Semiconductor wafer processing, clamping and overturning device and system thereof

Abstract

The invention relates to the technical field of semiconductor wafer processing, in particular to a clamping and overturning device and system for semiconductor wafer processing. The clamping and overturning device comprises a mounting guide rail, a pushing assembly, a sliding seat, a placing platform and a plurality of clamping and overturning mechanisms; the height of the wafer clamp is adjusted through the lifting arm, after the wafer clamp corresponds to the wafer, the current wafer is firmly clamped through the wafer, the pushing assembly is started, the position of the containing platform is adjusted, the multiple clamped and fixed wafers are sequentially conveyed to the corresponding machining equipment, the rotating assembly is started, and the wafer clamping device is started. The rotating disc is driven to rotate on the mounting base to turn over the wafers clamped on the wafer clamp, so that the wafers meet the machining conditions of current machining equipment, clamping, fixing and turning over of a plurality of wafers can be completed by adopting the structure, the machining efficiency of the wafer machining equipment is improved, and the productivity of a production line is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer processing, and in particular to a semiconductor wafer processing clamping and flipping device and a system thereof. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor integrated circuits. Wafer processing refers to the process of processing the microcircuit structures of various chips on the wafer through processes such as but not limited to deposition, etching, and cleaning. During the wafer processing, it is often necessary to flip the wafer between two adjacent processes or within one process.

[0003] In the prior art, a tooling fixture with a clamping and flipping function is arranged on the output end of the sliding guide rail to firmly clamp the wafer. After the wafer is processed in the current step, the wafer is transported to the next step through the sliding guide rail, and the wafer is flipped by the flipping mechanism on the tooling fixture, and then the wafer is flipped.

[0004] However, the existing semiconductor wafer processing clamping and flipping devices can only clamp and flip a single wafer at a time, resulting in poor processing efficiency of the wafer processing equipment and low production line capacity. Summary of the invention

[0005] The purpose of the present invention is to provide a semiconductor wafer processing clamping and flipping device and its system, aiming to solve the technical problem that the existing semiconductor wafer processing clamping and flipping device can only clamp and flip a single wafer at a time, resulting in poor processing efficiency of the wafer processing equipment and low production line capacity.

[0006] To achieve the above-mentioned purpose, the present invention provides a semiconductor wafer processing clamping and flipping device, comprising a mounting rail, a pushing component, a sliding seat, a placement platform and a plurality of clamping and flipping mechanisms, wherein the sliding seat is slidably arranged on the mounting rail, the pushing component is arranged inside the mounting rail, the output end of the pushing component is connected to the sliding seat, the upper surface of the sliding seat is provided with the placement platform, the upper surface of the placement platform is evenly provided with a plurality of placement protrusions, and the placement platform is also provided with a plurality of the clamping and flipping mechanisms, each of the clamping and flipping mechanisms corresponds to one of the placement protrusions;

[0007] Each of the clamping and flipping mechanisms includes a lifting arm, a mounting seat, a rotating assembly, a rotating disk and a wafer clamp. The lifting arm is installed on one side of the placing protrusion, the mounting seat is arranged on the top of the lifting arm, the mounting seat is perpendicular to the lifting arm, the rotating disk is rotatably arranged on the end surface of the mounting seat, the rotating assembly is arranged inside the mounting seat, the output end of the rotating assembly is mechanically transmitted with the rotating disk, and the wafer clamp is arranged on a side of the rotating disk away from the mounting seat.

[0008] Among them, each of the lifting arms includes a mounting frame, an electric push rod and a sliding column. The mounting frame is installed on one side of the corresponding placement protrusion, the sliding column is slidably arranged at the top of the mounting frame, the electric push rod is arranged inside the mounting frame, the output end of the electric push rod is connected to the bottom of the sliding column, and the mounting seat is arranged at the end of the sliding column away from the mounting frame.

[0009] Wherein, each of the rotating components includes a driving motor and an output gear, and a driven tooth portion is provided on one side of each rotating disk located inside the corresponding mounting seat. The driving motor is installed inside the mounting seat, and the output gear is provided at the output end of the driving motor, and the output gear is meshed with the driven tooth portion.

[0010] Among them, each of the wafer clamps includes a transverse rail, a servo motor, a forward and reverse screw, two screw sleeves, two sliding blocks and two clamping arc plates. The transverse guide rail is installed on the side of the rotating disk away from the corresponding mounting seat. The sliding blocks are slidably arranged at both ends of the transverse guide rail. The servo motor is arranged on the side of the transverse guide rail. The forward and reverse screws are arranged at the output end of the servo motor. The forward and reverse screws are arranged at both ends of the forward and reverse screws. The screw sleeves are arranged, each of the screw sleeves is connected to one of the sliding blocks, each sliding block is arranged with the clamping arc plate, and each clamping arc plate is arranged with a clamping protrusion.

