Heat dissipation mechanism and solid state disk

Abstract

The invention discloses a heat dissipation mechanism and a solid state disk, and relates to the technical field of solid state disk heat dissipation technologies, and the heat dissipation mechanism comprises an external heat dissipation mechanism and an internal heat dissipation mechanism; the internal heat dissipation mechanism comprises an internal heat dissipation plate which is arranged in the solid state disk and abuts against a circuit board of the solid state disk, fins are formed at the end, away from the circuit board, of the internal heat dissipation plate, and an air channel is formed between every two adjacent fins; the external heat dissipation mechanism comprises an outer heat dissipation plate abutting against the outer wall of a shell of the solid state disk, a wind gathering channel with one end used for being inserted into the solid state disk and facing the inner heat dissipation plate is formed in the outer heat dissipation plate, and a fan blowing air into the wind gathering channel is arranged on the outer heat dissipation plate. The method has the advantages that the heat dissipation effect can be further improved, and the possibility that the solid state disk structure is damaged due to overheating is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of solid state drive heat dissipation technology, and in particular to a heat dissipation mechanism and a solid state drive. Background Art

[0002] Solid State Drive (SSD) is a hard disk made of solid-state electronic storage chip array, which consists of a control unit and a storage unit (FLASH chip, DRAM chip). Compared with traditional mechanical hard disk (HDD), solid state drive has shown significant advantages in many aspects.

[0003] The structure of a solid-state drive is mainly composed of a main control chip, NAND flash memory particles, DRAM cache (some SSDs have it), and a PCB board. The main control chip and NAND flash memory particles are the main heat generating locations. In order to maintain the stable operation of the SSD and extend its service life, reasonable heat dissipation measures need to be taken to reduce its operating temperature.

[0004] Existing methods for dissipating heat for solid-state drives include using a fan inside a chassis to control the airflow to remove heat from the surface of the solid-state drive, or adding a heat dissipation vest to the outside of the solid-state drive to increase the heat dissipation area and thereby improve the heat dissipation effect, or improving the heat dissipation effect by optimizing the internal structure of the solid-state drive.

[0005] However, the above heat dissipation methods are difficult to directly dissipate the heat of the internal structure of the solid-state drive. There is still a possibility that the solid-state drive structure will be damaged due to overheating, which needs further improvement. Summary of the invention

[0006] In order to further improve the heat dissipation effect and reduce the possibility of damage to the solid-state hard disk structure due to overheating, the present application provides a heat dissipation mechanism and a solid-state hard disk.

[0007] In a first aspect, the present application provides a heat dissipation mechanism, which adopts the following technical solution: A heat dissipation mechanism, comprising an external heat dissipation mechanism and an internal heat dissipation mechanism; The internal heat dissipation mechanism comprises an internal heat dissipation plate disposed in the solid state hard disk and abutting against the circuit board of the solid state hard disk, a fin is formed at one end of the internal heat dissipation plate away from the circuit board, and an air duct is formed between adjacent fins; The external heat dissipation mechanism includes an external heat dissipation plate abutting against the outer wall of the solid state hard disk shell, and a wind gathering channel with one end for being plugged into the solid state hard disk and facing the internal heat dissipation plate is formed on the external heat dissipation plate, and a fan for blowing air into the wind gathering channel is arranged on the external heat dissipation plate.

[0008] By adopting the above technical solution, the outer heat sink and the outer wall of the solid state drive are offset against each other, thereby increasing the heat dissipation area. Heat dissipation can be provided by a fan arranged in the chassis, and when the fan is started, the fan can drive the airflow around the outer heat sink to further improve the heat dissipation efficiency. The wind blown out by the fan can enter the interior of the solid state drive through the wind gathering channel and move in the solid state drive through the air duct. Since an internal heat sink and fins are provided, and the internal heat sink and the circuit board are offset against each other, the heat dissipation area of ​​the circuit board can also be increased, and the heat in the solid state drive can be brought out by wind. The internal and external parts of the solid state drive cooperate to dissipate heat, thereby improving the heat dissipation efficiency.

