Coarse grinding method applied to diamond substrate

Abstract

The invention relates to the technical field of diamond grinding, in particular to a rough grinding method applied to diamond substrates, which comprises the following steps: providing a plurality of diamond substrates with preset sizes and a grinding base, and fixedly adhering the diamond substrates on the grinding base; a grinding disc is provided, a groove is formed in the grinding disc, and the shape of the groove is a concentric circle groove; the diamond substrate fixed with the grinding base is in contact connection with a grooved grinding disc, and the diamond substrate is in contact with the grooved part of the grinding disc; controlling the grinding base to rotate at a preset rotating speed, and controlling the grinding disc to roughly grind the diamond substrate at a preset pressure; and in the rough grinding process, grinding liquid is supplied in a circulating mode or a non-circulating mode, so that the surface of the diamond substrate is gradually flattened, and a preset rough grinding surface type is formed. The method has the remarkable advantages in the aspects of improving the machining efficiency, guaranteeing the machining quality, reducing the cost and the like.

Description

Technical Field

[0001] The invention relates to the technical field of diamond grinding, and in particular to a rough grinding method applied to a diamond substrate. Background Art

[0002] In the diamond grinding industry, diamond substrates are increasingly used in the manufacture of high-power devices and optoelectronic devices due to their excellent thermal conductivity and mechanical strength. However, the processing of diamond substrates faces many challenges, especially in the rough grinding stage. In the prior art, most diamond substrate processing methods mainly rely on single-piece processing. Although this method performs well in terms of precision, it has many shortcomings.

[0003] First, the efficiency of monolithic processing is low. In practical applications, due to the extremely high hardness of diamond materials, its processing speed is much lower than that of other materials. Traditional monolithic processing requires a long time of grinding to achieve the required flatness and thickness, which directly leads to the extension of production cycle and increase in cost. Therefore, in the face of the growing market demand for diamond substrates, the monolithic processing method is particularly inadequate. Secondly, the overall TTV (Total Thickness Variation) performance of monolithic processing is poor. TTV refers to the total variation in material thickness, which reflects the flatness of the processed surface. In the process of monolithic processing, diamond substrates often have inconsistent thickness due to uneven force and limitations of grinding tools, and the supply of grinding fluid is not flexible enough, which leads to a further reduction in grinding efficiency. This is mainly due to the lack of an effective circulation fluid supply system, the fluidity and lubrication effect of the grinding fluid are insufficient, and the surface quality of the diamond substrate is affected. Ultimately, these problems combined together result in the overall low efficiency and unstable quality of diamond substrate processing. Summary of the invention

[0004] The main purpose of the present invention is to provide a rough grinding method for diamond substrates, aiming to overcome the technical problem that the prior art cannot achieve efficient and stable quality diamond substrate processing.

[0005] In order to achieve the above-mentioned invention problem, the present invention proposes a rough grinding method applied to a diamond substrate, the steps of the rough grinding method comprising: Providing a plurality of diamond substrates and grinding bases of preset sizes, and fixing and adhering the diamond substrates to the grinding bases; Providing a grinding disc, and performing grooves on the grinding disc, wherein the grooves are concentric circle grooves; Connecting the diamond substrate to which the grinding base is fixed to the grooved grinding disc so that the diamond substrate contacts the grooved portion of the grinding disc; Controlling the grinding base to rotate at a preset speed, and controlling the grinding disk to roughly grind the diamond substrate at a preset pressure; During the rough grinding process, the grinding liquid is supplied in a circulation mode or a non-circulation mode to gradually smooth the surface of the diamond substrate to form a preset rough grinding surface shape.

[0006] Furthermore, the step of fixing and adhering the diamond substrate to the grinding base comprises: Selecting a plurality of diamond substrates of preset sizes, placing the diamond substrates in a vacuum environment for surface treatment to remove surface impurities and oxide layers; Using a preset adhesive wax, evenly apply it on the back side of the diamond substrate, so that the adhesive wax is in close contact with the diamond substrate; The processed diamond substrate is pasted on the corresponding position of the grinding base, and the adhesive wax is solidified by heating to fix the diamond substrate on the grinding base.

[0007] Furthermore, the step of placing the diamond substrate in a vacuum environment for surface treatment comprises: Providing a vacuum processing chamber, placing the diamond substrate in the vacuum processing chamber, and starting a vacuum pump to extract air from the vacuum processing chamber to form a preset vacuum degree; Bombarding the surface of the diamond substrate with an ion beam to remove impurities and an oxide layer on the surface; The treated diamond substrate is cleaned to remove residual treated substances so that the surface of the diamond substrate is free of impurities.

[0008] Furthermore, the step of attaching the processed diamond substrate to a corresponding position of a grinding base and curing the adhesive wax by heating to fix the diamond substrate on the grinding base includes: monitoring a connection angle of the diamond substrate attached to the grinding base, and obtaining a value of the connection angle; According to the value of the connection angle, adjusting the position of the diamond substrate on the grinding base so that the diamond substrate contacts the grooved portion of the grinding disk to reach a preset value; The grinding substrate is placed in a heating device to heat the adhesive wax until the adhesive wax is completely solidified, thereby achieving the fixation of the diamond substrate on the grinding substrate.

[0009] Furthermore, the step of providing a grinding disc and performing grooving on the grinding disc comprises: A cemented carbide grinding disc is placed on a processing table, and grooves are cut on the surface of the grinding disc according to a preset concentric circle shape based on laser cutting technology to form a plurality of equally spaced grooves; The surface of the grooved grinding disc is polished to remove burrs and uneven parts generated during the cutting process, so that the surface of the grinding disc maintains a preset flatness; The polished grinding disc is cleaned and dried to remove the residual polishing agent and water, thereby obtaining the grooved grinding disc.

