Three-dimensional galvanometer correction method and laser processing equipment

Abstract

The invention provides a three-dimensional galvanometer correction method and laser processing equipment. The method comprises the steps of controlling a motion platform to move to a reference surface of a galvanometer assembly; determining a contour line of a circle with a preset value as a radius on a medium of the motion platform by taking the central point of the galvanometer assembly as a circle center; a plurality of first marking grids are marked on the contour line in the preset direction through laser, each first marking grid in each first marking grid corresponds to one deflection angle, and each first marking pattern corresponds to the position of one zoom lens; detecting each first marking grid based on a visual component so as to determine a first target position corresponding to the focal point of the laser from the positions of the zoom lens corresponding to the plurality of first marking patterns of each first marking grid; fitting the radius of the contour line and the first target positions corresponding to the plurality of first marking grids to obtain a first curve; and compensating the position of the zoom lens according to the first curve. By means of the method, the three-dimensional galvanometer can be accurately corrected.

Description

Technical Field

[0001] The present application relates to the field of correction technology, and in particular to a three-dimensional galvanometer correction method and laser processing equipment. Background Art

[0002] Laser processing technology has been widely used in cutting, welding, marking, deburring, drilling and other industrial fields due to its advantages of high efficiency, high precision, high stability and low loss. For example, in the manufacture of precision electronic products such as mobile terminals, laser welding, marking, cutting and etching processes have strict requirements on processing accuracy. In order to ensure the processing quality, the laser processing equipment needs to be accurately calibrated.

[0003] In the related art, due to the limitations of the correction method and the constraints of factors such as the system error of the laser processing equipment (for example, horizontality deviation), it is often difficult to achieve all-round and accurate correction of the laser processing equipment, which in turn affects the final accuracy of the laser processing. Summary of the invention

[0004] In view of the above, it is necessary to provide a three-dimensional galvanometer correction method and laser processing equipment, which can solve the technical problem that it is difficult to achieve all-round and accurate correction of laser processing equipment.

[0005] On the one hand, an embodiment of the present application provides a three-dimensional galvanometer correction method, which is applied to laser processing equipment. The laser processing equipment includes a galvanometer assembly, a visual assembly, a motion platform and a laser transmitter. The galvanometer assembly includes multiple zoom lenses and a galvanometer lens. The laser emitted by the laser transmitter is incident on the motion platform through the galvanometer assembly. The focal position of the laser is controlled by the relative position relationship between the multiple zoom lenses, and the relative position relationship is controlled by adjusting the position of at least one of the zoom lenses. The marking position of the laser in a preset direction is controlled by adjusting the deflection angle of the galvanometer lens. The method includes: determining a reference plane of the galvanometer assembly, and controlling the motion platform to move to the reference plane, and determining the center point of the motion platform with the center point of the galvanometer assembly as the center of the circle. A circular contour line position with a preset radius on a first medium is marked by the laser along the preset direction on the contour line, wherein each first marking grid includes a plurality of first marking patterns, each first marking grid corresponds to a deflection angle, and each first marking pattern in each first marking grid corresponds to a position of the zoom lens; each first marking grid is detected based on the visual component to determine a first target position corresponding to the focus of the laser from the positions of the zoom lens corresponding to the plurality of first marking patterns in each first marking grid, the radius of the contour line and the first target positions corresponding to the plurality of first marking grids are fitted to obtain a first curve, and the position of the zoom lens is compensated according to the first curve.

[0006] In some embodiments of the present application, the detection of each first marking grid based on the visual component to determine the first target position from the position of the zoom lens corresponding to the multiple first marking patterns of each first marking grid includes: controlling the visual component to detect the line width of each first marking pattern in the preset direction, fitting a second curve corresponding to each first marking grid according to the position of the zoom lens corresponding to the multiple first marking patterns in each marking grid and the line width corresponding to each first marking pattern, the second curve being used to describe the changing relationship between the position of the zoom lens corresponding to each first marking pattern and the line width, and determining the first target position corresponding to each first marking grid from the position of the zoom lens corresponding to the multiple first marking patterns in each first marking grid according to the second curve corresponding to each first marking grid.

[0007] In some embodiments of the present application, the preset direction includes a horizontal direction and a vertical direction, and the controlling the visual component to detect the line width of each first marking graphic includes: controlling the visual component to photograph each first marking grid to obtain a marking image corresponding to each first marking grid, using a template matching algorithm to locate each first marking graphic in the marking image, and obtaining the graphic position of each first marking graphic in the field of view of the visual component; based on the graphic position, using an edge detection algorithm to detect the marking image, and obtain edge pixel points of the area constituted by each first marking graphic; fitting the edge pixel points to obtain the left edge line, right edge line, upper edge line and lower edge line of the area constituted by each first marking graphic; determining the horizontal line width of each first marking graphic in the horizontal direction according to the left edge line and the right edge line of the area constituted by each first marking graphic; and determining the vertical line width of each first marking graphic in the vertical direction according to the upper edge line and the lower edge line of the area constituted by each first marking graphic.

[0008] In some embodiments of the present application, the second curve corresponding to each first marking grid includes a second curve corresponding to the horizontal line width and a second curve corresponding to the vertical line width, and determining the first target position corresponding to each first marking grid from the position of the zoom lens corresponding to the multiple first marking patterns in each first marking grid according to the second curve corresponding to each first marking grid includes: determining the horizontal line width with the smallest value according to the second curve corresponding to the horizontal line width, and determining the vertical line width with the smallest value according to the second curve corresponding to the vertical line width; if the positions of the zoom lenses corresponding to the smallest horizontal line width and the smallest vertical line width match, the positions of the zoom lenses corresponding to the smallest horizontal line width and the smallest vertical line width are set as the first target positions.

[0009] In some embodiments of the present application, the method also includes: determining the highest first target position, the lowest first target position, and other first target positions other than the highest first target position and the lowest first target position among the first target positions corresponding to the first marking grid of the preset direction, determining the height difference between the highest first target position and the lowest first target position, marking the first marking grid corresponding to the highest first target position and the first marking grid corresponding to the lowest first target position with a first mark corresponding to a first height deviation range in which the height difference is located, if the height difference is greater than or equal to a preset threshold, marking the first marking grid corresponding to the highest first target position with a second mark, determining the second height deviation range in which the other first target positions are located, and marking the first marking grids corresponding to the other first target positions with a third mark corresponding to the second height deviation range.

[0010] In some embodiments of the present application, determination of the reference plane includes: determining a height interval in the vertical direction centered on the height of the initial position, dividing the height interval to obtain a plurality of first sub-level surfaces, and when the motion platform moves to each first sub-level surface, marking a second marking pattern on a second medium on the motion platform by the laser, the second marking patterns corresponding to the plurality of first sub-level surfaces constitute a second marking grid, and determining the reference plane from the plurality of first sub-level surfaces based on detection of the second marking grid by the visual component.

