Measuring instrument and measuring method for measuring thickness of transparent object based on microscopic imaging

By a measuring meter -based measuring instrument, laser incident and optical microscopic imaging technology are used to solve the problem of the traditional measurement method that is difficult to achieve the thickness measurement of high -precision transparent materials, and achieve high -precision, no contact, simple and efficient measurement effects.

CN119354071APending Publication Date: 2025-01-24HUZHOU UNIVERSITY
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Patent Information

Application Number
CN202411481677.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-23
Publication Date
2025-01-24

AI Technical Summary

Technical Problem

Traditional measuring devices and methods are difficult to meet the needs of high-precision measurement of transparent material thickness, especially in terms of resolution and operational complexity.

Method used

A measuring instrument based on microcomposter is used to achieve high precision measurement of the thickness of transparent objects through laser incident mechanisms, multiplier amplification mechanisms and imaging analysis systems. The system does not need to be exposed to samples, using optical micro -imaging technology, with a resolution of 1 micron.

Benefits of technology

The high precision measurement of the thickness of transparent objects can be achieved, and the accuracy can reach 1 micrometer. It avoids damage and pollution of samples, and its operation is simple and efficient.

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Abstract

The invention belongs to the technical field of instrument related equipment, and particularly relates to a measuring instrument and a measuring method for measuring the thickness of a transparent object based on microscopic imaging, and the measuring instrument comprises a laser incidence mechanism which is used for emitting laser; the to-be-measured sample is used for reflecting the laser, and the included angle between the vertical plane where the to-be-measured sample is located and the incident direction of the laser is 45 degrees; the multiplying power amplification mechanism is used for amplifying the distance between the two light spots presented on the sample to be detected; and the imaging analysis system is used for measuring the distance and recording an image. The thickness measuring instrument can be used for measuring the thickness of a sample, the surface of the sample does not need to be contacted, damage and pollution to the sample are avoided, the precision is high, the operation is simple, the manufacturing cost is low, and wider development of the thickness measuring instrument becomes possible.
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Description

Technical Field

[0001] The invention belongs to the technical field of instrument-related equipment, and in particular relates to a measuring instrument and a measuring method for measuring the thickness of a transparent object based on microscopic imaging. Background Art

[0002] In the fields of scientific research, medicine, engineering, etc., measuring the thickness of transparent objects is an important task. Different situations have different requirements for measurement accuracy. Improving measurement accuracy is an inevitable trend in technological development. Contact measurement will cause damage and contamination to the measured object to a certain extent, so non-contact measurement is more popular and has a wider range of applications.

[0003] With the development of micro-nano technology, the demand for high-precision measurement of the thickness of transparent materials (such as optical lenses, films, etc.) is growing. Traditional measurement devices and methods are often limited by resolution, operation complexity or special requirements of the measurement environment and can no longer meet the demand for measurement accuracy. Therefore, it is urgent to develop an efficient, convenient and high-precision transparent object thickness measurement system. Based on this, we propose a measuring instrument and measurement method for transparent object thickness based on microscopic imaging. Summary of the invention

[0004] The purpose of the present invention is to provide a measuring instrument and a measuring method for measuring the thickness of a transparent object based on microscopic imaging, so as to solve the above-mentioned problem.

[0005] To achieve the above object, the present invention provides the following solutions:

[0006] Measuring instruments for measuring the thickness of transparent objects based on microscopic imaging, including:

[0007] A laser injection mechanism, used for emitting laser;

[0008] The sample to be tested is used to reflect the laser, and the included angle between the vertical plane where the sample to be tested is located and the incident direction of the laser is 45°;

[0009] A magnification mechanism, used for magnifying the distance between the two light spots presented on the sample to be tested;

[0010] The imaging analysis system is used to measure the size of the spacing and record images.

[0011] Preferably, the sample to be tested is fixed in a cage cube, and the cage cube is transmission-connected with a translation mechanism, and the translation mechanism is used to drive the sample to be tested to move so that the image collected by the imaging analysis system is clear.

[0012] Preferably, the translation mechanism comprises a three-dimensional translation stage, and the cage cube is fixedly connected to the three-dimensional translation stage.

[0013] Preferably, the laser incident mechanism comprises a laser pen, the emission end of the laser pen is optically connected to the incident end of the single-mode optical fiber, and the output end of the single-mode optical fiber is fixed to the cage cube via a fiber adapter plate.

