Wafer taking and placing device

Abstract

The invention provides a wafer taking and placing device, and relates to the technical field of semiconductors, and the wafer taking and placing device comprises a first supporting arm and a second supporting arm which are connected in a crossed manner; the first supporting arm and the second supporting arm are used for bearing a wafer; the first driving structure is connected with the first supporting arm and the second supporting arm, and the first driving structure is used for adjusting the cross angle between the first supporting arm and the second supporting arm; at least one of the first supporting arm and the second supporting arm is connected with the second driving structure, the second driving structure is used for driving the first supporting arm and the second supporting arm to move, and the first supporting arm and the second supporting arm put the wafer into the wafer box or take the wafer out of the wafer box through movement. According to the invention, the wafers of different sizes are taken and placed only through the two supporting arms, the size of the supporting structure is reduced as much as possible, interference between the supporting structure and a wafer box is avoided, and the process of taking and placing the wafers of different sizes is realized.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer placing and retrieving device. Background Art

[0002] Existing wafer boxes for storing wafers have different sizes, and the sizes of the wafers stored are also different. When the wafers are transferred to the card slots of the wafer box by the robot arm, or the wafers are taken out from the card slots of the wafer box, since the size of the robot arm is fixed, it will interfere with the card slots of wafer boxes of different sizes, that is, it will be incompatible with wafer boxes of different sizes, affecting the production efficiency and flexibility of wafer placement. Summary of the invention

[0003] An embodiment of the present invention provides a wafer fetching and placing device, which is used to solve the problem of incompatibility caused by fetching and placing wafers from wafer boxes of different sizes by a robot arm in the prior art.

[0004] To solve the above technical problems, the embodiments of the present invention provide the following technical solutions:

[0005] An embodiment of the present invention provides a wafer placing device, comprising:

[0006] A first supporting arm and a second supporting arm are cross-connected; the first supporting arm and the second supporting arm are used to carry a wafer;

[0007] a first driving structure, the first driving structure being connected to the first supporting arm and the second supporting arm respectively, and the first driving structure being used to adjust a crossing angle between the first supporting arm and the second supporting arm;

[0008] A second driving structure, at least one of the first supporting arm and the second supporting arm is connected to the second driving structure, and the second driving structure is used to drive the first supporting arm and the second supporting arm to move, and the first supporting arm and the second supporting arm put the wafer into the wafer box or take the wafer out of the wafer box through movement.

[0009] In some embodiments, two first support blocks are provided on the first support arm;

[0010] Two second support blocks are arranged on the second support arm;

[0011] The two first supporting blocks and the two second supporting blocks are used for supporting the wafer;

[0012] Two first support blocks are arranged on both sides of the intersection of the first support arm and the second support arm;

[0013] The two second support blocks are arranged on both sides of the intersection of the first support arm and the second support arm.

[0014] In some embodiments, the upper surfaces of the first support block and the second support block are provided with anti-slip textures.

[0015] In some embodiments, two of the first support blocks are symmetrically arranged on both sides of the intersection of the first support arm and the second support arm;

[0016] The two second support blocks are symmetrically arranged on both sides of the intersection of the first support arm and the second support arm.

[0017] In some embodiments, a first end of at least one of the first support arm and the second support arm is connected to the second driving structure;

[0018] The distance between the intersection of the first support arm and the second support arm and the second end of the first support arm is smaller than the distance between the intersection of the first support arm and the second support arm and the first end of the first support arm; the first end of the first support arm and the second end of the first support arm are opposite ends;

[0019] The distance between the intersection of the first support arm and the second support arm and the second end of the second support arm is smaller than the distance between the intersection of the first support arm and the second support arm and the first end of the second support arm; the first end of the second support arm and the second end of the second support arm are opposite ends.

[0020] In some embodiments, the intersection between the first support arm and the second support arm is fixedly connected by a connecting block.

