Support plate, foldable electronic equipment and method for preparing support plate

Abstract

The embodiment of the invention discloses a supporting plate, foldable electronic equipment and a method for preparing the supporting plate. The supporting plate comprises a first component, a second component and a connecting layer; the first component is in a plate shape and comprises a supporting face and a mounting face which are arranged back to back. The second component comprises a fixing part and a connecting part, the fixing part is connected with the first component through the connecting layer, the connecting part is connected with the fixing part and exposed relative to the mounting surface, and the connecting part is provided with a bulge and / or a groove and / or a through hole; the first component, the connecting layer and the second component are integrally formed structural components; the first component adopts a first metal material, the second component adopts a second metal material, the connecting layer comprises the first metal material and the second metal material, the density of the first metal material is smaller than that of the second metal material, and the hardness of the second metal material is larger than that of the first metal material. The supporting plate is high in size precision, light in weight and high in reliability.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a support plate, a foldable electronic device, and a method for preparing the support plate. Background Art

[0002] A foldable electronic device generally includes a screen and a housing device, wherein the screen is a flexible and bendable screen, and the housing device is used to support the screen. The housing device includes two housings and a rotating assembly connected between the two housings, and the two housings can be relatively unfolded or folded by the movement of the rotating assembly.

[0003] The rotating assembly includes a support plate, which is mainly used to support the screen. The current support plate usually includes a flat plate and multiple connectors, the flat plate is used to provide a support surface for supporting the screen, the multiple connectors are used to connect the rotating mechanism of the rotating assembly, and the multiple connectors are fixedly connected to the flat plate by rivets. Since the multiple connectors need to be separately assembled to the flat plate by rivets, the assembly process of the support plate is relatively cumbersome and the assembly accuracy is poor, which leads to a low product yield of the support plate. Summary of the invention

[0004] The embodiments of the present application provide a support plate with high dimensional accuracy, light weight and high reliability, and also provide a foldable electronic device including the support plate, and a method for preparing the support plate.

[0005] In the first aspect, the implementation method of the present application provides a support plate. The support plate is applied to the rotating assembly of a foldable electronic device, and the support plate is used to support the screen of the electronic device. The support plate includes a first member, a second member and a connecting layer. The first member is in the shape of a plate, and the first member includes a supporting surface and a mounting surface arranged opposite to each other, and the supporting surface is used to support the screen. The second member includes a fixed portion and a connecting portion, the fixed portion is connected to the first member through the connecting layer, the connecting portion is connected to the fixed portion and is exposed relative to the mounting surface, the connecting portion is used to connect the rotating mechanism of the rotating assembly, and the connecting portion is provided with a protrusion and / or a groove and / or a through hole. The first member, the connecting layer and the second member are integrally formed structural parts. The first member adopts a first metal material, the second member adopts a second metal material, and the connecting layer includes a first metal material and a second metal material.

[0006] In the present application, since the first component, the connecting layer and the second component of the support plate are integrally formed structural parts, the preparation process of the support plate is relatively simple, the dimensional accuracy is high, and the product yield is high. In addition, since the first component adopts the first metal material, the second component adopts the second metal material, the connecting layer includes the first metal material and the second metal material, and the connecting layer is connected between the first component and the second component, the connecting layer can improve the interface bonding strength between the first component and the second component, so that the connection strength between the first component and the second component is high, and the overall structure of the integral structural part formed by the first component, the connecting layer and the second component is stable and reliable. At this time, the overall structure of the support plate is stable and reliable.

[0007] In some possible implementations, the first member is plate-shaped, and includes a supporting surface and a mounting surface disposed opposite to each other, and the supporting surface is used to support the screen. The second member includes a fixing portion and a connecting portion, the fixing portion is connected to the first member through a connecting layer, the connecting portion is connected to the fixing portion and is exposed relative to the mounting surface, the connecting portion is used to connect to the rotating mechanism of the rotating assembly, and the connecting portion is provided with a protrusion and / or a groove and / or a through hole.

[0008] In this implementation, the first component of the support plate mainly realizes the supporting function of the support plate on the screen, and the second component mainly realizes the movable connection relationship between the support plate and the connecting mechanism. Therefore, the first component is the main component of the support plate, but not the main force-bearing component, and the second component is the main force-bearing component of the support plate. Since the first component, the second component and the connecting layer of the support plate of this implementation are integrally formed structural parts, that is, the main component of the support plate and the main force-bearing component are integrally formed structural parts, compared with the traditional solution in which the main component and the main force-bearing component are riveted together by rivets, the support plate of this implementation replaces the riveting process with an integral forming process, which can simplify the preparation process of the support plate, so that the dimensional accuracy of the support plate is higher and the product yield is higher.

[0009] In addition, the support plate of this implementation method adopts a first metal material for the first component and a second metal material for the second component, and the second metal material is different from the first metal material. Thus, through the combination design of the first metal material and the second metal material, the performance of the main part and the main force-bearing part of the support plate can be different to meet the diverse design requirements of the product.

[0010] In some possible implementations, density of the first metal material is less than density of the second metal material.

[0011] In this implementation, the first component of the support plate is made of a first metal material with a relatively low density, so that the mass of the main component of the support plate is relatively small, which is beneficial to the lightweight of the support plate.

[0012] In some possible implementations, the hardness of the second metal material is greater than the hardness of the first metal material.

[0013] In this implementation, the support plate adopts a composite structure of a first component and a second component, the first component adopts a first metal material with a lower hardness, the second component adopts a second metal material with a higher hardness, and the material hardness of the second component is greater than the material hardness of the first component. Since the material hardness of the second component is relatively high, the mechanical reliability of the second component as the main force-bearing component is relatively high and the wear resistance is relatively good. Since the material hardness of the first component is relatively low, the first component as the main component has a lower processing difficulty and a shorter processing time when CNC processing and other mechanical processing are performed, thereby having higher processing efficiency and lower processing cost. In addition, since the material hardness of the first component is relatively low, even if the first component undergoes mechanical processing over a large area, the residual stress after mechanical processing is relatively small, so the risk of deformation of the first component due to stress release is relatively small, which is conducive to the first component maintaining a shape with higher dimensional accuracy, and the flatness of the first component is relatively high, thereby further improving the product yield of the support plate.

[0014] Therefore, the support plate adopts an integrally molded composite structure including a first component and a second component. The material density and hardness of the first component are relatively small, and the material hardness of the second component is relatively large, which is conducive to the support plate to achieve high reliability and lightweight, and is also conducive to the support plate to obtain higher dimensional accuracy and product yield, as well as lower processing costs.

[0015] In some possible implementations, there are multiple first components, and there are multiple second components, and the multiple second components are arranged alternately with the multiple first components. Wherein, adjacent first components and second components are connected by a connecting layer. The fixing portion of each second component includes a matching support surface, and the matching support surface is arranged facing away from the connecting portion. The supporting surfaces of the multiple first components and the matching support surfaces of the multiple second components are arranged in the same plane, and are jointly spliced ​​into the supporting surface of the support plate.

[0016] In this implementation, the support surface of the support plate can provide a flat support environment for the screen.

[0017] In some possible implementations, the fixing portion of the second component further includes a matching mounting surface and a peripheral side surface, the matching mounting surface is arranged opposite to the matching support surface, the peripheral side surface is connected between the matching mounting surface and the support surface, and the peripheral side surface is connected to the first component through a connecting layer. The peripheral side surface is provided with at least one step surface; or the peripheral side surface is arranged obliquely relative to the matching mounting surface.

[0018] In this implementation, the peripheral side surface of the fixing portion of the second component has a larger area, thereby increasing the connection area between the fixing portion and the first component, increasing the area of ​​the connection layer, and improving the connection strength between the second component and the first component.

[0019] In some possible implementations, the fixing portion of the second component may be provided with a matching structure, and the matching structure is used to increase the bonding force between the second component and the first component.

[0020] In some possible implementations, the number of the first component is one, the number of the second components is multiple, and the fixing portions of the multiple second components are all connected to the first component.

[0021] In this implementation, the support surfaces of the support plates are all formed by the first component, and the support surfaces of the support plates can have better consistency.

[0022] In some possible implementations, the fixing portion of the second component may include a connecting surface, a mating mounting surface and a peripheral side surface, the connecting portion of the second component is connected to the mating mounting surface, the connecting surface is arranged to face away from the mating mounting surface, and the peripheral side surface is connected between the mating mounting surface and the connecting surface.

[0023] The connection surface and the peripheral side surface of the fixing part are connected to the first component through the connection layer. At this time, the connection area between the fixing part and the connection layer is large, and the area of ​​the connection layer is large, which improves the connection strength between the first component and the second component, making the overall structure of the support plate more stable and reliable.

[0024] In some possible implementations, the connecting portion is provided with a slide groove or a slide rail for slidingly connecting the rotating mechanism of the rotating assembly. And / or, the connecting portion is provided with an arc-shaped arm, an arc-shaped groove, a rotating shaft or a rotating shaft hole for rotatingly connecting the rotating mechanism of the rotating assembly.

[0025] In the implementation of the present application, the connection parts of the plurality of second components may have one or more connection relationships with the rotation mechanism of the rotation assembly. For example, the plurality of second components are divided into a first group of second components and a second group of second components, the connection parts of the first group of second components are rotationally connected to the rotation assembly, and the connection parts of the second group of second components are slidingly connected to the rotation assembly. The structures of the connection parts of the plurality of second components in the same group of second components may be the same or different.

[0026] In some possible implementations, the first member includes at least one groove, and the opening of the groove is provided on the mounting surface. The groove can be used to provide an avoidance space or a matching space when the support plate cooperates with the rotating mechanism of the rotating assembly, so that the matching structure layout of the support plate and the rotating assembly is more compact, which is conducive to the thin design of the electronic device.

[0027] In some possible implementations, the first component includes at least one protrusion, which is protruding from the mounting surface. The protrusion can be used to provide guidance, limiting, connection, etc. when the support plate cooperates with the rotating mechanism of the rotating assembly.

[0028] In some possible implementations, the thickness H1 of the connection layer satisfies: 0.1 μm≤H1≤30 μm.

[0029] In this implementation, since the first component and the second component are connected together by a connecting layer, the thickness of the connecting layer can be greater than or equal to 0.1 μm. The thicker the connecting layer is, the better the first component and the second component can be combined through the connecting layer, which is conducive to improving the bonding strength between the first component and the second component of the support plate, thereby improving the overall structural stability of the support plate. In addition, the thickness of the connecting layer can also be less than or equal to 30 μm, so that the support plate can meet the bonding strength requirements between the first component and the second component, while having a shorter preparation time and lower preparation cost, which is conducive to large-scale production.

[0030] In some possible implementations, the thickness H1 of the connection layer satisfies: 2 μm≤H1≤30 μm.

[0031] In this implementation, the thickness of the connecting layer is relatively large, that is, the thickness of the bonding interface between the first component and the second component is relatively large, so that the interface bonding strength between the first component and the second component is high and the risk of interface cracking is low. Therefore, the connection strength between the first component and the second component is high, and the overall structure of the first component, the connecting layer and the second component is stable and reliable.

[0032] In some possible implementations, the yield strength of the second metal material is greater than the yield strength of the first metal material.

[0033] In this implementation, the second component of the support plate is made of a second metal material with a relatively large yield strength, so that the second component has a stronger ability to resist slight plastic deformation, thereby further improving the mechanical reliability of the second component and the support plate.

[0034] In some possible implementations, the hardness of the second metal material is greater than or equal to 150 HV. And / or, the yield strength of the second metal material is greater than or equal to 200 MPa. And / or, the density of the first metal material is less than or equal to 3.5 g / cm 3 .

[0035] In some possible implementations, the first metal material is an aluminum alloy, a particle-reinforced aluminum-based composite material, a magnesium alloy, or a particle-reinforced magnesium-based composite material. In this implementation, the first component has a relatively small density. In addition, the material hardness of the first component is appropriate, which can reduce the difficulty of CNC processing, and the material hardness of the present application can make the processed first component have sufficient rigidity to ensure the structural reliability of the support plate.

[0036] In some possible implementations, the second metal material is titanium alloy, stainless steel or amorphous alloy. In this implementation, the second component has a higher hardness and a higher mechanical reliability.

[0037] In some possible implementations, the first component of the support plate is made of aluminum alloy, particle-reinforced aluminum-based composite material, magnesium alloy or particle-reinforced magnesium-based composite material, and the second component is made of stainless steel, titanium alloy or amorphous alloy material, so that the support plate has a small mass, high mechanical reliability, good wear resistance, less processing difficulty, lower cost, higher dimensional accuracy and flatness, and higher production yield.

[0038] In some implementations, the support plate may further perform surface treatment on the first component and the second component to increase their service life.

[0039] Exemplarily, the support plate may further include a surface anti-corrosion layer, which is fixed to and covers the outer surface of the first component. The outer surface of the first component is exposed to the outside of the support plate, and the outer surface of the first component is not in contact with the connecting layer. In this implementation, the surface anti-corrosion layer is used to improve the corrosion resistance and durability of the first component and the support plate, so as to improve the reliability and service life of the support plate.

[0040] Among them, since the first component is made of aluminum alloy, particle-reinforced aluminum-based composite material, magnesium alloy or particle-reinforced magnesium-based composite material, the surface anti-corrosion layer can be formed by chemical passivation process to reduce costs. In some other implementations, the surface anti-corrosion treatment can also be formed by spraying, electrophoresis, anodizing and other processes, and the implementation of this application does not strictly limit this.

[0041] Exemplarily, the support plate may further include a PVD coating, the PVD coating is fixed to and covers the outer surface of the second component, wherein the outer surface of the second component is exposed outside the support plate, and the outer surface of the second component is not connected to the first component.

[0042] In this implementation, by covering the outer surface of the second component with a PVD coating, the PVD coating can increase the wear resistance and scratch resistance of the second component and extend its service life. In addition, when the first metal material used by the second component is a titanium alloy or stainless steel, the PVD coating has good bonding with the outer surface of the second component, the PVD coating is not easy to fall off, and has high reliability.

[0043] In some examples, the PVD coating can also reduce the friction coefficient of the surface of the second component, reduce friction loss and energy consumption, and improve the mechanical transmission efficiency between the rotating mechanism of the rotating assembly and the support plate.

[0044] In some examples, the support plate can also be coated with PVD to achieve decorative effects such as coloring.

