Laser die cutting mechanism and laser die cutting method

By laser die-cutting the tape of self-adhesive label with the glue side facing up, forming a tapered piece with a conical structure, the problem of yellow or white printing on the outer edge of the figure after laser die-cut is solved, achieving better vision Effect.

CN119387880AInactive Publication Date: 2025-02-07ADA (GUANGDONG) INTELLIGENT EQUIPMENT CO LTD
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Patent Information

Application Number
CN202411603016.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-11
Publication Date
2025-02-07
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing laser die-cutting technology causes yellow or white marks to appear on the outer edge of the figure after the label tape is cut, affecting the visual effect.

Method used

The self-adhesive label tape with glue-side up is used for laser die-cutting, and the label tape is cut with glue-side up through the laser to form a tapered piece with a tapered structure to avoid residual edges of the figure.

Benefits of technology

The outer edge of the cut piece without residual structure is realized, avoiding the yellow edge or white marking, thereby improving the visual effect of the graphics.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a laser die cutting mechanism and a laser die cutting method. According to the laser die cutting mechanism and the laser die cutting method, a self-adhesive label with an upward adhesive surface is subjected to laser die cutting, so that the problem of white marks on the outer edge of a pattern after die cutting is solved. According to the technical scheme, on one hand, the laser die cutting mechanism is provided and comprises an adsorption conveying belt, a laser device and a label material belt to be subjected to laser die cutting, and the label material belt is provided with a rubber face; the label material belt is conveyed on the adsorption conveying belt in the mode that the rubber face faces upwards, a laser head of the laser device faces the adsorption conveying belt, and the laser head conducts die cutting on the label material belt on the adsorption conveying belt to form a cutting piece. The invention relates to the technical field of label die cutting.
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Description

Technical Field

[0001] The invention relates to the technical field of label die-cutting, and in particular to a laser die-cutting mechanism and a laser die-cutting method. Background Art

[0002] Self-adhesive label die-cutting can be done by using rollers or lasers. If laser die-cutting is used, the laser head is usually projected onto the top of the label tape, and the laser can cut the label tape to form the desired pattern. During laser cutting, the laser beam is diffuse rather than parallel, which causes the pattern surface on the upper part of the label tape to be cut obliquely by the laser. The cut part of the label tape, that is, the edge of the cut piece, is cut into a tapered structure as a whole, such as Figure 1 As shown, there is a part of residue at the bottom of the cut piece of the label. If the cut graphic is viewed from the front of the pattern surface, the residual structure at the bottom will cause yellow edges or white prints on the outer edges of the graphic, affecting the visual effect. The present invention proposes a solution to the problem of white prints on the outer edges of graphics after laser die-cutting. Summary of the invention

[0003] In order to solve the deficiencies of the prior art, the present invention provides a laser die-cutting mechanism and a laser die-cutting method, which utilize laser die-cutting of a self-adhesive label with the adhesive surface facing upward to solve the problem of white printing on the outer edge of the graphic after die-cutting.

[0004] The technical problem to be solved by the present invention is achieved through the following technical means: One aspect of the present invention is to propose a laser die-cutting mechanism, including an adsorption conveyor belt, a laser and a label tape to be laser die-cut, the label tape having an adhesive surface, the label tape being conveyed on the adsorption conveyor belt with the adhesive surface facing upward, the laser head of the laser facing the adsorption conveyor belt, and the laser head die-cuts the label tape on the adsorption conveyor belt into pieces.

[0005] In the above scheme, one side of the label tape is the adhesive surface and the other side is the pattern surface. The laser head die-cuts a preset pattern toward the label tape on the adsorption conveyor belt, and the portion of the label tape on which the preset pattern is die-cut is defined as the cut piece, which will continue to be conveyed along the adsorption conveyor belt; wherein, since the label tape is laser-die-cut with the adhesive surface facing upward, when the label tape is obliquely cut by the laser, a portion of the adhesive surface facing upward on the label tape is cut off, and the outer edge of the cut piece forms a conical structure, and the downward, i.e., lower, pattern surface of the cut piece is now the lower end surface of the conical structure; in this way, if the cut piece is viewed from the front of the pattern surface, there will be no residual structure on the outer edge of the cut piece, so the pattern surface of the cut piece will not have yellow edges or white prints, thereby achieving a better visual effect. wherein, the adhesive surface facing upward refers to the direction perpendicular to the conveying direction of the adhesive surface facing the adsorption conveyor belt relative to the adsorption conveyor belt.

