Display module manufacturing method, display module and head-mounted display equipment

Abstract

The invention discloses a display module manufacturing method, a display module and a head-mounted display device, and relates to the technical field of display, the display module manufacturing method comprises the following steps: manufacturing a first display backboard corresponding to a first display area and a second display backboard corresponding to a second display area; bonding the first display back plate and the second display back plate to form a display module; wherein the pixel density of a first display area on the display module is greater than that of a second display area, and the second display area surrounds the first display area. The manufacturing cost of the display module is reduced while the observation quality of a user on the display module is not influenced.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display module manufacturing method, a display module and a head-mounted display device. Background Art

[0002] In order to improve the immersive experience of virtual scenes, it is generally necessary to achieve it from two aspects. One is to increase the size of the display module to increase the FOV (Field of View) to provide the wearer with a wider field of view; the other is to increase the resolution and PPI (Pixels Per Inch) of the display module to reduce the impact of the screen door effect and enhance the realism of the picture. That is, a display module with a larger size and higher pixel density is needed.

[0003] However, if the display module with a higher pixel density is larger in size, its production cost will also be higher. For example, although the pixel density of the current silicon-based OLED (Organic Light-Emitting Diode) microdisplay can reach more than 3500, because the silicon-based OLED microdisplay is manufactured using semiconductor technology, it is limited by the influence of the semiconductor photolithography machine FOV, and the size of the display module directly manufactured is relatively small. If a large-size silicon-based OLED microdisplay is to be produced, the manufacturing cost of the display module will be greatly increased, which is unacceptable for consumer-grade electronics. Therefore, while not affecting the user's observation quality of the display module (i.e., the image quality under user observation), reducing the production cost of the display module is a technical problem that urgently needs to be solved in this field. Summary of the invention

[0004] The main purpose of the present application is to provide a display module manufacturing method, a display module and a head-mounted display device, aiming to solve the technical problem of reducing the manufacturing cost of the display module without affecting the user's observation quality of the display module.

[0005] To achieve the above objectives, the present application proposes a display module manufacturing method, the method comprising:

[0006] Manufacturing a first display backplane corresponding to the first display area and a second display backplane corresponding to the second display area;

[0007] The first display backplane and the second display backplane are bonded to form a display module; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area.

[0008] In one embodiment, the step of manufacturing a first display backplane corresponding to the first display area includes:

[0009] Providing a silicon wafer having a first driving circuit layer, wherein the first driving circuit layer includes at least one first driving circuit area corresponding to a first display area;

[0010] Performing through-silicon via processing on the silicon wafer so as to lead the connection wires of the first driving circuit layer to the back side of the silicon wafer;

[0011] The back side of the silicon wafer is thinned to expose the lead through holes of the silicon wafer for lead-out connection wires, thereby obtaining a silicon-based driving backplane as the first display backplane.

[0012] In one embodiment, the step of manufacturing a second display backplane corresponding to the second display area includes:

[0013] A second drive circuit layer is manufactured on the glass substrate to obtain a second display backplane, wherein the second drive circuit layer includes at least one second drive circuit area corresponding to the second display area, the second drive circuit area surrounds the bonding area, and the bonding area has bonding pins for connecting to the first drive circuit area.

[0014] In one embodiment, the step of bonding the first display backplane and the second display backplane to form a display module includes:

[0015] Cutting the first display backplane according to the size corresponding to the first display area and bonding it with the second display backplane to obtain a display driving backplane;

[0016] The display layer is manufactured on the display driver backplane, and the display driver backplane with the display layer manufactured is subjected to a post-processing process to obtain a display module.

[0017] In one embodiment, the steps of manufacturing a display layer on a display driver backplane, and performing a post-processing process on the display driver backplane on which the display layer is manufactured, to obtain a display module include:

[0018] According to the predetermined OLED structure, an organic material light-emitting layer and a common cathode layer are evaporated on the display driving backplane to obtain a display driving backplane with a display layer;

[0019] After packaging the display driving backplane with the display layer manufactured, attaching the cover plate, cutting and bonding the module, a display module is obtained.

[0020] In one embodiment, the step of bonding the first display backplane and the second display backplane to form a display module further includes:

[0021] Manufacturing and packaging a first display layer on a first display backplane;

[0022] The packaged first display backplane is cut according to the size corresponding to the first display area, and then bonded to the second display backplane to obtain a display driving backplane;

[0023] The second display layer is manufactured in the second display area of ​​the display driving backplane, and the display driving backplane with the second display layer manufactured is subjected to a post-processing process to obtain a display module.

