Combined heat dissipation device for server

Abstract

The invention discloses a combined heat dissipation device for a server, which relates to the field of server heat dissipation and comprises a server cabinet. A plurality of combined heat dissipation mechanisms are installed in the server cabinet along its own height direction. The combined heat dissipation mechanism comprises a heat dissipation baffle and a plurality of support members. The support members are in an inverted T-shape. The support members are used for welding on the bottom of a computer module. The support members are installed on the top of the heat dissipation baffle and are used for suspending the computer module in the server cabinet. The heat dissipation baffle comprises an upper plate, a lower plate and a hollow ventilation pipe. The lower plate is connected to the bottom of the upper plate. A heat dissipation cavity is provided at the bottom of the upper plate. The heat dissipation cavity is filled with a metal phase change material. A plurality of hollow ventilation pipes are arranged between the upper plate and the lower plate. The inner hole of the hollow ventilation pipe runs through the upper plate and the lower plate. The dual heat dissipation mode of air cooling and metal phase change material is adopted for heat dissipation. The heat dissipation effect is good and high heat dissipation requirements can be met.

Description

Technical Field

[0001] The invention relates to the technical field of server heat dissipation, and in particular to a combined heat dissipation device for a server. Background Art

[0002] There are multiple computer modules installed in the server cabinet along the longitudinal or transverse direction, and the shell of the computer module is installed on the carrier board of the cabinet. Since a large number of computer modules are integrated in the server cabinet, the server has high requirements for heat dissipation. At present, the heat dissipation method of the server cabinet is relatively simple, and it is basically dissipated by cooling fans. Different numbers of cooling fans are arranged according to the heat dissipation requirements. In an environment with high heat dissipation requirements, the cooling fan occupies a large space, and the cooling fan cannot adapt to the ambient temperature exceeding 35°C, and cannot achieve the purpose of heat dissipation in a timely and fast manner. Excessive temperature will affect the service life of components and increase the cost of replacing server accessories. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a combined heat dissipation device for a server to solve the deficiencies of the prior art.

[0004] The objective of the present invention is achieved through the following technical solutions: A combined heat dissipation device for a server, comprising a server cabinet, wherein a plurality of combined heat dissipation mechanisms are installed in the server cabinet along its own height direction, wherein the combined heat dissipation mechanism comprises a heat dissipation baffle and a plurality of support members, wherein the support member is in an inverted T-shape, wherein the support member is used to be welded to the bottom of a computer module, wherein the support member is installed on the top of the heat dissipation baffle, and is used to suspend the computer module in the server cabinet, wherein the heat dissipation baffle comprises an upper plate, a lower plate and a hollow ventilation pipe, wherein the lower plate is connected to the bottom of the upper plate, wherein a heat dissipation cavity is provided at the bottom of the upper plate, wherein the heat dissipation cavity is filled with a metal phase change material, wherein a plurality of the hollow ventilation pipes are arranged between the upper plate and the lower plate, and wherein the inner hole of the hollow ventilation pipe passes through the upper plate and the lower plate.

[0005] Furthermore, an upper ventilation hole is formed through the upper plate at a position corresponding to the hollow ventilation pipe, and a lower ventilation hole is formed through the lower plate at a position corresponding to the hollow ventilation pipe. Both ends of the hollow ventilation pipe are respectively welded in the upper ventilation hole and the lower ventilation hole. An elastic pad is fixed to the end surface of the lower plate close to the upper plate, and an avoidance hole is formed on the elastic pad at a position corresponding to the lower ventilation hole.

[0006] Furthermore, a pressure hole is opened at the bottom of the lower plate, a pressure sensor is installed at the bottom of the lower plate, and a pressure shaft of the pressure sensor extends into the pressure hole to contact the elastic pad.

[0007] Furthermore, an S-shaped surround channel is provided in the lower plate, and the S-shaped surround channel avoids the hollow ventilation pipe. A liquid inlet hole and a liquid discharge hole are provided at the bottom of the lower plate, and the liquid inlet hole and the liquid discharge hole are respectively connected to the two ends of the S-shaped surround channel. The liquid inlet hole and the liquid discharge hole are respectively threadedly connected with a liquid inlet pipe and a liquid discharge pipe. A refrigeration box is provided on the outside of the server cabinet, and coolant is filled in the refrigeration box. A water pump is provided on the refrigeration box, one end of the liquid inlet pipe is connected to the water pump, and the liquid discharge pipe is connected to the refrigeration box.

[0008] Furthermore, the lower plate includes a split upper plate and a split lower plate, the split upper plate is connected to the split lower plate by screws, an upper half-shaped surrounding groove is provided at the bottom of the split upper plate, a lower half-shaped surrounding groove is provided at the top of the split lower plate, the lower half-shaped surrounding groove and the upper half-shaped surrounding groove constitute the S-shaped surrounding channel, a sealing ring is fixed at the bottom of the split upper plate, a sealing groove is provided at the top of the split lower plate, and the sealing ring is interference fit in the sealing groove.

