Heat dissipation assembly, controller and control method

Abstract

The invention provides a heat dissipation assembly, a controller and a control method, and the heat dissipation assembly comprises a heat conduction housing which is internally provided with a heat conduction channel and is provided with at least two heat conduction regions which are arranged in the extension direction of the heat conduction channel; the at least two heat conduction parts are movably arranged in the heat conduction channel and arranged in the extending direction of the heat conduction channel, and the at least two heat conduction parts and the at least two heat conduction areas are arranged in a one-to-one correspondence mode; wherein the heat dissipation assembly has a first heat dissipation state and a second heat dissipation state; when the heat dissipation assembly is in a first heat dissipation state, each heat conduction part is opposite to the corresponding heat conduction area; and when the heat dissipation assembly is in the second heat dissipation state, at least part of each heat conduction part and the corresponding heat conduction area are arranged in a staggered mode, and the heat conduction part and the adjacent heat conduction area of the corresponding heat conduction area are oppositely arranged. Through the technical scheme provided by the invention, the technical problem that a fusion domain controller in the prior art is relatively large in temperature difference in different regions can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation structures of controllers, and in particular to a heat dissipation component, a controller and a control method. Background Art

[0002] At present, with the development of new energy vehicles, the whole vehicle architecture of new energy vehicles is gradually developing from distributed to multi-domain controllers and cross-domain fusion controllers. The existing fusion domain controllers concentrate the smart driving chip and the smart cockpit chip in one domain controller. As the computing power of the smart driving chip and the smart cockpit chip gradually increases, their power consumption is also increasing. This increases the difficulty of heat dissipation for the fusion domain controller.

[0003] In the prior art, conventional heat dissipation methods include the following: adding a water cooling plate inside or outside the shell for heat dissipation, which dissipates the heat of the controller through the water cooling plate; contacting high-heat devices such as smart driving chips and smart cockpit chips through a metal shell, and dissipating heat by providing metal bosses and heat dissipation fins on the metal shell, which dissipates the heat of the controller into the air through the metal bosses and heat dissipation fins; using a metal shell embedded with a fan for heat dissipation, which dissipates the heat of the metal shell through the fan.

[0004] However, the above heat dissipation method has a good heat dissipation effect for conventional single controllers. For fusion domain controllers, due to the different heat generation conditions of different chips, the above heat dissipation method cannot effectively and adaptively dissipate heat according to the heat generation conditions of different chips, resulting in better heat dissipation effect for some chips and poor heat dissipation effect for some chips, which leads to large temperature differences in different areas of the metal shell of the fusion domain controller, and thus makes the shell prone to deformation due to large temperature differences. Summary of the invention

[0005] The main purpose of the present invention is to provide a heat dissipation component, a controller and a control method to solve the technical problem of large temperature difference in different areas of the fusion domain controller in the prior art.

[0006] In order to achieve the above object, according to one aspect of the present invention, a heat dissipation assembly is provided, comprising:

[0007] A heat-conducting housing, wherein a heat-conducting channel is disposed in the heat-conducting housing, and the heat-conducting housing has at least two heat-conducting areas arranged along an extension direction of the heat-conducting channel;

[0008] At least two heat-conducting parts, both of which can be movably arranged in the heat-conducting channel and arranged along the extension direction of the heat-conducting channel, at least two heat-conducting parts are arranged one-to-one with at least two heat-conducting areas, each heat-conducting part is formed by a heat-conducting medium, and the thermal conductivity coefficients of two adjacent heat-conducting parts are different; the two adjacent heat-conducting parts are incompatible with each other and have a junction surface at the junction, or a separator is arranged between the two adjacent heat-conducting parts;

[0009] Among them, the heat dissipation component has a first heat dissipation state and a second heat dissipation state; when the heat dissipation component is in the first heat dissipation state, each heat-conducting part is arranged relative to the corresponding heat-conducting area; when the heat dissipation component is in the second heat dissipation state, at least part of each heat-conducting part is staggered with the corresponding heat-conducting area, and is arranged relative to the adjacent heat-conducting area of ​​the corresponding heat-conducting area.

[0010] Furthermore, the heat dissipation component also includes:

[0011] A driving structure is connected to the end of the heat-conducting channel, and is used to introduce positive-pressure fluid or negative-pressure fluid into the heat-conducting channel to drive at least two heat-conducting parts to move along the extension direction of the heat-conducting channel.

[0012] Furthermore, the driving structure includes:

[0013] A first driving member is connected to one end of the heat conduction channel, and the first driving member is used to introduce positive pressure or negative pressure fluid into the heat conduction channel through the one end of the heat conduction channel; and / or,

[0014] The second driving member is connected to the other end of the heat-conducting channel, and is used to introduce negative pressure or positive pressure fluid into the heat-conducting channel through the other end of the heat-conducting channel.

[0015] Furthermore, the heat dissipation component also includes:

[0016] A connecting pipeline, one end of which is connected to one end of the heat conduction channel, the other end of which extends out of the heat conduction housing, and the driving structure is communicated with the other end of the connecting pipeline.

[0017] Furthermore, the heat dissipation component also includes:

[0018] At least two temperature detection members, the at least two temperature detection members are arranged in one-to-one correspondence with the at least two heat conduction regions, and each temperature detection member is used to perform temperature detection on the corresponding heat conduction region;

[0019] The control element, at least two temperature detection elements and the driving structure are all connected to the control element, so that the control element controls the driving structure according to the temperature detection signals of the at least two temperature detection elements.