[0014] Preferably, the magnification magnification mechanism includes a first double-cemented lens and a second double-cemented lens arranged in sequence along the propagation direction of the light path, the first double-cemented lens and the second double-cemented lens are both fixed to the stainless steel cage rod through a cage mounting plate, and the first double-cemented lens, the second double-cemented lens and the receiving end of the imaging analysis system are coaxially arranged.

[0015] Preferably, the imaging analysis system comprises an industrial digital camera, the industrial digital camera is coaxially arranged with the second doublet lens, and the industrial digital camera is electrically connected to a computer terminal.

[0016] A measuring method of a measuring instrument for measuring the thickness of a transparent object based on microscopic imaging, using the above-mentioned measuring instrument for measuring the thickness of a transparent object based on microscopic imaging, comprises the following steps:

[0017] Step 1: installing the sample to be tested;

[0018] Step 2: Turn on the laser incident mechanism to irradiate the sample to be tested at an incident angle of 45°;

[0019] Step 3, opening the receiving end of the imaging analysis system, and forming two light spots in the imaging analysis system through the magnification mechanism;

[0020] Step 4: adjusting the position of the sample to be tested so that the two light spots displayed by the imaging analysis system are condensed;

[0021] Step 5: Start the imaging analysis system to measure the distance between the two condensed light spots, and reversely calculate the thickness of the sample to be measured according to the magnification.

[0022] Preferably, in the step 5, the thickness of the sample to be tested is calculated by the formula H=(D / M)(n^2-1 / 2)^(1 / 2);

[0023] Wherein, H represents the thickness of the sample to be measured, D represents the distance between the two light spots on the receiving end of the imaging analysis system, M represents the magnification of the magnification amplification mechanism, and n represents the refractive index of the transparent material under the laser wavelength conditions used.

[0024] Compared with the prior art, the present invention has the following advantages and technical effects:

[0025] When in use, after installing the sample to be tested; turn on the laser incident mechanism to irradiate the sample to be tested at an incident angle of 45°; turn on the receiving end of the imaging analysis system, and form two light spots in the imaging analysis system through the magnification mechanism; adjust the position of the sample to be tested to make the two light spots displayed by the imaging analysis system solid; start the imaging analysis system to measure the distance between the two solidified light spots, and reversely calculate the thickness of the sample to be tested based on the magnification.

[0026] Compared with traditional thickness measurement methods, this device has the following advantages:

[0027] (1) Non-contact measurement. There is no need to touch the sample surface, and no special treatment is required for the sample, which avoids damage and contamination to the sample. During the entire measurement process, the integrity and original appearance of the sample can be guaranteed, which greatly meets the needs of the market.

[0028] (2) The accuracy can reach 1 micron. This method measures the thickness of transparent samples based on optical microscopy. Since the resolution of optical microscopy is determined by the numerical aperture of the objective lens, when an objective lens with a numerical aperture of 0.25 or above is used, the optical resolution of the measurement system can reach 1 micron.

[0029] (3) Efficient measurement. This method uses the LabVIEW virtual instrument programming environment to write a program to collect image data in real time and analyze the thickness of the sample being measured. It has the characteristics of continuous and rapid measurement, and the efficient display and storage of measurement data. Due to the high degree of automation, it can also greatly reduce the error of manual measurement. The operation interface is simple and easy to use. The software kernel algorithm is simple and can be further converted into a program based on a single-chip microcomputer, so as to transform it into the advantage of lower cost products.

[0030] The invention can be used to measure the thickness of a sample and has the advantages of high implementation feasibility, simple operation, low manufacturing cost, etc., thereby making it possible for the thickness measuring instrument to be more widely developed. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor:

[0032] Figure 1 It is a schematic diagram of the structure of the present invention;

[0033] Figure 2 This is the software operation interface diagram of the present invention;

[0034] Figure 3A logic flow chart for the software program of the present invention to read images and calculate sample thickness;

[0035] Among them, 1. Laser pen; 2. Single-mode optical fiber; 3. Optical fiber adapter plate; 4. Cage cube; 5. Sample to be tested; 6. Three-dimensional translation stage; 7. Cage mounting plate; 8. Stainless steel cage rod; 9. First double glued lens; 10. Second double glued lens; 11. Stainless steel connecting rod; 12. Connecting rod base bracket; 13. Industrial digital camera; 14. Computer terminal. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] Reference Figures 1 to 3 The present invention discloses a measuring instrument for measuring the thickness of a transparent object based on microscopic imaging, comprising:

[0039] A laser injection mechanism, used for emitting laser;

[0040] The sample 5 to be tested is used to reflect the laser, and the included angle between the vertical plane where the sample 5 to be tested is located and the incident direction of the laser is 45°;

[0041] A magnification mechanism, used to magnify the distance between two light spots presented on the sample 5 to be tested;

[0042] Imaging analysis system for measuring gap size and recording images.

