High-uniformity wafer heater and processing method thereof

Abstract

The invention discloses a high-uniformity wafer heater and a processing method thereof, and belongs to the technical field of wafer heaters. The placing box is installed at the top of the bottom box, an annular exhaust box is fixedly installed at the top of the placing box, a supporting shaft is fixedly installed at the top of the placing box, a base plate is fixedly installed on the supporting shaft, a heat insulation plate is fixedly installed on the supporting shaft, and a controller is fixedly installed on the outer side of the placing box; a transformer is installed on the outer side of the containing box, a plurality of air inlet holes are formed in the bottom box, and dustproof nets are fixedly installed on the inner walls of the air inlet holes. The device is simple in structure and convenient to operate, a wafer can be rapidly and uniformly heated, the cooling efficiency can be improved, the wafer can be conveniently positioned and processed, temperature detection can be conveniently carried out, and the device is convenient for people to use.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer heaters, and in particular to a high-uniformity wafer heater and a processing method thereof. Background Art

[0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become an integrated circuit product with specific electrical functions. During the processing, it is sometimes necessary to heat the wafer. For disc-shaped wafers, the existing heater uses a ceramic base to carry the wafer, and heating wires are arranged in the ceramic base to achieve heating of the wafer surface.

[0003] Existing technical defects:

[0004] 1. The existing heating method has the problem of uneven heating area and different local temperatures;

[0005] 2. When placing the existing wafer, it is difficult to place it in the center of the base, which leads to uneven heating and unstable placement during processing or heating;

[0006] 3. After the heating process is completed, the existing wafers cannot be cooled down quickly, or when cooling down, the cooling effect varies due to the different positions of wind force, which affects the processing quality of the wafers;

[0007] 4. It is difficult to measure the temperature at different positions of the existing wafer when it is heated, resulting in a lack of monitoring effect. Summary of the invention

[0008] The purpose of the present invention is to solve the existing shortcomings and propose a high uniformity wafer heater and a processing method thereof.

[0009] In order to achieve the above object, the present invention adopts the following technical solutions:

[0010] A high uniformity wafer heater, comprising:

[0011] Bottom box;

[0012] A placement box is installed on the top of the bottom box, an annular exhaust box is fixedly installed on the top of the placement box, a support shaft is fixedly installed on the top of the placement box, a base plate is fixedly installed on the support shaft, a heat insulation board is fixedly installed on the support shaft, a controller is fixedly installed on the outside of the placement box, a transformer is installed on the outside of the placement box, a plurality of air inlet holes are opened on the bottom box, a dustproof net is fixedly installed on the inner wall of the air inlet hole, a first motor is fixedly installed on one side of the bottom box, an active rod is fixedly installed on the output shaft of the first motor, a second motor is fixedly installed on the bottom of the placement box, and the top of the bottom box is open;

[0013] A heating mechanism is installed on the substrate and cooperates with the transformer;

[0014] A positioning mechanism is installed on the base plate, the top of the placement box is rotatably connected to a cylinder, and the cylinder is transmission-connected to the positioning mechanism;

[0015] A cooling mechanism is installed in the bottom box and is drivingly connected to the active rod;

[0016] The temperature measuring mechanism is installed on the inner wall of the placing box and cooperates with the base plate.

[0017] Furthermore, the heating mechanism includes eight U-shaped resistance wires, which are installed at the bottom of the substrate. Eight guide grooves are opened on the top of the substrate, and the U-shaped resistance wire is located between two adjacent guide grooves.

[0018] The arrangement of the U-shaped resistance wire can facilitate heating of the substrate, and the arrangement of eight guide grooves and eight U-shaped resistance wires can form the substrate into eight parts, which can be evenly heated by the U-shaped resistance wires.

[0019] Furthermore, the eight guide grooves are evenly distributed on the base plate in a ring shape, and a plurality of ventilation holes are provided on the bottom inner wall of the guide groove.

[0020] The arrangement of the guide grooves and the ventilation holes can facilitate the flow of the blown air, so that when the air is blown for cooling, a backflow can be quickly formed, so that the wafer can dissipate heat quickly and evenly.

[0021] Furthermore, the positioning mechanism includes four symmetrically arranged card blocks, the top of the base plate is provided with four symmetrically arranged sliding holes, a sliding rod is fixedly installed on the inner wall of the sliding hole, a connecting block is slidably connected to the sliding rod, and the card block is fixedly connected to the connecting block.