[0045] In some implementations, a local area of ​​the support plate can be set as a laser engraving area. The surface energy of this area is better, and the connection strength with the adhesive (such as double-sided tape, glue, etc.) can be enhanced to facilitate the fixing of other structural parts (such as insulating Mylar, etc.). For example, the mounting surface of the first component can be provided with a laser engraving area.

[0046] In some possible implementations, the content of the main group elements of the first metal material in the connecting layer decreases in the direction from the first component to the second component, and the content of the main group elements of the second metal material increases in the direction from the first component to the second component.

[0047] In this implementation, the first component uses a first metal material, and the content of the main group elements of the first metal material of the connecting layer changes from high to low in the direction from the first component to the second component. The second component uses a second metal material, and the content of the main group elements of the second metal material of the connecting layer changes from low to high in the direction from the first component to the second component. Therefore, the first component and the connecting layer have a good bonding effect, and the second component and the connecting layer have a good bonding effect. A higher connection strength can be obtained between the first component and the second component through the connecting layer, so that the overall structure of the support plate is more stable and reliable.

[0048] In some possible implementations, a first interface is formed between the first component and the connecting layer, and a second interface is formed between the second component and the connecting layer. The first interface and the second interface are visible in the metallographic structure of the support plate.

[0049] In this implementation, since the connecting layer is an interdiffusion layer formed during the sintering process, the first metal material of the first component and the second metal material of the second component are dissimilar metal materials. Therefore, the first interface between the connecting layer and the first component and the second interface between the connecting layer and the second component can be clearly observed in the metallographic structure.

[0050] In some possible implementations, in the metallographic structure of the support plate, the first interface is parallel to the second interface.

[0051] In this implementation, since the connecting layer is formed by the metal interdiffusion effect during the sintering process, the multiple regions of the connecting layer arranged in the layer direction (i.e., perpendicular to the thickness direction of the connecting layer) are subjected to relatively uniform force during the sintering process. Therefore, the thicknesses of the multiple regions are equal or approximately equal, the overall thickness of the connecting layer is equal or approximately equal, and the first interface is parallel to the second interface.

[0052] At this time, since the parts of the connecting layer are of equal thickness, the degree of diffusion between the first metal material and the second metal material in the parts of the connecting layer is equivalent, the bonding strength between the parts of the connecting layer and the first component is the same or approximately the same, and the bonding strength between the parts of the connecting layer and the second component is also the same or approximately the same, thereby effectively avoiding the support plate from cracking at the place where the bonding strength between the connecting layer and the first component is weak, or at the place where the bonding strength between the connecting layer and the second component is weak, which is beneficial to improving the overall structural stability of the support plate and extending the service life of the support plate.

[0053] In some possible implementations, the first component, the connecting layer and the second component are formed by an insert powder metallurgy process. In the preparation process of the insert powder metallurgy process, the insert is first prepared, and then the insert and the powder of the connecting insert are sintered together to finally form an integrally formed structural component. Among them, the second component is formed by an insert made of a second metal material, the first component is formed by sintering a powder of a first metal material, and the connecting layer is formed by mutual diffusion of the second metal material and the first metal material.

[0054] In this implementation, since the first component, the connection layer and the second component of the support plate are integrally formed structural parts formed by the insert powder metallurgy process, based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the second component formed by the insert and the first component formed by the powder, that is, a connection layer in which the first metal material and the second metal material diffuse with each other is formed. At this time, the formation of the connection layer significantly improves the interface bonding strength between the first component and the second component, so that the connection strength between the first component and the second component is high, and the overall structure of the first component, the connection layer and the second component is stable and reliable.

[0055] In addition, in the process of preparing the support plate, the shape of the bonding interface between the first component and the second component can be controlled by controlling the shape of the surface of the insert that is used to contact the powder. The shape control of the bonding interface is easy to implement, highly flexible, and highly precise, so that the first component, the second component, and the connecting layer have high connection strength while also having high processing dimensional accuracy, thereby improving product yield.

[0056] In some possible implementations, the first component is formed by sintering powder at a sintering temperature of 500° C. to 660° C., a sintering time of 2 hours to 5 hours, and a sintering pressure greater than or equal to 100 MPa.

[0057] In this implementation, during the process of sintering the first component from powder, the connecting layer is formed by the mutual diffusion of metal materials between the insert and the powder. Therefore, the connecting layer is formed under high temperature and high pressure for a long time. The connecting layer can have a large thickness to ensure a reliable connection between the first component and the second component.

[0058] In a second aspect, the implementation of the present application further provides a foldable electronic device, the electronic device comprising a housing device and a screen. The housing device comprises a first housing, a second housing, and a rotating assembly, the rotating assembly comprising a rotating mechanism and two supporting plates of any of the foregoing items. The rotating mechanism is connected between the first housing and the second housing so that the first housing and the second housing can be relatively unfolded or relatively folded.

[0059] The screen is fixedly connected to the first shell and the second shell, the two support plates are located between the rotating mechanism and the screen, and the two support plates are movably connected to the rotating mechanism; during the relative expansion of the first shell and the second shell, the two support plates move with the rotating mechanism and expand relatively; during the relative folding of the first shell and the second shell, the two support plates move with the rotating mechanism and fold relatively.

[0060] In some possible implementations, when the two support plates are folded relative to each other, the support surfaces of the two support plates may face each other. For example, an angle may be formed between the support surfaces of the two support plates, for example, the spacing between the support surfaces of the two support plates at the end away from the main axis is smaller than the spacing at the end close to the main axis. In this case, a water drop-shaped accommodation space may be formed between the support surfaces of the two support plates and the main axis to accommodate part of the screen. In this case, the electronic device is an inward-folding electronic device.

[0061] In some possible implementations, when the two support plates are folded relative to each other, the support surfaces of the two support plates may face away from each other. In this case, the electronic device is an outward folding electronic device.

[0062] In a third aspect, the implementation of the present application also provides a method for preparing any of the above-mentioned support plates. The method for preparing the support plate includes: preparing an insert, the insert is made of a second metal material; placing the insert into a mold, piling powder in the mold, and making the powder contact the insert to form a part to be sintered, the powder is made of a first metal material; sintering the part to be sintered to form a sintered part; and processing the sintered part to form a support plate. Part of the insert is used to form a second component of the support plate, another part of the insert and a part of the powder are used to jointly form a connecting layer of the support plate, and another part of the powder is used to form a first component of the support plate.

[0063] In the implementation of the present application, a portion of the insert is used to form the second component of the support plate, another portion of the insert and a portion of the powder are used to jointly form a connecting layer of the support plate, and another portion of the powder is used to form the first component of the support plate. The first component, the second component and the connecting layer of the support plate are integrally formed structural parts through the insert powder metallurgy process. Based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the first component and the second component, that is, a connecting layer in which the first metal material and the second metal material diffuse with each other is formed. The existence of the connecting layer significantly improves the interface bonding strength between the first component and the second component, so that the connection strength between the first component and the second component is high, and the overall structure of the first component, the connecting layer and the second component is stable and reliable.

[0064] During the preparation of the support plate, the support plate can control the shape of the bonding interface between the first component and the second component by controlling the shape of the surface of the insert for contacting the powder. The shape control of the bonding interface is easy to achieve, highly flexible, and highly accurate, so that the first component, the second component, and the connecting layer have high processing accuracy when they have high connection strength. In addition, since the shape of the bonding interface is easy to control, the actual thickness of the first component and the second component can be close to or equal to the designed thickness when the design requirements are met, so that the thickness of the support plate can be reasonably controlled.

[0065] In the implementation of the present application, the support plate adopts a composite structure of a first component and a second component. The first component adopts a first metal material, and the second component adopts a second metal material. Through the arrangement of the first metal material and the second metal material, the support plate can achieve high reliability and light weight.

[0066] In some possible implementations, during the sintering of the part to be sintered, the sintering pressure P1 satisfies: P1 ≥ 100 MPa, the sintering temperature T1 satisfies: 500° C. ≤ T1 ≤ 660° C., and the sintering time t1 satisfies: 2 h ≤ t1 ≤ 5 h.

[0067] In this implementation, by performing hot isostatic pressing on the sintered part, the mutual diffusion degree of the first metal material and the second metal material is effectively improved, so that the transition layer thickness of the sintered part is larger, so the thickness of the connecting layer of the support plate is larger, and the thickness of the bonding interface between the first component and the second component is larger, so that the interface bonding strength between the first component and the second component is high, and the risk of interface cracking is low. Therefore, the connection strength between the first component and the second component is high, and the overall structure of the first component, the connecting layer and the second component is stable and reliable.

[0068] In some possible implementations, when preparing the insert, the surface roughness of part of the surface of the insert can be increased to increase the contact area between the insert and the powder, thereby increasing the bonding strength between the first part and the second part of the sintered part to improve the overall structural stability of the support plate formed subsequently.

[0069] Among them, the surface roughness of the surface can be increased by mechanically grinding part of the surface of the insert. Alternatively, the surface roughness of the surface of the insert can be increased by mechanically processing the insert to form a rubber-drawing structure such as a round hole or a dovetail groove, or by welding a steel sheet with a rubber-drawing structure on the insert to form a physical riveting structure on part of the surface of the insert.

[0070] In some possible implementations, before sintering the part to be sintered, the method may further include: performing cold isostatic pressing on the part to be sintered. After the part to be sintered is subjected to cold isostatic pressing, the powder is pre-pressed to facilitate the subsequent sintering process. Among them, the pressure during the cold isostatic pressing process may be greater than or equal to 100MPa, for example, in the range of 100MPa to 630MPa, the temperature may be room temperature, and the duration may be between 1 hour and 3 hours. In some other embodiments, after the part to be sintered is subjected to the cold isostatic pressing process, the part to be sintered may also be vacuum degassed to release the residual gas in the part to be sintered, thereby facilitating the subsequent sintering process.

[0071] In some possible implementations, after sintering the part to be sintered, the method may further include the step of performing a solution aging treatment on the sintered part. In this implementation, after the sintered part is subjected to the solution aging treatment, the first part of the sintered part can obtain a higher yield strength and / or hardness, so that the first component of the support plate can obtain a higher yield strength and / or hardness.

[0072] The solution aging treatment step includes: performing a solution treatment on the sintered part; cooling the sintered part; and performing an aging treatment on the sintered part. For example, the sintered part may be firstly subjected to a solution treatment; then the sintered part subjected to the solution treatment may be water quenched at room temperature to cool the sintered part; after the sintered part is cooled to room temperature, it is then subjected to an aging treatment.

[0073] In some examples, the first metal material is an aluminum alloy or a particle-reinforced aluminum-based composite material. In the solution aging treatment, the solution temperature T2 of the solution treatment satisfies: 500°C ≤ T2 ≤ 550°C, and the solution time t2 satisfies: 15min (minutes) ≤ t2 ≤ 60min; and / or, the aging temperature T3 of the aging treatment satisfies: 170°C ≤ T3 ≤ 200°C, and the aging time t3 satisfies: 4h ≤ t3 ≤ 24h.

[0074] In other examples, the first metal material is a magnesium alloy or a particle-reinforced magnesium-based composite material. In the solution aging treatment, the solution temperature T2 of the solution treatment satisfies: 380°C ≤ T2 ≤ 420°C, and the solution time t2 satisfies: 0.5h ≤ t2 ≤ 12h; and / or, the aging temperature T3 of the aging treatment satisfies: 180°C ≤ T3 ≤ 220°C, and the aging time t3 satisfies: 1h ≤ t3 ≤ 8h. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] In order to illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0076] Figure 1 is a structural schematic diagram of an electronic device provided by an embodiment of the present application when it is in an open state;

[0077] Figure 2 yes Figure 1 A schematic diagram of the structure of the electronic device shown in the closed state;

[0078] Figure 3 yes Figure 1 A schematic cross-sectional view of a portion of the structure of the electronic device shown cut along AA;

[0079] Figure 4 is a schematic diagram of the structure of the support plate provided in some embodiments of the present application;

[0080] Figure 5 yes Figure 4 A schematic diagram of the structure of the support plate shown at another angle;

[0081] Figure 6 yes Figure 5 The cross-sectional structure diagram of the support plate shown is taken along BB;

[0082] Figure 7 yes Figure 6 A schematic diagram showing the contents of the main group elements of the first metal material and the second metal material at different positions of the connecting layer of the support plate;

[0083] Figure 8 yes Figure 6 Schematic diagram of metallographic structure of a part of the support plate in some possible implementations;

[0084] Fig. 9 is a schematic flow chart of a method for preparing a support plate provided in an embodiment of the present application;

[0085] Fig.10 yes Fig. 9 Structural schematic diagram of some steps in the method for preparing a support plate in some embodiments Figure 1 ;

[0086] Fig.11 yes Fig.10 A schematic diagram of the structure shown at another angle;

[0087] Figure 12 to Figure 14 yes Fig. 9 Structural schematic diagram of some steps in the method for preparing a support plate in some embodiments Figures 2 to 4 ;

[0088] Fig.15 yes Fig.14 A schematic diagram of the structure shown at another angle;

[0089] Fig.16 yes Fig. 9 Structural schematic diagrams of some steps in the method for preparing a support plate in other embodiments;

[0090] Fig.17 is a schematic diagram of the structure of the support plate provided in the embodiment of the present application in other embodiments;

[0091] Figures 18 to 21 yes Fig. 9 Structural schematic diagram of some steps in the method for preparing the support plate in other embodiments Figures 1 to 4 ;

[0092] Fig. 22 is a schematic diagram of the structure of the support plate provided in the embodiment of the present application in other embodiments;

[0093] Fig.23 yes Fig. 22 A schematic diagram of the structure of the support plate shown at another angle;

[0094] Figure 24 to Figure 27 yes Fig. 9 Structural schematic diagram of some steps in the method for preparing the support plate in other embodiments Figures 1 to 4 ;

[0095] Fig.28 yes Fig. 27 A schematic diagram of the structure shown at another angle;

[0096] Fig.29 is a schematic diagram of the structure of the support plate provided in the embodiment of the present application in other embodiments;

[0097] Fig.30 is a schematic diagram of the structure of the support plate provided in the embodiment of the present application in other embodiments;

[0098] Fig.31 is a schematic structural diagram of another electronic device provided by an embodiment of the present application when it is in an open state;

[0099] Fig.32 yes Fig.31 A schematic diagram of the structure of the electronic device shown in the closed state;

[0100] Fig.33 yes Fig.31 The cross-sectional schematic diagram of the partial structure of the electronic device shown is cut along BB. DETAILED DESCRIPTION

[0101] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0102] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship after the connection remains unchanged, "sliding connection" means that the two are connected to each other and can slide relative to each other after the connection, and "rotational connection" means that the two are connected to each other and can rotate relative to each other after the connection.