[0024] In one embodiment, the step of manufacturing the second display layer in the second display area of ​​the display driving backplane includes:

[0025] Performing an alignment process on the second display area of ​​the display driving backplane to obtain a display driving backplane having an alignment layer;

[0026] After liquid crystal material is dripped onto the alignment layer, the layer is sealed to form a liquid crystal unit layer as the second display layer.

[0027] In addition, to achieve the above-mentioned purpose, the present application also proposes a display module, the display module comprising: a display driving backplane and a display layer integrally formed on the display driving backplane;

[0028] The display driving backplane is formed by bonding a first display backplane corresponding to the first display area and a second display backplane corresponding to the second display area;

[0029] The display layer includes a first display layer in a first display area and a second display layer in a second display area; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area, and the first display layer and the second display layer are formed as one piece.

[0030] In addition, to achieve the above-mentioned purpose, the present application also proposes a head-mounted display device, which is configured with the above-mentioned display module.

[0031] One or more technical solutions proposed in this application have at least the following technical effects:

[0032] The present application forms a display module by manufacturing a first display backplane corresponding to a first display area and a second display backplane corresponding to a second display area, and bonding the first display backplane and the second display backplane; wherein, the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area. Thus, the present application can manufacture a display module with different display areas. Although the human eye has a large visual field, the photoreceptor cells are mainly distributed near the fovea, and the clear visual field of the human eye is much smaller than the visual field. Therefore, the present application can use a display area with a higher pixel density in the clear visual field area, and a display area with a lower pixel density outside the clear visual field area, so that the display module manufactured by the present application only needs to manufacture a component with a higher pixel density in the first display area corresponding to the clear visual field area, without having to manufacture the entire display module with a higher pixel density, so as to greatly reduce the cost of the display module without affecting the user's observation quality of the display module. In addition, since the display module in the present application adopts a driving backplane that is first bonded to different display areas, on the one hand, the display module manufacturing method of the present application can be applied to the combination of different display structures. On the other hand, compared with simply splicing two prepared display panels, the present application can effectively reduce the splicing seam and even achieve seamless splicing, thereby effectively improving the user's observation quality of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0035] Figure 1 A schematic diagram of the visual field of the human eye in the horizontal plane;

[0036] Figure 2 A schematic diagram of a process flow provided for Embodiment 1 of the method for manufacturing a display module of the present application;

[0037] Figure 3 A schematic diagram of the structure of the display module in the main viewing direction involved in the embodiment of the present application;

[0038] Figure 4 Another structural schematic diagram of the display module involved in the embodiment of the present application in the main viewing direction;

[0039] Figure 5It is a schematic diagram of the structure of the display module involved in the embodiment of the present application in a side view direction;

[0040] Figure 6 A schematic diagram of a flow chart of a second embodiment of a method for manufacturing a display module of the present application;

[0041] Figure 7 A schematic diagram of a flow chart of Embodiment 3 of the method for manufacturing a display module of the present application;

[0042] Figure 8 A schematic diagram of the structure of a display module manufactured in an embodiment of the present application;

[0043] Fig. 9 Another structural schematic diagram of the display module manufactured according to the embodiment of the present application.

[0044] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0045] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0046] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0047] The main solution of the embodiment of the present application is: to produce a first display backplane corresponding to the first display area and a second display backplane corresponding to the second display area; to form a display module after bonding the first display backplane and the second display backplane; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area.

[0048] In the prior art, the larger the size of a display module with a higher pixel density, the higher its manufacturing cost will be. For example, although the pixel density of a silicon-based OLED (Organic Light-Emitting Diode) microdisplay can reach more than 3500, the size of the display module directly manufactured is relatively small because the silicon-based OLED microdisplay is manufactured using semiconductor technology and is limited by the FOV of the semiconductor lithography machine. If a large-size silicon-based OLED microdisplay is to be produced, the manufacturing cost of the display module will be greatly increased, which is unacceptable for consumer electronics.

[0049] This application provides a solution, see Figure 1, the light blue line segment is the standard line of sight 0°; the purple line segment is the visual field limit of the left eye, and the angle formed is the monocular visual area of ​​the left eye; the dark blue line segment is the visual field limit of the right eye, and the angle formed is the monocular visual area of ​​the right eye; the angle formed by the yellow line segment is the optimal eye rotation area; the area formed by the green line segment is the binocular visual area where both the left and right eyes can see objects clearly. Therefore, for a single human eye, although the human eye has a larger visual field (generally more than 120°), the photoreceptor cells are mainly distributed near the fovea, and the clear visual field of the human eye is much smaller than the visual field, generally about 15°. Therefore, the present application can use a display area with a higher pixel density in the clear visual field area, and a display area with a lower pixel density outside the clear visual field area, so that the display module produced by the present application only needs to produce components with a higher pixel density in the first display area corresponding to the clear visual field area, without having to produce an entire display module with a higher pixel density, so as to greatly reduce the cost of the display module without affecting the user's observation quality of the display module. In addition, since the display module in the present application adopts a driving backplane that is first bonded to different display areas, on the one hand, the display module manufacturing method of the present application can be applied to the combination of different display structures. On the other hand, compared with simply splicing two prepared display panels, the present application can effectively reduce the splicing seam and even achieve seamless splicing, thereby effectively improving the user's observation quality of the display module.