[0022] The arrangement of the four clamping blocks can facilitate the clamping of the wafer, so that the wafer is located in the middle of the substrate, which is convenient for processing operations, and the sliding hole and the sliding rod are slidably connected to the connecting block, so that the clamping block can be limited.

[0023] Furthermore, a swivel is rotatably connected to the support shaft, four symmetrically arranged positioning rods are fixedly installed on the side of the swivel, a stopper is fixedly installed on one end of the positioning rod, a pull rod is rotatably connected to the positioning rod, and the pull rod is rotatably connected to the corresponding connecting block, a push rod is fixedly installed on the piston of the cylinder, a slider is rotatably connected to the piston of the push rod, and the slider is slidably connected to the corresponding positioning rod,

[0024] The piston of the cylinder drives the push rod to move, and the push rod is connected to the sliding of the positioning rod through the slider, so that it can drive the positioning rod to change its angle. At the same time, the four positioning rods are fixedly connected to the swivel, so as to drive the other three positioning rods to rotate, and the positioning rod drives the connecting block to move through the pull rod.

[0025] Furthermore, a plurality of through holes are provided on the top of the placement box, a circular connecting hole is provided on the bottom of the annular exhaust box, the annular connecting hole is interconnected with the plurality of through holes, a plurality of air inlet pipes are installed on the inner side of the annular exhaust box, and the air inlet pipes are arranged at an angle of forty-five degrees to the inner side of the annular exhaust box, a plurality of exhaust pipes are installed on the annular exhaust box, and the exhaust pipes and the air inlet pipes cooperate with each other.

[0026] The air in the placement box is introduced into the annular exhaust box through the through hole and the annular connecting hole, and is introduced into the base plate through the air inlet pipe. At the same time, since the air inlet pipe is set at a forty-five-degree angle, the incoming air can flow faster, thereby increasing the cooling effect. At the same time, the air inside the annular exhaust box can be discharged through multiple exhaust pipes.

[0027] Furthermore, the air inlet mechanism includes fan blades, a mounting rod is fixedly mounted on the inner wall of the bottom box, a rotating shaft is rotatably connected to the mounting rod, and the fan blades are fixedly connected to the rotating shaft.

[0028] The rotating shaft drives the fan blades to rotate, and the rotating fan blades form air flow, and air is taken in through the air inlet holes, while the dustproof net filters the gas.

[0029] Furthermore, a first bevel gear is fixedly mounted on one end of the active rod, a second bevel gear is fixedly mounted on the rotating shaft, the first bevel gear and the second bevel gear are meshed with each other, a connecting box is rotatably connected to the active rod, the connecting box is rotatably connected to the rotating shaft, and the first bevel gear and the second bevel gear are located in the connecting box.

[0030] The rotating active rod can drive the rotating shaft to rotate through the mutual engagement of the first bevel gear and the second bevel gear. At the same time, the setting of the connecting box can stabilize the state between the active rod and the rotating shaft and position the first bevel gear and the second bevel gear.

[0031] Furthermore, the temperature measuring mechanism includes a temperature sensor, an inner toothed ring is rotatably connected to the inner wall of the annular exhaust box, a mounting block is installed on the top of the inner toothed ring, the temperature sensor is fixedly connected to the mounting block, a rotating rod is fixedly installed on the output shaft of the second motor, a driving gear is fixedly installed on the rotating rod, and the driving gear is meshed with the inner toothed ring.

[0032] The output shaft of the second motor drives the rotating rod to rotate, the rotating rotating rod drives the driving gear to rotate, the rotating driving gear drives the inner gear ring to rotate by mutual engagement with the inner gear ring, the rotating inner gear ring drives the temperature sensor to rotate through the mounting block, and the temperature sensor performs cyclic detection around the substrate.

[0033] A method for using a high uniformity wafer heater comprises the following steps

[0034] S1: Place the wafer on the substrate, start the cylinder switch, the piston of the cylinder drives the push rod to move, the push rod is connected to the positioning rod through the sliding block, so that the positioning rod can change its angle, and the four positioning rods are fixedly connected to the rotating ring, so that the other three positioning rods can be rotated, and the positioning rod drives the connecting block to move through the pull rod. The setting of the four clamping blocks can facilitate the clamping of the wafer, so that the wafer is in the middle of the substrate, which is convenient for processing operations, and the sliding hole and the sliding rod are connected to the connecting block through sliding, so that the clamping block can be limited;

[0035] S2: The U-shaped resistance wire is energized by a controller. The setting of the U-shaped resistance wire can facilitate heating of the substrate. Meanwhile, the setting of eight guide grooves and eight U-shaped resistance wires can form the substrate into eight parts, and the substrate is evenly heated by the U-shaped resistance wire. The setting of the guide grooves and the ventilation holes can facilitate the flow of the blown air, so that when the air is blown to cool down, a reflux can be formed quickly, so that the wafer can dissipate heat quickly and evenly.