[0011] Wherein, a heat dissipation groove is provided through the side wall of each mounting seat, and the heat dissipation groove corresponds to the corresponding driving motor.

[0012] Among them, the pushing assembly includes a motor, a threaded rod and a ball screw nut pair, the motor is installed inside the mounting guide rail, the threaded rod is provided at the output end of the motor, the ball screw nut pair is provided on the threaded rod, and the ball screw nut pair is connected to the sliding seat.

[0013] Among them, the semiconductor wafer processing clamping and flipping device also includes an auxiliary support member, which is arranged at one end of the threaded rod away from the motor, one end of the auxiliary support member is arranged outside the threaded rod, and the other end of the auxiliary support member is installed inside the mounting guide rail.

[0014] Wherein, the auxiliary support member includes a fixed block, a support block and a support ring, the fixed block is arranged at one end of the support block, the support ring is arranged at the other end of the support block, the support ring is arranged on the outside of the threaded rod, and the fixed block is installed on the inside of the mounting guide rail.

[0015] The present invention also provides a semiconductor wafer processing system, including the semiconductor wafer processing clamping and flipping device as described above, and also including a workbench and a material storage box, the mounting rail is installed on the upper surface of the workbench, and the material storage box is arranged on the workbench.

[0016] A semiconductor wafer processing clamping and flipping device and its system of the present invention include a mounting rail, a pushing component, a sliding seat, a placement platform and a plurality of clamping and flipping mechanisms, each of the clamping and flipping mechanisms includes a lifting arm, a mounting seat, a rotating component, a rotating disk and a wafer clamp, a plurality of wafers to be processed are placed on the corresponding placement protrusions respectively, the height of the wafer clamp is adjusted by the lifting arm so that the wafer clamp corresponds to the wafer, and the current wafer is clamped firmly by using the wafer, the pushing component is started to drive the sliding seat to slide on the mounting rail, thereby completing the adjustment of the position of the placement platform, so that the wafers clamped on the plurality of wafer clamps are sequentially transported to the corresponding processing equipment, and the rotating component can be started according to the processing conditions to drive the rotating disk to rotate on the mounting seat, and the wafer clamped on the wafer clamp is flipped so that the wafer meets the processing conditions of the current processing equipment. The above structure can be used to complete the clamping, fixing and flipping of a plurality of wafers, thereby improving the processing efficiency of the wafer processing equipment and improving the production line capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic structural diagram of a semiconductor wafer processing clamping and flipping device according to a first embodiment of the present invention.

[0019] Figure 2 The present invention provides Figure 1 A magnified view of the local structure at A.

[0020] Figure 3 It is a structural schematic diagram of the clamping and flipping mechanism in the first embodiment of the present invention.

[0021] Figure 4 Schematic diagram of the structure of the wafer clamp in the first embodiment of the present invention.

[0022] Figure 5 It is a schematic diagram of the split structure of the rotating disk and the mounting seat in the first embodiment of the present invention.

[0023] Figure 6 It is a structural schematic diagram of a semiconductor wafer processing clamping and flipping device according to a second embodiment of the present invention.

[0024] Figure 7 It is a structural schematic diagram of the semiconductor wafer processing system provided by the present invention.

[0025] 101-mounting guide rail, 102-sliding seat, 103-placing platform, 104-mounting seat, 105-rotating disk, 106-mounting frame, 107-electric push rod, 108-sliding column, 109-driving motor, 110-output gear, 111-lateral track, 112-servo motor, 113-positive and negative screw, 114-screw sleeve, 115-sliding block, 116-clamping arc plate, 117-motor, 118-threaded rod, 119-ball screw nut pair, 120-placing protrusion, 121-driven tooth portion, 122-clamping protrusion, 123-heat dissipation groove, 201-fixed block, 202-support block, 203-support ring, 301-workbench, 302-storage box. DETAILED DESCRIPTION

[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0027] First embodiment:

[0028] See also Figures 1 to 5 ,in Figure 1 is a schematic structural diagram of a semiconductor wafer processing clamping and flipping device according to a first embodiment, Figure 2 yes Figure 1 A magnified view of the local structure at A. Figure 3 is a schematic structural diagram of the clamping and flipping mechanism in the first embodiment, Figure 4 is a schematic structural diagram of a wafer clamp in the first embodiment, Figure 5 It is a schematic diagram of the split structure of the rotating disk and the mounting seat in the first embodiment.

