Probe applied to testing of failure analysis probe station of semiconductor tester

Abstract

The invention discloses a probe applied to testing of a failure analysis probe station of a semiconductor tester. The probe comprises a probe body and a probe head. The probe comprises a main body and a tail part, an included angle is formed at the joint of the main body and the tail part, and the probe head is connected with the tail part of the probe; a plurality of probe contact bodies are arranged in the probe head, the peripheries of the probe contact bodies are sleeved with springs, and the probe contact bodies are fixed in the probe head through the springs; the bottom of the probe head is provided with a plurality of uniformly distributed circular holes, and the probe contact bodies are arranged in the circular holes. The invention provides a probe applied to testing of a failure analysis probe station of a semiconductor tester, which is suitable for testing a bare wafer bonding pad of an unsealed device, can reduce interference of a packaging shell, maintain integrity of a failure sample, prolong the service life of the probe, and can increase contact effectiveness between the probe and the bonding pad when the surface of the wafer bonding pad is uneven.

Description

Technical Field

[0001] The invention relates to a probe used for testing a failure analysis probe station of a semiconductor tester, and belongs to the technical field of testing probes. Background Art

[0002] At present, with the advent of the era of automobile intelligence, electronic components are being used more and more, and the failure analysis of electronic components has also received more and more attention. Many electronic components need to be tested for bare chip electrical properties after being unpacked. Among them, a semiconductor tester is a device that can support the measurement and tracking of various performance parameters of electronic components. During the test process, a probe station is required to achieve electrical connection through the contact between the probe station probe and the device pins or wafer pads, and test the performance parameters of each pin.

[0003] In the existing technology, the most commonly used probes are those with a needle-shaped head and a straight body. This type of probe has no abnormalities when tested on individual wafers with smooth pad surfaces. In failure analysis, since the device has been wired, after unsealing, the surface of the wafer pad is uneven, and there is interference from solder joints, which affects the contact between the probe and the pad and thus affects the electrical test results; at the same time, since the wafer is at the bottom of the device packaging shell, the linear probe is often disturbed by the external packaging shell of the wafer during the positioning process, resulting in displacement, deformation of the probe head, and short life. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a probe for failure analysis probe station testing of a semiconductor tester, which is suitable for testing the bare chip pads of devices after unpacking, can reduce the interference of the packaging shell, maintain the integrity of the failed sample, and increase the life of the probe. When the surface of the chip pad is uneven, it can increase the contact effectiveness between the probe and the pad.

[0005] In order to solve the above technical problems, the technical solution of the present invention is: The present invention provides a probe used for semiconductor tester failure analysis probe station testing, which comprises a probe and a probe head; The probe comprises a main body and a tail, an angle is arranged at the connection between the main body and the tail, and the probe head is connected to the tail of the probe; A plurality of probe contact bodies are arranged inside the probe head, and springs are sleeved on the outer circumference of the probe contact bodies, and the probe contact bodies are fixed inside the probe head by the springs; The bottom of the probe head is provided with a plurality of evenly distributed circular holes, and the probe contact body is arranged in the circular holes.

[0006] Furthermore, the main body of the probe is cylindrical.

[0007] Furthermore, the tail of the probe is conical.

[0008] Furthermore, the angle θ between the main body and the tail of the probe is 120° to 180°.

[0009] Furthermore, the top of the probe contact body is connected to the top of the spring through a first welding point, the bottom of the spring is connected to the edge of the circular hole through a second welding point and a third welding point respectively, and the bottom of the probe contact body extends out of the circular hole.

[0010] Furthermore, the circular holes are evenly distributed on the center of the circle at the top of the probe head and on concentric circles of the center.

[0011] Furthermore, the probe contact body is cylindrical, and the portion of the bottom of the probe contact body that contacts the wafer pad is hemispherical.

[0012] The present invention adopts the above technical solution, and reduces the interference of electronic component packaging during testing and increases the life of the probe by setting an angle between the main body and the tail of the probe. By setting a plurality of probe contacts through the circular hole on the top of the probe head, the contact effectiveness between the probe and the pad can be increased when the surface of the chip pad is uneven. In addition, the probe contact body adopts an elastic connection to form a buffer when contacting the surface of the chip pad to prevent damage to the surface of the chip pad during contact, and can be used for measuring and tracking performance parameters of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is an overall front view of the probe used for semiconductor tester failure analysis probe station testing of the present invention; Figure 2 is a cross-sectional view of a probe head of the present invention; Figure 3 It is a bottom view of the probe head of the present invention. DETAILED DESCRIPTION

[0014] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments in conjunction with the accompanying drawings.

[0015] like Figure 1 As shown, this embodiment provides a probe for use in a semiconductor tester failure analysis probe station test, which includes a probe 2 and a probe head 1; The inside of the probe 2 is hollow and made of a good conductive metal material. The probe 2 includes a main body 21 and a tail 22. The main body 21 of the probe 2 is cylindrical, and the tail 22 of the probe 2 is conical. An angle is set at the connection between the main body 21 and the tail 22. The tail of the probe 2 is connected to the probe head 1, and the other end of the probe 2 is connected to the probe seat. The probe head 1 is effectively in contact with the chip pad, thereby realizing the electrical connection from the test equipment to the electronic components and realizing the performance test of the failed sample.