[0011] In some embodiments of the present application, after determining the reference plane, the method further includes: determining a height range in the vertical direction centered on the reference plane, and dividing the height range to obtain a plurality of second sub-level surfaces, and when the motion platform moves to each second sub-level surface, marking a third marking grid on a third medium of the motion platform by the laser, wherein the third marking grid includes a plurality of third marking patterns, each third marking pattern corresponds to a position of the zoom lens, controlling the visual component to detect the third marking grid, determining a second target position corresponding to the focus of the laser from the positions of the zoom lenses corresponding to the plurality of third marking patterns, fitting the position height of each second sub-level surface with the corresponding second target position to obtain a third curve, wherein the third curve is used to describe the changing relationship between the position height of each second sub-level surface and the corresponding second target position, and compensating for the position of the zoom lens according to the third curve.

[0012] In some embodiments of the present application, the method also includes: when the motion platform moves to each second sub-layer, marking a fourth marking grid on the fourth medium of the motion platform by the laser, wherein each second sub-layer corresponds to a fourth marking grid, each fourth marking grid corresponds to a position of the zoom lens and a maximum deflection angle, controlling the visual component to detect each fourth marking grid, obtaining the pixel coordinates of the center of each fourth marking grid, converting the pixel coordinates into mechanical coordinates, and controlling the movement of the motion platform according to the mechanical coordinates so that the center of each fourth marking grid coincides with the visual center of the visual component.

[0013] In some embodiments of the present application, the maximum deflection angle includes a maximum deflection angle in the horizontal direction and a maximum deflection angle in the vertical direction, and the method further includes: establishing a mechanical coordinate system with the mechanical coordinates of the center of each fourth marking grid as the origin, and calculating the lengths of multiple straight lines constituting each fourth marking grid in the mechanical coordinate system, calculating the first target line length of each fourth marking grid according to the lengths of all straight lines in the horizontal direction in the mechanical coordinate system, and calculating the second target line length of each fourth marking grid according to the lengths of all straight lines in the vertical direction in the mechanical coordinate system, scaling the maximum deflection angle in the horizontal direction according to the first target line length, and scaling the maximum deflection angle in the vertical direction according to the second target line length, calculating the length difference between the length of each straight line and the preset length, determining the length deviation range in which the length difference of each straight line is located, and marking each straight line with a fourth mark corresponding to the length deviation range.

[0014] On the other hand, the present application provides a laser processing device, which includes: a memory storing at least one instruction; and a processor executing the at least one instruction to implement the three-dimensional galvanometer correction method.

[0015] In the three-dimensional galvanometer correction method provided in the embodiment of the present application, by determining the reference plane of the galvanometer assembly and controlling the motion platform to move to the reference plane, a reference reference is provided for subsequent correction work. With the center point of the galvanometer assembly as the center of the circle, the contour lines of a circle with a preset radius on the first medium of the motion platform are determined, providing a clear path for laser marking / engraving. A laser is used to mark multiple first marking grids along a preset direction on the contour lines, each first marking grid corresponds to a deflection angle of the galvanometer lens, and each first marking pattern in the first marking grid corresponds to the position of a zoom lens. This marking / engraving method not only considers the influence of the deflection angle of the galvanometer lens on the laser direction, but also fully considers the influence of the position of the zoom lens on the focal position of the laser. Through the detection of each first marking grid by the visual component, the first target position corresponding to the laser focus can be accurately determined from the position of the zoom lens corresponding to the multiple first marking patterns. By fitting the radius of the contour line and the first target position corresponding to the plurality of first marking grids, a first curve is obtained. Since the first curve reflects the changing relationship between the radius of the contour line and the corresponding first target position, the zoom lens and the reference surface are compensated according to the first curve, so that the three-dimensional galvanometer can be accurately corrected. By accurately correcting the three-dimensional galvanometer, the problem of inconsistent grasping and abnormal correction caused by the distortion of the visual system of the laser processing equipment in the vertical direction (Z-axis direction) of the reference surface, field curvature and uneven lighting can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of a laser processing device provided in one embodiment of the present application.

[0017] Figure 2 It is a flow chart of a three-dimensional galvanometer correction method provided in one embodiment of the present application.

[0018] Figure 3 Schematic diagram of a first marking grid provided in one embodiment of the present application.

[0019] Figure 4 It is a schematic diagram of a first marked grid on a contour line provided in an embodiment of the present application.

[0020] Figure 5 It is a schematic diagram of a first curve provided in an embodiment of the present application.

[0021] Figure 6 It is a flow chart of a method for determining a reference plane of a galvanometer assembly provided in one embodiment of the present application.

[0022] Figure 7 It is a flowchart of a method for determining a first target position provided in an embodiment of the present application.

[0023] Figure 8It is a schematic diagram of an edge line provided by an embodiment of the present application.

[0024] Fig. 9 It is a schematic diagram of a second curve corresponding to the horizontal line width provided in an embodiment of the present application.

[0025] Fig.10 This is a flow chart of a three-dimensional galvanometer correction method provided in another embodiment of the present application.

[0026] Fig.11 It is a schematic diagram of a marked grid diagram provided in an embodiment of the present application.

[0027] Fig.12 This is a flow chart of a three-dimensional galvanometer correction method provided in another embodiment of the present application.

[0028] Fig.13 It is a schematic diagram of the height range provided by an embodiment of the present application.

[0029] Fig.14 It is a schematic diagram of a third curve provided in an embodiment of the present application.

[0030] Fig.15 It is a schematic diagram of a third curve provided in another embodiment of the present application.

[0031] Fig.16 This is a flow chart of a three-dimensional galvanometer correction method provided in another embodiment of the present application.

[0032] Fig.17 is a schematic diagram of a fourth marking grid provided in an embodiment of the present application.

[0033] Fig.18 It is a schematic diagram of a first middle straight line and a second middle straight line provided in one embodiment of the present application.

[0034] Fig.19 This is a flow chart of a three-dimensional galvanometer correction method provided in another embodiment of the present application.

[0035] Fig. 20 It is a schematic diagram of a mechanical coordinate system provided in an embodiment of the present application.

[0036] Fig.21 It is a schematic diagram of the framework of the laser processing equipment provided in one embodiment of the present application. DETAILED DESCRIPTION

[0037] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] It should be noted that in this application, "at least one" means one or more, and "more than one" means two or more than two. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims and drawings of this application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0039] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0040] The embodiment of the present application provides a three-dimensional galvanometer calibration method, which can accurately calibrate the three-dimensional galvanometer.

[0041] The three-dimensional galvanometer correction method provided in the embodiment of the present application can be applied to one or more laser processing equipment. Figure 1 , which is a schematic diagram of the structure of a laser processing device provided in one embodiment of the present application.

