Welding device for integrated circuit chip production

Abstract

The invention relates to the technical field of integrated circuit production, in particular to a welding device for integrated circuit chip production, which comprises an adsorption assembly, and the adsorption assembly comprises a processing pipe, an electromagnetic ring arranged on the circumferential surface of the processing pipe, a collection box connected with the processing pipe and an airflow power part arranged in the inner cavity of the processing pipe; and the grinding assembly comprises a rotating rod arranged in the inner cavity of the treatment pipe and a circular ring cover matched with the rotating rod. According to the device, metal oxide in smoke generated in the welding process can be stably adsorbed to the inner wall of the treatment pipe through an electromagnetic ring, after welding is completed, the electromagnetic ring is closed, the metal oxide can fall into a collecting box along an inner cavity of the treatment pipe, at the moment, due to loss of pushing force of the smoke, a jacking plate descends, and the metal oxide can be collected. And the jacking plate can drive the pressing plate to rotate and descend in the descending process, the metal oxide in the collecting box is smashed, the effective removal effect on the metal oxide can be achieved, and the purpose of environmental protection is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of integrated circuit production, in particular to a welding device for producing integrated circuit chips. Background Art

[0002] Integrated circuit chips are electronic devices that can realize certain circuit functions. During the production and processing of integrated circuit chips, welding equipment is needed to weld electronic components. Solder is required when welding electronic components, and excessive smoke will be generated during soldering. During the welding process, the metal surface will react with oxygen in the air to form metal oxides. Metal oxides are difficult to decompose naturally. If they are directly discharged into the external environment, they may cause pollution to the environment, which is not conducive to environmental protection. Summary of the invention

[0003] In view of the above problems existing in the prior art, the present invention is proposed.

[0004] Therefore, the technical problem to be solved by the present invention is that metal oxides are difficult to decompose naturally, and if they are directly discharged into the external environment, they may cause environmental pollution and be detrimental to environmental protection.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: A welding device for integrated circuit chip production, comprising an adsorption assembly, the adsorption assembly comprising a processing tube, an electromagnetic ring arranged on the circumferential surface of the processing tube, a collection box connected to the processing tube, and an airflow power member arranged in the inner cavity of the processing tube;

[0006] A grinding assembly, the grinding assembly comprising a rotating rod disposed in the inner cavity of the processing tube and a circular ring cover matched with the rotating rod;

[0007] A welding mechanism, the welding mechanism cooperates with the adsorption component

[0008] As a preferred embodiment of the welding device for integrated circuit chip production described in the present invention, the processing tube includes a smoke inlet pipe, a guide pipe, a smoke outlet pipe and a threaded groove, the smoke inlet pipe is communicated with the processing tube, the guide pipe is fixedly connected to the top of the processing tube, the smoke outlet pipe is fixedly connected to the top of the guide pipe, and the threaded groove is opened at the bottom of the processing tube.

[0009] As a preferred solution of the welding device for integrated circuit chip production described in the present invention, the collection box includes an annular plate, a blanking surface and a threaded mounting plate, the annular plate is fixedly connected to the circumferential surface of the collection box, the blanking surface is arranged in the inner cavity of the collection box, the threaded mounting plate is fixedly connected to the top of the collection box, and the threaded mounting plate is threadedly matched with the thread groove.

[0010] As a preferred solution of the welding device for integrated circuit chip production described in the present invention, the airflow power component includes a fixed rod, a sliding rod and a lifting plate, the fixed rod is fixedly connected to the inner cavity of the processing tube, the sliding rod is slidably connected to the sliding groove opened at the top of the fixed rod, and the lifting plate is fixedly connected to the top of the sliding rod.

[0011] As a preferred solution of the welding device for integrated circuit chip production described in the present invention, the fixed rod includes a notch, a spring and a moving rod, the notch is opened on one side of the fixed rod, one end of the spring is fixedly connected to the bottom of the notch, the moving rod is fixedly connected to the other end of the spring, the moving rod is slidably matched with the notch, and one end of the rotating rod is rotatably connected to the moving rod.