[0009] Optionally, an air gathering groove facing the air gathering channel is formed at one end of the inner heat dissipation plate facing away from the circuit board of the solid state hard disk, and one end of the air duct of the inner heat dissipation plate is connected to the air gathering groove.

[0010] By adopting the above technical solution, the wind gathering slot can first gather the wind and then disperse it more evenly into each air duct, thereby improving the uniformity of heat dissipation and improving the heat dissipation effect.

[0011] Optionally, the fan is arranged at one end of the outer heat dissipation plate away from the inner heat dissipation plate, and a gap is left between the fan and the outer heat dissipation plate.

[0012] By adopting the above technical solution, a gap is left between the fan and the external heat sink, so that when the fan is running, part of the wind can be discharged from the gap and then move along the outer wall of the external heat sink, thereby improving the heat dissipation efficiency of the external heat sink.

[0013] Optionally, a mounting groove is formed at one end of the external heat dissipation plate away from the solid state drive, the fan faces the mounting groove, an active hole is formed on an inner wall of the mounting groove, and the wind gathering channel passes through the active hole.

[0014] By adopting the above technical solution, a mounting groove is provided at the end of the external heat sink away from the solid state hard disk, the fan is opposite to the mounting groove, a movable hole is provided on the inner wall of the mounting groove, and the wind gathering channel is passed through the movable hole, thereby achieving stable installation of the fan and effective positioning of the wind gathering channel, ensuring that the airflow is smoothly and efficiently introduced into the solid state hard disk for internal heat dissipation, and most of the wind blown out by the fan is first gathered in the mounting groove, and can be gathered in the wind gathering channel to enter the solid state hard disk.

[0015] Optionally, the wind gathering channel is slidably connected to the external heat dissipation plate through a movable hole, a mounting edge is provided at one end of the wind gathering channel located in the mounting groove, and a first elastic member is provided between the mounting edge and the inner wall of the mounting groove.

[0016] By adopting the above technical solution, when the external heat dissipation mechanism is installed with the solid-state hard disk, the wind gathering channel can be appropriately shrunk to reduce the impact on the installation of the two. When the external heat dissipation mechanism is installed at a suitable position on the solid-state hard disk, the wind gathering channel can be plugged into the solid-state hard disk under the action of the reset force of the first elastic member. At the same time, it can be automatically reset by the first elastic member when not affected by external force, thereby improving the stability of the heat dissipation channel.

[0017] Optionally, the external heat dissipation mechanism is provided in two groups, and is respectively located on two sides of the solid state drive; Two groups of internal heat dissipation mechanisms are provided and are respectively located on two sides of the circuit board of the solid state hard disk.

[0018] By adopting the above technical solution, the number of external heat dissipation mechanisms and internal heat dissipation mechanisms is doubled, which can further improve the heat dissipation effect and improve the heat dissipation uniformity.

[0019] In a second aspect, the present application discloses a solid state hard disk, which adopts the following technical solution: A solid state hard disk, using any of the heat dissipation mechanisms described above, further comprising two detachably connected housings, and a circuit board located between the two housings; One or both of the shells are provided with a through hole for the wind gathering channel to pass through.

[0020] By adopting the above technical solution, the solid-state hard disk has an efficient internal and external heat dissipation structure. The external heat dissipation mechanism and the internal heat dissipation mechanism work together to ensure that the heat can be quickly conducted and discharged when the solid-state hard disk is running. The wind-collecting channel on the external heat sink cooperates with the air duct design of the internal heat sink so that the airflow is concentrated on the fins inside the solid-state hard disk, thereby improving the heat dissipation efficiency. A fan is provided at the end of the external heat sink away from the internal heat sink to further enhance the heat dissipation effect. In addition, the solid-state hard disk includes two detachably connected shells and a circuit board therebetween, and one or both of the shells are provided with a through hole for the wind-collecting channel to pass through, so as to facilitate the effective combination of the external heat dissipation mechanism and the internal heat dissipation structure, thereby further improving the heat dissipation performance.