[0103] The directional terms mentioned in the embodiments of the present application, such as "up", "down", "left", "right", "inside", "outside", etc., are only references to the directions of the drawings. The directional terms used are for the purpose of illustrating and understanding the embodiments of the present application, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0104] The limitations of the relative positional relationship mentioned in the embodiments of the present application, such as parallel, vertical, etc. These limitations are all for the current state of the art, rather than being absolutely strict limitations, allowing for a small amount of deviation, approximately parallel, approximately vertical, etc. For example, A is parallel to B, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. For example, A is perpendicular to B, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.

[0105] In the embodiments of the present application, "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the previous and subsequent associated objects are in an "or" relationship. "Multiple" means at least two. "Include", "Contain", "Have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0106] Figure 1 is a structural diagram of an electronic device 100 provided in an embodiment of the present application when it is in an open state. Figure 2 yes Figure 1 The structure diagram of the electronic device 100 is shown in FIG. Figure 1 As shown, the electronic device 100 may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a wearable device, etc. The following description will be made by taking the mobile phone as an example.

[0107] In some embodiments, such as Figure 1 and Figure 2 As shown, the electronic device 100 includes a housing device 10 and a screen 20, and the screen 20 is installed on the housing device 10. Figure 1 As shown, the housing device 10 can be unfolded to an open state; Figure 2 As shown, the housing device 10 can also be folded to a closed state. The housing device 10 can also be unfolded or folded to an intermediate state, and the intermediate state can be any state between the open state and the closed state.

[0108] The screen 20 is a flexible screen. The screen 20 can move with the housing device 10, and the housing device 10 can drive the screen 20 to unfold or fold, so that the electronic device 100 can be unfolded to an open state, or folded to a closed state. When the electronic device 100 is in a closed state, the screen 20 is located inside the housing device 10. It should be understood that when the electronic device 100 is in an open state, the various components of the electronic device 100 are correspondingly in an open state; when the electronic device 100 is in a closed state, the various components of the electronic device 100 are correspondingly in a closed state.

[0109] In this embodiment, when the electronic device 100 is in an open state, the screen 20 is flattened, and the screen 20 can be displayed in full screen, so that the electronic device 100 has a larger display area to improve the user's viewing experience and operation experience. When the electronic device 100 is in a closed state, the plane size of the electronic device 100 is small, which is convenient for the user to carry and store.

[0110] In some embodiments, the screen 20 may be integrated with a display function and a touch sensing function. The display function of the screen 20 is used to display images, videos, etc., and the touch sensing function of the screen 20 is used to sense the user's touch action to achieve human-computer interaction. Among them, the flexible display screen can adopt a liquid crystal display (LCD), an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a flexible light-emitting diode (FLED) display screen, a MiniLED display screen, a MicroLED display screen, a Micro-OLED display screen, a quantum dot light emitting diode (QLED) display screen, etc.

[0111] In some embodiments, the electronic device 100 may further include multiple components (not shown in the figure), and the multiple components are installed inside the housing device 10. The multiple components may include, for example, a processor, an internal memory, an external memory interface, a universal serial bus (USB) interface, a charging management module, a power management module, a battery, an antenna, a communication module, a camera, an audio module, a speaker, a receiver, a microphone, an earphone interface, a sensor module, a button, a motor, an indicator, and a subscriber identification module (SIM) card interface. Among them, the electronic device 100 may also have more or fewer components than described above, may combine two or more components, or may have different component configurations. Various components may be implemented in hardware, software, or a combination of hardware and software including one or more signal processing and / or application-specific integrated circuits.

[0112] Figure 3 yes Figure 1 The electronic device 100 is shown as a schematic cross-sectional view of a portion of the structure cut along line AA.

[0113] In some embodiments, such as Figures 1 to 3As shown, the housing device 10 may include a first housing 1, a second housing 2 and a rotating assembly 3. Exemplarily, the rotating assembly 3 includes a first support plate 31, a second support plate 32 and a rotating mechanism 33. The rotating mechanism 33 is connected between the first housing 1 and the second housing 2 so that the first housing 1 and the second housing 2 can be relatively unfolded or relatively folded. For example, the rotating mechanism 33 may include a main shaft 331, a first connecting portion 332 and a second connecting portion 333, wherein the first connecting portion 332 is connected between the first housing 1 and the main shaft 331, and the second connecting portion 333 is connected between the main shaft 331 and the second housing 2. Among them, the screen 20 is fixedly connected to the first housing 1 and the second housing 2, so that the screen 20 can move with the first housing 1 and the second housing 2.

[0114] Exemplarily, through the movement of the rotating assembly 3, the first shell 1 and the second shell 2 can be relatively unfolded to an open state, and the electronic device 100 is in an open state; through the movement of the rotating assembly 3, the first shell 1 and the second shell 2 can be relatively folded to a closed state, and the electronic device 100 is in a closed state. When the electronic device 100 is in an open state, the angle between the first shell 1 and the second shell 2 can be approximately 180°, and the first shell 1 and the second shell 2 are flat; or, the angle between the first shell 1 and the second shell 2 can also be slightly deviated from 180°, such as 165°, 177° or 185°. When the electronic device 100 is in a closed state, the angle between the first shell 1 and the second shell 2 can be approximately 0°, and the first shell 1 and the second shell 2 are folded; or, the angle between the first shell 1 and the second shell 2 can also be slightly deviated from 0°, such as 3°, 5° or 10°.

[0115] For example, Figure 3 As shown, the first support plate 31 and the second support plate 32 are both located between the rotating mechanism 33 and the screen 20. The first support plate 31 and the second support plate 32 are used to support the screen 20. The first support plate 31 and the second support plate 32 both have a support surface for supporting the screen 20. The first support plate 31 and the second support plate 32 are both movably connected to the rotating mechanism 33. In this embodiment, during the relative rotation of the first shell 1 and the second shell 2, the rotating mechanism 33 moves, and the first support plate 31 and the second support plate 32 move with the rotating mechanism 33.

[0116] In some examples, during the relative expansion of the first housing 1 and the second housing 2, the first support plate 31 and the second support plate 32 move with the rotating mechanism 33 and are relatively expanded. Figure 3As shown, when the first shell 1 and the second shell 2 are relatively unfolded to the open state, the first support plate 31 and the second support plate 32 are flattened, and the support surface 311 of the first support plate 31 and the support surface 321 of the second support plate 32 are coplanar or almost coplanar, thereby providing a flat support environment for the screen 20. In the process of the first shell 1 and the second shell 2 being relatively folded, the two support plates 4 move with the rotating mechanism 33 and fold relatively. Among them, when the first shell 1 and the second shell 2 are relatively folded to the closed state, the first support plate 31 and the second support plate 32 are closed, and the support surface 311 of the first support plate 31 and the support surface 321 of the second support plate 32 can be arranged facing each other. Among them, an angle can be formed between the support surface 311 of the first support plate 31 and the support surface 321 of the second support plate 32. For example, the distance between the two at the end away from the main axis 331 is smaller than the distance between the two at the end close to the main axis 331. At this time, the support surface 311 of the first support plate 31, the support surface 321 of the second support plate 32 and the main axis 331 can jointly form a water drop-shaped accommodation space for accommodating part of the screen 20.

[0117] Exemplarily, the first support plate 31 can be movably connected to the first connection part 332, and the second support plate 32 can be movably connected to the second connection part 333. Alternatively, the first support plate 31 can be movably connected to the first connection part 332 and the main shaft 331, and the second support plate 32 can be movably connected to the second connection part 333 and the main shaft 331. Among them, the movable connection relationship between the first support plate 31 and the first connection part 332 and / or the main shaft 331 can include a rotational connection and / or a sliding connection. The movable connection relationship between the second support plate 32 and the second connection part 333 and / or the main shaft 331 can include a rotational connection and / or a sliding connection. The embodiment of the present application does not strictly limit the specific implementation structure of the rotating mechanism 33, the specific connection structure of the first support plate 31 and the rotating mechanism 33, and the specific connection structure of the second support plate 32 and the rotating mechanism 33.

[0118] In the embodiment of the present application, the first support plate 31 and the second support plate 32 may adopt a similar structure. A support plate structure is introduced below. The first support plate 31 and the second support plate 32 may be designed with reference to the structure of the support plate below.

[0119] Figure 4 is a schematic diagram of the structure of the support plate 4 provided in some embodiments of the present application, Figure 5 yes Figure 4 The structural schematic diagram of the support plate 4 at another angle is shown. Figure 6 yes Figure 5 The cross-sectional structure diagram of the support plate 4 is shown along the BB. Figure 5 The viewing angle of the middle support plate 4 is relatively Figure 4 The viewing angle of the middle support plate 4 is flipped.

[0120] In some embodiments, such as Figures 4 to 6 As shown, the support plate 4 may include a first component 41, a second component 42 and a connecting layer 43. Exemplarily, the number of the first components 41 is multiple, the number of the second components 42 is multiple, and the multiple second components 42 are arranged alternately with the multiple first components 41. Among them, the adjacent first components 41 and the second components 42 are connected by the connecting layer 43. In other words, the connecting layer 43 is connected between the first component 41 and the second component 42, and the connecting layer 43 forms a connecting interface between the first component 41 and the second component 42. The first component 41, the connecting layer 43 and the second component 42 of the support plate 4 are integrally formed structural parts. Exemplarily, the first component 41 adopts a first metal material, the second component 42 adopts a second metal material, and the second metal material is different from the first metal material. The connecting layer 43 includes a first metal material and a second metal material.

[0121] In this embodiment, since the first component 41, the connecting layer 43 and the second component 42 of the support plate 4 are integrally formed structural parts, the preparation process of the support plate 4 is relatively simple, the dimensional accuracy is high, and the product yield is high. In addition, since the first component 41 adopts the first metal material, the second component 42 adopts the second metal material, the connecting layer 43 includes the first metal material and the second metal material, and the connecting layer 43 is connected between the first component 41 and the second component 42, the connecting layer 43 can improve the interface bonding strength between the first component 41 and the second component 42, so that the connection strength between the first component 41 and the second component 42 is high, and the overall structure of the integral structural part formed by the first component 41, the connecting layer 43 and the second component 42 is stable and reliable. At this time, the overall structure of the support plate 4 is stable and reliable.

[0122] In some embodiments, such as Figures 4 to 6 As shown, the first member 41 is in the shape of a plate. The first member 41 includes a supporting surface 411 and a mounting surface 412 disposed opposite to each other. The supporting surface 411 is used to support the screen 20. The second member 42 includes a fixing portion 421 and a connecting portion 422. The fixing portion 421 is connected to the first member 41 through a connecting layer 43. At this time, the second member 42 is connected to the first member 41 through the connecting layer 43. The connecting portion 422 is connected to the fixing portion 421 and is exposed relative to the mounting surface 412. The connecting portion 422 is used to connect the rotating mechanism 33 of the rotating assembly 3 (see Figure 3 ). For example, the connecting portion 422 may be provided with a protrusion and / or a groove and / or a through hole. The connecting portion 422 and the rotating mechanism 33 may be slidably connected and / or rotatably connected via the protrusion and / or the groove and / or the through hole.

[0123] In this embodiment, the first component 41 of the support plate 4 mainly realizes the supporting function of the support plate 4 on the screen 20, and the second component 42 mainly realizes the movable connection relationship between the support plate 4 and the connecting mechanism, so the first component 41 is the main component of the support plate 4, but not the main force-bearing component, and the second component 42 is the main force-bearing component of the support plate 4. Since the first component 41, the second component 42 and the connecting layer 43 of the support plate 4 of this embodiment are integrally formed structural parts, that is, the main component and the main force-bearing component of the support plate 4 are integrally formed structural parts, compared with the traditional solution in which the main component and the main force-bearing component are riveted together by rivets, the support plate 4 of this embodiment replaces the riveting process by an integral forming process, which can simplify the preparation process of the support plate 4, so that the dimensional accuracy of the support plate 4 is higher and the product yield is higher.

[0124] In addition, in the present embodiment, the support plate 4 adopts a first metal material for the first component 41 and a second metal material for the second component 42, and the second metal material is different from the first metal material. Thus, through the combination design of the first metal material and the second metal material, the performance of the main component and the main force-bearing component of the support plate 4 can be different to meet the diverse design requirements of the product.

[0125] In some embodiments, the density of the first metal material is less than the density of the second metal material. For example, the density of the first metal material may be less than or equal to 3.5 g / cm 3 (grams per cubic centimeter), for example, 1.8 g / cm 3 , 1.9g / cm 3 , 2.0g / cm 3 , 2.69g / cm 3 , 2.70g / cm 3 , 2.73g / cm 3 , 2.8g / cm 3 wait.

[0126] In this embodiment, the first component 41 of the support plate 4 is made of a first metal material with a relatively low density, so that the mass of the main component of the support plate 4 is relatively small, which is beneficial to the lightweight of the support plate 4 .

[0127] Exemplarily, the hardness of the second metal material is greater than the hardness of the first metal material. Among them, hardness is a performance indicator to measure the hardness of a material, which can be understood as the ability to resist elastic deformation, plastic deformation, residual deformation, resistance and anti-destructive force. Hardness is not a simple physical concept, but the mechanical properties of the material such as elasticity, plasticity, strength and toughness. Exemplarily, the hardness of the second metal material can be greater than or equal to 150HV, for example, 180HV, 200HV, 250HV, 280HV, 300HV, 310HV, 380HV, etc. Among them, HV is the Vickers hardness unit.

[0128] In this embodiment, the support plate 4 adopts a composite structure of a first component 41 and a second component 42, the first component 41 adopts a first metal material with a lower hardness, the second component 42 adopts a second metal material with a higher hardness, and the material hardness of the second component 42 is greater than the material hardness of the first component 41. Since the material hardness of the second component 42 is relatively high, the mechanical reliability of the second component 42 as the main force-bearing component is relatively high and the wear resistance is relatively good. Since the material hardness of the first component 41 is relatively low, the first component 41 as the main component has a relatively low processing difficulty and a relatively short processing time when CNC (Computer numerical control, numerical control machine tool) processing and other mechanical processing are performed, thereby having a relatively high processing efficiency and a relatively low processing cost. In addition, since the material hardness of the first component 41 is relatively low, even if the first component 41 undergoes a relatively large area of ​​mechanical processing, the residual stress after mechanical processing is relatively small, so the risk of deformation of the first component 41 due to stress release is relatively low, which is conducive to the first component 41 maintaining a shape with a relatively high dimensional accuracy, and the flatness of the first component 41 is relatively high, thereby further improving the product yield of the support plate 4.

