Degumming machine and degumming method based on visual inspection

Abstract

The invention provides a degumming machine and a degumming method based on visual inspection, and belongs to the field of silicon wafer processing.The degumming machine comprises a spraying device, a degumming device, a rinsing device, a degumming working streamline, a degumming rack, a movable clamping jaw module, a feeding trolley and a degumming detection assembly; the degumming device and the rinsing device are transversely arranged side by side and share the transverse moving cover plate assembly, the degumming detection assembly collects images of glued positions of silicon wafers in the silicon wafer material basket through the optical assembly and judges whether the images reach the degumming standard or not, the degumming detection efficiency is high, the degumming yield is guaranteed, and the working efficiency is improved. And the method is convenient to popularize and apply in the fields of degumming, cleaning and the like of silicon wafers in photovoltaic and semiconductor industries.

Description

Technical Field

[0001] The invention belongs to the field of silicon wafer processing, and in particular relates to a degumming machine and a degumming method based on visual detection. Background Art

[0002] In the process of silicon wafer preparation, degumming is an important process, because the silicon rod needs to be coated with glue before cutting. The uncut silicon rod is stuck under a separate adhesive board and then cut. After cutting, the adhesive board and the cut silicon wafers stuck under the adhesive board are placed in the degumming tool as a whole (the upper part of the degumming tool carries the adhesive board and is moved away with the subsequent actions), and sent to the degumming machine. After the subsequent degumming process, the silicon wafer falls off the adhesive board and falls into the degumming tool. In the prior art, after the degumming is completed, it is necessary to manually observe whether there is residual glue on the silicon wafer with the eyes. This method is inefficient and has poor accuracy. With the development of machine vision, it is hoped to design a degumming device based on visual image processing. Summary of the invention

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a degumming machine and a degumming method based on visual detection, which can solve the above problems.

[0004] A degumming machine comprises a degumming device, a mobile clamping claw module and a degumming detection component. The mobile clamping claw module is used for picking up and spatially transferring a silicon wafer basket. The degumming detection component collects images of the glued parts of silicon wafers in the silicon wafer basket through an optical component.

[0005] Furthermore, the degumming machine also includes a rinsing device, and the degumming device and the rinsing device are arranged side by side laterally and share a transverse cover plate assembly.

[0006] Furthermore, the degumming machine also includes a degumming work flow line and a loading cart, the loading cart is arranged upstream of the degumming work flow line, and the degumming device is arranged at a degumming station downstream of the loading cart.

[0007] Furthermore, the degumming machine also includes a spraying device for pre-cleaning the silicon wafers in the silicon wafer basket before degumming, and the loading vehicle and the spraying device are arranged upstream of the degumming work flow line.

[0008] Furthermore, the mobile gripper module is a gripper module driven by a robot arm or a driving beam. The robot arm is installed and fixed on the ground outside the degumming device or the rinsing device. The gripper module drives the gripper to pick up the flower basket through the X-axis and Y-axis driving beam modules installed on the degumming frame and its own Z-axis driving module.

[0009] Furthermore, the degumming detection component adopts a fixed and / or mobile image acquisition module, which is arranged on the degumming workflow line, the mobile clamping claw module and / or the degumming rack.

[0010] The present invention also provides a degumming method based on visual detection. The degumming method is implemented based on the above-mentioned degumming machine. The degumming method includes the following steps.

[0011] Degumming: the silicon wafer basket is degummed in the degumming device.

[0012] Detection: The degumming detection component collects images of the degumming silicon wafer basket. If it meets the degumming standard, the degumming is terminated and the material is unloaded. If it does not meet the degumming standard, the degumming is repeated until it meets the standard.

[0013] Furthermore, a pre-cleaning step is provided before degumming, and the mobile clamping claw module moves the silicon wafer basket delivered by the loading vehicle into the spraying device for spray cleaning.

[0014] Furthermore, a post-cleaning step is provided after the degumming step, in which the degummed silicon wafer basket is moved into a rinsing device for vibration rinsing.

