Wafer bearing device and chemical mechanical polishing equipment

Abstract

The embodiment of the invention provides a wafer bearing device and chemical mechanical polishing equipment. The wafer bearing device comprises a base, a supporting base, a conveying assembly, a swing assembly and a driving assembly, and the supporting base, the conveying assembly, the driving assembly and the swing assembly are all fixedly arranged on the base; the supporting seat is used for supporting a wafer; the driving assembly is connected with the swinging assembly and used for driving the swinging assembly to swing; a plurality of nozzles and a first flow channel used for supplying liquid to the nozzles are arranged in the swing assembly, and a water inlet section of the first flow channel is located in a swing shaft of the swing assembly and penetrates through a rotating shaft in the swing axis direction. The conveying assembly comprises a water outlet section arranged in the swing axis direction, and the conveying assembly is rotationally sealed with the water inlet section of the first flow channel and used for conveying fluid to the first flow channel when the swing assembly swings. The wafer bearing device can spray fluid to the surface of the wafer.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor manufacturing technology, and in particular to a wafer carrier and a chemical mechanical polishing device. Background Art

[0002] Integrated Circuit (IC) is the core and lifeblood of the development of the information technology industry. Integrated Circuits are generally formed by successively depositing a conductive layer, a semiconductor layer or an insulating layer on a silicon wafer. As a result, a thin film formed by a filler layer is deposited on the surface of the wafer. In the manufacturing process, it is necessary to continuously flatten the filler layer until the patterned top surface is exposed to form a conductive path between the raised patterns. Chemical Mechanical Polishing (CMP) technology is the preferred planarization process in the IC manufacturing process. In chemical mechanical polishing, when the wafer is circulated internally, according to the process requirements, the wafer needs to be placed in a cache station to wait. When the wafer is waiting in the cache station, its surface needs to be moisturized to prevent defects such as corrosion and oxidation on the wafer surface.

[0003] Currently, a spray pipe is connected to the swing arm in the cache station. When the swing arm swings in a direction parallel to the wafer, the spray pipe bends and swings with the swing arm to spray fluid onto the surface of the wafer.

[0004] However, the hardness of the spray pipe is relatively high, and repeated bending for a long time can easily cause the liquid pipe to bend, wear and tear, and cause wafer fluid leakage. Of course, other modules that need to spray liquid through swing arms, such as cleaning devices and drying devices, also have similar problems. Summary of the invention

[0005] In view of this, an embodiment of the present application provides a wafer carrier device and a chemical mechanical polishing equipment to at least partially solve the above-mentioned problems.

[0006] According to a first aspect of an embodiment of the present application, a wafer carrying device is provided, comprising: a base, a support base, a conveying assembly, a swing assembly and a driving assembly, wherein the support base, the conveying assembly, the driving assembly and the swing assembly are all fixedly arranged on the base; the support base is used to support the wafer; the driving assembly is connected to the swing assembly, and is used to drive the swing assembly to swing; a plurality of nozzles and a first flow channel for supplying liquid to the plurality of nozzles are arranged in the swing assembly, and a water inlet section of the first flow channel is located in the swing shaft of the swing assembly and passes through the rotating shaft along the swing axis direction; the conveying assembly comprises a water outlet section arranged along the swing axis direction, and is rotatably sealed with the water inlet section of the first flow channel, and is used to convey fluid to the first flow channel when the swing assembly swings.

[0007] According to a second aspect of an embodiment of the present application, a chemical mechanical polishing device is provided, comprising a wafer carrying device as described in the first aspect of the present application.

[0008] According to the wafer carrying device provided in the embodiment of the present application, it includes a base, a support seat, a conveying component, a swinging component and a driving component. The driving component is connected to the swinging component. A first flow channel and a plurality of nozzles connected to the first flow channel are arranged in the swinging component. The support seat can support the wafer, the conveying component can convey fluid to the first flow channel, and the driving component can drive the swinging component to swing, thereby allowing the fluid to be sprayed onto the surface of the wafer located on the support seat through the nozzle. Since the swinging component swings in a direction parallel to the surface of the wafer, the fluid can be sprayed onto the entire surface of the wafer through the nozzle, which can prevent defects such as corrosion and oxidation from occurring on the surface of the wafer. Moreover, since the water outlet section of the conveying component is rotatably sealed with the water inlet section of the first flow channel along the direction of the swing axis, the conveying component will not swing when the swinging component swings. Compared with the prior art, it can prevent the spray pipe from repeatedly bending when the swinging component swings, and can prevent fluid leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0010] Figure 1 is a schematic diagram of a wafer carrying device provided in an embodiment of the present application; Figure 2 is a cross-sectional schematic diagram of a conveying assembly provided in an embodiment of the present application; Figure 3 is a schematic diagram of another wafer carrying device provided in an embodiment of the present application; Figure 4 is a cross-sectional view of a swing assembly provided in an embodiment of the present application; Figure 5 It is a cross-sectional view of another swing assembly provided in an embodiment of the present application.