[0012] As a preferred solution of the welding device for producing integrated circuit chips of the present invention, a drainage arc plate is fixedly connected to the top of the lifting plate.

[0013] As a preferred solution of the welding device for producing integrated circuit chips of the present invention, the rotating rod includes a convex shaft and a pressing plate, the convex shaft is fixedly connected to the circumferential surface of the rotating rod, and the pressing plate is fixedly connected to the other end of the rotating rod.

[0014] As a preferred solution of the welding device for integrated circuit chip production described in the present invention, the annular cover includes a spiral groove and a positioning ring, the spiral groove is opened on the inner wall of the annular cover, the convex shaft is slidably matched with the spiral groove, and the positioning ring is fixedly connected to the circumferential surface of the annular cover.

[0015] As a preferred solution of the welding device for producing integrated circuit chips of the present invention, a connecting rod is fixedly connected to the circumferential surface of the positioning ring, and one end of the connecting rod is fixedly connected to the fixing rod.

[0016] As a preferred solution of the welding device for producing integrated circuit chips of the present invention, a hand-holding port is provided through the annular plate.

[0017] The beneficial effects of the present invention are as follows: the metal oxides in the smoke generated during the welding process can be stably adsorbed on the inner wall of the treatment tube through the electromagnetic ring, and after the welding is completed, the electromagnetic ring is closed, and the metal oxides can fall into the collection box along the inner cavity of the treatment tube. At this time, due to the loss of the thrust of the smoke, the lifting plate descends, and the lifting plate can drive the pressing plate to rotate and descend during the descent process, thereby crushing the metal oxides in the collection box. This can not only effectively remove the metal oxides and achieve the purpose of environmental protection, but also crushing the metal oxides can facilitate the subsequent recovery of the metal oxides by the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0019] Figure 1 A schematic diagram of the overall structure of a welding device for producing integrated circuit chips according to an embodiment of the present invention;

[0020] Figure 2 A schematic diagram of the structure of a processing tube in a welding device for producing integrated circuit chips according to an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of the cross-sectional structure of a processing tube in a welding device for producing integrated circuit chips according to an embodiment of the present invention;

[0022] Figure 4 A schematic cross-sectional structure diagram of another angle of a processing tube in a welding device for producing integrated circuit chips according to an embodiment of the present invention;

[0023] Figure 5 This is an enlarged schematic diagram of the structure of a welding device G for producing integrated circuit chips according to an embodiment of the present invention;

[0024] Figure 6 This is an enlarged schematic diagram of the structure of a welding device H for producing integrated circuit chips according to an embodiment of the present invention.

[0025] In the accompanying drawings: 100, adsorption component; 101, processing tube; 101a, smoke inlet pipe; 101b, guide pipe; 101c, smoke outlet pipe; 101d, threaded groove; 102, electromagnetic ring; 103, collecting box; 103a, annular plate; 103a-1, hand-held port; 103b, blanking surface; 103c, threaded mounting plate; 104, airflow power part; 104a, fixed rod; 104a-1, notch; 104a-2, spring; 104a-3, moving rod; 104b, sliding rod; 104c, lifting plate; 104c-1, guide arc plate; 200, grinding component; 201, rotating rod; 201a, convex shaft; 201b, pressing plate; 202, annular cover; 202a, spiral groove; 202b, positioning ring; 202b-1, connecting rod. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the present invention is described in detail with reference to schematic diagrams. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0029] Furthermore, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0030] Example 1

[0031] Reference Figure 1 - Figure 6 The present embodiment provides a welding device for integrated circuit chip production, including an adsorption component 100, the adsorption component 100 includes a processing tube 101, an electromagnetic ring 102 arranged on the circumferential surface of the processing tube 101, a collection box 103 connected to the processing tube 101, and an airflow power member 104 arranged in the inner cavity of the processing tube 101; a grinding component 200, the grinding component 200 includes a rotating rod 201 arranged in the inner cavity of the processing tube 101 and a circular ring cover 202 matched with the rotating rod 201.