[0020] Furthermore, there are multiple heat conduction channels, and the multiple heat conduction channels are arranged at intervals;

[0021] Wherein, a plurality of heat conduction channels are arranged along a predetermined direction; or,

[0022] A portion of the multiple heat conduction channels are arranged along a first preset direction, another portion of the multiple heat conduction channels are arranged along a second preset direction, and a portion of the multiple heat conduction channels and another portion of the multiple heat conduction channels are spaced apart along the thickness direction of the heat conduction housing.

[0023] Further, each heat conducting part is formed by a heat conducting fluid; and / or,

[0024] The heat-conducting housing is made of metal.

[0025] Further, one of the two adjacent heat-conducting parts is formed of liquid water, and the other of the two adjacent heat-conducting parts is formed of silicone oil; or,

[0026] A first guide portion is arranged on the partition, a second guide portion is arranged on the inner wall of the heat conduction channel, one of the first guide portion and the second guide portion extends along the extension direction of the heat conduction channel, and the first guide portion cooperates with the second guide portion in guiding.

[0027] According to another aspect of the present invention, there is provided a controller, comprising:

[0028] The heat dissipation component provided above;

[0029] A circuit board and at least two chips, the at least two chips are arranged on the circuit board, the at least two heat-conducting areas of the heat dissipation component are arranged one-to-one correspondingly to the at least two chips, each heat-conducting area is attached to the corresponding chip and dissipates heat for the corresponding chip.

[0030] Furthermore, one of the at least two chips is an intermittent heating chip, and the other of the at least two chips is a continuous heating chip, and the thermal conductivity of the heat conducting part corresponding to the intermittent heating chip is smaller than the thermal conductivity of the heat conducting part corresponding to the continuous heating chip.

[0031] Further, at least two chips include:

[0032] Smart driving chip: The smart driving chip is used to collect data collected by the camera while the vehicle is driving;

[0033] Smart cockpit chip: The smart cockpit chip is used to collect data collected by the camera during the vehicle's driving and parking process;

[0034] Communication chip, the smart cockpit chip connects with the communication chip and exchanges data.

[0035] Furthermore, the controller further comprises:

[0036] An Ethernet switching chip is arranged on the circuit board, and both the smart driving chip and the smart cockpit chip are connected to the Ethernet switching chip for data transmission;

[0037] Micro control unit, connects with Ethernet switch chip and transmits data.

[0038] According to another aspect of the present invention, a control method is provided, which is applicable to the heat dissipation assembly provided above, wherein at least two heat-conducting parts include a first heat-conducting part and a second heat-conducting part arranged adjacent to each other, and at least two heat-conducting regions include a first heat-conducting region and a second heat-conducting region arranged adjacent to each other, and the thermal conductivity of the first heat-conducting part is smaller than the thermal conductivity of the second heat-conducting part; the control method comprises:

[0039] Acquire the temperature of the first heat conducting region and the temperature of the second heat conducting region, and compare the temperature of the first heat conducting region with the temperature of the second heat conducting region;

[0040] When the temperature of the first heat-conducting region is less than or equal to the temperature of the second heat-conducting region, controlling the heat-dissipating component to be in a first heat-dissipating state;

[0041] When the temperature of the first heat-conducting region is greater than the temperature of the second heat-conducting region, the heat-dissipating component is controlled to be in the second heat-dissipating state.

[0042] Further, the heat dissipation assembly is the heat dissipation assembly provided above, the first driving member is connected to one end of the heat conduction channel close to the first heat conduction part, and the second driving member is connected to one end of the heat conduction channel close to the second heat conduction part; controlling the heat dissipation assembly to be in the second heat dissipation state includes:

[0043] Control the first driving member to introduce negative pressure fluid into the heat conduction channel; and / or,

[0044] The second driving member is controlled to introduce positive pressure fluid into the heat conduction channel.

[0045] Further, controlling the heat dissipation component to be in the second heat dissipation state also includes:

[0046] Obtaining a temperature increase rate and / or a temperature increase amount of the first heat transfer region within a predetermined time;

[0047] The fluid flow rate and flow rate of the first driving member are controlled according to the temperature increase rate and / or the temperature increase amount of the first heat-conducting area within a predetermined time; and / or, the fluid flow rate and flow rate of the second driving member are controlled according to the temperature increase rate and / or the temperature increase amount of the first heat-conducting area within a predetermined time.

[0048] By applying the technical solution of the present invention, by switching the heat dissipation component to the first heat dissipation state and the second heat dissipation state, it is possible to change the position of each heat conduction part in the heat conduction channel according to the heat dissipation requirements of different heat conduction areas, so that each heat conduction part can conduct heat and dissipate heat to the corresponding heat conduction area or the adjacent heat conduction area, thereby ensuring adaptive heat dissipation to the heat dissipation requirements of the corresponding heat conduction area as much as possible, ensuring the temperature uniformity of different heat conduction areas, and reducing the temperature difference between different heat conduction areas. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0050] Figure 1 A schematic diagram showing the layout structure of the heat-conducting part in the heat-conducting channel of the heat-dissipating assembly provided according to an embodiment of the present invention is shown;

[0051] Figure 2 A cross-sectional view of a heat dissipation assembly provided according to an embodiment of the present invention is shown;

[0052] Figure 3 A cross-sectional view of a heat dissipation assembly provided according to another embodiment of the present invention is shown;

[0053] Figure 4 A connection diagram of a controller provided according to an embodiment of the present invention is shown;

[0054] Figure 5 A flow chart of a control method provided according to an embodiment of the present invention is shown.