[0050] Based on this, the present application embodiment produces a display module manufacturing method, referring to Figure 2 , Figure 2 It is a flow chart of the first embodiment of the method for manufacturing a display module of the present application.

[0051] In this embodiment, the display module manufacturing method includes steps S10 to S40:

[0052] Step S10, manufacturing a first display backplane corresponding to the first display area and a second display backplane corresponding to the second display area;

[0053] It should be noted that the pixel density of the first display area is greater than that of the second display area, and the second display area surrounds the first display area. Since the difference in pixel density will also lead to the difference in driving circuits, the first display backplane includes a substrate having a first driving circuit layer adapted to the pixel density of the first display area, and the second display backplane includes a substrate having a second driving circuit layer adapted to the pixel density of the second display area.

[0054] Since the clear field of vision of the human eye corresponds to the center position of the display module, the pixel density of the first display area in this embodiment is greater than the pixel density of the second display area, and the second display area surrounds the first display area. A first display backplane is obtained by making a first drive circuit layer on a first substrate, wherein the first drive circuit layer includes at least one first drive circuit area corresponding to the pixel density of the first display area. A second drive circuit layer is made on a second substrate to obtain a second display backplane, wherein the second drive circuit layer includes at least one second drive circuit area corresponding to the pixel density of the second display area, and the second drive circuit area in the second drive circuit layer surrounds the bonding area, and the bonding area has a bonding pin for connecting to the first drive circuit area, and then the bonding between the first display backplane and the second display backplane. The first substrate and the second substrate can be made of materials such as silicon wafers, glass, and plastic, and the material of the substrate can be selected according to the process requirements.

[0055] As an example, in this embodiment, transistors and other circuit elements can be made on a silicon wafer using a standard CMOS process to obtain a silicon wafer with a first drive circuit layer. Then, the silicon wafer with the first drive circuit layer is subjected to through-silicon via processing so that the connection wires of the first drive circuit layer are led to the back of the silicon wafer, and the back of the silicon wafer is thinned so that the lead through holes of the lead-out connection wires of the silicon wafer are exposed, thereby obtaining a silicon-based drive backplane as the first display backplane. The second drive circuit layer of the LTPS-TFT array is deposited on a glass substrate to obtain a glass-based drive backplane as the first display backplane, wherein the second drive circuit layer includes at least one second drive circuit area corresponding to the pixel surface density of the second display area, and the second drive circuit area surrounds the bonding area.

[0056] In a feasible implementation manner, the step of manufacturing the first display backplane corresponding to the first display area in step S10 may include steps S11 to S12:

[0057] Step S11, providing a silicon wafer having a first driving circuit layer, wherein the first driving circuit layer includes at least one first driving circuit area corresponding to the first display area;

[0058] Step S12, performing through silicon via processing on the silicon wafer so as to lead the connection wires of the first driving circuit layer to the back side of the silicon wafer;

[0059] Step S13, thinning the back side of the silicon wafer to expose the lead through holes of the silicon wafer for lead-out connection wires, thereby obtaining a silicon-based driving backplane as the first display backplane.

[0060] Since silicon wafers can be used as substrates to produce better flatness and smaller surface roughness, it is conducive to the precise arrangement of pixels, and silicon wafers can use semiconductor processing technology to produce fine structures at the micron or even nanometer level, so extremely small pixels can be produced to achieve higher pixel density. Therefore, in this embodiment, the first display backplane is a driving backplane with a silicon wafer as a substrate. This embodiment provides a silicon wafer with a first driving circuit layer, wherein the first driving circuit layer includes at least one first driving circuit area corresponding to the first display area, and then the silicon wafer with the first driving circuit layer is processed by silicon through holes so that the connecting wires of the first driving circuit layer are led to the back of the silicon wafer, wherein the first driving circuit layer includes at least one first driving circuit area corresponding to the first display area; and then the back of the silicon wafer is thinned so that the lead through holes of the silicon wafer for leading out the connecting wires are exposed, and a silicon-based driving backplane is obtained as the first display backplane.

