Manufacturing method of high-precision semi-flexible rigid-flex printed circuit board

Abstract

The invention discloses a manufacturing method of a high-precision semi-flexible rigid-flexible combined board, which comprises the following steps of: sequentially manufacturing a bearing board with a wet film pattern, a windowing prepreg and a windowing core board corresponding to the wet film pattern, and a bending board of which one surface is attached with a covering film corresponding to the wet film pattern and the other surface is attached with an adhesive layer; sequentially stacking and laminating the plate layer and the copper layer from top to bottom to form a laminated plate, removing the aluminum sheet and the adhesive layer on the surface of the laminated plate, and sequentially manufacturing a dry film pasting pattern, a protection copper pattern, a solder mask pattern, an etching protection copper pattern and a dehumidification film removing pattern to form the high-precision semi-flexible rigid-flex printed circuit board; through the manufacturing process of firstly forming a groove, then filling the groove and then removing stuffing, the problem that the milling precision is difficult to control by using a depth-controlled plate milling machining method is avoided; by arranging the covering film and the adhesive layer, a protection effect is formed on the bending layer, and the problems of plate surface pollution and the like are effectively avoided; the whole processing process is simple, high-precision processing can be realized, and the service life of the circuit board is prolonged.

Description

Technical Field

[0001] The invention relates to the field of circuit board manufacturing, and in particular to a method for manufacturing a high-precision semi-flexible rigid-flexible board. Background Art

[0002] For some three-dimensional assembly designs but circuit board application modules that do not require multiple bending, semi-flexible rigid-flex boards are usually used, that is, they only require a partial one-time bending during installation and application.

[0003] The manufacturing method of the semi-flexible rigid-flexible combination board in the prior art is: to process it according to the traditional multi-layer circuit board, and in the molding process, use a controlled depth milling plate to mill off the non-retained layer in the bending area, retain the layer that needs to be bent and conducted, forming a locally "thinned" stepped structure, and the area of ​​the retained layer forms a flexure zone during installation and application.

[0004] However, the above-mentioned manufacturing method of the prior art has certain disadvantages for circuit boards with a relatively thin overall thickness. On the one hand, the depth control milling accuracy is difficult to meet the processing requirements of thin circuit boards, and the problem of too deep or too shallow milling is prone to occur. On the other hand, the semi-cured sheet in the reserved area after the depth control milling is exposed. When bending in subsequent applications, the semi-cured sheet is prone to cracks, breakage and other problems. After long-term use, the semi-cured sheet is prone to aging and chipping, exposing the internal copper layer circuit, causing the circuit to oxidize, thereby reducing the service life of the entire circuit board.

[0005] Therefore, in order to solve the problems raised by the above background technology, it is necessary to provide a method for manufacturing a high-precision semi-flexible rigid-flexible board. Summary of the invention

[0006] The present invention aims to solve the problem that the semi-flexible rigid-flexible board in the prior art requires a thin board body, high precision and other comprehensive performances, and proposes a method for manufacturing a high-precision semi-flexible rigid-flexible board, the manufacturing method comprising the following steps: S10: taking an aluminum sheet, a first copper layer and an adhesive layer, bonding the aluminum sheet and the first copper layer to form a board through the adhesive layer, and then making a wet film pattern on the first copper layer to form a carrier board; S20: taking a prepreg, making a prepreg window pattern corresponding to the wet film pattern, and forming a window prepreg; making a window core board having a core board window pattern, wherein the core board window pattern corresponds to the wet film pattern; S30: manufacturing a bending layer, wherein the bending layer is a prepreg, attaching a cover film to one surface of the prepreg, and attaching an adhesive layer to the other surface to form a bending plate; The covering film corresponds to the window pattern of the core plate; S40: taking the second copper layer, and then stacking the carrier board, the window prepreg, the window core board, the bent board and the second copper layer in order from top to bottom to form a stacked structure, and then pressing them together to form a pressed board; The wet film pattern in the stacked structure is arranged opposite to the covering film; The thickness of the wet film pattern in the laminated plate is equal to the sum of the thickness of the prepreg window pattern and the core plate window pattern; S50: removing the aluminum sheet and the adhesive layer of the laminated plate, and then applying a dry film to the surface of the laminated plate and making a surface circuit pattern to form a circuit pattern board; The manufacturing of the surface circuit pattern includes manufacturing a first protective copper pattern corresponding to the wet film pattern; S60: Making a solder resist pattern on the surface of the circuit pattern board, wherein the solder resist pattern includes making a solder resist window pattern on the surface of the first protective copper pattern, then etching the first protective copper pattern, and then removing the wet film pattern to form the high-precision semi-flexible rigid-flexible board.

