Electronic device and multilayer substrate

Abstract

The first radiation conductor layer is provided on the laminate. The second radiation conductor layer is provided on the laminate, is positioned above the first radiation conductor layer, and overlaps the first radiation conductor layer when viewed in the vertical direction. The first floating conductor has a shape that surrounds at least a portion of the periphery of the first radiation conductor layer when viewed in the vertical direction, is located above the first radiation conductor layer and below the second radiation conductor layer in the vertical direction, and is not electrically connected to the conductor present in the laminate. The second floating conductor has a shape that surrounds at least a portion of the periphery of the second radiation conductor layer when viewed in the vertical direction, and is positioned above the second radiation conductor layer.

Description

Technical Field

[0001] The present invention relates to an electronic device and a multilayer substrate including a plurality of radiation conductor layers. Background Art

[0002] As a previous invention regarding electronic equipment, an antenna device described in Patent Document 1 is known. The antenna device includes a patch antenna, a pad member, and a metal ring. The pad member is located above the patch antenna. The metal ring is located above the pad member. When viewed in the vertical direction, the metal ring has a ring shape. The metal ring and the pad member form a waveguide. As a result, the directivity of the patch antenna can be improved.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent No. 4569760 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] However, in the antenna device described in Patent Document 1, when the antenna device includes a plurality of patch antennas, there is a demand to improve the directivity of each of the plurality of patch antennas.

[0008] Therefore, an object of the present invention is to improve the directivity of each of the plurality of radiating conductor layers in an electronic device and a multilayer substrate including the plurality of radiating conductor layers.

[0009] Technical solutions to solve problems

[0010] An electronic device according to one embodiment of the present invention includes:

[0011] Multi-layer substrates; and

[0012] The second floating conductor,

[0013] The multi-layer substrate comprises:

[0014] A laminate having a structure in which a plurality of insulating layers are stacked in a vertical direction;

[0015] A first radiation conductor layer is provided in the laminate;

[0016] a second radiating conductor layer provided in the laminate and located above the first radiating conductor layer and overlapping the first radiating conductor layer as viewed in the up-down direction; and

[0017] a first floating conductor having a shape surrounding at least a portion of the first radiating conductor layer when viewed in the up-down direction, being located above the first radiating conductor layer and below the second radiating conductor layer in the up-down direction, and being not electrically connected to a conductor present in the laminated body,

[0018] The second floating conductor is not electrically connected to a conductor present in the laminate, has a shape surrounding at least a portion of the second radiating conductor layer when viewed in the up-down direction, and is located above the second radiating conductor layer.

[0019] A multilayer substrate according to one embodiment of the present invention includes:

[0020] A laminate having a structure in which a plurality of insulating layers are stacked in a vertical direction;

[0021] A first radiation conductor layer is provided in the laminate;

[0022] a second radiating conductor layer provided in the laminate and located above the first radiating conductor layer and overlapping the first radiating conductor layer as viewed in the up-down direction;

[0023] a first floating conductor having a shape surrounding at least a portion of the first radiating conductor layer when viewed in the up-down direction, being located above the first radiating conductor layer and below the second radiating conductor layer in the up-down direction, and being not electrically connected to a conductor present in the laminate; and

[0024] The second floating conductor has a shape surrounding at least a portion of the second radiating conductor layer when viewed in the up-down direction, is located above the second radiating conductor layer, and is not electrically connected to the conductor present in the laminate.

[0025] Effects of the Invention

[0026] According to the present invention, in an electronic device and a multilayer substrate including a plurality of radiating conductor layers, the directivity of each of the plurality of radiating conductor layers can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is an exploded perspective view of the electronic device 1 .

[0028] Figure 2 yes Figure 1 sectional view of an electronic device 1.

[0029] Figure 3 This is a perspective view of the electronic device 1 from above.

[0030] Figure 4 is a cross-sectional view of the electronic device 1a.

[0031] Figure 5 It is an exploded perspective view of the multi-layer substrate 10b.

[0032] Figure 6 is a cross-sectional view of the multi-layer substrate 10c. DETAILED DESCRIPTION

[0033] (Implementation Method)

[0034] [Structure of electronic device 1]

[0035] Hereinafter, a structure of an electronic device 1 according to an embodiment of the present invention will be described with reference to the drawings. Figure 1 It is an exploded perspective view of the electronic device 1 . Figure 2 yes Figure 1 sectional view of an electronic device 1. Figure 3 This is a perspective view of the electronic device 1 from above.

[0036] Hereinafter, the stacking direction of the stacked body 12 of the electronic device 1 is defined as the up-down direction. The two directions in which the sides of the stacked body 12 extend when the stacked body 12 is observed in the up-down direction are defined as the left-right direction and the front-back direction, respectively. The left-right direction is orthogonal to the up-down direction. The front-back direction is orthogonal to the up-down direction and the left-right direction. In addition, the definition of direction in this specification is an example. Therefore, the direction of the electronic device 1 during actual use and the direction in this specification do not need to be consistent. In addition, in each of the drawings, the up-down direction may also be reversed. Similarly, in each of the drawings, the left-right direction may also be reversed. In each of the drawings, the front-back direction may also be reversed.

[0037] Hereinafter, X is a component or member of the electronic device 1. In this specification, unless otherwise stated, the various parts of X are defined as follows. The front part of X means the front half of X. The rear part of X means the rear half of X. The left part of X means the left half of X. The right part of X means the right half of X. The upper part of X means the upper half of X. The lower part of X means the lower half of X. The front end of X means the front end of X. The rear end of X means the rear end of X. The left end of X means the left end of X. The right end of X means the right end of X. The upper end of X means the upper end of X. The lower end of X means the lower end of X. The front end of X means the front end of X and its vicinity. The rear end of X means the rear end of X and its vicinity. The left end of X means the left end of X and its vicinity. The right end of X means the right end of X and its vicinity. The upper end of X means the upper end of X and its vicinity. The lower end of X means the lower end of X and its vicinity.

[0038] The electronic device 1 is, for example, a wireless communication terminal such as a smart phone. Figure 1 As shown, the electronic device 1 includes a multilayer substrate 10 and a second floating conductor 32. In addition to the multilayer substrate 10 and the second floating conductor 32, the electronic device 1 also includes a housing, a display device, a battery, etc. However, the housing, the display device, the battery, etc. are not shown.

[0039] like Figure 1 As shown, the multilayer substrate 10 includes a laminate 12, a first ground conductor layer 16, a planar ground conductor layer 18, a first radiation conductor layer 20, a second radiation conductor layer 21, external electrodes 24a, 24b, 26a, 26b, 124a, 124b, 126a, 126b, a first floating conductor 31, a third radiation conductor layer 120, a fourth radiation conductor layer 121, and interlayer connection conductors v1 to v8 and v11 to v14.

[0040] The laminate 12 has a plate shape. Figure 1 as well as Figure 2 As shown, the stacked body 12 has a rectangular shape when viewed in the vertical direction. The stacked body 12 has a structure in which insulating layers 14a to 14f are stacked in the vertical direction. The insulating layers 14a to 14f are arranged in order from top to bottom. The material of the insulating layers 14a to 14f is a thermoplastic resin such as polyimide and liquid crystal polymer. Therefore, the stacked body 12 has flexibility.