[0006] In one embodiment, a waste collection module is provided on one side of the laser in the positive direction of the conveying direction of the adsorption conveyor belt, and the portion of the label material belt except the cut pieces is recycled by the waste collection module.

[0007] In the above scheme, the waste collection module is a conventional component of label die-cutting. The waste collection module is used to recycle the label material tape with the adhesive surface after laser die-cutting, so that only the cut pieces are left on the adsorption conveyor belt in the future.

[0008] In one embodiment, the laser die-cutting mechanism includes a raw material conveying module for conveying raw materials, the raw materials include base paper and the label material tape attached to the base paper, the raw material conveying module includes a raw material discharge cylinder for discharging the raw materials, a plurality of base paper traction shafts and a plurality of label traction shafts, after the raw materials are discharged from the raw material discharge cylinder, the base paper and the label material tape are separated, and the base paper is conveyed in conjunction with the base paper traction shaft, the label material tape is conveyed in conjunction with the label traction shaft, and the label material tape is transferred from the label traction shaft to the adsorption conveyor belt.

[0009] In one embodiment, a pressure roller is provided on one side of the laser in the positive direction of the conveying direction of the adsorption conveyor belt, and the pressure roller is located above the adsorption conveyor belt. The base paper passes under the pressure roller during transportation, and the base paper is bonded to the rubber surface of the cut piece through the pressure roller.

[0010] In the above scheme, during the conveying process, the base paper is scooped to the side of the positive direction of the conveying direction of the adsorption conveyor belt, and before the pressure roller, the base paper is attached to the label material belt above the adhesive surface of the label material belt and is compounded by the pressure roller to form a new material belt. Among them, when the raw material discharge cylinder is set on the positive direction side of the laser along the conveying direction of the adsorption conveyor belt, a plurality of label traction shafts are set in a layout manner that bypasses the laser; when the raw material discharge cylinder is set on the opposite direction side of the laser along the conveying direction of the adsorption conveyor belt, a plurality of base paper traction shafts are set in a layout manner that bypasses the laser. In addition, when sticking, the conveying direction of the base paper is the same as the conveying direction of the cut piece.

[0011] In one embodiment, the laser die-cutting mechanism includes a material receiving module for receiving the base paper and the cut pieces after bonding, and the material receiving module includes a material receiving cylinder.

[0012] In one embodiment, the laser head is vertically oriented toward the adsorption conveyor belt.

[0013] In one embodiment, the adsorption conveyor belt is a vacuum adsorption conveyor belt.

[0014] Another aspect of the present invention is to provide a laser die cutting method, comprising the following steps:

[0015] Step S1, separating the base paper and the label tape in the raw material and transporting them in two ways;

[0016] Step S2, the label material tape has an adhesive surface, and the label material tape passes through the adsorption conveyor belt with the adhesive surface facing upward. A laser is provided on one side of the adsorption conveyor belt, and the laser die-cuts a preset pattern toward the label material tape on the adsorption conveyor belt, and the portion of the label material tape on which the preset pattern is die-cut is defined as a cut piece;

[0017] Step S3, the portion of the label tape except the cut pieces is recycled through a waste collection module, and the cut pieces are continuously conveyed along the suction conveyor belt;

[0018] Step S4, on the side of the laser located in the positive direction of the conveying direction of the adsorption conveyor belt, the base paper is conveyed to the adsorption conveyor belt and abutted against the adhesive surface of the cut piece, so that the base paper and the cut piece are compounded;

[0019] Step S5, the laminated base paper and cut pieces are collected by a collecting drum.

[0020] In the above scheme, one side of the label tape is the adhesive surface and the other side is the pattern surface. The laser head die-cuts the label tape on the adsorption conveyor belt to produce a cut piece, and the cut piece will continue to be conveyed along the adsorption conveyor belt. Among them, since the label tape is die-cut by the laser with the adhesive surface facing upward, the label tape is obliquely cut by the laser to form a conical structure, and a part of the adhesive surface facing upward of the cut piece is cut off, and the downward surface of the cut piece, that is, the lower pattern surface, is now the lower end surface of the conical structure. In this way, if the cut piece is viewed from the front of the pattern surface, there will be no residual structure on the outer edge of the cut piece, so there will be no yellow edge or white print on the pattern surface, thereby achieving a better visual effect.