[0021] In some embodiments, the first supporting block and the second supporting block are made of polymer materials.

[0022] In some embodiments, the first driving structure is connected to a first position on the first support arm and a second position on the second support arm respectively;

[0023] The first position is between the first support block and the first end of the first support arm;

[0024] The second position is between the second support block and the first end of the second support arm;

[0025] Wherein, a first end of at least one of the first supporting arm and the second supporting arm is connected to the second driving structure.

[0026] In some embodiments, the second driving structure includes a carrier plate, a rotating shaft and a driving device;

[0027] The carrier plate is disposed above the rotating shaft, and the driving device is connected to the rotating shaft;

[0028] At least one of the first supporting arm and the second supporting arm is connected to the carrying plate;

[0029] The driving device is used to drive the carrying plate to drive the first supporting arm and the second supporting arm to rotate along the rotating shaft.

[0030] In some embodiments, the first drive structure includes: a pneumatic slide;

[0031] The pneumatic slide rails are connected to the first support arm and the second support arm respectively;

[0032] The pneumatic slide rail is capable of extension and retraction, and the crossing angle between the first support arm and the second support arm is adjusted through the extension and retraction of the pneumatic slide rail.

[0033] The embodiments of the present invention have the following beneficial effects:

[0034] The wafer placement device provided in the embodiment of the present invention uses a first support arm and a second support arm that are cross-arranged to carry wafers, and drives the crossing angle between the first support arm and the second support arm through a first driving structure to support wafers of different sizes to adapt to wafer boxes of different sizes, and drives the first support arm and the second support arm to move through the second driving structure to drive the wafer to be placed in the wafer box or to be taken out of the wafer box. That is, the embodiment of the present invention only uses two support arms to achieve the placement of wafers of different sizes. While ensuring the stability of the support, the size of the support structure is reduced as much as possible to avoid interference with the wafer box, and the placement process of wafers of different sizes can also be achieved by adjusting the crossing angle between the two support arms. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram showing the three-dimensional structure of a wafer pick-and-place device provided in an embodiment of the present invention;

[0036] Figure 2 A top view of a wafer carried by a wafer placing device provided by an embodiment of the present invention is shown.

[0037] Description of reference numerals:

[0038] 1-first support arm; 2-second support arm; 3-wafer; 4-first driving structure; 5-first support block; 6-second support block; 7-connecting block; 8-carrying plate; 9-rotating shaft. DETAILED DESCRIPTION

[0039] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0040] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0041] In order to solve the incompatibility problem in the prior art when wafers are taken and placed from wafer boxes of different sizes by a robot arm, an embodiment of the present invention provides a wafer taking and placing device.

[0042] like Figure 1 and Figure 2 As shown, the present invention provides a wafer placement device, comprising:

[0043] A first supporting arm 1 and a second supporting arm 2 are cross-connected; the first supporting arm 1 and the second supporting arm 2 are used to carry a wafer 3 .

[0044] When the wafer 3 is carried by the crossed first supporting arm 1 and the second supporting arm 2 , the wafer 3 is placed above the crossed first supporting arm 1 and the second supporting arm 2 .

[0045] in, Figure 1 A schematic diagram of the three-dimensional structure of a wafer pick-and-place device provided in an embodiment of the present invention, Figure 2 A top view of a wafer carried by a wafer placement device provided in an embodiment of the present invention.

[0046] The first driving structure 4 is connected to the first supporting arm 1 and the second supporting arm 2 respectively, and the first driving structure 4 is used to adjust the crossing angle between the first supporting arm 1 and the second supporting arm 2.

[0047] The connection between the first driving structure 4 and the first support arm 1 and the second support arm 2 is located on the same side of the intersection position (or intersection point) of the first support arm 1 and the second support arm 2 .

[0048] The connection position between the first driving structure 4 and the first supporting arm 1 and the second supporting arm 2 may be movable or fixed.