[0055] The above drawings include the following reference numerals:

[0056] 10. heat dissipation component; 11. heat-conducting housing; 111. heat-conducting channel; 112. heat-conducting area; 12. heat-conducting part; 13. connecting pipeline; 14. interface surface;

[0057] 20. Circuit board;

[0058] 30. Chip; 31. Smart driving chip; 32. Smart cockpit chip; 33. Communication chip;

[0059] 40. Ethernet switching chip; 50. Micro control unit. DETAILED DESCRIPTION

[0060] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0061] like Figures 1 to 3 As shown, the first embodiment of the present invention provides a heat dissipation assembly 10, which includes a heat-conducting housing 11 and at least two heat-conducting parts 12. A heat-conducting channel 111 is provided in the heat-conducting housing 11, and the heat-conducting housing 11 has at least two heat-conducting regions 112 arranged along the extension direction of the heat-conducting channel 111. The at least two heat-conducting parts 12 can be movably arranged in the heat-conducting channel 111 and arranged along the extension direction of the heat-conducting channel 111. The at least two heat-conducting parts 12 are arranged one-to-one with the at least two heat-conducting regions 112. Each heat-conducting part 12 is formed by a heat-conducting medium, and the thermal conductivity coefficients of the adjacent two heat-conducting parts 12 are different; the adjacent two heat-conducting parts 12 are incompatible with each other and have a junction partition 14 at the junction, or a partition is provided between the adjacent two heat-conducting parts 12. Among them, the heat dissipation component 10 has a first heat dissipation state and a second heat dissipation state; when the heat dissipation component 10 is in the first heat dissipation state, each heat-conducting part 12 is arranged relative to the corresponding heat-conducting area 112; when the heat dissipation component 10 is in the second heat dissipation state, at least part of each heat-conducting part 12 is staggered with the corresponding heat-conducting area 112, and is arranged relative to the adjacent heat-conducting area 112 of the corresponding heat-conducting area 112.

[0062] By using the heat dissipation component 10 provided in this embodiment, by switching the heat dissipation component 10 to the first heat dissipation state and the second heat dissipation state, it is possible to change the position of each heat conduction part 12 in the heat conduction channel 111 according to the heat dissipation requirements of different heat conduction areas 112, so that each heat conduction part 12 can conduct heat and dissipate heat to the corresponding heat conduction area 112 or the adjacent heat conduction area 112, so as to ensure adaptive heat dissipation to the heat dissipation requirements of the corresponding heat conduction area 112 as much as possible, so as to ensure the temperature uniformity of different heat conduction areas 112 and reduce the temperature difference between different areas. The heat dissipation component 10 is mainly used to dissipate heat for the heat dissipation part, and the heat dissipation part can be a fusion domain controller. By applying the heat dissipation component 10 in this embodiment to the fusion domain controller, the situation where the temperature difference between different areas of the fusion domain controller is large can be effectively reduced, and the heat dissipation effect and heat dissipation uniformity of the fusion domain controller can be effectively guaranteed.

[0063] In addition, this method of dynamically adjusting the heat dissipation strategy can not only improve heat dissipation efficiency and reduce energy waste, but also effectively respond to the heat dissipation needs of equipment under different workloads, and has a significant effect on improving the stability of electronic equipment and extending its service life.

[0064] It should be noted that "two adjacent heat-conducting parts 12 are incompatible with each other and have an interface partition surface 14 at the junction" can be understood as the above-mentioned interface partition surface 14 can be a natural tension surface formed under capillary action due to the incompatibility of the two heat-conducting media. By moving and pushing the fluid-like heat-conducting medium material filled in the cavity hole of the metal shell from the outside, it can be ensured that the interface partition surface 14 can move inside the cavity hole.

[0065] Specifically, at least two heat-conducting parts 12 include a first heat-conducting part 12 and a second heat-conducting part 12 that are adjacently arranged, and at least two heat-conducting regions 112 include a first heat-conducting region 112 and a second heat-conducting region 112 that are adjacently arranged, and the thermal conductivity of the first heat-conducting part 12 is smaller than the thermal conductivity of the second heat-conducting part 12. Under normal operation, the heat dissipation of the first heat-conducting region 112 is smaller than the heat dissipation of the second heat-conducting region 112, and at this time, the heat dissipation component 10 is in the first heat dissipation state; however, when the heat dissipation of the first heat-conducting region 112 suddenly increases or even exceeds the heat dissipation of the second heat-conducting region 112, at this time, the heat dissipation component 10 can be controlled to be in the second heat dissipation state, so that the second heat-conducting part 12 with a higher thermal conductivity can effectively dissipate the heat of the first heat-conducting region 112 quickly, thereby facilitating the rapid reduction of the heat of the first heat-conducting region 112, thereby avoiding the situation where the temperature difference between the first heat-conducting region 112 and the second heat-conducting region 112 is large.