[0042] like Figure 1 As shown, the laser processing equipment may include a galvanometer component, a visual component, a motion platform ( Figure 1 The galvanometer assembly includes a plurality of zoom lenses and a galvanometer lens, and the laser emitted by the laser transmitter is incident on the motion platform through the galvanometer assembly. The focal position of the laser is controlled by the relative position relationship between the plurality of zoom lenses, the relative position relationship between the plurality of zoom lenses is controlled by adjusting the position of at least one zoom lens, and the marking position of the laser in a preset direction is controlled by adjusting the deflection angle of the galvanometer lens. The visual component may be a camera, the galvanometer lens may be a reflective lens, the preset direction may include an X-axis direction and a Y-axis direction, the X-axis direction may represent a horizontal direction, the Y-axis direction may represent a vertical direction, and the Z-axis direction may represent a vertical direction. The relative position relationship between the plurality of zoom lenses may be the relative distance between the plurality of zoom lenses.

[0043] like Figure 2 , is a flow chart of a three-dimensional galvanometer calibration method provided by an embodiment of the present application. According to different requirements, the order of each step in the flow chart can be adjusted according to actual requirements, and some steps can be omitted. The three-dimensional galvanometer calibration method is applied to laser processing equipment, such as Figure 1The laser processing device 10 is shown.

[0044] S11, determining a reference plane of the galvanometer assembly, and controlling the motion platform to move to the reference plane.

[0045] In some embodiments of the present application, the reference plane may be a reference plane used in laser processing equipment to calibrate the galvanometer assembly and locate the focal position of the laser. Since the high precision of laser processing requires the galvanometer assembly to accurately control the focus of the laser, in order to accurately calibrate the three-dimensional galvanometer, it is necessary to determine the reference plane of the galvanometer assembly. The method for determining the reference plane will be described in detail below.

[0046] S12, taking the center point of the galvanometer assembly as the center of the circle, determining the contour line position of a circle with a preset radius on the first medium of the motion platform.

[0047] The present application does not limit the type of the first medium. For example, the first medium may be adhesive tape.

[0048] In some embodiments of the present application, there may be multiple preset values, and the preset values ​​may be customized, which is not limited by the present application. If there are multiple preset values, concentric circles with the center point as the center can be determined on the first medium, and each circle in the concentric circles is a contour line, so that the positions of multiple contour lines can be determined.

[0049] S13, marking a plurality of first marking grids along a preset direction on the contour line by laser, wherein each first marking grid includes a plurality of first marking patterns, each first marking grid corresponds to a deflection angle, and each first marking pattern in each first marking grid corresponds to the position of a zoom lens.

[0050] In some embodiments of the present application, the preset direction includes a vertical direction and a horizontal direction. Since the zoom lens extends in the vertical direction, the laser processing equipment can adjust the position of at least one zoom lens in the vertical direction, thereby adjusting the relative position relationship of multiple zoom lenses.

[0051] The adjustment range of the position of the zoom lens may be determined according to the initial position of the at least one zoom lens in the vertical direction, and the present application does not limit the method for determining the adjustment range.

[0052] Exemplarily, the laser processing equipment can determine the upper and lower limits of the adjustment range according to the preset ratio of the initial position, thereby obtaining the adjustment range. For example, if the initial position is 50 and the preset ratio is 10%, the upper limit of the adjustment range can be 55=50+50*10%, and the lower limit of the adjustment range can be 45=50-50*10%, thereby determining the adjustment range to be [45,55]. The above examples of the method for determining the adjustment range are only examples and are not limited to this in practical applications.

[0053] The adjustment range may include multiple positions of the zoom lens, and the laser processing equipment can evenly divide the adjustment range according to a first preset interval to obtain the multiple positions, wherein the first preset interval can be customized, and the present application does not impose any restrictions on this.

[0054] For example, following the above embodiment, if the first preset interval is 1, the laser processing equipment can evenly divide the adjustment range [45, 55] so that the interval / gap between any two positions obtained by the division is 1, and a total of 11 zoom lens positions of 45, 46, 47...54, 55 can be obtained.

[0055] When adjusting the at least one zoom lens to each position in the adjustment range, the adjustment can be performed in a descending order or a descending order. For example, following the above embodiment, among the 11 positions of 45, 46, 47…54, 55, the at least one zoom lens can be first adjusted to the position of 55, and after the laser completes a marking, the at least one zoom lens can be adjusted from the position of 55 to the position of 54, and so on, and the at least one zoom lens can be moved to each position. Alternatively, the at least one zoom lens can be adjusted to the position of 45, and after the laser completes a marking, the at least one zoom lens can be adjusted from the position of 45 to the position of 46, and so on, and the at least one zoom lens can be moved to each position.

[0056] In some embodiments of the present application, the preset direction includes a horizontal direction and a vertical direction. Since the marking position of the laser in the horizontal direction and the vertical direction can be controlled by adjusting the deflection angle of the vibrating lens, after marking a first marking grid at a marking position, the next marking position on the contour line can be determined by adjusting the deflection angle of the vibrating lens, and the first marking grid can be marked at the determined marking position. Similarly, the first marking grid in the horizontal direction and the vertical direction on each contour line can be obtained.

[0057] The adjustment ranges of the positions of the zoom lenses corresponding to the first marked grids on the same contour line are the same, and the deflection angles corresponding to the first marked grids on the same contour line are different.

[0058] In some embodiments of the present application, the first marking pattern may be a "cross" pattern formed by the trajectory of the laser in the horizontal and vertical directions, and the first marking grid formed by multiple "cross" patterns may be a cross matrix.

[0059] For example, following the above embodiment, if the adjustment range [45,55] is evenly divided, 11 cross patterns can be obtained, and the 11 cross patterns corresponding to the first sub-levels can form a cross matrix. Figure 3 FIG. 1 is a schematic diagram of a first marking grid provided by an embodiment of the present application. Figure 3 In the figure, the first marking grid is a cross matrix composed of 11 cross figures, each cross in the cross matrix has a corresponding number, and the straight lines with the same number in the horizontal and vertical directions belong to the same cross figure.

[0060] like Figure 4 , which is a schematic diagram of a first marked grid on a contour line provided in an embodiment of the present application. Figure 4 Each "ten" in represents the first marking grid, not the first marking pattern. Figure 4 In the figure, each contour line has two first marking grids in the horizontal direction and the vertical direction respectively.

[0061] S14, detecting each first marking grid based on the visual component to determine the first target position corresponding to the focus of the laser from the positions of the zoom lens corresponding to the multiple first marking patterns of each first marking grid.

[0062] In some embodiments of the present application, each first marking pattern corresponds to the position of a variable focus lens, and multiple first marking patterns correspond to the positions of multiple variable focus lenses.

[0063] In some embodiments of the present application, the laser processing equipment can control the visual component to detect each of the first marking grids, thereby determining the line width of each first marking pattern in each of the first marking grids, and the laser processing equipment can determine the position of the zoom lens corresponding to the first marking pattern with the smallest line width as the first target position.

