mirror; 30-processing head base; 31-first rotary machine Structure; 32-second rotating mechanism; 33-third rotating mechanism; 34-fourth rotating mechanism; 35-rotational motion module; 36-first motion module; 37-second motion module; 38-third motion module; 39-fixed seat; 300-motion mechanism; 400-parts; 20-optical axis; 41-original input laser beam; 42-first reflected laser beam; 43-first refracted laser beam; 44-second refracted laser beam; 45-third refracted laser beam; 46-second reflected laser beam; 47-first processing beam; 48-second processing beam; 49-third processing beam. DETAILED DESCRIPTION

[0027] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to exemplarily illustrate the principles of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments, and covers any modification, replacement and improvement of parts, components and connection modes without departing from the spirit of the present invention.

[0028] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0029] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the products of the present invention are conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. These are merely for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting" and "installation" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Figure 1 is a schematic diagram of a semi-enclosed structure inner surface dynamic beam laser shock peening optical path device provided by an embodiment of the present invention, see Figure 1 and Figure 2 The optical path device may include a beam angle adjuster 100, a reflective processing head 200 and a motion mechanism 300. The motion mechanism 300 is respectively connected to the beam angle adjuster 100 and the reflective processing head 200 and is used to drive the beam angle adjuster 100 and the reflective processing head 200 to move. The beam angle adjuster 100 can rotate around the optical axis 20 and is used to adjust the incident angle of the laser beam entering the reflective processing head 200. The reflective processing head 200 is used to perform laser processing on the inner surface of the part 400.

[0032] In the above embodiment, the motion mechanism 300 is connected to the beam angle adjuster 100 and the reflective processing head 200, and can drive the beam angle adjuster 100 and the reflective processing head 200 to move three-dimensionally in space, and can also independently control the reflective processing head 200 to rotate around point M in the xz plane.

[0033] As an optional implementation, Figure 1 As shown, the beam angle adjuster 100 includes a first reflecting mirror 1, a first wedge-shaped mirror 2, a second wedge-shaped mirror 3 and a multi-angle wedge-shaped mirror 4. The first wedge-shaped mirror 2 is used to refract the first reflected laser beam 42 reflected by the first reflecting mirror 1 to form a first refracted laser beam 43. The second wedge-shaped mirror 3 is used to refract the first refracted laser beam 43 to form a second refracted laser beam 44 parallel to the optical axis 20. The multi-angle wedge-shaped mirror 4 is used to refract the second refracted laser beam 44 to form a third refracted laser beam 45.

[0034] Specifically, the wedge angles of the first wedge mirror 2 and the second wedge mirror 3 are the same. The laser incident surface and the laser output surface of the multi-angle wedge mirror 4 have different characteristics. The laser incident surface of the multi-angle wedge mirror 4 is a plane, and the normal of the plane is in the xz plane. The rotational motion module 35 is mounted on the beam angle adjuster base 10, the fixed seat 39 is mounted on the rotational motion module 35, and the first motion module 36 and the third motion module 38 are mounted on the fixed seat 39. The wedge mirror 2 is mounted on the first motion module 36, the second wedge mirror 3 is mounted on the third motion module 38, and the multi-angle wedge mirror 4 is mounted on the second motion module 37. The rotational motion module 35 can drive the fixed seat 39 and all the elements mounted thereon to rotate around the optical axis 20.

[0035] Furthermore, the first wedge mirror 2 is arranged to move along the direction of the optical axis 20 to adjust the distance between the second refracted laser beam 44 and the optical axis 20. The laser output surface of the multi-angle wedge mirror 4 has a plurality of wedge surfaces whose wedge angles increase one by one from top to bottom along the z-axis; the number of the wedge surfaces is at least 2, and the z-direction width of each wedge surface is greater than 1.2φ, where φ is the diameter of the original input laser beam 41.

[0036] As an optional implementation, Figure 1 As shown, the reflective machining head 200 includes a second reflector 11, a third reflector 12, a first shaping mirror 15, a first rotating mechanism 31 and a second rotating mechanism 32. The first rotating mechanism 31 is connected to the second reflector 11 and is used to drive the second reflector 11 to rotate. The second rotating mechanism 32 is connected to the third reflector 12 and is used to drive the third reflector 12 to rotate. The second reflector 11 is used to reflect the third refracted laser beam 45 to form a second reflected laser beam 46. The first shaping mirror 15 is used to form the second reflected laser beam 46 reflected by the third reflector 12 into a first machining beam 47 that irradiates the inner surface of the part 400.