[0007] Furthermore, the forming of the carrier board is: taking a thick copper layer, making the wet film pattern on the surface of the thick copper layer, and forming the carrier board; the forming of the circuit pattern board is: thinning the thick copper layer to the thickness of the first copper layer, and then sequentially applying a dry film to the surface of the pressed plate, making a surface circuit pattern, and forming the circuit pattern board.

[0008] Furthermore, a single side of the adhesive layer is larger than the window pattern of the core board.

[0009] Furthermore, the material of the adhesive layer is micro-adhesive.

[0010] Furthermore, the manufacturing of the bending layer is as follows: taking a single-sided copper-clad board, manufacturing a bending copper layer pattern on its copper surface corresponding to the wet film pattern, to form the bending layer.

[0011] Furthermore, the thickness of the bent copper layer pattern is smaller than the thickness of the surface circuit pattern.

[0012] Furthermore, a single side of the bent copper layer pattern is larger than the covering film.

[0013] Furthermore, one side of the covering film is larger than the window pattern of the core board.

[0014] Furthermore, making the surface circuit pattern includes making a second protective copper pattern in a region of the second copper layer corresponding to the glue layer, wherein a single side of the second protective copper pattern is larger than the glue layer.

[0015] Furthermore, the removal of the wet film pattern is to form a blue glue layer in the area outside the first protective copper pattern, etch the first protective copper pattern, remove the wet film pattern, and then peel off the blue glue layer.

[0016] The technical solution of the present invention is to laminate and press together a carrier board with a wet film pattern, a core board with windows corresponding to the wet film pattern in each layer, and a bending board with a covering film corresponding to the wet film pattern, to form a manufacturing process of first forming a groove, then filling the groove, and then removing the filler. This effectively avoids the problems of using a controlled depth milling plate, which is difficult to control the accuracy and is easy to mill the bent plate, resulting in processing failure. By arranging a covering film and an adhesive layer at the position of the bending layer corresponding to the wet film pattern, the bending layer is protected, avoiding cracks and fractures in the semi-cured sheet in the bending application, causing board surface pollution, and other problems. The overall processing process is simple, can achieve high-precision processing, and improves the service life of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 Schematic diagram of the process flow of an embodiment of the present invention; Figure 2 is a schematic cross-sectional view of a stacked structure according to an embodiment of the present invention; Figure 3 is a schematic diagram of the cross-sectional structure of a pressed plate according to an embodiment of the present invention; Figure 4 is a schematic diagram of the cross-sectional structure of a circuit pattern board according to an embodiment of the present invention; Figure 5 It is a schematic diagram of the cross-sectional structure of a high-precision semi-flexible rigid-flexible board according to an embodiment of the present invention.

[0019] Description of Figure Numbers:

[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside...) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0023] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0024] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of a process flow of an embodiment of the present invention, Figure 2 Schematic cross-sectional view of a stacked structure according to an embodiment of the present invention.

[0026] The manufacturing process of the embodiment of the present invention includes using Figure 1 The following will implement the various steps in the process Figure 1 Each step in the process is further explained step by step.