[0041] The first radiation conductor layer 20 radiates and / or receives the first high frequency signal. The first radiation conductor layer 20 is provided in the laminate 12. In the present embodiment, the first radiation conductor layer 20 is located on the upper main surface of the insulating layer 14c. Figure 1 As shown, the first radiating conductor layer 20 has a rhombus shape having diagonal lines extending in the front-rear direction and the left-right direction when viewed in the vertical direction. The length of one side of the first radiating conductor layer 20 is 1 / 2 of the wavelength of the first high-frequency signal.

[0042] The second radiation conductor layer 21 radiates and / or receives the second high-frequency signal. The second radiation conductor layer 21 is provided on the laminate 12. In the present embodiment, the second radiation conductor layer 21 is located on the upper main surface of the insulating layer 14a. Thus, the second radiation conductor layer 21 is located above the first radiation conductor layer 20. The vertical distance between the second radiation conductor layer 21 and the first radiation conductor layer 20 is 1 / 4 of the wavelength of the second high-frequency signal. The length of one side of the second radiation conductor layer 21 is 1 / 2 of the wavelength of the second high-frequency signal.

[0043] Furthermore, if Figure 3As shown in FIG. 1 , the second radiating conductor layer 21 overlaps the first radiating conductor layer 20 when viewed in the vertical direction. When viewed in the vertical direction, the second radiating conductor layer 21 has a rhombus shape having diagonals extending in the front-back direction and the left-right direction. However, the area of ​​the second radiating conductor layer 21 is smaller than that of the first radiating conductor layer 20. Therefore, when viewed in the vertical direction, the four sides of the first radiating conductor layer 20 do not overlap with the second radiating conductor layer 21. Therefore, the frequency of the second high-frequency signal radiated or received by the second radiating conductor layer 21 is higher than the frequency of the first high-frequency signal radiated or received by the first radiating conductor layer 20.

[0044] The third radiation conductor layer 120 radiates and / or receives a third high frequency signal. The third radiation conductor layer 120 is provided in the laminate 12. In the present embodiment, the third radiation conductor layer 120 is located on the upper main surface of the insulating layer 14c. Figure 1 As shown, the third radiation conductor layer 120 has a rhombus shape having diagonal lines extending in the front-rear direction and the left-right direction when viewed in the vertical direction. The length of one side of the third radiation conductor layer 120 is 1 / 2 of the wavelength of the third high-frequency signal.

[0045] The fourth radiation conductor layer 121 radiates and / or receives a fourth high-frequency signal. The fourth radiation conductor layer 121 is provided on the laminate 12. In the present embodiment, the fourth radiation conductor layer 121 is located on the upper main surface of the insulating layer 14a. Thus, the fourth radiation conductor layer 121 is located above the third radiation conductor layer 120. The vertical distance between the fourth radiation conductor layer 121 and the third radiation conductor layer 120 is 1 / 4 of the wavelength of the fourth high-frequency signal. The length of one side of the fourth radiation conductor layer 121 is 1 / 2 of the wavelength of the fourth high-frequency signal.

[0046] Furthermore, if Figure 3 As shown in FIG. 1 , the fourth radiating conductor layer 121 overlaps the third radiating conductor layer 120 when viewed in the vertical direction. Figure 3 As shown in FIG. 1 , the fourth radiation conductor layer 121 has a rhombus shape having diagonal lines extending in the front-rear direction and the left-right direction when viewed in the vertical direction. However, the area of ​​the fourth radiation conductor layer 121 is smaller than the area of ​​the third radiation conductor layer 120. Therefore, the four sides of the third radiation conductor layer 120 do not overlap with the fourth radiation conductor layer 121 when viewed in the vertical direction. Therefore, the frequency of the fourth high-frequency signal radiated or received by the fourth radiation conductor layer 121 is higher than the frequency of the third high-frequency signal radiated or received by the third radiation conductor layer 120.

[0047] like Figure 1 as well as Figure 2As shown in FIG. 1 , the planar ground conductor layer 18 is provided on the laminate 12. More specifically, the planar ground conductor layer 18 is located below the first radiation conductor layer 20 and the third radiation conductor layer 120. The planar ground conductor layer 18 is provided on the lower main surface of the insulating layer 14f. Figure 1 As shown in FIG. 1 , the planar ground conductor layer 18 has a rectangular shape when viewed in the vertical direction. The long sides of the planar ground conductor layer 18 extend in the left-right direction. The short sides of the planar ground conductor layer 18 extend in the front-back direction. When viewed in the vertical direction, the planar ground conductor layer 18 overlaps with the first radiation conductor layer 20, the second radiation conductor layer 21, the third radiation conductor layer 120, and the fourth radiation conductor layer 121. The planar ground conductor layer 18 is connected to the ground potential.

[0048] The first ground conductor layer 16 is provided on the laminate 12. More specifically, the first ground conductor layer 16 is located above the first radiation conductor layer 20 and the third radiation conductor layer 120. In the present embodiment, the vertical position of the first ground conductor layer 16 is the same as the vertical position of the second radiation conductor layer 21 and the fourth radiation conductor layer 121. Therefore, the first ground conductor layer 16 is located on the upper main surface of the insulating layer 14a.

[0049] Furthermore, when viewed in the up-down direction, the first ground conductor layer 16 does not overlap with the first radiation conductor layer 20, the second radiation conductor layer 21, the third radiation conductor layer 120, and the fourth radiation conductor layer 121. In the present embodiment, when viewed in the up-down direction, the first ground conductor layer 16 has a ring shape surrounding the first radiation conductor layer 20, the second radiation conductor layer 21, the third radiation conductor layer 120, and the fourth radiation conductor layer 121. In the present embodiment, the first ground conductor layer 16 has an outer edge and an inner edge of a rectangular shape having two sides extending in the front-rear direction and two sides extending in the left-right direction.

[0050] The external electrodes 24a, 24b, 26a, 26b, 124a, 124b, 126a, 126b are provided on the lower main surface of the insulating layer 14f. The external electrodes 24a, 24b, 26a, 26b, 124a, 124b, 126a, 126b are not in contact with the planar grounding conductor layer 18. Therefore, the external electrodes 24a, 24b, 26a, 26b, 124a, 124b, 126a, 126b are located in the opening provided in the planar grounding conductor layer 18.

[0051] When viewed in the vertical direction, the external electrodes 24a and 24b overlap the first radiation conductor layer 20. When viewed in the vertical direction, the external electrodes 26a and 26b overlap the second radiation conductor layer 21. A first high-frequency signal is input and output to the external electrodes 24a and 24b. A second high-frequency signal is input and output to the external electrodes 26a and 26b.

[0052] When viewed in the vertical direction, the external electrodes 124a and 124b overlap the third radiation conductor layer 120. When viewed in the vertical direction, the external electrodes 126a and 126b overlap the fourth radiation conductor layer 121. The third high-frequency signal is input and output to the external electrodes 124a and 124b. The fourth high-frequency signal is input and output to the external electrodes 126a and 126b.

