High-vacuum seam welding device for butterfly-shaped semiconductor device

Abstract

The butterfly-shaped semiconductor device high-vacuum seam welding device comprises a welding cavity, two clamp inlets are formed in the outer surface of the welding cavity, a vacuum detection opening is fixedly connected to the bottom of the welding cavity, a vacuum pump connector is fixedly connected to the bottom of the welding cavity, and four supporting legs are evenly and fixedly installed at the bottom of the welding cavity; a cover plate is movably mounted at the top of the welding cavity; the movable mechanism is used for controlling the butterfly-shaped semiconductor device to move in the inner cavity of the welding cavity; the movable mechanism comprises a first motor; an output shaft of a second motor drives a second lead screw to rotate to drive a second sliding block to drive a workbench to move to the inner wall of a welding cavity, then an output shaft of a first motor drives three belt wheels to rotate through belt transmission, the belt wheels drive two first lead screws to rotate, the two first lead screws drive a first sliding block, and the second sliding block drives the workbench to move to the inner wall of the welding cavity. And at the moment, the electromagnet is electrified to attract the workbench, so that the workbench can be driven.

Description

Technical Field

[0001] The invention relates to the technical field of high vacuum seam welding, in particular to a high vacuum seam welding device for a butterfly-shaped semiconductor device. Background Art

[0002] With the development of semiconductor device packaging technology, the demand for semiconductor devices packaged in metal butterfly shells has increased. However, butterfly semiconductor devices used in special fields are high-end devices with extremely high stability and durability. They need to be evacuated to a high vacuum state before seam welding of the shell, so that the devices can adapt to extreme temperature, pressure, humidity, radiation and other environments. The manufacturing process is quite strict. In order to meet the requirements of high vacuum process in the seam welding process of butterfly semiconductor devices, this butterfly semiconductor device high vacuum seam welding device has been specially developed.

[0003] The seam welding process of conventional semiconductor butterfly device packaging is generally carried out in a nitrogen environment to ensure the welding effect and airtightness. Such devices can only be used without problems in commercial and industrial temperature environments.

[0004] However, the semiconductor butterfly devices produced by such seam welding process in the aerospace and deep sea fields cannot meet the requirements. In order to be used in special environments, semiconductor butterfly devices need to be seam welded under high vacuum conditions. After seam welding, the inside of the device is in a high vacuum state, and the vacuum degree can reach -5 levels, which can ensure that the semiconductor butterfly devices can be used normally in special environments without being affected by the environment.

[0005] The present invention adopts special functional design and manufacturing to provide a device that can ensure that the semiconductor butterfly device still has high air tightness during seam welding under non-commercial temperature, working temperature and other special environments. Summary of the invention

[0006] In order to make up for the shortcomings of the prior art and solve the problem of insufficient airtightness of semiconductor butterfly-shaped devices when welded in a nitrogen environment, the present invention proposes a high-vacuum seam welding device for butterfly-shaped semiconductor devices.

[0007] A butterfly-shaped semiconductor device high vacuum seam welding device comprises a welding chamber, wherein the outer surface of the welding chamber is provided with two clamp entrances, the bottom of the welding chamber is fixedly connected with a vacuum detection port, the bottom of the welding chamber is fixedly connected with a vacuum pump interface, the bottom of the welding chamber is evenly fixedly installed with four supporting legs, and the top of the welding chamber is movably installed with a cover plate;

[0008] Also included is a movable mechanism for controlling the butterfly-shaped semiconductor device to move within the welding cavity;

[0009] The movable mechanism includes a first motor, which is fixedly installed on one side of the welding chamber, and three pulleys are rotatably installed on the inner wall of the welding chamber. The output shaft of the first motor is fixedly connected to one side of one of the pulleys, and the three pulleys are driven by belts, wherein one side of two pulleys is fixedly connected to a first screw rod, and the outer surfaces of the two first screw rods are commonly threadedly connected to a first slider, a second motor is fixedly installed on one side of the welding chamber, the output shaft of the second motor is fixedly connected to a second screw rod, and the second screw rod is threadedly connected to a second slider, two limit blocks are fixedly installed on the bottom wall of the inner surface of the welding chamber, the second slider is slidably installed on the top of the limit block, and a workbench is slidably installed on the top of the second slider, and two third connecting blocks are movably installed on the inner wall of the welding chamber, and seam welding rollers are rotatably installed on the opposite surfaces of the two third connecting blocks.