[0037] Specifically, the reflective mirror, the shaping mirror, and the rotating mechanism are all fixed on the processing head base 30, the center point of the incident light beam on the second reflective mirror 11 is point M, and the reflective processing head 200 can rotate a certain angle around point M. In fact, the reflective processing head can have a plurality of movable reflective mirrors, shaping mirrors, and rotating mechanisms, and the number of the three is equal.

[0038] As an optional implementation, Figure 1 As shown, the reflective processing head 200 further includes a processing head base 30 , and the second reflector 11 , the third reflector 12 , the first shaping mirror 15 , the first rotating mechanism 31 and the second rotating mechanism 32 are all installed inside the processing head base 30 .

[0039] As an optional implementation, Figure 1As shown, the reflective machining head 200 also includes a fourth reflector 13, a second shaping mirror 16 and a third rotating mechanism 33. The third rotating mechanism 33 is connected to the fourth reflector 13 and is used to drive the fourth reflector 13 to rotate; the second shaping mirror 16 is used to form a second reflected laser beam 46 reflected by the fourth reflector 13 into a second machining beam 48 that irradiates the inner surface of the part 400.

[0040] As an optional implementation, Figure 1 As shown, the reflective processing head 200 also includes a fifth reflector 14, a third shaping mirror 17 and a fourth rotating mechanism 34. The fourth rotating mechanism 34 is connected to the fifth reflector 14 and is used to drive the fifth reflector 14 to rotate; the third shaping mirror 17 is used to transform the second reflected laser beam 46 reflected by the fifth reflector 14 into a third processing beam 49 that irradiates the inner surface of the part 400.

[0041] The working principle of the optical path device is specifically as follows: the original input laser beam 41 is reflected by the first reflector 1 to form a first emitted laser beam 42 that coincides with the optical axis 20; the first reflected laser beam 42 is refracted by the movable first wedge mirror 2 to form a first refracted laser beam 43; the first refracted laser beam 43 is formed by the second wedge mirror 3 to form a second refracted laser beam 44 that is parallel to the optical axis 20; the second refracted laser beam 44 is formed by the multi-angle wedge mirror 4 to form a third refracted laser beam 45; the third refracted laser beam 45 is formed by the second reflector 11 to form a second reflected laser beam 46; the second reflected laser beam 46 is formed by the third reflector 12 and the first shaping mirror 15 to form a first processing beam 47; the first processing beam 47 is irradiated on the first processing position 50 of the part 400.

[0042] The second rotating mechanism 32 can drive the third reflector 12 to rotate, so that the second reflected laser beam 46 forms a second processing beam 48 after passing through the fourth reflector 13 and the second shaping mirror 16, and finally reaches the first processing position 50 through another angle; similarly, the third rotating mechanism 33 drives the fourth reflector 13 to rotate, so that the second reflected laser beam 46 forms a third processing beam 49 after passing through the fifth reflector 14 and the third shaping mirror 17. In this way, by controlling the corresponding rotating mechanism to control the corresponding reflector to rotate, the impact angles of the first processing beam 47, the second processing beam 48, and the third processing beam 49 are different, so that the impact angle adjustment can be achieved. The angles between the several processing beams formed by several movable total reflection mirrors and shaping mirrors and the second reflected laser beam 46 are β1, β2, β3, ..., β m , and β1, β2, β3,…,β m The angle value of is an arithmetic progression, and the angle difference is Δβ.