[0011] 100, wafer carrier; 101, base; 102, support seat; 103, swing assembly; 1031, first sub-swing arm; 10311, fourth flow channel; 1032, second sub-swing arm; 10321, fifth flow channel; 1033, swing shaft; 10331, first flow channel; 10332, second flow channel; 10333, first sub-swing shaft; 10334, second sub-swing shaft; 10335, connecting assembly; 10336, sixth flow channel; 10337, seventh flow channel; 10341, first bearing; 10342, Two bearings; 10351, first bearing seat; 10352, second bearing seat; 1036, nozzle; 1037, sealing ring; 1038, first sealing assembly; 1039, second sealing assembly; 104, conveying assembly; 1041, pipe joint; 1042, right-angle joint; 1043, liquid inlet assembly; 1044, limiter; 105, driving assembly; 1051, motor; 1052, transmission; 1053, first transmission wheel; 1054, transmission mechanism; 1055, second transmission wheel; 106, housing; 200, wafer. DETAILED DESCRIPTION

[0012] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0013] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0014] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0015] As mentioned above, integrated circuits (ICs) are the core and lifeblood of the development of the information technology industry. Integrated circuits are generally formed by successively depositing a conductive layer, a semiconductor layer or an insulating layer on a silicon wafer. As a result, a thin film formed by a filler layer is deposited on the surface of the wafer. In the manufacturing process, it is necessary to continuously flatten the filler layer until the patterned top surface is exposed to form a conductive path between the raised patterns. Chemical mechanical polishing (CMP) technology is the preferred planarization process in the IC manufacturing process. In chemical mechanical polishing, when the wafer is circulated internally, according to the process requirements, the wafer needs to be placed in a cache station to wait. When the wafer is waiting in the cache station, its surface needs to be moisturized to prevent defects such as corrosion and oxidation on the wafer surface. At present, a spray pipe is connected to the swing arm in the cache station, for example: the liquid pipe is fixed on the swing arm, and when the swing arm swings in a direction parallel to the wafer, the spray pipe bends and swings with the swing arm, for example: the swing arm swings repeatedly in a direction parallel to the wafer surface, and the spray pipe fixed on the swing arm swings repeatedly with the swing arm. However, the spray pipe has a high hardness, and repeated bending over a long period of time can easily cause the liquid pipe to bend and wear, leading to problems such as wafer fluid leakage.

[0016] Similarly, in a horizontal or vertical drying station, it is necessary to spray the cleaning or drying fluid through the nozzle on the swing arm, which also has similar problems.

[0017] The present application provides a wafer carrying device, which includes a base, a support seat, a conveying assembly, a swinging assembly and a driving assembly. The driving assembly is connected to the swinging assembly. A first flow channel and a plurality of nozzles connected to the first flow channel are arranged in the swinging assembly. The support seat can support the wafer, the conveying assembly can convey fluid to the first flow channel, and the driving assembly can drive the swinging assembly to swing, thereby spraying the fluid onto the surface of the wafer located on the support seat through the nozzle. Since the swinging assembly swings in a direction parallel to the surface of the wafer, the fluid can be sprayed onto the entire surface of the wafer through the nozzle, which can prevent defects such as corrosion and oxidation from occurring on the surface of the wafer. Moreover, since the water outlet section of the conveying assembly is rotatably sealed with the water inlet section of the first flow channel along the direction of the swing axis, the conveying assembly will not swing when the swinging assembly swings. Compared with the prior art, it can prevent the spray pipe from repeatedly bending when the swinging assembly swings, and can prevent fluid leakage.

[0018] The wafer carrier and chemical mechanical polishing equipment provided by the present application are described below by way of examples. It should be noted that the wafer carrier in the present application refers to any device capable of carrying a wafer, such as a buffer station, a cleaning station, a drying station, etc., all of which are within the scope of protection of the present application.

[0019] Figure 1 is a schematic diagram of a wafer carrying device provided in an embodiment of the present application, such as Figure 1 As shown, the wafer carrier 100 includes: a base 101, a support base 102, a conveying assembly 104, a swing assembly 103 and a driving assembly 105. The support base 102, the conveying assembly 104, the driving assembly 105 and the swing assembly 103 are all fixedly arranged on the base 101, the support base 102 is used to support the wafer, the driving assembly 105 is connected to the swing assembly 103, and is used to drive the swing assembly 103 to swing, and the swing assembly 103 is provided with a plurality of nozzles and a first flow channel for supplying liquid to the plurality of nozzles, the water inlet section of the first flow channel is located in the swing axis of the swing assembly 103 and passes through the rotating shaft along the swing axis direction, the conveying assembly 104 includes a water outlet section arranged along the swing axis direction, and is rotatably sealed with the water inlet section of the first flow channel, and is used to convey fluid to the first flow channel when the swing assembly 103 swings. The fluid in the present application can be liquid or gas, both of which are within the protection scope of the present application.

[0020] The support base 102, the conveying assembly 104, the driving assembly 105 and the swing assembly 103 are fixed on the base 101. In one example, Figure 1 As shown, the wafer carrier 100 may further include a box 106, which is disposed on the base 101, and the support seat 102, part of the conveying assembly 104 and the swing assembly 103 are disposed in the box 106. The support seat 102 can place the wafer 200 and support the wafer 200. In an example, Figure 1 As shown, the support base 102 can be set to a mountain-shaped structure. The support base 102 has a certain thickness. When the support base 102 carries the wafer 200 , part of the edge of the wafer 200 is clamped on the support base 102 .