[0010] Further, the step of controlling the grinding substrate to rotate at a preset speed, and controlling the grinding disk to roughly grind the diamond substrate at a preset pressure, comprises: Setting an initial rotation speed of the grinding substrate and an initial pressure value of the grinding disk, driving the grinding substrate to rotate at the initial rotation speed by a motor, and driving the grinding disk to roughly grind the diamond substrate at the initial pressure value; During the rough grinding process, the flatness and consistency of the surface of the diamond substrate are detected in real time, and the rough grinding effect of the diamond substrate is judged based on the detection result; The initial rotation speed and initial pressure value are adjusted according to the rough grinding effect of the diamond substrate until a preset rough grinding effect is achieved.

[0011] Furthermore, the step of detecting the flatness and consistency of the surface of the diamond substrate in real time and judging the rough grinding effect of the diamond substrate based on the detection result includes: Acquiring a real-time photograph of the surface of the diamond substrate, performing image processing on the real-time photograph, and extracting texture features and morphology features; In the selected detection area, the extracted texture features and topographic features are quantitatively analyzed to calculate the surface roughness and uniformity; The calculated roughness and uniformity are compared with the preset roughness and uniformity thresholds to determine whether the rough grinding effect of the diamond substrate meets the standards; If the judgment result is that the roughness and uniformity of the surface of the diamond substrate do not meet the preset standard, the rotation speed of the grinding base and the pressure value of the grinding disk are adjusted, and rough grinding is performed again until the judgment result meets the preset standard.

[0012] Further, the step of supplying the grinding liquid in the circulation mode comprises: Connecting a liquid storage device to the grinding disc, wherein the liquid storage device contains grinding liquid of a preset concentration; A circulation pump is provided to pump the grinding liquid in the liquid storage device to the grooved portion of the grinding disc through the circulation pump, so that the grinding liquid is evenly covered on the contact surface between the diamond substrate and the grinding disc at a speed of 3L to 15L per minute; During the rough grinding process, the circulation pump is opened and closed regularly to supply the grinding fluid in a circulation mode so that the surface of the diamond substrate is continuously acted upon by the grinding fluid; The step of supplying the grinding fluid in the non-circulation mode comprises: Placing a liquid storage device directly around the grooved portion of the grinding disc, wherein the liquid storage device contains a grinding liquid of a preset concentration; During the rough grinding process, the liquid storage device is controlled to drip the grinding liquid to the grooved part of the grinding disc at a speed of 10ml~200ml per minute, so that the grinding liquid forms a uniform film on the contact surface between the diamond substrate and the grinding disc, so that the surface of the diamond substrate is continuously affected by the grinding liquid.

[0013] Furthermore, the preset size is 2 inches, the preset speed is 50 rpm to 200 rpm, and the preset pressure value is 115 g / cm 2 ~125g / cm 2 .

[0014] Furthermore, the disc surface step of the grinding substrate is less than 0.1 mm, and the disc surface TTV is less than 10 um.

[0015] Beneficial effects: The rough grinding method for diamond substrates proposed in this application firstly greatly improves the processing efficiency by fixing multiple diamond substrates on the same grinding base for processing. Compared with the traditional single-chip processing, this batch processing method can significantly shorten the production cycle, reduce production costs, and meet the market's growing demand for diamond substrates. At the same time, by fixing the diamond substrates on the grinding base, the relative position between the diamond substrates is guaranteed to be stable during the processing process, and the problem of inconsistent thickness caused by uneven force is reduced, thereby improving the overall TTV performance, making the surface of the processed diamond substrate smoother and the quality more stable. Further, by designing a grinding disc with concentric grooves, the rough grinding effect is improved. The design of concentric grooves enables the grinding disc to form a more uniform grinding force during rotation, avoiding the problem of uneven grinding caused by excessive or too small local pressure. At the same time, the slotted design also helps the circulation supply of the grinding liquid, improves the fluidity and lubrication effect of the grinding liquid, so that the diamond substrate can be fully lubricated and cooled during the rough grinding process, reduces the risk of thermal damage and mechanical damage, and further improves the processing quality.

[0016] In summary, the rough grinding method for diamond substrates proposed in this application shows significant advantages in improving processing efficiency, ensuring processing quality, reducing costs, etc., and has broad application prospects and important practical significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall steps of a rough grinding method applied to a diamond substrate in one embodiment of the present invention; Figure 2 1 is a schematic diagram of the steps of a rough grinding method applied to a diamond substrate in one embodiment of the present invention; Figure 3 is a schematic diagram of steps of a rough grinding method applied to a diamond substrate in another embodiment of the present invention; The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] It will be understood by those skilled in the art that, unless expressly stated, the singular forms "one", "above", and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present invention refers to the presence of features, integers, steps, operations, elements, modules, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, modules, components, and / or groups thereof. It should be understood that when an element is said to be "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be an intermediate element. In addition, the "connection" or "coupling" used herein may include wireless connection or wireless coupling. The term "and / or" used herein includes all or any module and all combinations of one or more associated listed items.

[0020] Those skilled in the art will understand that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those skilled in the art in the field to which the present invention belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as here.