[0010] Preferably, two first thread grooves are provided on one side of the first slider, the first screw rod is threadedly installed on the inner surface of the first thread groove, a first groove is provided on one side of the first slider, an electromagnet is fixedly installed on the inner surface of the first groove, a second thread groove is provided on one side of the second slider, the second slider is threadedly installed on the inner surface of the second thread groove, a limiting rod is fixedly installed on the inner wall of the welding cavity, and a sealing gasket is fixedly installed on the top of the inner surface of the welding cavity.

[0011] Preferably, two support blocks are fixedly installed on the top of the workbench, and a plurality of second grooves are provided on the opposite surfaces of the two support blocks. A spring is fixedly installed on the inner surface of the second groove, and a chuck is fixedly connected to one end of the spring. The chuck is slidably installed on the inner surface of the second groove, and a guide head is fixedly connected to one side of the chuck.

[0012] Preferably, two power connectors are fixedly installed on the outer surface of the welding cavity, two connecting rings are fixedly installed on the outer surface of the welding cavity, a first connecting block is rotatably installed on the inner surface of the connecting ring, two first connecting blocks are jointly fixedly installed on the top of the cover plate, two second connecting blocks are fixedly installed on the top of the cover plate, a rotating shaft is rotatably installed on one side of the second connecting block, a second electric telescopic rod is fixedly connected to the outer surface of the rotating shaft, a rotating block is fixedly connected to the bottom of the second electric telescopic rod, the rotating blocks are rotatably installed on both sides of the welding cavity, a first observation window is opened on one side of the welding cavity, and a second observation window is opened on the top of the cover plate.

[0013] Preferably, an installation groove is provided on the inner surface of one of the clamp entrances, two first electric telescopic rods are fixedly installed on the inner surface of the installation groove, a sealing block is fixedly connected to the bottom of the two first electric telescopic rods, and the sealing block is slidably installed on the inner surface of the installation groove.

[0014] Preferably, a third motor is fixedly installed on one side of the welding chamber, the output shaft of the third motor is fixedly connected to a connecting shaft, one end of the connecting shaft is fixedly connected to a gear, two fixing rings are fixedly installed on the inner wall of the welding chamber, a third groove is opened on the top of the fixing ring, a rack is slidably installed on the inner surface of the third groove, and one of the racks is meshed with the gear.

[0015] Preferably, a slide plate is fixedly connected to one side of the two racks, four reinforcement blocks are fixedly installed on the outer surface of the slide plate, and the four reinforcement blocks are evenly fixedly installed on one side of the two racks, a fourth groove is provided on one side of the slide plate, and two third sliding blocks are slidably installed on the inner surface of the fourth groove, and a third thread groove and a slide groove are provided on one side of the two third sliding blocks, a bidirectional threaded rod is threadedly installed on the inner surface of the third thread groove, one end of the bidirectional threaded rod is fixedly connected to a fourth motor, and the fourth motor is fixedly installed on one side of the slide plate, a sliding rod is slidably installed on the inner surfaces of the two slide grooves, and the sliding rod is fixedly installed on the inner surface of the fourth groove, the third connecting block is fixedly installed on one side of the third sliding block, a fourth connecting block is fixedly installed on the top of the third connecting block, and a pressure weight is movably installed on the outer surface of the fourth connecting block, and the two seam welding rollers are rotatably installed on the opposite surfaces of the two third connecting blocks.

[0016] Preferably, a third electric telescopic rod and a support plate are fixedly installed on one side of the welding cavity, one end of the third electric telescopic rod is fixedly connected to a fifth connecting block, one side of the fifth connecting block is fixedly connected to a sixth connecting block, one end of the sixth connecting block is fixedly connected to an eighth connecting block, one side of the eighth connecting block is movably connected to a push plate, two are provided on one side of the eighth connecting block, two inner surfaces of which are slidably provided with cylinders, one ends of the two cylinders are jointly fixedly installed on one side of the push plate, two fifth grooves are provided at the bottom of the support plate, the other ends of the two cylinders are jointly fixedly connected to a V-shaped connecting rod, one side of the V-shaped connecting rod is fixedly connected to the fourth electric telescopic rod, two seventh connecting blocks are fixedly installed on the bottom of the welding cavity, and the two seventh connecting blocks are jointly fixedly installed on the outer surface of the fourth electric telescopic rod.