[0129] Therefore, the support plate 4 adopts an integrally formed composite structure including a first component 41 and a second component 42. The material density and hardness of the first component 41 are relatively small, and the material hardness of the second component 42 is relatively large, which is beneficial for the support plate 4 to achieve high reliability and lightweight, and is also beneficial for the support plate 4 to obtain higher dimensional accuracy and product yield, as well as lower processing costs.

[0130] In some embodiments, the yield strength of the second metal material is greater than the yield strength of the first metal material. Exemplarily, the yield strength of the second metal material may be greater than or equal to 200 MPa (megapascals), such as 400 MPa, 450 MPa, 500 MPa, 600 MPa, 665 MPa, etc. Yield strength is the yield limit of a metal material when yielding occurs, that is, the stress that resists micro plastic deformation.

[0131] In this embodiment, the second component 42 of the support plate 4 is made of a second metal material with a large yield strength, so that the second component 42 has a stronger ability to resist slight plastic deformation, thereby further improving the mechanical reliability of the second component 42 and the support plate 4.

[0132] In some embodiments, the first metal material can be an aluminum alloy, a particle-reinforced aluminum-based composite material, a magnesium alloy, or a particle-reinforced magnesium-based composite material. For example, 7034 aluminum alloy, 6013 aluminum alloy, AZ31B magnesium alloy, etc. At this time, the first component 41 has a relatively small density. In addition, the material hardness of the first component 41 is suitable, which can reduce the difficulty of CNC processing, and the material hardness of the present application can make the processed first component 41 have sufficient rigidity to ensure the structural reliability of the support plate 4.

[0133] Among them, the particles in the particle-reinforced aluminum-based composite material and the particle-reinforced magnesium-based composite material can be reinforced particles such as silicon carbide, aluminum oxide, boron carbide, carbon nanotubes, graphene, chromium carbide, silicon boride, titanium boride, titanium carbide, etc. For example, the particle-reinforced aluminum-based composite material can be a SiC (silicon carbide) particle reinforcement phase with a mass fraction of 20% + a 6061 aluminum alloy matrix with a mass fraction of 80%, a SiC (silicon carbide) particle reinforcement phase with a mass fraction of 17% + a 6013 aluminum alloy matrix with a mass fraction of 83%, a graphene particle reinforcement phase with a mass fraction of 25% + a 6063 aluminum alloy matrix with a mass fraction of 75%, etc. The particle-reinforced magnesium-based composite material can be a SiC (silicon carbide) particle reinforcement phase with a mass fraction of 20% + an AZ91 magnesium alloy matrix with a mass fraction of 80%, a SiC (silicon carbide) particle reinforcement phase with a mass fraction of 25% + a ZK60 magnesium alloy matrix with a mass fraction of 75%, etc.

[0134] Exemplarily, the second metal material may be stainless steel, titanium alloy or amorphous alloy, such as 17-4PH stainless steel, SUS301 stainless steel, SUS316L stainless steel, TC4 titanium alloy, TA2 titanium alloy, etc. At this time, the second component 42 has a higher hardness and a higher mechanical reliability.

[0135] In some examples, the first metal material is 7034 aluminum alloy, and the second metal material is 17-4PH stainless steel. In other examples, the first metal material is 6013 aluminum alloy, and the second metal material is SUS316L stainless steel. The embodiments of the present application do not strictly limit the specific combination of the first metal material and the second metal material.

[0136] In some embodiments of the present application, the first component 41 of the support plate 4 is made of aluminum alloy, particle-reinforced aluminum-based composite material, magnesium alloy or particle-reinforced magnesium-based composite material, and the second component 42 is made of stainless steel, titanium alloy or amorphous alloy material, so that the support plate 4 has a small mass, high mechanical reliability, good wear resistance, less processing difficulty, lower cost, higher dimensional accuracy and flatness, and higher production yield.

[0137] In some embodiments, such as Figures 4 to 6 As shown, the fixing portion 421 of each second member 42 includes a matching support surface 4211 and a matching installation surface 4212 that are arranged opposite to each other. The connecting portion 422 can be convexly arranged on the matching installation surface 4212, and the matching support surface 4211 is arranged opposite to the connecting portion 422. The supporting surfaces 411 of the plurality of first members 41 and the matching support surfaces 4211 of the plurality of second members 42 face the same direction. The installation surfaces 412 of the plurality of first members 41 and the matching installation surfaces 4212 of the plurality of second members 42 face the same direction.

[0138] Exemplarily, the supporting surfaces 411 of the plurality of first members 41 and the matching supporting surfaces 4211 of the plurality of second members 42 may be coplanarly arranged and jointly spliced ​​into the supporting surface of the supporting plate 4. In this case, the supporting plate 4 can provide a flat supporting environment for the screen 20.

[0139] In some examples, the mounting surfaces 412 of the plurality of first components 41 and the matching mounting surfaces 4212 of the plurality of second components 42 may also be arranged in the same plane to be jointly spliced ​​into the mounting surface of the support plate 4 .

[0140] In some embodiments, such as Figure 6 As shown, the fixing portion 421 of the second member 42 also includes a peripheral side surface 4213, and the peripheral side surface 4213 of the fixing portion 421 is connected between the matching support surface 4211 and the matching installation surface 4212. The peripheral side surface 4213 of the fixing portion 421 is connected to the first member 41 through the connecting layer 43. Exemplarily, the peripheral side surface 4213 of the fixing portion 421 is provided with at least one step surface 4213a. At this time, the peripheral side surface 4213 of the fixing portion 421 has a larger area, thereby increasing the connection area between the fixing portion 421 and the first member 41, increasing the area of ​​the connecting layer 43, and improving the connection strength between the second member 42 and the first member 41. In other examples, the peripheral side surface 4213 of the fixing portion 421 is inclined relative to the matching installation surface 4212. At this time, the peripheral side surface 4213 of the fixing portion 421 is an inclined surface, and the peripheral side surface 4213 of the fixing portion 421 also has a larger area. The peripheral side surface 4213 of the fixing portion 421 may be a flat surface or a curved surface, which is not strictly limited in the embodiment of the present application.

[0141] In some embodiments, such as Figure 6As shown, the fixing portion 421 of the second member 42 may be provided with a matching structure, and the matching structure is used to increase the bonding force between the second member 42 and the first member 41. For example, the matching structure may include a through hole 4214. A portion of the first member 41 is embedded in the through hole 4214. In some examples, the openings at both ends of the through hole 4214 may be located at the step surface 4213a and the matching mounting surface 4212, respectively. Among them, in the direction from the step surface 4213a to the matching mounting surface 4212, the aperture of the through hole 4214 may be increased to form a structure similar to a dovetail groove, thereby further increasing the bonding force between the second member 42 and the first member 41. In some other embodiments, the matching structure may also include through holes or grooves or protrusions of other shapes, etc., which are not strictly limited in the embodiments of the present application.

[0142] In some embodiments, the connecting portion 422 of the second member 42 may be provided with a slide groove or a slide rail for slidingly connecting the rotating mechanism 33 of the rotating assembly 3; and / or, the connecting portion 422 may be provided with an arc-shaped arm, an arc-shaped groove, a rotating shaft or a rotating shaft hole for rotationally connecting the rotating mechanism 33 of the rotating assembly 3. Figure 8 In the figure, the connecting portion 422 is provided with a slide groove 4221 as an example for illustration. At this time, the rotating mechanism 33 of the rotating component 3 can be provided with a slider or a shaft inserted in the slide groove 4221, and the sliding connection between the two is achieved by sliding the slider or the shaft in the slide groove 4221.

[0143] In this embodiment, the connection parts 422 of the plurality of second members 42 may have one or more connection relationships with the rotating mechanism 33 of the rotating assembly 3. For example, the plurality of second members 42 are divided into a first group of second members 42 and a second group of second members 42, the connection parts 422 of the first group of second members 42 are rotatingly connected with the rotating assembly 3, and the connection parts 422 of the second group of second members 42 are slidingly connected with the rotating assembly 3. The structures of the connection parts 422 of the plurality of second members 42 in the same group of second members 42 may be the same or different. The embodiment of the present application does not strictly limit the structures of the plurality of second members 42 of the support plate 4.

[0144] In some embodiments, the first member 41 may include at least one groove, and the opening of the groove is provided on the mounting surface 412. The groove may be used to provide an avoidance space or a matching space when the support plate 4 matches with the rotating mechanism 33 of the rotating assembly 3, so that the matching structure layout of the support plate 4 and the rotating assembly 3 is more compact, which is conducive to the thin design of the electronic device 100. For example, Figure 5The middle support plate 4 shows two grooves 413 arranged at intervals. It is understandable that when the first member 41 of the support plate 4 includes multiple grooves, the shapes, types, and functions of the multiple grooves can be the same or different, and the embodiment of the present application does not strictly limit this. Of course, in other embodiments, the first member 41 may not be provided with grooves.

[0145] In some embodiments, the first member 41 may include at least one protrusion (not shown in the figure), which is protruding from the mounting surface 412. The protrusion may be used to provide guidance, position limiting, connection and other functions when the support plate 4 cooperates with the rotating mechanism 33 of the rotating assembly 3. It is understandable that when the first member 41 of the support plate 4 includes multiple protrusions, the shapes, types and functions of the multiple protrusions may be the same or different, and the embodiments of the present application do not strictly limit this. Of course, in other embodiments, the first member 41 may not be provided with a protrusion.

[0146] In some embodiments, the support plate 4 may further perform surface treatment on the first component 41 and the second component 42 to increase their service life.

[0147] Exemplarily, the support plate 4 may further include a surface anti-corrosion layer (not shown in the figure), which is fixed to and covers the outer surface of the first member 41. The outer surface of the first member 41 is exposed to the outside of the support plate 4, and the outer surface of the first member 41 is not in contact with the connecting layer 43. In this embodiment, the surface anti-corrosion layer is used to improve the corrosion resistance and durability of the first member 41 and the support plate 4, so as to improve the reliability and service life of the support plate 4.

[0148] Among them, since the first component 41 is made of aluminum alloy, particle-reinforced aluminum-based composite material, magnesium alloy or particle-reinforced magnesium-based composite material, the surface anti-corrosion layer can be formed by chemical passivation process to reduce costs. In some other embodiments, the surface anti-corrosion treatment can also be formed by spraying, electrophoresis, anodizing and other processes, which are not strictly limited in the embodiments of the present application.

[0149] Exemplarily, the support plate 4 may also include a PVD (Physical Vapor Deposition) coating (not shown in the figure), and the PVD coating is fixed and covers the outer surface of the second component 42. Among them, the outer surface of the second component 42 is exposed to the outside of the support plate 4, and the outer surface of the second component 42 is not connected to the first component 41. Among them, PVD technology refers to a technology that uses physical methods to vaporize the surface of a material source (solid or liquid) into gaseous atoms or molecules, or partially ionizes into ions under vacuum conditions, and deposits a thin film with a certain special function on the surface of the substrate through a low-pressure gas (or plasma) process. Physical vapor deposition is a surface treatment technology. PVD treatment can be vacuum evaporation coating, vacuum sputtering coating or vacuum ion coating.

[0150] In this embodiment, by covering the outer surface of the second member 42 with a PVD coating, the PVD coating can increase the wear resistance and scratch resistance of the second member 42 and extend the service life. In addition, when the first metal material used by the second member 42 is a titanium alloy or stainless steel, the PVD coating has good bonding with the outer surface of the second member 42, the PVD coating is not easy to fall off, and the reliability is high.

[0151] In some examples, the PVD coating can also reduce the friction coefficient of the surface of the second component 42 , reduce friction loss and energy consumption, and improve the mechanical transmission efficiency between the rotating mechanism 33 of the rotating assembly 3 and the support plate 4 .

[0152] In some examples, the support plate 4 may also be coated with PVD to achieve decorative effects such as coloring.

[0153] In some embodiments, a local area of ​​the support plate 4 can be set as a laser engraving area (not shown in the figure). The surface energy of this area is better, which can enhance the connection strength with the adhesive (such as double-sided tape, glue, etc.) to facilitate the fixing of other structural parts (such as insulating Mylar, etc.). For example, the mounting surface 412 of the first component 41 can be provided with a laser engraving area.

[0154] In some embodiments, such as Figures 4 to 6 As shown, the first component 41, the connecting layer 43 and the second component 42 of the support plate 4 can be formed by an insert powder metallurgy process. In the preparation process of the insert powder metallurgy process, the insert is first prepared, and then the insert and the powder of the connecting insert are sintered together to finally form an integrally formed structural member. Exemplarily, the second component 42 is formed by an insert made of a second metal material, the first component 41 is formed by sintering a powder of a first metal material, and the connecting layer 43 is formed by mutual diffusion of the first metal material and the second metal material.

[0155] In this embodiment, since the first component 41, the connecting layer 43 and the second component 42 of the support plate 4 are integrally formed structural parts formed by the insert powder metallurgy process, based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the second component 42 formed by the insert and the first component 41 formed by the powder, that is, a connecting layer 43 in which the first metal material and the second metal material diffuse with each other is formed. At this time, the formation of the connecting layer 43 significantly improves the interface bonding strength between the first component 41 and the second component 42, so that the connection strength between the first component 41 and the second component 42 is high, and the overall structure of the first component 41, the connecting layer 43 and the second component 42 is stable and reliable.

[0156] In addition, in the process of preparing the support plate 4, the shape of the bonding interface between the first component 41 and the second component 42 can be controlled by controlling the shape of the surface of the insert for contacting the powder. The shape control of the bonding interface is easy to implement, highly flexible and highly precise, so that the first component 41, the second component 42 and the connecting layer 43 have high processing dimensional accuracy while having high connection strength, thereby improving product yield.

[0157] In some embodiments, such as Figure 6 As shown, the connection layer 43 includes a first interface 431 and a second interface 432, and the second interface 432 is arranged opposite to the first interface 431. The first interface 431 connects the first component 41, and the second interface 432 connects the second component 42. For the convenience of the following description, the direction from the first interface 431 of the connection layer 43 to the second interface 432 is defined as the thickness direction of the connection layer 43.

[0158] Figure 7 yes Figure 6 The diagram shows the contents of the main group elements of the first metal material and the second metal material at different positions of the connection layer 43 of the support plate 4 .