[0061] In this embodiment, a silicon wafer having a first driving circuit layer is subjected to through silicon via processing so that the connecting wires of the first driving circuit layer are led to the back side of the silicon wafer, wherein the first driving circuit layer includes at least one first driving circuit area corresponding to a first display area; the back side of the silicon wafer is thinned so that the lead through holes of the lead-out connecting wires of the silicon wafer are exposed, thereby obtaining a silicon-based driving backplane as the first display backplane, in preparation for bonding between the first display backplane and the second display backplane.

[0062] In a feasible implementation manner, the step of making a second display backplane corresponding to the second display area in step S10 may include step S13:

[0063] Step S13, manufacturing a second driving circuit layer on the glass substrate to obtain a second display backplane corresponding to the second display area, wherein the second driving circuit layer includes at least one second driving circuit area corresponding to the second display area, the second driving circuit area surrounds the bonding area, and the bonding area has bonding pins for connecting with the first driving circuit area;

[0064] It should be noted that the bonding area has bonding pins for connecting to the first driving circuit area.

[0065] In this embodiment, a second driving circuit layer is manufactured on a glass substrate, wherein the second driving circuit layer includes at least one second driving circuit area corresponding to the pixel density of a second display area. In this embodiment, the second driving circuit area surrounds the bonding area so as to bond the first display backplane with a higher pixel density to the central area of ​​the second driving substrate, thereby allowing the second display area to surround the first display area, providing a higher pixel density for the user's clear field of vision.

[0066] Step S20, bonding the first display backplane and the second display backplane to form a display module; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area.

[0067] It should be noted that bonding can adopt bonding processes such as eutectic bonding and low-temperature bonding, and the specific bonding process can be selected according to specific needs.

[0068] Taking the case where the first display backplane and the second display backplane on the display driver backplane both adopt the same display mechanism as an example, in this embodiment, the first display backplane is cut according to the size corresponding to the first display area to obtain each first display unit. The first display unit and the second display backplane are bonded together to obtain the display driver backplane; the display layer is manufactured on the display driver backplane, and the display driver backplane with the display layer manufactured is subjected to a post-processing process to obtain a display module.

[0069] However, in real production scenarios, it is also possible that the first display backplane and the second display backplane may adopt different light-emitting display mechanisms. In this embodiment, the first display layer can be manufactured and packaged on the first display backplane; the packaged first display backplane is cut according to the corresponding size of the first display area to obtain each first display unit. The first display unit is bonded to the second display backplane to obtain a display driver backplane; the second display layer is manufactured in the second display area of ​​the display driver backplane, and the display driver backplane with the second display layer manufactured is subjected to a post-processing process to obtain a display module.

[0070] Taking the bonding process as eutectic bonding as an example, in this embodiment, eutectic bonding materials can be coated on the back of the first display unit and the bonding area of ​​the second display backplane respectively by sputtering, silk screen printing or other physical vapor deposition methods, wherein common eutectic bonding material systems include Au-Si, Au-Ge, Al-Ge, Au-Sn and Au-In, etc. Then, by adjusting the relative positions of the first display unit and the second display backplane, the lead through hole on the back of the first display unit matches the lead position of the bonding pin in the bonding area. Then, heating is performed to cause the eutectic bonding materials coated on the back of the first display unit and the bonding area of ​​the second display backplane to undergo a eutectic reaction. After the eutectic reaction is completed, cooling is performed to complete the bonding of the first display backplane and the second display backplane to obtain a display driver backplane.

[0071] Taking the bonding process of low temperature bonding as an example, this embodiment can achieve low temperature bonding through anisotropic conductive adhesive (ACF, Anisotropic Conductive Adhesive). In this embodiment, anisotropic conductive adhesive can be applied to the back of the first display unit and the bonding area of ​​the second display backplane respectively by a dispensing machine, template printing or screen printing. Then, by adjusting the relative positions of the first display unit and the second display backplane, the lead through hole on the back of the first display unit matches the lead position of the bonding pin in the bonding area. Then, the back of the first display unit and the bonding area of ​​the second display backplane are bonded under appropriate temperature and pressure. The bonded first display backplane and the second display backplane are cured to complete the bonding of the first display backplane and the second display backplane to obtain a display driver backplane.

[0072] The first embodiment of the present application provides a method for manufacturing a display module, by manufacturing a first display backplane corresponding to a first display area and a second display backplane corresponding to a second display area, and bonding the first display backplane and the second display backplane to form a display module; wherein, the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area. Thus, the present application can manufacture a display module with different display areas. Although the human eye has a large visual field, the photoreceptor cells are mainly distributed near the fovea, and the clear visual field of the human eye is much smaller than the visual field. Therefore, the present embodiment can use a display area with a higher pixel density in the clear visual field area, and a display area with a lower pixel density outside the clear visual field area, so that the display module manufactured by the present embodiment only needs to manufacture a component with a higher pixel density in the first display area corresponding to the clear visual field area, without having to manufacture the entire display module with a higher pixel density, so as to greatly reduce the cost of the display module without affecting the user's observation quality of the display module. In addition, since the display module in this embodiment adopts a driving backplane to which different display areas are first bonded, on the one hand, the display module manufacturing method of this embodiment can be applied to the combination of different display structures, and on the other hand, compared with simply splicing two prepared display panels, this embodiment can effectively reduce the splicing seam and even achieve seamless splicing, thereby effectively improving the user's observation quality of the display module.