[0017] The present invention is beneficial in that:

[0018] 1. The present invention firstly drives the second slider to move the workbench to the inner wall of the welding chamber through the second motor output shaft driving the second screw rod, and then drives the three pulleys to rotate through the first motor output shaft through belt transmission, and the pulleys rotate the two first screw rods, and the two first screw rods drive the first slider. At this time, the electromagnet is energized to adsorb the workbench, thereby realizing the driving of the workbench.

[0019] 2. The present invention moves the workbench to the inner wall of the welding chamber, and then drives the sixth connecting block and the eighth connecting block to push the butterfly-shaped semiconductor device on the top of the support plate to the top of the workbench by contracting the third electric telescopic rod. During the pushing process, the butterfly-shaped semiconductor device will pass through the guide head. At this time, the spring contracts and the clamp slides on the inner surface of the second groove. The spring can enable the guide head to clamp the butterfly-shaped semiconductor device tighter, thereby avoiding the active displacement of the butterfly semiconductor device during the seam welding of the butterfly semiconductor device.

[0020] 3. The present invention rotates the connecting shaft and the gear through the third motor output shaft, and the gear meshes with the rack. Further, when the rack slides on the inner surface of the third groove, the rack can slide with the slide plate. The fourth motor output shaft rotates the bidirectional threaded rod to change the positions of the two third connecting blocks and the seam welding roller according to the size of the butterfly-shaped semiconductor device. After the butterfly-shaped semiconductor device is seam welded, the fourth electric telescopic rod is contracted to make the V-shaped connecting rod slide on the inner surface with the cylinder, and further the cylinder pushes the push plate to push the butterfly-shaped semiconductor device out through the fixture entrance. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention;

[0023] Figure 2 A schematic diagram of the internal structure of a welding chamber according to an embodiment of the present invention;

[0024] Figure 3 A schematic diagram of a workbench structure according to an embodiment of the present invention;

[0025] Figure 4 A schematic diagram of a cover plate structure according to an embodiment of the present invention;

[0026] Figure 5 A schematic diagram of the installation slot structure of an embodiment of the present invention;

[0027] Figure 6 A schematic diagram of a fixing ring connection structure according to an embodiment of the present invention;

[0028] Figure 7 A schematic diagram of a sliding plate connection structure according to an embodiment of the present invention;

[0029] Figure 8The figure is a schematic diagram of a push plate driving structure according to an embodiment of the present invention.