[0021] Optionally, a vent is provided on a side wall opposite to the solid state hard disk, and an end of the air duct away from the wind collecting groove faces the side wall of the solid state hard disk where the vent is provided.

[0022] By adopting the above technical solution, the wind entering the solid state hard disk can carry the heat and then bring the heat out through the ventilation holes, thereby achieving smooth opening of the air path and improving the heat dissipation effect.

[0023] Optionally, a closing piece for closing the through hole is detachably connected to the shell.

[0024] By adopting the above technical solution, when the solid state drive is not in use, the through hole can be closed by the closing member to improve the protection effect and reduce damage to the internal structure of the solid state drive. When in use, the closing member is removed to expose the through hole.

[0025] Optionally, a slide groove is provided on the shell, and the through hole is provided on the inner wall of the slide groove. A closing member for opening and closing the through hole is slidably connected in the slide groove, and a second elastic member is provided between the closing member and the inner wall of the slide groove. A guide surface is provided on the surface of the closing member, and when the wind gathering channel pushes the guide surface, it can drive the closing member to move toward the direction of the second elastic member and compress the second elastic member.

[0026] By adopting the above technical solution, when the solid-state hard disk is not in use, the through hole can be closed by the closing member to improve the protection effect and reduce damage to the internal structure of the solid-state hard disk. When in use, the closing member can be pushed through the wind gathering channel to move and compress the second elastic member to expose the through hole. The elastic force of the second elastic member also makes the connection between the external heat dissipation mechanism and the solid-state hard disk more stable.

[0027] In summary, the present application includes at least one of the following beneficial effects: 1. The setting of the inner heat sink and the outer heat sink can effectively increase the heat dissipation area of ​​the solid state drive, and guide the airflow through the fins and air duct design on the inner heat sink to improve the heat dissipation efficiency; 2. The wind collecting channel of the external heat dissipation mechanism cooperates with the wind collecting slot on the internal heat dissipation plate, so that the fan air can be directly aimed at the fins, which enhances the heat exchange between the internal and external heat dissipation mechanisms and improves the heat dissipation uniformity; 3. The fan blows air in the wind channel of the heat sink, which allows the airflow to be more concentratedly directed to the important heat-generating components inside the solid-state drive, improving the heat dissipation effect and meeting the heat dissipation requirements under high-load conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the overall explosion structure of Example 1 of the present application; Figure 2 is a schematic cross-sectional structure diagram of Example 1 of the present application; Figure 3 is a schematic diagram of the exploded structure of the solid state drive in Example 1 of the present application; Figure 4 is a schematic structural diagram showing an external heat dissipation mechanism in Example 1 of the present application; Figure 5 It is a schematic diagram of the overall explosion structure of Example 2 of the present application.

[0029] Explanation of the reference numerals: 1. External heat dissipation mechanism; 11. External heat sink; 111. Mounting groove; 112. Movable hole; 12. Side panel; 13. Fan seat; 131. Fan; 14. Wind gathering channel; 141. Mounting edge; 142. First elastic member; 2. Internal heat dissipation mechanism; 21. Internal heat sink; 211. Fin; 212. Air duct; 213. Wind gathering groove; 3. Solid-state hard disk; 31. Housing; 311. Through hole; 312. Closing member; 313. Slide groove; 314. Second elastic member; 315. Guide surface; 316. Ventilation hole; 32. Circuit board. DETAILED DESCRIPTION

[0030] The following will be combined with the attached Figure 1-5 , the technical solutions in the embodiments of the present invention are clearly and completely described. The described embodiments are only possible technical implementations of the present invention, not all possible implementations. Those skilled in the art can completely combine the embodiments of the present invention to obtain other embodiments without creative work, and these embodiments are also within the scope of protection of the present invention.