[0073] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar contents as those in the above-mentioned embodiment 1 can be referred to the above introduction, and will not be repeated in the following. Figure 6 , step S20 includes steps S21-S22:

[0074] Step S21, cutting the first display backplane according to the size corresponding to the first display area, and bonding it with the second display backplane to obtain a display driving backplane;

[0075] Step S22, manufacturing a display layer on the display driver backplane, and performing a post-processing process on the display driver backplane with the display layer manufactured, to obtain a display module.

[0076] It should be noted that the post-processing process is the process flow after the display layer is made, and the post-processing process includes at least packaging, cover plate attachment, module cutting and bonding. Depending on the specific needs, the post-processing process can also include more processing steps. For example, if the display driver backplane adopts a WOLED structure, it is necessary to add a Color Filter (color filter) processing step before the cover plate is attached to achieve full-color display. For example, the LCD (Liquid Crystal Display) display driver backplane requires processing steps such as attaching polarizers and assembling backlight sources. Of course, it can also include aging testing, calibration and other processing steps.

[0077] In this embodiment, the first display backplane is cut according to the size corresponding to the first display area, and then bonded with the second display backplane to obtain a display driver backplane. In order to improve the manufacturing quality of the display layer, the display driver backplane can be cut according to the predetermined target size to obtain at least two new display driver backplanes, wherein the predetermined target size is the size required by the process used to manufacture the display layer for the processing of the backplane. Taking evaporation as an example, if the size of the display driver backplane is too large, it may be difficult to manufacture a fine metal mask, and the uniformity and accuracy of evaporation are difficult to ensure. Then, the display layer is manufactured on the display driver backplane, and the display driver backplane with the manufactured display layer is subjected to a post-processing process to obtain a display module. Taking the first display backplane and the second display backplane on the display driver backplane as an example, both the first display backplane and the second display backplane adopt the OLED display process, in this embodiment, according to the predetermined OLED structure, the organic material light-emitting layer and the common cathode layer are deposited on the display driver backplane to obtain a display driver backplane with a manufactured display layer, and then the display driver backplane with the manufactured display layer can be packaged, the cover plate attached, the module cut and bonded to obtain a display module. The deposition of the organic material light-emitting layer and the common cathode layer can be achieved by physical vapor deposition, chemical vapor deposition, inkjet printing and other processes. It can be understood that in this embodiment, the second display backplane can be cut first, and then the first display backplane and the second display backplane are bonded. That is, in this embodiment, the second display backplane can be cut according to the predetermined target size to obtain at least two new second display backplanes. Then, after the first display backplane is cut according to the corresponding size of the first display area, it is bonded with the second display backplane to obtain a display driver backplane. The display layer is then manufactured on the display driver backplane, and the display driver backplane with the display layer manufactured is subjected to a post-processing process to obtain a display module.

[0078] The display module can be found in Figure 3 , Figure 4 and Figure 5 , Figure 3 is a schematic diagram of the structure of the display module involved in the embodiment of the present application in the main viewing direction, Figure 4 is another structural schematic diagram of the display module involved in the embodiment of the present application in the main viewing direction, Figure 5 This is a schematic diagram of the structure of the display module involved in the embodiment of the present application in the side view direction. In this embodiment, the center of the display module is a display area with a higher pixel density, and the outside of the center of the display module is a display area with a lower pixel density. The display area with a higher pixel density can be a rectangular or circular lamp shape.

[0079] In a feasible implementation manner, step S22 includes steps A10 to A20:

[0080] Step A10, performing evaporation deposition of an organic material light-emitting layer and a common cathode layer on a display driving backplane according to a predetermined OLED structure, to obtain a display driving backplane with a display layer made thereon;

[0081] Step A20, after packaging the display driving backplane with the display layer manufactured, attaching the cover plate, cutting and bonding the module, a display module is obtained.

[0082] It should be noted that the predetermined OLED structure is a pre-selected OLED light-emitting mode, such as RGB Side-by-Side structure (RGB side-by-side structure, that is, each pixel is composed of three independent light-emitting units of red (Red), green (Green), and blue (Blue) side by side), WOLED structure (that is, each pixel point has only one white light-emitting diode, and visual red, green, and blue light are formed through RGB primary color filters).