[0029] The present invention provides a semiconductor wafer processing clamping and flipping device: it includes a mounting guide rail 101, a pushing component, a sliding seat 102, a placement platform 103 and multiple clamping and flipping mechanisms, each of the clamping and flipping mechanisms includes a lifting arm, a mounting seat 104, a rotating component, a rotating disk 105 and a wafer clamp, each of the lifting arms includes a mounting frame 106, an electric push rod 107 and a sliding column 108, each of the rotating components includes a driving motor 109 and an output gear 110, each of the wafer clamps includes a transverse track 111, a servo motor 112, a forward and reverse threaded screw 113, two screw sleeves 114, two sliding blocks 115 and two clamping arc plates 116, and the pushing component includes a motor 117, a threaded rod 118 and a ball screw nut pair 119. The above-mentioned solution solves the problem that the existing semiconductor wafer processing clamping and flipping device can only clamp and flip a single wafer at a time, resulting in poor processing efficiency of the wafer processing equipment and low production line capacity. It can be understood that the above-mentioned solution can be used in the structure of the semiconductor wafer processing production line.

[0030] According to this specific embodiment, the sliding seat 102 is slidably provided on the mounting guide rail 101, the motor 117 is installed inside the mounting guide rail 101, the threaded rod 118 is provided at the output end of the motor 117, the ball screw nut pair 119 is provided on the threaded rod 118, the ball screw nut pair 119 is connected to the sliding seat 102, the upper surface of the sliding seat 102 is provided with the placement platform 103, the upper surface of the placement platform 103 is evenly provided with a plurality of placement protrusions 120, the lifting arm is installed on one side of the placement protrusion 120, the top of the lifting arm is provided with the mounting seat 104, the mounting seat 104 is perpendicular to the lifting arm, the end surface of the mounting seat 104 is rotatably provided with the rotating disk 105, the rotating assembly is provided inside the mounting seat 104, the output end of the rotating assembly is mechanically transmitted with the rotating disk 105, and the rotating disk 105 is away from the The wafer clamp is provided on one side of the mounting seat 104, and multiple wafers to be processed are placed on the corresponding placement protrusions 120 respectively. The height of the wafer clamp is adjusted by the lifting arm so that the wafer clamp corresponds to the wafer, and the current wafer is clamped firmly using the wafer, and the motor 117 is started to drive the threaded rod 118 to rotate. Since the ball screw nut pair 119 is connected to the sliding seat 102, the position of the placement platform 103 is adjusted, so that the multiple wafers clamped on the wafer clamp are transported to the corresponding processing equipment in turn, and according to the processing conditions, the rotating component can be started to drive the rotating disk 105 to rotate on the mounting seat 104, and the wafer clamped on the wafer clamp is flipped so that the wafer meets the processing conditions of the current processing equipment. The above structure can be used to complete the clamping, fixing and flipping of multiple wafers, thereby improving the processing efficiency of wafer processing equipment and improving the production line capacity.

[0031] Among them, the mounting frame 106 is installed on one side of the corresponding placement protrusion 120, the sliding column 108 is slidably arranged at the top of the mounting frame 106, the electric push rod 107 is arranged inside the mounting frame 106, the output end of the electric push rod 107 is connected to the bottom of the sliding column 108, and the mounting seat 104 is arranged at the end of the sliding column 108 away from the mounting frame 106. Starting the electric push rod 107 drives the sliding column 108 to slide on the top of the mounting frame 106, thereby completing the adjustment of the position of the mounting seat 104.

[0032] Secondly, each rotating disk 105 is provided with a driven tooth portion 121 on one side located inside the corresponding mounting seat 104, the driving motor 109 is installed inside the mounting seat 104, and the output end of the driving motor 109 is provided with the output gear 110, the output gear 110 is meshed with the driven tooth portion 121, and the driving motor 109 is started to drive the output gear 110 to rotate. Since the output gear 110 is meshed with the driven tooth portion 121, the rotating disk 105 is driven to rotate at the end of the mounting seat 104.