[0159] In some embodiments, Figure 7 The diagram shows the variation trend of the content of the main group elements of the first metal material and the content of the main group elements of the second metal material at different positions of the connecting layer 43. The X-axis represents the distance from each part of the connecting layer 43 to the first interface 431 in the thickness direction of the connecting layer 43, and the value X1 corresponds to the distance from the second interface 432 to the first interface 431; the Y-axis represents the content ratio of the material, and the value 1 is 100%. The first metal material and the second metal material are mostly alloy materials, and the main group element of the alloy material refers to the element with the highest content in the alloy. In alloys, some other elements are usually added to change their performance and characteristics, but the content of the main group elements is the highest and plays a leading role in the properties of the alloy. The selection and content of the main group elements determine the chemical composition and basic properties of the alloy. For example, for stainless steel, iron is the main group element, and other added elements such as chromium and nickel play a role in improving corrosion resistance. In addition, for titanium alloys, titanium is the main group element; for aluminum alloys and particle-reinforced aluminum-based composites, aluminum is the main group element; for magnesium alloys and particle-reinforced magnesium-based composites, magnesium is the main group element.

[0160] like Figure 7 As shown, the content of the main group element of the first metal material of the connecting layer 43 decreases in the direction from the first component 41 to the second component 42, and the content of the main group element of the second metal material increases in the direction from the first component 41 to the second component 42. The direction from the first component 41 to the second component 42 is parallel to the thickness direction of the connecting layer 43.

[0161] In this embodiment, the first component 41 adopts a first metal material, and the content of the main group elements of the first metal material of the connecting layer 43 changes from high to low in the direction from the first component 41 to the second component 42. The second component 42 adopts a second metal material, and the content of the main group elements of the second metal material of the connecting layer 43 changes from low to high in the direction from the first component 41 to the second component 42. Therefore, the first component 41 and the connecting layer 43 have a good bonding effect, and the second component 42 and the connecting layer 43 have a good bonding effect. A higher connection strength can be obtained between the first component 41 and the second component 42 through the connecting layer 43, so that the overall structure of the support plate 4 is more stable and reliable.

[0162] Figure 8 yes Figure 6 Schematic diagram of the metallographic structure of a partial structure of the support plate 4 in some possible implementations.

[0163] In some embodiments, such as Figure 8 As shown, the first interface 431 and the second interface 432 are visible in the metallographic structure of the support plate 4. The metallographic structure of the support plate 4 is the internal organizational structure of the support plate 4 seen in a metallographic (optical) microscope. The resolution of the metallographic microscope can be in the micron level, for example, 0.1 micron to 0.5 micron. Since the connecting layer 43 is an interdiffusion layer formed during the sintering process, the first metal material of the first component 41 and the second metal material of the second component 42 are dissimilar metal materials, the first interface 431 where the connecting layer 43 is connected to the first component 41 and the second interface 432 where the connecting layer 43 is connected to the second component 42 can be clearly observed in the metallographic structure.

[0164] Exemplarily, the first interface 431 and the second interface 432 of the connection layer 43 may be relatively smooth interfaces, and slight bumps are allowed on the first interface 431 and the second interface 432. The overall shape of the first interface 431 and the second interface 432 may be designed according to the shape of the support plate 4, for example, it may include a curved surface. Among them, since the connection layer 43 is formed by the metal interdiffusion effect during the sintering process, the multiple regions of the connection layer 43 arranged in its layer direction (i.e., perpendicular to the thickness direction of the connection layer 43) are subjected to a relatively uniform force during the sintering process, so the thickness of the multiple regions is equal or approximately equal, the overall thickness of the connection layer 43 is equal or approximately equal, and the first interface 431 and the second interface 432 may be parallel or approximately parallel to each other.

[0165] like Figure 7As shown, in the metallographic structure of the support plate 4, the first interface 431 can be parallel to or approximately parallel to the second interface 432. At this time, since the parts of the connection layer 43 are of equal thickness, the diffusion degree between the first metal material and the second metal material in the parts of the connection layer 43 is equal, the bonding strength between the parts of the connection layer 43 and the first component 41 is the same or approximately the same, and the bonding strength between the parts of the connection layer 43 and the second component 42 is also the same or approximately the same, so that the support plate 4 can be effectively prevented from cracking at the place where the bonding strength between the connection layer 43 and the first component 41 is weak, or at the place where the bonding strength between the connection layer 43 and the second component 42 is weak, which is conducive to improving the overall structural stability of the support plate 4 and extending the service life of the support plate 4.

[0166] In some embodiments, the thickness H1 of the connection layer 43 may satisfy: 0.1 μm (micrometer) ≤ H1 ≤ 30 μm. For example, the thickness of the connection layer 43 may be 0.8 μm, 2 μm, 3.6 μm, 5 μm, 6 μm, 8 μm, 12 μm, 15 μm, 20 μm, etc.

[0167] In this embodiment, since the first member 41 and the second member 42 are connected together by the connecting layer 43, the thickness of the connecting layer 43 can be greater than or equal to 0.1 μm. The thickness of the connecting layer 43 is relatively thick, so that the first member 41 and the second member 42 can be better combined through the connecting layer 43, which is conducive to improving the bonding strength between the first member 41 and the second member 42 of the support plate 4, thereby improving the overall structural stability of the support plate 4. In addition, the thickness of the connecting layer 43 can also be less than or equal to 30 μm, so that the support plate 4 can meet the bonding strength requirements between the first member 41 and the second member 42, and the preparation time is short, the preparation cost is low, and it is conducive to large-scale production.

[0168] The thickness of the connection layer 43 can be controlled by the sintering process during the preparation of the support plate 4, for example, by the sintering temperature and the sintering time. When the sintering temperature is higher and the sintering time is longer, the thickness of the connection layer 43 is greater. In addition, the thickness of the connection layer 43 affects the connection strength between the first component 41 and the second component 42. When no brittle phase is generated in the connection layer 43, the greater the thickness of the connection layer 43, the better. Of course, the thickness design of the connection layer 43 can also take into account the processing efficiency, processing cost and processing difficulty at the same time, and control the thickness of the connection layer 43 within a certain range.

[0169] In some examples, the thickness of the connection layer 43 may be in the range of 2 μm to 30 μm. In this case, the thickness of the connection layer 43 is relatively large, that is, the thickness of the bonding interface between the first component 41 and the second component 42 is relatively large, so that the interface bonding strength between the first component 41 and the second component 42 is high, and the risk of interface cracking is low. Therefore, the connection strength between the first component 41 and the second component 42 is high, and the overall structure of the first component 41, the connection layer 43 and the second component 42 is stable and reliable.

[0170] In some embodiments, the first component 41 can be formed by sintering powder under a hot isostatic pressing process. For example, the first component 41 can be formed by sintering powder at a sintering temperature of 500° C. to 660° C., a sintering time of 2 hours to 5 hours, and a sintering pressure greater than or equal to 100 MPa.

[0171] In this embodiment, during the process of sintering the first component 41 by powder, the connecting layer 43 is formed by the mutual diffusion of metal materials between the insert and the powder. Therefore, the connecting layer 43 is formed under high temperature and high pressure for a relatively long time. The connecting layer 43 can have a large thickness to ensure a reliable connection between the first component 41 and the second component 42.

[0172] In the embodiment of the present application, since the thickness of the connection layer 43 will be affected when the first metal material and the second metal material are combined with different materials, when selecting the metal for combination of the first metal material and the second metal material, in addition to considering the requirements described above, the mutual diffusion coefficient between the metals can also be considered to meet the reliability and quantification requirements of the product, so that the connection layer 43 can achieve reliable connection between the first component 41 and the second component 42. It can be understood that the combination of the first metal material and the second metal material can have other schemes in addition to the above-mentioned example scheme, and the embodiment of the present application does not strictly limit this.

[0173] The structure and components of the support plate 4 in some embodiments are specifically introduced above, and the method for preparing the support plate will be further introduced below in conjunction with the relevant drawings.

[0174] Fig. 9 is a schematic flow chart of a method for preparing a support plate provided in an embodiment of the present application, Fig.10 yes Fig. 9 Structural schematic diagram of some steps in the method for preparing a support plate in some embodiments Figure 1 , Fig.11 yes Fig.10 A schematic diagram of the structure shown at another angle; Figure 12 to Figure 14 yes Fig. 9 Structural schematic diagram of some steps in the method for preparing a support plate in some embodiments Figures 2 to 4 ; Fig.15 yes Fig.14A schematic diagram of the structure shown at another angle.

[0175] In some embodiments, the present application also provides a method for preparing a support plate, which can be used to prepare the support plate 4 described above (such as Figures 4 to 6 The method includes but is not limited to steps S110 to S140 provided below. Figures 9 to 15 , the various steps of the method for preparing the support plate are introduced:

[0176] Step S110 : preparing the insert 51 .

[0177] For example, Fig.10 and Fig.11 As shown, the insert 51 can be prepared to be connected with the second member 42 (such as Figures 4 to 6 For example, the insert 51 may include a plate portion 511 and a structural portion 512, the plate portion 511 includes a first surface 5111, a second surface 5112 and a third surface 5113, the first surface 5111 and the second surface 5112 are arranged opposite to each other, and the third surface 5113 is circumferentially connected between the first surface 5111 and the second surface 5112. The third surface 5113 is provided with a step surface 5113a. The structural portion 512 is connected to the second surface 5112, and the structural portion 512 is provided with at least one structural feature, which may be, for example, a protrusion and / or a groove and / or a through hole. Fig.11 In the figure, the structural feature is the slide groove 5114 as an example for illustration.

[0178] For example, the insert 51 can be obtained by metal injection molding (MIM), stamping, CNC machining or vacuum die casting. In some other embodiments, the insert 51 can also be obtained by other processing techniques, which is not strictly limited in the present embodiment.

[0179] Exemplarily, the insert 51 may be made of a second metal material, which is a metal material with a relatively high hardness, such as stainless steel, titanium alloy or amorphous alloy. For example, the second metal material may be 17-4PH stainless steel, in which case the insert 51 may be formed by MIM. Alternatively, the second metal material may be SUS316L stainless steel, in which case the insert 51 may be formed by CNC processing. Alternatively, the second metal material may be an amorphous alloy, in which case the insert 51 may be formed by vacuum die casting. The specific material of the insert 51 is not strictly limited in the present embodiment of the application.

[0180] Step S120 : placing the insert 51 into the mold 6 , piling the powder 52 in the mold 6 , and making the powder 52 contact the insert 51 , so as to form the part 5 to be sintered.

[0181] For example, Fig.12 As shown, in step S120, multiple inserts 51 can be placed into the mold 6 according to the preset positions. At this time, the mold 6 and the multiple inserts 51 together form a receiving space 61, and part of the surface of the insert 51 forms part of the wall surface of the receiving space 61. Fig.10 and Fig.12 As shown, the third surface 5113 of the plate portion 511 of the insert 51 can form a partial wall surface of the accommodating space 61. The structural portion 512 of the insert 51 is located outside the accommodating space 61. The accommodating space 61 is divided into multiple parts by multiple inserts 51. In this embodiment, the mold 6 can accurately position the insert 51, thereby ensuring the relative positions between the multiple inserts 51, which is conducive to improving the preparation yield of the support plate 4.

[0182] like Fig.10 and Fig.13 As shown, in step S120, the powder 52 may be accumulated in the receiving space 61 of the mold 6, and the powder 52 contacts the third surface 5113 of the plate portion 511 of the insert 51, thereby contacting the insert 51 to form the to-be-sintered component 5. In some examples, the accumulation height of the powder 52 may be flush with the first surface 5111 of the plate portion 511 of the insert 51. In other embodiments, the accumulation height of the powder 52 may also be higher than the first surface 5111 of the plate portion 511 of the insert 51.

[0183] In this embodiment, the sintered part 5 includes powder 52 and insert 51, and the powder 52 and insert 51 are in contact and maintain a relative positional relationship through the mold 6. In addition, the overall shape of the powder 52 after accumulation changes with the shape of the insert 51 and the mold 6, so by processing the shape of the insert 51 and the shape of the mold 6, the shape of the contact interface between the insert 51 and the powder 52 can be controlled, and the overall shape of the powder 52 after accumulation can also be controlled.

[0184] In some examples, the powder 52 can be obtained through powder making, powder blending and powder mixing processes. In other examples, the powder 52 can also be obtained through other processes, which are not strictly limited in the embodiments of the present application.

[0185] For example, the powder 52 may be made of a first metal material, which is a metal material with a relatively low density. For example, the density of the first metal material may be less than the density of the second metal material, and the hardness of the second metal material may be greater than the hardness of the first metal material. In some examples, the density of the first metal material is less than or equal to 3.5 g / cm 3 , and / or, the hardness of the second metal material is greater than or equal to 150 HV.

[0186] Exemplarily, the first metal material may be an aluminum alloy, a particle-reinforced aluminum-based composite material, a magnesium alloy, or a particle-reinforced magnesium-based composite material. For example, the first metal material may be a 7034 aluminum alloy, a 6013 aluminum alloy, a silicon carbide-reinforced aluminum-based composite material, etc. In some examples, the combination of the first metal material and the second metal material may be a 7034 aluminum alloy and 17-4PH stainless steel.

[0187] Among them, other solution details of the first metal material and the second metal material can be found in the relevant description above and will not be repeated here.

[0188] Step S130: sintering the part to be sintered 5 to form a sintered part 7.

[0189] For example, Fig.14 and Fig.15 As shown, the sintered part 7 includes a first part 71, a second part 72 and a transition layer 73 connecting the first part 71 and the second part 72. There are multiple first parts 71 and multiple second parts 72, and the multiple first parts 71 and the multiple second parts 72 are arranged alternately one by one, and the adjacent first parts 71 and the second parts 72 are connected by the transition layer 73. The material of the first part 71 is a first metal material, and the shape of the first part 71 corresponds to the stacking shape of the powder 52; the material of the second part 72 is a second metal material, and the shape of the second part 72 corresponds to the shape of the insert 51; the material of the transition layer 73 includes a first metal material and a second metal material, and the shape of the transition layer 73 corresponds to the shape of the contact interface between the insert 51 and the powder 52. The content of the main group element of the first metal material in the transition layer 73 gradually decreases in the direction from the first part 71 to the second part 72, and the content of the main group element of the second metal material gradually increases in the direction from the first part 71 to the second part 72. In the following text, the process of sintering the sintered part 5 can be referred to as the sintering process.