[0021] Reference Figure 1 The embodiment of the present invention provides a rough grinding method for a diamond substrate, comprising the following steps: S1: providing a plurality of diamond substrates and a grinding base of preset sizes, and fixing and adhering the diamond substrates to the grinding base; In step S1, preferably, three 2-inch diamond substrates are glued to an alumina ceramic disk by a wax sticking process for grinding. The grinding substrate is not limited to the ceramic disk, and can also be fixed with a stainless steel disk or a zirconia ceramic, etc. The disk surface jump of the grinding substrate is less than 0.1 mm, and the disk surface TTV is less than 10 um. The disk surface jump refers to the unevenness of the surface of the grinding substrate in the vertical direction, which is very important for ensuring the uniformity and accuracy of the diamond substrate during the rough grinding process. When the disk surface jump is less than 0.1 mm, the vibration and deviation during the grinding process can be significantly reduced, thereby improving the processing accuracy and surface quality. TTV (Total Thickness Variation) refers to the total variation of the thickness of the material or substrate, which is used to evaluate the flatness and consistency of the surface. It is calculated by measuring the thickness difference at different positions of the sample. The smaller the TTV, the flatter the surface is, which is suitable for precision machining. Therefore, in this embodiment, three high-quality 2-inch diamond substrates are selected, and the wax sticking process is used to enable the diamond substrate to be firmly and flatly attached to the alumina ceramic disk.

[0022] S2: providing a grinding disc, and performing grooves on the grinding disc, wherein the grooves are concentric circle grooves; In step S2, the grinding disc preferably uses a cast iron disc, more specifically a ductile iron disc, and the slotting method can be a square 10*10cm to 30*30cm, or a diamond slotting method, or a concentric slotting method. In this embodiment, the best choice is a concentric slotting method of 15*30cm, because the concentric slotting method can distribute the grinding liquid more evenly, so that the grinding force of the diamond substrate during the rough grinding process is more balanced. This design not only helps to improve the grinding efficiency, but also effectively reduces the scratches and unevenness on the surface of the diamond substrate. The slotting design on the grinding disc is to increase the contact area between the grinding liquid and the diamond substrate, improve the grinding efficiency, and promote the discharge of grinding waste. Specifically, a positioning hole is drilled at the center of the grinding disc for subsequent precise docking with the main shaft of the grinder. At the same time, the flatness and roughness of the grinding disc are checked to meet the precision requirements of the rough grinding of the diamond substrate. The depth of the slotting is accurately calculated and adjusted according to the thickness, hardness and expected grinding effect of the diamond substrate.

[0023] S3: contacting and connecting the diamond substrate fixed with the grinding base with the grooved grinding disc, and making the diamond substrate contact with the grooved part of the grinding disc; In step S3, the above steps have already firmly fixed the diamond substrate on the grinding base, and selected a suitable grinding disc and its slot design, and then adjusted the relative position between the diamond substrate and the grinding disc to the optimal state to ensure that the diamond substrate can be evenly stressed. In this process, special attention should be paid to the precise alignment of the diamond substrate and the slotted portion of the grinding disc to ensure the stability and efficiency of the grinding process.

[0024] In another embodiment, the relative position between the diamond substrate and the grinding disk can be adjusted to the optimal state based on machine vision technology, and the real-time image between the diamond substrate and the grinding disk can be captured by a high-definition camera, and the image processing technology can be combined for accurate analysis. Specifically, the edges of the diamond substrate and the grinding disk are identified, the relative position between the two is obtained, and the image processing algorithm is used to calculate the optimal contact points of the diamond substrate on the grinding disk. These contact points should be distributed at uniform positions of the concentric grooves to ensure uniform distribution of the grinding force. Through the precise control of the preset algorithm, the relative position between the diamond substrate and the grinding disk can be adjusted in real time to ensure the stability and efficiency of the grinding process. More specifically, the multiple contact points of the diamond substrate on the grinding disk are obtained as 1, 2, 3, ..., n, where n is the number of contact points, and then each contact point is position-encoded to form an accurate position information set, and the coordinates (X, Y) of the contact point relative to the center point of the diamond substrate and the grinding disk are obtained, and then the relative angles and distances between each contact point are calculated using vector analysis and trigonometric functions. In another embodiment, by continuously monitoring the state of the diamond substrate surface, such as temperature, stress distribution, etc., as well as the amount and properties of the grinding products during the grinding process, the relative position between the diamond substrate and the grinding disk is fine-tuned based on these data to achieve optimal grinding parameters and effects.

[0025] S4: controlling the grinding base to rotate at a preset speed, and controlling the grinding disk to roughly grind the diamond substrate at a preset pressure; S5: During the rough grinding process, the grinding liquid is supplied in a circulation mode or a non-circulation mode to gradually smooth the surface of the diamond substrate to form a preset rough grinding surface shape.