[0043] When in use, after installing the sample 5 to be tested; turn on the laser incident mechanism, so that the laser irradiates the sample 5 to be tested at an incident angle of 45°; turn on the receiving end of the imaging analysis system, and form two light spots in the imaging analysis system through the magnification mechanism; adjust the position of the sample 5 to be tested so that the two light spots displayed by the imaging analysis system are condensed; start the imaging analysis system to measure the distance between the two condensed light spots, and reversely calculate the thickness of the sample 5 to be tested according to the magnification. Compared with the traditional thickness measurement method, this device has the following advantages:

[0044] (1) Non-contact measurement. There is no need to touch the sample surface, and no special treatment is required for the sample, which avoids damage and contamination to the sample. During the entire measurement process, the integrity and original appearance of the sample can be guaranteed, which greatly meets the needs of the market.

[0045] (2) The accuracy can reach 1 micron. This method measures the thickness of transparent samples based on optical microscopy. Since the resolution of optical microscopy is determined by the numerical aperture of the objective lens, when an objective lens with a numerical aperture of 0.25 or above is used, the optical resolution of the measurement system can reach 1 micron.

[0046] (3) Efficient measurement. This method uses the LabVIEW virtual instrument programming environment to write a program to collect image data in real time and analyze the thickness of the sample being measured. It has the characteristics of continuous and rapid measurement, and the efficient display and storage of measurement data. Due to the high degree of automation, it can also greatly reduce the error of manual measurement. The operation interface is simple and easy to use. The software kernel algorithm is simple and can be further converted into a program based on a single-chip microcomputer, so as to transform it into the advantage of lower cost products.

[0047] The invention can be used to measure the thickness of a sample and has the advantages of high implementation feasibility, simple operation, low manufacturing cost, etc., thereby making it possible for the thickness measuring instrument to be more widely developed.

[0048] The sample 5 to be tested is a transparent sample.

[0049] According to a further optimization scheme, the sample 5 to be tested is fixed on the cage cube 4, and the cage cube 4 is connected to a translation mechanism for driving the sample 5 to be tested to move so that the image collected by the imaging analysis system is clear.

[0050] The cage cube 4 is preferably a CM1-DCH / M type cage cube.

[0051] The sample 5 to be tested is fixed in the cage cube 4 , and the incident direction of the laser forms an angle of 45 degrees with the surface of the sample 5 to be tested.

[0052] According to a further optimized solution, the translation mechanism includes a three-dimensional translation platform 6 , and the cage cube 4 is fixedly connected to the three-dimensional translation platform 6 .

[0053] The three-dimensional translation stage 6 is preferably a GCM-901640M translation stage.

[0054] When the device is used, the sample 5 to be measured is placed in the cage cube 4, and the three-dimensional translation stage 6 is adjusted to make the measurement applicable to a wider range.

[0055] Furthermore, the fixed end of the three-dimensional translation stage 6 is fixedly installed by a 12.7 mm stainless steel connecting rod 11 and a 12.7 mm connecting rod base bracket 12, and the stainless steel connecting rod 11 and the connecting rod base bracket 12 respectively use metric threads (M4 and M6).

[0056] According to a further optimized solution, the laser incident mechanism comprises a laser pen 1 , the emission end of the laser pen 1 is optically connected to the incident end of the single-mode optical fiber 2 , and the output end of the single-mode optical fiber 2 is fixed to the cage cube 4 through the optical fiber adapter plate 3 .

[0057] The laser pen 1 is preferably a laser pen with a diameter of 2.5 mm and a power of 5 mW.

[0058] The single-mode optical fiber 2 is preferably a P3-630A-FC-2 optical fiber.

[0059] The optical fiber adapter plate 3 is preferably an SM1FCA type optical fiber adapter plate.