[0021] The swing assembly 103 can swing repeatedly under the drive of the driving assembly 105. When the wafer 200 is located on the support base 102, the swing assembly 103 swings in a direction parallel to the surface of the wafer 200 under the drive of the driving assembly 105. Optionally, a horizontal line passing through a point on the wafer 200 closest to the base 101 is used as a horizontal plane. When the swing assembly 103 swings, the angle range between the swing assembly 103 and the horizontal plane is [-5°, 95°].

[0022] When the swing assembly 103 swings, the swing shaft in the swing assembly 103 rotates along the swing axis. A first flow channel is provided inside the swing assembly 103. The water inlet section of the first flow channel is located inside the swing shaft of the swing assembly 103, and the water inlet section penetrates the rotating shaft in the swing shaft along the swing axis direction. The first flow channel is connected with multiple nozzles on the swing assembly 103. The conveying assembly 104 includes a water outlet section provided along the swing axis direction. The water outlet section is rotatably sealed with the water inlet section of the first flow channel. When the swing assembly 103 swings, the conveying assembly 104 can convey the external fluid to the swing shaft, and convey the fluid to the first flow channel through the water outlet section, so that the fluid is sprayed to the outside of the swing assembly 103 through multiple nozzles. When the wafer 200 is located on the support seat 102, the multiple nozzles spray the fluid onto the surface of the wafer 200. Optionally, the first flow channel can be a cylindrical through pipe with a diameter range of [3mm, 6mm], which can ensure that the fluid sprayed by multiple nozzles can be more evenly distributed on the surface of the wafer 200.

[0023] It should be noted that, since the water outlet section of the conveying assembly 104 is rotationally sealed with the water inlet section of the first flow channel of the swing assembly 103 , the conveying assembly 104 does not swing with the swing assembly 103 when the swing assembly 103 swings.

[0024] In the embodiment of the present application, the wafer carrier 100 includes a base 101, a support seat 102, a conveying component 104, a swing component 103 and a driving component 105. The driving component 105 is connected to the swing component 103. A first flow channel and a plurality of nozzles connected to the first flow channel are arranged in the swing component 103. The support seat can support the wafer 200, the conveying component 104 can convey fluid to the first flow channel, and the driving component 105 can drive the swing component 103 to swing, thereby spraying the fluid to the surface of the wafer 200 located on the support seat 102 through the nozzle. 103 swings in a direction parallel to the surface of the wafer 200, so that the fluid can be sprayed onto the entire surface of the wafer 200 through the nozzle, which can prevent defects such as corrosion and oxidation on the surface of the wafer 200, and because the water outlet section of the conveying component 104 is rotatably sealed with the water inlet section of the first flow channel along the swing axis direction, when the swinging component 103 swings, the conveying component 104 will not swing, and the water channel will not shift in position with the swinging. Compared with the prior art, the spray pipe can be prevented from bending repeatedly when the swinging component 103 swings on the basis of stable fluid supply, thereby preventing fluid leakage.

[0025] Figure 2 is a cross-sectional schematic diagram of a conveying assembly provided in an embodiment of the present application, such as Figure 2As shown, the shell of the water outlet section of the conveying component 104 is a stepped shell, which extends into the first flow channel 10331, and the outer wall of the stepped shell and the inner wall of the water inlet section of the first flow channel 10331 are rotatably sealed by a sealing ring 1037.

[0026] The shell of the water outlet section of the conveying component 104 is a stepped shell, that is, the width of the cross section of the water outlet section of the conveying component 104 is smaller than the width of the cross section of the conveying component 104, for example: Figure 2 The cross-sectional width N of the water outlet section is smaller than the cross-sectional width L of the conveying component 104; the first flow channel 10331 and the rotating shaft pass through the line direction of the swing axis 1033; the stepped shell extends into the first flow channel 10331 and is connected with the first flow channel 10331; the outer wall of the stepped shell and the inner wall of the water inlet section of the first flow channel 10331 are rotationally sealed by the sealing ring 1037; when the swing component swings, the swing axis 1033 of the swing component rotates relative to the stepped shell of the conveying component 104, thereby achieving that when the swing component 103 swings, the conveying component 104 does not swing.

[0027] In one example, the sealing ring 1037 can be sleeved on the outer wall of the stepped shell, so that the outer wall of the stepped shell and the inner wall of the water inlet section of the first flow channel 10331 are rotatably sealed through the sealing ring 1037.

[0028] In an embodiment of the present application, the shell of the water outlet section of the conveying component 104 is a stepped shell, and the stepped shell extends into the first flow channel 10331, thereby allowing the external fluid to be conveyed to the first flow channel 10331 of the swinging component through the conveying component 104, so that the first flow channel 10331 conveys the fluid to multiple nozzles to achieve moisturizing of the wafer surface, and the outer wall of the stepped shell and the inner wall of the water inlet section of the first flow channel 10331 are rotationally sealed by the sealing ring 1037, thereby allowing the swing shaft 1033 of the swing component to rotate relative to the stepped shell of the conveying component 104 when the swinging component swings, and since the sealing ring 1037 is provided, it can prevent fluid leakage due to a gap between the stepped shell and the first flow channel 10331 after the fluid is conveyed to the first flow channel 10331, thereby ensuring that the fluid can be normally conveyed to the swinging component.

