Schematic diagram material detection system and method
By introducing encoding detection and parameter matching functions into the schematic material detection system, the problem of cumbersome manual operation during component update and iteration is solved, and a more efficient R&D process and more accurate parameter verification is achieved.
Patent Information
- Application Number
- CN202411615518.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-02-07
AI Technical Summary
In the schematic design of the prior art, when components are updated and iterated, they need to manually find, delete and replace devices, resulting in engineers spending a lot of time and inefficiency.
Provide a schematic material detection system, including engineering inspection module, position number determination module, detection module and update module, information detection and parameter matching is carried out through component encoding, support one-click identification and replacement of non-standard library devices, and automatic update of devices parameter.
It reduces the time for selecting devices individually and deleting them manually, improves R&D efficiency, reduces the time for positioning components, and improves the accuracy of parameter verification.
Smart Images
Figure CN119396999A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a schematic material detection system and method, and belongs to the field of schematic material detection. Background Art
[0002] At present, in schematic design, there are often many components that are updated and iterated. New solutions will be used in new projects to replace previous design solutions. At this time, the entire schematic needs to be analyzed. First, find and analyze the old components, then mark the components that need to be replaced, and then find the corresponding devices from the new standard library, delete the old components in the schematic, and then re-add the new components to achieve the purpose of updating and iteration.
[0003] In the existing technology, it is necessary to first find and identify the device to be replaced, and then delete the found device, and then re-insert the new device for schematic design. In this process, finding old devices, identifying and screening, deleting and replacing, and then redrawing the schematic will take up a lot of engineers' time. From the perspective of R&D efficiency, the steps are cumbersome and inefficient. At the same time, when comparing device parameter information, it is often necessary to open the attribute list, the corresponding specification or standard library parameter information, and manually check the accuracy of the parameters. This method takes a long time and is prone to omissions. Summary of the invention
[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a schematic material detection system and method, which can reduce the time for individually selecting devices and manually deleting placement when performing schematic material detection, reduce the time for repeatedly opening function interfaces, support interactive positioning of material detection reports and schematics, reduce the time for locating components, and improve research and development efficiency.
[0005] In order to solve the above technical problems, the technical solution of the present invention is: In one aspect, the present invention provides a schematic material detection system, which includes an engineering inspection module, a position number determination module, a detection module, and an update module; The engineering check module is used to check whether the schematic diagram is in engineering mode; The bit number determination module is used to determine whether there are any components in the schematic diagram that are not labeled with bit numbers, and to rearrange the bit numbers of the schematic diagram with one key for the components that are not labeled with bit numbers; The detection module is used to perform information detection according to the coding of components and determine whether all components in the schematic diagram are from the standard library; The update module is used to match component parameters with the standard library using the component code as a keyword, and to display matching error information, and to update and replace parameter information that is different from the standard library.
[0006] Furthermore, the parameter information of the information detection includes coding, manufacturer material number, specification parameters, schematic package, PCB package, brand, specification information, whether to disable and preferred recommendation information.
[0007] Another aspect of the present invention provides a detection method of a schematic material detection system, which comprises the following steps: Step S1, use the code in the component parameters as a keyword to query, compare the keyword with the code in the standard component library, perform material detection based on the selected schematic diagram, and detect whether all devices in the schematic diagram are from the standard library. If components from non-standard libraries are detected, jump to step S2; if components from the standard library are detected, jump to step S3; Step S2: an error message is given indicating that the schematic diagram has no corresponding coded material. Click the error message to locate the erroneous material with one click. The user is prompted to check and select standard library components. The standard library components are imported with one click to replace non-standard components. Step S3, compare the device parameters in the schematic diagram with the device parameters in the standard library one by one, detect them one by one in the order of the component parameter attribute structure tree, display the inconsistent problems one by one and prompt for inspection; Step S4, click Update Components to automatically update the components with error information, and update the parameters of the standard library components with one click. At the same time, the corresponding packages are also updated one by one, and a difference report is exported; Step S5, prompting that the detection and update are completed, performing secondary material detection on the schematic diagram, refreshing and confirming the components, adjusting and updating the components, until no difference is detected, and the detection is completed.
