Series liquid cooling flow channel for frequency converter

Abstract

The invention discloses a series liquid cooling runner for a frequency converter. The series liquid cooling runner comprises a first liquid flow cavity formed in a liquid cooling plate; the second liquid flow cavity is arranged at the top of the liquid cooling plate and is positioned below the silicon carbide power unit; the third liquid flow cavity is arranged in the liquid cooling plate and is positioned below the capacitor; the fourth liquid flow cavity is arranged at the top of the first placing block and is positioned above the direct-current reactor; the fifth liquid flow cavity is arranged in the liquid cooling plate and is positioned below the rectifier bridge; the sixth liquid flow cavity is arranged at the top of the second placing block and is positioned below the input reactor; the seventh liquid flow cavity is arranged in the liquid cooling plate and is used for allowing the cooling liquid to flow out; and cooling liquid flows in from the cooling liquid inlet, sequentially flows through the plurality of liquid flow cavities which are connected in series and then flows out from the cooling liquid outlet, and is used for cooling the electrical elements according to a sequence of heating values from high to low. According to the invention, heat dissipation can be carried out on electrical elements on the frequency converter according to the sequence of heat productivity from high to low, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation of electronic devices, and in particular to a series liquid cooling channel for a frequency converter. Background Art

[0002] As the power of the inverter increases, the heat generated by its internal components also increases. If the heat cannot be dissipated in time, the inverter will generate heat and alarm and shut down. The inverter often uses air cooling to dissipate heat, but air cooling is greatly affected by the external temperature, the heat dissipation effect is unstable, and the inverter is prone to failure due to overheating. In order to improve the efficiency of air cooling, a high-power centrifugal fan is required. The greater the power of the centrifugal fan, the larger its volume. Therefore, the volume of the inverter is getting larger and larger, which not only takes up space, but also increases costs. Therefore, the present application proposes a series liquid cooling channel for the inverter, which is used to solve the problems of large size, space occupation, poor heat dissipation effect, and unstable heat dissipation of the heat dissipation device of the above-mentioned existing inverter. Summary of the invention

[0003] In view of the above defects or deficiencies in the prior art, it is desirable to provide a series liquid cooling channel for a frequency converter, which can dissipate heat from electrical components on the frequency converter in order of heat generation from high to low, thereby improving the heat dissipation effect.

[0004] The present invention provides a series liquid cooling channel for a frequency converter, the frequency converter includes a liquid cooling plate and an electrical component, the top of the liquid cooling plate is integrally provided with a first placement block and a second placement block, the electrical component includes a support capacitor and a DC reactor installed in the first placement block, an input reactor installed in the second placement block, a silicon carbide power unit and a rectifier bridge installed on the top of the liquid cooling plate, the silicon carbide power unit, the support capacitor, the DC reactor, the rectifier bridge and the input reactor are arranged in descending order of heat generation, and is characterized in that the liquid cooling channel includes:

[0005] A first liquid flow cavity provided in the liquid cooling plate for the cooling liquid to flow into;

[0006] A second liquid flow chamber is provided on the top of the liquid cooling plate and below the silicon carbide power unit, and is used to dissipate heat for the silicon carbide power unit;

[0007] A third liquid flow chamber disposed in the liquid cooling plate below the capacitor, for dissipating heat from the supporting capacitor;

[0008] A fourth liquid flow chamber disposed on the top of the first placement block and above the DC reactor, for dissipating heat from the DC reactor;

[0009] A fifth liquid flow chamber disposed in the liquid cooling plate below the rectifier bridge, for dissipating heat from the rectifier bridge;

[0010] A sixth liquid flow chamber disposed on the top of the second placement block and below the input reactor, for dissipating heat from the input reactor;

[0011] A seventh liquid flow cavity provided in the liquid cooling plate for the cooling liquid to flow out;

[0012] The first liquid flow chamber, the second liquid flow chamber, the third liquid flow chamber, the fourth liquid flow chamber, the fifth liquid flow chamber, the sixth liquid flow chamber and the seventh liquid flow chamber are connected in series;