[0032] The welding mechanism cooperates with the adsorption component 100 in that the smoke inlet pipe 101a is located above the welding mechanism to suck the smoke generated by welding into the smoke inlet pipe 101a. One end of the smoke inlet pipe 101a is trumpet-shaped and has a built-in exhaust fan for absorbing smoke.

[0033] The welding mechanism used in the production of integrated circuit chips is a prior art and will not be described in detail here.

[0034] Furthermore, the processing tube 101 includes a smoke inlet pipe 101a, a flow guide pipe 101b, a smoke outlet pipe 101c and a threaded groove 101d. The smoke inlet pipe 101a is communicated with the processing tube 101, the flow guide pipe 101b is fixedly connected to the top of the processing tube 101, the smoke outlet pipe 101c is fixedly connected to the top of the flow guide pipe 101b, and the threaded groove 101d is opened at the bottom of the processing tube 101.

[0035] It should be noted that the shape of the flow guide tube 101b is such that the diameter gradually increases from the bottom to the top.

[0036] Furthermore, the collecting box 103 includes an annular plate 103a, a blanking surface 103b and a threaded mounting plate 103c, the annular plate 103a is fixedly connected to the circumferential surface of the collecting box 103, the blanking surface 103b is arranged in the inner cavity of the collecting box 103, the threaded mounting plate 103c is fixedly connected to the top of the collecting box 103, and the threaded mounting plate 103c is threadedly matched with the thread groove 101d.

[0037] It should be noted that the threaded cooperation between the threaded mounting plate 103c and the threaded groove 101d makes it convenient for the staff to disassemble and assemble the collection box 103.

[0038] In addition, the falling surface 103b can make the fallen metal oxides fall into the bottom of the collecting box 103 better, so as to facilitate the subsequent crushing process.

[0039] Furthermore, a hand-holding opening 103a-1 is formed through the annular plate 103a.

[0040] It should be noted that the holding port 103a-1 can facilitate the staff to rotate the annular plate 103a, and an anti-skid pad is installed inside the holding port 103a-1 to prevent the staff from slipping when rotating the annular plate 103a.

[0041] Furthermore, the airflow power member 104 includes a fixed rod 104a, a sliding rod 104b and a lifting plate 104c. The fixed rod 104a is fixedly connected to the inner cavity of the processing tube 101, the sliding rod 104b is slidably connected to a sliding groove opened at the top of the fixed rod 104a, and the lifting plate 104c is fixedly connected to the top of the sliding rod 104b.

[0042] Furthermore, the fixed rod 104a includes a slot 104a-1, a spring 104a-2 and a movable rod 104a-3, the slot 104a-1 is opened on one side of the fixed rod 104a, one end of the spring 104a-2 is fixedly connected to the bottom of the slot 104a-1, the movable rod 104a-3 is fixedly connected to the other end of the spring 104a-2, the movable rod 104a-3 is slidably matched with the slot 104a-1, and one end of the rotating rod 201 is rotatably connected to the movable rod 104a-3.

[0043] It should be noted that the spring 104a-2 will be in a stretched state during the rising process of the lifting plate 104c. When the lifting plate 104c loses the thrust of the smoke, the spring 104a-2 will reset. During this process, a downward pulling force can be applied to the lifting plate 104c, so that the lifting plate 104c will not rely solely on gravity to drive the grinding assembly 200. Therefore, the lifting plate 104c does not need to be designed to be heavier to avoid the effect that the smoke cannot lift the lifting plate 104c.

[0044] Furthermore, a guide arc plate 104c-1 is fixedly connected to the top of the lifting plate 104c.

[0045] It should be noted that the guide arc plate 104c-1 is in contact with the inner cavity of the processing tube 101. When the smoke lifts the lifting plate 104c to the uppermost end, the smoke can be discharged into the smoke outlet pipe 101c from the gap between the guide arc plate 104c-1 and the guide pipe 101b.