[0049] Specifically, when the connection position between the first drive structure 4 and the first support arm 1 and the second support arm 2 is movable, the first support arm 1 and the second support arm 2 can be respectively connected to the corresponding slots, and the two ends of the first drive structure 4 are respectively connected to the slots, and the first drive structure 4 can move along the slots toward or away from the intersection of the first support arm 1 and the second support arm 2. By moving the first drive structure 4 toward the direction close to the intersection of the first support arm 1 and the second support arm 2, the intersection angle between the first support arm 1 and the second support arm 2 is increased, and by moving the first drive structure 4 toward the direction away from the intersection of the first support arm 1 and the second support arm 2, the intersection angle between the first support arm 1 and the second support arm 2 is reduced. In this setting, the length of the first drive structure 4 can be fixed.

[0050] When the connection position between the first drive structure 4 and the first support arm 1 and the second support arm 2 is fixed, the first drive structure 4 can be set to be variable in length, that is, the first drive structure 4 can be telescopic, and the crossing angle between the first support arm 1 and the second support arm 2 can be increased by extending the first drive structure 4, and the crossing angle between the first support arm 1 and the second support arm 2 can be decreased by shortening the first drive structure 4.

[0051] In the embodiment of the present invention, by adjusting the crossing angle between the first support arm 1 and the second support arm 2 through the first driving structure, wafers of different sizes can be supported by the first support arm 1 and the second support arm 2 to accommodate wafer boxes of different sizes.

[0052] Among them, when the crossing angle between the first support arm 1 and the second support arm 2 is 90°, the size of the wafer it can support is the largest. When the crossing angle between the first support arm 1 and the second support arm 2 is larger or smaller than 90°, the size of the wafer it can support is reduced.

[0053] A second driving structure, at least one of the first supporting arm 1 and the second supporting arm 2 is connected to the second driving structure, and the second driving structure is used to drive the first supporting arm 1 and the second supporting arm 2 to move, and the first supporting arm 1 and the second supporting arm 2 put the wafer into the wafer box or take the wafer out of the wafer box through movement.

[0054] Among them, the second driving structure can be connected to only one of the first support arm 1 and the second support arm 2, and the connection method can be fixed. For example, only the first support arm 1 is connected to the second driving structure, and the second support arm 2 is not connected to the second driving structure. This design method can enable the first driving structure 4 to adjust the crossing angle between the first support arm 1 and the second support arm 2, avoiding interference between the fixed first support arm 1 and the second support arm 2 and the first driving structure 4, affecting the adjustment of the crossing angle between the first support arm 1 and the second support arm 2.

[0055] The second driving structure can be connected to the first support arm 1 and the second support arm 2 respectively, but the connection method is that it is fixedly connected to one of the support arms and movably connected to the other support arm, that is, one of the first support arm 1 and the second support arm 2 is fixed relative to the second driving structure, and the other support arm can be moved relative to the second driving structure. For example, the first support arm 1 is fixed relative to the second driving structure, and the second support arm 2 is movable relative to the second driving structure. This design method allows the first driving structure 4 to adjust the crossing angle between the first support arm 1 and the second support arm 2, avoiding interference between the fixed first support arm 1 and the second support arm 2 and the first driving structure 4, affecting the adjustment of the crossing angle between the first support arm 1 and the second support arm 2.

[0056] The second driving structure is used to drive the first support arm 1 and the second support arm 2 to move, including the second driving structure driving the first support arm 1 and the second support arm 2 to move in translation and / or the second driving structure driving the first support arm 1 and the second support arm 2 to move in rotation.

[0057] In the embodiments of the present invention, wafers of different sizes can be taken and placed only by two supporting arms. While ensuring the stability of the support, the size of the supporting structure is reduced as much as possible to avoid interference with the wafer box. The taking and placing process of wafers of different sizes can also be achieved by adjusting the crossing angle between the two supporting arms.