[0016] The angle θ set at the connection between the main body 21 and the tail 22 is 120°~180°. If the angle is too large, the probability of interference with the device packaging shell during probe positioning will increase, thereby causing damage to the sample shell or the probe; if the angle is too small, the microscope will not be able to clearly see the positioning of the probe head.

[0017] like Figure 3 As shown, the top of the probe head 1 of this embodiment is circular with a radius of 20 to 50 mm. A plurality of circular holes 8 are arranged on the top of the probe head 1. The circular holes 8 are evenly distributed on the center of the circle on the top of the probe head 1 and on the concentric circles of the center of the circle, which can ensure uniform and comprehensive coverage of the wafer pad to be tested. The probe contact body 7 is arranged in the circular hole 8.

[0018] like Figure 2 As shown, a plurality of probe contact bodies 7 are arranged inside the probe head 1 of this embodiment, and springs 4 are sleeved on the outer periphery of the probe contact bodies 7. The probe contact bodies 7 are fixed inside the probe head 1 by the springs 4, and the springs 4 connect the probes 2 and the probe contact bodies 7; The top of the probe contact body 7 is connected to the top of the spring 4 through the first welding point 3, and the bottom of the spring 4 is connected to the edge of the circular hole 8 through the second welding point 5 and the third welding point 6 respectively, without affecting the upward and downward movement of the circular hole 8 and the probe contact body 7, and the bottom of the probe contact body 7 extends out of the circular hole 8; the probe contact body 7 adopts an elastic connection to form a buffer when contacting with the surface of the chip pad, so as to prevent the probe contact body 7 from damaging the surface of the chip pad during contact; The first solder joint 3, the second solder joint 5 and the third solder joint 6 are all made of alloy materials, and the spring 4 is made of a metal material with strong conductivity. The probe contact body 7 is made of a good conductive metal material and is cylindrical in shape. The bottom of the probe contact body 7 that contacts the wafer pad is hemispherical to prevent the pad from being pierced, and the hemispherical diameter is 1 to 10 microns.

[0019] In this embodiment, the materials of the spring 4, the probe 2, and the probe contact body 7 can be gold, tungsten, or tungsten plated with gold. The first solder joint 3, the second solder joint 5, and the third solder joint 6 can be soldered using tin wire or tin paste.

[0020] The working principle of the present invention is as follows: One end of the probe head 1 is connected to the probe, and the other end is in effective contact with the chip pad. The probe 2 is inserted into the probe base as a whole, thereby realizing the electrical connection between the test equipment and the electronic components. The position of the probe head 1 is adjusted under visual observation and microscope to realize the performance test of the failed sample.

[0021] By setting an angle at the connection between the probe body 21 and the tail 22, the interference of the package shell can be reduced, the integrity of the failed sample can be maintained, and the life of the probe 2 can be increased. By setting multiple probe contact bodies 7 inside the probe head 1 and multiple circular holes 8 on the top of the probe head 1, it can be suitable for testing the bare wafer pads of the device after unpacking, and the contact effectiveness between the probe contact body 7 and the pad can be increased. In addition, the probe contact body 7 adopts an elastic connection to form a buffer when contacting the surface of the wafer pad to prevent damage to the surface of the wafer pad during contact, and can be used for measuring and tracking the performance parameters of electronic components.

[0022] The specific embodiments described above further illustrate the technical problems, technical solutions and beneficial effects solved by the present invention. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A probe used for failure analysis probe station testing of a semiconductor tester, characterized in that: It includes a probe (2) and a probe head (1); The probe (2) comprises a main body (21) and a tail (22), an angle is provided at the connection between the main body (21) and the tail (22), and the probe head (1) is connected to the tail of the probe (2); A plurality of probe contact bodies (7) are arranged inside the probe head (1), a spring (4) is sleeved on the outer circumference of the probe contact body (7), and the probe contact body (7) is fixed inside the probe head (1) by the spring (4); The bottom of the probe head (1) is provided with a plurality of evenly distributed circular holes (8), and the probe contact body (7) is arranged in the circular holes (8).

2. The probe used for semiconductor tester failure analysis probe station testing according to claim 1, characterized in that: The main body (21) of the probe (2) is cylindrical.

3. The probe used for semiconductor tester failure analysis probe station testing according to claim 1, characterized in that: The tail (22) of the probe (2) is conical.

4. The probe used for semiconductor tester failure analysis probe station testing according to claim 1, characterized in that: The included angle θ between the main body (21) and the tail (22) of the probe (2) is 120° to 180°.

5. The probe used for semiconductor tester failure analysis probe station testing according to claim 1, characterized in that: The top of the probe contact body (7) is connected to the top of the spring (4) via a first welding point (3), the bottom of the spring (4) is connected to the edge of the circular hole (8) via a second welding point (5) and a third welding point (6), and the bottom of the probe contact body (7) protrudes from the circular hole (8).

6. The probe used for semiconductor tester failure analysis probe station testing according to claim 5, characterized in that: The circular holes (8) are evenly distributed on the center of the circle at the top of the probe head (1) and on concentric circles of the center of the circle.

7. The probe used for semiconductor tester failure analysis probe station testing according to claim 6, characterized in that: The probe contact body (7) is cylindrical, and the bottom of the probe contact body (7) that contacts the chip pad is hemispherical.

Images