[0066] It should be noted that when the heat dissipation component 10 is in the first heat dissipation state, each heat conduction part 12 is only arranged relative to the corresponding heat conduction area 112; when the heat dissipation component 10 is in the second heat dissipation state, a part of each heat conduction part 12 is arranged relative to the corresponding heat conduction area 112, and another part of each heat conduction part 12 is arranged relative to the heat conduction area 112 adjacent to the corresponding heat conduction area 112. As for the proportional relationship between a part and another part of each heat conduction part 12, it can be determined according to specific heat dissipation requirements. Specifically, when the heat dissipation requirement of the first heat conduction area 112 is greater and the temperature of the first heat conduction area 112 is greater than the temperature of the second heat conduction area 112, the length of the part of the second heat conduction part 12 corresponding to the first heat conduction area 112 is greater, so as to quickly meet the heat dissipation requirement of the first heat conduction area 112.

[0067] Specifically, the heat conducting part 12 can be a solid structure or a fluid. When the heat conducting part 12 is a solid structure, the heat conducting part 12 can be a heat conducting strip or a heat conducting column; when the heat conducting part 12 is a fluid, the fluid is filled in the flow channel. It is only necessary to satisfy that the thermal conductivity coefficients of the heat conducting media forming the two adjacent heat conducting parts 12 are different.

[0068] In this embodiment, the heat dissipation component 10 also includes a driving structure, which is connected to the end of the heat conduction channel 111, and the driving structure is used to introduce positive pressure fluid or negative pressure fluid into the heat conduction channel 111 to drive at least two heat conduction parts 12 to move along the extension direction of the heat conduction channel 111. With such a structural setting, it is convenient to effectively adjust the positions of at least two heat conduction parts 12, so as to smoothly switch the heat dissipation component 10 to the first heat dissipation state and the second heat dissipation state. Through external drive by the driving structure, the heat dissipation component 10 can achieve refined temperature control, which is of great significance for ensuring the stable operation of precision electronic equipment under extreme conditions, for example, in a controller with extreme temperature changes, it can ensure normal operation in different environments.

[0069] Specifically, the fluid in “positive pressure fluid or negative pressure fluid” can be liquid or gas, and when the heat conducting part 12 is a heat conducting fluid, the positive pressure fluid and the negative pressure fluid are also incompatible with each other.

[0070] Specifically, the driving structure includes a first driving member, which is connected to one end of the heat-conducting channel 111, and is used to introduce positive pressure or negative pressure fluid into the heat-conducting channel 111 through one end of the heat-conducting channel 111. With such a structural arrangement, it is convenient to adjust the position of one end of the heat-conducting channel 111 through the first driving member, so that the positions of at least two heat-conducting parts 12 in the heat-conducting channel 111 are changed.

[0071] Specifically, the driving structure includes a second driving member, which is connected to the other end of the heat-conducting channel 111, and the second driving member is used to pass negative pressure or positive pressure fluid into the heat-conducting channel 111 through the other end of the heat-conducting channel 111. In this way, the position of the other end of the heat-conducting channel 111 can be easily adjusted by the second driving member, so that the positions of at least two heat-conducting parts 12 in the heat-conducting channel 111 are changed.

[0072] Specifically, in the case where the driving structure includes a first driving member and a second driving member, the positions of the two ends of the heat-conducting channel 111 will be adjusted synchronously through the cooperation of the first driving member and the second driving member, so as to facilitate the quick and adaptive adjustment and change of the positions of at least two heat-conducting parts 12 in the heat-conducting channel 111. In addition, the above structure can adjust the position of the heat-conducting part 12 in both directions, providing a more flexible heat dissipation strategy, which is suitable for heat dissipation of multiple chips 30 or devices with different heating characteristics. The two-way adjustment capability enables the heat dissipation component 10 to more flexibly respond to the dynamic changes of the heat source inside the device. For the controller of multiple chips 30, the heat dissipation strategy can be adjusted in real time according to the heating conditions of different chips 30, thereby effectively preventing local overheating and improving the heat dissipation efficiency and overall performance of the device.

[0073] In this embodiment, the heat dissipation assembly 10 further includes a connecting pipe 13, one end of which is connected to one end of the heat conduction channel 111, the other end of which is extended out of the heat conduction housing 11, and the driving structure is connected to the other end of the connecting pipe 13. With such a structural arrangement, it is possible to avoid direct contact between the driving member and the heat conduction housing 11, increase the distance between the driving member and the heat conduction housing 11, thereby facilitating flexible adjustment of the position of the driving member, and also avoiding the situation where the heat of the driving member is transferred to the heat conduction housing 11 due to the driving member being too close to the heat conduction housing 11.

[0074] Specifically, the heat dissipation component 10 also includes at least two temperature detection components and a control component. The at least two temperature detection components are arranged in a one-to-one correspondence with the at least two heat conduction regions 112, and each temperature detection component is used to detect the temperature of the corresponding heat conduction region 112. At least two temperature detection components and the drive structure are connected to the control component so that the control component controls the drive structure according to the temperature detection signals of the at least two temperature detection components. In this way, it is convenient to enable the control component to adaptively adjust the drive structure according to the temperature conditions of different heat conduction regions 112, and realize intelligent heat dissipation control, so that the heat dissipation component 10 switches to the first heat dissipation state or the second heat dissipation state.

[0075] In this embodiment, there are multiple heat conduction channels 111, and the multiple heat conduction channels 111 are arranged at intervals to improve the heat dissipation effect of the heat dissipation structure. The multi-channel design can increase the heat dissipation area and heat dissipation efficiency of the heat dissipation component 10, and is suitable for heat dissipation of multiple heat sources or high-power heat sources.