[0030] In the figure: 1. welding chamber; 11. supporting leg; 101. vacuum pump interface; 13. fixture entrance; 131. mounting groove; 132. first electric telescopic rod; 133. sealing block; 14. limiting rod; 15. limiting block; 16. power connector; 17. sealing pad; 18. first observation window; 19. vacuum detection port; 2. first motor; 21. pulley; 22. belt; 23. first screw rod; 24. first slider; 241. first thread groove; 242. first groove; 243. electromagnet; 3. second motor; 31. second screw rod; 32. second slider; 321. second thread groove; 33. workbench; 331. supporting block; 332. second groove; 333. spring; 334. chuck; 335. guide head; 41. connecting ring; 42. first connecting block; 43. cover plate; 44. rotating block; 45. second electric telescopic rod; 46, rotating shaft; 47, second connecting block; 48, second observation window; 5, third motor; 51, connecting shaft; 52, gear; 53, fixing ring; 531, third groove; 532, rack; 533, slide plate; 5331, fourth motor; 534, reinforcing block; 535, fourth groove; 536, third slide block; 5361, third threaded groove; 5362, slide groove; 537, slide rod; 538, bidirectional threaded rod; 54, third connecting block; 541, fourth connecting block; 542, pressure weight; 55, seam welding roller; 61, third electric telescopic rod; 62, fifth connecting block; 63, sixth connecting block; 64, eighth connecting block; 641, push plate; 65, support plate; 651, fifth groove; 652, V-shaped connecting rod; 653, cylinder; 66, seventh connecting block; 661, fourth electric telescopic rod. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] See also Figures 1 to 8As shown, a high vacuum seam welding device for butterfly-shaped semiconductor devices comprises a welding chamber 1, wherein two clamp entrances 13 are provided on the outer surface of the welding chamber 1, a vacuum detection port 19 is fixedly connected to the bottom of the welding chamber 1, a vacuum pump interface 101 is fixedly connected to the bottom of the welding chamber 1, four support legs 11 are evenly fixedly installed on the bottom of the welding chamber 1, and a cover plate 43 is movably installed on the top of the welding chamber 1; further comprising a movable mechanism for controlling the movement of the butterfly-shaped semiconductor device in the inner cavity of the welding chamber 1; the movable mechanism comprises a first motor 2, wherein the first motor 2 is fixedly installed on one side of the welding chamber 1, and three pulleys 21 are rotatably installed on the inner wall of the welding chamber 1, and the output shaft of the first motor 2 is fixedly connected to one side of the pulleys 21, and the three pulleys 21 are rotatably installed on the inner wall of the welding chamber 1, and the output shaft of the first motor 2 is fixedly connected to one side of the pulleys 21, and the three pulleys 21 are rotatably connected to ... three pulleys 21 are rotatably connected to the inner wall of the welding chamber 1, and the three pulleys 21 are rot The pulleys 21 are driven by belts 22, wherein one side of the two pulleys 21 is fixedly connected with a first screw rod 23, and the outer surfaces of the two first screw rods 23 are commonly threadedly connected with a first slider 24, a second motor 3 is fixedly installed on one side of the welding chamber 1, the output shaft of the second motor 3 is fixedly connected with a second screw rod 31, the second screw rod 31 is threadedly connected with a second slider 32, two limit blocks 15 are fixedly installed on the bottom wall of the inner surface of the welding chamber 1, the second slider 32 is slidably installed on the top of the limit block 15, and a workbench 33 is slidably installed on the top of the second slider 32, and two third connecting blocks 54 are movably installed on the inner wall of the welding chamber 1, and seam welding rollers 55 are rotatably installed on the opposite surfaces of the two third connecting blocks 54.

[0033] When seam welding is performed on a butterfly-shaped semiconductor device, if the seam welding is performed in an environment filled with nitrogen, the airtightness of the seam-welded butterfly-shaped semiconductor device is difficult to meet the use requirements.

[0034] When the present invention is in use, firstly, the butterfly-shaped semiconductor device is placed on the top of the workbench 33 in the inner cavity of the welding chamber 1 through the fixture entrance 13. When in use, the inner cavity of the welding chamber 1 is placed in a vacuum state through the vacuum pump interface 101. After the belt 22 is driven, the output shaft of the first motor 2 rotates with three pulleys 21, wherein two pulleys 21 rotate with two first screw rods 23, and the two first screw rods 23 drive the first slider 24 to move. The second motor 3 output shaft rotates with the second screw rod 31, and the second screw rod 31 drives the second slider 32. This can complete the driving of the workbench 33 on the X and Y axes, and further, the butterfly-shaped semiconductor device can be seam welded through two seam welding rollers 55.

[0035] Further, such as Figure 2As shown, two first thread grooves 241 are provided on one side of the first slider 24, the first screw rod 23 is threadedly installed on the inner surface of the first thread groove 241, a first groove 242 is provided on one side of the first slider 24, an electromagnet 243 is fixedly installed on the inner surface of the first groove 242, a second thread groove 321 is provided on one side of the second slider 32, the second slider 32 is threadedly installed on the inner surface of the second thread groove 321, a limiting rod 14 is fixedly installed on the inner wall of the welding cavity 1, and a sealing gasket 17 is fixedly installed on the top of the inner surface of the welding cavity 1.

[0036] When the present invention is in use, the first screw rod 23 rotates on the inner surface of the first thread groove 241 to drive the first slider 24 to move. The first slider 24 with the energized electromagnet 243 can adsorb the workbench 33 and further move the workbench 33. The second screw rod 31 is rotated on the inner surface of the second thread groove 321 to drive the second slider 32. The workbench 33 will first move with the second slider 32, thereby achieving the purpose of driving the workbench 33 on the X and Y axes.

[0037] Further, such as Figure 3 As shown, two support blocks 331 are fixedly installed on the top of the workbench 33, and a plurality of second grooves 332 are opened on the opposite surfaces of the two support blocks 331. A spring 333 is fixedly installed on the inner surface of the second groove 332, and a clamp 334 is fixedly connected to one end of the spring 333. The clamp 334 is slidably installed on the inner surface of the second groove 332, and a guide head 335 is fixedly connected to one side of the clamp 334.