[0064] The line width of each first marking pattern may include a horizontal line width in the horizontal direction and / or a vertical line width in the vertical direction.

[0065] S15, fitting the radius of the contour line and the first target positions corresponding to the plurality of first marking grids to obtain a first curve.

[0066] In some embodiments of the present application, the first curve is used to describe the changing relationship between the radius of the contour line and the corresponding first target position. When there are multiple contour lines, the laser processing equipment can generate the first curve according to the radius of each contour line and the first target position corresponding to the first marking grid in the horizontal direction of each contour line.

[0067] like Figure 5 , which is a schematic diagram of a first curve provided by an embodiment of the present application. Figure 5 , the horizontal axis represents the radius of the circular contour line, and the vertical axis represents the first target position.

[0068] In other embodiments of the present application, since the relative position relationship between multiple zoom lenses is determined by the position of at least one zoom lens, the position of a zoom lens corresponds to a relative distance between multiple zoom lenses, and the laser processing equipment can generate a first curve based on the radius of each contour line and the relative distance corresponding to the first marked grid in the horizontal direction on each contour line.

[0069] S16, compensating the position of the zoom lens according to the first curve.

[0070] In some embodiments of the present application, the laser processing equipment can determine the slope of the linear function formed by adjacent points according to the radius corresponding to the adjacent points in the first curve and the first target position, and determine the linear function according to the determined slope.

[0071] Among them, a linear function can be determined according to the radius and the first target position corresponding to each pair of adjacent points on the first curve. Since the first curve includes multiple pairs of adjacent points, multiple linear functions can be obtained, each of which has a corresponding radius range. According to each linear function, the first target position corresponding to each radius in the corresponding radius range can be calculated, so that the position of the zoom lens can be compensated according to the calculated first target position. The radius range corresponding to each linear function can be determined by the radius corresponding to the adjacent point corresponding to the linear function.

[0072] In the three-dimensional galvanometer correction method provided in the embodiment of the present application, by determining the reference plane of the galvanometer assembly and controlling the motion platform to move to the reference plane, a reference reference is provided for subsequent correction work. With the center point of the galvanometer assembly as the center of the circle, the contour lines of a circle with a preset radius on the first medium of the motion platform are determined, providing a clear path for laser marking / engraving. A laser is used to mark multiple first marking grids along a preset direction on the contour lines, each first marking grid corresponds to a deflection angle of the galvanometer lens, and each first marking pattern in the first marking grid corresponds to the position of a zoom lens. This marking / engraving method not only considers the influence of the deflection angle of the galvanometer lens on the laser direction, but also fully considers the influence of the position of the zoom lens on the focal position of the laser. Through the detection of each first marking grid by the visual component, the first target position corresponding to the laser focus can be accurately determined from the position of the zoom lens corresponding to the multiple first marking patterns. By fitting the radius of the contour line and the first target position corresponding to the plurality of first marking grids, a first curve is obtained. Since the first curve reflects the changing relationship between the radius of the contour line and the corresponding first target position, the zoom lens and the reference surface are compensated according to the first curve, so that the three-dimensional galvanometer can be accurately corrected. By accurately correcting the three-dimensional galvanometer, the problem of inconsistent grasping and abnormal correction caused by the distortion of the visual system of the laser processing equipment in the vertical direction (Z-axis direction) of the reference surface, field curvature and uneven lighting can be avoided.

[0073] like Figure 6 , which is a flow chart of a method for determining a reference plane of a galvanometer assembly in step S11 provided in one embodiment of the present application.

[0074] S111, determining a height interval centered on the height of the initial position in the vertical direction, dividing the height interval, and obtaining a plurality of first sub-surface surfaces.

[0075] In some embodiments of the present application, the vertical direction can refer to Figure 1 The Z-axis direction in the initial position. The initial position height can be preset, or can be obtained by detecting the height corresponding to the initial position of the motion platform.

[0076] The height interval centered on the initial position height can be determined according to the initial position height, and the present application does not limit the method for determining the height interval. Exemplarily, the method for determining the height interval can refer to the method for determining the adjustment range in step S13.

[0077] The laser processing equipment can evenly divide the height range according to the second preset interval to obtain multiple position heights, and determine the XY plane corresponding to each position height obtained as the first sub-level surface, thereby obtaining multiple first sub-level surfaces, wherein the second preset interval can be customized, and this application does not impose any restrictions on this.

[0078] S112, when the moving platform moves to each first sub-layer, marking a second marking pattern on the second medium on the moving platform by laser, and the second marking patterns corresponding to the multiple first sub-layers constitute a second marking grid.

[0079] In some embodiments of the present application, the laser processing equipment can control the motion platform to move to each first sub-layer, control the laser emitter to emit laser, so that the laser marks a second marking pattern on the second medium of the motion platform, and each first sub-layer has a corresponding second marking pattern.

[0080] The type of the second medium can be the same as the type of the first medium, the shape of the second marking pattern can be the same as the first marking pattern, the description of the second medium can refer to the description of the first medium, and the description of the generation of the second marking pattern can refer to the description of the first marking pattern.

[0081] S113, based on the detection of the second marking grid by the visual component, determining a reference plane from the multiple first sub-face planes.

[0082] In some embodiments of the present application, based on the detection of the second marking grid by the visual component, the method for determining the reference plane from multiple first sub-planes can refer to the method for determining the first target position, and the present application will not repeat it.

[0083] In this embodiment, by determining the reference plane, a basis is provided for accurately calibrating the three-dimensional galvanometer.

[0084] like Figure 7 , which is a flow chart of a method for determining a first target position provided in one embodiment of the present application.

[0085] S141, controlling the visual component to detect the line width of each first marking pattern in a preset direction.

[0086] In some embodiments of the present application, the preset direction includes a horizontal direction and a vertical direction, and the laser processing equipment controls the visual component to detect the line width of each first marking graphic, including: controlling the visual component to photograph each first marking grid to obtain a marking image corresponding to each first marking grid; using a template matching algorithm to locate each first marking graphic in the marking image to obtain the graphic position of each first marking graphic in the field of view of the visual component; based on the graphic position, using an edge detection algorithm to detect the marking image to obtain edge pixel points of the area constituted by each first marking graphic; fitting the edge pixel points to obtain the left edge line, right edge line, upper edge line and lower edge line of the area constituted by each first marking graphic; according to the left edge line and right edge line of the area constituted by each first marking graphic, determine the horizontal line width of each first marking graphic in the horizontal direction; according to the upper edge line and lower edge line of the area constituted by each first marking graphic, determine the vertical line width of each first marking graphic in the vertical direction.

[0087] Among them, the laser processing equipment can calculate the similarity between the standard marking pattern of the template image and the first marking pattern of the marking image, and determine the standard marking pattern matching the first marking pattern of the marking image based on the calculated similarity, wherein each standard marking pattern in the template image has a corresponding standard position in the field of view of the visual component, and the standard position corresponding to each standard marking pattern matching the first marking pattern is determined as the graphic position of the first marking pattern in the field of view of the visual component. The edge detection algorithm can be a Canny algorithm, a Sobel operator, etc., and this application does not limit the type of edge detection algorithm.