[0060] The laser pen 1 emits the laser through the single-mode optical fiber 2 and the optical fiber adapter plate 3 to form a point light source, so that the experimenter can observe the experimental effect.

[0061] A further optimized solution is that the magnification mechanism includes a first double-cemented lens 9 and a second double-cemented lens 10 arranged in sequence along the propagation direction of the light path. The first double-cemented lens 9 and the second double-cemented lens 10 are both fixed to the stainless steel cage rod 8 through a cage mounting plate 7. The first double-cemented lens 9, the second double-cemented lens 10 and the receiving end of the imaging analysis system are coaxially arranged.

[0062] The outer diameter of the stainless steel cage rod 8 is preferably 6 mm.

[0063] The cage mounting plate 7 is preferably a CP33 / M cage mounting plate.

[0064] The first double cemented lens 9 is preferably a GCL-010654A lens with a focal length of 75 mm.

[0065] The second double cemented lens 10 is preferably a GCL-010609A lens with a focal length of 300 mm.

[0066] Two cage mounting plates 7 are installed along the axis by stainless steel cage rods 8 and fixed in the horizontal direction by stainless steel connecting rods 11 and connecting rod base brackets 12. The first double-cemented lens 9 and the second double-cemented lens 10 are coaxially arranged and fixed by the cage mounting plates 7 and the stainless steel cage rods 8 respectively.

[0067] According to a further optimization scheme, the imaging analysis system includes an industrial digital camera 13 , which is coaxially arranged with the second double-cemented lens 10 , and the industrial digital camera 13 is electrically connected to a computer terminal 14 .

[0068] The industrial digital camera 13 is preferably a C2CMOS05100KPA camera.

[0069] The sample to be tested 5 is mounted on the cage cube 4; the cage cube 4 is fixed on the three-dimensional translation stage 6. The single-mode optical fiber 2 outputting the laser is fixed on the cage cube 4 through the optical fiber adapter plate 3. The first double-cemented lens 9, the second double-cemented lens 10 and the industrial digital camera 13 are fixed along the same axis through the cage mounting plate 7 and the stainless steel cage rod 8; the center heights of the first double-cemented lens 9, the second double-cemented lens 10 and the industrial digital camera 13 are ensured to be the same. The first double-cemented lens 9 is adjusted so that the axial distance between it and the center of the optical fiber adapter plate 3 is one times the focal length of the first double-cemented lens 9; the second double-cemented lens 10 is adjusted so that the axial distance between it and the center of the photosensitive chip of the industrial digital camera 13 is equal to one times the focal length of the second double-cemented lens 10; the stainless steel cage rod 8 is adjusted so that the laser output by the optical fiber is reflected by the sample to be tested 5, propagated axially along the first double-cemented lens 9 and the second double-cemented lens 10, and finally converged at the center of the photosensitive chip of the industrial digital camera 13.

[0070] A measuring method of a measuring instrument for measuring the thickness of a transparent object based on microscopic imaging, using the above-mentioned measuring instrument for measuring the thickness of a transparent object based on microscopic imaging, comprises the following steps:

[0071] Step 1: Install the sample 5 to be tested;

[0072] Step 2: Turn on the laser incident mechanism to irradiate the sample 5 to be tested at an incident angle of 45°;

[0073] Step 3: Open the receiving end of the imaging analysis system, and form two light spots in the imaging analysis system through the magnification mechanism;

[0074] Step 4: Adjust the position of the sample 5 to make the two light spots displayed by the imaging analysis system solid;

[0075] Step 5: Start the imaging analysis system to measure the distance between the two condensed light spots, and calculate the thickness of the sample 5 to be measured based on the magnification.

[0076] Further optimizing the scheme, in step 5, the thickness of the sample 5 to be tested is calculated by the formula H = (D / M)(n^2-1 / 2)^(1 / 2);

[0077] Wherein, H represents the thickness of the sample 5 to be measured, D represents the distance between the two light spots on the receiving end of the imaging analysis system, M represents the magnification of the magnification amplification mechanism, and n represents the refractive index of the transparent material under the laser wavelength conditions used.

[0078] A measuring method of a measuring instrument for measuring the thickness of a transparent object based on microscopic imaging comprises the following steps:

[0079] Step 1: Sample loading: Install the sample 5 to be tested on the cage cube 4.