[0038] When the present invention is in use, the butterfly-shaped semiconductor device enters the inner cavity of the welding cavity 1 through the fixture entrance 13. When installing the butterfly-shaped semiconductor device, the workbench 33 is close to the inner wall of the welding cavity 1, and the butterfly-shaped semiconductor device will slide along the workbench 33 to the top of the workbench 33. During this process, the butterfly-shaped semiconductor device will squeeze the guide head 335 and the clamp 334. The spring 333 further contracts. The spring 333 can make the clamp 334 have a squeezing force on the butterfly-shaped semiconductor device, making the butterfly-shaped semiconductor device more stable on the top of the workbench 33. Several guide heads 335 are conducive to installing the butterfly-shaped semiconductor device on the top of the workbench 33.

[0039] Further, such as Figure 4As shown, two power connectors 16 are fixedly installed on the outer surface of the welding chamber 1, two connecting rings 41 are fixedly installed on the outer surface of the welding chamber 1, a first connecting block 42 is rotatably installed on the inner surface of the connecting ring 41, two first connecting blocks 42 are jointly fixedly installed on the top of the cover plate 43, two second connecting blocks 47 are fixedly installed on the top of the cover plate 43, a rotating shaft 46 is rotatably installed on one side of the second connecting block 47, a second electric telescopic rod 45 is fixedly connected to the outer surface of the rotating shaft 46, a rotating block 44 is fixedly connected to the bottom of the second electric telescopic rod 45, the rotating block 44 is rotatably installed on both sides of the welding chamber 1, a first observation window 18 is opened on one side of the welding chamber 1, and a second observation window 48 is opened on the top of the cover plate 43.

[0040] When the present invention is in use, the position of the cover plate 43 can be adjusted by extending and shortening the second electric telescopic rod 45. During adjustment, the first connecting block 42 rotates on the inner surface of the connecting ring 41, the rotating shaft 46 rotates on one side of the second connecting block 47, and the rotating block 44 rotates on the outer surface of the welding chamber 1. During seam welding, the staff observes the seam welding situation through the first observation window 18 and the second observation window 48.

[0041] Further, such as Figure 5 As shown, an installation groove 131 is opened on the inner surface of one of the clamp entrances 13, and two first electric telescopic rods 132 are fixedly installed on the inner surface of the installation groove 131. A sealing block 133 is fixedly connected to the bottom of the two first electric telescopic rods 132, and the sealing block 133 is slidably installed on the inner surface of the installation groove 131.

[0042] When the present invention is in use, the inner cavity of the welding cavity 1 needs to be in a sealed state. The first electric telescopic rod 132 is extended to carry the sealing block 133 to slide in the inner cavity of the installation groove 131, so that the sealing block 133 can seal the clamp inlet 13, thereby achieving a sealing effect on the inner cavity of the welding cavity 1.

[0043] Further, such as Figure 6 and Figure 7 As shown, a third motor 5 is fixedly installed on one side of the welding chamber 1, and the output shaft of the third motor 5 is fixedly connected to a connecting shaft 51, and one end of the connecting shaft 51 is fixedly connected to a gear 52. Two fixing rings 53 are fixedly installed on the inner wall of the welding chamber 1, and a third groove 531 is opened on the top of the fixing ring 53. A rack 532 is slidably installed on the inner surface of the third groove 531, and one of the racks 532 is meshed with the gear 52;

[0044] A slide plate 533 is fixedly connected to one side of the two racks 532. Four reinforcing blocks 534 are fixedly installed on the outer surface of the slide plate 533. The four reinforcing blocks 534 are evenly fixedly installed on one side of the two racks 532. A fourth groove 535 is provided on one side of the slide plate 533. Two third sliders 536 are slidably installed on the inner surface of the fourth groove 535. A third thread groove 5361 and a slide groove 5362 are provided on one side of the two third sliders 536. A bidirectional threaded rod 538 is threadedly installed on the inner surface of the third thread groove 5361. The bidirectional threaded rod 538 is threadedly installed on the inner surface of the bidirectional threaded rod 53 8 is fixedly connected to a fourth motor 5331 at one end, and the fourth motor 5331 is fixedly installed on one side of the slide plate 533. A slide bar 537 is slidably installed on the inner surfaces of the two slide grooves 5362, and the slide bar 537 is fixedly installed on the inner surface of the fourth groove 535. The third connecting block 54 is fixedly installed on one side of the third sliding block 536. A fourth connecting block 541 is fixedly installed on the top of the third connecting block 54, and a pressure weight 542 is movably installed on the outer surface of the fourth connecting block 541. The two seam welding rollers 55 are rotatably installed on the opposite surfaces of the two third connecting blocks 54.