[0013] One end of the first liquid flow cavity is communicated with a cooling liquid inlet provided on the liquid cooling plate, and one end of the seventh liquid flow cavity is communicated with a cooling liquid outlet provided on the liquid cooling plate; the cooling liquid flows in from the cooling liquid inlet, flows through the first liquid flow cavity, the second liquid flow cavity, the third liquid flow cavity, the fourth liquid flow cavity, the fifth liquid flow cavity, the sixth liquid flow cavity and the seventh liquid flow cavity in sequence, and then flows out from the cooling liquid outlet, so as to dissipate heat from the electrical components in the order of heat generation from high to low; wherein,

[0014] The seventh liquid flow chamber is located below the input reactor and is used to dissipate heat for the input reactor;

[0015] The cooling liquid inlet and the cooling liquid outlet are arranged on the same side of the liquid cooling plate.

[0016] Preferably, a first liquid outlet is formed at one end of the first liquid flow chamber away from the coolant inlet, a first liquid inlet is formed at one end of the third liquid flow chamber, and both the first liquid outlet and the first liquid inlet are connected to the second liquid flow chamber;

[0017] The other end of the third liquid flow chamber is provided with a second liquid outlet, and one end of the fifth liquid flow chamber is provided with a second liquid inlet, and the second liquid outlet and the second liquid inlet are both connected to the fourth liquid flow chamber;

[0018] A third liquid outlet is formed at the other end of the fifth liquid flow chamber, a third liquid inlet is formed at one end of the seventh liquid flow chamber away from the cooling liquid outlet, and both the third liquid outlet and the third liquid inlet are connected to the sixth liquid flow chamber.

[0019] Preferably, a first guide channel and a second guide channel communicating with the fourth liquid flow chamber are provided on both sides of the first placement block, the first guide channel communicating with the second liquid outlet, and the second guide channel communicating with the second liquid inlet;

[0020] A third guide channel and a fourth guide channel are provided on both sides of the sixth liquid flow chamber in the second placement block, the third guide channel is connected to the third liquid outlet, and the fourth guide channel is connected to the third liquid inlet.

[0021] Preferably, the first placement block is provided with a first placement cavity for installing the supporting capacitor and a second placement cavity for installing the DC reactor, and the second placement block is provided with a third placement cavity for installing the input reactor.

[0022] Preferably, one end of the first liquid flow chamber close to the coolant inlet and one end of the seventh liquid flow chamber close to the coolant outlet are both provided with chamfers.

[0023] Compared with the prior art, the beneficial effects of the present invention are:

[0024] The present invention comprises a first liquid flow chamber, a second liquid flow chamber, a third liquid flow chamber, a fifth liquid flow chamber and a seventh liquid flow chamber arranged on a liquid cooling plate, and further comprises a fourth liquid flow chamber arranged on a first placement block and a sixth liquid flow chamber arranged on a second placement block. The first liquid flow chamber, the second liquid flow chamber, the third liquid flow chamber, the fourth liquid flow chamber, the fifth liquid flow chamber, the sixth liquid flow chamber and the seventh liquid flow chamber are connected in series in a descending order of the calorific value of the electrical components. The cooling liquid flows in from the cooling liquid inlet, and flows through the first liquid flow chamber, the second liquid flow chamber, the third liquid flow chamber, the fourth liquid flow chamber, the fifth liquid flow chamber, the sixth liquid flow chamber and the seventh liquid flow chamber in sequence in a descending order of the calorific value of the electrical components, and then flows out from the cooling liquid outlet. In the process of flow, In the invention, the silicon carbide power unit is cooled by the second liquid flow chamber, the capacitor is cooled by the third liquid flow chamber, the DC reactor is cooled by the fourth liquid flow chamber, the rectifier bridge is cooled by the fifth liquid flow chamber, and the input reactor is cooled by the sixth and seventh liquid flow chambers; the series liquid cooling flow channel of the present application cools the electrical components in the order of high to low heat generation through the series liquid flow chambers, thereby avoiding the problem of excessive temperature difference in the liquid flow chambers and improving the heat dissipation effect; the present application directly opens a liquid flow chamber on the liquid cooling plate, and the liquid cooling heat dissipation reduces the volume of the heat dissipation device compared with the traditional air cooling heat dissipation device; and the liquid cooling heat dissipation is less affected by the external environment, and the heat dissipation effect is better and more stable.