[0036] S3: When cooling is required, the first motor switch is started again, and the output shaft of the first motor drives the active rod to rotate. The rotating active rod can drive the rotating shaft to rotate through the mutual engagement of the first bevel gear and the second bevel gear. At the same time, the setting of the connecting box can stabilize the state between the active rod and the rotating shaft, and position the first bevel gear and the second bevel gear. The rotating rotating shaft drives the fan blades to rotate. The rotating fan blades form air flow and take in air through the air inlet hole. At the same time, the dustproof net performs gas filtering. The air in the placement box is introduced into the annular exhaust box through the through hole and the annular connecting hole, and is introduced into the base plate through the air inlet pipe. At the same time, because the air inlet pipe is set at a forty-five degree angle, the incoming air can accelerate the flow, thereby increasing the cooling effect. At the same time, the air inside the annular exhaust box can be discharged through multiple exhaust pipes;

[0037] S4: When heating is performed, the second motor switch is started, the output shaft of the second motor drives the rotating rod to rotate, the rotating rotating rod drives the driving gear to rotate, the rotating driving gear drives the inner gear ring to rotate by mutual engagement with the inner gear ring, the rotating inner gear ring drives the temperature sensor to rotate through the mounting block, and the temperature sensor performs cyclic detection around the substrate.

[0038] Compared with the prior art, the advantages of the present invention are:

[0039] (1) In this solution, the first bevel gear and the second bevel gear are meshed with each other, and the placement box and the annular exhaust box are arranged so that the rotating active rod can drive the fan blades to blow air and act on the base plate. At the same time, the air inlet pipe is arranged at a 45-degree angle, which can facilitate the flow of the incoming air to increase the cooling effect. At the same time, the air inside the annular exhaust box can be discharged through multiple exhaust pipes;

[0040] (2) Since eight guide grooves and eight U-shaped resistance wires are provided in this solution, the substrate can be formed into eight parts, and the U-shaped resistance wires can be used to heat the substrate uniformly and quickly;

[0041] (3) In this solution, since the positioning rod and the pull rod are rotatably connected, and the pull rod and the connecting block are rotatably connected, the moving push rod can drive the four clamping blocks to move, so that the wafer can be clamped and positioned, so that the wafer is located in the middle of the substrate, which is convenient for heating and processing;

[0042] (4) In this solution, since the active gear and the inner gear ring are meshed with each other, the rotating shaft can drive the inner gear ring to rotate, and then drive the temperature sensor to perform rotation detection on different positions of the outer side of the substrate.

[0043] The invention has a simple structure and is easy to operate, and can heat the wafer quickly and evenly, while also increasing the cooling efficiency, facilitating the positioning and processing of the wafer, and also facilitating temperature detection, making it convenient for people to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 This is a schematic structural diagram of a high uniformity wafer heater proposed by the present invention;

[0045] Figure 2 A schematic diagram of the rear view structure of a high uniformity wafer heater proposed by the present invention;

[0046] Figure 3 This is a schematic diagram of the internal structure of a placement box for a high uniformity wafer heater proposed by the present invention when viewed from above;

[0047] Figure 4 This is a schematic diagram of a top view of a substrate of a high uniformity wafer heater proposed by the present invention;

[0048] Figure 5 This is a schematic diagram of the bottom-up structure of a substrate of a high uniformity wafer heater proposed by the present invention;

[0049] Figure 6 A schematic diagram of the structure of a positioning mechanism for a high uniformity wafer heater proposed by the present invention;

[0050] Figure 7 This is a schematic diagram of a top view of the structure of a ring-shaped placement box for a high uniformity wafer heater proposed by the present invention;

[0051] Figure 8 This is a schematic diagram of the bottom view of the structure of a ring-shaped placement box for a high uniformity wafer heater proposed by the present invention;

[0052] Fig. 9 This is a schematic diagram of a top view of a placement box for a high uniformity wafer heater proposed by the present invention;