[0190] In this embodiment, the sintered part 5 is formed into an integrally formed sintered part 7 by an insert powder metallurgy process. The second part 72 of the sintered part 7 is formed by the insert 51, and the first part 71 is formed by the powder 52. The transition layer 73 is formed at the contact interface between the insert 51 and the powder 52, and is formed by the mutual diffusion of the first metal material and the second metal material during the sintering process. The transition layer 73 is an interdiffusion layer with a composition gradient, which can significantly improve the interface bonding strength between the first part 71 and the second part 72, so that the connection strength between the two is high, and the overall structure of the sintered part 7 is stable and reliable.

[0191] Among them, since the transition layer 73 is formed by the metal interdiffusion effect during the sintering process, the multiple regions of the transition layer 73 arranged in the layer direction (i.e., perpendicular to the thickness direction of the transition layer 73) are subjected to relatively uniform force during the sintering process, so the thickness of the multiple regions is equal or approximately equal, the overall thickness of the transition layer 73 is equal or approximately equal, and the two interfaces of the transition layer 73 respectively connecting the first part 71 and the second part 72 can be parallel to each other or approximately parallel to each other. Among them, the two interfaces of the transition layer 73 respectively connecting the first part 71 and the second part 72 can be relatively smooth interfaces, and slight undulations are allowed on the interfaces.

[0192] Exemplarily, the thickness H1 of the transition layer 73 may satisfy: 0.1 μm (micrometer) ≤ H1 ≤ 30 μm. For example, the thickness of the transition layer 73 may be 0.8 μm, 2 μm, 3.6 μm, 5 μm, 6 μm, 8 μm, 12 μm, 15 μm, 20 μm, etc.

[0193] In this embodiment, since the first part 71 and the second part 72 are connected together through the transition layer 73, the thickness of the transition layer 73 can be greater than or equal to 0.1 μm. The thickness of the transition layer 73 is relatively thick, so that the first part 71 and the second part 72 can be better combined through the transition layer 73, and the connection strength between the two is high and the connection is stable. In addition, the thickness of the transition layer 73 can also be less than or equal to 30 μm, which is conducive to shortening the preparation time of the sintered part 7, thereby reducing the preparation cost and facilitating large-scale production.

[0194] Exemplarily, in step S130, the sintered part 5 can be sintered by hot isostatic pressing (HIP). During the sintering process, the sintering pressure P1 satisfies: P1 ≥ 100 MPa, the sintering temperature T1 satisfies: 500°C (degrees Celsius) ≤ T1 ≤ 660°C, and the sintering time t1 satisfies: 2h (hours) ≤ t1 ≤ 5h. At this time, the mutual diffusion degree between the first metal material and the second metal material is deep, and the thickness of the transition layer 73 is large, for example, greater than or equal to 2 μm, so that the connection strength between the first part 71 and the second part 72 is high.

[0195] Illustratively, in step S110, when preparing the insert 51, the surface roughness of a portion of the surface of the insert 51 (e.g., the third surface 5113) can be increased to increase the contact area between the insert 51 and the powder 52, thereby increasing the bonding strength between the first portion 71 and the second portion 72 of the sintered part 7 formed after step S130, thereby improving the overall structural stability of the support plate 4 formed subsequently.

[0196] The surface roughness of the surface of the insert 51 can be increased by mechanical grinding of a part of the surface. Alternatively, a rubber-drawing structure such as a round hole or a dovetail groove can be formed on the insert 51 by mechanical processing, or a steel sheet with a rubber-drawing structure can be welded on the insert 51 to form a physical riveting structure on a part of the surface of the insert 51, thereby increasing the surface roughness of the part of the surface of the insert 51. For example, Fig.10 and Fig.11 As shown, the insert 51 is provided with a hole 514 , and the powder will be partially filled into the hole 514 in step S120 , so that the bonding strength between the first part 71 and the second part 72 of the sintered part 7 is high.

[0197] Exemplarily, after step S120 and before step S130, the method may further include: performing cold isostatic pressing on the part to be sintered 5. After the part to be sintered 5 is subjected to cold isostatic pressing (CIP), the powder 52 is pre-pressed to facilitate the subsequent sintering process. The pressure during the cold isostatic pressing process may be greater than or equal to 100 MPa, for example, in the range of 100 MPa to 630 MPa, the temperature may be room temperature, and the duration may be between 1 hour and 3 hours. In some other embodiments, after the part to be sintered 5 is subjected to the cold isostatic pressing process, the part to be sintered 5 may also be vacuum degassed to release the residual gas in the part to be sintered 5, thereby facilitating the subsequent sintering process.

[0198] Exemplarily, after step S130, the method may further include a step of performing a solution aging treatment on the sintered part 7. In this embodiment, after the sintered part 7 is subjected to the solution aging treatment, the first portion 71 of the sintered part 7 can obtain a higher yield strength and / or hardness.

[0199] The solid solution aging treatment step includes: performing solid solution treatment on the sintered part 7; cooling the sintered part 7; and performing aging treatment on the sintered part 7. For example, the solid solution treatment may be performed on the sintered part 7 first; then the solid solution treated sintered part 7 may be water quenched at room temperature to cool the sintered part 7; after the sintered part 7 is cooled to room temperature, the aging treatment is then performed on it.

[0200] In some examples, the first metal material is an aluminum alloy or a particle-reinforced aluminum-based composite material. In the solution aging treatment, the solution temperature T2 of the solution treatment satisfies: 500°C ≤ T2 ≤ 550°C, and the solution time t2 satisfies: 15min (minutes) ≤ t2 ≤ 60min; and / or, the aging temperature T3 of the aging treatment satisfies: 170°C ≤ T3 ≤ 200°C, and the aging time t3 satisfies: 4h ≤ t3 ≤ 24h.

[0201] In other examples, the first metal material is a magnesium alloy or a particle-reinforced magnesium-based composite material. In the solution aging treatment, the solution temperature T2 of the solution treatment satisfies: 380°C ≤ T2 ≤ 420°C, and the solution time t2 satisfies: 0.5h ≤ t2 ≤ 12h; and / or, the aging temperature T3 of the aging treatment satisfies: 180°C ≤ T3 ≤ 220°C, and the aging time t3 satisfies: 1h ≤ t3 ≤ 8h.

[0202] Step S140: processing the sintered part 7 to form the support plate 4.

[0203] For example, Figures 4 to 6 as well as Fig.14 and Fig.15 As shown, in step S140, the step of processing the sintered part 7 may include: machining the sintered part 7 to form a first component 41, a second component 42 and a connecting layer 43. At this time, through the step of machining, the shape and / or size of the sintered part 7 can be changed to form a first component 41, a second component 42 and a connecting layer 43 with a designed shape. Among them, the first component 41 is formed by the first part 71, the second component 42 is formed by the second part 72, and the connecting layer 43 is formed by the transition layer 73. Specifically, the remaining part of the first part 71 after machining forms the first component 41. The remaining part of the second part 72 after machining forms the second component 42. The remaining part of the transition layer 73 after machining forms the connecting layer 43.

[0204] In this embodiment, the material of the first component 41 is the first metal material, the material of the second component 42 is the second metal material, and the material of the connecting layer 43 includes the first metal material and the second metal material. The content of the main group element of the first metal material of the connecting layer 43 gradually decreases in the direction from the first component 41 to the second component 42, and the content of the main group element of the second metal material gradually increases in the direction from the first component 41 to the second component 42.

[0205] In some examples, the machining step may include CNC machining, mechanical polishing and other steps. For example, CNC machining may be the main machining step, which is used to machine the basic shape and / or size, and then further fine machining may be performed by mechanical polishing. In this embodiment, since the support plate 4 is a one-piece sintered part 7 that is CNC machined to obtain basic structural features, there is no need to assemble multiple parts by riveting, welding, screwing, etc. in subsequent steps, so the dimensional accuracy and flatness accuracy of the support plate 4 are relatively high.

[0206] Among them, in step S110, when the insert 51 has processed the main structure of the second component 42, the processing of the second component 42 in the CNC processing in step S140 can be further finishing to improve the dimensional accuracy of the second component 42. In step S110, if the insert 51 has only processed a part of the structure of the second component 42, another part of the structure of the second component 42 can be processed in the CNC processing in step S140.

[0207] Among them, in step S120, when the mold 6 defines the shape of the powder 52 so that the first part 71 after the powder 52 is sintered includes the main structure of the first component 41, the processing of the first component 41 in the CNC processing in step S140 can be further finishing to improve the dimensional accuracy of the first component 41. In step S120, if the mold 6 defines the shape of the powder 52 so that the first part 71 after the powder 52 is sintered only includes a part of the structure of the first component 41, then another part of the structure of the first component 41 can be processed during the CNC processing in step S140.

[0208] Among them, mechanical polishing can adopt processes such as sandblasting, wire drawing, CD grain processing, etc. Mechanical polishing can make the surface of the support plate 4 formed subsequently smoother and glossier, and remove some surface defects to improve the appearance and performance of the support plate 4, and improve its quality and service life. Among them, in the mechanical processing step, the thickness of the sintered part 7 can also be thinned so that the final support plate 4 has a smaller thickness. In some other examples, the mechanical processing step may also not include mechanical polishing, and the embodiment of the present application does not strictly limit this.

[0209] For example, Figure 3 As shown, in step S140, after mechanical processing of the sintered part 7, the step of processing the sintered part 7 may further include: performing PVD treatment on at least part of the surface of the second component 42 to form a PVD coating. Other related designs of the PVD coating can refer to the above embodiments and will not be described here.

[0210] For example, Figure 3As shown, in step S140, after the sintered part 7 is machined, the step of machining the sintered part 7 may also include: performing surface anti-corrosion treatment on at least part of the surface of the first component 41 to form a surface anti-corrosion layer. The surface anti-corrosion layer can improve the corrosion resistance and durability of the first component 41 to improve the reliability and service life of the support plate 4. Among them, the surface anti-corrosion treatment can adopt a chemical passivation process to form a layer of anti-corrosion chemical film, that is, a surface anti-corrosion layer, on the surface of the first component 41. The cost of chemical passivation is low. In some other examples, the surface anti-corrosion treatment can also adopt processes such as spraying, electrophoresis, and anodizing to form a coating or plating on the surface of the first component 41, which is used as a surface anti-corrosion layer. Other related designs of the surface anti-corrosion layer can refer to the previous embodiments and will not be repeated here.

[0211] Exemplarily, in step S140, after mechanical processing of the sintered part 7, the step of processing the sintered part 7 may further include: laser engraving a local area of ​​the outer surface of the sintered part 7 to form a laser engraved area. The surface energy of the laser engraved area is better, and the connection strength with the adhesive (such as double-sided tape, glue, etc.) can be enhanced to facilitate the fixing of other structural parts. Other related designs of the laser engraved area can refer to the above embodiments, which will not be repeated here.

[0212] It is understandable that in step S140, the PVD treatment process, the surface anti-corrosion treatment process, and the laser engraving process are all optional processes and non-essential processes. In some other embodiments, the method for preparing the support plate may not include one or more of these processes.

[0213] Exemplarily, in step S140, after mechanical processing of the sintered part 7, the step of processing the sintered part 7 may further include: assembling auxiliary materials. The auxiliary materials (not shown in the figure) may be structural parts such as foam and Mylar sheets. When step S140 includes a PVD treatment process, and / or a surface anticorrosion treatment process, and / or a laser engraving process, the auxiliary material assembly process may be performed after these processes. The auxiliary material assembly process is also an optional process and a non-essential process.

[0214] In the method for preparing a support plate in an embodiment of the present application, a portion of the insert 51 is used to form the second component 42 of the support plate 4, another portion of the insert 51 and a portion of the powder 52 are used to form the connecting layer 43 of the support plate 4 together, and another portion of the powder 52 is used to form the first component 41 of the support plate 4. The first component 41, the second component 42 and the connecting layer 43 of the support plate 4 are structural parts formed in one piece by an insert powder metallurgy process. Based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the first component 41 and the second component 42, that is, a connecting layer 43 in which the first metal material and the second metal material diffuse with each other is formed. The presence of the connecting layer 43 significantly improves the interface bonding strength between the first component 41 and the second component 42, so that the connection strength between the first component 41 and the second component 42 is high, and the overall structure of the first component 41, the connecting layer 43 and the second component 42 is stable and reliable.

[0215] In addition, by hot isostatic pressing the sintered part 5 in step S130, the mutual diffusion degree of the first metal material and the second metal material is effectively improved, so that the thickness of the transition layer 73 of the sintered part 7 is relatively large, so the thickness of the connecting layer 43 of the support plate 4 is relatively large, and the thickness of the bonding interface between the first component 41 and the second component 42 is relatively large, so that the interface bonding strength between the first component 41 and the second component 42 is high, and the risk of interface cracking is low. Therefore, the connection strength between the first component 41 and the second component 42 is high, and the overall structure of the first component 41, the connecting layer 43 and the second component 42 is stable and reliable.

[0216] Furthermore, during the preparation of the support plate 4, the support plate 4 can control the shape of the bonding interface between the first component 41 and the second component 42 by controlling the shape of the surface of the insert 51 for contacting the powder 52. The shape control of the bonding interface is easy to implement, highly flexible, and highly accurate, so that the first component 41, the second component 42, and the connecting layer 43 have high processing accuracy when having a high connection strength. In addition, since the shape of the bonding interface is easy to control, the actual thickness of the first component 41 and the second component 42 can be close to or equal to the designed thickness when the design requirements are met, so that the thickness of the support plate 4 can be reasonably controlled.

[0217] In the embodiment of the present application, the support plate 4 adopts a composite structure of a first component 41 and a second component 42. The first component 41 adopts a first metal material, and the second component 42 adopts a second metal material. Through the arrangement of the first metal material and the second metal material, the support plate 4 can achieve high reliability and light weight.

[0218] In the embodiment of the present application, by performing solution aging treatment on the sintered part 7 after step S130, the yield strength and / or hardness of the first part 71 of the sintered part 7 can be effectively improved, so that the yield strength and / or hardness of the first component 41 of the support plate 4 can be improved, and the mechanical reliability of the support plate 4 is higher and the service life is longer.

[0219] Fig.16 yes Fig. 9 The structural schematic diagram of some steps in the method for preparing a support plate in other embodiments is shown. The method for preparing a support plate in this embodiment can include most of the technical features of the method for preparing a support plate in the previous embodiment. The following mainly describes the differences between the two, and most of the same technical features of the two are not repeated.