[0008] Furthermore, the component parameter attribute structure tree includes resistor parameter attributes, capacitor parameter attributes, inductor parameter attributes, LED parameter attributes, diode parameter attributes, MOS tube parameter attributes, chip parameter attributes, connector parameter attributes and transistor parameter attributes.
[0009] Furthermore, the detection order of the resistor parameter attributes is resistance detection, power detection, accuracy detection, packaging detection, size detection, and brand detection.
[0010] Furthermore, the detection order of the capacitor parameter attributes is capacitance detection, voltage detection, accuracy detection, packaging detection, size detection, and brand detection.
[0011] Furthermore, the detection order of the inductor parameter attributes is inductance detection, rated current detection, DC resistance detection, saturation current detection, accuracy detection, and packaging detection.
[0012] Furthermore, the detection order of the LED parameter attributes is minimum current detection, maximum current detection, maximum voltage detection, minimum voltage detection, brightness BIN detection, and chromaticity BIN detection.
[0013] Furthermore, the detection order of the diode parameter attributes is pre-voltage detection, forward current detection, power detection, reverse peak voltage detection, reverse peak current detection, and thermal resistance detection.
[0014] Furthermore, the detection order of the MOS tube parameter attributes is source voltage detection, leakage current detection, gate voltage detection, DC on-resistance detection, power consumption detection, and electrostatic level detection; The chip parameter attribute detection order is thermal resistance detection, Tj temperature detection, electrostatic level detection, packaging detection, size detection, and brand detection; The detection order of the connector parameter attributes is voltage detection, current detection, packaging detection, vehicle-grade detection, size detection, and brand detection; The detection order of the transistor parameter attributes is collector current detection, base current detection, thermal resistance detection, Tj temperature detection, electrostatic level detection, and packaging detection.
[0015] By adopting the above technical scheme, the present invention can identify the devices in the schematic diagram that are not in the standard library with one click by setting the detection module. By setting the update module, the system has the function of updating device parameters in batches. For the identified non-standard components, the standard library components can be imported to replace the wrong components with one click, reducing the time for manual deletion and placement; for the identified standard components, the properties of the components on the schematic diagram can be updated to all the properties of the corresponding material coded components in the standard library according to the material code with one click, and specific or all material components can be updated according to their own needs, reducing the time for selecting devices separately. At the same time, it also has a re-detection function. After updating the component parameters, the material detection can be directly performed again, shortening the time for repeatedly opening the software function. In addition, it has a built-in positioning function. The material can be automatically located by selecting the component error information, and the corresponding error information is displayed. It supports the interactive positioning of the material detection report and the schematic diagram, which reduces the time for manual positioning of components, improves the accuracy of parameter verification, and improves R&D efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a principle block diagram of the principle diagram material detection system of the present invention; Figure 2 It is a test flow chart of the principle diagram material detection system of the present invention; Figure 3 It is a structure tree diagram of component parameter attributes of the present invention. DETAILED DESCRIPTION
[0017] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments in conjunction with the accompanying drawings.
[0018] Embodiment 1 like Figure 1 As shown, this embodiment provides a schematic material detection system, which includes an engineering inspection module, a bit number determination module, a detection module and an update module. This embodiment is based on the upgrade of the existing material detection function, and newly added functions such as batch update of component parameters, re-detection, and component positioning are added to ensure that all components in the project design process are consistent with the standard component library; The engineering check module is used to check whether the schematic diagram is in engineering mode. The schematic diagram must be in engineering mode before it can be checked; The bit number determination module is used to determine whether there are any components in the schematic diagram that are not labeled with bit numbers, and output the inspection results. For components that are not labeled with bit numbers, the schematic diagram bit numbers are rearranged with one click to ensure that each component has a corresponding bit number. The detection module is used to perform information detection based on the coding of components to determine whether all components in the schematic diagram are from the standard library. The parameter information of the information detection includes coding, manufacturer material number, specification parameters, schematic package, PCB package, brand, specification book information, whether it is disabled and preferred recommendation information; The update module is used to match component parameters with the standard library using the component code as a keyword, display matching error information, and update and replace parameter information that differs from the standard library.