[0043] The first wedge mirror 2 is driven to move along the x direction by the first motion module 36, and the second wedge mirror 3 is driven to move along the z direction by the third motion module 38, and the positions of the first refracted laser beam 43 and the second refracted laser beam 44 will change. The second refracted laser beam 44 is still parallel to the optical axis 20, but the distance from the optical axis 20 is different. The second refracted laser beam 44 will irradiate different areas of the multi-angle wedge mirror 4, and the multi-angle wedge mirror 4 is driven to move along the x direction by the second motion module 37, and the angle between the formed third refracted laser beam 45 and the optical axis 20 is variable and both are irradiated on the M point of the second reflector 11. Accordingly, the reflective processing head 200 is rotated around the M point by a certain angle, and the angles of the first processing beam 47, the second processing beam 48, and the third processing beam 49 formed by the third refracted laser beam 45 after passing through the second reflector 11 will change accordingly. In this way, the multi-angle change of the processing beam is realized, which meets the processing requirements of different inner wall shapes on the inner surface of the semi-enclosed structure. The first refracted laser beam 43 is irradiated on the multi-angle wedge mirror 4, and the wedge angles are θ1, θ2, θ3, ..., θ n When the wedge surface is formed, the angles between the second refracted laser beam 44 and the optical axis 20 are α1, α2, α3, ..., α n , and α1, α2, α3,…,α n The angle value is an arithmetic progression, and the angle difference is Δβ / n.

[0044] Example 1

[0045] The device is used to perform laser shock hardening on the upper edge of the raised surface of the inner wall of a titanium alloy hollow cylinder part. The inner wall of a TC4 titanium alloy hollow cylinder with a thickness of 15 mm and an outer diameter of 200 mm is laser shocked hardened. The inner wall contains a raised surface with a width of 10 mm and a height of 5 mm (the cross-sectional shape is semicircular). The diameter of the original input laser beam 41 is 30 mm and the wavelength is 1064 nm. The angle between the processing beam and the perpendicular line of the optical axis 20 is defined as the impact angle, and the adjustment range of the impact angle is 59.3 to 99.3°.

[0046] In this embodiment, the adjustment step of the processing beam impact angle is 5°, the diameter of the original input laser beam 41 is φ, and the wavelength is λ. The propagation direction of the original input laser beam 41 is the positive direction of the z-axis, and the propagation direction of the reflected laser beam 42 is the positive direction of the x-axis.

[0047] The first reflector 1, the first wedge mirror 2, the second wedge mirror 3, and the multi-angle wedge mirror 4 of the beam angle adjuster 100 are all made of a uniform K9 glass substrate, and are coated with a 1064nm anti-reflection film on both sides. The wedge angles of the first wedge mirror 2 and the second wedge mirror 3 are 15°, the rotary motion module 35 is a hollow motor with an aperture greater than 30mm, and the first (x-direction) motion module 36, the second (x-direction) motion module 37, and the third (z-direction) motion module 38 are uniform lead screw transmission structures. The multi-angle wedge mirror 4 has three wedge surfaces, with wedge angles of 10.8°, 19.2°, and 26.05°, respectively, and the z-direction width of each wedge surface is 40mm.

[0048] The second reflector (total reflector) 11, the third reflector (movable total reflector) 12, the fourth reflector (movable total reflector) 13, the fifth reflector (movable total reflector) 14, and the first shaping mirror 15 of the reflective processing head 200 are all processed from a K9 glass substrate, and the third reflector 12, the fourth reflector 13, and the fifth reflector 14 are respectively coated with a 52.5° total reflection film, a 45° total reflection film, and a 37.5° total reflection film. The first shaping mirror 15, the second shaping mirror 16, and the third shaping mirror 17 are all focusing mirrors with a diameter of 50 mm and a focus of 500 mm. The angles between the first processing beam 47, the second processing beam 48, and the third processing beam 49 output by the reflective processing head 200 and the second reflected laser beam 46 are 75°, 90°, and 105°, respectively.

[0049] The first motion module 36, the second motion module 37 and the third motion module 38 are controlled so that the second refracted laser beam 44 is irradiated on the 10.8° wedge surface, the 19.2° wedge surface and the 26.05° wedge surface of the multi-angle wedge mirror respectively, and the angles between the third refracted laser beam 45 and the optical axis 20 are approximately 5.7°, 10.7° and 15.7° respectively. That is, by controlling the motion mechanism 300 to rotate around point M, the impact angles of the first processing beam 47, the second processing beam 48 and the third processing beam 49 can be further adjusted.

[0050] Example 2

[0051] The device is used to perform laser shock hardening on the upper edge of the raised surface of the inner wall of a titanium alloy hollow cylinder part. The inner wall of a TC4 titanium alloy hollow cylinder with a thickness of 15 mm and an outer diameter of 200 mm is laser shocked hardened. The inner wall contains a raised surface with a width of 10 mm and a height of 5 mm (the cross-sectional shape is semicircular). The diameter of the original input laser beam 41 is 30 mm and the wavelength is 1064 nm. The angle between the processing beam and the perpendicular line of the optical axis 20 is defined as the impact angle, and the adjustment range of the impact angle is 80.7 to 120.7°.