[0088] The vertical line width of each first marking pattern in the vertical direction may be the distance between the upper edge line and the lower edge line corresponding to each first marking pattern, and the horizontal line width of each first marking pattern in the horizontal direction may be the distance between the left edge line and the right edge line corresponding to each first marking pattern.

[0089] like Figure 8 FIG. 1 is a schematic diagram of an edge line provided by an embodiment of the present application. Figure 8 In the figure, the distance between the left edge line and the right edge line is the horizontal line width, and the distance between the upper edge line and the lower edge line is the vertical line width.

[0090] S142, fitting a second curve corresponding to each first marking grid according to the position of the zoom lens corresponding to the plurality of first marking patterns in each marking grid and the line width corresponding to each first marking pattern.

[0091] In some embodiments of the present application, the second curve is used to describe the changing relationship between the position of the zoom lens corresponding to each first marking pattern and the corresponding line width.

[0092] The second curve corresponding to each first marking grid includes a second curve corresponding to the horizontal line width and a second curve corresponding to the vertical line width. Figure 3 The line widths of the multiple first marking patterns in the first marking grid in the horizontal and vertical directions show a trend of being larger on both sides and smaller in the middle. Therefore, the trends of the second curve corresponding to the horizontal line width and the second curve corresponding to the vertical line width are basically the same.

[0093] like Fig. 9 , which is a schematic diagram of a second curve corresponding to a horizontal line width provided by an embodiment of the present application. Fig. 9 In the figure, the horizontal axis represents the position of the zoom lens, the vertical axis represents the horizontal position of the left edge line and the right edge line corresponding to the position of the zoom lens, and the longitudinal distance between the two points corresponding to each position of the zoom lens represents the horizontal line width corresponding to each position. Fig. 9 The horizontal line widths shown are examples only.

[0094] S143, determining the first target position corresponding to each first marking grid from the positions of the zoom lens corresponding to the plurality of first marking patterns in each first marking grid according to the second curve corresponding to each first marking grid.

[0095] In some embodiments of the present application, the laser processing equipment determines the first target position corresponding to each first marking grid from the position of the zoom lens corresponding to the multiple first marking patterns in each first marking grid according to the second curve corresponding to each first marking grid, including: determining the horizontal line width with the smallest value according to the second curve corresponding to the horizontal line width, and determining the vertical line width with the smallest value according to the second curve corresponding to the vertical line width; if the positions of the zoom lenses corresponding to the smallest horizontal line width and the smallest vertical line width match, the positions of the zoom lenses corresponding to the smallest horizontal line width and the smallest vertical line width are set as the first target position.

[0096] The position matching of the zoom lens corresponding to the smallest horizontal line width and the smallest vertical line width may be that the position of the zoom lens corresponding to the smallest horizontal line width and the smallest vertical line width are the same.

[0097] In other embodiments of the present application, the laser processing equipment may directly determine the position of the zoom lens corresponding to the smallest horizontal line width or the position of the zoom lens corresponding to the smallest vertical line width as the first target position.

[0098] After marking the first marking grid, such as Fig.10, which is a flow chart of a three-dimensional galvanometer correction method provided in another embodiment of the present application.

[0099] S21, determining the highest first target position, the lowest first target position, and other first target positions except the highest first target position and the lowest first target position among the first target positions corresponding to the first marking grid in a preset direction.

[0100] In some embodiments of the present application, the preset direction includes a horizontal direction and a vertical direction.

[0101] S22, determine the height difference between the highest first target position and the lowest first target position, and use the first mark corresponding to the first height deviation range in which the height difference lies to mark the first marking grid corresponding to the highest first target position and the first marking grid corresponding to the lowest first target position.

[0102] In some embodiments of the present application, the laser processing equipment may include pre-defined multiple first height deviation ranges, each height deviation range has a corresponding first mark, and after determining the height difference between the highest first target position and the lowest first target position, the first height deviation range in which the height difference is located can be determined from the multiple first height deviation ranges, and the corresponding first mark pairs corresponding to the determined first height deviation ranges can be marked.

[0103] The type of the first mark can be customized. Exemplarily, the first mark can be a color, including but not limited to: purple, yellow.

[0104] S23, if the height difference is greater than or equal to a preset threshold, use a second mark to mark the first marking grid corresponding to the highest first target position.

[0105] In some embodiments of the present application, the preset threshold value can be customized, and the present application does not impose any limitation on this.

[0106] The present application does not limit the type of the second mark. For example, the second mark can be a graphic mark, including but not limited to: a triangle, a circle.

[0107] S24, determining a second height deviation range in which the other first target positions are located, and marking the first marking grid corresponding to the other first target positions with a third mark corresponding to the second height deviation range.

[0108] In some embodiments of the present application, the laser processing device may include a plurality of predefined second height deviation ranges, each of which has a corresponding third mark. The third mark may be any type of mark, and the present application is specific to the third mark. Exemplarily, the third mark may be a color different from the color corresponding to the first mark.

[0109] In some embodiments of the present application, the laser processing device can generate a grid map according to the distance between each first marking grid and the center point of the galvanometer assembly, each square in the grid map corresponds to a first marking grid, and the distance between the square corresponding to each first marking grid and the center point of the grid map can represent the distance between the first marking grid and the center point of the galvanometer assembly. If the first mark is a lighter color, the second mark is a triangle, and the third mark is a darker color, such as Fig.11 , which is a schematic diagram of a marked grid diagram provided by an embodiment of the present application. Fig.11 In the figure, the lighter square with a triangular mark in the lower left corner corresponds to the first marking grid corresponding to the highest first target position, the lighter square in the upper right corner corresponds to the first marking grid corresponding to the lowest first target position, and the darker square corresponds to the first marking grid corresponding to the other first target positions.

[0110] In this embodiment, by marking the corresponding first marking grid or the squares of the first marking grid with the first mark, the second mark and the third mark, the deviation or error can be visualized, thereby facilitating the user to understand the deviation of the first marking grid.

[0111] After determining the reference surface, Fig.12 , which is a flow chart of a three-dimensional galvanometer correction method provided in another embodiment of the present application.

[0112] S31, determining a height range centered on the reference plane in the vertical direction, and dividing the height range to obtain a plurality of second sub-surface planes.

[0113] In some embodiments of the present application, the height range includes an upper limit of the position height and a lower limit of the position height, and the multiple second sub-level surfaces include a second sub-level surface corresponding to the upper limit of the position height and a second sub-level surface corresponding to the lower limit of the position height. The method for determining the height range can refer to the description of the method for determining the height interval, wherein the height range is larger than the height interval, and the method for dividing the second sub-level surface can refer to the method for dividing the first sub-level surface, and the present application will not repeat the description.