[0019] Embodiment 2 like Figure 2 As shown, this embodiment provides a detection method of the material detection system as shown in the schematic diagram of embodiment 1, which includes the following steps: Step S1, use the code in the component parameters as a keyword to query, compare the keyword with the code in the standard component library, perform material detection based on the selected schematic diagram, and detect whether all devices in the schematic diagram are from the standard library. If components from non-standard libraries are detected, jump to step S2; if components from the standard library are detected, jump to step S3; Step S2: give an error message that there is no corresponding coded material in the schematic diagram, click the error message to locate the wrong material and highlight it, prompt to check, select standard library components, and update the parameters of non-standard components to standard component parameters in the order of component parameter attribute structure tree, so as to reduce the time of manual deletion and placement; Step S3, compare the device parameters in the schematic diagram with the device parameters in the standard library one by one, detect them one by one in the order of the component parameter attribute structure tree, directly give prompts for the error information in the parameters, display the inconsistencies one by one, generate a difference report, and facilitate one-click positioning inspection. In the difference report, make relevant descriptions of the erroneous device and inform the error type. Click the erroneous component in the difference report interface, and it will automatically jump to the schematic diagram, highlight the erroneous component, which is convenient for engineers to review; Step S4, click Update Components to automatically update the components with error information, and batch update to the parameters of the standard library components with one click. At the same time, the corresponding packages are also updated one by one, and the difference report is exported as a basis for detection. You can also set to update specific or all material components according to your needs to reduce the time of selecting components separately; Step S5, prompting that the detection update is completed, performing secondary material detection on the schematic diagram, refreshing and confirming the components, adjusting and updating the components until no difference is detected, and the detection is completed. Continuously performing multiple detections in the detection interface is beneficial to reducing the time of repeatedly opening the function interface.
[0020] like Figure 3 As shown, the component parameter attribute structure tree of this embodiment includes resistor parameter attributes, capacitor parameter attributes, inductor parameter attributes, LED parameter attributes, diode parameter attributes, MOS tube parameter attributes, chip parameter attributes, connector parameter attributes and transistor parameter attributes.
[0021] like Figure 3 As shown, the detection order of the resistance parameter attributes of this embodiment is resistance detection, power detection, accuracy detection, packaging detection, size detection, and brand detection; The detection order of capacitor parameter attributes is capacitance detection, voltage detection, accuracy detection, packaging detection, size detection, and brand detection; The detection order of inductor parameter attributes is inductance value detection, rated current detection, DC resistance detection, saturation current detection, accuracy detection, and packaging detection; The detection order of LED parameter attributes is minimum current detection, maximum current detection, maximum voltage detection, minimum voltage detection, brightness BIN detection, and chromaticity BIN detection; The detection order of diode parameter attributes is pre-voltage detection, forward current detection, power detection, reverse peak voltage detection, reverse peak current detection, and thermal resistance detection; The detection order of MOS tube parameter attributes is source voltage detection, leakage current detection, gate voltage detection, DC on-resistance detection, power consumption detection, and electrostatic level detection; The order of chip parameter attribute detection is thermal resistance detection, Tj temperature detection, electrostatic level detection, packaging detection, size detection, and brand detection; The detection order of connector parameter attributes is voltage detection, current detection, packaging detection, automotive grade detection, size detection, and brand detection. The detection order of transistor parameter properties is collector current detection, base current detection, thermal resistance detection, Tj temperature detection, electrostatic level detection, and packaging detection.
[0022] The working principle of the present invention is as follows: Through the detection module, use the code in the component parameters as a keyword to query, compare the schematic component code with the code in the standard library, and detect whether all components in the schematic are from the standard library. If there are components from non-standard libraries, click the corresponding error prompt information to locate the wrong material with one click, select the standard library components and import them with one click to replace the non-standard components; if they are all standard library components, then check the schematic device parameters and standard library device parameters one by one in the order of the component parameter attribute structure tree, display the inconsistencies one by one and generate a difference report. Click Update Components to automatically update the components with error information. After the detection and update are completed, the schematic can be tested and updated for secondary materials until no difference is detected.
[0023] When conducting schematic material inspection, the inefficiency caused by cumbersome steps is avoided, the time for selecting components individually and manually deleting them can be reduced, the time for repeatedly opening the function interface is reduced by using the re-inspection function, and the interactive positioning of material inspection reports and schematics is supported, which reduces the time for locating components and improves the accuracy of parameter verification.