[0021] In one embodiment, in step S4, a pressure roller is provided on one side of the laser located in the positive direction of the conveying direction of the adsorption conveyor belt, and the pressure roller is located above the adsorption conveyor belt. During the conveying process, the base paper is attached to the rubber surface of the cut piece through the pressure roller. When attached, the conveying direction of the base paper is the same as the conveying direction of the cut piece.

[0022] In one embodiment, the laser is located on a vertical line of the suction conveyor belt, and the laser is facing the suction conveyor belt. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of laser die-cutting of label strips in the prior art;

[0024] Figure 2 Schematic diagram of laser die cutting of the label material strip of the present invention;

[0025] Figure 3 It is a structural schematic diagram of the laser die-cutting mechanism;

[0026] Figure 4 It is a structural schematic diagram of the laser die-cutting mechanism. DETAILED DESCRIPTION

[0027] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0028] like Figures 1 to 4 As shown, the technical solution adopted by the present invention is that one aspect of the present invention is to propose a laser die-cutting mechanism, including an adsorption conveyor belt 1, a laser 2 and a label tape 3 to be laser die-cut, the label tape 3 having an adhesive surface 4, the label tape 3 is conveyed on the adsorption conveyor belt 1 with the adhesive surface 4 facing upward, the laser head of the laser 2 faces the adsorption conveyor belt 1, and the laser head die-cuts the label tape 3 on the adsorption conveyor belt 1 into a cut piece 5.

[0029] In the above scheme, one side of the label tape 3 is the adhesive surface 4 and the other side is the pattern surface 16. The laser head dies out a preset pattern toward the label tape 3 on the adsorption conveyor belt 1, and the portion of the label tape 3 on which the preset pattern is die-cut is defined as the cut piece 5, which will continue to be conveyed along the adsorption conveyor belt 1; wherein, since the label tape 3 is laser-die-cut with the adhesive surface 4 facing upward, when the label tape 3 is obliquely cut by the laser, a portion of the adhesive surface of the label tape 3 facing upward is cut off, and the outer edge of the cut piece 5 forms a conical structure, and the downward pattern surface 16 of the cut piece 5, that is, the lower part, is now the lower end surface of the conical structure; in this way, when the cut piece 5 is viewed from the front of the pattern surface 16, the outer edge of the cut piece 5 will no longer have a residual structure, so the pattern surface 16 of the cut piece 5 will not have yellow edges or white prints, thereby achieving a better visual effect. wherein, the adhesive surface 4 facing upward refers to the direction perpendicular to the conveying direction of the adhesive surface 4 facing the adsorption conveyor belt 1 relative to the adsorption conveyor belt 1.

[0030] In one embodiment, a waste collection module 6 is provided on one side of the laser 2 in the positive direction of the conveying direction of the adsorption conveyor belt 1 , and the portion of the label material belt 3 from which the cut pieces 5 are removed is recovered by the waste collection module 6 .

[0031] In the above scheme, the waste collection module 6 is a conventional component of label die-cutting, and the waste collection module 6 is used to recycle the label material tape 3 with the adhesive surface 4 after laser die-cutting, so that only the cut pieces 5 are left on the adsorption conveyor belt 1 later.

[0032] In one embodiment, the laser die-cutting mechanism includes a raw material conveying module 8 for conveying raw material 7, the raw material 7 includes a base paper 9 and the label material tape 3 attached to the base paper 9, the raw material conveying module 8 includes a raw material discharge cylinder 10 for discharging the raw material 7, a plurality of base paper traction shafts 11 and a plurality of label traction shafts 12, after the raw material 7 is discharged from the raw material discharge cylinder 10, the base paper 9 and the label material tape 3 are separated, and the base paper 9 is conveyed in conjunction with the base paper traction shaft 11, and the label material tape 3 is conveyed in conjunction with the label traction shaft 12, and the label material tape 3 is transferred from the label traction shaft 12 to the adsorption conveyor belt 1.

[0033] In one embodiment, a pressure roller 13 is provided on one side of the laser 2 in the positive direction of the conveying direction of the adsorption conveyor belt 1, and the pressure roller 13 is located above the adsorption conveyor belt 1. The base paper 9 passes under the pressure roller 13 during transportation, and the base paper 9 is bonded to the rubber surface 4 of the cut piece 5 through the pressure roller 13.