[0220] In some embodiments, in step S110 of the method for preparing the support plate, the insert 51 may include a plurality of main body members 51a and a connecting member 51b connecting the plurality of main body members 51a. The structure of the main body member 51a may refer to Fig.10 and Fig.11 The relevant description of the structure of the insert 51 shown. The multiple main parts 51a are arranged according to the relative position relationship of the multiple second components 42 of the support plate 4, and the adjacent two main parts 51a are connected and fixed by the connecting member 51b, so that the multiple main parts 51a can maintain a stable relative position relationship. In step S120, since the insert 51 is an integrated structure, the insert 51 can be loaded into the mold 6 at one time, and the assembly is convenient. In addition, in step S130, since the mold 6 and the connecting member 51b can jointly define the relative position relationship of the multiple main parts 51a, even if the multiple main parts 51a are subjected to some stress during the sintering process, their relative position relationship can still remain stable.

[0221] In some examples, the connector 51b of the insert 51 is not removed but retained in the subsequent steps of the method for preparing the support plate. At this time, a portion of the plurality of main members 51a of the insert 51 is used to form a plurality of second members 42 of the support plate 4, another portion of the plurality of main members 51a and a portion of the powder 52 are used to form the connecting layer 43 of the support plate 4, and the connector 51b of the insert 51 and another portion of the powder 52 are used to form the first member 41 of the support plate 4.

[0222] In other examples, the connecting member 51b of the insert 51 can be removed in a subsequent step of the method for preparing the support plate. At this time, a portion of the plurality of main members 51a of the insert 51 is used to form a plurality of second members 42 of the support plate 4, another portion of the plurality of main members 51a and a portion of the powder 52 are used to form the connecting layer 43 of the support plate 4, and another portion of the powder 52 is used to form the first member 41 of the support plate 4.

[0223] It is understandable that the specific design position of the connector 51b of the insert 51 can be adaptively changed according to whether the connector 51b needs to be removed later. For example, in the solution of not removing, the connector 51b can be connected to the side of the main body 51a, and in the solution of removing, the connector 51b can be connected to the top surface of the main body 51a. The specific position of the connector 51b is not strictly limited in the embodiment of the present application.

[0224] Among them, other designs of the insert 51 and other designs of the method for preparing the support plate can be referred to the relevant description of the previous embodiments, which will not be repeated here.

[0225] Fig.17 The support plate 4 of this embodiment can include most of the technical features of the support plate 4 of the previous embodiment. The following mainly describes the differences between the two, and most of the same technical features of the two are not repeated.

[0226] In some embodiments, the support plate 4 may include a first component 41, a second component 42 and a connecting layer 43. Exemplarily, the number of the first components 41 is multiple, the number of the second components 42 is multiple, and the multiple second components 42 are arranged alternately with the multiple first components 41. Among them, the adjacent first components 41 and the second components 42 are connected by the connecting layer 43. Among them, the peripheral side surface 4213 of the fixing portion 421 of the second component 42 may be perpendicular to the matching mounting surface 4212. At this time, the peripheral side surface 4213 of the fixing portion 421 is also perpendicular to the matching support surface 4211. In the length extension direction of the support plate 4, the matching support surface 4211 and the matching mounting surface 4212 of the fixing portion 421 are of equal width. Among them, please refer to the relevant description of the previous embodiment for other designs of the support plate 4, which will not be repeated here.

[0227] Figures 18 to 21 yes Fig. 9 Structural schematic diagram of some steps in the method for preparing the support plate in other embodiments Figures 1 to 4 The method for preparing a support plate in this embodiment may include most of the technical features of the method for preparing a support plate in the previous embodiment. The following mainly describes the differences between the two methods, and most of the same technical features of the two methods will not be repeated.

[0228] In some embodiments, such as Fig.18 As shown, in step S110 of the method for preparing a support plate, the profile 53 may be cut into a plurality of blocks to form the insert 51. The profile 53 is made of the second metal material.

[0229] like Fig.19As shown, in step S120 of the method for preparing a support plate, a plurality of inserts 51 may be placed in the inner cavity of the mold 6 according to preset positions. At this time, the mold 6 and the inserts 51 together form a receiving space 61, and a portion of the side surface of the insert 51 forms a portion of the wall surface of the receiving space 61. Exemplarily, the inner cavity of the mold 6 may be roughly in the shape of a long strip, and the plurality of inserts 51 divide the inner cavity of the mold 6 into a plurality of spaces.

[0230] like Fig. 20 As shown, in step S120 of the method for preparing a support plate, powder 52 may be accumulated in the receiving space 61 of the mold 6 , and the powder 52 contacts the side surface of the insert 51 to form the to-be-sintered component 5 .

[0231] like Fig.21 As shown, in step S130 of the method for preparing the support plate, the sintered part 7 includes a first part 71, a second part 72, and a transition layer 73 connecting the first part 71 and the second part 72. There are multiple first parts 71, multiple second parts 72, multiple first parts 71 and multiple second parts 72 are arranged alternately one by one, and adjacent first parts 71 and second parts 72 are connected by the transition layer 73. The sintered part 5 is formed into an integrally formed sintered part 7 by an insert powder metallurgy process, the second part 72 of the sintered part 7 is formed by an insert 51, the first part 71 is formed by a powder 52, and the transition layer 73 is formed at the contact interface between the insert 51 and the powder 52, and is formed by the mutual diffusion of the first metal material and the second metal material during the sintering process.

[0232] like Figure 4 , Figure 5 as well as Fig.21 As shown, in step S140 of the method for preparing the support plate, the shape and / or size of the sintered part 7 can be changed by machining to form a first component 41, a second component 42 and a connecting layer 43 with a designed shape. The sintered part 7 can be formed into the basic shape and / or size of the support plate 4 by CNC machining.

[0233] Among them, other designs of the method for preparing the support plate can be referred to the relevant description of the previous embodiment, which will not be repeated here.

[0234] Fig. 22 is a schematic diagram of the structure of the support plate 4 provided in the embodiment of the present application in other embodiments, Fig.23 yes Fig. 22 The support plate 4 of this embodiment can include most of the technical features of the support plate 4 of the previous embodiment. The following mainly describes the differences between the two, and most of the same technical features of the two are not repeated.

[0235] In some embodiments, such as Fig. 22 and Fig.23 As shown, the support plate 4 may include a first member 41, a second member 42 and a connecting layer 43. Among them, the second member 42 includes a fixing portion 421 and a connecting portion 422. Exemplarily, the number of the first member 41 is one, the number of the second member 42 is multiple, the multiple second members 42 are arranged at intervals, and the fixing portions 421 of the multiple second members 42 are all connected to the first member 41. The fixing portion 421 of each second member 42 is connected to the first member 41 through the connecting layer 43. In other words, the connecting layer 43 is connected between the first member 41 and the second member 42, and the connecting layer 43 forms a connecting interface between the first member 41 and the second member 42. The first member 41, the connecting layer 43 and the second member 42 of the support plate 4 are integrally formed structural parts. Exemplarily, the first member 41 adopts a first metal material, the second member 42 adopts a second metal material, and the second metal material is different from the first metal material. The connecting layer 43 includes a first metal material and a second metal material.

[0236] In this embodiment, since the first component 41, the connecting layer 43 and the second component 42 of the support plate 4 are integrally formed structural parts formed by the insert powder metallurgy process, based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the second component 42 formed by the insert and the first component 41 formed by the powder, that is, a connecting layer 43 in which the first metal material and the second metal material diffuse with each other is formed. At this time, the formation of the connecting layer 43 significantly improves the interface bonding strength between the first component 41 and the second component 42, so that the connection strength between the first component 41 and the second component 42 is high, and the overall structure of the first component 41, the connecting layer 43 and the second component 42 is stable and reliable.

[0237] In addition, in the process of preparing the support plate 4, the shape of the bonding interface between the first component 41 and the second component 42 can be controlled by controlling the shape of the surface of the insert for contacting the powder. The shape control of the bonding interface is easy to implement, highly flexible and highly precise, so that the first component 41, the second component 42 and the connecting layer 43 have high processing dimensional accuracy while having high connection strength, thereby improving product yield.

[0238] For example, Fig. 22 As shown, the support surface 411 of the first member 41 forms the support surface of the support plate 4. At this time, since the support surfaces of the support plate 4 are all formed by the first member 41, they can have better consistency.

[0239] For example, Fig.23As shown, the connecting portion 422 of the second member 42 is connected to the fixing portion 421 and is exposed relative to the mounting surface 412 of the first member 41. The fixing portion 421 of the second member 42 may include a connecting surface 4215, a matching mounting surface 4212 and a peripheral side surface 4213, the connecting portion 422 is connected to the matching mounting surface 4212, the connecting surface 4215 is arranged to face away from the matching mounting surface 4212, and the peripheral side surface 4213 is connected between the matching mounting surface 4212 and the connecting surface 4215.

[0240] The connection surface 4215 and the peripheral side surface 4213 of the fixing portion 421 are connected to the first member 41 through the connection layer 43. At this time, the connection area between the fixing portion 421 and the connection layer 43 is large, and the area of ​​the connection layer 43 is large, which improves the connection strength between the first member 41 and the second member 42, making the overall structure of the support plate 4 more stable and reliable.

[0241] In some examples, the fixing portion 421 of the second member 42 may be provided with at least one matching structure, and the matching structure is used to increase the bonding force between the second member 42 and the first member 41. For example, the matching structure may include a through hole 4214, and the openings at both ends of the through hole 4214 may be respectively located at the matching mounting surface 4212 and the connecting surface 4215 of the fixing portion 421. The aperture of the through hole 4214 may remain unchanged; or, the aperture of the through hole 4214 may increase in the direction from the connecting surface 4215 toward the matching mounting surface 4212 to form a structure similar to a dovetail groove. The specific structure of the matching structure is not strictly limited in the embodiments of the present application.

[0242] Among them, other designs of the support plate 4 please refer to the relevant description of the previous embodiment, which will not be repeated here.

[0243] Figure 24 to Figure 27 yes Fig. 9 Structural schematic diagram of some steps in the method for preparing the support plate in other embodiments Figures 1 to 4 , Fig.28 yes Fig. 27 The structure shown is a schematic diagram of the structure at another angle. The method for preparing the support plate of this embodiment can include most of the technical features of the method for preparing the support plate of the previous embodiment. The following mainly describes the differences between the two, and most of the same technical features of the two are not repeated.

[0244] In some embodiments, such as Fig.24 As shown, in step S110 of the method for preparing the support plate, the insert 51 can be prepared to be connected to the second member 42 (such as Fig.23For example, the insert 51 may include a plate portion 511 and a structural portion 512, the plate portion 511 includes a first surface 5111, a second surface 5112 and a third surface 5113, the first surface 5111 and the second surface 5112 are arranged opposite to each other, and the third surface 5113 is circumferentially connected between the first surface 5111 and the second surface 5112. The structural portion 512 is connected to the second surface 5112 and is provided with at least one structural feature, which may be, for example, a protrusion and / or a groove and / or a through hole.

[0245] like Fig.25 As shown, in step S120 of the method for preparing the support plate, multiple inserts 51 can be placed in the inner cavity of the mold 6 according to preset positions. At this time, the mold 6 and the multiple inserts 51 together form a receiving space 61. Fig.24 and Fig.25 As shown, the second surface 5112 and at least a portion of the third surface 5113 of the plate portion 511 of the insert 51 form a partial wall surface of the accommodating space 61 , and the structural portion 512 of the insert 51 is located outside the accommodating space 61 .

[0246] like Fig.26 As shown, in step S120 of the method for preparing the support plate, the powder 52 may be deposited in the receiving space 61 of the mold 6, and the powder 52 contacts the plate portion 511 of the insert 51 to form the to-be-sintered component 5. For example, the powder 52 contacts the first surface 5111 and the third surface 5113 of the plate portion 511 of the insert 51.

[0247] like Fig. 27 and Fig.28 As shown, in step S130 of the method for preparing the support plate, the sintered part 7 includes a first part 71, a second part 72, and a transition layer 73 connecting the first part 71 and the second part 72. There is one first part 71, and there are multiple second parts 72. The multiple second parts 72 are arranged at intervals, and each second part 72 is connected to the first part 71 through the transition layer 73. The sintered part 5 is formed into an integrally formed sintered part 7 by an insert powder metallurgy process. The second part 72 of the sintered part 7 is formed by an insert 51, and the first part 71 is formed by powder 52. The transition layer 73 is formed at the contact interface between the insert 51 and the powder 52, and is formed by the mutual diffusion of the first metal material and the second metal material during the sintering process.

[0248] Among them, other designs of the method for preparing the support plate can be referred to the relevant description of the previous embodiment, which will not be repeated here.

[0249] Fig.29The support plate 4 of this embodiment can include most of the technical features of the support plate 4 of the previous embodiment. The following mainly describes the differences between the two, and most of the same technical features of the two are not repeated.

[0250] In some embodiments, such as Fig.29 As shown, the support plate 4 may include a first member 41, a second member 42 and a connecting layer 43. The number of the second members 42 is multiple. Each second member 42 includes a fixing portion 421 and a connecting portion 422, and the fixing portions 421 of the multiple second members 42 are connected to the first member 41 through the connecting layer 43. The shapes of the fixing portions 421 of the multiple second members 42 may be the same or different, and the connection shape of the fixing portion 421 and the first member 41 may change accordingly. For example, the fixing portions 421 of some second members 42 may adopt the same shape as described above. Figure 6 The fixing portion 421 of the embodiment has a similar or identical structure, and the fixing portion 421 of the second member 42 may adopt the same structure as that in the previous embodiment. Fig.23 The connecting portions 422 of the plurality of second members 42 may include a plurality of different structures to form a plurality of connection relationships with the rotating mechanism 33 of the rotating assembly 3. For example, the connecting portions 422 of some second members 42 may include a slide groove to slidably connect to the rotating mechanism 33 of the rotating assembly 3; the connecting portions 422 of some second members 42 may include an arc-shaped arm to rotatably connect to the rotating mechanism 33 of the rotating assembly 3.

[0251] It can be understood that the number, structure and connection structure of the second component 42 of the support plate 4 and the first component 41 in the embodiment of the present application can be flexibly combined with reference to the relevant schemes of the previous embodiment, and the embodiment of the present application does not strictly limit the specific number, position and structure of the first component 41 and the second component 42 of the support plate 4.