[0026] In steps S4-S5, the rough grinding process can be precisely controlled by controlling the rotation speed of the grinding substrate and the pressure applied by the grinding disk to the diamond substrate. The selection of the rotation speed needs to take into account the physical properties of the diamond substrate, such as hardness, toughness, and the desired rough grinding efficiency. A faster rotation speed can shorten the processing time, but it may also increase the risk of surface scratches. Therefore, in actual operation, experiments can be conducted based on historical data to find the balance between the rotation speed and the processing quality. At the same time, by precisely controlling the pressure, it can be ensured that the diamond substrate is subjected to a uniform and moderate grinding force during the rough grinding process, thereby obtaining an ideal rough grinding surface. Specifically, a feedback control system can be added to monitor the roughness and shape changes of the diamond substrate surface in real time, and dynamically adjust the rotation speed of the grinding substrate and the pressure of the grinding disk according to the monitoring results. This feedback control system can integrate machine vision technology, capture real-time images of the diamond substrate surface through a high-definition camera, and use image processing algorithms to analyze the surface roughness and shape, thereby accurately adjusting the grinding parameters. For example, when it is detected that the surface roughness exceeds the preset threshold, the control system can automatically increase the pressure of the grinding disc or reduce the rotation speed of the grinding substrate to enhance the grinding effect; on the contrary, when the surface roughness reaches or is lower than the target value, the control system can reduce the pressure or increase the rotation speed to avoid damage caused by excessive grinding. In addition, in order to further improve the stability and efficiency of the rough grinding process, a method of circulating the grinding fluid can be used during the grinding process. The grinding fluid plays a role of cooling, lubricating and cleaning during the grinding process, which can significantly reduce the friction coefficient between the diamond substrate and the grinding disc, reduce heat accumulation, and promote the discharge of grinding waste. By circulating the grinding fluid, it can be ensured that the surface of the diamond substrate is always fully covered with the grinding fluid, thereby maintaining a stable grinding environment and improving the uniformity and consistency of the rough grinding surface. At the same time, in order to optimize the supply amount and flow rate of the grinding fluid, the optimal grinding fluid formula and supply parameters can be determined through experiments based on the material, size and rough grinding requirements of the diamond substrate.

[0027] It is worth noting that in the above-mentioned embodiment, diamond, as a high-hardness material, will generate a large amount of heat during the rough grinding process. If the heat cannot be dissipated in time, it will not only cause thermal deformation of the diamond substrate, but also may affect the cooling effect of the grinding fluid, and even accelerate the wear of the grinding disc. Therefore, in steps S4~S5, an effective cooling system is introduced, and a cooling water circulation device is used to circulate cooling water through the cooling channel on the back of the grinding disc to take away the heat generated during the grinding process. At the same time, the temperature, flow rate and circulation mode of the cooling water also need to be accurately regulated according to the actual situation during the grinding process to ensure that the diamond substrate and the grinding disc are always kept within a suitable operating temperature range. Specifically, the peripheral side of the slotted part of the grinding disc is provided with a cooling water inlet and outlet, and the cooling water enters the cooling channel inside the grinding disc through the inlet, flows along the channel and absorbs the heat generated during the grinding process, and finally flows out from the outlet to form a complete cooling cycle.

[0028] In summary, the specific working principle of this embodiment is: fixing multiple diamond substrates on the same grinding base for processing greatly improves the processing efficiency. Compared with traditional single-chip processing, this batch processing method can significantly shorten the production cycle, reduce production costs, and meet the market's growing demand for diamond substrates. At the same time, by fixing the diamond substrate on the grinding base, the relative position between the diamond substrates is guaranteed to be stable during the processing process, and the problem of inconsistent thickness caused by uneven force is reduced, thereby improving the overall TTV performance, making the surface of the processed diamond substrate smoother and the quality more stable. Further, by designing a grinding disc with concentric grooves, the rough grinding effect is improved. The design of concentric grooves enables the grinding disc to form a more uniform grinding force during rotation, avoiding the problem of uneven grinding caused by excessive or too small local pressure. At the same time, the slotted design also helps the circulation supply of the grinding liquid, improves the fluidity and lubrication effect of the grinding liquid, so that the diamond substrate can be fully lubricated and cooled during the rough grinding process, reduces the risk of thermal damage and mechanical damage, and further improves the processing quality.

[0029] In one embodiment, the step of fixing and adhering the diamond substrate to the grinding base comprises: Selecting a plurality of diamond substrates of preset sizes, placing the diamond substrates in a vacuum environment for surface treatment to remove surface impurities and oxide layers; Using a preset adhesive wax, evenly apply it on the back side of the diamond substrate, so that the adhesive wax is in close contact with the diamond substrate; The processed diamond substrate is pasted on the corresponding position of the grinding base, and the adhesive wax is solidified by heating to fix the diamond substrate on the grinding base.

[0030] In the above embodiment, the surface treatment of the diamond substrate under a vacuum environment is to create a dust-free and impurity-free environment to ensure the purity of the surface of the diamond substrate. During the surface treatment process, physical or chemical methods can be used to remove oxides, grease and other contaminants on the surface of the diamond substrate to obtain a clean and flat base surface. When selecting an adhesive wax, it is preferred to select an adhesive wax with high adhesion and good temperature resistance to ensure that the diamond substrate will not fall off or shift during the grinding process. At the same time, the adhesive wax should also have good fluidity so that it can evenly cover the back of the diamond substrate when applied to ensure a close combination with the grinding base. When the treated diamond substrate is pasted on the grinding base, each diamond substrate is placed in a predetermined position and maintains a certain spacing and relative position relationship, which can be achieved by pre-marking the position on the grinding base or using a positioning fixture. During the pasting process, it is necessary to evenly apply the adhesive wax on the back of the diamond substrate and keep it in close contact with the grinding base to avoid bubbles or gaps. Then, the adhesive wax is solidified by heating to achieve a firm combination of the diamond substrate and the grinding base.

[0031] In one embodiment, the step of placing the diamond substrate in a vacuum environment for surface treatment comprises: Providing a vacuum processing chamber, placing the diamond substrate in the vacuum processing chamber, and starting a vacuum pump to extract air from the vacuum processing chamber to form a preset vacuum degree; Bombarding the surface of the diamond substrate with an ion beam to remove impurities and an oxide layer on the surface; The treated diamond substrate is cleaned to remove residual treated substances so that the surface of the diamond substrate is free of impurities.