[0025] It should be understood that the contents described in the summary of the invention are not intended to limit the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0027] Figure 1 A perspective view of the present invention;

[0028] Figure 2 It is a front view of the present invention;

[0029] Figure 3 A top view of the present invention;

[0030] Figure 4 A schematic diagram of the structure of installing electrical components of the present invention;

[0031] Numbers in the figure: 1, liquid cooling plate; 2, first placement block; 3, second placement block; 4, silicon carbide power unit; 5, supporting capacitor; 6, DC reactor; 7, rectifier bridge; 8, input reactor;

[0032] 11. First liquid flow chamber; 12. Second liquid flow chamber; 13. Third liquid flow chamber; 14. Fourth liquid flow chamber; 15. Fifth liquid flow chamber; 16. Sixth liquid flow chamber; 17. Seventh liquid flow chamber; 18. Coolant inlet; 19. Coolant outlet;

[0033] 21. a first flow guiding channel; 22. a second flow guiding channel;

[0034] 31. The third flow guiding channel; 32. The fourth flow guiding channel;

[0035] 111, a first liquid outlet;

[0036] 131, a first liquid inlet; 132, a second liquid outlet;

[0037] 151, a second liquid inlet; 152, a third liquid outlet;

[0038] 171. The third liquid inlet. DETAILED DESCRIPTION

[0039] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant inventions, rather than to limit the invention. It should also be noted that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0040] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0041] Please refer to Figure 1 to Figure 4, an embodiment of the present invention provides a series liquid cooling channel for a frequency converter, wherein the frequency converter includes a liquid cooling plate 1 and an electrical component arranged on the top of the liquid cooling plate 1, wherein the top of the liquid cooling plate 1 is integrally formed with a first placement block 2 and a second placement block 3, the electrical component includes a support capacitor 5 and a DC reactor 6 installed in the first placement block 2, an input reactor 8 installed in the second placement block 3, a silicon carbide power unit 4 and a rectifier bridge 7 installed on the top of the liquid cooling plate 1, and the silicon carbide power unit 4, the support capacitor 5, the DC reactor 6, the rectifier bridge 7 and the input reactor 8 are arranged in descending order of heat generation;

[0042] Specifically, the heat generation of the silicon carbide power unit 4, the supporting capacitor 5, the DC reactor 6, the rectifier bridge 7 and the input reactor 8, as well as their sensitivity to temperature, are simulated in the heat dissipation simulation software. According to the simulation data, the silicon carbide power unit 4 has the largest heat generation, followed by the supporting capacitor 5, and then the DC reactor 6, the rectifier bridge 7 and the input reactor 8. Therefore, the present application dissipates heat for the silicon carbide power unit 4, the supporting capacitor 5, the DC reactor 6, the rectifier bridge 7 and the input reactor 8 in the order of the heat generation of the electrical components from high to low;

[0043] Preferably, the serial liquid cooling channel of the present application comprises a first liquid flow chamber 11, a second liquid flow chamber 12, a third liquid flow chamber 13, a fourth liquid flow chamber 14, a fifth liquid flow chamber 15, a sixth liquid flow chamber 16 and a seventh liquid flow chamber 17, wherein the first liquid flow chamber 11 is arranged in the liquid cooling plate 1 for the cooling liquid to flow in;

[0044] The second liquid flow chamber 12 is arranged at the top of the liquid cooling plate 1 and below the silicon carbide power unit 4, and is used to dissipate heat for the silicon carbide power unit 4; specifically, the second liquid flow chamber 12 is arranged at the inner top of the liquid cooling plate 1, and the silicon carbide power unit 4 is fixedly connected to the outer top of the liquid cooling plate 1 by bolts, and the cylindrical pin of the silicon carbide power unit 4 is embedded in the second liquid flow chamber 12;

[0045] The third liquid flow cavity 13 is arranged in the liquid cooling plate 1 below the supporting capacitor 5, and is used to dissipate heat for the supporting capacitor 5; preferably, a first placement cavity for installing the supporting capacitor 5 is arranged on the first placement block 2; specifically, the supporting capacitor 5 is embedded in the first placement cavity, and is fixed by injecting thermal conductive glue after embedding;