[0029] Figure 3 is a schematic diagram of another wafer carrying device provided in an embodiment of the present application, such as Figure 3As shown, the driving component 105 includes: a motor 1051, a transmission 1052, a first transmission wheel 1053, a transmission mechanism 1054 and a second transmission wheel 1055, the motor 1051 is connected to the transmission 1052, the transmission 1052 is connected to the first transmission wheel 1053, the second transmission wheel 1055 is connected to the swing component 103, the transmission 1052 is connected to the base 101, and the first transmission wheel 1053 and the second transmission wheel 1055 are connected through the transmission mechanism 1054.

[0030] The output end of the motor 1051 is connected to the transmission 1052. The motor 1051 can generate a first driving kinetic energy under the drive of electric energy. The transmission 1052 receives the first driving kinetic energy, performs a speed change process on the first driving kinetic energy, and obtains a second driving kinetic energy. In one example, the transmission 1052 performs a speed reduction process on the first driving kinetic energy, for example, the transmission 1052 reduces the speed of the motor 1051. The output end of the transmission 1052 is connected to the first transmission wheel 1053, and the first transmission wheel 1053 can rotate under the drive of the second driving kinetic energy. The second transmission wheel 1055 is connected to the swing assembly 103. The second transmission wheel 1055 is connected to the first transmission wheel 1053 through a transmission mechanism 1054. In one example, the transmission mechanism 1054 can be a transmission belt. When the first transmission wheel 1053 rotates under the drive of the second driving kinetic energy, the second transmission wheel 1055 can be driven to rotate through the transmission mechanism 1054, so that the second transmission wheel 1055 drives the swing assembly 103 to swing.

[0031] In one example, the motor 1051 can output the first driving kinetic energy in the opposite direction of rotation in a timing sequence, thereby causing the swing component 103 to swing repeatedly within a fixed range in a timing sequence. For example, a horizontal line passing through a point on the wafer closest to the base 101 is used as a horizontal plane, and the swing component 103 swings back and forth within an angle range of [-5°, 95°] with the horizontal plane.

[0032] In the embodiment of the present application, the motor 1051 is connected to the transmission 1052, the transmission 1052 is connected to the first transmission wheel 1053, the second transmission wheel 1055 is connected to the swing assembly 103, and the first transmission wheel 1053 and the second transmission wheel 1055 are connected via a transmission mechanism 1054, thereby generating a first driving kinetic energy through the motor 1051, and performing speed-changing processing on the first driving kinetic energy through the transmission 1052 to obtain a second driving kinetic energy, and the first transmission wheel 1053 can be driven to rotate by the second driving kinetic energy, thereby driving the second transmission wheel 1055 to rotate by the transmission mechanism 1054, thereby driving the swing assembly 103 to swing back and forth.

[0033] In one possible implementation, the swing assembly includes a bearing seat, a bearing, a swing shaft and a swing arm, the swing shaft is connected to the bearing seat through a bearing, the bearing seat is connected to the base, the swing shaft is connected to the swing arm, the first flow channel includes a second flow channel arranged in the swing shaft, and a third flow channel arranged in the swing arm, the second flow channel and the third flow channel are connected, the bearing seat can fix the swing assembly to the base, the bearing can make the swing shaft swing relative to the bearing seat, and the swing shaft can swing under the drive of the second transmission wheel to drive the swing arm to swing.

[0034] In an embodiment of the present application, a swinging assembly includes a bearing seat, a bearing, a swinging shaft and a swinging arm. The bearing seat is fixedly arranged on the base, thereby the swinging assembly can be fixedly arranged on the base. The swinging shaft is connected to the bearing seat through the bearing, thereby the swinging assembly can be swung relative to the bearing seat. A second flow channel is arranged in the swinging shaft, and a third flow channel is arranged in the swinging arm. The second flow channel and the third flow channel are connected to form a first flow channel. Part of the second flow channel can be a water inlet section or the entire second flow channel can be a water inlet section. Therefore, the second flow channel can be used as a water inlet section to receive the fluid transported by the water outlet section in the conveying assembly, and the fluid can be transported to the nozzle through the third flow channel. The swinging shaft can swing under the drive of the second transmission wheel to drive the swinging arm to swing, thereby the fluid can be evenly sprayed on the surface of the wafer, thereby achieving moisturizing of the wafer.

[0035] The structure of the swing assembly will be described in detail below with reference to the accompanying drawings.

[0036] Figure 4 is a cross-sectional schematic diagram of a swing assembly provided in an embodiment of the present application, such as Figure 4 As shown, the first end of the swing shaft 1033 is connected to the inner ring of the first bearing 10341, the outer ring of the first bearing 10341 is connected to the first bearing seat 10351, the second end of the swing shaft 1033 is connected to the inner ring of the second bearing 10342, the outer ring of the second bearing 10342 is connected to the second bearing seat 10352, and the second end of the swing shaft 1033 at least partially extends out of the second bearing seat 10352 and is connected to the second transmission wheel 1055.

[0037] The first bearing seat 10351 and the second bearing seat 10352 are fixed on the base, the first bearing 10341 is arranged in the first bearing seat 10351, and the second bearing 10342 is arranged in the second bearing seat 10352. The bearing seat is connected to the outer ring of the bearing, the first end of the swing shaft 1033 is connected to the inner ring of the first bearing 10341, and the second end of the swing shaft 1033 is connected to the inner ring of the second bearing 10342. The inner ring of the bearing can rotate relative to the outer ring of the bearing, and the second end portion of the swing shaft 1033 extends out of the second bearing seat 10352 and is connected to the second transmission wheel 1055. When the second transmission wheel 1055 drives the swing shaft 1033 to swing, since a bearing is arranged between the swing shaft 1033 and the bearing seat, the swing shaft 1033 can rotate relative to the bearing seat.