[0080] Step 2: Fixing device; the cage cube 4 is fixed on the three-dimensional translation stage 6. The output end of the single-mode optical fiber 2 of the laser pen 1 is fixed on the cage cube 4 through the optical fiber adapter plate 3. The first double-cemented lens 9, the second double-cemented lens 10 and the industrial digital camera 13 are fixed along the same axis through the cage mounting plate 7 and the stainless steel cage rod 8; ensure that the center heights of the first double-cemented lens 9, the second double-cemented lens 10 and the industrial digital camera 13 are the same. Adjust the first double-cemented lens 9 so that the axial distance between it and the center of the optical fiber output port installed on the optical fiber adapter plate 3 is equal to the focal length of the first double-cemented lens 9; adjust the second double-cemented lens 10 so that the axial distance between it and the center of the photosensitive chip of the industrial digital camera 13 is equal to the focal length of the second double-cemented lens 10; adjust the stainless steel cage rod 8 so that the laser output by the optical fiber is reflected by the sample to be tested 5, propagates axially along the first double-cemented lens 9 and the second double-cemented lens 10, and finally converges at the center of the photosensitive chip of the industrial digital camera 13.

[0081] Measurement principle: At the fiber optic adapter plate 3, the laser output by the single-mode optical fiber 2 is a point light source, and the light emitted by it is reflected by the front and rear surfaces of the sample 5 to be measured to form two virtual image points; the two virtual image points are on the front focal plane of the first double-cemented lens 9, and their distance d in the focal plane is related to the thickness H of the sample 5 to be measured and the incident angle of 45 degrees of the single-mode optical fiber 2 irradiating the sample by the formula H=d(n^2-1 / 2)^(1 / 2); the first double-cemented lens 9 and the second double-cemented lens 10 constitute an enlarged imaging system, and the magnification M needs to be calibrated. In theory, the magnification is the ratio of the focal lengths of the two lenses; therefore, the distance D between the two image points obtained by analyzing the image captured by the camera is D=Md; therefore, the image point distance D obtained by imaging with the industrial digital camera 13 is used to calculate the thickness of the sample 5 to be measured as H=(D / M)(n^2-1 / 2)^(1 / 2).

[0082] Step 3: Run the image processing program through the computer terminal 14; run the image processing executable program to measure the thickness. Only use the mouse to interact with the program to complete the measurement and display the results.

[0083] Step 4: Turn on the laser pen 1 to output laser, adjust the three-dimensional translation stage 6, and change the distance of the sample 5 to be tested relative to the first double-cemented lens 9 along the axial direction of the lens group until the microscopic image displayed on the computer screen is a clear dot matrix.

[0084] Step 5: In the thickness measurement program running in the computer terminal 14, click the "Capture Image" button, and the image display box will display the image currently captured by the camera. If the image points in the image are saturated, click "Capture Image" multiple times until the software automatically adjusts the exposure time to an appropriate size and a regular dot matrix is ​​clearly visible in the image. The image acquisition program is a prior art and will not be described in detail here. Select the rectangular area to be captured based on the picture. Click the upper left corner and lower right corner of the rectangular area to be selected with the left mouse button in turn to obtain two coordinate values, ensuring that the captured rectangular area contains two clear image points. These two points should be located on the left and right sides of the central axis of the captured image, not on the same side. Click the "Capture Image" button, and the display box will display the image of the captured rectangular area. Click the "Thickness Calculation" button, the system will combine the pixel distance between the two points in the image, and write a program based on the thickness calculation formula in the measurement principle. The thickness of the sample to be measured can be directly read by running the calculation program. Click the End Program button to end the measurement. For details of the software interface, see Figure 2 .

[0085] The logical flow of the program is shown in Figure 3 The program obtains the center coordinates of the two image points in the rectangular area (x1, y1) and (x2, y2) through a search algorithm, and calculates D = 2.2*[(x1-x2)^2+(y1-y2)^2]^(1 / 2), its unit is micrometer, and the final thickness calculation formula is H = (D / M)(n^2-1 / 2)^(1 / 2), where n is the refractive index of the transparent material under the laser wavelength conditions used (needs to be measured separately).

[0086] It should be noted that the distance from the output laser port of the single-mode optical fiber 2 fixed on the optical fiber adapter plate 3 to the first double-cemented lens 9 is equal to the focal length of the lens 9, and the photosensitive chip of the industrial digital camera 13 should be located at the right focal plane of the second double-cemented lens 10.