[0045] When the present invention is in use, the output shaft of the third motor 5 drives the connecting shaft 51 to rotate, and the connecting shaft 51 further drives the gear 52 to rotate. The engagement of the gear 52 with the rack 532 can drive the rack 532 to slide on the inner surface of the third groove 531, thereby achieving the purpose of adjusting the seam welding position on the Z axis. The output shaft of the fourth motor 5331 drives the bidirectional threaded rod 538 to rotate, and the bidirectional threaded rod 538 rotates on the inner surface of the third threaded groove 5361, which can drive the two third sliders 536 to move toward each other, thereby enabling the two third connecting blocks 54 to move. The two third connecting blocks 54 further drive the seam welding roller 55 to move, thereby achieving the purpose of seam welding different positions of the butterfly-shaped semiconductor device.

[0046] Further, such as Figure 8As shown, a third electric telescopic rod 61 and a support plate 65 are fixedly installed on one side of the welding chamber 1, one end of the third electric telescopic rod 61 is fixedly connected to a fifth connecting block 62, one side of the fifth connecting block 62 is fixedly connected to a sixth connecting block 63, one end of the sixth connecting block 63 is fixedly connected to an eighth connecting block 64, one side of the eighth connecting block 64 is movably connected to a push plate 641, one side of the eighth connecting block 64 is provided with two 642, and cylinders 653 are slidably installed on the inner surfaces of the two 642, and one end of the two cylinders 653 is jointly fixedly installed on one side of the push plate 641, and two fifth grooves 651 are provided at the bottom of the support plate 65, and the other ends of the two cylinders 653 are jointly fixedly connected to a V-shaped connecting rod 652, and one side of the V-shaped connecting rod 652 is fixedly connected to a fourth electric telescopic rod 661, and two seventh connecting blocks 66 are fixedly installed at the bottom of the welding chamber 1, and the two seventh connecting blocks 66 are jointly fixedly installed on the outer surface of the fourth electric telescopic rod 661.

[0047] When the present invention is in use, firstly, the third electric telescopic rod 61 is shortened to move the fifth connecting block 62 and the sixth connecting block 63, and further drive the eighth connecting block 64 to block one of the fixture entrances 13, and the fixture entrance 13 on the other side is blocked by the sealing block 133. After the butterfly-shaped semiconductor device is seam-welded, the butterfly-shaped semiconductor device needs to be pushed out. At this time, the fourth electric telescopic rod 661 is shortened, and the output shaft of the fourth electric telescopic rod 661 will move with the V-shaped connecting rod 652 and the cylinder 653. The cylinder 653 slides on the inner surface of 642, and the cylinder 653 pushes the push plate 641 to move. At this time, the push plate 641 moves to the inner cavity of the welding chamber 1, and the butterfly-shaped semiconductor device can be pushed to the top of the workbench 33. As the push plate 641 moves, the butterfly-shaped semiconductor device can be pushed out through the fixture entrance 13.

[0048] Working principle: First, the second motor 3 output shaft drives the second screw rod 31 to rotate and drive the second slider 32 to move the workbench 33 to the inner wall of the welding chamber 1. Then, the first motor 2 output shaft drives the three pulleys 21 to rotate through the belt 22. The pulleys 21 rotate the two first screw rods 23. The two first screw rods 23 drive the first slider 24. At this time, the electromagnet 243 is energized to adsorb the workbench 33, and then the workbench 33 can be driven. After moving the workbench 33 to the inner wall of the welding chamber 1, The butterfly-shaped semiconductor device at the top of the support plate 65 drives the sixth connecting block 63 and the eighth connecting block 64 to push the butterfly-shaped semiconductor device to the top of the workbench 33 through the contraction of the third electric telescopic rod 61. During the pushing process, the butterfly-shaped semiconductor device passes through the guide head 335. At this time, the spring 333 contracts, and the clamp 334 slides on the inner surface of the second groove 332. The spring 333 can enable the guide head 335 to clamp the butterfly-shaped semiconductor device tighter, thereby avoiding the active displacement of the butterfly semiconductor device during the seam welding of the butterfly semiconductor device.