[0083] In this embodiment, the display driver backplane with the display layer prepared can be obtained by evaporating the organic material light-emitting layer and the common cathode layer on the display driver backplane according to the predetermined OLED structure. Taking the RGB Side-by-Side structure as an example, in this embodiment, the three light-emitting materials of red, green and blue are placed in the evaporation source respectively in a highly vacuum environment, and evaporated into gaseous state by heating. Then, the fine metal mask is precisely aligned with the display driver backplane to ensure that the opening pattern on the fine metal mask corresponds to the pixel position on the display driver backplane one by one. Then, each time a light-emitting material of one color is evaporated, the gaseous light-emitting material is deposited on the display driver backplane through the openings on the fine metal mask to form light-emitting layers of organic materials of red, green and blue colors. Then, the display driver backplane with the display layer prepared is packaged, the cover plate is attached, the module is cut and bonded, and the display module is obtained.

[0084] The second embodiment of the present application provides a method for manufacturing a display module. In this embodiment, a first display backplane is cut according to the size corresponding to the first display area, and then bonded with a second display backplane to obtain a display driver backplane; a display layer is manufactured on the display driver backplane, and the display driver backplane with the display layer manufactured is subjected to a post-processing process to obtain a display module. Since this embodiment manufactures the display layer as a whole after bonding the first display backplane and the second display backplane, there is no splicing seam on the display layer in this embodiment, that is, seamless splicing is achieved, which effectively improves the user's observation quality of the display module.

[0085] Based on the first embodiment of the present application, in the third embodiment of the present application, the same or similar contents as those in the above-mentioned embodiment 1 can be referred to the above introduction, and will not be repeated in the following. Figure 7 , step S20 also includes steps S23 to S25:

[0086] Step S23, manufacturing and packaging the first display layer on the first display backplane;

[0087] Step S24, cutting the packaged first display backplane according to the size corresponding to the first display area, and bonding it with the second display backplane to obtain a display driving backplane;

[0088] Step S25 , manufacturing a second display layer in the second display area of ​​the display driver backplane, and performing a post-processing process on the display driver backplane with the second display layer manufactured thereon to obtain a display module.

[0089] It should be noted that the post-processing process is the process flow after the display layer is made, and the post-processing process includes at least packaging, cover plate attachment, module cutting and bonding. Depending on the specific needs, the post-processing process can also include more processing steps. For example, if the display driver backplane adopts a WOLED structure, it is necessary to add a Color Filter (color filter) processing step before the cover plate is attached to achieve full-color display. For example, the LCD (Liquid Crystal Display) display driver backplane requires processing steps such as attaching polarizers and assembling backlight sources. Of course, it can also include aging testing, calibration and other processing steps.

[0090] In a real production scenario, it is also possible that the first display backplane and the second display backplane may adopt different light-emitting display mechanisms. In this case, it is difficult to directly integrate the production of the display layer. Therefore, before bonding, the first display layer is first produced and packaged on the first display backplane in this embodiment. For example, taking the first display layer as an OLED layer as an example, the present embodiment can deposit an organic material light-emitting layer and a common cathode layer on the first display backplane according to a predetermined OLED structure to obtain a first display backplane with a first display layer, and then the first display backplane with a first display layer can be packaged. Then, the packaged first display backplane is cut according to the corresponding size of the first display area to obtain each first display unit. The first display unit is bonded to the second display backplane to obtain a display driver backplane. Since the production and packaging of the first display layer have been completed on the first display backplane in advance in this embodiment, the second display layer can only be produced on the second display area of ​​the display driver backplane in this embodiment, and the display driver backplane with the second display layer produced is subjected to a post-processing process to obtain a display module. Taking the second display backplane adopting the OLED display mechanism as an example, this embodiment can deposit the organic material light-emitting layer and the common cathode layer on the second display area according to the predetermined OLED structure to obtain the display driving backplane with the second display layer, and then the display driving backplane with the second display layer can be packaged, the cover plate attached, the module cut and bonded to obtain the display module. The deposition of the organic material light-emitting layer and the common cathode layer can be achieved by physical vapor deposition, chemical vapor deposition, inkjet printing and other processes. Taking the second display backplane adopting the LCD display mechanism as an example, this embodiment can perform an orientation treatment on the second display area of ​​the display driving backplane to obtain a display driving backplane with an orientation layer; after dripping liquid crystal material on the orientation layer, the frame is sealed to form a liquid crystal unit layer as the second display layer, thereby obtaining the display driving backplane with the second display layer. Then, the display driving backplane with the second display layer can be packaged, the cover plate attached, the module cut and bonded to obtain the display module.