[0009] Furthermore, the left and right side walls of the server cabinet are provided with installation grooves, the left and right ends of the heat dissipation baffle are respectively adapted in the two installation grooves, and multiple plug-ins are provided on both sides of the top of the heat dissipation baffle, and the multiple plug-ins are arranged at equal intervals along the length direction of the installation groove. The plug-ins have the freedom to move along the thickness direction of the heat dissipation baffle, and the inner top wall of the installation groove is provided with a hole corresponding to the position of the plug-in, and the top of the plug-in is adapted in the hole.

[0010] Furthermore, locking cavities are provided on both sides of the heat dissipation cavity in the upper plate, and a screw is provided in the locking cavity. The tail end of the screw is threadedly connected to the upper plate, and a cam is fixed on the screw sleeve. A vertical groove is opened at the top of the upper plate corresponding to the position of the plug, and the vertical groove is connected to the locking cavity. The plug is slidably adapted in the vertical groove, and the bottom of the plug extends to the lock cavity to fix a limit plate, the width of the limit plate is greater than the width of the vertical groove, and a ball is rotatably provided at the bottom of the limit plate, and the ball contacts the cam, the head of the screw passes through the upper plate and is fixed with a knob, and the front end surface of the upper plate is marked with an unlocking mark.

[0011] Furthermore, two inverted T-shaped grooves are provided in parallel on the top surface of the upper plate, and the inverted T-shaped groove passes through the front end surface of the upper plate. The lower part of the support member is slidably adapted in the inverted T-shaped groove. A groove is provided on one side of the support member, and a conical hole is provided on the inner side wall of the inverted T-shaped groove at a position corresponding to the groove. A stop ball is arranged in the conical hole, and the stop ball is partially adapted in the groove.

[0012] Furthermore, a strip cavity is provided in the upper plate at one side of the inverted T-shaped groove, a push plate is slidably provided in the strip cavity, the push plate moves along the length direction of the inverted T-shaped groove, an elastic sleeve is sleeved on the push plate, the elastic sleeve is interference fit in the strip cavity, a receiving groove is provided on the push plate at a position corresponding to the tapered hole, the inner diameter of the tapered hole gradually decreases in a direction approaching the groove, the minimum diameter of the tapered hole is smaller than the diameter of the stop ball, and both ends of the push plate pass through the upper plate and are respectively connected to a front limit plate and a rear limit plate;

[0013] When the front limit plate abuts against the upper plate, the accommodating grooves and the tapered holes are arranged alternately, and the push plate pushes the stop ball into the groove;

[0014] When the rear limiting plate abuts against the upper plate, the receiving groove corresponds to the tapered hole, and the stop ball is disengaged from the groove and partially located in the receiving groove.

[0015] Furthermore, a threaded hole and a filling hole are sequentially opened on the front end surface of the upper plate along the direction close to the heat dissipation cavity, the filling hole is connected to the heat dissipation cavity, the diameter of the filling hole is smaller than the diameter of the threaded hole, the threaded hole is adapted with a plug, a rubber sealing block is fixed to one end of the plug close to the filling hole, the rubber sealing block rests on the step formed by the threaded hole and the filling hole, and a small filling hole is opened through the plug.

[0016] The beneficial effects of the present invention are:

[0017] 1. A cooling fan is normally installed in the server cabinet. The cooling fan drives the air flow in the server cabinet. The air passes through the heat dissipation baffle through the hollow ventilation duct. In the process of passing through the heat dissipation baffle, it will exchange heat with the liquid metal in the heat dissipation cavity, thereby quickly reducing the temperature of the air. The cold air exchanges heat with the computer module to achieve the purpose of heat dissipation. It has a good heat dissipation effect and can meet high heat dissipation requirements.

[0018] 2. The volume of the metal phase change material will increase during the process of absorbing heat and changing from solid to liquid. The elastic deformation of the elastic pad allows the space of the heat dissipation cavity to adapt to the change in the shape of the phase change material, thereby avoiding deformation or damage to the heat dissipation partition caused by the increase in the volume of the phase change material.