[0046] When in use, first energize the electromagnetic ring 102, and then introduce the smoke from the smoke inlet pipe 101a through the exhaust fan. It should be noted that a one-way valve is arranged inside the smoke inlet pipe 101a to prevent the smoke drawn into the smoke inlet pipe 101a by the exhaust fan from flowing back. The metal oxides mixed in the smoke can be adsorbed by the energized electromagnetic ring 102. During the process of smoke introduction, the lifting plate 104c will gradually rise due to the thrust of the smoke. At this time, the sliding rod 104b can drive the moving rod 104a-3 to move upward through the lifting plate 104c. During this process, the spring 104a-2 is in a stretched state, and the smoke can be discharged into the smoke outlet pipe 101c from the gap between the guide arc plate 104c-1 and the guide pipe 101b.

[0047] Example 2

[0048] Reference Figure 1 - Figure 6 Based on the previous embodiment, this embodiment provides a welding device for integrated circuit chip production, wherein the rotating rod 201 includes a convex shaft 201a and a pressing plate 201b, the convex shaft 201a is fixedly connected to the circumferential surface of the rotating rod 201, and the pressing plate 201b is fixedly connected to the other end of the rotating rod 201.

[0049] Furthermore, the annular cover 202 includes a spiral groove 202a and a positioning ring 202b. The spiral groove 202a is provided on the inner wall of the annular cover 202. The convex shaft 201a is slidably matched with the spiral groove 202a. The positioning ring 202b is fixedly connected to the circumferential surface of the annular cover 202.

[0050] It should be noted that the cooperation between the convex shaft 201a and the spiral groove 202a can cause the rotating rod 201 to rotate. At this time, due to the reset of the spring 104a-2, the rotating rod 201 can move downward while rotating.

[0051] Furthermore, a connecting rod 202b-1 is fixedly connected to the circumferential surface of the positioning ring 202b, and one end of the connecting rod 202b-1 is fixedly connected to the fixing rod 104a.

[0052] It should be noted that the connecting rod 202b-1 can fix the positioning ring 202b.

[0053] It should be noted that a check valve is installed on the smoke inlet pipe 101a to prevent smoke from flowing back and causing the lifting plate 104c to be unable to move and the smoke to be unable to be discharged.

[0054] in addition, Figure 1 - Figure 6 It is only a reference diagram of mechanical transmission and does not represent the final product proportions.

[0055] When in use, first energize the electromagnetic ring 102, and then introduce the smoke from the smoke inlet pipe 101a through the exhaust fan. The metal oxides mixed in the smoke can be adsorbed by the energized electromagnetic ring 102. During the process of smoke introduction, the lifting plate 104c will gradually rise due to the thrust of the smoke. At this time, the sliding rod 104b can drive the moving rod 104a-3 to move upward through the lifting plate 104c. During this process, the spring 104a-2 is in a stretched state, and the smoke can be discharged into the smoke outlet pipe 101c from the gap between the guide arc plate 104c-1 and the guide pipe 101b. After welding is completed, stop energizing the electromagnetic ring 102. At this time, the metal oxides adsorbed on the inner wall of the processing tube 101 will slide along the inner wall of the processing tube 101 to the bottom of the collection box 103. Due to the thrust of the smoke, the lifting plate 104c will move downward due to the reset force of the spring 104a-2 and the action of gravity. During this process, the drainage arc plate 104c-1 can assist in scraping the metal oxides on the inner wall of the treatment tube 101, preventing some metal oxides from condensing with moisture in the air and adhering to the inner wall of the treatment tube 101, thereby achieving a better cleaning effect. As the lifting plate 104c descends, the pressing plate 201b can rotate and press the metal oxides at the bottom of the collection box 103 with the sliding cooperation of the convex shaft 201a and the spiral groove 202a, which has a better crushing and grinding effect, not only can it effectively remove the metal oxides and achieve the purpose of environmental protection, but also the crushing of the metal oxides can facilitate the subsequent recovery of the metal oxides by the staff.

[0056] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values ​​(e.g., temperature, pressure, etc.), installation arrangement, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present invention. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other replacements, modifications, changes and omissions can be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the invention is not limited to a specific embodiment, but extends to numerous modifications still falling within the scope of the appended claims.