[0046] The fourth liquid flow chamber 14 is arranged on the top of the first placement block 2 and above the DC reactor 6, and is used to dissipate heat for the DC reactor 6; preferably, a second placement chamber for installing the DC reactor 6 is provided on the first placement block 2; specifically, the DC reactor 6 is embedded in the second placement chamber, and is also fixed by injecting thermal conductive glue after embedding;

[0047] The fifth liquid flow chamber 15 is arranged in the liquid cooling plate 1 below the rectifier bridge 7, and is used to dissipate heat for the rectifier bridge 7; specifically, the rectifier bridge 7 is fixed to the top of the liquid cooling plate 1 by bolts, corresponding to the position of the fifth liquid flow chamber 15;

[0048] The sixth liquid flow chamber 16 is arranged at the top of the second placement block 2 and below the input reactor 8, and is used to dissipate heat for the input reactor 8; preferably, a third placement chamber for installing the input reactor 8 is arranged on the second placement block 3; specifically, the input reactor 8 is embedded in the third placement chamber, and is also fixed by injecting thermal conductive glue after embedding;

[0049] The seventh liquid flow cavity 17 is arranged in the liquid cooling plate 1 below the input reactor 8, and is used for the cooling liquid to flow out, and is also used for dissipating heat from the input reactor 8;

[0050] Preferably, the first liquid flow chamber 11, the second liquid flow chamber 12, the third liquid flow chamber 13, the fourth liquid flow chamber 14, the fifth liquid flow chamber 15, the sixth liquid flow chamber 16 and the seventh liquid flow chamber 17 are connected in series;

[0051] One end of the first liquid flow chamber 11 is connected to the cooling liquid inlet 18 provided on the liquid cooling plate 1, and one end of the seventh liquid flow chamber 17 is connected to the cooling liquid outlet 19 provided on the liquid cooling plate 1; the cooling liquid flows in from the cooling liquid inlet 18, flows through the first liquid flow chamber 11, the second liquid flow chamber 12, the third liquid flow chamber 13, the fourth liquid flow chamber 14, the fifth liquid flow chamber 15, the sixth liquid flow chamber 16 and the seventh liquid flow chamber 17 in sequence, and then flows out from the cooling liquid outlet 19, so as to dissipate heat from the electrical components in the order of the heat generation from high to low; wherein,

[0052] The seventh liquid flow chamber 17 is located below the input reactor 8 and is used to dissipate heat for the input reactor 8; the sixth liquid flow chamber 17 and the seventh liquid flow chamber 17 both dissipate heat for the input reactor 8;

[0053] The coolant inlet 18 and the coolant outlet 19 are arranged on the same side of the liquid cooling plate 1; specifically, the coolant inlet 18 and the coolant outlet 19 are connected to an external container filled with coolant to realize the circulation of the coolant, and the coolant inlet 18 and the coolant outlet 19 are arranged on the side of the same side of the liquid cooling plate 1, so that the first liquid flow chamber 11, the second liquid flow chamber 12, the third liquid flow chamber 13, the fourth liquid flow chamber 14, the fifth liquid flow chamber 15, the sixth liquid flow chamber 16 and the seventh liquid flow chamber are connected in series similar to a three-dimensional ring, which reduces the space of the liquid flow chamber layout compared to the linear series connection method;

[0054] During heat dissipation, the coolant flows in from the coolant inlet 18, and flows through the first liquid flow chamber 11, the second liquid flow chamber 12, the third liquid flow chamber 13, the fourth liquid flow chamber 14, the fifth liquid flow chamber 15, the sixth liquid flow chamber 16 and the seventh liquid flow chamber 17 in the order of the heat generation of the electrical components from high to low, and then flows out from the coolant outlet 19. During the flow process, the silicon carbide power unit 4, the support capacitor 5, the DC reactor 6, the rectifier bridge 7 and the input reactor 8 are cooled in the order of the heat generation from high to low, avoiding the problem of excessive temperature difference in the liquid flow chamber and improving the heat dissipation effect. The present application directly opens a plurality of liquid flow chambers on the liquid cooling plate 1, and the liquid cooling heat dissipation reduces the volume of the heat dissipation device compared with the traditional air cooling heat dissipation device. Moreover, the liquid cooling heat dissipation is less affected by the external environment, and the heat dissipation effect is better and more stable.