[0058] In some embodiments, two first support blocks 5 are provided on the first support arm 1;

[0059] Two second support blocks 6 are arranged on the second support arm 2;

[0060] The two first supporting blocks 5 and the two second supporting blocks 6 are used for supporting the wafer 3;

[0061] The two first support blocks 5 are respectively arranged on both sides of the intersection of the first support arm 1 and the second support arm 2, and the two second support blocks 6 are respectively arranged on both sides of the intersection of the first support arm 1 and the second support arm 2, so as to support the wafer 3.

[0062] In some embodiments, the first supporting block 5 and the second supporting block 6 are made of polymer materials.

[0063] By making the first support block 5 and the second support block 6 of polymer materials, the first support block 5 and the second support block 6 can be used for a long time without being easily damaged.

[0064] Preferably, the first support block 5 is made of peek (polyetheretherketone) material, and the second support block 6 is made of peek (polyetheretherketone) material, which will not cause damage to the surface of the wafer and can ensure stable support for the wafer.

[0065] It should also be noted that in order to prevent the wafer 3 from tipping over during the process of taking and placing the wafer 3, the horizontal heights of the upper surfaces of the two first support blocks 5 and the upper surfaces of the two second support blocks 6 must be kept consistent to ensure smooth taking and placing of the wafer.

[0066] Preferably, in order to ensure stable support for the wafer, the two first support blocks 5 are symmetrically arranged on both sides of the intersection position of the first support arm 1 and the second support arm 2, that is, the distance between the first support blocks 5 on both sides of the intersection position and the intersection position is equal.

[0067] The two second support blocks 6 are symmetrically arranged on both sides of the intersection of the first support arm 1 and the second support arm 2 , that is, the distances between the second support blocks 6 on both sides of the intersection and the intersection are equal.

[0068] Furthermore, the distance between a first support block 5 and the intersection position is equal to the distance between a second support block 6 and the intersection position.

[0069] In some embodiments, in order to further ensure stable support for the wafer and prevent the wafer from slipping during transportation, the upper surfaces of the first support block 5 and the second support block 6 are provided with anti-skid patterns. The anti-skid patterns increase the friction between the wafer 3 and the wafer 3 to prevent the wafer 3 from slipping or falling.

[0070] The anti-slip lines may be longitudinal stripes or oblique stripes.

[0071] The density of the anti-skid patterns can be determined according to the area of ​​the upper surface of the support block and the number of anti-skid patterns that need to be provided.

[0072] It should be noted that the distance between the first support block 5 and the intersection position, and the distance between the second support block 6 and the intersection position are adjustable, and the distances can be determined according to the radius of the wafer being carried, such as ensuring that the distance between the first support block 5 and the intersection position, and the distance between the second support block 6 and the intersection position are slightly smaller than the radius of the wafer, or the first support block 5 and the second support block 6 support the edge of the wafer, ensuring that the distance between the middle position of the first support block 5 and the intersection position, and the distance between the middle position of the second support block 6 and the intersection position are equal to the radius of the wafer. This prevents the first support block 5 and the second support block 6 from being too close to the center of the wafer, causing the wafer to fall or flip during transportation.

[0073] For example, the radius of the wafer is 150 mm, and the distance between the middle position of the first support block 5 and the intersection position, and the distance between the middle position of the second support block 6 and the intersection position are equal to 150 mm+0.1 mm to 0.3 mm.

[0074] In some embodiments, a first end of at least one of the first support arm 1 and the second support arm 2 is connected to the second driving structure;

[0075] The distance between the intersection of the first support arm 1 and the second support arm 2 and the second end of the first support arm 1 is smaller than the distance between the intersection of the first support arm 1 and the second support arm 2 and the first end of the first support arm 1, wherein the first end of the first support arm 1 and the second end of the first support arm 1 are two opposite ends of the first support arm 1;

[0076] The distance between the intersection of the first support arm 1 and the second support arm 2 and the second end of the second support arm 2 is smaller than the distance between the intersection of the first support arm 1 and the second support arm 2 and the first end of the second support arm 2; the first end of the second support arm 2 and the second end of the second support arm 2 are two opposite ends on the second support arm 2.