[0076] Specifically, the plurality of heat-conducting channels 111 are arranged along a predetermined direction so as to optimize the layout of the plurality of heat-conducting channels 111 and improve the heat dissipation effect of the plurality of heat-conducting channels 111 on the at least two heat-conducting regions 112. Specifically, at least two heat-conducting portions 12 are disposed in each heat-conducting channel 111, and the at least two heat-conducting portions 12 are disposed in a one-to-one correspondence with the at least two heat-conducting regions 112.

[0077] Specifically, a portion of the multiple heat-conducting channels 111 is arranged along a first preset direction, another portion of the multiple heat-conducting channels 111 is arranged along a second preset direction, and a portion of the multiple heat-conducting channels 111 and another portion of the multiple heat-conducting channels 111 are arranged at intervals along the thickness direction of the heat-conducting housing 11. With such a structural arrangement, a portion of the multiple heat-conducting channels 111 and another portion of the multiple heat-conducting channels 111 can be respectively distributed at different layer heights of the heat-conducting housing 11, and a portion of the heat-conducting channels 111 and another portion of the heat-conducting channels 111 are arranged alternately, thereby further optimizing the structural layout of the multiple heat-conducting channels 111, thereby better improving the heat dissipation effect of at least two heat-conducting regions 112.

[0078] Specifically, the first preset direction may be a horizontal direction, and the second preset direction may be a vertical direction.

[0079] In this embodiment, each heat-conducting portion 12 is formed by a heat-conducting fluid, which can ensure that the heat-dissipating assembly 10 has good heat-conducting and heat-dissipating performance.

[0080] Specifically, the heat-conducting housing 11 is made of metal, which can ensure that the heat dissipation component 10 has good thermal conductivity and durability, and is suitable for heat dissipation of equipment in various harsh environments, such as high temperature, high humidity, and high vibration industrial environments, reducing maintenance costs.

[0081] Specifically, one of the two adjacent heat conducting parts 12 is formed by liquid water, and the other of the two adjacent heat conducting parts 12 is formed by silicone oil. In this way, the liquid water and the silicone oil are incompatible with each other and have a boundary surface 14 at the junction, which can ensure the stable movement of the heat conducting part 12 in the heat conducting channel 111, thereby improving the heat dissipation effect of the heat dissipation component 10.

[0082] Alternatively, a first guide portion is provided on the separator, and a second guide portion is provided on the inner wall of the heat-conducting channel 111, and one of the first guide portion and the second guide portion extends along the extension direction of the heat-conducting channel 111, and the first guide portion and the second guide portion cooperate in a guiding manner. In this way, the motion stability of the separator can be improved by the inverse cooperation of the first guide portion and the second guide portion, so that the separator can stably move along the extension direction of the heat-conducting channel 111, and the separator can also effectively separate two adjacent heat-conducting portions 12. Specifically, one of the first guide portion and the second guide portion is a guide protrusion, and the other of the first guide portion and the second guide portion is a guide groove.

[0083] When a separator is used, a sealing portion may be provided at the periphery of the separator, and the sealing portion is used to fit with the inner wall of the heat conduction channel 111 to effectively separate the fluids of the two heat conduction portions 12 on both sides of the separator.

[0084] like Figure 4 As shown, embodiment 2 of the present invention provides a controller, which includes the heat dissipation component 10, a circuit board 20 and at least two chips 30 provided above, at least two chips 30 are arranged on the circuit board 20, at least two heat conduction areas 112 of the heat dissipation component 10 are arranged in a one-to-one correspondence with at least two chips 30, each heat conduction area 112 is attached to the corresponding chip 30, and dissipates heat for the corresponding chip 30.

[0085] The controller provided in this embodiment can ensure the stable operation of each chip 30 inside the controller, improve the overall performance and service life of the equipment, and is suitable for the heat dissipation requirements of various high-performance chips 30, such as the smart driving chip 31 of an autonomous driving car, the smart cockpit chip 32, etc.

[0086] Specifically, when the heat-conducting medium is a fluid, the change in the position of the first heat-conducting portion 12 and the second heat-conducting portion 12 will also change the position of the interface 14 , thereby changing the heat dissipation state.

[0087] In this embodiment, one of at least two chips 30 is an intermittent heating chip, and the other of at least two chips 30 is a continuous heating chip, and the thermal conductivity of the heat conducting part 12 corresponding to the intermittent heating chip is smaller than the thermal conductivity of the heat conducting part 12 corresponding to the continuous heating chip. With such a setting, a customized heat dissipation solution can be provided according to the heat dissipation characteristics of the chip 30, effectively avoiding energy waste and local overheating, and is suitable for heat dissipation of equipment with multiple chips 30 and multiple heat sources, such as the fusion domain controller of new energy vehicles.

[0088] Specifically, the heat dissipation of intermittently heating chips in normal operation (most scenarios) is relatively small, so a liquid heat-conducting medium with a lower thermal conductivity can be filled in the corresponding part of the heat-conducting channel 111 to reduce the overall thermal conductivity of the heat-dissipating path. During the period of continuous high heat dissipation demand, in order to ensure the heat dissipation effect, a liquid heat-conducting medium with a high thermal conductivity needs to be filled in the corresponding part of the heat-conducting channel 111 to reduce the overall thermal conductivity of the heat-dissipating path.