[0055] In a preferred embodiment, if Figure 3 As shown, a first liquid outlet 111 is provided at one end of the first liquid flow chamber 11 away from the cooling liquid inlet 18, and a first liquid inlet 131 is provided at one end of the third liquid flow chamber 13. Both the first liquid outlet 111 and the first liquid inlet 131 are connected to the second liquid flow chamber 12;

[0056] The other end of the third liquid flow chamber 13 is provided with a second liquid outlet 132, and one end of the fifth liquid flow chamber 15 is provided with a second liquid inlet 151, and both the second liquid outlet 132 and the second liquid inlet 151 are connected to the fourth liquid flow chamber 14;

[0057] A third liquid outlet 152 is formed at the other end of the fifth liquid flow chamber 15 , and a third liquid inlet 171 is formed at one end of the seventh liquid flow chamber 17 away from the coolant outlet 19 . Both the third liquid outlet 152 and the third liquid inlet 171 are connected to the sixth liquid flow chamber 16 .

[0058] Preferably, the first guide channel 21 and the second guide channel 22 are provided on both sides of the fourth liquid flow chamber 14 in the first placement block 2, and are connected thereto. The first guide channel 21 is connected to the second liquid outlet 132, and the second guide channel 22 is connected to the second liquid inlet 151; specifically, the first backflow channel 21, the fourth liquid flow chamber 14 and the second liquid flow channel 22 are connected in a "U" shape, and the coolant flowing out of the second liquid outlet 132 flows into the first backflow channel 21, and then flows into the fourth liquid flow chamber 14 from bottom to top in the first backflow channel 21, flows into the second guide channel 22 from top to bottom after passing through the fourth liquid flow chamber 14, and flows into the fifth liquid flow chamber 15 from the second liquid inlet 151 after passing through the second guide channel 22;

[0059] Preferably, the third guide channel 31 and the fourth guide channel 32 are provided on both sides of the sixth liquid flow chamber 16 in the second placement block 3, and the third guide channel 31 is connected to the third liquid outlet 152, and the fourth guide channel 32 is connected to the third liquid inlet 171. Specifically, the third guide channel 31, the sixth liquid flow chamber 16 and the fourth guide channel 32 are connected in a "U" shape, and the coolant flowing out of the third liquid outlet 152 flows into the third backflow channel 31, and then flows into the sixth liquid flow chamber 16 from bottom to top in the third backflow channel 31, flows into the fourth backflow channel 32 from top to bottom after passing through the sixth liquid flow chamber 16, and flows into the seventh liquid flow chamber 17 from the third liquid inlet 171 after passing through the fourth guide channel 32.

[0060] Preferably, the end of the first liquid flow chamber 11 close to the coolant inlet 18 and the end of the seventh liquid flow chamber close to the coolant outlet 19 are both chamfered. Specifically, the chamfer is used to guide the coolant to flow into the first liquid flow chamber 11 and out of the seventh liquid flow chamber 17 better.

[0061] It should be noted that the liquid cooling channel in the present application can also dissipate heat for other heat-generating electrical components, and is not limited to dissipating heat for the silicon carbide power unit 4, the supporting capacitor 5, the DC inductor 6, the rectifier bridge 7 and the input inductor 8. Other electrical components that need heat dissipation are also installed in the corresponding liquid flow cavity positions in the order of heat generation from high to low. When dissipating heat, the coolant flows in multiple liquid flow cavities arranged in series in the order of heat generation of the electrical components from high to low, thereby better dissipating the heat of the electrical components.