[0053] Fig.10 This is a schematic diagram of the bottom view of the structure of a placement box for a high uniformity wafer heater proposed by the present invention;

[0054] Fig.11 This is a schematic diagram of the internal structure of a bottom box of a high uniformity wafer heater proposed by the present invention, viewed from above;

[0055] Fig.12 This is a schematic diagram of the structure of a blower structure of a high uniformity wafer heater proposed by the present invention;

[0056] Fig.13 This is a schematic diagram of the temperature measurement mechanism of a high uniformity wafer heater proposed by the present invention;

[0057] Fig.14 A high uniformity wafer heater proposed by the present invention Figure 3 Schematic diagram of the structure of part A;

[0058] Fig.15 A high uniformity wafer heater proposed by the present invention Figure 4 Schematic diagram of the structure of part B.

[0059] In the figure: 1, bottom box; 2, placement box; 3, support shaft; 4, base plate; 5, guide groove; 6, ventilation hole; 7, U-shaped resistance wire; 8, heat insulation board; 9, sliding hole; 10, sliding rod; 11, connecting block; 12, clamping block; 13, swivel; 14, positioning rod; 15, cylinder; 16, push rod; 17, slider; 18, stopper; 19, pull rod; 20, annular exhaust box; 22, through hole; 23, annular connecting hole; 24, Mounting rod; 25, rotating shaft; 26, fan blade; 27, first motor; 28, active rod; 29, first bevel gear; 30, second bevel gear; 31, connecting box; 32, air inlet; 33, dust screen; 34, air inlet duct; 35, exhaust duct; 36, second motor; 37, rotating rod; 38, active gear; 39, inner gear ring; 40, mounting block; 41, temperature sensor; 42, controller; 43, transformer. DETAILED DESCRIPTION

[0060] The technical solution of this embodiment will be clearly and completely described below in conjunction with the drawings in this embodiment. Obviously, the described embodiment is only a part of this embodiment, rather than all of the embodiments.

[0061] Embodiment 1

[0062] Reference Figure 1-Figure 15 , a high uniformity wafer heater, comprising:

[0063] Bottom box 1;

[0064] A placement box 2 is installed on the top of the bottom box 1, a ring-shaped exhaust box 20 is fixedly installed on the top of the placement box 2, a support shaft 3 is fixedly installed on the top of the placement box 2, a base plate 4 is fixedly installed on the support shaft 3, a heat insulation board 8 is fixedly installed on the support shaft 3, a controller 42 is fixedly installed on the outside of the placement box 2, a transformer 43 is installed on the outside of the placement box 2, a plurality of air inlet holes 32 are opened on the bottom box 1, a dustproof net 33 is fixedly installed on the inner wall of the air inlet hole 32, a first motor 27 is fixedly installed on one side of the bottom box 1, an active rod 28 is fixedly installed on the output shaft of the first motor 27, a second motor 36 is fixedly installed on the bottom of the placement box 2, and the top of the bottom box 1 is an opening;

[0065] The heating mechanism is mounted on the substrate 4 and cooperates with the transformer 43;

[0066] The positioning mechanism is installed on the base plate 4, and the top of the placement box 2 is rotatably connected to a cylinder 15, and the cylinder 15 is transmission-connected to the positioning mechanism;

[0067] The cooling mechanism is installed in the bottom box 1 and is in transmission connection with the active rod 28;

[0068] The temperature measuring mechanism is installed on the inner wall of the placing box 2 and cooperates with the base plate 4.

[0069] In this embodiment, the heating mechanism includes eight U-shaped resistance wires 7, and the eight U-shaped resistance wires 7 are installed at the bottom of the substrate 4. Eight guide grooves 5 are opened on the top of the substrate 4. The U-shaped resistance wire 7 is located between two adjacent guide grooves 5. The eight guide grooves 5 are evenly distributed on the substrate 4 in a ring shape, and a plurality of ventilation holes 6 are opened on the bottom inner wall of the guide groove 5. The setting of the U-shaped resistance wire 7 can facilitate the heating of the substrate 4. At the same time, the setting of the eight guide grooves 5 and the eight U-shaped resistance wires 7 can form the substrate 4 into eight parts and heat it evenly through the U-shaped resistance wire 7. The setting of the guide grooves 5 and the ventilation holes 6 can facilitate the flow of the blown air, so that when blowing and cooling, reflux can be quickly formed, so that the wafer can dissipate heat quickly and evenly.