[0091] In a feasible embodiment, the step of manufacturing the second display layer in the second display area of ​​the display driving backplane in step S25 includes steps C10 to C20:

[0092] Step C10, performing an alignment process on the second display area of ​​the display driving backplane to obtain a display driving backplane with an alignment layer;

[0093] Step C20, after dripping liquid crystal material on the alignment layer, sealing the frame to form a liquid crystal unit layer as the second display layer.

[0094] This embodiment can use inorganic alignment, organic PI (polyimide) + Rubbing (rubbing) and other orientation processes to achieve orientation treatment on the second display area of ​​the display driver backplane to obtain a display driver backplane with an orientation layer. Taking the inorganic alignment orientation process as an example, this embodiment can immerse the second display area in a solution containing a silane coupling agent, or form a silane layer on the surface of the second display area by a vapor deposition method. The silane coupling agent forms a uniform silicon-oxygen network structure on the surface of the second display area through hydrolysis and condensation reactions. The treated display driver backplane is then thermally cured to enhance the adhesion between the silane layer and the second display area, and to form an ordered orientation structure to obtain a display driver backplane with an orientation layer. Taking the organic PI + Rubbing orientation process as an example, this embodiment can coat a layer of polyimide (PI) solution on the second display area, and cure the PI layer by baking. After the PI layer is cured, it is subjected to mechanical rubbing, usually using a cloth wheel or flannel cloth to rub in one direction at a certain pressure and speed. The rubbing process will form tiny scratches and orientations on the surface of the PI layer. These orientation structures, scratches and orientations, will guide the arrangement of liquid crystal molecules, thus obtaining a display driver backplane with an orientation layer.

[0095] Furthermore, this embodiment adopts vacuum injection or liquid crystal dripping to manufacture the liquid crystal unit layer. Taking the vacuum injection method as an example, it mainly includes vacuum treatment, liquid crystal infusion, sealing and curing, etc. Taking the liquid crystal dripping (ODF) method as an example, it mainly includes liquid crystal dripping, substrate frame glue coating, vacuum bonding, UV irradiation and heating, etc.

[0096] In this embodiment, an orientation treatment is performed on the second display area of ​​the display driver backplane to obtain a display driver backplane with an orientation layer, and then a liquid crystal material is dripped on the orientation layer and then the frame is sealed to form a liquid crystal unit layer as the second display layer, thereby realizing the production of the second display layer on the second display backplane of the LCD display mechanism.

[0097] The third embodiment of the present application provides a method for manufacturing a display module, which includes manufacturing and packaging a first display layer on a first display backplane; cutting the packaged first display backplane according to the corresponding size of the first display area, and bonding it with a second display backplane to obtain a display driver backplane; manufacturing a second display layer in the second display area of ​​the display driver backplane, and performing a post-processing process on the display driver backplane with the second display layer manufactured to obtain a display module. Thus, this embodiment can manufacture a display module with different display areas, and this embodiment is more suitable for scenarios where different display areas use different display mechanisms, so it can adapt to more combinations of different types of display areas, and can more effectively meet different display requirements for display modules.

[0098] It should be noted that the above examples are only used to understand the present application and do not constitute a limitation on the display module manufacturing method of the present application. More simple transformations based on this technical concept are all within the protection scope of the present application.

[0099] In addition, the present application also provides a display module, which includes: a display driving backplane and a display layer formed integrally on the display driving backplane; the display driving backplane is bonded by a first display backplane corresponding to the first display area and a second display backplane corresponding to the second display area; the display layer includes a first display layer in the first display area, and a second display layer in the second display area; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area. It can be understood that when the first display layer and the second display layer adopt the same display mechanism, the first display layer and the second display layer can be formed integrally using the same display layer manufacturing process. The first display backplane of the first display area on the display driving backplane is used to drive the first display layer to display an image, and the second display backplane of the second display area is used to drive the second display layer to display an image. The pixel density of the first display area is greater than the pixel density of the second display area, and the second display area surrounds the first display area, then the first display area is used as the display area corresponding to the clear field of vision of the human eye to ensure a higher display quality in the clear field of vision. The structure of the display module can refer to Figure 8 , Figure 8 The display driver backplane in the middle includes a glass-based driver backplane and a silicon-based driver circuit bonded at the center. Anodes are deposited on the display driver backplane. The first display layer in the first display area and the second display layer in the second display area are both OLED layers. Cathode is deposited on the OLED layer. Due to the WOLED structure, a color filter is also required, and then a glass cover is attached to protect the layers below.