[0032] In the above embodiment, by providing a highly clean vacuum environment, the purity of the diamond substrate during the surface treatment process is improved. The design of the vacuum treatment chamber can not only effectively isolate the interference of external dust and impurities, but also extract the indoor air to a preset vacuum degree through the action of the vacuum pump, further improving the purity level of the treatment environment. In such an environment, the surface of the diamond substrate is finely bombarded by an advanced physical treatment technology, the ion beam, with its high energy and high directivity, can accurately remove impurities and oxide layers on the surface of the diamond substrate, while maintaining the flatness and finish of the base surface. After the ion beam treatment is completed, the diamond substrate is thoroughly cleaned to remove residual substances that may be generated during the ion beam treatment, such as tiny fragments generated by ion beam bombardment or by-products generated by chemical reactions. By using appropriate cleaning agents and cleaning processes, it can be ensured that the surface of the diamond substrate is free of impurities. In another embodiment, a layer of micro-nano rough structure can be formed on the surface of the diamond substrate by plasma treatment or chemical etching. This rough structure can increase the contact area and mechanical bite force between the adhesive and the diamond substrate, thereby improving the bonding strength. At the same time, this treatment can also improve the wettability and fluidity of the adhesive on the surface of the diamond substrate, so that the adhesive can be more evenly covered on the back of the diamond substrate, further ensuring the firmness and stability of the adhesion.

[0033] In one embodiment, the step of attaching the processed diamond substrate to a corresponding position of a grinding base and curing the adhesive wax by heating to fix the diamond substrate on the grinding base comprises: S21: monitoring a connection angle of the diamond substrate attached to the grinding base, and obtaining a value of the connection angle; S22: adjusting the position of the diamond substrate on the grinding base according to the value of the connection angle so that the diamond substrate contacts the grooved portion of the grinding disk to reach a preset value; S23: placing the grinding substrate in a heating device, and heating the adhesive wax until the adhesive wax is completely solidified, thereby fixing the diamond substrate on the grinding substrate.

[0034] In the above embodiment, the connection angle between the diamond substrate and the grinding base is monitored in real time by a high-precision angle measuring device, so that the relative position relationship between the two can be accurately grasped during the pasting process. After obtaining the value of the connection angle, the position of the diamond substrate on the grinding base is fine-tuned according to the preset process parameters and processing requirements to ensure that the diamond substrate can be in close contact with the slotted portion of the grinding disc in a predetermined direction and angle. Such adjustment helps to achieve uniform force during the grinding process and improve processing efficiency and processing quality. The grinding base with adjusted position is placed in a special heating device to heat the adhesive wax. The heating temperature and time need to be strictly controlled to ensure that the adhesive wax can be fully softened and flow evenly, while avoiding excessively high temperatures from causing thermal damage to the diamond substrate and the grinding base. During the heating process, the adhesive wax gradually melts and penetrates into the tiny gap between the diamond substrate and the grinding base to form a strong bonding layer. When the adhesive wax is completely solidified, the diamond substrate is firmly fixed on the grinding base, providing stable support for subsequent processing.

[0035] In one embodiment, the step of providing a grinding disc and performing grooving on the grinding disc comprises: A cemented carbide grinding disc is placed on a processing table, and grooves are cut on the surface of the grinding disc according to a preset concentric circle shape based on laser cutting technology to form a plurality of equally spaced grooves; The surface of the grooved grinding disc is polished to remove burrs and uneven parts generated during the cutting process, so that the surface of the grinding disc maintains a preset flatness; The polished grinding disc is cleaned and dried to remove the residual polishing agent and water, thereby obtaining the grooved grinding disc.

[0036] In the above embodiment, a piece of cemented carbide material with excellent wear resistance and stability is first selected as the substrate of the grinding disc to ensure that the grinding disc can maintain a stable shape and precision during long-term high-speed rotation and grinding. Subsequently, advanced laser cutting technology is used to accurately groove the surface of the grinding disc according to the preset concentric circle shape. Laser cutting, with its high precision and high efficiency, can ensure that the shape, size and position of the groove meet the design requirements, while reducing the thermal impact and mechanical damage to the grinding disc substrate. After the laser cutting is completed, the surface of the grooved grinding disc is polished. The main purpose of polishing is to remove burrs, uneven parts and micro cracks that may be generated during the cutting process, and further improve the surface finish and flatness of the grinding disc. The polished grinding disc is thoroughly cleaned and dried. The main purpose of cleaning is to remove the polishing agent, moisture and other impurities remaining in the polishing process to prevent them from adversely affecting the subsequent grinding process. The drying process is to ensure that the grinding disc can remain dry and clean during the subsequent processing and use, and avoid corrosion or performance degradation caused by moisture or moisture.

[0037] In one embodiment, the step of controlling the grinding substrate to rotate at a preset speed, and controlling the grinding disk to roughly grind the diamond substrate at a preset pressure, comprises: Setting an initial rotation speed of the grinding substrate and an initial pressure value of the grinding disk, driving the grinding substrate to rotate at the initial rotation speed by a motor, and driving the grinding disk to roughly grind the diamond substrate at the initial pressure value; During the rough grinding process, the flatness and consistency of the surface of the diamond substrate are detected in real time, and the rough grinding effect of the diamond substrate is judged based on the detection result; The initial rotation speed and initial pressure value are adjusted according to the rough grinding effect of the diamond substrate until a preset rough grinding effect is achieved.