[0114] S32, when the motion platform moves to each second sub-layer, a third marking grid is marked on the third medium of the motion platform by laser, wherein the third marking grid includes a plurality of third marking patterns, and each third marking pattern corresponds to the position of a zoom lens.

[0115] In some embodiments of the present application, the shape of the third marking pattern is the same as that of the first marking pattern, and each second sub-face has a corresponding third marking grid. The type of the third medium can be the same as that of the first medium.

[0116] The marking method of the third marking grid can refer to the marking method of each first marking grid, and this application will not repeat it.

[0117] In some embodiments of the present application, when marking the third marking grid, the adjustment range of the position of the at least one zoom lens can refer to the description of the adjustment range in step S13, and the present application will not repeat the description.

[0118] In some embodiments of the present application, when the parameters of the galvanometer assembly are fixed, the greater the relative position relationship between the multiple zoom lenses, the longer the focal length of the laser, the lower the focal position height of the laser, the smaller the relative position relationship between the zoom lenses, the shorter the focal length of the laser, and the higher the focal position height of the laser. Moving the at least one zoom lens to the position of the largest zoom lens in the adjustment range will make the relative position relationship between the multiple zoom lenses smaller, and moving the at least one zoom lens to the smallest position in the adjustment range will make the relative position relationship between the multiple zoom lenses larger. Therefore, when the at least one zoom lens moves to the largest position in the adjustment range, the motion platform can move to the second sub-level with the highest position height, and when the at least one zoom lens moves to the smallest position in the adjustment range, the motion platform can move to the second sub-level with the lowest position height. Fig.13 , which is a schematic diagram of the height range provided by an embodiment of the present application. Fig.13 In the figure, H represents the height range, Z0 represents the reference plane, level 1 represents the second sub-level corresponding to the upper limit of the height of the position in the height range, and level 2 represents the second sub-level corresponding to the lower limit of the height of the position in the height range.

[0119] S33, controlling the visual component to detect the third marking grid, and determining the second target position corresponding to the focus of the laser from the positions of the zoom lenses corresponding to the plurality of third marking patterns.

[0120] In some embodiments of the present application, the method for determining the second target position may refer to the method for determining the first target position, and the present application will not repeat the description.

[0121] S34, fitting the position height of each second sub-surface layer with the corresponding second target position to obtain a third curve.

[0122] In some embodiments of the present application, the third curve is used to describe the changing relationship between the position height of each second sub-face layer and the corresponding second target position.

[0123] The laser of the laser processing equipment can have a variety of focusing modes, such as front focusing and back focusing. Front focusing means that the laser is focused before it is incident on the moving platform, and the laser focal position is located on the moving platform or the workpiece. The third curve corresponding to the laser of different focusing modes may be different.

[0124] like Fig.14 As shown in FIG. 1 , it is a schematic diagram of a third curve provided by an embodiment of the present application. Fig.15 , which is a schematic diagram of a third curve provided in another embodiment of the present application.

[0125] Fig.14 It is the third curve corresponding to the laser with front focusing mode. Fig.15 The third curve corresponds to the post-focused laser. Fig.14 and Fig.15 The horizontal axis in represents the position height, and the vertical axis represents the second target position.

[0126] S35, compensating the position of the zoom lens according to the third curve.

[0127] In some embodiments of the present application, for the method of compensating the position of the zoom lens according to the third curve, reference may be made to the description of the position of the zoom lens according to the first curve in step S16, and the present application will not repeat the description.

[0128] In this embodiment, the position of the zoom lens is compensated according to the third curve, so as to avoid the problem that the focus of the laser cannot fall on the processing surface due to the large distance between the galvanometer assembly and the motion platform.

[0129] After compensating the position of the zoom lens using the third curve, the laser processing equipment can correct the distortion, field curvature and uneven lighting generated by the visual system of the laser processing equipment in the horizontal direction (X-axis direction) and vertical direction (Y-axis direction) of the reference surface. Fig.16 , which is a flow chart of a three-dimensional galvanometer correction method provided in another embodiment of the present application.

[0130] S41, when the motion platform moves to each of the second sub-layers, a fourth marking grid is marked on the fourth medium of the motion platform by laser.

[0131] In some embodiments of the present application, each second lamination surface corresponds to a fourth marking grid, and each fourth marking grid corresponds to the position of a zoom lens and a maximum deflection angle. The maximum deflection angle includes the maximum deflection angle in the horizontal direction and the maximum deflection angle in the vertical direction.

[0132] Among them, the type of the fourth medium may be the same as that of the first medium, and the present application will not repeat the description.

[0133] As Fig.17 shown, it is a schematic diagram of the fourth marking grid provided by an embodiment of the present application. In Fig.17 it, the fourth marking grid is a "field" - shaped grid composed of 6 straight lines.

[0134] S42. Control the vision component to detect each fourth marking grid, and obtain the pixel coordinates of the center of each fourth marking grid.

[0135] In some embodiments of the present application, the laser processing equipment can determine the left edge line, right edge line, upper edge line, and lower edge line of the area corresponding to each fourth marking grid with reference to the determination method of the left edge line, right edge line, upper edge line, and lower edge line of the area formed by each first marking pattern in step S141, determine the first intermediate straight line between the left edge line and the right edge line corresponding to each fourth marking grid, and determine the second intermediate straight line between the upper edge line and the lower edge line corresponding to each fourth marking grid. Take the intersection point between the first intermediate straight line and the second intermediate straight line as the center of each fourth marking grid, and determine the pixel coordinates of the center of each fourth marking grid according to the pixel coordinate system corresponding to the vision component.

[0136] As Fig.18 shown, it is a schematic diagram of the first intermediate straight line and the second intermediate straight line provided by an embodiment of the present application.

[0137] S43. Convert the pixel coordinates into mechanical coordinates.

[0138] In some embodiments of the present application, after obtaining the pixel coordinates of the center points of each fourth marking pattern, the pixel equivalent corresponding to the center of each fourth marking pattern can be combined, so as to convert the pixel coordinates of the center of each fourth marking pattern into the corresponding mechanical coordinates.

[0139] S44. Control the movement platform to move according to the mechanical coordinates, so that the center of each fourth marking grid coincides with the vision center of the vision component.

[0140] In this embodiment, by controlling the movement platform to move, so that the center of each fourth marking grid coincides with the vision center of the vision component, visual interference can be reduced, which is convenient for establishing an accurate mechanical coordinate system in the following text.

[0141] After the motion platform is controlled to move according to the mechanical coordinates so that the center of each fourth marking grid coincides with the visual center of the visual component, as shown in FIG. Fig.19 , which is a flow chart of a three-dimensional galvanometer correction method provided in another embodiment of the present application.

[0142] S51, establishing a mechanical coordinate system with the mechanical coordinate of the center of each fourth marking grid as the origin, and calculating the lengths of a plurality of straight lines constituting each fourth marking grid in the mechanical coordinate system.