[0019] 3. The pressure sensor detects the deformation state of the elastic pad and determines the shape of the phase change metal material based on the deformation state of the elastic pad. When the phase change metal material is completely transformed into liquid and does not transform into solid within a certain period of time, it indicates that the temperature in the server cabinet exceeds the combined heat dissipation capacity of the phase change metal material and the cooling fan. At this time, the water pump causes the coolant in the refrigeration box to flow in the S-shaped surround channel to cool the air and metal phase change material in the server cabinet. The heat is dissipated by a combination of air cooling, metal phase change material and liquid cooling, further improving the heat dissipation capacity to quickly reduce the temperature in the server cabinet. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the partial structure of a combined heat dissipation device for a server of the present invention;

[0021] Figure 2 A top view of a heat dissipation baffle in a combined heat dissipation device for a server of the present invention;

[0022] Figure 3 for Figure 2 Middle AA section view;

[0023] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0024] Figure 5 A state diagram of a support member unlocked in a combined heat dissipation device for a server of the present invention;

[0025] Figure 6 for Figure 5 Enlarged view of point B in the middle;

[0026] Figure 7 for Figure 2 Partial cross-sectional view along the BB axis;

[0027] Figure 8 for Figure 7 Enlarged view of point C in the middle;

[0028] Fig. 9 It is a structural schematic diagram of a split lower plate in a combined heat dissipation device for a server of the present invention;

[0029] Fig.10 This is a schematic diagram of the internal structure of a server cabinet in a combined heat dissipation device for a server of the present invention;

[0030] Fig.11 for Fig.10 Enlarged view of point D in the middle;

[0031] Fig.12 It is a front view of a combined heat dissipation device for a server of the present invention;

[0032] In the figure, 1-server cabinet, 2-heat dissipation baffle, 3-support, 4-upper plate, 5-lower plate, 6-hollow ventilation pipe, 7-heat dissipation cavity, 8-elastic pad, 9-avoidance hole, 10-pressure hole, 11-pressure sensor, 12-S-shaped surrounding channel, 13-liquid inlet hole, 14-liquid discharge hole, 15-liquid inlet pipe, 16-liquid discharge pipe, 17-refrigeration box, 18-water pump, 19-split upper plate, 20-split lower plate, 21-sealing ring, 22-sealing groove, 23-installation slide Slot, 24-insert, 25-jack, 26-lock chamber, 27-screw, 28-cam, 29-vertical slot, 30-limit plate, 31-ball, 32-knob, 33-inverted T-shaped slot, 34-groove, 35-conical hole, 36-stop ball, 37-strip cavity, 38-push plate, 39-elastic sleeve, 40-accommodating slot, 41-front limit plate, 42-rear limit plate, 43-threaded hole, 44-filling hole, 45-plug, 46-rubber sealing block, 47-filling small hole. DETAILED DESCRIPTION

[0033] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0034] Embodiment 1: Figures 1 to 12As shown, a combined heat dissipation device for a server includes a server cabinet 1. A heat dissipation fan is normally installed in the server cabinet 1. A plurality of combined heat dissipation mechanisms are installed in the server cabinet 1 along its own height direction. The combined heat dissipation mechanism includes a heat dissipation baffle 2 and a plurality of support members 3. The support member 3 is in an inverted T shape. The support member 3 is used to be welded on the bottom of a computer module. The support member 3 is installed on the top of the heat dissipation baffle 2 and is used to suspend the computer module in the server cabinet 1. The heat dissipation baffle 2 includes an upper plate 4, a lower plate 5 and a hollow ventilation pipe 6. The lower plate 5 is connected to the bottom of the upper plate 4. A heat dissipation cavity 7 is opened at the bottom of the upper plate 4. The heat dissipation cavity 7 is filled with a metal phase change material. A plurality of hollow ventilation pipes 6 are arranged between the upper plate 4 and the lower plate 5. The inner hole of the hollow ventilation pipe 6 passes through the upper plate 4 and the lower plate 5. The computer module is suspended through the support member 3. The computer module is suspended on the heat dissipation baffle 2, which greatly increases the heat exchange area of ​​the computer module and improves the heat dissipation effect of the computer module. The metal phase change material is solid in normal state. The heat dissipation fan discharges the hot air in the server cabinet 1 and introduces cold air from the outside to achieve air exchange and heat dissipation. The heat dissipation fan also enhances the flow of air in the server cabinet 1. Due to the setting of the hollow ventilation pipe 6, the air can pass through the heat dissipation baffle 2 through the hollow ventilation pipe 6. In the process of passing through the heat dissipation baffle 2, it will exchange heat with the liquid metal in the heat dissipation cavity 7, thereby quickly reducing the temperature of the air. Due to the suspended arrangement of the computer module, the cooled cold air can directly act on the computer module after passing through the hollow ventilation pipe 6, which increases the heat exchange area and improves the efficiency. The dual heat dissipation mode of air cooling and metal phase change material is used for heat dissipation, which can meet high heat dissipation requirements. During specific implementation, the heat dissipation baffle 2 adopts a split structure, which is convenient for the installation of the hollow ventilation pipe 6, so that the hollow ventilation pipe 6 can still maintain the sealing of the heat dissipation cavity 7 after installation, and prevent the metal phase change material from overflowing from the heat dissipation cavity 7; specifically, an upper ventilation hole is penetrated through the position of the upper plate 4 corresponding to the hollow ventilation pipe 6, and a lower ventilation hole is penetrated through the position of the lower plate 5 corresponding to the hollow ventilation pipe 6. The two ends of the hollow ventilation pipe 6 are respectively welded in the upper ventilation hole and the lower ventilation hole. First, one end of the hollow ventilation pipe 6 is welded in the upper ventilation hole to achieve the connection between the hollow ventilation pipe 6 and the upper plate 4, and at the same time, the gap between the hollow ventilation pipe 6 and the upper ventilation hole is eliminated. Then, the upper plate 4 and the lower plate 5 are welded together. At this time, the other end of the hollow ventilation pipe 6 is located in the lower ventilation hole, and then the lower plate 5 is connected to the hollow ventilation pipe 6 by welding to eliminate the gap between the outer wall of the hollow ventilation pipe 6 and the inner wall of the lower ventilation hole. Therefore, under the premise of setting the hollow ventilation pipe 6, the sealing of the heat dissipation cavity 7 can still be guaranteed.