[0031] The inventor of the present application has found that the solid state drive 3, as an important storage device, has obvious advantages in data reading and writing speed, shock resistance, etc., and is therefore widely used in computers, servers, etc. However, as the workload of the solid state drive 3 continues to increase, its heat generation is also increasing. If not properly handled, the performance of the solid state drive 3 may be reduced or even damaged, seriously affecting the operating stability and service life of the device.

[0032] To this end, the present application mainly adopts the following scheme: a heat dissipation mechanism, including an external heat dissipation mechanism 1 and an internal heat dissipation mechanism 2, specifically adopting the design of an internal heat dissipation plate 21 of the internal heat dissipation mechanism 2 and an air gathering channel 14 of the external heat dissipation mechanism 1, and being arranged on the solid-state hard disk 3, thereby achieving the effect of significantly improving the heat dissipation efficiency of the solid-state hard disk 3. The present application is further described in detail below.

[0033] Example 1 The present application embodiment provides a heat dissipation mechanism and a corresponding solid state hard disk 3 for use with the same. Figure 1 and Figure 2, wherein the structure of the solid state drive 3 is basically the same as that of the existing solid state drive 3, including two detachably connected shells 31, and a circuit board 32 located between the two shells 31 (because it is a conventional structure and is not the focus of the invention of this application, it will not be described in detail, and is also briefly drawn in the accompanying drawings). The two shells 31 can be disassembled by snap-on connection, or connected by bolts, so as to facilitate the disassembly and replacement of the internal structure of the solid state drive 3. In order to avoid damage to the corresponding structure due to excessive clamping force during the connection of the shells 31, the two shells 31 can also be elastically connected. A circle of elastic parts, such as a spring, is set at the connection of the shells 31. The spring can be a coil spring, and the diameter can be set to between 5mm and 10mm, for example, set to 6mm, to ensure the stability of the connection.

[0034] Reference Figure 1 and Figure 3 , one or both of the shells 31 have through holes 311 on their surfaces. This application takes the case where both shells 31 have two through holes 311 as an example. The two shells 31 are connected to form the shell of the solid state drive 3. The two opposite side walls of the shell of the solid state drive 3 are provided with a plurality of ventilation holes 316, so that the air inside and outside the solid state drive 3 can be connected, so that the heat inside the solid state drive 3 can be taken out through the airflow.

[0035] The solid-state hard disk 3 also includes a closing piece 312. The number of closing pieces 312 and through holes 311 is the same, and they are snap-fitted with the through holes 311 one by one. When the through holes 311 need to be used, the closing piece 312 can be removed; if the through holes 311 are not needed, the closing piece 312 closes the through holes 311, which can reduce the entry of dust, moisture, etc., and reduce electromagnetic interference between the solid-state hard disk 3 and other items in the chassis, thereby protecting the solid-state hard disk 3.

[0036] Reference Figure 2 and Figure 3 The heat dissipation mechanism includes an external heat dissipation mechanism 1 and an internal heat dissipation mechanism 2, wherein the internal heat dissipation mechanism 2 includes an internal heat dissipation plate 21 disposed in the solid state drive 3 and abutting against the circuit board 32 of the solid state drive 3. In the present application, the internal heat dissipation plate 21 can be directly fixed to the circuit board 32 by bolts or clamping, and the internal heat dissipation plate 21 can abut against the components on the circuit board 32. To reduce interference, the position of the internal heat dissipation plate 21 or the shape of the surface facing the circuit board 32 can also be appropriately adjusted. A fin 211 is formed at one end of the internal heat dissipation plate 21 away from the circuit board 32, and an air duct 212 is formed between adjacent fins 211.