[0062] In the description of this specification, the terms "connection", "installation", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0063] In the description of this specification, the description of the terms "one embodiment", "some embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0064] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A series liquid cooling channel for a frequency converter, the frequency converter comprising a liquid cooling plate and electrical components, the top of the liquid cooling plate is integrally provided with a first placement block and a second placement block, the electrical components comprising a support capacitor and a DC reactor installed in the first placement block, an input reactor installed in the second placement block, a silicon carbide power unit and a rectifier bridge installed on the top of the liquid cooling plate, the silicon carbide power unit, the support capacitor, the DC reactor, the rectifier bridge and the input reactor are arranged in descending order of heat generation, characterized in that: The liquid cooling channel comprises: A first liquid flow cavity provided in the liquid cooling plate for the cooling liquid to flow into; A second liquid flow chamber is provided on the top of the liquid cooling plate and below the silicon carbide power unit, and is used to dissipate heat for the silicon carbide power unit; A third liquid flow chamber disposed in the liquid cooling plate below the capacitor, for dissipating heat from the supporting capacitor; A fourth liquid flow chamber disposed on the top of the first placement block and above the DC reactor, for dissipating heat from the DC reactor; A fifth liquid flow chamber disposed in the liquid cooling plate below the rectifier bridge, for dissipating heat from the rectifier bridge; A sixth liquid flow chamber provided at the top of the second placement block and below the input reactor, for dissipating heat from the input reactor; A seventh liquid flow cavity provided in the liquid cooling plate for the cooling liquid to flow out; The first liquid flow chamber, the second liquid flow chamber, the third liquid flow chamber, the fourth liquid flow chamber, the fifth liquid flow chamber, the sixth liquid flow chamber and the seventh liquid flow chamber are connected in series; One end of the first liquid flow cavity is communicated with a cooling liquid inlet provided on the liquid cooling plate, and one end of the seventh liquid flow cavity is communicated with a cooling liquid outlet provided on the liquid cooling plate; the cooling liquid flows in from the cooling liquid inlet, flows through the first liquid flow cavity, the second liquid flow cavity, the third liquid flow cavity, the fourth liquid flow cavity, the fifth liquid flow cavity, the sixth liquid flow cavity and the seventh liquid flow cavity in sequence, and then flows out from the cooling liquid outlet, so as to dissipate heat from the electrical components in the order of heat generation from high to low; wherein, The seventh liquid flow chamber is located below the input reactor and is used to dissipate heat for the input reactor; The cooling liquid inlet and the cooling liquid outlet are arranged on the same side of the liquid cooling plate.

2. The series liquid cooling channel for a frequency converter according to claim 1, characterized in that: A first liquid outlet is formed at one end of the first liquid flow chamber away from the cooling liquid inlet, a first liquid inlet is formed at one end of the third liquid flow chamber, and both the first liquid outlet and the first liquid inlet are connected to the second liquid flow chamber; The other end of the third liquid flow chamber is provided with a second liquid outlet, and one end of the fifth liquid flow chamber is provided with a second liquid inlet, and the second liquid outlet and the second liquid inlet are both connected to the fourth liquid flow chamber; A third liquid outlet is formed at the other end of the fifth liquid flow chamber, a third liquid inlet is formed at one end of the seventh liquid flow chamber away from the cooling liquid outlet, and both the third liquid outlet and the third liquid inlet are connected to the sixth liquid flow chamber.

3. The series liquid cooling channel for a frequency converter according to claim 2, characterized in that: A first guide channel and a second guide channel are provided on both sides of the fourth liquid flow chamber in the first placement block and are connected thereto, the first guide channel is connected to the second liquid outlet, and the second guide channel is connected to the second liquid inlet; A third guide channel and a fourth guide channel are provided on both sides of the sixth liquid flow chamber in the second placement block, the third guide channel is connected to the third liquid outlet, and the fourth guide channel is connected to the third liquid inlet.

4. The series liquid cooling channel for a frequency converter according to claim 1, characterized in that: The first placement block is provided with a first placement cavity for installing the support capacitor and a second placement cavity for installing the DC reactor, and the second placement block is provided with a third placement cavity for installing the input reactor.

5. The series liquid cooling channel for a frequency converter according to claim 1, characterized in that: An end of the first liquid flow chamber close to the coolant inlet and an end of the seventh liquid flow chamber close to the coolant outlet are both provided with chamfers.

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