[0035] Embodiment 2: The volume of the metal phase change material changes during the deformation process. In order to prevent the volume of the metal phase change material from increasing after absorbing heat and liquefying, thereby causing deformation or damage to the heat dissipation baffle 2, based on Embodiment 1, as Figures 1 to 3As shown, an elastic pad 8 is fixed to the end face of the lower plate 5 close to the upper plate 4, and an avoidance hole 9 is opened on the elastic pad 8 at the position corresponding to the lower ventilation hole. A pressure hole 10 is opened at the bottom of the lower plate 5, and a pressure sensor 11 is installed at the bottom of the lower plate 5. The pressure axis of the pressure sensor 11 extends into the pressure hole 10 and contacts the elastic pad 8. The elastic pad 8 is set. In the process of filling the metal phase change material, there is no need for precise filling amount, and it is only necessary to make the filling amount equal to or slightly larger than the volume of the heat dissipation cavity 7. When the heat absorption volume of the metal phase change material increases, the elastic pad 8 will undergo compression deformation, thereby increasing the volume of the heat dissipation cavity 7, and then adapting to the volume change of the metal phase change material, avoiding deformation or damage to the heat dissipation partition 2. The deformation of the elastic pad 8 will squeeze the pressure axis of the pressure sensor 11. The state of the metal phase change material can be judged by the pressure signal fed back by the pressure sensor 11, so as to roughly obtain the temperature in the server cabinet, and make timely adjustments according to the feedback temperature.

[0036] Furthermore, if Figures 1 to 8 As shown, the front end surface of the upper plate 4 is provided with threaded holes 43 and filling holes 44 in sequence along the direction close to the heat dissipation cavity 7. The filling hole 44 is connected to the heat dissipation cavity 7. The diameter of the filling hole 44 is smaller than the diameter of the threaded hole 43. The threaded hole 43 is internally threaded with a plug 45. A rubber sealing block 46 is fixed to one end of the plug 45 close to the filling hole 44. The rubber sealing block 46 abuts against the step formed by the threaded hole 43 and the filling hole 44. A filling hole 47 is formed through the plug 45. The metal phase change material is filled into the heat dissipation cavity 7 through the filling hole 44. Then the plug 45 is screwed on to seal the filling hole 44. After the plug 45 is screwed into place, the rubber sealing block 46 abuts against the step formed by the threaded hole 43 and the filling hole 44. The deformable high-strength sealing surface has a strong sealing performance, which can prevent the metal phase change material from overflowing and affecting the computer module. When the amount of metal phase change material in the heat dissipation cavity 7 is reduced and needs to be supplemented, the liquid metal phase change material is injected into the heat dissipation cavity 7 through an injection needle. The injection needle pierces the rubber sealing block 46 through the filling hole 47. The injection needle pierces the rubber sealing block 46 to connect to the filling hole 44, thereby adding the liquid metal phase change material into the heat dissipation cavity 7, and then the injection needle is pulled out. The rubber sealing block 46 can close the puncture entrance of the injection needle through its own deformation, thereby re-sealing the filling hole 44, and the addition of metal phase change material can be completed without removing the plug 45. The operation is simple and quick.