[0038] In the embodiment of the present application, the first end of the swing shaft 1033 is connected to the first bearing seat 10351 through the first bearing 10341, and the second end of the swing shaft 1033 is connected to the second bearing seat 10352 through the second bearing 10342. The second end of the swing shaft 1033 at least partially extends out of the second bearing seat 10352 and is connected to the second transmission wheel 1055. As a result, the swing shaft 1033 can swing relative to the bearing seat driven by the second transmission wheel 1055, so that the swing shaft 1033 drives the swing arm to swing.

[0039] In one possible implementation, Figure 4 As shown, the swing arm includes a first sub-swing arm 1031 and a second sub-swing arm 1032, the first sub-swing arm 1031 and the second sub-swing arm 1032 are located on both sides of the wafer, the first end of the first sub-swing arm 1031 is connected to the first end of the second sub-swing arm 1032, a plurality of nozzles 1036 are arranged on the first sub-swing arm 1031 and the second sub-swing arm 1032, the nozzles 1036 on the first sub-swing arm 1031 are arranged opposite to the nozzles 1036 on the second sub-swing arm 1032, the first sub-swing arm 1031 is provided with a fourth flow channel 10311, the second sub-swing arm 1032 is provided with a fifth flow channel 10321, the fourth flow channel 10311 and the fifth flow channel 10321 are connected to form a third flow channel.

[0040] The swing arm includes a first sub-swing arm 1031 and a second sub-swing arm 1032. The first sub-swing arm 1031 and the second sub-swing arm 1032 are arranged in parallel. One end of the first sub-swing arm 1031 and the second sub-swing arm 1032 are connected so that the first sub-swing arm 1031 and the second sub-swing arm 1032 form a U-shaped structure. When a wafer is supported on the support seat, the first sub-swing arm and the second sub-swing arm are located on both sides of the wafer. One end at which the first sub-swing arm 1031 and the second sub-swing arm 1032 are connected is connected to the swing shaft 1033. When the swing shaft 1033 swings under the drive of the second transmission wheel 1055, the first sub-swing arm 1031 and the second sub-swing arm 1032 are driven by the swing shaft 1033 to swing along a plane perpendicular to a first direction. The first direction is a direction perpendicular to the wafer surface.

[0041] like Figure 4 As shown in the cross-sectional view, the swing shaft 1033 includes a second flow channel 10332, the first sub-swing arm 1031 includes a fourth flow channel 10311, and the second sub-swing arm 1032 includes a fifth flow channel 10321. The fourth flow channel 10311 and the fifth flow channel 10321 are connected to form a third flow channel in the swing assembly 103. In one example, as Figure 4 As shown, the second flow channel 10332 of the swing shaft 1033 is connected to the fifth flow channel 10321 in the second sub-swing arm 1032, and the fifth flow channel 10321 is connected to the fourth flow channel 10311 in the first sub-swing arm 1031, thereby forming a first flow channel. A plurality of nozzles 1036 are arranged on the first sub-swing arm 1031 and the second sub-swing arm 1032, and the plurality of nozzles 1036 are connected to the third flow channel. In one example, the plurality of nozzles 1036 arranged on the first sub-swing arm 1031 are connected to the fourth flow channel 10311, and the plurality of nozzles 1036 arranged on the second sub-swing arm 1032 are connected to the fifth flow channel 10321. After the fluid is transmitted to the fourth flow channel 10311 and the fifth flow channel 10321, the fluid can be ejected out of the swing assembly 103 through the plurality of nozzles 1036 arranged on the first sub-swing arm 1031 and the plurality of nozzles 1036 arranged on the second sub-swing arm 1032.

[0042] In one example, the spraying directions of the multiple nozzles 1036 arranged on the first sub-swing arm 1031 and the multiple nozzles 1036 arranged on the second sub-swing arm 1032 are not opposite, and the spraying direction of the nozzle 1036 is not parallel to the first direction. The multiple nozzles 1036 on the first sub-swing arm 1031 spray fluid along the second direction, and the angle between the second direction and the first direction is greater than 0 degree and less than or equal to the angle threshold. The angle threshold can be set as needed, for example: the angle threshold can be set to 45 degrees. The multiple nozzles 1036 on the second sub-swing arm 1032 spray fluid along the third direction, and the angle between the third direction and the first direction is greater than 0 degree and less than or equal to the angle threshold. In one example, the angle between the second direction and the first direction is equal to the angle between the third direction and the first direction.

[0043] In an embodiment of the present application, the swing arm includes a first sub-swing arm 1031 and a second sub-swing arm 1032, and the first sub-swing arm 1031 and the second sub-swing arm 1032 constitute a U-shaped swing arm, and a plurality of nozzles 1036 are arranged on the first sub-swing arm 1031 and the second sub-swing arm 1032, so that fluid can be sprayed on two surfaces of the wafer at the same time, and because the spraying direction of the nozzle 1036 is greater than 0 degrees and less than or equal to the angle threshold, the spraying angle can be controlled to reduce the fluid rebounded by the wafer, and the fluid can be sprayed on the surface of the wafer more evenly.