[0053] like Figure 3 As shown, the interlayer connection conductor v1 electrically connects the first radiation conductor layer 20 and the external electrode 24a. The interlayer connection conductor v1 penetrates the insulating layers 14c to 14f in the vertical direction. In addition, the interlayer connection conductor v1 is located near the midpoint of the left front side of the first radiation conductor layer 20 when viewed in the vertical direction. In the first radiation conductor layer 20, the point where the interlayer connection conductor v1 contacts is the first feed point P1.

[0054] like Figure 3 As shown, the interlayer connection conductor v2 electrically connects the first radiation conductor layer 20 and the external electrode 24b. The interlayer connection conductor v2 penetrates the insulating layers 14c to 14f in the vertical direction. In addition, the interlayer connection conductor v2 is located near the midpoint of the left rear side of the first radiation conductor layer 20 when viewed in the vertical direction. In the first radiation conductor layer 20, the point where the interlayer connection conductor v2 contacts is the second feed point P2.

[0055] like Figure 3 As shown, the interlayer connection conductor v3 electrically connects the second radiation conductor layer 21 and the external electrode 26a. The interlayer connection conductor v3 penetrates the insulating layers 14a to 14f in the vertical direction. In addition, the interlayer connection conductor v3 is located near the midpoint of the right front side of the second radiation conductor layer 21 when viewed in the vertical direction. In the second radiation conductor layer 21, the point where the interlayer connection conductor v3 contacts is the third feed point P3.

[0056] like Figure 3 As shown, the interlayer connection conductor v4 electrically connects the second radiation conductor layer 21 and the external electrode 26b. The interlayer connection conductor v4 penetrates the insulating layers 14a to 14f in the vertical direction. In addition, the interlayer connection conductor v4 is located near the midpoint of the right rear side of the second radiation conductor layer 21 when viewed in the vertical direction. In the second radiation conductor layer 21, the point where the interlayer connection conductor v4 contacts is the fourth feed point P4.

[0057] like Figure 3 As shown, the interlayer connection conductor v11 electrically connects the third radiation conductor layer 120 and the external electrode 124a. The interlayer connection conductor v11 penetrates the insulating layers 14c to 14f in the vertical direction. In addition, the interlayer connection conductor v11 is located near the midpoint of the left front side of the third radiation conductor layer 120 when viewed in the vertical direction. In the third radiation conductor layer 120, the point that the interlayer connection conductor v11 contacts is the fifth feed point P5.

[0058] like Figure 3 As shown, the interlayer connection conductor v12 electrically connects the third radiation conductor layer 120 and the external electrode 124b. The interlayer connection conductor v12 penetrates the insulating layers 14c to 14f in the vertical direction. In addition, the interlayer connection conductor v12 is located near the midpoint of the left rear side of the third radiation conductor layer 120 when viewed in the vertical direction. In the third radiation conductor layer 120, the point that the interlayer connection conductor v12 contacts is the sixth feed point P6.

[0059] like Figure 3 As shown, the interlayer connection conductor v13 electrically connects the fourth radiation conductor layer 121 and the external electrode 126a. The interlayer connection conductor v13 penetrates the insulating layers 14a to 14f in the vertical direction. In addition, the interlayer connection conductor v13 is located near the midpoint of the right front side of the fourth radiation conductor layer 121 when viewed in the vertical direction. In the fourth radiation conductor layer 121, the point that the interlayer connection conductor v13 contacts is the seventh feed point P7.

[0060] like Figure 3 As shown, the interlayer connection conductor v14 electrically connects the fourth radiation conductor layer 121 and the external electrode 126b. The interlayer connection conductor v14 penetrates the insulating layers 14a to 14f in the vertical direction. In addition, the interlayer connection conductor v14 is located near the midpoint of the right rear side of the fourth radiation conductor layer 121 when viewed in the vertical direction. In the fourth radiation conductor layer 121, the point that the interlayer connection conductor v14 contacts is the eighth feed point P8.

[0061] The interlayer connection conductors v5 to v8 electrically connect the first ground conductor layer 16 and the planar ground conductor layer 18. The interlayer connection conductors v5 to v8 each penetrate the insulating layers 14a to 14f in the up-down direction.

[0062] The first floating conductor 31 is provided in the laminated body 12. The first floating conductor 31 is located above the first radiating conductor layer 20 and below the second radiating conductor layer 21 in the up-down direction.

[0063] In this embodiment, if Figure 1As shown, the first floating conductor 31 includes an upper floating conductor layer 311, a lower floating conductor layer 312, and interlayer connection conductors v21 to v24. The upper floating conductor layer 311 is located on the upper surface of the stack 12. Therefore, the upper floating conductor layer 311 is located on the upper main surface of the insulating layer 14a. When viewed in the up-down direction, the upper floating conductor layer 311 has a rectangular shape. The long side of the upper floating conductor layer 311 extends in the left-right direction. The short side of the upper floating conductor layer 311 extends in the front-back direction.

[0064] In addition, openings Op1 and Op11 are provided in the upper floating conductor layer 311. The openings Op1 and Op11 are arranged in order from left to right. The openings Op1 and Op11 have a rhombus shape having diagonal lines extending in the front-back direction and the left-right direction. Furthermore, when viewed in the up-down direction, the entire first radiation conductor layer 20 and the entire second radiation conductor layer 21 are located in the opening Op1. When viewed in the up-down direction, the entire third radiation conductor layer 120 and the entire fourth radiation conductor layer 121 are located in the opening Op11.

[0065] The lower floating conductor layer 312 is provided in the laminate 12. The lower floating conductor layer 312 is located below the upper floating conductor layer 311. Therefore, the lower floating conductor layer 312 is located on the upper main surface of the insulator layer 14c. When viewed in the up-down direction, the lower floating conductor layer 312 has a rectangular shape. The long side of the lower floating conductor layer 312 extends in the left-right direction. The short side of the lower floating conductor layer 312 extends in the front-back direction.

[0066] In addition, the lower floating conductor layer 312 is provided with openings Op2 and Op12. The openings Op2 and Op12 are arranged in order from left to right. The openings Op2 and Op12 have a rhombus shape having diagonal lines extending in the front-rear direction and the left-right direction. Furthermore, as viewed in the vertical direction, the entire first radiation conductor layer 20 and the entire second radiation conductor layer 21 are located in the opening Op2. As viewed in the vertical direction, the entire third radiation conductor layer 120 and the entire fourth radiation conductor layer 121 are located in the opening Op12. Thus, as viewed in the vertical direction, the first floating conductor 31 has a shape surrounding at least a portion of the first radiation conductor layer 20 and at least a portion of the third radiation conductor layer 120. In the present embodiment, as viewed in the vertical direction, the first floating conductor 31 has a ring shape surrounding the first radiation conductor layer 20. As viewed in the vertical direction, the first floating conductor 31 has a ring shape surrounding the third radiation conductor layer 120.

[0067] The interlayer connection conductors v21 to v24 electrically connect the upper floating conductor layer 311 and the lower floating conductor layer 312. The interlayer connection conductors v21 to v24 each penetrate the insulating layers 14a and 14b in the up-down direction.

[0068] The first floating conductor 31 as described above has a floating potential. Therefore, the first floating conductor 31 is not connected to the ground potential or the power supply potential. In addition, no high-frequency signal is transmitted in the first floating conductor 31. Therefore, the first floating conductor 31 is not electrically connected to the conductor existing in the stack 12. The conductor existing in the stack 12 is, for example, a conductor that transmits a high-frequency signal and a ground conductor connected to the ground potential.