[0037] Embodiment 3: When the metal phase change material is completely liquefied, the heat absorption capacity of the metal phase change material reaches its limit, and the pressure sensor 11 detects the maximum pressure. When the maximum pressure is maintained for a period of time without decreasing, it indicates that the temperature in the server cabinet 1 has not decreased. At this time, the working heat of the computer module exceeds the heat dissipation capacity of the server cabinet 1. Therefore, based on the embodiment 2, as shown in FIG. Figures 1 to 9As shown, an S-shaped surrounding channel 12 is provided in the lower plate 5, and the S-shaped surrounding channel 12 avoids the hollow ventilation pipe 6. A liquid inlet hole 13 and a liquid discharge hole 14 are provided at the bottom of the lower plate 5, and the liquid inlet hole 13 and the liquid discharge hole 14 are respectively connected to the two ends of the S-shaped surrounding channel 12, and the liquid inlet hole 13 and the liquid discharge hole 14 are respectively threadedly connected with a liquid inlet pipe 15 and a liquid discharge pipe 16. A refrigeration box 17 is provided on the outside of the server cabinet 1, and a coolant is filled in the refrigeration box 17. A water pump 18 is provided on the refrigeration box 17. One end of the liquid inlet pipe 15 is connected to a water pump 18, and the liquid discharge pipe 16 is connected to a refrigeration box 17. A refrigeration plate is provided in the refrigeration box 17 to cool the liquid in the refrigeration box 17. When the pressure feedback from the pressure sensor 11 reaches the maximum value and is maintained for a set time, the water pump 18 is started, and the water pump 18 drives the coolant in the refrigeration box 17 into the S-shaped surrounding channel 12 through the liquid inlet pipe 15, and then returns to the refrigeration box 17 from the liquid discharge pipe 16, so that the coolant is in the S-shaped surrounding channel. 12 internal circulation, the setting of the S-shaped surround channel 12 makes the coolant have a longer flow path on the lower plate 5, increases the coverage area of ​​the coolant and the lower plate 5, and has a strong heat absorption capacity. The air in the server cabinet 1 will contact the lower plate 5 for cooling, and the cooled air acts on the computer module through the hollow ventilation pipe 6 to achieve rapid cooling of the computer module. At the same time, it can also cool the metal phase change material, so that the metal phase change material changes from liquid to solid. When the dual heat dissipation mode cannot meet the heat dissipation requirements, liquid cooling is started, and the three-combination mode of air cooling, metal phase change material and liquid cooling is used for heat dissipation, further improving the heat dissipation capacity to quickly reduce the temperature in the server cabinet 1. When the pressure sensor 11 detects the minimum pressure, it indicates that the metal phase change material is basically converted into a solid state. At this time, the water pump 18 stops working and continues to use the dual heat dissipation mode for heat dissipation, which can avoid energy waste and achieve rational use of energy while meeting the heat dissipation requirements.

[0038] Embodiment 4: Since the structure of the S-shaped surrounding channel 12 is relatively complex, it needs to be arranged to avoid the lower ventilation hole, and it also needs to be arranged to extend the flow path of the coolant in a winding manner, which makes it difficult to manufacture the S-shaped surrounding channel 12 for the one-piece lower plate 5. Therefore, based on the embodiment 3, as shown in FIG. Figures 1 to 9As shown, the lower plate 5 includes a split upper plate 19 and a split lower plate 20, the split upper plate 19 is connected to the split lower plate 20 by screws, an upper half-shaped surrounding groove is provided at the bottom of the split upper plate 19, a lower half-shaped surrounding groove is provided at the top of the split lower plate 20, the lower half-shaped surrounding groove and the upper half-shaped surrounding groove form an S-shaped surrounding channel 12, a sealing ring 21 is fixed at the bottom of the split upper plate 19, a sealing groove 22 is provided at the top of the split lower plate 20, the sealing ring 21 is interference fit in the sealing groove 22, and the lower plate 5 is set to a split type, so that it can be split An upper half-shaped surrounding groove and a lower half-shaped surrounding groove are respectively provided on the end surface of the upper plate 19 and the end surface of the split lower plate 20. After the split upper plate 19 and the split lower plate 20 are connected, the upper half-shaped surrounding groove and the lower half-shaped surrounding groove can form an S-shaped surrounding channel 12, thereby reducing the manufacturing difficulty of the S-shaped surrounding channel 12, and at the same time, the arrangement path of the S-shaped surrounding channel 12 can be arbitrarily set according to needs; the gap between the split upper plate 19 and the split lower plate 20 is eliminated through the cooperation of the sealing ring 21 and the sealing groove 22, thereby avoiding the problem of coolant overflow.