[0037] Specifically, the structural feature of the inner heat sink 21 can be a plate form, the thickness can be 0.5mm to 1.5mm, and the material is mostly copper or aluminum to improve the thermal conductivity. For example, the thickness of the heat sink body is set to 1mm, and the material is copper; the width of the fin 211 can be 1.5mm to 5mm, the thickness is 0.2mm to 0.5mm, and the structural feature can be a flat thin plate. For example, the width of the fin 211 is set to 3mm, and the thickness is set to 0.3mm. The heat dissipation effect is optimized by adjusting the spacing between the fins 211. The spacing can be adjusted to between 3mm and 7mm. For example, the present application takes the spacing as 5mm as an example, that is, the width of the air duct 212 is 5mm.

[0038] Reference Figure 2 and Figure 3 , a wind collecting groove 213 corresponding to the position of the through hole 311 is formed on the inner heat dissipation plate 21. The size of the wind collecting groove 213 can be designed according to the specific shape of the inner heat dissipation plate 21, and the wind collecting groove 213 is connected to the air duct 212 formed on the inner heat dissipation plate 21, that is, one end of the air duct 212 is connected to the wind collecting groove 213, and the end of the air duct 212 away from the wind collecting groove 213 is directly facing the air vent 316 of the outer shell of the solid state drive 3, or facing the surface of the housing 31 where the air vent 316 is provided.

[0039] Reference Figure 2 and Figure 4 The external heat dissipation mechanism 1 is a vest with a cross-section that is approximately "U"-shaped, and includes two external heat dissipation plates 11 that abut against the outer wall of the shell 31 of the solid state drive 3, and a side plate 12 fixed to the same end of the two external heat dissipation plates 11. The external heat dissipation plates 11 are formed with an end of a wind gathering channel 14 that is used to be plugged into the solid state drive 3 and faces the fins 211. The wind gathering channels 14 can be plugged into the through holes 311 one by one and face the wind gathering grooves 213. A fan seat 13 is fixed to the external heat dissipation plate 11, and a fan 131 is provided on the fan seat 13 for blowing air into the wind gathering channel 14. The blown air can enter the wind gathering groove 213 through the wind gathering channel 14, and move along the air duct 212 to the air vents 316, and the heat on the internal heat dissipation plate 21 is taken away by the airflow, thereby achieving the effect of significantly improving the heat dissipation efficiency of the solid state drive 3. In the present application, the fins 211 can abut against the inner wall of the housing 31, thereby further guiding the heat on the circuit board 32 to the inner heat sink 21 and taking it away by wind, or directly guiding it to the housing 31 and taking it away by the outer heat sink 11. In some preferred embodiments of the present application, guide blades can be further provided inside the wind gathering channel 14, for example, 4 guide blades are provided to improve the airflow efficiency.

[0040] Reference Figure 1 and Figure 2, the fan 131 can be an axial flow fan 131, a centrifugal fan 131, etc. In the present embodiment, the axial flow fan 131 is preferably used because it has a higher air volume output and a simple structure. The specific size and parameters of the fan 131 can be adjusted according to the actual heat dissipation requirements, for example, the diameter can be set to between 50 mm and 100 mm. The number of blades of the fan 131 can be 3 to 8, and the blade angle is adjusted according to the actual heat dissipation requirements. It is generally recommended to be set to between 20 degrees and 40 degrees, for example, to 30 degrees. The specific shape of the blade can be rectangular or curved, for example, curved blades are used to increase the air volume. The axial flow fan 131 can also be replaced by a centrifugal fan 131, and in the present application, the fan 131 can also be an air suction type, and cooling can also be achieved through the air duct 212, the wind gathering groove 213 and the air vents 316.

[0041] The fan seat 13 and the outer heat sink 11 are detachably connected by bolts or the like, and a gap is left between the side wall of the fan seat 13 and the outer heat sink 11, so that part of the wind blown out by the fan 131 can move along the surface of the outer heat sink 11, thereby dissipating the heat from the outer heat sink 11.