[0069] By providing the first floating conductor 31, Figure 2 As shown, the first waveguide X1 is formed in a region surrounded by the first radiating conductor layer 20, the second radiating conductor layer 21, and the first floating conductor 31. The third waveguide X3 is formed in a region surrounded by the third radiating conductor layer 120, the fourth radiating conductor layer 121, and the first floating conductor 31.

[0070] The first ground conductor layer 16, the planar ground conductor layer 18, the first radiation conductor layer 20, the second radiation conductor layer 21, the external electrodes 24a, 24b, 26a, 26b, 124a, 124b, 126a, 126b, the third radiation conductor layer 120, the fourth radiation conductor layer 121, the upper floating conductor layer 311, and the lower floating conductor layer 312 are formed, for example, by patterning a metal foil attached to the upper main surface or the lower main surface of the insulating layers 14a to 14f. The metal is, for example, copper. In addition, the interlayer connection conductors v1 to v8, v11 to v14, and v21 to v24 are, for example, through-hole conductors. The through-hole conductors are formed by forming through-holes in the insulating layers 14a to 14f, filling the through-holes with a conductive paste, and sintering the conductive paste.

[0071] The second floating conductor 32 is not provided on the laminate 12. The second floating conductor 32 is located above the laminate 12. Thus, the second floating conductor 32 is located above the second radiation conductor layer 21 and the fourth radiation conductor layer 121. The distance L1 between the second floating conductor 32 and the second radiation conductor layer 21 is, for example, less than 1 / 2 of the wavelength of the second high-frequency signal. The wavelength of the second high-frequency signal is the wavelength in air.

[0072] The second floating conductor 32 overlaps the laminate 12 when viewed in the vertical direction. The second floating conductor 32 has a plate shape having an upper main surface and a lower main surface. When viewed in the vertical direction, the second floating conductor 32 has a rectangular shape. The long side of the second floating conductor 32 extends in the left-right direction. The short side of the second floating conductor 32 extends in the front-back direction.

[0073] The second floating conductor 32 is provided with openings Op3 and Op13. The openings Op3 and Op13 are arranged in order from left to right. The openings Op3 and Op13 have a rhombus shape having diagonal lines extending in the front-rear direction and the left-right direction. Furthermore, the second radiation conductor layer 21 is located in the opening Op3 when viewed in the vertical direction. The fourth radiation conductor layer 121 is located in the opening Op13 when viewed in the vertical direction. Thus, the second floating conductor 32 has a shape surrounding at least a portion of the second radiation conductor layer 21 and at least a portion of the fourth radiation conductor layer 121 when viewed in the vertical direction. In the present embodiment, the second floating conductor 32 has a ring shape surrounding the second radiation conductor layer 21 when viewed in the vertical direction. The second floating conductor 32 has a ring shape surrounding the fourth radiation conductor layer 121 when viewed in the vertical direction.

[0074] Furthermore, the first radiating conductor layer 20 is located in the opening Op3 when viewed in the vertical direction. The third radiating conductor layer 120 is located in the opening Op13 when viewed in the vertical direction. Thus, the second floating conductor 32 has a shape surrounding at least a portion of the first radiating conductor layer 20 and at least a portion of the third radiating conductor layer 120 when viewed in the vertical direction. In the present embodiment, the second floating conductor 32 has a ring shape surrounding the first radiating conductor layer 20 when viewed in the vertical direction. The second floating conductor 32 has a ring shape surrounding the third radiating conductor layer 120 when viewed in the vertical direction.

[0075] In addition, if Figure 3 As shown, when viewed in the vertical direction, the openings Op1 and Op2 surrounded by the first floating conductor 31 are contained in the opening Op3 surrounded by the second floating conductor 32. When viewed in the vertical direction, the openings Op11 and Op12 surrounded by the first floating conductor 31 are contained in the opening Op13 surrounded by the second floating conductor 32.

[0076] The second floating conductor 32 as described above has a floating potential. Therefore, the second floating conductor 32 is not connected to the ground potential or the power supply potential. In addition, no high-frequency signal is transmitted in the second floating conductor 32. Therefore, the second floating conductor 32 is not electrically connected to the conductor existing in the stack 12. The conductor existing in the stack 12 is, for example, a conductor that transmits a high-frequency signal and a ground conductor connected to the ground potential.

[0077] The second floating conductor 32 is a metal plate. Examples of the metal include SUS (Steel Use Stainless Steel), copper, etc. In the present embodiment, the second floating conductor 32 is adhered to a glass plate (not shown) by an adhesive.

[0078] By providing the second floating conductor 32, Figure 2 As shown, the second waveguide X2 is formed in a region surrounded by the second radiating conductor layer 21 and the first floating conductor 31. The fourth waveguide X4 is formed in a region surrounded by the fourth radiating conductor layer 121 and the first floating conductor 31.

[0079] However, the first waveguide X1, the second waveguide X2, the third waveguide X3, and the fourth waveguide X4 each have a cutoff frequency. The cutoff frequency is the upper limit of the frequency band of the high-frequency signal that can pass through the first waveguide X1, the second waveguide X2, the third waveguide X3, and the fourth waveguide X4. The cutoff frequency of the first waveguide X1 is lower than the frequency of the first high-frequency signal. The cutoff frequency of the second waveguide X2 is lower than the frequency of the first high-frequency signal and the frequency of the second high-frequency signal. The cutoff frequency of the third waveguide X3 is lower than the frequency of the third high-frequency signal. The cutoff frequency of the fourth waveguide X4 is lower than the frequency of the third high-frequency signal and the frequency of the fourth high-frequency signal.

[0080] The cutoff frequencies of the first waveguide X1, the second waveguide X2, the third waveguide X3, and the fourth waveguide X4 depend on the sizes of the openings Op1, Op3, Op11, and Op13, respectively. Therefore, the sizes of the opening Op1 in the front-to-back direction and the left-to-right direction are respectively longer than half of the wavelength of the first high-frequency signal. The sizes of the opening Op3 in the front-to-back direction and the left-to-right direction are respectively longer than half of the wavelength of the first high-frequency signal and half of the wavelength of the second high-frequency signal. The sizes of the opening Op11 in the front-to-back direction and the left-to-right direction are respectively longer than half of the wavelength of the third high-frequency signal. The sizes of the opening Op13 in the front-to-back direction and the left-to-right direction are respectively longer than half of the wavelength of the third high-frequency signal and half of the wavelength of the fourth high-frequency signal. In the present embodiment, the sizes of the openings Op1, Op3, Op11, and Op13 in the front-to-back direction and the left-to-right direction are 0.45 mm.

[0081] In the electronic device 1 as described above, the first ground conductor layer 16, the planar ground conductor layer 18, and the first radiating conductor layer 20 function as a patch antenna that radiates or receives a first high-frequency signal. In addition, the first ground conductor layer 16, the planar ground conductor layer 18, and the second radiating conductor layer 21 function as a patch antenna that radiates or receives a second high-frequency signal. The first ground conductor layer 16, the planar ground conductor layer 18, and the third radiating conductor layer 120 function as a patch antenna that radiates or receives a third high-frequency signal. The first ground conductor layer 16, the planar ground conductor layer 18, and the fourth radiating conductor layer 121 function as a patch antenna that radiates or receives a fourth high-frequency signal.