[0087] It should be noted that the light reflected from the front and rear surfaces of the sample 5 to be tested should be at the same center height (same horizontal height) as the lens and the camera.

[0088] It should be noted that when capturing an image, make sure that the captured range contains two clear points. These two points should be located on the left and right sides of the central axis of the captured image, not on the same side.

[0089] It should be noted that the instrument is not recommended to be used in a strong light environment (strong light will affect the laser output by the optical fiber, and the power of the point light source should be less than 1mW).

[0090] Step 5: Post-measurement processing: After the measurement is completed, remove the sample 5 to be measured, turn off the laser pen 1, and disconnect the camera from the computer.

[0091] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0092] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A measuring instrument for measuring the thickness of a transparent object based on microscopic imaging, characterized in that: include: A laser injection mechanism, used for emitting laser; The sample to be tested (5) is used to reflect the laser, and the included angle between the vertical plane where the sample to be tested (5) is located and the incident direction of the laser is 45°; A magnification mechanism, used for magnifying the distance between two light spots presented on the sample to be tested (5); The imaging analysis system is used to measure the size of the spacing and record images.

2. The measuring instrument for measuring the thickness of a transparent object based on microscopic imaging according to claim 1, characterized in that: The sample to be tested (5) is fixed on a cage cube (4), and the cage cube (4) is transmission-connected with a translation mechanism, and the translation mechanism is used to drive the sample to be tested (5) to move so that the image collected by the imaging analysis system is clear.

3. The measuring instrument for measuring the thickness of a transparent object based on microscopic imaging according to claim 2, characterized in that: The translation mechanism comprises a three-dimensional translation platform (6), and the cage cube (4) is fixedly connected to the three-dimensional translation platform (6).

4. The measuring instrument for measuring the thickness of a transparent object based on microscopic imaging according to claim 1, characterized in that: The laser injection mechanism comprises a laser pen (1), the emission end of the laser pen (1) being optically connected to the incident end of the single-mode optical fiber (2), and the output end of the single-mode optical fiber (2) being fixedly connected to the cage cube (4) via an optical fiber adapter plate (3).

5. The measuring instrument for measuring the thickness of a transparent object based on microscopic imaging according to claim 1, characterized in that: The magnification magnification mechanism comprises a first double-cemented lens (9) and a second double-cemented lens (10) which are sequentially arranged along the propagation direction of the light path; the first double-cemented lens (9) and the second double-cemented lens (10) are both fixedly connected to a stainless steel cage rod (8) via a cage mounting plate (7); the first double-cemented lens (9), the second double-cemented lens (10) and a receiving end of the imaging analysis system are coaxially arranged.

6. The measuring instrument for measuring the thickness of a transparent object based on microscopic imaging according to claim 1, characterized in that: The imaging analysis system comprises an industrial digital camera (13), wherein the industrial digital camera (13) is coaxially arranged with the second doublet lens (10), and the industrial digital camera (13) is electrically connected to a computer terminal (14).

7. A measuring method of a measuring instrument for measuring the thickness of a transparent object based on microscopic imaging, using the measuring instrument for measuring the thickness of a transparent object based on microscopic imaging according to any one of claims 1 to 6, characterized in that: The steps include: Step 1: installing the sample to be tested (5); Step 2: Turn on the laser incident mechanism to irradiate the sample (5) to be tested at an incident angle of 45°; Step 3, opening the receiving end of the imaging analysis system, and forming two light spots in the imaging analysis system through the magnification mechanism; Step 4: adjusting the position of the sample to be tested (5) so that the two light spots displayed by the imaging analysis system are solidified; Step 5: Start the imaging analysis system to measure the distance between the two condensed light spots, and inversely calculate the thickness of the sample (5) to be measured according to the magnification.

8. The measuring method of the measuring instrument for measuring the thickness of transparent objects based on microscopic imaging according to claim 7, characterized in that: In the step 5, the thickness of the sample to be tested (5) is calculated by the formula H=(D / M)(n^2-1 / 2)^(1 / 2); Wherein, H represents the thickness of the sample (5) to be measured, D represents the distance between the two light spots on the receiving end of the imaging analysis system, M represents the magnification of the magnification amplification mechanism, and n represents the refractive index of the transparent material under the laser wavelength conditions used.