[0089] When the heat generation of the intermittent heating chip suddenly increases, the liquid thermal conductive material with high thermal conductivity is moved through the boundary so that it at least partially covers and fills the corresponding part of the intermittent heating chip, thereby enhancing the overall thermal conductivity of its heat dissipation path. Through the above method, the temperature difference between the heat dissipation areas of the protective shell of the multi-fusion domain controller can be minimized in different usage scenarios, reducing the risk of warping and deformation of the metal protective shell due to excessive temperature differences in different areas. Specifically, the liquid thermal conductive medium can be selected from a variety of thermal conductivities [λ1…λn]. By staggered arrangement of the longitudinal, transverse, single-layer or staggered multi-layer thermal conductive channels 111, a combination of different thermal conductivities in multiple regions can be achieved, further improving the flexibility of adjusting the thermal conductivity of the natural heat dissipation metal protective shell.

[0090] Specifically, at least two chips 30 include an intelligent driving chip 31, an intelligent cockpit chip 32 and a communication chip 33. The intelligent driving chip 31 is used to collect the data collected by the camera during the driving process of the vehicle; the intelligent cockpit chip 32 is used to collect the data collected by the camera during the driving and parking process of the vehicle; the intelligent cockpit chip 32 is connected and data is exchanged with the communication chip 33. In this way, the high heat dissipation requirements of the self-driving car can be met, the stable operation of the intelligent driving chip 31 and the intelligent cockpit chip 32 can be ensured, and the driving safety can be improved.

[0091] Specifically, the smart driving chip 31 serves as an intermittent heating chip, and the smart cockpit chip 32 serves as a continuous heating chip, so as to achieve uniformity of heat dissipation effect through variable thermal conductivity, thereby ensuring balanced heat dissipation of the entire protective shell of the controller.

[0092] In this embodiment, the controller also includes an Ethernet switch chip 40 and a micro control unit 50. The Ethernet switch chip 40 is arranged on the circuit board 20. The smart driving chip 31 and the smart cockpit chip 32 are both connected to the Ethernet switch chip 40 for data transmission; the micro control unit 50 is connected to the Ethernet switch chip 40 for data transmission. Through the cooperation of the Ethernet switch chip 40 and the micro control unit 50, the controller can realize high-speed data exchange and intelligent control, which is suitable for equipment that requires real-time data processing and control. In addition, the above structure realizes the conversion of the Ethernet switch of the equipment into the Ethernet switch chip 40 arranged on the circuit board 20, which reduces the occupied space, changes the connection mode, and improves the data transmission speed.

[0093] The smart driving chip 31 focuses on processing the data collected by the front and side view cameras. The data results and raw data streams are transmitted to the micro control unit 50 via Ethernet for vehicle control decisions, and are transmitted to the smart cockpit chip 32 for display on the screen end of the screen display component. The smart cockpit chip 32 focuses on processing the front and surround view camera components, which are used for front view video collection and recording during driving, and 360° video stitching of parking scenes. The video data is displayed through the screen display component for human-computer interaction. The functional safety micro control unit 50 receives the front and side view video detection results, such as lane lines, pedestrians, signboards, etc., which can be sent to the smart cockpit chip 32 for unified decision processing and sent to the functional safety micro control unit 50 for regulatory control decisions and vehicle control signal output. The smart cockpit chip 32 is connected and data interacts with 4G / 5G, WIFI, BT modules or modules, and data is exchanged with the cloud and data is transmitted with mobile phones, smart keys, etc. The above-mentioned smart cockpit chip 32 generally has a powerful CPU and GPU, and its overall power consumption is relatively large. It can be selected as a continuous heating chip, and a heat-conducting medium with a higher thermal conductivity (λ2) is used to dissipate its heat. When the above-mentioned smart driving chip 31 is in the parking state, it generally does not need to perform AI computing and recognition of lane lines, vehicles, pedestrians, etc., and only releases its maximum computing power under the driving state. It can be selected as an intermittent heating chip, and a heat-conducting medium with a lower thermal conductivity (λ1) is used to dissipate its heat when the car is parked; when the car is driving, a heat-conducting medium with a higher thermal conductivity (λ2) is used to dissipate its heat.

[0094] Specifically, when there are other categories of system-level chips or other types of chips (such as communication chips 33 (which can be 4G or 5G), power chips, etc.), heat dissipation needs to be carried out through the heat-conducting shell 11. According to different working conditions, a combination of heat-conducting media with multiple thermal conductivities (λ1...λn) can be selected to finely divide the heat dissipation areas with different thermal conductivities to balance the heat dissipation area of ​​the entire domain controller shell.

[0095] Specifically, the controller further includes a protective housing, and the heat dissipation assembly 10, the circuit board 20 and at least two chips 30 are all installed in the protective cavity of the protective housing. Specifically, the heat-conducting housing 11 of the heat dissipation assembly 10 can be connected to the protective housing or integrally formed, so as to facilitate better heat dissipation through the protective housing.