[0082] (Effect)

[0083] According to the electronic device 1, the directivity of each of the first radiating conductor layer 20 and the second radiating conductor layer 21 can be improved. More specifically, the first floating conductor 31 has a shape that surrounds at least a portion of the periphery of the first radiating conductor layer 20 when viewed in the vertical direction. The first floating conductor 31 is located above the first radiating conductor layer 20 and below the second radiating conductor layer 21 in the vertical direction. In addition, the first floating conductor 31 is not electrically connected to a conductor present in the laminate 12. Thus, the first waveguide X1 is formed in a region surrounded by the first radiating conductor layer 20, the second radiating conductor layer 21, and the first floating conductor 31. Such a first waveguide X1 restricts the first high-frequency signal radiated from the first radiating conductor layer 20 from excessively spreading in the front-back direction and the left-right direction. In addition, the first waveguide X1 restricts the passing region of the first high-frequency signal that can be received by the first radiating conductor layer 20. That is, the first waveguide X1 improves the directivity of the first radiating conductor layer 20.

[0084] Furthermore, the second floating conductor 32 has a shape that surrounds at least a portion of the second radiation conductor layer 21 when viewed in the vertical direction. The second floating conductor 32 is located above the second radiation conductor layer 21. Thus, a second waveguide X2 is formed in a region surrounded by the second radiation conductor layer 21 and the first floating conductor 31. Such a second waveguide X2 restricts the second high-frequency signal radiated from the second radiation conductor layer 21 from excessively spreading in the front-back direction and the left-right direction. In addition, the second waveguide X2 restricts the passage region of the second high-frequency signal that can be received by the second radiation conductor layer 21. That is, the second waveguide X2 improves the directivity of the second radiation conductor layer 21. For the same reason, the directivity of the third radiation conductor layer 120 and the directivity of the fourth radiation conductor layer 121 are improved.

[0085] According to the electronic device 1, it is possible to suppress the size increase of the electronic device 1. When viewed in the vertical direction, the second radiation conductor layer 21 overlaps the first radiation conductor layer 20. Therefore, when viewed in the vertical direction, the electronic device 1 is less likely to be larger than an electronic device in which two radiation conductors are arranged in the front-rear direction or the left-right direction.

[0086] According to the electronic device 1, the first floating conductor 31 has a ring shape surrounding the first radiation conductor layer 20 when viewed in the vertical direction. This further improves the directivity of the first radiation conductor layer 20. For the same reason, the directivity of the second radiation conductor layer 21, the directivity of the third radiation conductor layer 120, and the directivity of the fourth radiation conductor layer 121 are improved.

[0087] According to the electronic device 1, the opening Op1 surrounded by the first floating conductor 31 is contained in the opening Op3 surrounded by the second floating conductor 32 when viewed in the vertical direction. Therefore, the area of ​​the opening Op3 is larger than the area of ​​the opening Op1. As a result, the first high-frequency signal radiated by the first radiating conductor layer 20 is less likely to be blocked by the second floating conductor 32. The reception of the first high-frequency signal by the first radiating conductor layer 20 is less likely to be blocked by the second floating conductor 32. Therefore, the directivity of the first radiating conductor layer 20 depends on the shape of the opening Op1 and is less likely to depend on the shape of the opening Op3. For the same reason, the directivity of the fourth radiating conductor layer 121 depends on the shape of the opening Op11 and is less likely to depend on the shape of the opening Op13.

[0088] According to the electronic device 1, the antenna gain of the first radiating conductor layer 20 in the first polarization wave and the antenna gain of the first radiating conductor layer 20 in the second polarization wave can be made close to each other. More specifically, the first radiating conductor layer 20 radiates and receives the first high-frequency signal of the first polarization wave at the first feeding point P1. The first radiating conductor layer 20 radiates and receives the first high-frequency signal of the second polarization wave at the second feeding point P2. In order to make the antenna gain of the first radiating conductor layer 20 in the first polarization wave and the antenna gain of the first radiating conductor layer 20 in the second polarization wave close to each other, the distance from the first feeding point P1 to the first ground conductor layer 16 and the distance from the second feeding point P2 to the first ground conductor layer 16 can be made close to each other.

[0089] Therefore, in the electronic device 1, if Figure 3 As shown in FIG. 1 , the first radiation conductor layer 20 and the second radiation conductor layer 21 have a rhombus shape having diagonal lines extending in the left-right direction and the front-back direction when viewed in the vertical direction. Furthermore, the first ground conductor layer 16 is located on the left, front, and back of the first radiation conductor layer 20 and the second radiation conductor layer 21 when viewed in the vertical direction. Thus, the distance from the first feed point P1 to the first ground conductor layer 16 and the distance from the second feed point P2 to the first ground conductor layer 16 become equal to each other. As a result, according to the multilayer substrate 10, the antenna gain of the first radiation conductor layer 20 in the first polarization wave and the antenna gain of the first radiation conductor layer 20 in the second polarization wave can be made close to each other. In addition, for the same reason, according to the multilayer substrate 10, the antenna gain of the second radiation conductor layer 21 in the first polarization wave and the antenna gain of the second radiation conductor layer 21 in the second polarization wave can be made close to each other.

[0090] According to the electronic device 1, air exists between the laminate 12 and the second floating conductor 32. Thus, the dielectric constant of the space above the first radiation conductor layer 20, the second radiation conductor layer 21, the third radiation conductor layer 120, and the fourth radiation conductor layer 121 is reduced. As a result, the dielectric loss generated in the electronic device 1 can be reduced.

[0091] (First Modification)

[0092] Hereinafter, an electronic device 1 a according to a first modification will be described with reference to the drawings. Figure 4 is a cross-sectional view of the electronic device 1a.

[0093] The difference between the electronic device 1a and the electronic device 1 is that the multilayer substrate 10a further includes a protective layer 15. The protective layer 15 has a dielectric constant higher than the dielectric constant of the insulating layers 14a to 14f. The protective layer 15 covers the upper surface of the laminate 12. No conductor layer is provided on the upper surface of the protective layer 15. Such a protective layer 15 protects the conductor layer located on the upper main surface of the insulating layer 14a. The other structures of the electronic device 1a are the same as those of the electronic device 1, so the description is omitted. In addition, the electronic device 1a can achieve the same effects as the electronic device 1.

[0094] According to the electronic device 1a, the protective layer 15 has a high dielectric constant, so the wavelength shortening effect is produced in the second waveguide X2. As a result, the cutoff frequency of the second waveguide X2 becomes higher. In this way, by providing the protective layer 15, the cutoff frequency of the second waveguide X2 can be adjusted. For the same reason, by providing the protective layer 15, the cutoff frequency of the fourth waveguide X4 can be adjusted.

[0095] (Second modification)

[0096] Hereinafter, a multilayer substrate 10b according to a second modification will be described with reference to the drawings. Figure 5 It is an exploded perspective view of the multi-layer substrate 10b.