[0039] Embodiment 5: Based on Embodiment 4, Figures 1 to 11 As shown, the left and right side walls of the server cabinet 1 are provided with mounting grooves 23, and the left and right ends of the heat dissipation baffle 2 are respectively adapted in the two mounting grooves 23. Both sides of the top of the heat dissipation baffle 2 are provided with a plurality of plug-ins 24, and the plurality of plug-ins 24 are arranged at equal intervals along the length direction of the mounting grooves 23. The plug-ins 24 have the freedom to move along the thickness direction of the heat dissipation baffle 2. The inner top wall of the mounting groove 23 is provided with a plug-in hole 25 corresponding to the position of the plug-in hole 24, and the top of the plug-in hole 24 is adapted in the plug-in hole 25. Since the heat dissipation baffle 2 needs Filled with metal phase change material, therefore, the heat dissipation baffle 2 cannot be integrally formed with the server cabinet 1. The heat dissipation baffle 2 is quickly connected to the server cabinet 1, which is convenient for later maintenance and for later replenishment of metal phase change material. During installation, the heat dissipation baffle 2 is slid into the installation slot 23 of the server cabinet 1. When the heat dissipation baffle 2 slides into the end of the installation slot 23, the socket 25 is located on the moving path of the plug 24. Then, the plug 24 is inserted into the socket 25, so that the heat dissipation baffle 2 is stably connected to the server cabinet 1.

[0040] Furthermore, locking cavities 26 are provided on both sides of the heat dissipation cavity 7 in the upper plate 4, and a screw 27 is provided in the locking cavity 26. The tail of the screw 27 is threadedly connected to the upper plate 4, and a cam 28 is fixedly sleeved on the screw 27. A vertical groove 29 is provided at the top of the upper plate 4 corresponding to the position of the plug 24, and the vertical groove 29 is connected to the locking cavity 26. The plug 24 is slidably adapted in the vertical groove 29, and the bottom of the plug 24 extends to the locking cavity 26 to fix a limit plate 30. The width of the limit plate 30 is greater than the width of the vertical groove 29, and a ball 31 is rotatably provided at the bottom of the limit plate 30, and the ball 31 contacts the cam 28. The head of the screw 27 passes through the upper plate 4 and is fixed with a knob 32. The front end surface of the upper plate 4 is marked with an unlocking mark, and an indicator arrow is provided on the knob 32. When installing the heat dissipation baffle 2, the knob 32 is turned, and the knob 32 drives the cam 28 to rotate through the screw 27. The indicating arrow corresponds to the unlocking mark. At this time, the proximal end of the cam 28 contacts the ball 31, so that the plug 24 is located in the vertical groove 29 under its own gravity. Then, the heat dissipation baffle 2 is slid into the installation slide groove 23, and then the knob 32 is turned to tighten the screw 27. The screw 27 drives the distal end of the cam 28 to move close to the plug 24. The plug 24 is lifted by the cam 28, so that the plug 24 is inserted into the socket 25 to complete the connection between the heat dissipation baffle 2 and the server cabinet 1. The position of the cam 28 is locked by the threaded connection between the screw 27 and the heat dissipation baffle 2, so that the plug 24 can be stably inserted into the socket 25 to realize the reliable connection of the heat dissipation baffle 2. The axial length of the cam 28 can contact the balls 31 of multiple plugs 24. By turning the knob 32 once, multiple plugs 24 on one side can be pushed into the socket 25, thereby realizing the quick connection and quick disassembly of the heat dissipation baffle 2.