[0049] The output shaft of the third motor 5 drives the connecting shaft 51 and the gear 52 to rotate, and the gear 52 is meshed with the rack 532. Further, when the rack 532 slides on the inner surface of the third groove 531, the rack 532 can slide with the slide plate 533. The output shaft of the fourth motor 5331 drives the bidirectional threaded rod 538 to rotate, so that the positions of the two third connecting blocks 54 and the seam welding roller 55 can be changed according to the size of the butterfly-shaped semiconductor device. After the butterfly-shaped semiconductor device is seam welded, the fourth electric telescopic rod 661 is contracted to make the V-shaped connecting rod 652 slide with the cylinder 653 on the inner surface of 642. Further, the cylinder 653 pushes the push plate 641 to push the butterfly-shaped semiconductor device out through the fixture entrance 13.

[0050] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0051] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. A butterfly-shaped semiconductor device high vacuum seam welding device, comprising a welding chamber (1), wherein the outer surface of the welding chamber (1) is provided with two fixture entrances (13), the bottom of the welding chamber (1) is fixedly connected with a vacuum detection port (19), the bottom of the welding chamber (1) is fixedly connected with a vacuum pump interface (101), the bottom of the welding chamber (1) is evenly fixedly installed with four support legs (11), and the top of the welding chamber (1) is movably installed with a cover plate (43); It also includes a movable mechanism for controlling the movement of the butterfly-shaped semiconductor device in the welding cavity (1); Features: The movable mechanism comprises a first motor (2), the first motor (2) being fixedly mounted on one side of the welding chamber (1), three pulleys (21) being rotatably mounted on the inner wall of the welding chamber (1), the output shaft of the first motor (2) being fixedly connected to one side of one of the pulleys (21), the three pulleys (21) being driven via a belt (22), one side of two of the pulleys (21) being fixedly connected to a first screw rod (23), the outer surfaces of the two first screw rods (23) being commonly threadedly connected to a first slider (24), and a second The motor (3) is provided with a second screw rod (31) fixedly connected to the output shaft of the second motor (3), the second screw rod (31) is threadedly connected to the second slider (32), two limit blocks (15) are fixedly installed on the bottom wall of the inner surface of the welding chamber (1), the second slider (32) is slidably installed on the top of the limit block (15), a workbench (33) is slidably installed on the top of the second slider (32), and two third connecting blocks (54) are movably installed on the inner wall of the welding chamber (1), and seam welding rollers (55) are rotatably installed on the opposite surfaces of the two third connecting blocks (54).

2. A butterfly-shaped semiconductor device high vacuum seam welding device according to claim 1, characterized in that: Two first thread grooves (241) are provided on one side of the first slider (24), the first screw rod (23) is threadedly mounted on the inner surface of the first thread groove (241), a first groove (242) is provided on one side of the first slider (24), an electromagnet (243) is fixedly mounted on the inner surface of the first groove (242), a second thread groove (321) is provided on one side of the second slider (32), the second slider (32) is threadedly mounted on the inner surface of the second thread groove (321), a limiting rod (14) is fixedly mounted on the inner wall of the welding cavity (1), and a sealing gasket (17) is fixedly mounted on the top of the inner surface of the welding cavity (1).

3. A butterfly-shaped semiconductor device high vacuum seam welding device according to claim 2, characterized in that: Two support blocks (331) are fixedly installed on the top of the workbench (33), and a plurality of second grooves (332) are provided on opposite surfaces of the two support blocks (331). A spring (333) is fixedly installed on the inner surface of the second groove (332), and one end of the spring (333) is fixedly connected to a chuck (334). The chuck (334) is slidably installed on the inner surface of the second groove (332), and one side of the chuck (334) is fixedly connected to a guide head (335).