[0034] In the above scheme, during the conveying process, the base paper 9 is folded to the side of the positive direction of the conveying direction of the adsorption conveyor belt 1, and before the pressure roller 13, the base paper 9 is attached to the label material belt 3 above the adhesive surface 4 of the label material belt 3 and is compounded by the pressure roller to form a new material belt. Among them, when the raw material discharge cylinder 10 is set on the positive direction side of the laser 2 along the conveying direction of the adsorption conveyor belt 1, a plurality of label traction shafts 12 are set in a layout manner to bypass the laser 2; when the raw material discharge cylinder 10 is set on the opposite direction side of the laser 2 along the conveying direction of the adsorption conveyor belt 1, a plurality of base paper traction shafts 11 are set in a layout manner to bypass the laser 2. In addition, when attached, the conveying direction of the base paper 9 is the same as the conveying direction of the cut piece 5.

[0035] In one embodiment, the laser die-cutting mechanism includes a material receiving module 14 for receiving the base paper 9 and the cut pieces 5 after bonding, and the material receiving module 14 includes a material receiving cylinder 15 .

[0036] In one embodiment, the laser head is vertically oriented toward the adsorption conveyor belt 1 .

[0037] In one embodiment, the adsorption conveyor belt 1 is a vacuum adsorption conveyor belt.

[0038] Another aspect of the present invention is to provide a laser die cutting method, comprising the following steps:

[0039] Step S1, separating the base paper 9 and the label tape 3 in the raw material 7 and transporting them in two ways;

[0040] Step S2, the label material tape 3 has an adhesive surface 4, and the label material tape 3 passes through the adsorption conveyor belt 1 with the adhesive surface 4 facing upward. A laser 2 is provided on one side of the adsorption conveyor belt 1, and the laser 2 die-cuts a preset pattern toward the label material tape 3 on the adsorption conveyor belt 1, and the portion of the label material tape 3 on which the preset pattern is die-cut is defined as a cut piece 5;

[0041] Step S3, the portion of the label material tape 3 except the cut pieces 5 is recycled through the waste collection module 6, and the cut pieces 5 continue to be transported along the suction conveyor belt 1;

[0042] Step S4, on the side of the laser 2 located in the positive direction of the conveying direction of the adsorption conveyor belt 1, the base paper 9 is conveyed to the adsorption conveyor belt 1 and abuts against the adhesive surface 4 of the cut piece 5, so that the base paper 9 and the cut piece 5 are compounded;

[0043] In step S5 , the composite base paper 9 and the cut pieces 5 are collected by the collecting drum 15 .

[0044] In the above scheme, one side of the label tape 3 is the adhesive surface and the other side is the pattern surface 16. The laser head cuts the cut piece 5 toward the label tape 3 on the adsorption conveyor belt 1, and the cut piece 5 will continue to be conveyed along the adsorption conveyor belt 1. In particular, since the label tape 3 is laser-cut with the adhesive surface 4 facing upward, the label tape 3 is obliquely cut by the laser to form a conical structure, and a portion of the adhesive surface 4 facing upward of the cut piece 5 is cut off, and the downward surface of the cut piece 5, that is, the lower pattern surface 16, is now the lower end surface of the conical structure. In this way, if the cut piece 5 is viewed from the front of the pattern surface 16, there will be no residual structure on the outer edge of the cut piece 5, so the pattern surface 16 will not have yellow edges or white prints, thereby achieving a better visual effect. In particular, the adhesive surface 4 facing upward refers to the direction perpendicular to the conveying direction of the adhesive surface 4 facing the adsorption conveyor belt 1 relative to the adsorption conveyor belt 1.

[0045] In one embodiment, in step S4, a pressure roller 13 is provided on the side of the laser 2 located in the positive direction of the conveying direction of the adsorption conveyor belt 1, and the pressure roller 13 is located above the adsorption conveyor belt 1. During the conveying process, the base paper 9 is attached to the rubber surface 4 of the cut piece 5 through the pressure roller 13. When attached, the conveying direction of the base paper 9 is the same as the conveying direction of the cut piece 5.

[0046] In one embodiment, the laser 2 is located on a vertical line of the adsorption conveyor belt 1 , and the laser 2 is facing the adsorption conveyor belt 1 .