[0033] At the same time, the transverse guide rail is installed on a side of the rotating disk 105 away from the corresponding mounting seat 104, and the sliding blocks 115 are slidably arranged at both ends of the transverse guide rail. The servo motor 112 is arranged on the side of the transverse guide rail, and the output end of the servo motor 112 is arranged with the positive and negative threaded rod 113, and the two ends of the positive and negative threaded rod 113 are arranged with the screw sleeve 114, each of the screw sleeves 114 is respectively connected to a sliding block 115, and each of the sliding blocks 115 is provided with the clamping arc plate 116. A clamping protrusion 122 is provided on each of the clamping arc plates 116. When the height of the two clamping arc plates 116 is adjusted to correspond to that on the placement platform 103 by the lifting arm, the two clamping arc plates 116 are respectively located on both sides of the wafer to be processed, and the servo motor 112 is started to drive the forward and reverse screws 113 to rotate, thereby driving the two sliding blocks 115 to move toward each other through the two screw sleeves 114, so that the wafer to be processed is firmly clamped by using the clamping protrusions 122 provided on the two clamping arc plates 116.

[0034] In addition, a heat dissipation groove 123 is provided on the side wall of each mounting seat 104, and the heat dissipation groove 123 corresponds to the corresponding driving motor 109. Through the setting of the heat dissipation groove 123, the interior of the mounting seat 104 is kept in circulation with the outside air, and the heat generated by the driving motor 109 during operation is taken away by the flowing air.

[0035] When using a semiconductor wafer processing clamping and flipping device of the present embodiment, a plurality of wafers to be processed are placed on the corresponding placement protrusions 120 respectively, and the height of the wafer clamp is adjusted by the lifting arm so that the wafer clamp corresponds to the wafer. After the height of the two clamping arc plates 116 is adjusted by the lifting arm to correspond to that on the placement platform 103, the two clamping arc plates 116 are respectively located on both sides of the wafer to be processed, and the servo motor 112 is started to drive the forward and reverse threaded screws 113 to rotate, thereby driving the two sliding blocks 115 to move toward each other through the two threaded screw sleeves 114, thereby utilizing the clamping protrusions 122 arranged on the two clamping arc plates 116 to rotate. The wafer to be processed is clamped firmly, and the motor 117 is started to drive the threaded rod 118 to rotate. Since the ball screw nut pair 119 is connected to the sliding seat 102, the position of the placement platform 103 is adjusted, so that the wafers clamped on the multiple wafer clamps are transported to the corresponding processing equipment in turn, and according to the processing conditions, the rotating assembly can be started to drive the rotating disk 105 to rotate on the mounting seat 104, and the wafer clamped on the wafer clamp is flipped, so that the wafer meets the processing conditions of the current processing equipment. The above structure can be used to complete the clamping, fixing and flipping of multiple wafers, thereby improving the processing efficiency of the wafer processing equipment and increasing the production line capacity.

[0036] Second embodiment:

[0037] Based on the first embodiment, please refer to Figure 6 , Figure 6 It is a structural schematic diagram of a semiconductor wafer processing clamping and flipping device according to a second embodiment.

[0038] The present invention provides a semiconductor wafer processing clamping and flipping device, which also includes an auxiliary support member. The auxiliary support member includes a fixing block 201 , a support block 202 and a support ring 203 .

[0039] According to this specific embodiment, the auxiliary support member is provided at one end of the threaded rod 118 away from the motor 117, one end of the auxiliary support member is provided outside the threaded rod 118, and the other end of the auxiliary support member is installed inside the mounting guide rail 101. The threaded rod 118 is auxiliary supported by the auxiliary support member, so that the structure of the threaded rod 118 is more stable when it rotates.

[0040] Among them, the fixing block 201 is provided at one end of the support block 202, and the support ring 203 is provided at the other end of the support block 202. After the support ring 203 is set on the outside of the threaded rod 118, the fixing block 201 is installed inside the mounting rail 101, thereby completing the installation of the auxiliary support member.

[0041] When using a semiconductor wafer processing clamping and flipping device according to the present embodiment, after the support ring 203 is set on the outside of the threaded rod 118, the fixed block 201 is installed on the inside of the mounting guide rail 101, thereby completing the installation of the auxiliary support member. The threaded rod 118 is auxiliary supported by the auxiliary support member, so that the threaded rod 118 has a more stable structure when rotating.

[0042] See also Figure 7 The present invention also provides a semiconductor wafer processing system, including the semiconductor wafer processing clamping and flipping device as described above, and also including a workbench 301 and a material storage box 302, wherein the mounting rail 101 is installed on the upper surface of the workbench 301, and the material storage box 302 is arranged on the workbench 301.

[0043] In this embodiment, a plurality of wafer processing equipment are sequentially arranged on the workbench 301, and the mounting rail 101 is horizontally arranged on the upper surface of the workbench 301, so that the placement platform 103 passes through the plurality of wafer processing equipment in sequence, thereby utilizing the plurality of wafer processing equipment to complete various processing steps of the wafer, and through the setting of the material storage box 302, the storage of the wafers to be processed is completed, which is convenient for loading the wafers to be processed.

