Member for semiconductor manufacturing apparatus
By using an insulating sleeve to cover the gas outflow passage on the substrate of the semiconductor manufacturing device, the problem of possible discharge in the gas outflow passage on the substrate is solved, the maintenance process is simplified, and an effective anti-discharge and easy-to-replace design is achieved.
CN119365970APending Publication Date: 2025-01-24NGK INSULATORS LTD
Patent Information
- Application Number
- CN202280005647.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-30
- Publication Date
- 2025-01-24
Smart Images
Figure CN119365970A_ABST
Abstract
A wafer mounting table 10 is provided with: a ceramic plate 20; a conductive substrate 30; a gas common passage 54 provided inside the substrate 30; a plurality of gas outflow passages (56) provided so as to extend from the gas common passage (54) to the wafer placement surface; a gas inflow passage 52 provided so as to communicate with the gas common passage 54 from the lower surface of the substrate 30; and an insulating sleeve (60) which is a single member that is disposed in the substrate through-hole (31) and cannot be separated from the substrate through-hole (31). The insulating sleeve (60) has a first communication hole (64) constituting a part of the gas common passage (54), and a second communication hole (66) provided from the first communication hole (64) to the upper surface of the insulating sleeve (60) and constituting a part of the gas outflow passage (56).
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Citation Information
Patent Citations
Electrostatic chuck
JP2017123396A
Method for manufacturing three-dimensional fired body
WO2020217406A1