[0027] Step S10: An aluminum sheet 1010, a first copper layer 1020 and an adhesive layer 1030 are taken, and the aluminum sheet 1010 and the first copper layer 1020 are bonded into a board through the adhesive layer 1030, and then a wet film pattern 1040 is made on the first copper layer 1020 to form a carrier board 100. A support structure is formed for the first copper layer 1020 through the aluminum sheet 1010 and the adhesive layer 1020, and the ductility of the aluminum sheet 1010 is used to effectively form an effect of spreading pressure, thereby providing a flat and processable first copper layer 1020 for a thinner circuit board.

[0028] Another implementation method of forming the carrier board 100 is: take a thick copper layer, make a wet film pattern 1040 on the surface of the thick copper layer, and form the carrier board 100; compared with using the aluminum sheet 1010 and the first copper layer 1020 to bond into the carrier board 100 to provide bearing support, the processing of this implementation method is relatively simple, but because the original design requirement of the circuit board is relatively thin, the thick copper layer needs to be thickened in the later process of forming the circuit pattern board to meet the thin plate design requirement of the circuit board, that is, the thick copper layer is thinned to the thickness of the first copper layer 1020, and then the surface of the pressing plate 20 is subjected to subsequent processing such as sticking a dry film and making a surface circuit pattern 3010.

[0029] It is worth noting that the thickness of the above-mentioned thick copper layer is less than or equal to 105 microns. On the one hand, this is to avoid a large difference in the thickness of the copper layers on the two surfaces. In the subsequent pressing process, the pressing plate 20 is prone to a more serious warping problem. On the other hand, the thicker the copper layer, the more etching liquid is needed for copper reduction in the subsequent process, the higher the processing cost, and the more etching waste liquid is generated, which causes serious harm to the environment.

[0030] Furthermore, the material of the adhesive layer 1030 is micro-adhesive, and common materials are epoxy resin colloids and acrylic colloids. It has uniform adhesiveness. On the one hand, it can adhere to the aluminum sheet 1010 and the first copper layer 1020, so that the carrier board 100 is not easy to be offset during the lamination process of the subsequent process, resulting in problems such as layer deviation. On the other hand, when the thickness is reduced in the subsequent process, the micro-adhesive will not completely adhere the aluminum sheet 1010 and the first copper layer 1020, which is easy to tear off and is not easy to leave sticky residues, effectively avoiding tearing damage to the surface of the first copper layer 1020.

[0031] Step S20: Take a prepreg, make a prepreg window pattern 2010 corresponding to the wet film pattern 1040, and form a windowed prepreg 200; make a windowed core board 300 having a core board window pattern 3010, and the core board window pattern 3010 corresponds to the wet film pattern 1040.

[0032] In this embodiment, the windowed semi-cured sheet 200 and the windowed core board 300 form an effective match through the corresponding core board window graphics 3010 and wet film graphics 1040. After the subsequent pressing and bonding process, a flat pressed board surface is formed, which effectively prevents the occurrence of pressing depressions and other problems, and forms a firm circuit board structure.

[0033] It is worth noting that the viscosity of the window semi-cured sheet 200 is greater than that of the adhesive layer 1030, so that when the aluminum sheet 1010 and the adhesive layer 1030 are removed in the subsequent process, the first copper layer 1020 will not be removed at the same time, and it is not easy to tear and damage the first copper layer 1020, resulting in circuit short circuits, circuit board processing failures and other problems.

[0034] Step S30: A bending layer 4010 is manufactured. The bending layer 4010 is a semi-cured sheet. A covering film 4020 is attached to the surface of the semi-cured sheet, and a glue layer 4030 is attached to the other side to form a bending plate 400. That is, the covering film 4020 and the glue layer 4030 are respectively attached to both sides of the bending layer 4010. The glue layer 4030 and the covering film 4020 are attached to the bending layer 4010 to form a combined structure in which the upper and lower surfaces are attached. When bending is applied, it can buffer the bending stress and protect the bending layer 4010. At the same time, it also provides a stable processing layer foundation for the subsequent lamination process and a bending foundation for circuit board applications.