[0015] Furthermore, in the detection step, the debonding detection component collects the side image, bottom image and top image of the silicon wafer and the wafer tray in the silicon wafer basket, and fits the contour image of the silicon wafer on the glued surface through image processing, and compares it with the standard image to identify whether there is a debonding defect.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: the present application adopts a degumming detection component to collect images of silicon wafers after degumming to determine whether the degumming standard is met, has a high degumming detection efficiency, ensures the degumming yield rate, and is convenient for promotion and application in the fields of degumming and cleaning of silicon wafers in the photovoltaic and semiconductor industries. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 and Figure 2 Schematic diagrams of the degumming machine of the present invention from different viewing angles;

[0018] Figure 3 Flow chart of the degumming method.

[0019] In the figure,

[0020] 100. Spraying device;

[0021] 200. Degumming device;

[0022] 300, rinsing device;

[0023] 400, degumming workflow;

[0024] 500, degumming rack;

[0025] 600, mobile clamping claw module; 610, clamping claw three-axis driving assembly; 620, clamping claw module;

[0026] 700, loading car;

[0027] 800, transverse cover assembly;

[0028] 900. Debonding detection component. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Degumming machine

[0031] A degumming machine, see Figure 1 and Figure 2 The degumming machine includes a spray device 100, a degumming device 200, a rinsing device 300, a degumming workflow 400, a degumming frame 500, a mobile clamping module 600, a loading vehicle 700 and a degumming detection assembly 900. The degumming device 200 and the rinsing device 300 are arranged side by side in a horizontal direction and share a transverse cover assembly 800.

[0032] Layout relationship: the degumming workflow line 400 is arranged longitudinally, the loading vehicle 700 and the spray device 100 are arranged upstream of the degumming workflow line 400, and the degumming device 200 and the rinsing device 300 are arranged downstream of the spray device 100; the mobile clamping claw module 600 is arranged on the degumming rack 500 for picking up and spatially transferring the silicon wafer basket; the degumming detection component 900 collects images of the glued parts of the silicon wafers in the silicon wafer basket through optical components.

[0033] Among them, the degumming frame 500 adopts a gantry structure, a steel beam structure, etc., and can be installed with a mobile clamping claw module 600, a dosing tank module, a longitudinal top beam support seat, etc.

[0034] Among them, the mobile gripper module 600 is a gripper module driven by a robot arm or a driving beam. The robot arm is installed and fixed on the ground outside the degumming device 200 or the rinsing device 300. The gripper module drives the gripper to pick up the material basket through the X-axis and Y-axis driving beam modules installed on the degumming frame 500 and its own Z-axis driving module.

[0035] In the example, a clamping module driven by a driving beam is adopted, and the mobile clamping module 600 includes a clamping three-axial driving component 610 and a clamping component 620. The clamping component 620 is arranged at the lower part of the clamping three-axial driving component 610, and is used to pick up the silicon wafer basket. The clamping three-axial driving component 610 is mounted on the degumming frame 500 through the driving beam, and is used to realize the spatial movement of the clamping component 620 in the X direction, the Y direction and the Z direction. The clamping three-axial driving component 610 can adopt the three-dimensional space driving mechanism commonly used in the field. This example adopts: the crossbeam and the longitudinal beam are matched with the driving motor and the gear rack structure, and the Z direction is also driven by the motor and the gear rack. Of course, linear motors, synchronous belt drives and other methods can also be used.

[0036] Because the degumming and rinsing unit below includes a degumming device 200 and a rinsing device 300, in the preferred example, the mobile clamping claw module 600 uses two clamping claw assemblies 620. Of course, the clamping claw triaxial drive assembly 610 also uses two, but the X-direction and Y-direction parts are shared, while the Z-direction is divided into two independent ones. Of course, in other examples, two mobile clamping claw modules 600 can also be used.

[0037] On the top of the spray device 100 , only one clamping jaw three-axial driving assembly 610 and one clamping jaw assembly 620 need to be provided.

[0038] Furthermore, a liquid medicine monitoring unit is provided on the degumming machine frame 500, and the liquid medicine monitoring unit monitors the concentration and liquid level of the medicine in the medicine adding box online, and automatically adds and replenishes the medicine.