[0057] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0058] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0059] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A welding device for producing integrated circuit chips, characterized in that: include, An adsorption assembly (100), the adsorption assembly (100) comprising a processing tube (101), an electromagnetic ring (102) arranged on the circumferential surface of the processing tube (101), a collection box (103) connected to the processing tube (101), and an airflow dynamic member (104) arranged in the inner cavity of the processing tube (101); A grinding assembly (200), the grinding assembly (200) comprising a rotating rod (201) disposed in the inner cavity of the processing tube (101) and a circular ring cover (202) matched with the rotating rod (201); A welding mechanism, the welding mechanism cooperates with the adsorption component (100).

2. The welding device for producing integrated circuit chips according to claim 1, characterized in that: The processing tube (101) comprises a smoke inlet tube (101a), a flow guide tube (101b), a smoke outlet tube (101c) and a threaded groove (101d); the smoke inlet tube (101a) is in communication with the processing tube (101); the flow guide tube (101b) is fixedly connected to the top of the processing tube (101); the smoke outlet tube (101c) is fixedly connected to the top of the flow guide tube (101b); and the threaded groove (101d) is provided at the bottom of the processing tube (101).

3. The welding device for producing integrated circuit chips according to claim 2, characterized in that: The collection box (103) comprises an annular plate (103a), a blanking surface (103b) and a threaded mounting plate (103c); the annular plate (103a) is fixedly connected to the circumferential surface of the collection box (103); the blanking surface (103b) is arranged in the inner cavity of the collection box (103); the threaded mounting plate (103c) is fixedly connected to the top of the collection box (103); and the threaded mounting plate (103c) is threadably matched with the thread groove (101d).

4. The welding device for producing integrated circuit chips according to claim 3, characterized in that: The airflow power component (104) includes a fixed rod (104a), a sliding rod (104b) and a lifting plate (104c), wherein the fixed rod (104a) is fixedly connected to the inner cavity of the processing tube (101), the sliding rod (104b) is slidably connected to a sliding groove opened at the top of the fixed rod (104a), and the lifting plate (104c) is fixedly connected to the top of the sliding rod (104b).

5. The welding device for producing integrated circuit chips according to claim 4, characterized in that: The fixed rod (104a) comprises a notch (104a-1), a spring (104a-2) and a movable rod (104a-3); the notch (104a-1) is opened on one side of the fixed rod (104a); one end of the spring (104a-2) is fixedly connected to the bottom of the notch (104a-1); the movable rod (104a-3) is fixedly connected to the other end of the spring (104a-2); the movable rod (104a-3) is slidably matched with the notch (104a-1); and one end of the rotating rod (201) is rotatably connected to the movable rod (104a-3).

6. The welding device for producing integrated circuit chips according to claim 5, characterized in that: The top of the lifting plate (104c) is fixedly connected with a guide arc plate (104c-1).

7. The welding device for producing integrated circuit chips according to claim 6, characterized in that: The rotating rod (201) comprises a convex shaft (201a) and a pressing plate (201b); the convex shaft (201a) is fixedly connected to the circumferential surface of the rotating rod (201); and the pressing plate (201b) is fixedly connected to the other end of the rotating rod (201).

8. The welding device for producing integrated circuit chips according to claim 7, characterized in that: The annular cover (202) comprises a spiral groove (202a) and a positioning ring (202b), wherein the spiral groove (202a) is formed on the inner wall of the annular cover (202), the convex shaft (201a) is slidably matched with the spiral groove (202a), and the positioning ring (202b) is fixedly connected to the circumferential surface of the annular cover (202).

9. The welding device for producing integrated circuit chips according to claim 8, characterized in that: A connecting rod (202b-1) is fixedly connected to the circumferential surface of the positioning ring (202b), and one end of the connecting rod (202b-1) is fixedly connected to the fixing rod (104a).

10. The welding device for producing integrated circuit chips according to any one of claims 3 to 9, characterized in that: The annular plate (103a) is provided with a hand-holding opening (103a-1) extending therethrough.

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