[0077] It can be understood that when the support arm is connected to the second driving structure, it is connected to the second driving structure through one end of the support arm. Also, the distance between the intersection of the first support arm 1 and the second support arm 2 and the end of the first support arm 1 away from the second driving structure is less than half of the length of the first support arm 1, the distance between the intersection of the first support arm 1 and the second support arm 2 and the end of the first support arm 1 away from the second driving structure is less than half of the length of the first support arm 1, and the distance between the intersection of the first support arm 1 and the second support arm 2 and the end of the second support arm 2 away from the second driving structure is less than half of the length of the second support arm 2, so as to ensure that when the wafer is transported, the wafer can be completely on the support arm to avoid affecting the placement of the wafer.

[0078] Among them, it is also necessary to ensure that the distance between the intersection position of the first support arm 1 and the second support arm 2 and the end of the first support arm 1 away from the second driving structure is equal to the distance between the intersection position of the first support arm 1 and the second support arm 2 and the end of the second support arm 2 away from the second driving structure.

[0079] It should also be noted that the crossing position of the first support arm 1 and the second support arm 2 can be adjusted, specifically according to the size of the wafer to be taken and placed. The crossing position of the first support arm 1 and the second support arm 2 can also be fixed, and wafers of different sizes can be carried only by adjusting the crossing angle between the first support arm 1 and the second support arm 2.

[0080] In some embodiments, the intersection between the first support arm 1 and the second support arm 2 is fixedly connected via a connecting block 7 .

[0081] It should be noted that fixing the intersection position between the first support arm 1 and the second support arm 2 by the connecting block 7 can prevent wear between the first support arm 1 and the second support arm 2 during the angle adjustment process.

[0082] The connection block 7 may be made of a polymer material, such as rubber, etc., which can prevent wear between the first support arm 1 and the second support arm 2 and also prevent wear of the connection block 7 .

[0083] In some embodiments, the first driving structure 4 is connected to a first position on the first support arm 1 and a second position on the second support arm 2 respectively;

[0084] The first position is located between the first support block 5 and the first end of the first support arm 1;

[0085] The second position is located between the second support block 6 and the first end of the second support arm 2;

[0086] Wherein, a first end of at least one of the first supporting arm 1 and the second supporting arm 2 is connected to the second driving structure.

[0087] In this embodiment, the first driving structure 4 is ensured to be as close as possible to the second driving structure, or as close as possible to the first end of the first support arm 1 and the first end of the second support arm 2. In this way, the weight of the end away from the second driving structure can be reduced, and the first support arm 1, the second support arm 2 and the second driving structure can be stably connected to ensure the long-term use of the device.

[0088] In some embodiments, the second driving structure includes a carrier plate 8, a rotating shaft 9 and a driving device, wherein the driving device is not shown in the figure;

[0089] The carrier plate 8 is disposed above the rotating shaft 9 , and the driving device is connected to the rotating shaft 9 , that is, the rotating shaft is driven to rotate by the driving device, thereby driving the carrier plate 8 to rotate.

[0090] At least one of the first support arm 1 and the second support arm 2 is connected to the carrying plate 8;

[0091] The driving device is used to drive the supporting plate 8 to drive the first supporting arm 1 and the second supporting arm 2 to rotate along the rotating shaft 9 .

[0092] By driving the first support arm 1 and the second support arm 2 to rotate along the rotation axis 9 through the driving device, the direction and height of the mechanical pick-and-place device can be flexibly adjusted.

[0093] In some embodiments, the first drive structure includes: a pneumatic slide;

[0094] The pneumatic slide rail is connected to the first support arm 1 and the second support arm 2 respectively, that is, two ends of the pneumatic slide rail are connected to the first support arm 1 and the second support arm 2 respectively.