Claims

1. A laser die-cutting mechanism, characterized in that: The invention comprises an adsorption conveyor belt (1), a laser (2) and a label material belt (3) to be laser die-cut, wherein the label material belt (3) has an adhesive surface (4), and the label material belt (3) is conveyed on the adsorption conveyor belt (1) with the adhesive surface (4) facing upwards, and the laser head of the laser (2) faces the adsorption conveyor belt (1), and the laser head die-cuts the label material belt (3) on the adsorption conveyor belt (1) into a cut piece (5).

2. A laser die-cutting mechanism according to claim 1, characterized in that: A waste collection module (6) is provided on one side of the laser (2) located in the positive direction of the conveying direction of the adsorption conveyor belt (1), and the portion of the label material belt (3) from which the cut pieces (5) are removed is recovered by the waste collection module (6).

3. A laser die-cutting mechanism according to claim 1, characterized in that: The laser die-cutting mechanism comprises a material conveying module (8) for conveying a material (7), wherein the material (7) comprises a base paper (9) and the label material tape (3) attached to the base paper (9), and the material conveying module (8) comprises a material discharge cylinder (10) for discharging the material (7), a plurality of base paper traction shafts (11) and a plurality of label traction shafts (12). After the material (7) is discharged from the material discharge cylinder (10), the base paper (9) and the label material tape (3) are separated, and the base paper (9) cooperates with the base paper traction shaft (11) for conveying, and the label material tape (3) cooperates with the label traction shaft (12) for conveying, and the label material tape (3) is transferred from the label traction shaft (12) to the adsorption conveyor belt (1).

4. A laser die-cutting mechanism according to claim 3, characterized in that: A pressure roller (13) is provided on one side of the laser (2) located in the positive direction of the conveying direction of the adsorption conveyor belt (1); the pressure roller (13) is located above the adsorption conveyor belt (1); the base paper (9) passes under the pressure roller (13) during conveyance, and the base paper (9) is bonded to the rubber surface (4) of the cut piece (5) through the pressure roller (13).

5. A laser die-cutting mechanism according to claim 4, characterized in that: The laser die-cutting mechanism comprises a material receiving module (14) for receiving the base paper (9) and the cut piece (5) after bonding, and the material receiving module (14) comprises a material receiving cylinder (15).

6. A laser die-cutting mechanism according to claim 1, characterized in that: The laser head is vertically oriented toward the adsorption conveyor belt (1).

7. A laser die-cutting mechanism according to claim 2, characterized in that: The adsorption conveyor belt (1) is a vacuum adsorption conveyor belt.

8. A laser die cutting method, characterized in that: The steps include: Step S1, separating the base paper (9) and the label tape (3) in the raw material (7) and transporting them in two ways; Step S2, the label material tape (3) has an adhesive surface (4), and the label material tape (3) passes through the adsorption conveyor belt (1) with the adhesive surface (4) facing upward. A laser (2) is provided on one side of the adsorption conveyor belt (1), and the laser (2) die-cuts a preset pattern toward the label material tape (3) on the adsorption conveyor belt (1), and the portion of the label material tape (3) on which the preset pattern is die-cut is defined as a cut piece (5); Step S3, the portion of the label material tape (3) except the cut pieces (5) is recycled through the waste collection module (6), and the cut pieces (5) continue to be transported along the suction conveyor belt (1); Step S4, on the side of the laser (2) located in the positive direction of the conveying direction of the adsorption conveyor belt (1), the base paper (9) is conveyed to the adsorption conveyor belt (1) and abutted against the adhesive surface (4) of the cut piece (5), so that the base paper (9) and the cut piece (5) are compounded; Step S5, the composite base paper (9) and the cut pieces (5) are collected by a collecting drum (15).

9. A laser die-cutting method according to claim 8, characterized in that: In step S4, a pressure roller (13) is provided on the side of the laser (2) located in the positive direction of the conveying direction of the adsorption conveyor belt (1), and the pressure roller (13) is located above the adsorption conveyor belt (1). During the conveying process, the base paper (9) is attached to the rubber surface (4) of the cut piece (5) through the pressure roller (13). When attached, the conveying direction of the base paper (9) is the same as the conveying direction of the cut piece (5).

10. A laser die-cutting method according to claim 8, characterized in that: The laser (2) is located on a vertical line of the adsorption conveyor belt (1), and the laser (2) is facing the adsorption conveyor belt (1).

Citation Information

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