[0039] Furthermore, the degumming detection component 900 adopts a fixed and / or mobile image acquisition module, which is arranged on the degumming workflow line 400, the mobile clamping module 600 and / or the degumming rack 500.

[0040] In a specific example, a degumming detection component 900 can be set up near the degumming workflow line 400 at the degumming station, and the form includes a detection slide rail and a detection camera lens. The detection camera lens can be moved by the detection slide rail to face the silicon wafer basket placed on the degumming workflow line 400. Of course, in addition to the longitudinal reciprocating movement along the degumming workflow line 400, the detection camera lens can also extend and retract the lens horizontally and lift and lower vertically. The lifting mode can also adopt a driving slide rail or a linear motor.

[0041] In another example, the debonding detection component 900 is provided with a lifting drive rail or a linear motor by setting driving beams in the X-direction and the Y-direction of the mobile clamping module 600 on the debonding frame 500.

[0042] In another example, the debonding detection component 900 can be integrated on the mobile gripper module 600, whether it is a robot arm mode or a gripper module mode driven by a driving beam, so that image acquisition can be performed more freely in space.

[0043] Embodiment 1

[0044] A degumming machine includes a degumming device 200, a degumming workflow line 400, a mobile clamping module 600 and a degumming detection assembly 900. Of course, the degumming workflow line 400 may not be required, and the silicon wafer basket may be transferred manually or by using the mobile clamping module 600.

[0045] Embodiment 2

[0046] A degumming machine includes a degumming device 200, a rinsing device 300, a degumming workflow 400, a mobile clamping module 600 and a degumming detection assembly 900. The degumming device 200 and the rinsing device 300 are arranged side by side in a transverse direction and share a transverse cover assembly 800. The rinsing device 300 is provided for cleaning after degumming, i.e., post-cleaning, to facilitate detection or unloading after cleaning.

[0047] Embodiment 3

[0048] A degumming machine includes a degumming device 200, a rinsing device 300, a degumming workflow 400, a mobile clamping claw module 600, a loading vehicle 700 and a degumming detection assembly 900. The degumming device 200 and the rinsing device 300 are arranged side by side in a transverse direction and share a transverse cover assembly 800.

[0049] The loading vehicle 700 is arranged upstream of the degumming work line 400, and the degumming device 200 is arranged at the degumming station downstream of the loading vehicle 700. The loading vehicle 700 can be a manual cart, an AGV transporter, etc., and the present solution preferably uses a manual cart.

[0050] Embodiment 4

[0051] A degumming machine includes a spray device 100, a degumming device 200, a rinsing device 300, a degumming workflow 400, a mobile clamping claw module 600, a loading vehicle 700 and a degumming detection assembly 900. The degumming device 200 and the rinsing device 300 are arranged side by side in a transverse direction and share a transverse cover assembly 800.

[0052] The spray device 100 is used for pre-cleaning the silicon wafers in the silicon wafer basket before degumming. The loading vehicle 700 and the spray device 100 are arranged upstream of the degumming workflow 400.

[0053] In a specific example, a group of spray devices 100, degumming devices 200, rinsing devices 300, and loading vehicles 700 are symmetrically arranged on both sides of the degumming workflow 400 to improve the overall efficiency.

[0054] The spray device 100, the degumming device 200, and the rinsing device 300 all include a box, an inner support frame group, and a hydraulic control component (for water inlet and outlet control). The hydraulic control component of the spray device 100 includes three groups of spray pipe groups at different angles, which are used to spray the upper, middle, and lower parts of the silicon wafer; the degumming device 200 also includes a heating component, a bubbling component, and a degumming spray component; the rinsing device 300 also includes a heating component, a bubbling component, and a rinsing vibration component. The rinsing vibration component is arranged in the box outside the inner support frame group to provide vibration waves to improve the rinsing effect. Ultrasonic vibration is preferably used, and the form can be a vibration plate and / or a vibration rod, such as an ultrasonic vibration plate, an ultrasonic vibration rod, etc.

[0055] Degumming method

[0056] A degumming method based on visual inspection, the degumming method is implemented based on the above-mentioned degumming machine, see Figure 3 , the degumming method comprises the following steps.