[0044] What is disclosed above is only a preferred embodiment of the present invention, and it certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A semiconductor wafer processing clamping and flipping device, comprising a mounting rail, a pushing component, a sliding seat and a placement platform, wherein the sliding seat is slidably arranged on the mounting rail, the pushing component is arranged inside the mounting rail, the output end of the pushing component is connected to the sliding seat, and the upper surface of the sliding seat is provided with the placement platform, characterized in that: It also includes a plurality of clamping and flipping mechanisms, a plurality of placement protrusions are evenly arranged on the upper surface of the placement platform, and a plurality of the clamping and flipping mechanisms are also arranged on the placement platform, and each of the clamping and flipping mechanisms corresponds to one of the placement protrusions; Each of the clamping and flipping mechanisms includes a lifting arm, a mounting seat, a rotating assembly, a rotating disk and a wafer clamp. The lifting arm is installed on one side of the placing protrusion, the mounting seat is arranged on the top of the lifting arm, the mounting seat is perpendicular to the lifting arm, the rotating disk is rotatably arranged on the end surface of the mounting seat, the rotating assembly is arranged inside the mounting seat, the output end of the rotating assembly is mechanically transmitted with the rotating disk, and the wafer clamp is arranged on a side of the rotating disk away from the mounting seat.

2. The semiconductor wafer processing clamping and flipping device according to claim 1, characterized in that: Each of the lifting arms includes a mounting frame, an electric push rod and a sliding column. The mounting frame is mounted on one side of the corresponding placement protrusion. The sliding column is slidably arranged on the top of the mounting frame. The electric push rod is arranged inside the mounting frame. The output end of the electric push rod is connected to the bottom of the sliding column. The mounting seat is arranged at one end of the sliding column away from the mounting frame.

3. The semiconductor wafer processing clamping and flipping device according to claim 2, characterized in that: Each of the rotating components includes a driving motor and an output gear. A driven tooth portion is provided on one side of each rotating disk located inside the corresponding mounting seat. The driving motor is installed inside the mounting seat. The output end of the driving motor is provided with the output gear, and the output gear is meshed with the driven tooth portion.

4. The semiconductor wafer processing clamping and flipping device according to claim 3, characterized in that: Each of the wafer clamps includes a transverse rail, a servo motor, a forward and reverse screw, two screw sleeves, two sliding blocks and two clamping arc plates. The transverse guide rail is installed on a side of the rotating disk away from the corresponding mounting seat. The sliding blocks are slidably arranged at both ends of the transverse guide rail. The servo motor is arranged on the side of the transverse guide rail. The forward and reverse screws are arranged at the output end of the servo motor. The forward and reverse screws are arranged at both ends of the forward and reverse screws. The screw sleeves are arranged, each of the screw sleeves is connected to one of the sliding blocks, each sliding block is arranged with the clamping arc plate, and each clamping arc plate is arranged with a clamping protrusion.

5. The semiconductor wafer processing clamping and flipping device according to claim 4, characterized in that: A heat dissipation groove is provided through the side wall of each mounting seat, and the heat dissipation groove corresponds to the corresponding driving motor.

6. The semiconductor wafer processing clamping and flipping device according to claim 1, characterized in that: The pushing assembly includes a motor, a threaded rod and a ball screw nut pair. The motor is installed inside the mounting guide rail. The output end of the motor is provided with the threaded rod. The ball screw nut pair is provided on the threaded rod. The ball screw nut pair is connected to the sliding seat.

7. The semiconductor wafer processing clamping and flipping device according to claim 6, characterized in that: The semiconductor wafer processing clamping and flipping device also includes an auxiliary support member, which is arranged at one end of the threaded rod away from the motor, one end of the auxiliary support member is arranged outside the threaded rod, and the other end of the auxiliary support member is installed inside the mounting guide rail.

8. The semiconductor wafer processing clamping and flipping device according to claim 7, characterized in that: The auxiliary support member includes a fixed block, a support block and a support ring, wherein the fixed block is arranged at one end of the support block, the support ring is arranged at the other end of the support block, the support ring is arranged outside the threaded rod, and the fixed block is installed inside the mounting guide rail.

9. A semiconductor wafer processing system, comprising the semiconductor wafer processing clamping and flipping device according to claim 1, characterized in that: It also includes a workbench and a material storage box. The mounting rail is mounted on the upper surface of the workbench, and the material storage box is arranged on the workbench.

Images