[0035] Furthermore, the covering film 4020 corresponds to the core panel window pattern 3010, that is, the position where the covering film 4020 is attached is the area on the surface of the bending layer 4010 corresponding to the wet film pattern 1040. The pressing plate 20 formed by pressing in the subsequent process makes it easy to separate the wet film pattern 1040 from the covering film 4020, and also provides a processing basis for removing the wet film pattern 1040 in the subsequent process.

[0036] In one embodiment, the bending layer 4010 is made by taking a single-sided copper-clad board, and making a bending copper layer pattern 4010A on its copper surface corresponding to the wet film pattern 1040 to form a bending layer; by setting the bending copper layer pattern 4010A and the covering film 4020, a double upper and lower protection effect is formed for the insulating dielectric layer 4010B, thereby preventing the insulating dielectric layer 4010B from tearing or falling off when being bent, causing problems such as board surface pollution.

[0037] Furthermore, the thickness of the bending copper layer pattern 4010A is less than the thickness of the surface circuit pattern 3010. The thickness of the bending copper layer pattern 4010A is designed to be thinner. On the one hand, the thinner the bending copper layer pattern 4010A is easier to bend, and the better the bendability during the application process. On the other hand, the setting of the bending copper layer pattern 4010A is equivalent to adding a core layer. The increased thickness of the copper layer can provide certain support for the bending, thereby increasing the bending force and the stability after one bending.

[0038] Furthermore, one side of the bent copper layer pattern 4010A is larger than the covering film 4020, so that the bent copper layer pattern 4010A penetrates into the circuit board, thereby avoiding the problem of warping of the edge of the bent copper layer pattern 4010A when bent in later applications, thereby causing the covering film 4020 to bulge locally or even tear, causing pollution to the surface of the circuit board.

[0039] Furthermore, one side of the covering film 4020 is larger than the core board window pattern 3010, forming a structure in which the covering film 4020 penetrates deeply into the interior of the circuit board, and the covering film 4020 is made of PI material, which has high reliability, good bendability, and is not prone to cracks and chipping. It has a long service life and protects the bending layer 4010, preventing the bending layer 4010 from tearing and falling off when bending, causing board surface pollution, and has the effect of extending the service life of the circuit board.

[0040] Furthermore, one side of the adhesive layer 4030 is larger than the core board window pattern 3010, forming a structure in which the adhesive layer 4030 penetrates deeply into the circuit board. The adhesive property of the adhesive layer 4030 is used to disperse stress during the bending process to avoid stress concentration that may cause the bending layer 4010 to break, thereby improving the bending stability of the circuit board and the reliability of the circuit board application.

[0041] In this embodiment, when the covering film 4020, the bent copper pattern 4010A and the adhesive layer 4030 are provided at the same time, the three can be provided to form a "staircase" structure in which each side is smaller than the lower board from top to bottom. This can reduce the height difference of the stacked layers, make the board surface smoother after lamination, and buffer the pressure on the edge of the bending layer 4010 during folding applications, thereby improving the stability of the circuit board structure.

[0042] See also Figure 3 , Figure 3 It is a schematic diagram of the cross-sectional structure of a pressed plate according to an embodiment of the present invention.

[0043] Step S40: Take the second copper layer 500, and then stack the carrier board 100, the window prepreg 200, the window core board 300, the bent board 400 and the second copper layer 500 from top to bottom to form a stacked structure 10, and then press them together to form a pressed board 20. The second copper layer 500 and the aluminum sheet 1010 provide a complete pressing surface for the pressing process, so that the force distribution of the circuit board is uniform during the pressing process, avoiding the pressing deformation of the circuit board due to the different stress caused by the uneven pressing surface, resulting in processing problems such as bent board or warping. Furthermore, the wet film pattern 1040 in the stacked structure 10 is arranged opposite to the cover film 4020 , providing a processing basis for removing the wet film pattern 1040 in a subsequent process.