[0143] like Fig. 20 , which is a schematic diagram of a mechanical coordinate system provided in an embodiment of the present application.

[0144] S52, calculating the first target line length of each fourth marking grid according to the length of all straight lines in the horizontal direction in the mechanical coordinate system, and calculating the second target line length of each fourth marking grid according to the length of all straight lines in the vertical direction in the mechanical coordinate system.

[0145] In some embodiments of the present application, the laser processing equipment can use a variety of methods to calculate the first target line length and the second target line length, and the present application does not limit the calculation method of the first target line length and the second target line length. Exemplarily, the first target line length can be the average value or weighted average value between the lengths of all straight lines in the horizontal direction. The second target line length can be the average value or weighted average value between the lengths of all straight lines in the vertical direction.

[0146] S53, scaling the maximum deflection angle in the horizontal direction according to the first target line length, and scaling the maximum deflection angle in the vertical direction according to the second target line length.

[0147] In this embodiment, by scaling the maximum deflection angle in the horizontal direction according to the first target line length and the maximum deflection angle in the vertical direction according to the second target line length, the three-dimensional stereo correction of the galvanometer assembly can be automatically completed, thereby improving the correction accuracy of the three-dimensional galvanometer and ensuring that the laser processing equipment can achieve high-precision processing in actual applications.

[0148] S54, calculating the length difference between the length of each straight line and a preset length.

[0149] In some embodiments of the present application, the preset length can be customized, and the present application does not impose any limitation on this.

[0150] S55, determining a length deviation range in which the length difference of each straight line is located, and marking each straight line with a fourth mark corresponding to the length deviation range.

[0151] In some embodiments of the present application, the laser processing equipment may include a preset definition to obtain multiple length deviation ranges, each length deviation range having a corresponding fourth mark. The present application does not limit the type of the fourth mark. Exemplarily, the fourth mark may be a color, including but not limited to: purple, green.

[0152] In this embodiment, the corresponding straight lines are marked with fourth marks such as colors, so that deviations and errors can be visualized, so that users can intuitively understand the deviations.

[0153] like Fig.21 FIG. 1 is a schematic diagram of a laser processing device according to an embodiment of the present application. Fig.21 In the embodiment, the laser processing device 10 may include a communication module 101, a memory 102, a processor 103, an input / output (I / O) interface 104 and a bus 105. The processor 103 is coupled to the communication module 101, the memory 102 and the input / output interface 104 through the bus 105.

[0154] The communication module 101 may include a wired communication module and / or a wireless communication module. The wired communication module may provide one or more wired communication solutions such as universal serial bus (USB), controller area network bus (CAN, Controller Area Network). The wireless communication module may provide one or more wireless communication solutions such as wireless fidelity (wireless fidelity, Wi-Fi), Bluetooth (Bluetooth, BT), mobile communication network, frequency modulation (frequency modulation, FM), near field communication technology (near field communication, NFC), infrared technology (infrared, IR), etc.

[0155] The memory 102 may include one or more random access memories (RAM) and one or more non-volatile memories (NVM). The random access memory can be directly read and written by the processor 103, and can be used to store executable programs (such as machine instructions) of other running programs, and can also be used to store user and application data. The random access memory may include static random-access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), etc.

[0156] The non-volatile memory may also store executable programs and user and application data, etc., and may be loaded into the random access memory in advance for direct reading and writing by the processor 103. The non-volatile memory may include a disk storage device and a flash memory.

[0157] The memory 102 is used to store one or more computer programs. The one or more computer programs are configured to be executed by the processor 103. The one or more computer programs include multiple instructions. When the multiple instructions are executed by the processor 103, the three-dimensional galvanometer correction method executed on the laser processing device 10 can be implemented.

[0158] In other embodiments, Fig.21 The laser processing device 10 shown also includes an external memory interface for connecting to an external memory to expand the storage capacity of the laser processing device 10 .

[0159] The processor 103 may include one or more processing units, for example, the processor 103 may include an application processor (AP), a modem processor, a graphics processor (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), and / or a neural-network processing unit (NPU), etc. Different processing units may be independent devices or integrated into one or more processors.

[0160] The processor 103 provides computing and control capabilities. For example, the processor 103 is used to execute a computer program stored in the memory 102 to implement the above-mentioned three-dimensional galvanometer correction method.

[0161] The input / output interface 104 is used to provide a channel for user input or output. For example, the input / output interface 104 can be used to connect various input and output devices, such as a mouse, keyboard, touch device, display screen, etc., so that the user can enter information or visualize information.

[0162] The bus 105 is at least used to provide a channel for mutual communication among the communication module 101 , the memory 102 , the processor 103 , and the input / output interface 104 in the laser processing device 10 .

[0163] It is understood that the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the laser processing device 10. In other embodiments of the present application, the laser processing device 10 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0164] An embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. The computer program includes program instructions. The method implemented when the program instructions are executed can refer to the methods in the above-mentioned embodiments of the present application.

[0165] The computer-readable storage medium may be the internal memory of the laser processing device described in the above embodiment, such as a hard disk or memory of the laser processing device. The computer-readable storage medium may also be an external storage device of the laser processing device, such as a plug-in hard disk equipped on the laser processing device, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc.

[0166] In some embodiments, the computer-readable storage medium may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function, etc.; the data storage area may store data created according to the use of the laser processing equipment, etc.

[0167] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only illustrative, for example, the division of the modules is only a logical function division, and there may be other division methods in actual implementation.

[0168] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0169] In addition, each functional module in each embodiment of the present application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The above integrated unit can be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0170] Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present application is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present application. Any attached figure mark in the claims should not be regarded as limiting the claims involved.

[0171] In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in this application can also be implemented by one unit or device through software or hardware. The words first, second, etc. are used to indicate names, and do not indicate any particular order.

[0172] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A three-dimensional galvanometer correction method, applied to laser processing equipment, characterized in that: The laser processing equipment comprises a galvanometer assembly, a visual assembly, a motion platform and a laser transmitter, the galvanometer assembly comprises a plurality of zoom lenses and a galvanometer lens, the laser emitted by the laser transmitter is incident on the motion platform through the galvanometer assembly, the focal position of the laser is controlled by the relative position relationship between the plurality of zoom lenses, the relative position relationship is controlled by adjusting the position of at least one of the zoom lenses, the marking position of the laser in a preset direction is controlled by adjusting the deflection angle of the galvanometer lens, and the method comprises: Determine a reference plane of the galvanometer assembly, and control the motion platform to move to the reference plane; Taking the center point of the galvanometer assembly as the center of the circle, determining the contour position of a circle with a preset radius on the first medium of the motion platform; Marking a plurality of first marking grids along the preset direction on the contour line by the laser, wherein each first marking grid includes a plurality of first marking patterns, each first marking grid corresponds to one of the deflection angles, and each first marking pattern in each first marking grid corresponds to a position of the zoom lens; Detecting each first marking grid based on the visual component to determine a first target position corresponding to the focus of the laser from the positions of the zoom lens corresponding to the multiple first marking patterns of each first marking grid; Fitting the radius of the contour line and the first target positions corresponding to the plurality of first marking grids to obtain a first curve; The position of the variable focus lens is compensated according to the first curve.