[0100] In addition, the first display layer and the second display layer may also adopt different display mechanisms. The present application also provides a display module, which includes: a display driving backplane and a display layer on the display driving backplane; the display driving backplane is formed by bonding a first display backplane corresponding to the first display area and a second display backplane corresponding to the second display area; the display layer includes a first display layer in the first display area, and a second display layer in the second display area; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area, and the first display layer and the second display layer adopt different display mechanisms. Exemplarily, the first display layer may be an organic material light-emitting layer, and the second display layer may be a liquid crystal unit layer, which are used to display images; Fig. 9The display driver backplane in the middle includes a glass-based driver backplane and a silicon-based driver circuit bonded at its center. Anodes are deposited on the display driver backplane. The first display layer in the first display area is an OLED layer, and the second display layer in the second display area is a liquid crystal unit layer. A cathode is deposited on the OLED layer. Due to the use of a WOLED structure, a color filter is also required, and then a glass cover is attached to protect the layers below.

[0101] In addition, an embodiment of the present application also proposes a head-mounted display device, which is configured with the display module as above. An exemplary head-mounted display device can be virtual reality glasses, virtual reality helmets, mixed reality helmets and other devices.

[0102] It should be understood that the various parts disclosed in this application can be implemented by hardware, software, firmware or a combination thereof. In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0103] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0104] The above are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A method for manufacturing a display module, characterized in that: include: Manufacturing a first display backplane corresponding to the first display area and a second display backplane corresponding to the second display area; The first display backplane and the second display backplane are bonded to form a display module; wherein the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area.

2. The display module manufacturing method according to claim 1, characterized in that: The step of manufacturing the first display backplane corresponding to the first display area includes: Providing a silicon wafer having a first driving circuit layer, wherein the first driving circuit layer includes at least one first driving circuit area corresponding to the first display area; Performing through silicon via processing on the silicon wafer so as to lead the connection wires of the first driving circuit layer to the back side of the silicon wafer; The back side of the silicon wafer is thinned to expose the lead through holes of the silicon wafer for leading out the connecting wires, thereby obtaining a silicon-based driving backplane as the first display backplane.

3. The display module manufacturing method according to claim 2, characterized in that: The steps of manufacturing a second display backplane corresponding to the second display area include: A second drive circuit layer is manufactured on a glass substrate to obtain a second display backplane, wherein the second drive circuit layer includes at least one second drive circuit area corresponding to the second display area, the second drive circuit area is surrounded by a bonding area, and the bonding area has bonding pins for connecting to the first drive circuit area.

4. The display module manufacturing method according to claim 1, characterized in that: The step of bonding the first display backplane and the second display backplane to form a display module comprises: Cutting the first display backplane according to the size corresponding to the first display area and bonding it with the second display backplane to obtain a display driving backplane; The display layer is manufactured on the display driving backplane, and the display driving backplane with the display layer manufactured is subjected to a post-processing process to obtain a display module.

5. The display module manufacturing method according to claim 4, characterized in that: The step of manufacturing the display layer on the display driver backplane and performing a post-processing process on the display driver backplane with the display layer manufactured thereon to obtain a display module includes: According to the predetermined OLED structure, an organic material light-emitting layer and a common cathode layer are evaporated on the display driving backplane to obtain a display driving backplane with a display layer; After packaging the display driving backplane with the display layer manufactured, attaching the cover plate, cutting and bonding the module, a display module is obtained.

6. The display module manufacturing method according to claim 1, characterized in that: The step of bonding the first display backplane and the second display backplane to form a display module further includes: Manufacturing and packaging a first display layer on the first display backplane; Cutting the packaged first display backplane according to the size corresponding to the first display area, and bonding it with the second display backplane to obtain a display driving backplane; The second display layer is manufactured in the second display area of ​​the display driving backplane, and the display driving backplane with the second display layer manufactured is subjected to a post-processing process to obtain a display module.

7. The method for manufacturing a display module according to claim 6, wherein: The step of manufacturing the second display layer in the second display area on the display driving backplane comprises: Performing an alignment process on the second display region of the display driving backplane to obtain a display driving backplane having an alignment layer; After liquid crystal material is dripped onto the alignment layer, the alignment layer is sealed to form a liquid crystal unit layer as the second display layer.

8. A display module, characterized in that: The display module comprises: a display driving backplane and a display layer formed integrally on the display driving backplane; The display driving backplane is formed by bonding a first display backplane corresponding to the first display area and a second display backplane corresponding to the second display area; The display layer includes a first display layer in the first display area and a second display layer in the second display area; the pixel density of the first display area on the display module is greater than the pixel density of the second display area, and the second display area surrounds the first display area, and the first display layer and the second display layer are formed as one piece.

9. A head mounted display device, characterized in that: The head mounted display device is configured with the display module as claimed in claim 8.

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