[0252] Among them, other designs of the support plate 4 please refer to the relevant description of the previous embodiment, which will not be repeated here.

[0253] Fig.30 The support plate 4 of this embodiment can include most of the technical features of the support plate 4 of the previous embodiment. The following mainly describes the differences between the two, and most of the same technical features of the two are not repeated.

[0254] In some embodiments, such as Fig.30 As shown, the support plate 4 may include a first component 41 , a second component 42 and a connection layer 43 . The second component 42 is connected to the first component 41 through the connection layer 43 .

[0255] Exemplarily, the first member 41 may include at least one protrusion, which is protruding from the mounting surface 412. The protrusion may be used to engage with the rotating mechanism 33 of the rotating assembly 3 (see Figure 3 ) connection, so that the support plate 4 can establish multiple connection relationships with the rotating mechanism 33 through the first component 41 and the second component 42 to ensure the smooth and accurate movement of the support plate 4.

[0256] For example, Fig.30 As shown, the first member 41 includes a protrusion 414, and the first member 41 can be fixedly connected to the rotating mechanism 33 through the protrusion 414. At this time, the support plate 4 is fixedly connected to the rotating mechanism 33 through the first member 41, and is movably connected to the rotating mechanism 33 through the second member 42. The movably connected includes but is not limited to a sliding connection, a rotating connection, etc.

[0257] In some examples, the protrusion 414 may be provided with a fastening hole, and the support plate 4 may be fixedly connected to the rotating mechanism 33 through the protrusion 414 by a fastener. It is understandable that since the protrusion 414 and the rotating mechanism 33 are fixedly connected, the relative connection relationship is relatively stable and the wear is small, so the protrusion 414 may be provided on the first member 41. In some other embodiments, the protrusion for achieving the fixed connection relationship may also be provided on the second member 42.

[0258] Among them, other designs of the support plate 4 please refer to the relevant description of the previous embodiment, which will not be repeated here.

[0259] In the above embodiments, the electronic device 100 is an inward-folding electronic device, and in some other embodiments, the electronic device 100 may also be an outward-folding electronic device.

[0260] Fig.31 is a structural diagram of another electronic device 100 provided in an embodiment of the present application when it is in an open state. Fig.32 yes Fig.31 The schematic diagram of the structure of the electronic device 100 is shown in a closed state. Fig.33 yes Fig.31 The electronic device 100 shown is a cross-sectional schematic diagram of a partial structure cut along BB. The electronic device 100 of this embodiment may include most of the technical features of the electronic device 100 of the previous embodiment. The following mainly describes the differences between the two, and most of the same technical features of the two are not repeated.

[0261] In some embodiments, the electronic device 100 includes a housing device 10 and a screen 20, and the screen 20 is installed in the housing device 10. The housing device 10 can be unfolded to an open state, or folded to a closed state, or unfolded or folded to an intermediate state, and the intermediate state can be any state between the open state and the closed state. The screen 20 is a flexible screen, and the housing device 10 can drive the screen 20 to unfold or fold. Among them, when the housing device 10 is in a closed state, the screen 20 is located outside the housing device 10.

[0262] The housing device 10 may include a first housing 1, a second housing 2 and a rotating assembly 3. Exemplarily, the rotating assembly 3 includes a first support plate 31, a second support plate 32 and a rotating mechanism 33. The rotating mechanism 33 is connected between the first housing 1 and the second housing 2 so that the first housing 1 and the second housing 2 can be relatively unfolded or relatively folded. For example, the rotating mechanism 33 may include a main shaft 331, a first connecting portion 332 and a second connecting portion 333, the first connecting portion 332 is connected between the first housing 1 and the main shaft 331, and the second connecting portion 333 is connected between the main shaft 331 and the second housing 2. The screen 20 is fixedly connected to the first housing 1 and the second housing 2, so that the screen 20 can move with the first housing 1 and the second housing 2.

[0263] The first support plate 31 and the second support plate 32 are both located between the rotating mechanism 33 and the screen 20. The first support plate 31 and the second support plate 32 are used to support the screen 20. The first support plate 31 and the second support plate 32 both have a support surface for supporting the screen 20. The first support plate 31 and the second support plate 32 are both movably connected to the rotating mechanism 33. In this embodiment, during the relative rotation of the first shell 1 and the second shell 2, the rotating mechanism 33 moves, and the first support plate 31 and the second support plate 32 move with the rotating mechanism 33.

[0264] In some examples, during the relative expansion of the first housing 1 and the second housing 2, the first support plate 31 and the second support plate 32 move with the rotating mechanism 33 and are relatively expanded. Fig.33As shown, when the first shell 1 and the second shell 2 are relatively unfolded to the open state, the first support plate 31 and the second support plate 32 are flattened, and the support surface 311 of the first support plate 31 and the support surface 321 of the second support plate 32 are coplanar or almost coplanar, thereby providing a flat support environment for the screen 20. In the process of the first shell 1 and the second shell 2 being relatively folded, the two support plates 4 move with the rotating mechanism 33 and fold relatively. Among them, when the first shell 1 and the second shell 2 are relatively folded to the closed state, the support surface 311 of the first support plate 31 and the support surface 321 of the second support plate 32 can move to be arranged back to back with each other, and the screen 20 is located outside the first shell 1, the first support plate 31, the second support plate 32 and the second shell 2. At this time, the first support plate 31 and the second support plate 32 can support the screen 20.

[0265] Exemplarily, the first support plate 31 can be movably connected to the first connection part 332, and the second support plate 32 can be movably connected to the second connection part 333. Alternatively, the first support plate 31 can be movably connected to the first connection part 332 and the main shaft 331, and the second support plate 32 can be movably connected to the second connection part 333 and the main shaft 331. Among them, the movable connection relationship between the first support plate 31 and the first connection part 332 and / or the main shaft 331 can include a rotational connection and / or a sliding connection and / or a fixed connection. The movable connection relationship between the second support plate 32 and the second connection part 333 and / or the main shaft 331 can include a rotational connection and / or a sliding connection and / or a fixed connection. The embodiment of the present application does not strictly limit the specific implementation structure of the rotating mechanism 33, the specific connection structure of the first support plate 31 and the rotating mechanism 33, and the specific connection structure of the second support plate 32 and the rotating mechanism 33.

[0266] In the embodiment of the present application, the first support plate 31 and the second support plate 32 can adopt a similar structure. The structural design and preparation method of the first support plate 31 and the second support plate 32 can refer to the description of the previous embodiment. The specific structure can also be adaptively changed according to different application environments (such as different connection relationships with other structures, etc.), which will not be repeated here.

[0267] It is understandable that in the foldable electronic device 100, whether it is an outward-folding electronic device or an inward-folding electronic device, the rotating assembly 3 is its core component. In order to meet the requirements of opening and closing life, reliability and flatness, the rotating assembly 3 usually needs to be assembled from a large number of parts (for example, by riveting, welding and gluing). Many of the parts are made of different materials and different processes to give full play to the advantages of various materials. However, due to the large number of parts in the rotating assembly 3 and the complex assembly process, the cumulative tolerance of the rotating assembly 3 is large and the finished product yield is low.

[0268] In the embodiment of the present application, by carrying out a special structural design and preparation method design on the support plate 4, the support plate 4 is formed into a lightweight, highly reliable and highly dimensional-precision one-piece structure, thereby improving the finished product yield of the support plate 4. The improvement of the support plate 4 also helps to reduce the number of parts of the rotating assembly 3, simplify the assembly process, and improve the finished product yield.

[0269] In addition, other components of the rotating assembly 3, such as the main shaft, shielding door panel, etc., can also be improved with reference to the structure and preparation process of the support plate 4, so as to not only minimize the number of components and reduce the difficulty of assembly, but also adopt a variety of materials according to local conditions and integrate the advantages of various materials to meet the performance requirements of different components (such as wear resistance, etc.), so as to make the rotating assembly 3 lower in cost and better in performance.

[0270] All the above drawings are illustrative diagrams of the present application. The drawings mainly illustrate the parts of the product related to the embodiments of the present application. The product may still include other parts not shown in the drawings. In addition, the actual shape, actual position, actual size and proportion, actual structure, actual quantity, etc. of the parts or structures of the product are not limited by the drawings.

[0271] The above embodiments are used to illustrate the technical solutions of the present application rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0272] In the absence of conflict, the embodiments of the present application and the features in the embodiments may be combined with each other, and any combination of features in different embodiments is also within the protection scope of the present application. That is to say, the multiple embodiments described above may also be arbitrarily combined according to actual needs.

Claims

1. A support plate, characterized in that: Applicable to a rotating assembly of a foldable electronic device, the support plate is used to support the screen of the electronic device; The support plate includes a first member, a second member and a connecting layer; the first member is in a plate shape, and includes a supporting surface and a mounting surface disposed opposite to each other, and the supporting surface is used to support the screen; the second member includes a fixing portion and a connecting portion, the fixing portion is connected to the first member through the connecting layer, the connecting portion is connected to the fixing portion and is exposed relative to the mounting surface, the connecting portion is used to connect the rotating mechanism of the rotating assembly, and the connecting portion is provided with a protrusion and / or a groove and / or a through hole; the first member, the connecting layer and the second member are integrally formed structural parts; The first component is made of a first metal material, the second component is made of a second metal material, the connection layer includes the first metal material and the second metal material, the density of the first metal material is less than the density of the second metal material, and the hardness of the second metal material is greater than the hardness of the first metal material.

2. The support plate according to claim 1, characterized in that: The number of the first components is plural, the number of the second components is plural, and the plural second components and the plural first components are arranged alternately one by one; The fixing portion of each second member includes a matching support surface, and the matching support surface is arranged away from the connecting portion; The supporting surfaces of the plurality of first components and the matching supporting surfaces of the plurality of second components are arranged in the same plane and are jointly spliced ​​to form the supporting surface of the supporting plate.

3. The support plate according to claim 2, characterized in that: The fixing portion further comprises a matching installation surface and a peripheral side surface, wherein the matching installation surface is arranged opposite to the matching support surface, the peripheral side surface is connected between the matching installation surface and the support surface, and the peripheral side surface is connected to the first component through the connecting layer; The peripheral side surface is provided with at least one step surface; or, the peripheral side surface is inclined relative to the matching installation surface.

4. The support plate according to claim 1, characterized in that: The number of the first component is one, the number of the second components is multiple, and the fixing portions of the multiple second components are all connected to the first component.

5. The support plate according to any one of claims 1 to 4, characterized in that: The connecting portion is provided with a slide groove or a slide rail for slidingly connecting the rotating mechanism of the rotating component; and / or, the connecting portion is provided with an arc-shaped arm, an arc-shaped groove, a rotating shaft or a rotating shaft hole for rotationally connecting the rotating mechanism of the rotating component.

6. The support plate according to any one of claims 1 to 4, characterized in that: The first component includes at least one groove, the opening of which is arranged on the installation surface; and / or the first component includes at least one protrusion, which is arranged protruding from the installation surface.

7. The support plate according to any one of claims 1 to 6, characterized in that: The thickness H1 of the connection layer satisfies: 0.1 μm≤H1≤30 μm; or, 2 μm≤H1≤30 μm.

8. The support plate according to any one of claims 1 to 7, characterized in that: The yield strength of the second metal material is greater than the yield strength of the first metal material.

9. The support plate according to any one of claims 1 to 8, characterized in that: The hardness of the second metal material is greater than or equal to 150 HV, and / or the yield strength of the second metal material is greater than or equal to 200 MPa, and / or the density of the first metal material is less than or equal to 3.5 g / cm 3 .

10. The support plate according to any one of claims 1 to 9, characterized in that: The first metal material is an aluminum alloy, a particle-reinforced aluminum-based composite material, a magnesium alloy or a particle-reinforced magnesium-based composite material; and / or the second metal material is a titanium alloy, stainless steel or an amorphous alloy.

11. The support plate according to any one of claims 1 to 10, characterized in that: The content of the main group element of the first metal material in the connection layer decreases in the direction from the first member to the second member, and the content of the main group element of the second metal material increases in the direction from the first member to the second member.

12. The support plate according to any one of claims 1 to 11, characterized in that: A first interface is formed between the first component and the connection layer, and a second interface is formed between the second component and the connection layer. The first interface and the second interface are visible in the metallographic structure of the support plate.

13. The support plate according to claim 12, characterized in that: In the metallographic structure of the support plate, the first interface is parallel to the second interface.

14. The support plate according to any one of claims 1 to 13, characterized in that The first component, the connecting layer and the second component are formed by insert powder metallurgy process; The second component is formed by an insert made of a second metal material, the first component is formed by sintering powder of a first metal material, and the connection layer is formed by mutual diffusion of the second metal material and the first metal material.

15. The support plate according to claim 14, characterized in that: The first component is formed by sintering the powder at a sintering temperature of 500° C. to 660° C., a sintering time of 2 hours to 5 hours, and a sintering pressure greater than or equal to 100 MPa.

16. A foldable electronic device, characterized in that: The electronic device comprises a housing device and a screen; The housing device comprises a first housing, a second housing and a rotating assembly, wherein the rotating assembly comprises a rotating mechanism and two supporting plates according to any one of claims 1 to 15, wherein the rotating mechanism is connected between the first housing and the second housing so that the first housing and the second housing can be relatively unfolded or relatively folded; The screen is fixedly connected to the first shell and the second shell, the two support plates are located between the rotating mechanism and the screen, and the two support plates are movably connected to the rotating mechanism; During the relative expansion of the first shell and the second shell, the two support plates move with the rotating mechanism and are relatively expanded; during the relative folding of the first shell and the second shell, the two support plates move with the rotating mechanism and are relatively folded.

17. A method for preparing the support plate according to any one of claims 1 to 13, characterized in that: include: preparing an insert, wherein the insert is made of a second metal material; Placing the insert into a mold, accumulating powder in the mold, and making the powder contact the insert to form a sintered part, wherein the powder is made of a first metal material; Sintering the to-be-sintered part to form a sintered part; as well as Processing the sintered part to form a support plate; Part of the insert is used to form the second component of the support plate, another part of the insert and a part of the powder are used to jointly form the connecting layer of the support plate, and another part of the powder is used to form the first component of the support plate.

18. The method according to claim 17, characterized in that During the sintering of the to-be-sintered part, the sintering pressure P1 satisfies: P1 ≥ 100 MPa, the sintering temperature T1 satisfies: 500° C. ≤ T1 ≤ 660° C., and the sintering time t1 satisfies: 2 h ≤ t1 ≤ 5 h.

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