[0097] The multilayer substrate 10b is different from the multilayer substrate 10 in that the multilayer substrate 10b includes a second floating conductor 32. More specifically, the laminate 12 further includes an insulating layer 14g. The insulating layer 14g is located above the insulating layer 14a.

[0098] The second floating conductor 32 is located on the upper main surface of the insulating layer 14a. The second floating conductor 32 is a conductor layer. Therefore, the second floating conductor 32 of the multilayer substrate 10b is different from the second floating conductor 32 of the electronic device 1 in thickness. However, except for the thickness, the structure of the second floating conductor 32 of the multilayer substrate 10b is the same as the second floating conductor 32 of the electronic device 1.

[0099] The interlayer connection conductors v21 to v24 penetrate the insulating layers 14g, 14a, and 14b in the vertical direction. Thus, the second floating conductor 32 is electrically connected to the first floating conductor 31 through the interlayer connection conductors v21 to v24. The other structures of the multilayer substrate 10b are the same as those of the electronic device 1, so the description is omitted. The multilayer substrate 10b can achieve the same effects as those of the electronic device 1. In addition, the multilayer substrate 10b has the second floating conductor 32, so it can be miniaturized compared to the electronic device 1.

[0100] (Third Modification)

[0101] Hereinafter, a multilayer substrate 10c according to a third modification will be described with reference to the drawings. Figure 6 is a cross-sectional view of the multi-layer substrate 10c.

[0102] The multilayer substrate 10c is different from the multilayer substrate 10b in that it further includes a protective layer 15. The protective layer 15 has a dielectric constant higher than the dielectric constant of the insulating layers 14a to 14f. The protective layer 15 covers the upper surface of the laminate 12. No conductor layer is provided on the upper surface of the protective layer 15. Such a protective layer 15 protects the conductor layer located on the upper main surface of the insulating layer 14a. The other structures of the multilayer substrate 10c are the same as those of the multilayer substrate 10b, so the description is omitted. In addition, the multilayer substrate 10c can achieve the same effects as the multilayer substrate 10b.

[0103] According to the multilayer substrate 10c, the protective layer 15 has a high dielectric constant, so the wavelength shortening effect is produced in the second waveguide X2. As a result, the cutoff frequency of the second waveguide X2 becomes higher. In this way, by providing the protective layer 15, the cutoff frequency of the second waveguide X2 can be adjusted. For the same reason, by providing the protective layer 15, the cutoff frequency of the fourth waveguide X4 can be adjusted.

[0104] (Other Implementations)

[0105] The electronic device according to the present invention is not limited to the electronic devices 1 and 1a, and can be modified within the scope of the gist thereof. In addition, the structures of the electronic devices 1 and 1a can be arbitrarily combined.

[0106] The multilayer substrate according to the present invention is not limited to the multilayer substrates 10b and 10c, and can be modified within the scope of the gist thereof. In addition, the structures of the multilayer substrates 10b and 10c can be arbitrarily combined.

[0107] The third radiation conductor layer 120 and the fourth radiation conductor layer 121 are not essential components.

[0108] Furthermore, the frequency of the electromagnetic waves radiated or received by the second radiating conductor layer 21 may be higher than the frequency of the electromagnetic waves radiated or received by the first radiating conductor layer 20 , or the area of ​​the second radiating conductor layer 21 may be smaller than the area of ​​the first radiating conductor layer 20 .

[0109] Furthermore, the frequency of the electromagnetic wave radiated or received by the fourth radiating conductor layer 121 may be higher than the frequency of the electromagnetic wave radiated or received by the third radiating conductor layer 120 , or the area of ​​the fourth radiating conductor layer 121 may be smaller than the area of ​​the third radiating conductor layer 120 .

[0110] Alternatively, only one of the interlayer connection conductors v1 and v2 may be provided. Alternatively, only one of the interlayer connection conductors v3 and v4 may be provided.

[0111] Alternatively, only the interlayer connection conductor v1 may be provided. In this case, the interlayer connection conductor v1 is connected to both the first radiation conductor layer 20 and the second radiation conductor layer 21, and is connected to the external electrode 24a. Both the first high-frequency signal and the second high-frequency signal are input and output to the external electrode 24a. When the first radiation conductor layer 20 receives the first high-frequency signal and the second radiation conductor layer 21 receives the second high-frequency signal, for example, a duplexer is connected to the external electrode 24a. The duplexer separates the first high-frequency signal from the second high-frequency signal.

[0112] In addition, the first ground conductor layer 16 does not need to have a ring shape.

[0113] In addition, the first ground conductor layer 16 and the planar ground conductor layer 18 are not essential components.

[0114] Furthermore, the first floating conductor 31 may not have a ring shape surrounding the first radiating conductor layer 20 when viewed in the vertical direction. The first floating conductor 31 may have a shape surrounding at least a portion of the first radiating conductor layer 20 when viewed in the vertical direction.

[0115] Furthermore, the first floating conductor 31 may not have a ring shape surrounding the third radiating conductor layer 120 when viewed in the vertical direction. The first floating conductor 31 may have a shape surrounding at least a portion of the third radiating conductor layer 120 when viewed in the vertical direction.

[0116] Furthermore, the second floating conductor 32 may not have a ring shape surrounding the second radiating conductor layer 21 when viewed in the vertical direction. The second floating conductor 32 may have a shape surrounding at least a portion of the second radiating conductor layer 21 when viewed in the vertical direction.

[0117] Furthermore, the second floating conductor 32 may not have a ring shape surrounding the fourth radiating conductor layer 121 when viewed in the vertical direction. The second floating conductor 32 may have a shape surrounding at least a portion of the fourth radiating conductor layer 121 when viewed in the vertical direction.

[0118] Furthermore, when viewed in the up-down direction, the opening Op2 surrounded by the first floating conductor 31 may not be included in the opening Op3 surrounded by the second floating conductor 32 .

[0119] Furthermore, the first radiating conductor layer 20 and the second radiating conductor layer 21 may have a shape other than a rhombus shape having diagonals extending in the front-rear direction and the left-right direction when viewed in the vertical direction. The first radiating conductor layer 20 and the second radiating conductor layer 21 may have a circular shape when viewed in the vertical direction.

[0120] In addition, the first floating conductor 31 may not include an interlayer connection conductor. In this case, the first floating conductor 31 is, for example, one conductor layer.

[0121] In addition, in the multi-layer substrates 10 b and 10 c , the first floating conductor 31 and the second floating conductor 32 may not be electrically connected.

[0122] The number of interlayer connection conductors electrically connecting the upper floating conductor layer 311 and the lower floating conductor layer 312 is not limited to 4. The number of interlayer connection conductors electrically connecting the upper floating conductor layer 311 and the lower floating conductor layer 312 may be one or more.

[0123] In addition, although the interlayer connection conductors v21 to v24 penetrate the insulating layers 14 a and 14 b in the vertical direction, they may penetrate one or more insulating layers in the vertical direction.

[0124] In addition, the frequency of the first high frequency signal, the frequency of the second high frequency signal, the frequency of the third high frequency signal, and the frequency of the fourth high frequency signal are different from each other. However, the frequency of the first high frequency signal and the frequency of the third high frequency signal may be equal, and the frequency of the second high frequency signal and the frequency of the fourth high frequency signal may be equal.