[0095] The pneumatic slide is capable of extension and retraction, and the crossing angle between the first support arm 1 and the second support arm 2 is adjusted by the extension and retraction of the pneumatic slide, that is, as the pneumatic slide is extended, the crossing angle between the first support arm 1 and the second support arm 2 increases, and as the pneumatic slide is shortened, the crossing angle between the first support arm 1 and the second support arm 2 decreases, so as to achieve the bearing capacity of wafers of different sizes.

[0096] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A wafer pick-and-place device, characterized in that: include: A first supporting arm and a second supporting arm are cross-connected; the first supporting arm and the second supporting arm are used to carry a wafer; a first driving structure, the first driving structure being connected to the first supporting arm and the second supporting arm respectively, and the first driving structure being used to adjust a crossing angle between the first supporting arm and the second supporting arm; A second driving structure, at least one of the first supporting arm and the second supporting arm is connected to the second driving structure, and the second driving structure is used to drive the first supporting arm and the second supporting arm to move, and the first supporting arm and the second supporting arm put the wafer into the wafer box or take the wafer out of the wafer box through movement.

2. The wafer handling device according to claim 1, characterized in that: Two first support blocks are arranged on the first support arm; Two second support blocks are arranged on the second support arm; The two first supporting blocks and the two second supporting blocks are used for supporting the wafer; The two first support blocks are respectively arranged on both sides of the intersection of the first support arm and the second support arm; The two second support blocks are respectively arranged on both sides of the intersection position of the first support arm and the second support arm.

3. The wafer handling device according to claim 2, characterized in that: The upper surfaces of the first support block and the second support block are provided with anti-slip patterns.

4. The wafer handling device according to claim 2, characterized in that: The two first support blocks are symmetrically arranged on both sides of the intersection of the first support arm and the second support arm; The two second support blocks are symmetrically arranged on both sides of the intersection of the first support arm and the second support arm.

5. The wafer handling device according to claim 1, characterized in that: A first end of at least one of the first supporting arm and the second supporting arm is connected to the second driving structure; The distance between the intersection of the first support arm and the second support arm and the second end of the first support arm is smaller than the distance between the intersection of the first support arm and the second support arm and the first end of the first support arm; the first end of the first support arm and the second end of the first support arm are opposite ends; The distance between the intersection of the first support arm and the second support arm and the second end of the second support arm is smaller than the distance between the intersection of the first support arm and the second support arm and the first end of the second support arm; the first end of the second support arm and the second end of the second support arm are opposite ends.

6. The wafer handling device according to claim 1, characterized in that: The intersection between the first support arm and the second support arm is fixedly connected via a connecting block.

7. The wafer handling device according to claim 2, characterized in that: The first supporting block and the second supporting block are made of polymer material.

8. The wafer placing device according to claim 2, characterized in that: The first driving structure is respectively connected to a first position on the first supporting arm and a second position on the second supporting arm; The first position is between the first support block and the first end of the first support arm; The second position is between the second support block and the first end of the second support arm; Wherein, a first end of at least one of the first supporting arm and the second supporting arm is connected to the second driving structure.

9. The wafer handling device according to claim 1, characterized in that: The second driving structure includes a carrying plate, a rotating shaft and a driving device; The carrier plate is disposed above the rotating shaft, and the driving device is connected to the rotating shaft; At least one of the first supporting arm and the second supporting arm is connected to the carrying plate; The driving device is used to drive the carrying plate to drive the first supporting arm and the second supporting arm to rotate along the rotating shaft.

10. The wafer placing device according to claim 1, characterized in that: The first driving structure includes: a pneumatic slide rail; The pneumatic slide rails are connected to the first support arm and the second support arm respectively; The pneumatic slide rail is capable of extension and retraction, and the crossing angle between the first support arm and the second support arm is adjusted through the extension and retraction of the pneumatic slide rail.

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