[0041] Embodiment 6: Based on Embodiment 5, Figures 1 to 11As shown, two inverted T-shaped grooves 33 are parallelly provided on the top surface of the upper plate 4, and the inverted T-shaped grooves 33 pass through the front end surface of the upper plate 4. Each heat dissipation baffle 2 is provided with four support members 3, and each two positions correspond to an inverted T-shaped groove 33. The lower part of the support member 3 is slidably adapted in the inverted T-shaped groove 33, and a groove 34 is provided on one side of the support member 3. A conical hole 35 is provided on the inner side wall of the inverted T-shaped groove 33 at a position corresponding to the groove 34. A stop ball 36 is provided in the conical hole 35, and the stop ball 36 is partially adapted in the groove 34. A strip cavity 37 is provided on one side of the inverted T-shaped groove 33 in the upper plate 4, and a push plate 38 is slidably provided in the strip cavity 37. The push plate 38 moves along the length direction of the inverted T-shaped groove 33. The set is equipped with an elastic sleeve 39, which is interference-fitted in the strip cavity 37. A receiving groove 40 is opened at the position corresponding to the tapered hole 35 on the push plate 38. The inner diameter of the tapered hole 35 gradually decreases in the direction close to the groove 34. The minimum diameter of the tapered hole 35 is smaller than the diameter of the stop ball 36. The two ends of the push plate 38 pass through the upper plate 4 and are respectively connected with a front limit plate 41 and a rear limit plate 42; when the front limit plate 41 abuts against the upper plate 4, the receiving groove 40 and the tapered hole 35 are arranged alternately, and the push plate 38 pushes the stop ball 36 into the groove 34; when the rear limit plate 42 abuts against the upper plate 4, the receiving groove 40 corresponds to the tapered hole 35, and the stop ball 36 is separated from the groove 34 and partially located in the receiving groove 40. When installing the computer module, first move The push plate 38 is moved to make the rear limit plate 42 contact the upper plate 4, so that the receiving groove 40 corresponds to the tapered hole 35. Under the action of the tapered hole 35, the stop ball 36 moves toward the receiving groove 40 under its own gravity, so that the stop ball 36 is separated from the inverted T-shaped groove 33, and then the support member 3 is slid into the corresponding inverted T-shaped groove 33. When the support member 3 behind the computer module moves to the end of the inverted T-shaped groove 33, at this time, the groove 34 corresponds to the tapered hole 35, and then the push plate 38 is pushed to make the front limit plate 41 contact the upper plate 4. In this process, the push plate 38 squeezes the spherical surface of the stop ball 36, and the squeezing force is decomposed under the action of the spherical surface, so that the stop ball 36 moves away from the receiving groove 40, thereby partially pushing the stop ball 36 into the groove 34, so that the push plate The flat surface of 38 rests on the stop ball 36, thereby stably retaining the stop ball 36 in the groove 34, thereby suspending the computer module on the heat dissipation baffle 2. The force exerted by the movement of the computer module to squeeze the stop ball 36 is perpendicular to the moving direction of the push plate 38. This force cannot push the push plate 38 to move, thereby making the installation of the computer module more stable. By setting the elastic sleeve 39, there is a greater friction between the push plate 38 and the upper plate 4, which can effectively prevent the push plate 38 from accidentally sliding and ensure the reliability of the computer module connection. When the computer module needs to be removed, it is only necessary to pull the push plate 38 to make the rear limit plate 42 contact the upper plate 4, and finally pull out the computer module, thereby making the installation and disassembly of the computer module simple and efficient.

Claims

1. A combined heat dissipation device for a server, comprising a server cabinet (1), characterized in that: A plurality of combined heat dissipation mechanisms are installed in the server cabinet (1) along its height direction. The combined heat dissipation mechanisms include a heat dissipation baffle (2) and a plurality of support members (3). The support member (3) is in the shape of an inverted T. The support member (3) is used to be welded to the bottom of the computer module. The support member (3) is installed on the top of the heat dissipation baffle (2) and is used to suspend the computer module in the server cabinet (1). The heat dissipation baffle (2) includes an upper plate (4), a lower plate (5) and a hollow ventilation pipe (6). The lower plate (5) is connected to the bottom of the upper plate (4). A heat dissipation cavity (7) is provided at the bottom of the upper plate (4). The heat dissipation cavity (7) is filled with a metal phase change material. A plurality of hollow ventilation pipes (6) are provided between the upper plate (4) and the lower plate (5). The inner hole of the hollow ventilation pipe (6) passes through the upper plate (4) and the lower plate (5). An upper ventilation hole is formed through the upper plate (4) at a position corresponding to the hollow ventilation pipe (6), and a lower ventilation hole is formed through the lower plate (5) at a position corresponding to the hollow ventilation pipe (6). Two ends of the hollow ventilation pipe (6) are respectively welded in the upper ventilation hole and the lower ventilation hole. An elastic pad (8) is fixed to the end surface of the lower plate (5) close to the upper plate (4), and an avoidance hole (9) is formed on the elastic pad (8) at a position corresponding to the lower ventilation hole.

2. A combined heat dissipation device for a server according to claim 1, characterized in that: A pressure hole (10) is provided at the bottom of the lower plate (5), a pressure sensor (11) is installed at the bottom of the lower plate (5), and a pressure shaft of the pressure sensor (11) extends into the pressure hole (10) to contact the elastic pad (8).

3. The combined heat dissipation device for a server according to claim 1, characterized in that: An S-shaped surround channel (12) is provided in the lower plate (5), the S-shaped surround channel (12) avoids the hollow ventilation pipe (6), a liquid inlet hole (13) and a liquid discharge hole (14) are provided at the bottom of the lower plate (5), the liquid inlet hole (13) and the liquid discharge hole (14) are respectively connected to two ends of the S-shaped surround channel (12), the liquid inlet hole (13) and the liquid discharge hole (14) are respectively threadedly connected to a liquid inlet pipe (15) and a liquid discharge pipe (16), a refrigeration box (17) is provided on the outside of the server cabinet (1), the refrigeration box (17) contains cooling liquid, a water pump (18) is provided on the refrigeration box (17), one end of the liquid inlet pipe (15) is connected to the water pump (18), and the liquid discharge pipe (16) is connected to the refrigeration box (17).