[0125] The present invention has the following structures. (1)

[0127] An electronic device comprising:

[0128] Multi-layer substrates; and

[0129] The second floating conductor,

[0130] The multi-layer substrate comprises:

[0131] A laminated body having a structure stacked in an up-and-down direction;

[0132] A first radiation conductor layer is provided in the laminate;

[0133] a second radiating conductor layer provided in the laminate and located above the first radiating conductor layer and overlapping the first radiating conductor layer as viewed in the up-down direction; and

[0134] a first floating conductor having a shape surrounding at least a portion of the first radiating conductor layer when viewed in the up-down direction, being located above the first radiating conductor layer and below the second radiating conductor layer in the up-down direction, and being not electrically connected to a conductor present in the laminated body,

[0135] The second floating conductor is not electrically connected to a conductor present in the laminate, has a shape surrounding at least a portion of the second radiating conductor layer when viewed in the up-down direction, and is located above the second radiating conductor layer. (2)

[0137] The electronic device according to (1), wherein:

[0138] The frequency of electromagnetic waves radiated or received by the second radiating conductor layer is higher than the frequency of electromagnetic waves radiated or received by the first radiating conductor layer, or the area of ​​the second radiating conductor layer is smaller than the area of ​​the first radiating conductor layer. (3)

[0140] The electronic device according to (1) or (2), wherein:

[0141] The first floating conductor has a ring shape surrounding the first radiation conductor layer when viewed in the up-down direction. (4)

[0143] The electronic device according to (3), wherein:

[0144] The second floating conductor has a ring shape surrounding the second radiation conductor layer when viewed in the up-down direction. (5)

[0146] The electronic device according to (4), wherein:

[0147] When viewed in the up-down direction, the opening surrounded by the first floating conductor is accommodated in the opening surrounded by the second floating conductor. (6)

[0149] The electronic device according to any one of (1) to (5), wherein:

[0150] have:

[0151] A third radiation conductor layer is provided in the laminate; and

[0152] a fourth radiating conductor layer provided in the laminate and located above the third radiating conductor layer and overlapping the third radiating conductor layer when viewed in the vertical direction;

[0153] The first floating conductor has a shape surrounding at least a portion of the third radiation conductor layer when viewed in the vertical direction.

[0154] The second floating conductor has a shape surrounding at least a portion of the fourth radiation conductor layer when viewed in the up-down direction. (7)

[0156] The electronic device according to any one of (1) to (6), wherein:

[0157] When viewed in the up-down direction, the first radiation conductor layer and the second radiation conductor layer have a rhombus shape having diagonal lines extending in the front-back direction and the left-right direction. (8)

[0159] The electronic device according to any one of (1) to (7), wherein:

[0160] The first floating conductor includes one or more interlayer connection conductors penetrating one or more insulating layers in the up-down direction. (9)

[0162] The electronic device according to (8), wherein:

[0163] The first floating conductor includes an upper floating conductor layer located on the upper surface of the laminate and a lower floating conductor layer located below the upper floating conductor layer.

[0164] The one or more interlayer connection conductors electrically connect the upper floating conductor layer and the lower floating conductor layer. (10)

[0166] The electronic device according to any one of (1) to (9), wherein:

[0167] The multi-layer substrate further comprises:

[0168] a protective layer having a higher dielectric constant than that of the insulator layer and covering the upper surface of the laminate,

[0169] No conductor layer is disposed on the upper surface of the protective layer. (11)

[0171] A multi-layer substrate comprising:

[0172] A laminated body having a structure stacked in an up-and-down direction;

[0173] A first radiation conductor layer is provided in the laminate;

[0174] a second radiating conductor layer provided in the laminate and located above the first radiating conductor layer and overlapping the first radiating conductor layer as viewed in the up-down direction;

[0175] a first floating conductor having a shape surrounding at least a portion of the first radiating conductor layer when viewed in the up-down direction, being located above the first radiating conductor layer and below the second radiating conductor layer in the up-down direction, and being not electrically connected to a conductor present in the laminate; and

[0176] The second floating conductor has a shape surrounding at least a portion of the second radiating conductor layer when viewed in the up-down direction, is located above the second radiating conductor layer, and is not electrically connected to the conductor present in the laminate. (12)

[0178] The multi-layer substrate according to (11), wherein

[0179] The frequency of electromagnetic waves radiated or received by the second radiating conductor layer is higher than the frequency of electromagnetic waves radiated or received by the first radiating conductor layer, or the area of ​​the second radiating conductor layer is smaller than the area of ​​the first radiating conductor layer. (13)

[0181] The multilayer substrate according to (11) or (12), wherein:

[0182] The first floating conductor has a ring shape surrounding the first radiation conductor layer when viewed in the up-down direction. (14)

[0184] The multi-layer substrate according to (13), wherein

[0185] The second floating conductor has a ring shape surrounding the second radiation conductor layer when viewed in the up-down direction. (15)

[0187] The multi-layer substrate according to (14), wherein

[0188] When viewed in the up-down direction, the opening surrounded by the first floating conductor is accommodated in the opening surrounded by the second floating conductor. (16)

[0190] The multilayer substrate according to any one of (11) to (15), wherein:

[0191] have:

[0192] A third radiation conductor layer is provided in the laminate; and

[0193] a fourth radiating conductor layer provided in the laminate and located above the third radiating conductor layer and overlapping the third radiating conductor layer when viewed in the vertical direction;

[0194] The first floating conductor has a shape surrounding at least a portion of the third radiation conductor layer when viewed in the vertical direction.

[0195] The second floating conductor has a shape surrounding at least a portion of the fourth radiation conductor layer when viewed in the up-down direction. (17)

[0197] The multilayer substrate according to any one of (11) to (16), wherein

[0198] The first radiation conductor layer and the second radiation conductor layer have a rhombus shape having diagonal lines extending in the front-rear direction and the left-right direction. (18)

[0200] The multilayer substrate according to any one of (11) to (17), wherein

[0201] The first floating conductor includes one or more interlayer connection conductors penetrating one or more insulating layers in the up-down direction. (19)

[0203] The multi-layer substrate according to (18), wherein

[0204] The first floating conductor includes an upper floating conductor layer located on the upper surface of the laminate and a lower floating conductor layer located below the upper floating conductor layer.

[0205] The one or more interlayer connection conductors electrically connect the upper floating conductor layer and the lower floating conductor layer. (20)

[0207] The multilayer substrate according to any one of (11) to (19), wherein:

[0208] The multi-layer substrate further comprises:

[0209] a protective layer having a higher dielectric constant than that of the insulator layer and covering the upper surface of the laminate,

[0210] No conductor layer is disposed on the upper surface of the protective layer. (twenty one)

[0212] The multilayer substrate according to any one of (11) to (20), wherein

[0213] The second floating conductor is electrically connected to the first floating conductor.