[0044] Furthermore, the thickness of the wet film pattern 1040 in the laminated board 20 is equal to the sum of the thicknesses of the semi-cured sheet window pattern 2010 and the core board window pattern 3010, thereby ensuring the surface flatness of the laminated board 20 and forming a tightly pressed structure of each layer of core board in the laminated board 20. If the thickness of the wet film pattern 1040 is relatively large, but the sum of the thicknesses of the semi-cured sheet window pattern 2010 and the core board window pattern 3010 is relatively small, it may easily lead to problems such as local bulges of the laminated board 20.

[0045] It is worth mentioning that the material of the prepreg is epoxy resin composite glass fiber, ceramic powder composite epoxy resin, polyimide or polytetrafluoroethylene, and different performance materials can be selected according to different application scenarios and needs.

[0046] See also Figure 4 , Figure 4 It is a schematic diagram of the cross-sectional structure of a circuit pattern board according to an embodiment of the present invention.

[0047] Step S50: The aluminum sheet 1010 and the adhesive layer 1020 of the laminated plate 20 are removed, and then the surface of the laminated plate 20 is sequentially coated with a dry film and a surface circuit pattern 3010 is produced to form a circuit pattern board 30. That is, the aluminum sheet 1010 and the adhesive layer 1020 are used as auxiliary processing layers and need to be removed after the lamination is completed to expose the first copper layer 1030, thereby providing a surface copper layer foundation for etching the copper pattern in the subsequent process.

[0048] Furthermore, the production of the surface circuit pattern 3010 includes producing a first protective copper pattern 3010A corresponding to the wet film pattern 1040. The first protective copper pattern 3010A is used to protect the groove body and the wet film pattern 1040 to prevent ink or chemicals from entering during subsequent processing, thereby providing a smoother processable board surface.

[0049] In one embodiment, making the surface circuit pattern 3010 includes making a second protective copper pattern 3010B in an area of ​​the second copper layer 500 corresponding to the glue layer 4030, and the second protective copper pattern 3010B is larger than the glue layer on one side; when the area of ​​the glue layer 4030 corresponding to the second copper layer 500 has no circuit pattern distributed therein, or has a small amount of circuit pattern distributed therein, the second protective copper pattern 3010B can be made in the area; on the one hand, the combination of the second protective copper pattern 3010B and the glue layer 4030 can enhance the mechanical strength of the circuit board and protect the circuit board from damage during the bending process, thereby enhancing the stability of the circuit board; on the other hand, the circuit board can better withstand stress when being bent, reducing the risk of the copper layer breaking or falling off due to bending, thereby extending the service life of the circuit board.

[0050] See also Figure 5 , Figure 5 It is a schematic diagram of the cross-sectional structure of a high-precision semi-flexible rigid-flexible board according to an embodiment of the present invention.

[0051] Step S60: A solder resist pattern 3020 is produced on the surface of the circuit pattern board 30. The solder resist pattern 3020 includes a solder resist window pattern 3020A produced on the surface of the first protective copper pattern 3010A to expose the first protective copper pattern 3010A, thereby providing a processing basis for etching the first protective copper pattern 3010A and the dehumidification film pattern 1040 in the subsequent process. The first protective copper pattern 3010A is then etched, and the wet film pattern 1040 is removed to form a high-precision semi-flexible rigid-flexible board 40.

[0052] It is worth mentioning that the material of the solder resist pattern 3020 is flexible solder resist ink. On the one hand, the flexible solder resist ink has good insulation properties, which can effectively isolate the circuit from the outside world, prevent short circuits and circuit damage, and play a role in protecting the circuit; on the other hand, the flexible solder resist ink is flexible and will not affect the bending of the high-precision semi-flexible rigid-flexible board 40 during the application process.

[0053] Since a stripping liquid is required to subsequently strip off the wet film pattern 1040, and the stripping liquid will react with the solder resist pattern 3020, the removal method of the wet film pattern 1040 in this embodiment is as follows: a blue glue layer is made in the area outside the first protective copper pattern 3010A. The blue glue layer does not react with the stripping liquid and plays a role in protecting the solder resist pattern 3020. The first protective copper pattern 3010A is then etched, and the wet film pattern 1040 is removed. Finally, the blue glue layer is peeled off to form a high-precision semi-flexible rigid-flexible board 40.