[0052] In this embodiment, the adjustment step of the processing beam impact angle is 5°, the diameter of the original input laser beam 41 is φ, and the wavelength is λ. The propagation direction of the original input laser beam 41 is the positive direction of the z-axis, and the propagation direction of the first reflected laser beam 42 is the positive direction of the x-axis.

[0053] The first reflector 1, the first wedge mirror 2, the second wedge mirror 3, and the multi-angle wedge mirror 4 of the beam angle adjuster 100 are all made of a uniform K9 glass substrate, and are coated with a 1064nm anti-reflection film on both sides. The wedge angles of the first wedge mirror 2 and the second wedge mirror 3 are 15°, the rotary motion module 35 is a hollow motor with an aperture greater than 30mm, and the first (x-direction) motion module 36, the second (x-direction) motion module 37, and the third (z-direction) motion module 38 are uniform lead screw transmission structures. The multi-angle wedge mirror 4 has three wedge surfaces, with wedge angles of 10.8°, 19.2°, and 26.05°, respectively, and the z-direction width of each wedge surface is 40mm.

[0054] The second reflector (total reflector) 11, the third reflector (movable total reflector) 12, the fourth reflector (movable total reflector) 13, the fifth reflector (movable total reflector) 14, and the first shaping mirror 15 of the reflective processing head 200 are all processed from a K9 glass substrate, and the third reflector 12, the fourth reflector 13, and the fifth reflector 14 are respectively coated with a 52.5° total reflection film, a 45° total reflection film, and a 37.5° total reflection film. The first shaping mirror 15, the second shaping mirror 16, and the third shaping mirror 17 are all focusing mirrors with a diameter of 50 mm and a focus of 500 mm. The angles between the first processing beam 47, the second processing beam 48, and the third processing beam 49 output by the reflective processing head 200 and the second reflected laser beam 46 are 75°, 90°, and 105°, respectively.

[0055] The first motion module 36, the second motion module 37 and the third motion module 38 are controlled so that the second refracted laser beam 44 is irradiated on the 10.8° wedge surface, the 19.2° wedge surface and the 26.05° wedge surface of the multi-angle wedge mirror respectively, and the angles between the third refracted laser beam 45 and the optical axis 20 are approximately 5.7°, 10.7° and 15.7° respectively. That is, by controlling the motion mechanism 300 to rotate around point M, the impact angles of the first processing beam 47, the second processing beam 48 and the third processing beam 49 can be further adjusted.

[0056] It should be clear that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. The present invention is not limited to the specific steps and structures described above and shown in the figures. In addition, for the sake of brevity, a detailed description of known methods and technologies is omitted here.

[0057] The above are only embodiments of the present application and are not limited to the present application. For those skilled in the art, the present application may have various changes and variations without departing from the scope of the present invention. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A semi-enclosed structure inner surface dynamic beam laser shock peening optical path device, characterized in that: The invention comprises a beam angle adjuster (100), a reflective processing head (200) and a motion mechanism (300); the motion mechanism (300) is respectively connected to the beam angle adjuster (100) and the reflective processing head (200) and is used to drive the beam angle adjuster (100) and the reflective processing head (200) to move; the beam angle adjuster (100) can rotate around an optical axis (20) and is used to adjust the incident angle of a laser beam entering the reflective processing head (200); and the reflective processing head (200) is used to perform laser processing on the inner surface of a part (400).

2. The optical path device for dynamic beam laser shock peening of inner surface of a semi-enclosed structure according to claim 1, characterized in that: The beam angle adjuster (100) comprises a first reflecting mirror (1), a first wedge-shaped mirror (2), a second wedge-shaped mirror (3) and a multi-angle wedge-shaped mirror (4); the first wedge-shaped mirror (2) is used to refract a first reflected laser beam (42) reflected by the first reflecting mirror (1) to form a first refracted laser beam (43); the second wedge-shaped mirror (3) is used to refract the first refracted laser beam (43) to form a second refracted laser beam (44) parallel to the optical axis (20); and the multi-angle wedge-shaped mirror (4) is used to refract the second refracted laser beam (44) to form a third refracted laser beam (45).