[0044] Figure 5 is a cross-sectional view of another swing assembly provided in an embodiment of the present application, such as Figure 5 As shown, the swing shaft 1033 includes a first sub-swing shaft 10333 , a second sub-swing shaft 10334 and a connecting component 10335 , and the second flow channel 10332 includes: a sixth flow channel 10336 and a seventh flow channel 10337 . The first end of the first sub-swing shaft 10333 and the first end of the second sub-swing shaft 10334 are connected through a connecting assembly 10335, the second end of the first sub-swing shaft 10333 is connected to the inner ring of the first bearing 10341, the second end of the second sub-swing shaft 10334 is connected to the inner ring of the second bearing 10342, and the swing arm is connected to the connecting assembly 10335, wherein the axis of the first bearing 10341 and the second bearing 10342 coincide, the sixth flow channel 10336 and the seventh flow channel 10337 are arranged in the connecting assembly, the sixth flow channel 10336 is connected to the fourth flow channel 10311, and the seventh flow channel 10337 is connected to the fifth flow channel 10321, and the sixth flow channel 10336 and the seventh flow channel 10337 are constructed to transport different fluids to the fourth flow channel 10311 and the fifth flow channel 10321 respectively.

[0045] The swing shaft 1033 may include a first sub-swing shaft 10333 and a second sub-swing shaft 10334, one end of the first sub-swing shaft 10333 and one end of the second sub-swing shaft 10334 are fixedly connected via a connecting assembly 10335, the second end of the first sub-swing shaft 10333 and the second end of the second sub-swing shaft 10334 are respectively connected to the first bearing 10341 and the second bearing 10342, when the second sub-swing shaft 10334 swings driven by the second transmission wheel 1055, the second sub-swing shaft 10334 drives the first sub-swing shaft 10333 to swing via the connecting assembly 10335.

[0046] A sixth flow channel 10336 and a seventh flow channel 10337 are provided in the connecting component 10335. The sixth flow channel 10336 is connected to the fourth flow channel 10311 in the first sub-swing arm 1031, and the seventh flow channel 10337 is connected to the fifth flow channel 10321 in the second sub-swing arm 1032. In one example, the sixth flow channel 10336 is partially located in the first sub-swing shaft 10333, and the seventh flow channel 10337 is partially located in the second sub-swing shaft 10334. The sixth flow channel 10336 can receive the first fluid delivered by the conveying component 104, and the seventh flow channel 10337 can receive the second fluid delivered by the conveying component 104. The first fluid and the second fluid can be different, so that different fluids can be delivered to the fourth flow channel 10311 and the fifth flow channel 10321 respectively, so that the nozzle 1036 arranged on the first sub-swing arm 1031 and the nozzle 1036 arranged on the second sub-swing arm 1032 spray different fluids.

[0047] In an embodiment of the present application, the swing shaft 1033 includes a first sub-swing shaft 10333, a second sub-swing shaft 10334 and a connecting component 10335. The first sub-swing shaft 10333 and the second sub-swing shaft 10334 are connected by the connecting component 10335. When the second transmission wheel 1055 drives the second sub-swing shaft 10334 to swing, the first sub-swing shaft 10333 and the second sub-swing shaft 10334 can swing synchronously to drive the swing arm to swing along a plane perpendicular to the first direction. Since the sixth flow channel 10336 and the seventh flow channel 10337 are provided in the connecting component 10335, different fluids transported by the conveying component can be received through the sixth flow channel 10336 and the seventh flow channel 10337, and different fluids can be sprayed onto the two surfaces of the wafer. Therefore, different fluids can be selected according to the chemical properties of the wafer surface, which is suitable for moisturizing two wafers with different surface chemical properties.

[0048] In one possible implementation, Figure 3 and Figure 4 As shown, the conveying component 104 includes a pipe joint 1041, a right-angle joint 1042 and a liquid inlet component 1043. The first end of the pipe joint 1041 is connected to the external pipeline, the second end of the pipe joint 1041 is connected to the first end of the right-angle joint 1042, the second end of the right-angle joint 1042 is connected to the first end of the liquid inlet component 1043, and the second end of the liquid inlet component 1043 extends into the swing shaft 1033 as a water outlet section.

[0049] One end of the pipe joint 1041 is connected to an external pipeline, and the external pipeline can connect the pipe joint 1041 and a device for storing fluid, so that the fluid can be transported to the pipe joint 1041 through the external pipeline, and the other end of the pipe joint 1041 is connected to one end of the right-angle joint 1042, and the other end of the right-angle joint 1042 is connected to the liquid inlet component 1043. The first end of the right-angle joint 1042 and the extension line of the second end of the right-angle joint 1042 are perpendicular, that is, the angle between the extension line of the first end and the second end is a right angle, and the right-angle joint 1042 can change the flow direction of the fluid so that the fluid flows into the liquid inlet component 1043.

[0050] The first end of the liquid inlet component 1043 is connected to the second end of the right-angle joint 1042, and the second end portion of the liquid inlet component 1043 extends into the swing shaft 1033 and communicates with the second flow channel 10332, so that the fluid delivered by the right-angle joint 1042 can be delivered to the first flow channel in the swing component 103 through the liquid inlet component 1043. It should be understood that the second end of the liquid inlet component 1043 is a stepped shell, such as Figure 2 As shown, the cross-sectional width N of the water outlet section is smaller than the cross-sectional width L of the liquid inlet component, and the portion of the stepped shell extending into the swing shaft 1033 is a cylindrical hollow structure, whereby when the swing shaft 1033 swings, the second end of the liquid inlet component 1043 extending into the swing shaft 1033 rotates within the swing shaft 1033, which will not affect the swing of the swing shaft 1033, and the fluid can flow through the cylindrical hollow portion to be transported to the liquid inlet component 1043.