[0024] The specific embodiments described above further illustrate the technical problems, technical solutions and beneficial effects solved by the present invention. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A schematic material detection system, characterized in that: It includes an engineering inspection module, a bit number determination module, a detection module and an update module; The engineering check module is used to check whether the schematic diagram is in engineering mode; The bit number determination module is used to determine whether there are any components in the schematic diagram that are not labeled with bit numbers, and to rearrange the bit numbers of the schematic diagram with one key for the components that are not labeled with bit numbers; The detection module is used to perform information detection according to the coding of components and determine whether all components in the schematic diagram are from the standard library; The update module is used to match component parameters with the standard library using the component code as a keyword, and to display matching error information, and to update and replace parameter information that is different from the standard library.
2. The schematic material detection system according to claim 1, characterized in that: The parameter information of the information detection includes coding, manufacturer material number, specification parameters, schematic package, PCB package, brand, specification information, whether to disable and preferred recommendation information.
3. A detection method of a schematic material detection system according to any one of claims 1 to 2, characterized in that: It includes the following steps: Step S1, use the code in the component parameters as a keyword to query, compare the keyword with the code in the standard component library, perform material detection based on the selected schematic diagram, and detect whether all devices in the schematic diagram are from the standard library. If components from non-standard libraries are detected, jump to step S2; if components from the standard library are detected, jump to step S3; Step S2: an error message is given indicating that the schematic diagram has no corresponding coded material. Click the error message to locate the erroneous material with one click. The user is prompted to check and select standard library components. The standard library components are imported with one click to replace non-standard components. Step S3, compare the device parameters in the schematic diagram with the device parameters in the standard library one by one, detect them one by one in the order of the component parameter attribute structure tree, display the inconsistent problems one by one and prompt for inspection; Step S4, click Update Components to automatically update the components with error information, and update the parameters of the standard library components with one click. At the same time, the corresponding packages are also updated one by one, and a difference report is exported; Step S5, prompting that the detection and update are completed, performing secondary material detection on the schematic diagram, refreshing and confirming the components, adjusting and updating the components, until no difference is detected, and the detection is completed.
4. The detection method of the schematic material detection system according to claim 3 is characterized in that: The component parameter attribute structure tree includes resistance parameter attributes, capacitance parameter attributes, inductance parameter attributes, LED parameter attributes, diode parameter attributes, MOS tube parameter attributes, chip parameter attributes, connector parameter attributes and transistor parameter attributes.
5. The detection method of the schematic material detection system according to claim 3 is characterized in that: The detection order of the resistor parameter attributes is resistance detection, power detection, accuracy detection, packaging detection, size detection, and brand detection.
6. The detection method of the schematic material detection system according to claim 3, characterized in that: The detection order of the capacitor parameter attributes is capacitance detection, voltage detection, accuracy detection, packaging detection, size detection, and brand detection.
7. The detection method of the schematic material detection system according to claim 3, characterized in that: The detection order of the inductor parameter attributes is inductance value detection, rated current detection, DC resistance detection, saturation current detection, accuracy detection, and packaging detection.
8. The detection method of the schematic material detection system according to claim 3, characterized in that: The detection order of the LED parameter attributes is minimum current detection, maximum current detection, maximum voltage detection, minimum voltage detection, brightness BIN detection, and chromaticity BIN detection.
9. The detection method of the schematic material detection system according to claim 3, characterized in that: The detection order of the diode parameter attributes is pre-voltage detection, forward current detection, power detection, reverse peak voltage detection, reverse peak current detection, and thermal resistance detection.
10. The detection method of the schematic material detection system according to claim 3, characterized in that: The detection order of the MOS tube parameter attributes is source voltage detection, leakage current detection, gate voltage detection, DC on-resistance detection, power consumption detection, and electrostatic level detection; The chip parameter attribute detection order is thermal resistance detection, Tj temperature detection, electrostatic level detection, packaging detection, size detection, and brand detection; The detection order of the connector parameter attributes is voltage detection, current detection, packaging detection, vehicle-grade detection, size detection, and brand detection; The detection order of the transistor parameter attributes is collector current detection, base current detection, thermal resistance detection, Tj temperature detection, electrostatic level detection, and packaging detection.