[0096] like Figure 5 As shown, the third embodiment of the present invention provides a control method, which is applicable to the heat dissipation component 10 provided above, wherein at least two heat conduction parts 12 include a first heat conduction part 12 and a second heat conduction part 12 arranged adjacently, and at least two heat conduction regions 112 include a first heat conduction region 112 and a second heat conduction region 112 arranged adjacently, and the thermal conductivity of the first heat conduction part 12 is less than the thermal conductivity of the second heat conduction part 12; the control method includes: obtaining the temperature of the first heat conduction region 112 and the temperature of the second heat conduction region 112, and comparing the temperature of the first heat conduction region 112 with the temperature of the second heat conduction region 112; when the temperature of the first heat conduction region 112 is less than or equal to the temperature of the second heat conduction region 112, controlling the heat dissipation component 10 to be in the first heat dissipation state; when the temperature of the first heat conduction region 112 is greater than the temperature of the second heat conduction region 112, controlling the heat dissipation component 10 to be in the second heat dissipation state. This control method can dynamically adjust the heat dissipation strategy according to the actual heating situation, improve the heat dissipation efficiency, and can be conveniently and better applied to various devices that need to adjust the heat dissipation according to the workload.

[0097] In this embodiment, the heat dissipation assembly 10 is the heat dissipation assembly 10 provided above, the first driving member is connected to one end of the heat conduction channel 111 close to the first heat conduction part 12, and the second driving member is connected to one end of the heat conduction channel 111 close to the second heat conduction part 12; controlling the heat dissipation assembly 10 to be in the second heat dissipation state includes: controlling the first driving member to pass negative pressure fluid into the heat conduction channel 111; and / or controlling the second driving member to pass positive pressure fluid into the heat conduction channel 111. By accurately controlling the fluid pressure of the first driving member and / or the second driving member, the heat dissipation assembly 10 can quickly respond to the temperature change of the heat source, provide instant heat dissipation, and can be more suitable for heat dissipation of controllers that require rapid response.

[0098] Specifically, controlling the heat dissipation component 10 to be in the second heat dissipation state also includes: obtaining the temperature increase rate and / or temperature increase amount of the first heat conduction area 112 within a predetermined time; controlling the fluid flow rate and flow rate of the first driving member according to the temperature increase rate and / or temperature increase amount of the first heat conduction area 112 within a predetermined time; and / or, controlling the fluid flow rate and flow rate of the second driving member according to the temperature increase rate and / or temperature increase amount of the first heat conduction area 112 within a predetermined time. With this control strategy, it is possible to make a prejudgment based on the temperature change trend of the heat source corresponding to the first heat conduction area 112, adjust the heat dissipation strategy in advance, and avoid the situation where the first heat conduction area 112 is overheated due to a sudden temperature increase, thereby causing uneven temperature.

[0099] From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects: chips with different heat generation and working characteristics can still achieve balanced heat dissipation in the regions of the metal shell of the entire domain controller through fine adjustment of the thermal conductivity of the metal shell they are in contact with under natural heat dissipation conditions, reduce the distortion of the heat-conducting shell and / or the protective shell caused by the large temperature difference in different areas of the metal heat dissipation shell, enhance the stability of the overall structural form of the next-generation cabin-driver fusion domain controller and the central centralized domain controller under natural heat dissipation conditions, and enhance the working stability and reliability of the equipment in long-term complex and harsh environments.

[0100] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0101] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the application. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0102] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0103] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0104] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0105] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat dissipation component, characterized in that: include: A heat-conducting housing (11), wherein a heat-conducting channel (111) is arranged inside the heat-conducting housing (11), and the heat-conducting housing (11) has at least two heat-conducting areas (112) arranged along an extension direction of the heat-conducting channel (111); At least two heat-conducting parts (12) are movably arranged in the heat-conducting channel (111) and arranged along the extension direction of the heat-conducting channel (111); the at least two heat-conducting parts (12) are arranged in one-to-one correspondence with the at least two heat-conducting regions (112); each of the heat-conducting parts (12) is formed by a heat-conducting medium; the thermal conductivity coefficients of two adjacent heat-conducting parts (12) are different; the two adjacent heat-conducting parts (12) are incompatible with each other and have a junction surface (14) at the junction, or a separator is arranged between the two adjacent heat-conducting parts (12); The heat dissipation component has a first heat dissipation state and a second heat dissipation state; when the heat dissipation component is in the first heat dissipation state, each of the heat conduction parts (12) is arranged relative to the corresponding heat conduction area (112); when the heat dissipation component is in the second heat dissipation state, at least a portion of each of the heat conduction parts (12) is arranged offset from the corresponding heat conduction area (112), and is arranged relative to the heat conduction area (112) adjacent to the corresponding heat conduction area (112).

2. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation component also includes: A driving structure, the driving structure being in communication with an end of the heat-conducting channel (111), the driving structure being used to introduce a positive-pressure fluid or a negative-pressure fluid into the heat-conducting channel (111) so as to drive the at least two heat-conducting parts (12) to move along an extension direction of the heat-conducting channel (111).

3. The heat dissipation assembly according to claim 2, characterized in that: The driving structure comprises: a first driving member, connected to one end of the heat-conducting channel (111), the first driving member being used to introduce a positive pressure or negative pressure fluid into the heat-conducting channel (111) through one end of the heat-conducting channel (111); and / or, The second driving member is in communication with the other end of the heat-conducting channel (111), and the second driving member is used to introduce negative pressure or positive pressure fluid into the heat-conducting channel (111) through the other end of the heat-conducting channel (111).

4. The heat dissipation assembly according to claim 2, characterized in that: The heat dissipation component also includes: A connecting pipeline (13), one end of the connecting pipeline (13) is connected to one end of the heat-conducting channel (111), the other end of the connecting pipeline (13) extends out of the heat-conducting housing (11), and the driving structure is in communication with the other end of the connecting pipeline (13).