[0038] In the above embodiment, according to the preset process requirements, the initial parameters of the grinding substrate and the grinding disc are set, which is the basis for ensuring the smooth progress of the rough grinding process. Through the precise control of the motor, the grinding substrate rotates smoothly at the set initial speed, and the grinding disc applies an appropriate initial pressure value to perform preliminary grinding on the diamond substrate, aiming to make the diamond substrate evenly stressed and avoid processing quality problems caused by uneven stress. In the process of rough grinding, the real-time monitoring and feedback mechanism plays a vital role. The flatness and consistency of the surface of the diamond substrate are monitored in real time using high-precision detection instruments. These data can intuitively reflect the effect of rough grinding. By comparing and analyzing these data with the preset standard values, the progress and quality of the rough grinding of the diamond substrate can be accurately judged, providing a basis for subsequent adjustments. Based on the real-time detection results, the rotation speed of the grinding substrate and the pressure value of the grinding disc are dynamically adjusted. If the detection results show that the flatness and consistency of the surface of the diamond substrate have not yet met the expected requirements, the pressure value of the grinding disc can be appropriately increased or the rotation speed of the grinding substrate can be increased to enhance the grinding effect. On the contrary, if the test results show that the surface of the diamond substrate is too smooth or there are signs of over-grinding, then it is necessary to reduce the pressure of the grinding disc or reduce the speed of the grinding base in time to avoid unnecessary damage to the diamond substrate. Through such a dynamic adjustment process, it can be ensured that the diamond substrate can gradually approach the preset processing quality target during the rough grinding stage. When the monitoring data shows that the flatness and consistency of the diamond substrate surface have reached the preset rough grinding effect, the rough grinding process can be stopped and the subsequent processing stage can be entered.

[0039] In one embodiment, the step of detecting the flatness and consistency of the surface of the diamond substrate in real time and judging the rough grinding effect of the diamond substrate based on the detection result includes: Acquiring a real-time photograph of the surface of the diamond substrate, performing image processing on the real-time photograph, and extracting texture features and morphology features; In the selected detection area, the extracted texture features and topographic features are quantitatively analyzed to calculate the surface roughness and uniformity; The calculated roughness and uniformity are compared with the preset roughness and uniformity thresholds to determine whether the rough grinding effect of the diamond substrate meets the standards; If the judgment result is that the roughness and uniformity of the surface of the diamond substrate do not meet the preset standard, the rotation speed of the grinding base and the pressure value of the grinding disk are adjusted, and rough grinding is performed again until the judgment result meets the preset standard.

[0040] In this embodiment, real-time photos of the surface of the diamond substrate are captured by a high-precision camera device. These photos can clearly reflect the microstructure and morphological features of the surface. Based on image processing technology, these photos are carefully analyzed and processed, and the texture features and morphological features of the surface are extracted by algorithms. These features include the degree of surface concavity, the direction and distribution of the texture, and the microscopic defects of the surface. In the selected detection area, the extracted texture features and morphological features are deeply quantitatively analyzed. By calculating the roughness of the surface, the unevenness of the surface of the diamond substrate can be quantitatively evaluated; and the calculation of the uniformity can reflect the differences between the various regions of the surface. These quantitative data provide a solid foundation for subsequent evaluation. The calculated roughness and uniformity are compared with the preset roughness and uniformity thresholds. These preset thresholds are set based on process requirements and product quality standards, and represent the qualified standards for the surface quality of the diamond substrate. By comparison, it can be intuitively judged whether the rough grinding effect of the diamond substrate has reached the preset standard. If the judgment result shows that the roughness and uniformity of the diamond substrate surface do not meet the preset standards, then it is necessary to adjust the rotation speed of the grinding substrate and the pressure value of the grinding disk accordingly according to the actual situation. The rough grinding effect of the diamond substrate can be further improved by increasing or decreasing the rotation speed, adjusting the pressure value, etc. Then, perform rough grinding again, and repeat the above-mentioned detection and evaluation process until the roughness and uniformity of the diamond substrate surface meet the preset standards. Such real-time detection and dynamic adjustment process not only improves the accuracy and efficiency of diamond substrate processing, but also makes the stability and reliability of the processing process. Through precise monitoring and timely adjustment, errors and defects in the processing process can be minimized, and the quality and consistency of the product can be improved. At the same time, this automated processing method also reduces the dependence on manual operation and labor intensity, and improves production efficiency and safety.

[0041] In one embodiment, the step of supplying the polishing liquid in the circulation mode comprises: S31: connecting a liquid storage device to the grinding disc, wherein the liquid storage device contains grinding liquid of a preset concentration; S32: setting a circulation pump, and pumping the grinding liquid in the liquid storage device to the grooved portion of the grinding disk through the circulation pump, so that the grinding liquid is evenly covered on the contact surface between the diamond substrate and the grinding disk at a speed of 3L to 15L per minute; S33: during the rough grinding process, the circulation pump is periodically turned on and off so that the grinding liquid is supplied in a circulation mode so that the surface of the diamond substrate is continuously acted upon by the grinding liquid; The step of supplying the grinding fluid in the non-circulation mode comprises: S41: placing a liquid storage device directly around the grooved portion of the grinding disc, wherein the liquid storage device contains a grinding liquid of a preset concentration; S42: During the rough grinding process, the liquid storage device is controlled to drip the grinding liquid to the grooved part of the grinding disk at a speed of 10-200 ml per minute, so that the grinding liquid forms a uniform thin film on the contact surface between the diamond substrate and the grinding disk, so that the surface of the diamond substrate is continuously acted upon by the grinding liquid.