4. A butterfly-shaped semiconductor device high vacuum seam welding device according to claim 3, characterized in that: Two power connectors (16) are fixedly mounted on the outer surface of the welding chamber (1); two connecting rings (41) are fixedly mounted on the outer surface of the welding chamber (1); a first connecting block (42) is rotatably mounted on the inner surface of the connecting ring (41); the two first connecting blocks (42) are fixedly mounted on the top of a cover plate (43); two second connecting blocks (47) are fixedly mounted on the top of the cover plate (43); a rotating shaft (46) is rotatably mounted on one side of the second connecting block (47); a second electric telescopic rod (45) is fixedly connected to the outer surface of the rotating shaft (46); a rotating block (44) is fixedly connected to the bottom of the second electric telescopic rod (45); the rotating block (44) is rotatably mounted on both sides of the welding chamber (1); a first observation window (18) is provided on one side of the welding chamber (1); and a second observation window (48) is provided on the top of the cover plate (43).

5. A butterfly-shaped semiconductor device high vacuum seam welding device according to claim 4, characterized in that: An installation groove (131) is provided on the inner surface of one of the clamp entrances (13), and two first electric telescopic rods (132) are fixedly installed on the inner surface of the installation groove (131). A sealing block (133) is fixedly connected to the bottom of the two first electric telescopic rods (132), and the sealing block (133) is slidably installed on the inner surface of the installation groove (131).

6. A butterfly-shaped semiconductor device high vacuum seam welding device according to claim 5, characterized in that: A third motor (5) is fixedly mounted on one side of the welding chamber (1); an output shaft of the third motor (5) is fixedly connected to a connecting shaft (51); one end of the connecting shaft (51) is fixedly connected to a gear (52); two fixing rings (53) are fixedly mounted on the inner wall of the welding chamber (1); a third groove (531) is formed on the top of the fixing ring (53); a rack (532) is slidably mounted on the inner surface of the third groove (531); one of the racks (532) is meshed with the gear (52).

7. A butterfly-shaped semiconductor device high vacuum seam welding device according to claim 6, characterized in that: A slide plate (533) is fixedly connected to one side of the two racks (532). Four reinforcing blocks (534) are fixedly installed on the outer surface of the slide plate (533). The four reinforcing blocks (534) are evenly fixedly installed on one side of the two racks (532). A fourth groove (535) is provided on one side of the slide plate (533). Two third sliding blocks (536) are slidably installed on the inner surface of the fourth groove (535). A third thread groove (5361) and a slide groove (5362) are provided on one side of the two third sliding blocks (536). A bidirectional threaded rod (538) is threadedly installed on the inner surface of the third thread groove (5361). One end of the bidirectional threaded rod (538) is fixedly connected to a fourth motor (5331). The fourth motor (5331) is fixedly installed on one side of the slide plate (533). A sliding rod (537) is slidably installed on the inner surface of the two slide grooves (5362). The sliding rod (537) is fixedly installed on the inner surface of the fourth groove (535).

8. A butterfly-shaped semiconductor device high vacuum seam welding device according to claim 7, characterized in that: The third connecting block (54) is fixedly mounted on one side of the third sliding block (536); a fourth connecting block (541) is fixedly mounted on the top of the third connecting block (54); a pressure weight (542) is movably mounted on the outer surface of the fourth connecting block (541); and the two seam welding rollers (55) are rotatably mounted on opposite surfaces of the two third connecting blocks (54).

9. A butterfly-shaped semiconductor device high vacuum seam welding device according to claim 8, characterized in that: A third electric telescopic rod (61) and a support plate (65) are fixedly installed on one side of the welding chamber (1); one end of the third electric telescopic rod (61) is fixedly connected to a fifth connecting block (62); one side of the fifth connecting block (62) is fixedly connected to a sixth connecting block (63); one end of the sixth connecting block (63) is fixedly connected to an eighth connecting block (64); and one side of the eighth connecting block (64) is movably connected to a push plate (641).

10. A butterfly-shaped semiconductor device high vacuum seam welding device according to claim 9, characterized in that: The eighth connecting block (64) is provided with two (642) on one side, and cylinders (653) are slidably mounted on the inner surfaces of the two (642), and one end of the two cylinders (653) is fixedly mounted on one side of the push plate (641). The bottom of the support plate (65) is provided with two fifth grooves (651), and the other ends of the two cylinders (653) are fixedly connected to a V-shaped connecting rod (652), and one side of the V-shaped connecting rod (652) is fixedly connected to a fourth electric telescopic rod (661). The bottom of the welding cavity (1) is fixedly mounted with two seventh connecting blocks (66), and the two seventh connecting blocks (66) are fixedly mounted on the outer surface of the fourth electric telescopic rod (661).

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