[0054] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a high-precision semi-flexible rigid-flexible board, characterized in that: The production method comprises the following steps: S10: taking an aluminum sheet, a first copper layer and an adhesive layer, bonding the aluminum sheet and the first copper layer to form a board through the adhesive layer, and then making a wet film pattern on the first copper layer to form a carrier board; S20: taking a prepreg, making a prepreg window pattern corresponding to the wet film pattern, and forming a window prepreg; making a window core board having a core board window pattern, wherein the core board window pattern corresponds to the wet film pattern; S30: manufacturing a bending layer, wherein the bending layer is a prepreg, attaching a cover film to one surface of the prepreg, and attaching an adhesive layer to the other surface to form a bending plate; The covering film corresponds to the window pattern of the core plate; S40: taking the second copper layer, and then stacking the carrier board, the window prepreg, the window core board, the bent board and the second copper layer in order from top to bottom to form a stacked structure, and then pressing them together to form a pressed board; The wet film pattern in the stacked structure is arranged opposite to the covering film; The thickness of the wet film pattern in the laminated plate is equal to the sum of the thickness of the prepreg window pattern and the core plate window pattern; S50: removing the aluminum sheet and the adhesive layer of the laminated plate, and then applying a dry film to the surface of the laminated plate and making a surface circuit pattern to form a circuit pattern board; The manufacturing of the surface circuit pattern includes manufacturing a first protective copper pattern corresponding to the wet film pattern; S60: Making a solder resist pattern on the surface of the circuit pattern board, wherein the solder resist pattern includes making a solder resist window pattern on the surface of the first protective copper pattern, then etching the first protective copper pattern, and then removing the wet film pattern to form the high-precision semi-flexible rigid-flexible board.

2. The method for manufacturing a high-precision semi-flexible rigid-flexible board according to claim 1, characterized in that: The forming of the carrier board is as follows: taking a thick copper layer, making the wet film pattern on the surface of the thick copper layer, and forming the carrier board; the forming of the circuit pattern board is as follows: thinning the thick copper layer to the thickness of the first copper layer, and then sequentially applying a dry film to the surface of the pressing plate, making a surface circuit pattern, and forming the circuit pattern board.

3. The method for manufacturing a high-precision semi-flexible rigid-flexible board according to claim 1, characterized in that: The single side of the glue layer is larger than the window pattern of the core board.

4. The method for manufacturing a high-precision semi-flexible rigid-flexible board according to claim 1, characterized in that: The material of the adhesive layer is micro-adhesive.

5. The method for manufacturing a high-precision semi-flexible rigid-flexible board according to claim 1, characterized in that: The method of making the bending layer comprises: taking a single-sided copper-clad board, and making a bending copper layer pattern on the copper surface thereof corresponding to the wet film pattern, so as to form the bending layer.

6. The method for manufacturing a high-precision semi-flexible rigid-flexible board according to claim 5, characterized in that: The thickness of the bent copper layer pattern is smaller than the thickness of the surface circuit pattern.

7. The method for manufacturing a high-precision semi-flexible rigid-flexible board according to claim 5, characterized in that: The single side of the bent copper layer pattern is larger than the covering film.

8. A method for manufacturing a high-precision semi-flexible rigid-flexible board as claimed in claim 1 or 7, characterized in that: The covering film has a single side larger than the core board window pattern.

9. The method for manufacturing a high-precision semi-flexible rigid-flexible board according to claim 1, characterized in that: The manufacturing of the surface circuit pattern includes manufacturing a second protective copper pattern in the area of ​​the second copper layer corresponding to the adhesive layer, wherein a single side of the protective copper pattern is larger than the adhesive layer.

10. The method for manufacturing a high-precision semi-flexible rigid-flexible board according to claim 1, characterized in that: The removing of the wet film pattern is to form a blue glue layer on the area outside the first protective copper pattern, etch the first protective copper pattern, remove the wet film pattern, and then peel off the blue glue layer.

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