5. The heat dissipation assembly according to claim 2, characterized in that: The heat dissipation component also includes: At least two temperature detection components, the at least two temperature detection components are arranged in one-to-one correspondence with the at least two heat-conducting regions (112), and each of the temperature detection components is used to perform temperature detection on the corresponding heat-conducting region (112); A control member, wherein the at least two temperature detection members and the driving structure are both connected to the control member, so that the control member controls the driving structure according to temperature detection signals from the at least two temperature detection members.

6. The heat dissipation assembly according to claim 1, characterized in that: There are a plurality of heat-conducting channels (111), and the plurality of heat-conducting channels (111) are arranged at intervals; Wherein, the plurality of heat conduction channels (111) are arranged along a predetermined direction; or, A portion of the plurality of heat-conducting channels (111) is arranged along a first preset direction, another portion of the plurality of heat-conducting channels (111) is arranged along a second preset direction, and a portion of the plurality of heat-conducting channels (111) and another portion of the plurality of heat-conducting channels (111) are spaced apart from each other along a thickness direction of the heat-conducting housing (11).

7. The heat dissipation assembly according to claim 1, characterized in that: Each of the heat conducting parts (12) is formed by a heat conducting fluid; and / or, The heat-conducting housing (11) is made of metal.

8. The heat dissipation assembly according to claim 1, characterized in that: One of the two adjacent heat-conducting parts (12) is formed of liquid water, and the other of the two adjacent heat-conducting parts (12) is formed of silicone oil; or, A first guide portion is provided on the partition, and a second guide portion is provided on the inner wall of the heat-conducting channel (111), one of the first guide portion and the second guide portion extends along the extension direction of the heat-conducting channel (111), and the first guide portion cooperates with the second guide portion in a guiding manner.

9. A controller, characterized in that: include: The heat dissipation assembly according to any one of claims 1 to 8; A circuit board (20) and at least two chips (30), wherein the at least two chips (30) are arranged on the circuit board (20), and at least two heat conduction areas of the heat dissipation component are arranged in a one-to-one correspondence with the at least two chips (30), and each of the heat conduction areas is attached to the corresponding chip (30) and dissipates heat for the corresponding chip (30).

10. The controller according to claim 9, characterized in that: One of the at least two chips (30) is an intermittent heating chip, the other of the at least two chips (30) is a continuous heating chip, and the thermal conductivity of the heat conducting portion corresponding to the intermittent heating chip is smaller than the thermal conductivity of the heat conducting portion corresponding to the continuous heating chip.

11. The controller according to claim 9, characterized in that: The at least two chips (30) include: An intelligent driving chip (31), the intelligent driving chip (31) being used to collect data collected by a camera during driving of the vehicle; A smart cockpit chip (32), the smart cockpit chip (32) being used to collect data collected by a camera during driving and parking of the vehicle; A communication chip (33), wherein the smart cockpit chip (32) is connected to and exchanges data with the communication chip (33).

12. The controller according to claim 11, characterized in that: The controller further comprises: An Ethernet switching chip (40) is arranged on the circuit board (20), and the smart driving chip (31) and the smart cockpit chip (32) are both connected to the Ethernet switching chip (40) for data transmission; The micro control unit (50) is connected to the Ethernet switching chip (40) and performs data transmission.

13. A control method, characterized in that: The heat dissipation assembly according to any one of claims 1 to 8, wherein the at least two heat-conducting parts include a first heat-conducting part and a second heat-conducting part disposed adjacent to each other, the at least two heat-conducting regions include a first heat-conducting region and a second heat-conducting region disposed adjacent to each other, and the thermal conductivity of the first heat-conducting part is smaller than the thermal conductivity of the second heat-conducting part; The control method comprises: Acquiring a temperature of the first heat conducting region and a temperature of the second heat conducting region, and comparing the temperature of the first heat conducting region with the temperature of the second heat conducting region; When the temperature of the first heat-conducting region is less than or equal to the temperature of the second heat-conducting region, controlling the heat-dissipating component to be in the first heat-dissipating state; When the temperature of the first heat-conducting region is greater than the temperature of the second heat-conducting region, the heat dissipation component is controlled to be in the second heat dissipation state.

14. The control method according to claim 13, characterized in that: The heat dissipation assembly is the heat dissipation assembly described in claim 3, the first driving member is connected to an end of the heat conduction channel close to the first heat conduction part, and the second driving member is connected to an end of the heat conduction channel close to the second heat conduction part; the controlling the heat dissipation assembly to be in the second heat dissipation state includes: controlling the first driving member to introduce negative pressure fluid into the heat conduction channel; and / or, The second driving member is controlled to introduce positive pressure fluid into the heat conduction channel.

15. The control method according to claim 14, characterized in that: The controlling the heat dissipation component to be in the second heat dissipation state further includes: Obtaining a temperature increase rate and / or a temperature increase amount of the first heat transfer region within a predetermined time; The fluid flow rate and flow rate of the first driving member are controlled according to the temperature increase rate and / or the temperature increase amount of the first heat-conducting area within a predetermined time; and / or, the fluid flow rate and flow rate of the second driving member are controlled according to the temperature increase rate and / or the temperature increase amount of the first heat-conducting area within a predetermined time.

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