3. The optical path device for dynamic beam laser shock peening of inner surface of a semi-enclosed structure according to claim 2, characterized in that: The beam angle adjuster (100) further comprises a beam angle adjuster base (10), wherein the first reflector (1), the first wedge-shaped mirror (2), the second wedge-shaped mirror (3) and the multi-angle wedge-shaped mirror (4) are all installed inside the beam angle adjuster base (10) along the direction of the optical axis (20).

4. The optical path device for dynamic beam laser shock peening of inner surface of a semi-enclosed structure according to claim 2, characterized in that: The first wedge mirror (2) is arranged to move along the direction of the optical axis (20) to adjust the distance between the second refracted laser beam (44) and the optical axis (20).

5. The optical path device for dynamic beam laser shock peening of inner surface of a semi-enclosed structure according to claim 2, characterized in that: The beam angle adjuster (100) further comprises a rotational motion module (35), a first motion module (36), a second motion module (37), a third motion module (38) and a fixed seat (39); the fixed seat (39) is mounted on the rotational motion module (35); the first motion module (36), the second motion module (37) and the third motion module (38) are all mounted on the fixed seat (39) and rotate synchronously with the fixed seat (39); the first wedge mirror (2) is mounted on the first motion module (36); the second wedge mirror (3) is mounted on the third motion module (38); the multi-angle wedge mirror (4) is mounted on the second motion module (37); and the rotational motion module (35) is used to drive the fixed seat (39) to rotate around the optical axis (20).

6. The optical path device for dynamic beam laser shock peening of inner surface of a semi-enclosed structure according to claim 2, characterized in that: The laser output surface of the multi-angle wedge mirror (4) has a plurality of wedge surfaces with wedge angles increasing one by one from top to bottom along the z-axis; wherein the number of the wedge surfaces is at least 2, and the z-direction width of each wedge surface is greater than 1.2φ, where φ is the diameter of the original input laser beam (41).

7. The optical path device for dynamic beam laser shock peening of inner surface of a semi-enclosed structure according to claim 2, characterized in that: The reflective processing head (200) comprises a second reflector (11), a third reflector (12), a first shaping mirror (15), a first rotating mechanism (31) and a second rotating mechanism (32); the first rotating mechanism (31) is connected to the second reflector (11) and is used to drive the second reflector (11) to rotate; the second rotating mechanism (32) is connected to the third reflector (12) and is used to drive the third reflector (12) to rotate; the second reflector (11) is used to reflect the third refracted laser beam (45) to form a second reflected laser beam (46); the first shaping mirror (15) is used to form the second reflected light beam (46) reflected by the third reflector (12) into a first processing light beam (47) irradiated on the inner surface of the part (400).

8. The optical path device for dynamic beam laser shock peening of inner surface of a semi-enclosed structure according to claim 7, characterized in that: The reflective processing head (200) further comprises a processing head base (30), and the second reflector (11), the third reflector (12), the first shaping mirror (15), the first rotating mechanism (31) and the second rotating mechanism (32) are all installed inside the processing head base (30).

9. The optical path device for dynamic beam laser shock peening of inner surface of a semi-enclosed structure according to claim 7, characterized in that: The reflective processing head (200) further comprises a fourth reflector (13), a second shaping mirror (16) and a third rotating mechanism (33); the third rotating mechanism (33) is connected to the fourth reflector (13) and is used to drive the fourth reflector (13) to rotate; the second shaping mirror (16) is used to transform the second reflected laser beam (46) reflected by the fourth reflector (13) into a second processing beam (48) for irradiating the inner surface of the part (400).

10. The optical path device for dynamic beam laser shock peening of inner surface of a semi-enclosed structure according to claim 7, characterized in that: The reflective processing head (200) further comprises a fifth reflector (14), a third shaping mirror (17) and a fourth rotating mechanism (34); the fourth rotating mechanism (34) is connected to the fifth reflector (14) and is used to drive the fifth reflector (14) to rotate; the third shaping mirror (17) is used to transform the second reflected laser beam (46) reflected by the fifth reflector (14) into a third processing light beam (49) for irradiating the inner surface of the part (400).

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