[0042] In the above embodiment, there are two grinding liquid supply modes: circulation mode and non-circulation mode. In the circulation mode, the grinding liquid is continuously delivered to the grooved part of the grinding disc through the circulation pump, so that the contact surface between the diamond substrate and the grinding disc is always kept wet and the grinding liquid is evenly distributed. This efficient supply method not only improves the grinding efficiency, but also controls the temperature during the grinding process and prevents damage to the diamond substrate caused by overheating. The supply speed of 3 to 15L per minute is carefully set according to experimental data, aiming to find the best balance between the grinding effect and the supply speed. In addition, the design of regularly opening and closing the circulation pump allows the grinding liquid to form a certain interval during the supply process, which helps the grinding liquid to better penetrate into the tiny gaps of the diamond substrate, further improving the uniformity and consistency of rough grinding. In contrast, the non-circulation mode focuses more on the precise control of the grinding fluid. In this mode, the liquid storage device is directly placed on the side of the slotted part of the grinding disc. By finely adjusting the dripping speed (10~200ml per minute), the grinding fluid is dripped onto the contact surface in a slow and steady manner to form a uniform film, which can continuously act on the surface of the diamond substrate while avoiding the waste and excessive use of the grinding fluid. The non-circulation mode is suitable for scenes with extremely high requirements for grinding accuracy. It can minimize the pollution of the grinding fluid to the environment and the increase in costs while ensuring the grinding effect. Whether it is a circulation mode or a non-circulation mode, the common goal is to ensure that the diamond substrate can be fully and evenly ground during the rough grinding process. By real-time monitoring and adjustment of grinding parameters (such as speed, pressure value, etc.) and selecting a suitable grinding fluid supply mode, the processing quality of the diamond substrate can be precisely controlled. This dynamic adjustment process not only improves processing efficiency and product quality, but also reduces production costs and energy consumption.

[0043] In one embodiment, the preset size is 1.5 inches to 2.5 inches, preferably 2 inches, the preset speed is 50 to 200 rpm, and the preset pressure is 115 g / cm 2~ 125g / cm 2 .

[0044] In this embodiment, the specific parameter settings in the processing process are refined. The preset size is 2 inches of diamond substrate, which is suitable for a variety of application scenarios. At the same time, the preset speed range is set to 50-200rpm. This range is based on a large amount of experimental data and aims to find the optimal speed range that can ensure both processing efficiency and maintain processing quality. In addition, the preset pressure value is set to 115g / cm 2~ 125g / cm 2 , preferably 120g / cm 2 , 120g / cm 2 The pressure value can provide enough pressure to ensure good contact between the diamond substrate and the grinding disc during the grinding process, with a certain removal rate, but not too large to cause damage to the substrate, ensuring the safety of the wafer. In actual operation, by fine-tuning the pressure value, the grinding effect can be further optimized to ensure that the flatness and roughness of the diamond substrate surface meet the expected standards. Specifically, in actual operation, these preset parameters can be used as the initial conditions for processing, but they are not immutable. As the processing process proceeds, it may be necessary to dynamically adjust the parameters based on real-time detection results and evaluation results. For example, if it is found that the roughness of the diamond substrate surface is too high or the uniformity is insufficient, you can try to reduce the rotation speed of the grinding base or reduce the pressure value of the grinding disc to slow down the rough grinding speed and make the surface smoother and more uniform. On the contrary, if the roughness is too low, you can appropriately increase the rotation speed or increase the pressure value to speed up the rough grinding speed and achieve the expected processing effect. At the same time, monitor the use of the grinding fluid. Whether it is in circulation mode or non-circulation mode, it is necessary to ensure that the grinding fluid can evenly cover the contact surface between the diamond substrate and the grinding disc and continuously act on the surface. In circulation mode, the working status of the circulation pump should be checked regularly to ensure a stable supply of grinding liquid. In non-circulation mode, the dripping speed needs to be carefully controlled to avoid problems caused by too much or too little grinding liquid.

[0045] In one embodiment, the disk surface step of the grinding substrate is less than 0.1 mm, and the disk surface TTV is less than 10 um.

[0046] In the above embodiment, the runout of the grinding substrate should be less than 0.1 mm, which ensures the stability of the grinding disc during rotation and reduces the vibration and error caused by the uneven disc surface. Vibration is a major problem in diamond processing. It not only damages the surface quality of the diamond substrate, but also reduces the processing efficiency. Therefore, strictly controlling the runout of the disc surface is one of the important measures to ensure processing accuracy. In addition, the disc surface TTV (Total Thickness Variation) should also be less than 10um, which means that the thickness variation of the grinding disc in the radial direction is very small and almost negligible. This high degree of uniformity is crucial to maintaining consistency and stability during the processing of the diamond substrate. In actual operation, in order to meet these precision requirements, it is necessary to select high-quality grinding equipment and grinding materials, and operate in strict accordance with process specifications.

[0047] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A rough grinding method for a diamond substrate, characterized in that: The steps of the rough grinding method include: Providing a plurality of diamond substrates and grinding bases of preset sizes, and fixing and adhering the diamond substrates to the grinding bases; Providing a grinding disc, and performing grooves on the grinding disc, wherein the grooves are concentric circle grooves; Connecting the diamond substrate to which the grinding base is fixed to the grooved grinding disc so that the diamond substrate contacts the grooved portion of the grinding disc; Controlling the grinding base to rotate at a preset speed, and controlling the grinding disk to roughly grind the diamond substrate at a preset pressure; During the rough grinding process, the grinding liquid is supplied in a circulation mode or a non-circulation mode to gradually smooth the surface of the diamond substrate to form a preset rough grinding surface shape.