4. A combined heat dissipation device for a server according to claim 3, characterized in that: The lower plate (5) comprises a split upper plate (19) and a split lower plate (20), the split upper plate (19) being connected to the split lower plate (20) by screws, an upper half-shaped surrounding groove being provided at the bottom of the split upper plate (19), a lower half-shaped surrounding groove being provided at the top of the split lower plate (20), the lower half-shaped surrounding groove and the upper half-shaped surrounding groove forming the S-shaped surrounding channel (12), a sealing ring (21) being fixed at the bottom of the split upper plate (19), a sealing groove (22) being provided at the top of the split lower plate (20), the sealing ring (21) being interference fit in the sealing groove (22).

5. The combined heat dissipation device for a server according to claim 1, characterized in that: The left and right side walls of the server cabinet (1) are provided with mounting slots (23), the left and right ends of the heat dissipation baffle (2) are respectively fitted into the two mounting slots (23), a plurality of inserts (24) are provided on both sides of the top of the heat dissipation baffle (2), the plurality of inserts (24) are arranged at equal intervals along the length direction of the mounting slots (23), the inserts (24) have the freedom to move along the thickness direction of the heat dissipation baffle (2), the inner top wall of the mounting slot (23) is provided with an insert hole (25) at a position corresponding to the insert piece (24), and the top of the insert piece (24) is fitted into the insert hole (25).

6. A combined heat dissipation device for a server according to claim 5, characterized in that: The upper plate (4) is provided with locking cavities (26) on both sides of the heat dissipation cavity (7), a screw (27) is provided in the locking cavity (26), the tail of the screw (27) is threadedly connected to the upper plate (4), a cam (28) is fixedly sleeved on the screw (27), a vertical groove (29) is provided at the top of the upper plate (4) corresponding to the position of the insert (24), the vertical groove (29) is connected to the locking cavity (26), and the insert (24) is slidably adapted in the locking cavity (26). In the vertical groove (29), the bottom of the insert (24) extends to the lock cavity (26) to fix a limit plate (30), the width of the limit plate (30) is greater than the width of the vertical groove (29), a ball (31) is rotatably arranged at the bottom of the limit plate (30), the ball (31) contacts the cam (28), the head of the screw rod (27) passes through the upper plate (4) and is fixed with a knob (32), and the front end surface of the upper plate (4) is marked with an unlocking mark.

7. The combined heat dissipation device for a server according to claim 1, characterized in that: The top surface of the upper plate (4) is provided with two inverted T-shaped grooves (33) in parallel, the inverted T-shaped grooves (33) pass through the front end surface of the upper plate (4), the lower part of the support member (3) is slidably fitted in the inverted T-shaped grooves (33), one side of the support member (3) is provided with a groove (34), the inner side wall of the inverted T-shaped groove (33) is provided with a tapered hole (35) at a position corresponding to the groove (34), a stop ball (36) is arranged in the tapered hole (35), and the stop ball (36) is partially fitted in the groove (34).

8. The combined heat dissipation device for a server according to claim 7, characterized in that: A strip cavity (37) is provided in the upper plate (4) on one side of the inverted T-shaped groove (33), a push plate (38) is slidably provided in the strip cavity (37), the push plate (38) moves along the length direction of the inverted T-shaped groove (33), an elastic sleeve (39) is sleeved on the push plate (38), the elastic sleeve (39) is interference fit in the strip cavity (37), a receiving groove (40) is provided on the push plate (38) at a position corresponding to the tapered hole (35), the inner diameter of the tapered hole (35) gradually decreases in a direction approaching the groove (34), the minimum diameter of the tapered hole (35) is smaller than the diameter of the stop ball (36), and two ends of the push plate (38) pass through the upper plate (4) and are respectively connected to a front limit plate (41) and a rear limit plate (42); When the front limit plate (41) abuts against the upper plate (4), the accommodating grooves (40) and the tapered holes (35) are arranged alternately, and the push plate (38) pushes the stop ball (36) into the groove (34); When the rear limiting plate (42) abuts against the upper plate (4), the accommodating groove (40) corresponds to the conical hole (35), and the stop ball (36) is separated from the groove (34) and partially located in the accommodating groove (40).

9. The combined heat dissipation device for a server according to claim 2, characterized in that: The front end surface of the upper plate (4) is provided with a threaded hole (43) and a filling hole (44) in sequence along a direction close to the heat dissipation cavity (7); the filling hole (44) is connected to the heat dissipation cavity (7); the diameter of the filling hole (44) is smaller than the diameter of the threaded hole (43); the threaded hole (43) is internally threaded and adapted with a plug (45); a rubber sealing block (46) is fixed to one end of the plug (45) close to the filling hole (44); the rubber sealing block (46) abuts against a step formed by the threaded hole (43) and the filling hole (44); and a filling hole (47) is penetrated through the plug (45).

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