[0051] In the embodiment of the present application, the conveying component 104 includes a pipe joint 1041, a right-angle joint 1042 and a liquid inlet component 1043. The pipe joint 1041 is connected to the right-angle joint 1042, and the right-angle joint 1042 is connected to the liquid inlet component 1043. The liquid inlet component 1043 at least partially extends into the swing shaft 1033, so that the fluid can be conveyed to the swing component 103 through the pipe joint 1041, the right-angle joint 1042 and the liquid inlet component 1043 in sequence, thereby realizing the fluid conveyance.

[0052] In one possible implementation, Figure 3 As shown, the conveying component 104 also includes a limit member 1044, a first end of the limit member 1044 is connected to the bearing seat, and a second end of the limit member 1044 extends toward the direction of the liquid inlet component 1043. The limit member 1044 abuts against the liquid inlet component 1043. The limit member 1044 can limit the movement of the liquid inlet component 1043 when the swing component 103 swings.

[0053] The conveying component 104 also includes a limit member 1044, a first end of the limit member 1044 is connected to the bearing seat, and a second end of the limit member 1044 extends in a direction toward the liquid inlet component 1043. In one example, the second end of the limit member 1044 extends toward another bearing seat in a direction toward the liquid inlet component 1043. Since the bearing seat is fixed on the base 101 and the limit member 1044 is connected to the bearing seat, when the swing component 103 swings in a direction perpendicular to the first direction, the limit member 1044 does not move with the swing of the swing component 103. Since the limit member 1044 abuts against the liquid inlet component 1043, the movement of the liquid inlet component 1043 can be limited.

[0054] In one example, if Figure 3 As shown, the limit member 1044 can be a cubic structure. In other examples, the limit member 1044 can also be a columnar structure or other structures, and the limit member 1044 can be set on the first bearing seat or on the second bearing seat, without any limitation.

[0055] In the embodiment of the present application, the conveying component 104 also includes a limit member 1044, a first end of the limit member 1044 is connected to the bearing seat, and a second end of the limit member 1044 extends toward the direction of the liquid inlet component 1043. The limit member 1044 abuts against the liquid inlet component 1043, thereby preventing the conveying component 104 from swinging with the swinging component 103 when the swinging component 103 swings, thereby preventing the conveying component 104 from being damaged.

[0056] In one possible implementation, Figure 4 As shown, the swing assembly 103 also includes a first sealing assembly 1038 , and the first sealing assembly 1038 is disposed at the connection point between the second flow channel 10332 and the fifth flow channel 10321 .

[0057] The swing assembly 103 also includes a first sealing assembly 1038, which is disposed between the second flow channel 10332 of the swing shaft 1033 and the fifth flow channel 10321 of the swing assembly 103. The first sealing assembly 1038 may be a sealing ring. It should be understood that the swing arm and the swing shaft 1033 in the swing assembly 103 are not integrally formed, but are two separate components. When the swing arm and the swing shaft 1033 are installed, the first sealing assembly 1038 is installed between the swing arm and the swing shaft 1033 to prevent a gap between the second flow channel 10332 and the fifth flow channel 10321 from causing fluid leakage.

[0058] It should be noted that if Figure 3 As shown, the fourth flow channel 10311 is connected to the fifth flow channel 10321 , and the fourth flow channel 10311 and the fifth flow channel 10321 can be integrally formed, so there is no need to set a sealing component at the connection point between the fourth flow channel 10311 and the fifth flow channel 10321 .

[0059] In the embodiment of the present application, the swing assembly 103 also includes a first sealing assembly 1038, which is arranged at the connecting point between the second flow channel 10332 and the fifth flow channel 10321. This can prevent leakage between the second flow channel 10332 and the fifth flow channel 10321 due to a gap between the second flow channel 10332 and the fifth flow channel 10321 after the swing arm and the swing shaft 1033 are installed, thereby ensuring that the fluid is normally delivered to the swing arm.

[0060] In one possible implementation, Figure 4 As shown, the swing assembly 103 further includes a second sealing assembly 1039, and the second sealing assembly 1039 is disposed between the swing shaft 1033 and the second bearing seat.

[0061] The swing assembly 103 further includes a second sealing assembly 1039, which is disposed between the swing shaft 1033 and the second bearing seat 10352. Figure 3 As shown, a second sealing component 1039 is provided at the connection side between the swing shaft 1033 and the second transmission wheel 1055 . The second sealing component 1039 may be a sealing ring, and the sealing ring may be sleeved on the swing shaft 1033 .

[0062] In the embodiment of the present application, the swing assembly 103 also includes a second sealing assembly 1039, which is arranged between the swing shaft 1033 and the second bearing seat 10352, thereby preventing dust from entering the interior of the swing assembly 103 through the gap between the swing shaft 1033 and the second bearing seat 10352, preventing the second bearing 10342 and the swing shaft 1033 from being damaged due to dust, and improving the reliability of the wafer carrier 100.