2. The three-dimensional galvanometer calibration method according to claim 1, characterized in that: The detecting each first marking grid based on the visual component to determine the first target position from the positions of the zoom lens corresponding to the multiple first marking patterns of each first marking grid comprises: Controlling the visual component to detect the line width of each first marking pattern in the preset direction; According to the positions of the zoom lenses corresponding to the plurality of first marking patterns in each marking grid and the line width corresponding to each first marking pattern, fitting a second curve corresponding to each first marking grid, wherein the second curve is used to describe the relationship between the position of the zoom lens corresponding to each first marking pattern and the line width; According to the second curve corresponding to each first marking grid, the first target position corresponding to each first marking grid is determined from the position of the zoom lens corresponding to the plurality of first marking patterns in each first marking grid.

3. The three-dimensional galvanometer calibration method according to claim 2, characterized in that: The preset direction includes a horizontal direction and a vertical direction, and the controlling the visual component to detect the line width of each first marking pattern includes: Controlling the visual component to photograph each of the first marking grids to obtain a marking image corresponding to each of the first marking grids; Positioning each of the first marking patterns in the marking image using a template matching algorithm to obtain a graphic position of each of the first marking patterns in the field of view of the visual component; Based on the graphic position, the marked image is detected using an edge detection algorithm to obtain edge pixel points of the area formed by each first marked graphic; Fitting the edge pixel points to obtain the left edge line, right edge line, upper edge line and lower edge line of the area formed by each first marking pattern; According to the left edge line and the right edge line of the area formed by each first marking pattern, the horizontal line width of each first marking pattern in the horizontal direction is determined, and according to the upper edge line and the lower edge line of the area formed by each first marking pattern, the vertical line width of each first marking pattern in the vertical direction is determined.

4. The three-dimensional galvanometer calibration method according to claim 3, characterized in that: The second curve corresponding to each first marking grid includes a second curve corresponding to the horizontal line width and a second curve corresponding to the vertical line width, and determining the first target position corresponding to each first marking grid from the positions of the zoom lens corresponding to the plurality of first marking patterns in each first marking grid according to the second curve corresponding to each first marking grid includes: Determine the minimum horizontal line width according to the second curve corresponding to the horizontal line width, and determine the minimum vertical line width according to the second curve corresponding to the vertical line width; If the positions of the zoom lens corresponding to the minimum horizontal line width and the minimum vertical line width match, the positions of the zoom lens corresponding to the minimum horizontal line width and the minimum vertical line width are set as the first target position.

5. The three-dimensional galvanometer calibration method according to claim 1, characterized in that: The method further comprises: Determine the highest first target position, the lowest first target position, and other first target positions except the highest first target position and the lowest first target position among the first target positions corresponding to the first marking grid in the preset direction; Determine a height difference between the highest first target position and the lowest first target position, and mark a first marking grid corresponding to the highest first target position and a first marking grid corresponding to the lowest first target position using a first mark corresponding to a first height deviation range within which the height difference lies; If the height difference is greater than or equal to a preset threshold, marking the first marking grid corresponding to the first target position at the highest position with a second marker; A second height deviation range in which the other first target positions are located is determined, and a first marking grid corresponding to the other first target positions is marked using a third mark corresponding to the second height deviation range.

6. The three-dimensional galvanometer calibration method according to claim 1, characterized in that: The determination of the reference surface includes: Determine a height interval centered on the height of the initial position in the vertical direction, divide the height interval, and obtain a plurality of first sub-surface surfaces; When the motion platform moves to each first sub-layer, a second marking pattern is marked on the second medium on the motion platform by the laser, and the second marking patterns corresponding to the plurality of first sub-layers constitute a second marking grid; The reference plane is determined from the plurality of first sub-plane surfaces based on detection of the second marking grid by the vision component.

7. The three-dimensional galvanometer calibration method according to claim 1, characterized in that: After determining the reference surface, the method further comprises: Determine a height range centered on the reference plane in the vertical direction, and divide the height range to obtain a plurality of second sub-surfaces; When the motion platform moves to each second sub-layer, a third marking grid is marked on the third medium of the motion platform by the laser, wherein the third marking grid includes a plurality of third marking patterns, and each third marking pattern corresponds to a position of the zoom lens; Controlling the visual component to detect the third marking grid, and determining a second target position corresponding to the focus of the laser from the positions of the zoom lenses corresponding to the plurality of third marking patterns; Fitting the position height of each second sub-face layer with the corresponding second target position to obtain a third curve, wherein the third curve is used to describe the change relationship between the position height of each second sub-face layer and the corresponding second target position; The position of the variable focus lens is compensated according to the third curve.

8. The three-dimensional galvanometer calibration method according to claim 7, characterized in that: The method further comprises: When the motion platform moves to each of the second sub-levels, a fourth marking grid is marked on a fourth medium of the motion platform by the laser, wherein each of the second sub-levels corresponds to a fourth marking grid, and each fourth marking grid corresponds to a position of the zoom lens and a maximum deflection angle; Controlling the visual component to detect each fourth marking grid to obtain the pixel coordinates of the center of each fourth marking grid; Converting the pixel coordinates into mechanical coordinates; The motion platform is controlled to move according to the mechanical coordinates so that the center of each fourth marking grid coincides with the visual center of the visual component.

9. The three-dimensional galvanometer calibration method according to claim 8, characterized in that: The maximum deflection angle includes a maximum deflection angle in a horizontal direction and a maximum deflection angle in a vertical direction, and the method further includes: Establishing a mechanical coordinate system with the mechanical coordinate of the center of each fourth marking grid as the origin, and calculating the lengths of a plurality of straight lines constituting each fourth marking grid in the mechanical coordinate system; Calculating a first target line length of each fourth marking grid according to the length of all straight lines in the horizontal direction of the mechanical coordinate system, and calculating a second target line length of each fourth marking grid according to the length of all straight lines in the vertical direction of the mechanical coordinate system; Scaling the maximum deflection angle in the horizontal direction according to the first target line length, and scaling the maximum deflection angle in the vertical direction according to the second target line length; Calculate the length difference between the length of each straight line and the preset length; A length deviation range in which the length difference of each straight line is located is determined, and each straight line is marked with a fourth mark corresponding to the length deviation range.

10. A laser processing device, characterized in that: The laser processing equipment comprises: a memory storing at least one instruction; and The processor executes the at least one instruction to implement the three-dimensional galvanometer correction method as described in any one of claims 1 to 9.

Images