[0042] The external heat sink 11 is made of aluminum alloy plate, and the thickness can be set to between 2mm and 5mm, for example, set to 3mm, to ensure its structural stability. A mounting groove 111 is provided on the external heat sink 11, and the fan 131 is directly opposite to the mounting groove 111. The depth of the mounting groove 111 can be set to between 15mm and 30mm, for example, set to 20mm. The width of the mounting groove 111 can be designed according to the size of the fan 131. A dustproof net can also be added to the mounting groove 111 to prevent dust from entering the fan blade area, for example, a galvanized steel wire mesh is used. The inner wall of the mounting groove 111 can be provided with reinforcing ribs to improve the overall structural rigidity.

[0043] Reference Figure 2 and Figure 4, an active hole 112 is provided on the inner wall of the mounting groove 111 facing the fan 131, and the wind gathering channel 14 is penetrated in the active hole 112. The size of the active hole 112 can be designed according to the specific requirements of the wind gathering channel 14, and the inner diameter of the active hole 112 can be set to between 10 mm and 20 mm, for example, set to 15 mm, so as to ensure that the wind gathering channel 14 can pass smoothly. A mounting edge 141 is provided at one end of the wind gathering channel 14, and the other end is inserted into the solid state drive 3 toward the fin 211 on the inner heat dissipation plate 21. In order to ensure a stable connection between the wind gathering channel 14 and the active hole 112, and to facilitate the movement of the wind gathering channel 14, a first elastic member 142, such as a spring, can be provided and installed between the mounting edge 141 and the inner wall of the mounting groove 111, so as to enable the wind gathering channel 14 to be slidably connected in the active hole 112. The elastic force of the first elastic member 142 can adjust the telescopic range of the wind gathering channel 14. When the external heat dissipation mechanism and the solid state drive 3 are installed, the wind gathering channel 14 can be pressed against the outer wall of the solid state drive 3 to move and compress the first elastic member 142. When the wind gathering channel 14 and the through hole 311 are aligned, the elastic force of the first elastic member 142 can make the wind gathering channel 14 plug into the through hole 311 and maintain stability. To facilitate the disassembly of the external heat dissipation mechanism 1 and the solid state drive 3, the external heat dissipation plate 11 can be detachably connected to the side plate 12, or the side wall of the wind gathering channel 14 can be set as an arc surface or other guiding inclined surface to facilitate the separation of the external heat dissipation mechanism and the solid state drive 3.

[0044] The implementation principle of this embodiment is as follows: the inner heat sink 21 is arranged inside the solid state drive 3 and is in close contact with the circuit board 32 of the solid state drive 3, so that the heat on the circuit board 32 can be effectively absorbed. The fins 211 on the inner heat sink 21 increase the heat dissipation contact area, further improving the heat dissipation efficiency. The external heat dissipation mechanism 1 blows air into the wind gathering channel 14 through the fan 131, guides the cooling air into the solid state drive 3, and then takes away the heat through the internal heat dissipation mechanism 2, and through the gap between the fan seat 13 and the outer heat sink 11, part of the wind can also move along the outer wall of the outer heat sink 11 to take away the heat on the outer heat sink 11.

[0045] In this way, the overall heat dissipation efficiency is effectively improved, and the problem of uneven heat dissipation in traditional heat dissipation methods is avoided, thereby extending the service life of the solid state drive 3 and improving its reliability.

[0046] Example 2 The difference between this embodiment and the above-mentioned embodiment 1 is that: Figure 4 and Figure 5The shell body 31 is provided with a slide groove 313, and the through hole 311 is provided on the inner wall of the slide groove 313. A closing piece 312 for opening and closing the through hole 311 is slidably connected in the slide groove 313. A second elastic piece 314 is provided between the closing piece 312 and the inner wall of the slide groove 313. A guide surface 315 is provided on the surface of the closing piece 312. When the wind gathering channel 14 pushes the guide surface 315, the closing piece 312 can be driven to move toward the second elastic piece 314 and compress the second elastic piece 314. Specifically, the second elastic piece 314 can be a spring or a spring. Through the above method, during installation, there is no need to remove the closing piece 312. The closing piece 312 can be directly pushed to move by the movement of the wind gathering channel 14. Through the first elastic piece 142 and the second elastic piece 314, the connection stability between the external heat dissipation mechanism and the solid state drive 3 is improved.