2. The rough grinding method for a diamond substrate according to claim 1, characterized in that: The step of fixing and adhering the diamond substrate to the grinding base comprises: Selecting a plurality of diamond substrates of preset sizes, placing the diamond substrates in a vacuum environment for surface treatment to remove surface impurities and oxide layers; Using a preset adhesive wax, evenly apply it on the back side of the diamond substrate, so that the adhesive wax is in close contact with the diamond substrate; The processed diamond substrate is pasted on the corresponding position of the grinding base, and the adhesive wax is solidified by heating to fix the diamond substrate on the grinding base.

3. The rough grinding method for a diamond substrate according to claim 2, characterized in that: The step of placing the diamond substrate in a vacuum environment for surface treatment comprises: Providing a vacuum processing chamber, placing the diamond substrate in the vacuum processing chamber, and starting a vacuum pump to extract air from the vacuum processing chamber to form a preset vacuum degree; Bombarding the surface of the diamond substrate with an ion beam to remove impurities and an oxide layer on the surface; The treated diamond substrate is cleaned to remove residual treated substances so that the surface of the diamond substrate is free of impurities.

4. The rough grinding method for a diamond substrate according to claim 2, characterized in that: The step of pasting the processed diamond substrate on the corresponding position of the grinding base and solidifying the adhesive wax by heating to fix the diamond substrate on the grinding base comprises: monitoring a connection angle of the diamond substrate attached to the grinding base, and obtaining a value of the connection angle; According to the value of the connection angle, adjusting the position of the diamond substrate on the grinding base so that the diamond substrate contacts the grooved portion of the grinding disk to reach a preset value; The grinding substrate is placed in a heating device to heat the adhesive wax until the adhesive wax is completely solidified, thereby achieving the fixation of the diamond substrate on the grinding substrate.

5. The rough grinding method for a diamond substrate according to claim 1, characterized in that: The step of providing a grinding disc and performing grooving on the grinding disc comprises: A cemented carbide grinding disc is placed on a processing table, and grooves are cut on the surface of the grinding disc according to a preset concentric circle shape based on laser cutting technology to form a plurality of equally spaced grooves; The surface of the grooved grinding disc is polished to remove burrs and uneven parts generated during the cutting process, so that the surface of the grinding disc maintains a preset flatness; The polished grinding disc is cleaned and dried to remove residual polishing agent and water, thereby obtaining the grooved grinding disc.

6. The rough grinding method for a diamond substrate according to claim 1, characterized in that: The step of controlling the grinding substrate to rotate at a preset speed, and controlling the grinding disk to roughly grind the diamond substrate at a preset pressure, comprises: Setting an initial rotation speed of the grinding substrate and an initial pressure value of the grinding disk, driving the grinding substrate to rotate at the initial rotation speed by a motor, and driving the grinding disk to roughly grind the diamond substrate at the initial pressure value; During the rough grinding process, the flatness and consistency of the surface of the diamond substrate are detected in real time, and the rough grinding effect of the diamond substrate is judged based on the detection result; The initial rotation speed and initial pressure value are adjusted according to the rough grinding effect of the diamond substrate until a preset rough grinding effect is achieved.

7. The rough grinding method for a diamond substrate according to claim 6, characterized in that: The step of detecting the flatness and consistency of the surface of the diamond substrate in real time and judging the rough grinding effect of the diamond substrate based on the detection result includes: Acquire a real-time photograph of the surface of the diamond substrate, perform image processing on the real-time photograph, and extract texture features and morphology features; In the selected detection area, the extracted texture features and topographic features are quantitatively analyzed to calculate the surface roughness and uniformity; The calculated roughness and uniformity are compared with the preset roughness and uniformity thresholds to determine whether the rough grinding effect of the diamond substrate meets the standards; If the judgment result is that the roughness and uniformity of the surface of the diamond substrate do not meet the preset standard, the rotation speed of the grinding base and the pressure value of the grinding disk are adjusted, and rough grinding is performed again until the judgment result meets the preset standard.

8. The rough grinding method for a diamond substrate according to claim 1, characterized in that: The step of supplying the grinding liquid in the circulation mode comprises: Connecting a liquid storage device to the grinding disc, wherein the liquid storage device contains grinding liquid of a preset concentration; A circulation pump is provided to pump the grinding liquid in the liquid storage device to the grooved portion of the grinding disc through the circulation pump, so that the grinding liquid is evenly covered on the contact surface between the diamond substrate and the grinding disc at a speed of 3L to 15L per minute; During the rough grinding process, the circulation pump is opened and closed regularly to supply the grinding fluid in a circulation mode so that the surface of the diamond substrate is continuously acted upon by the grinding fluid; The step of supplying the grinding fluid in the non-circulation mode comprises: Placing a liquid storage device directly around the grooved portion of the grinding disc, wherein the liquid storage device contains a grinding liquid of a preset concentration; During the rough grinding process, the liquid storage device is controlled to drip the grinding liquid to the grooved part of the grinding disc at a speed of 10ml~200ml per minute, so that the grinding liquid forms a uniform film on the contact surface between the diamond substrate and the grinding disc, so that the surface of the diamond substrate is continuously affected by the grinding liquid.

9. The rough grinding method for a diamond substrate according to claim 1, characterized in that: The preset size is 2 inches, the preset speed is 50 rpm to 200 rpm, and the preset pressure value is 115 g / cm 2 ~125g / cm 2 .

10. The rough grinding method for a diamond substrate according to claim 1, characterized in that: The disc surface step of the grinding substrate is less than 0.1 mm, and the disc surface TTV is less than 10 um.

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