[0057] During pre-cleaning, the mobile clamping module 600 moves the silicon wafer basket delivered by the loading vehicle 700 into the spraying device 100 for spray cleaning.

[0058] Degumming: the silicon wafer basket is degummed in the degumming device 200 .

[0059] After cleaning, the debonded silicon wafer basket is moved into the rinsing device 300 for vibration rinsing.

[0060] Detection: The degumming detection component 900 collects images of the silicon wafer basket that has been degummed. If the degumming standard is met, the degumming is terminated; if the degumming standard is not met, the degumming is repeated until the standard is met.

[0061] Unloading: The mobile clamping module 600 transports the silicon wafer basket that meets the debonding standard to the unloading station for unloading.

[0062] The post-cleaning step can be set before or after the test. Before the test, it is convenient for the test; after the test, it saves the process, and the material can be directly unloaded after the post-cleaning is completed.

[0063] Among them, in the detection step, the debonding detection component 900 collects the side image, bottom image and top image of the silicon wafer and the crystal tray in the silicon wafer basket, and fits the contour image of the silicon wafer on the glued surface through image processing, and compares it with the standard image to identify whether there is a debonding defect.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A degumming machine, comprising a degumming device (200), a movable clamping claw module (600) and a degumming detection component (900), characterized in that: The mobile clamping claw module (600) is used for picking up and spatially transferring the silicon wafer basket; the debonding detection component (900) collects images of the glued areas of the silicon wafers in the silicon wafer basket through an optical component.

2. The degumming machine according to claim 1, characterized in that: The degumming machine further comprises a rinsing device (300), wherein the degumming device (200) and the rinsing device (300) are arranged side by side in a transverse direction and share a transverse cover plate assembly (800).

3. The degumming machine according to claim 1 or 2, characterized in that: The degumming machine further comprises a degumming work line (400) and a loading vehicle (700), wherein the loading vehicle (700) is arranged upstream of the degumming work line (400), and the degumming device (200) is arranged at a degumming station downstream of the loading vehicle (700).

4. The degumming machine according to claim 3, characterized in that: The degumming machine further comprises a spraying device (100) for pre-cleaning the silicon wafers in the silicon wafer basket before degumming. The loading vehicle (700) and the spraying device (100) are arranged upstream of the degumming work flow line (400).

5. The degumming machine according to claim 4, characterized in that: The mobile gripper module (600) is a gripper module driven by a robot arm or a driving beam. The robot arm is installed and fixed on the ground outside the degumming device (200) or the rinsing device (300). The gripper module drives the gripper to pick up the material basket through the driving beam modules in the X and Y directions installed on the degumming machine frame (500) and its own driving module in the Z direction.

6. The degumming machine according to claim 5, characterized in that: The degumming detection assembly (900) adopts a fixed and / or mobile image acquisition module, which is arranged on the degumming workflow line (400), the mobile clamping claw module (600) and / or the degumming rack (500).

7. A degumming method based on visual detection, characterized in that: The degumming method is implemented based on the degumming machine according to claim 5, and the degumming method comprises: Degumming, the silicon wafer basket is degummed in a degumming device (200); Detection: The degumming detection component (900) collects images of the degumming silicon wafer basket. If the degumming standard is met, the degumming is terminated and the material is unloaded. If the degumming standard is not met, the degumming is repeated until the standard is met.

8. The degumming method according to claim 7, characterized in that: A pre-cleaning step is also provided before degumming, and the mobile clamping claw module (600) moves the silicon wafer basket delivered by the loading vehicle (700) into the spraying device (100) for spray cleaning.

9. The degumming method according to claim 7, characterized in that: After the degumming step, a post-cleaning step is provided, in which the degummed silicon wafer basket is moved into a rinsing device (300) for vibration rinsing.

10. The degumming method according to claim 7, characterized in that: In the detection step, the debonding detection component (900) collects the side image, bottom image and top image of the silicon wafer and the wafer tray in the silicon wafer basket, and fits the silicon wafer contour image of the adhesive surface through image processing, and compares it with the standard image to identify whether there is a debonding defect.

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