[0047] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A heat dissipation mechanism, characterized in that: It comprises an external heat dissipation mechanism (1) and an internal heat dissipation mechanism (2); The internal heat dissipation mechanism (2) comprises an internal heat dissipation plate (21) disposed in the solid state hard disk (3) and abutting against a circuit board (32) of the solid state hard disk (3); a fin (211) is formed at one end of the internal heat dissipation plate (21) facing away from the circuit board (32); and an air duct (212) is formed between adjacent fins (211); The external heat dissipation mechanism (1) comprises an external heat dissipation plate (11) abutting against the outer wall of the outer shell of the solid state hard disk (3), the external heat dissipation plate (11) is formed with an air gathering channel (14) having one end for being plugged into the solid state hard disk (3) and facing the internal heat dissipation plate (21), and the external heat dissipation plate (11) is provided with a fan (131) for blowing air into the air gathering channel (14).

2. A heat dissipation mechanism according to claim 1, characterized in that: An air gathering groove (213) facing the air gathering channel (14) is formed at one end of the inner heat dissipation plate (21) away from the circuit board (32) of the solid state hard disk (3), and one end of the air duct (212) of the inner heat dissipation plate (21) is connected to the air gathering groove (213).

3. A heat dissipation mechanism according to claim 1, characterized in that: The fan (131) is arranged at one end of the outer heat dissipation plate (11) away from the inner heat dissipation plate (21), and a gap is left between the fan (131) and the outer heat dissipation plate (11).

4. A heat dissipation mechanism according to claim 3, characterized in that: An installation slot (111) is provided at one end of the external heat dissipation plate (11) away from the solid state hard disk (3); the fan (131) is directly opposite to the installation slot (111); an active hole (112) is provided on the inner wall of the installation slot (111); and the wind gathering channel (14) is provided in the active hole (112).

5. A heat dissipation mechanism according to claim 4, characterized in that: The wind gathering channel (14) is slidably connected to the outer heat dissipation plate (11) via a movable hole (112); a mounting edge (141) is provided at one end of the wind gathering channel (14) located in the mounting groove (111); and a first elastic member (142) is provided between the mounting edge (141) and the inner wall of the mounting groove (111).

6. A heat dissipation mechanism according to claim 1, characterized in that: The external heat dissipation mechanism (1) is provided in two groups and is respectively located on two sides of the solid state hard disk (3); Two groups of internal heat dissipation mechanisms (2) are provided and are respectively located on two sides of a circuit board (32) of the solid state hard disk (3).

7. A solid state hard disk, using the heat dissipation mechanism according to any one of claims 1 to 6, characterized in that: It also includes two detachably connected housings (31), and a circuit board (32) located between the two housings (31); One or both of the shells (31) are provided with a through hole (311) for the wind gathering channel (14) to pass through.

8. A solid state hard disk according to claim 7, characterized in that: A ventilation hole (316) is provided on the side wall opposite to the solid state hard disk (3), and the end of the air duct (212) away from the air collecting groove (213) faces the side wall of the solid state hard disk (3) where the ventilation hole (316) is provided.

9. The solid state hard disk according to claim 7, characterized in that: A closing piece (312) for closing the through hole (311) is detachably connected to the housing (31).

10. The solid state hard disk according to claim 7, characterized in that: The shell (31) is provided with a slide groove (313), the through hole (311) is provided on the inner wall of the slide groove (313), a closing member (312) for opening and closing the through hole (311) is slidably connected in the slide groove (313), a second elastic member (314) is provided between the closing member (312) and the inner wall of the slide groove (313), a guide surface (315) is provided on the surface of the closing member (312), and when the wind gathering channel (14) pushes the guide surface (315), the closing member (312) can be driven to move toward the second elastic member (314) and compress the second elastic member (314).

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