[0063] An embodiment of the present application further provides a chemical mechanical polishing device, which includes the wafer carrying device 100 in any of the above embodiments.

[0064] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.

[0065] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present application.

[0066] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A wafer carrying device, characterized in that: include: A base, a support base, a conveying assembly, a swing assembly and a driving assembly, wherein the support base, the conveying assembly, the driving assembly and the swing assembly are all fixedly arranged on the base; The support seat is used to support the wafer; The driving assembly is connected to the swing assembly and is used to drive the swing assembly to swing; The swing assembly is provided with a plurality of nozzles and a first flow channel for supplying liquid to the plurality of nozzles, wherein a water inlet section of the first flow channel is located in the swing shaft of the swing assembly and passes through the rotating shaft along the swing axis direction; The conveying assembly includes a water outlet section arranged along the swing axis direction and is rotationally sealed with the water inlet section of the first flow channel, so as to convey fluid to the first flow channel when the swing assembly swings.

2. The device according to claim 1, characterized in that The shell of the water outlet section of the conveying assembly is a stepped shell, which extends into the first flow channel, and the outer wall of the stepped shell and the inner wall of the water inlet section of the first flow channel are rotatably sealed by a sealing ring.

3. The device according to claim 1 or 2, characterized in that: The driving assembly includes: a motor, a transmission, a first transmission wheel, a transmission mechanism, and a second transmission wheel; The motor is connected to the transmission, the transmission is connected to the first transmission wheel, the second transmission wheel is connected to the swing assembly, the transmission is connected to the base, and the first transmission wheel and the second transmission wheel are connected through the transmission mechanism.

4. The device according to claim 3, characterized in that The swing assembly includes a bearing seat, a bearing, a swing shaft and a swing arm; The swing shaft is connected to the bearing seat through the bearing, the bearing seat is connected to the base, the swing shaft is connected to the swing arm, the first flow channel includes a second flow channel arranged in the swing shaft, and a third flow channel arranged in the swing arm, the second flow channel is connected to the third flow channel, and the second flow channel includes the water inlet section; The bearing seat is used to fix the swing assembly to the base; The bearing is used to make the swing shaft swing relative to the bearing seat; The swing shaft is used to swing under the drive of the second transmission wheel to drive the swing arm to swing.

5. The device according to claim 4, characterized in that The first end of the swing shaft is connected to the inner ring of the first bearing, the outer ring of the first bearing is connected to the first bearing seat, the second end of the swing shaft is connected to the inner ring of the second bearing, the outer ring of the second bearing is connected to the second bearing seat, and the second end of the swing shaft at least partially extends out of the second bearing seat and is connected to the second transmission wheel.

6. The device according to claim 5, characterized in that The swing arm includes a first sub-swing arm and a second sub-swing arm, the first sub-swing arm and the second sub-swing arm are located on both sides of the wafer, the first end of the first sub-swing arm is connected to the first end of the second sub-swing arm, the multiple nozzles are arranged on the first sub-swing arm and the second sub-swing arm, the nozzles on the first sub-swing arm are arranged opposite to the nozzles on the second sub-swing arm, the first sub-swing arm is provided with a fourth flow channel, the second sub-swing arm is provided with a fifth flow channel, the fourth flow channel and the fifth flow channel are connected to form the third flow channel.

7. The device according to claim 6, characterized in that The swing shaft comprises: a first sub-swing shaft, a second sub-swing shaft and a connecting assembly, and the second flow channel comprises: a sixth flow channel and a seventh flow channel; The first end of the first sub-swing shaft and the first end of the second sub-swing shaft are connected through the connecting assembly, the second end of the first sub-swing shaft is connected to the inner ring of the first bearing, the second end of the second sub-swing shaft is connected to the inner ring of the second bearing, and the swing arm is connected to the connecting assembly, wherein the axis of the first bearing coincides with the axis of the second bearing; The sixth flow channel and the seventh flow channel are arranged in the connecting component, the sixth flow channel is connected to the fourth flow channel, the seventh flow channel is connected to the fifth flow channel, and the sixth flow channel and the seventh flow channel are constructed to transport different fluids to the fourth flow channel and the fifth flow channel respectively.

8. The device according to claim 4, characterized in that The delivery assembly comprises: a pipe joint, a right-angle joint and a liquid inlet assembly; The first end of the pipe joint is connected to the external pipeline, the second end of the pipe joint is connected to the first end of the right-angle joint, the second end of the right-angle joint is connected to the first end of the liquid inlet component, and the second end of the liquid inlet component extends into the swing shaft as the water outlet section.

9. The device according to claim 8, characterized in that The conveying assembly further includes: a limiting member; The first end of the limiting member is connected to the bearing seat, the second end of the limiting member extends in a direction toward the liquid inlet assembly, and the limiting member abuts against the liquid inlet assembly; The limiting member is configured to limit the movement of the liquid inlet assembly when the swing assembly swings.

10. The device according to claim 6, characterized in that The swing assembly further includes: a first sealing assembly; The first sealing assembly is disposed at a connecting point between the second flow channel and the fifth flow channel.

11. The device according to claim 5, characterized in that The swing assembly further includes: a second sealing assembly; The second sealing assembly is arranged between the swing shaft and the second bearing seat.

12. A chemical mechanical polishing device, characterized in that: It comprises a wafer carrying device as described in any one of claims 1-11.

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