[0214] Description of Reference Numerals

[0215] 1.1a: electronic equipment;

[0216] 10, 10a~10c: multi-layer substrate;

[0217] 12: laminate;

[0218] 14a-14g: insulator layer;

[0219] 15: protective layer;

[0220] 16: 1st ground conductor layer;

[0221] 18: Planar ground conductor layer

[0222] 20: first radiation conductor layer;

[0223] 21: second radiation conductor layer;

[0224] 24a, 24b, 26a, 26b, 124a, 124b, 126a, 126b: external electrodes;

[0225] 31: first floating conductor;

[0226] 32: second floating conductor;

[0227] 120: third radiation conductor layer;

[0228] 121: 4th radiation conductor layer;

[0229] 311: upper floating conductor layer;

[0230] 312: lower floating conductor layer;

[0231] Op1~Op4, Op11~Op13: Open;

[0232] P1: The first power supply point;

[0233] P2: The second power supply point;

[0234] P3: The third power supply point;

[0235] P4: 4th power supply point;

[0236] P5: The fifth power supply point;

[0237] P6: 6th power supply point;

[0238] P7: 7th power supply point;

[0239] P8: 8th power supply point;

[0240] X1: 1st waveguide;

[0241] X2: 2nd waveguide;

[0242] X3: 3rd waveguide;

[0243] X4: 4th waveguide;

[0244] v1~v8, v11~v14, v21~v24: interlayer connecting conductors.

Claims

1. An electronic device comprising: Multi-layer substrates; and The second floating conductor, The multi-layer substrate comprises: A laminate having a structure in which a plurality of insulating layers are stacked in a vertical direction; A first radiation conductor layer is provided in the laminate; a second radiating conductor layer provided in the laminate and located above the first radiating conductor layer and overlapping the first radiating conductor layer as viewed in the up-down direction; and a first floating conductor having a shape surrounding at least a portion of the first radiating conductor layer as viewed in the up-down direction, being located above the first radiating conductor layer and below the second radiating conductor layer in the up-down direction, and being not electrically connected to a conductor present in the laminated body, The second floating conductor is not electrically connected to a conductor present in the laminate, has a shape surrounding at least a portion of the second radiating conductor layer when viewed in the up-down direction, and is located above the second radiating conductor layer.

2. The electronic device according to claim 1, wherein: The frequency of electromagnetic waves radiated or received by the second radiating conductor layer is higher than the frequency of electromagnetic waves radiated or received by the first radiating conductor layer, or the area of ​​the second radiating conductor layer is smaller than the area of ​​the first radiating conductor layer.

3. The electronic device according to claim 1 or claim 2, wherein: The first floating conductor has a ring shape surrounding the first radiation conductor layer when viewed in the up-down direction.

4. The electronic device according to claim 3, wherein: The second floating conductor has a ring shape surrounding the second radiation conductor layer when viewed in the up-down direction.

5. The electronic device according to claim 4, wherein: When viewed in the up-down direction, the opening surrounded by the first floating conductor is accommodated in the opening surrounded by the second floating conductor.

6. The electronic device according to any one of claims 1 to 5, wherein: have: A third radiation conductor layer is provided in the laminate; and a fourth radiating conductor layer provided in the laminate and located above the third radiating conductor layer and overlapping the third radiating conductor layer when viewed in the vertical direction; The first floating conductor has a shape surrounding at least a portion of the third radiation conductor layer when viewed in the vertical direction. The second floating conductor has a shape surrounding at least a portion of the fourth radiation conductor layer when viewed in the up-down direction.

7. The electronic device according to any one of claims 1 to 6, wherein: When viewed in the up-down direction, the first radiation conductor layer and the second radiation conductor layer have a rhombus shape having diagonal lines extending in the front-back direction and the left-right direction.

8. The electronic device according to any one of claims 1 to 7, wherein: The first floating conductor includes one or more interlayer connection conductors penetrating one or more insulating layers in the up-down direction.

9. The electronic device according to claim 8, wherein: The first floating conductor includes an upper floating conductor layer located on the upper surface of the laminate and a lower floating conductor layer located below the upper floating conductor layer. The one or more interlayer connection conductors electrically connect the upper floating conductor layer and the lower floating conductor layer.

10. The electronic device according to any one of claims 1 to 9, wherein: The multi-layer substrate further comprises: a protective layer having a higher dielectric constant than that of the insulator layer and covering the upper surface of the laminate, No conductor layer is disposed on the upper surface of the protective layer.

11. A multi-layer substrate comprising: A laminate having a structure in which a plurality of insulating layers are stacked in a vertical direction; A first radiation conductor layer is provided in the laminate; a second radiating conductor layer provided in the laminate and located above the first radiating conductor layer and overlapping the first radiating conductor layer as viewed in the up-down direction; a first floating conductor having a shape surrounding at least a portion of the first radiating conductor layer when viewed in the up-down direction, being located above the first radiating conductor layer and below the second radiating conductor layer in the up-down direction, and being not electrically connected to a conductor present in the laminate; as well as The second floating conductor has a shape surrounding at least a portion of the second radiating conductor layer when viewed in the up-down direction, is located above the second radiating conductor layer, and is not electrically connected to the conductor present in the laminate.

12. The multi-layer substrate according to claim 11, wherein The frequency of electromagnetic waves radiated or received by the second radiating conductor layer is higher than the frequency of electromagnetic waves radiated or received by the first radiating conductor layer, or the area of ​​the second radiating conductor layer is smaller than the area of ​​the first radiating conductor layer.

13. The multi-layer substrate according to claim 11 or claim 12, wherein: The first floating conductor has a ring shape surrounding the first radiation conductor layer when viewed in the up-down direction.

14. The multi-layer substrate according to claim 13, wherein: The second floating conductor has a ring shape surrounding the second radiation conductor layer when viewed in the up-down direction.

15. The multi-layer substrate according to claim 14, wherein When viewed in the up-down direction, the opening surrounded by the first floating conductor is accommodated in the opening surrounded by the second floating conductor.

16. The multi-layer substrate according to any one of claims 11 to 15, wherein: have: A third radiation conductor layer is provided in the laminate; and a fourth radiating conductor layer provided in the laminate and located above the third radiating conductor layer and overlapping the third radiating conductor layer when viewed in the vertical direction; The first floating conductor has a shape surrounding at least a portion of the third radiation conductor layer when viewed in the vertical direction. The second floating conductor has a shape surrounding at least a portion of the fourth radiation conductor layer when viewed in the up-down direction.

17. The multi-layer substrate according to any one of claims 11 to 16, wherein: The first radiation conductor layer and the second radiation conductor layer have a rhombus shape having diagonal lines extending in the front-rear direction and the left-right direction.

18. The multi-layer substrate according to any one of claims 11 to 17, wherein: The first floating conductor includes one or more interlayer connection conductors penetrating one or more insulating layers in the up-down direction.

19. The multi-layer substrate according to claim 18, wherein The first floating conductor includes an upper floating conductor layer located on the upper surface of the laminate and a lower floating conductor layer located below the upper floating conductor layer. The one or more interlayer connection conductors electrically connect the upper floating conductor layer and the lower floating conductor layer.

20. The multi-layer substrate according to any one of claims 11 to 19, wherein: The multi-layer substrate further comprises: a protective layer having a higher dielectric constant than that of the insulator layer and covering the upper surface of the laminate, No conductor layer is disposed on the upper surface of the protective layer.

21. The multi-layer substrate according to any one of claims 11 to 20, wherein: The second floating conductor is electrically connected to the first floating conductor.

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