[0070] In this embodiment, the positioning mechanism includes four symmetrically arranged card blocks 12, four symmetrically arranged sliding holes 9 are opened on the top of the base plate 4, a sliding rod 10 is fixedly installed on the inner wall of the sliding hole 9, a connecting block 11 is slidably connected to the sliding rod 10, the card block 12 is fixedly connected to the connecting block 11, a rotating ring 13 is rotatably connected to the support shaft 3, four symmetrically arranged positioning rods 14 are fixedly installed on the side of the rotating ring 13, a stopper 18 is fixedly installed at one end of the positioning rod 14, a pull rod 19 is rotatably connected to the positioning rod 14, and the pull rod 19 is rotatably connected to the corresponding connecting block 11, a push rod 16 is fixedly installed on the piston of the cylinder 15, and a slider 17 is rotatably connected to the piston of the push rod 16 The slider 17 is slidably connected with the corresponding positioning rod 14, and the piston of the cylinder 15 drives the push rod 16 to move. The push rod 16 is slidably connected with the positioning rod 14 through the slider 17, so that the positioning rod 14 can be driven to change its angle. At the same time, the four positioning rods 14 are fixedly connected with the swivel 13, so that the other three positioning rods 14 can be driven to rotate. The positioning rod 14 drives the connecting block 11 to move through the pull rod 19. The setting of the four clamping blocks 12 can facilitate the clamping of the wafer, so that the wafer is located in the middle part of the substrate 4, which is convenient for processing operations, and the sliding hole 9 and the sliding rod 10 are slidably connected to the connecting block 11, so that the clamping block 12 can be limited.

[0071] In this embodiment, a plurality of through holes 22 are provided on the top of the placement box 2, and a circular connecting hole 23 is provided on the bottom of the annular exhaust box 20. The annular connecting hole 23 is interconnected with the plurality of through holes 22. A plurality of air inlet pipes 34 are installed on the inner side of the annular exhaust box 20, and the air inlet pipes 34 are arranged at a forty-five degree angle to the inner side of the annular exhaust box 20. A plurality of exhaust pipes 35 are installed on the annular exhaust box 20, and the exhaust pipes 35 cooperate with the air inlet pipes 34. The air in the placement box 2 is introduced into the annular exhaust box 20 through the through holes 22 and the annular connecting holes 23, and is introduced into the base plate 4 through the air inlet pipes 34. At the same time, since the air inlet pipes 34 are arranged at a forty-five degree angle, the incoming air can flow faster, thereby increasing the cooling effect. At the same time, the air inside the annular exhaust box 20 can be discharged through the plurality of exhaust pipes 35.

[0072] In this embodiment, the air intake mechanism includes a fan blade 26, a mounting rod 24 is fixedly installed on the inner wall of the bottom box 1, a rotating shaft 25 is rotatably connected to the mounting rod 24, the fan blade 26 is fixedly connected to the rotating shaft 25, a first bevel gear 29 is fixedly installed on one end of the active rod 28, a second bevel gear 30 is fixedly installed on the rotating shaft 25, the first bevel gear 29 and the second bevel gear 30 are meshed with each other, a connecting box 31 is rotatably connected to the active rod 28, the connecting box 31 is rotatably connected to the rotating shaft 25, the first bevel gear 29 and the second bevel gear 30 is located in the connecting box 31, and the rotating active rod 28 can drive the rotating shaft 25 to rotate through the mutual engagement of the first bevel gear 29 and the second bevel gear 30. At the same time, the setting of the connecting box 31 can stabilize the state between the active rod 28 and the rotating shaft 25, and position the first bevel gear 29 and the second bevel gear 30. The rotating rotating shaft 25 drives the fan blades 26 to rotate, and the rotating fan blades 26 form air flow and take in air through the air inlet 32. At the same time, the dustproof net 33 performs gas filtering.

[0073] In this embodiment, the temperature measuring mechanism includes a temperature sensor 41, an inner toothed ring 39 is rotatably connected to the inner wall of the annular exhaust box 20, a mounting block 40 is installed on the top of the inner toothed ring 39, the temperature sensor 41 is fixedly connected to the mounting block 40, a rotating rod 37 is fixedly installed on the output shaft of the second motor 36, a driving gear 38 is fixedly installed on the rotating rod 37, the driving gear 38 and the inner toothed ring 39 are meshed with each other, the output shaft of the second motor 36 drives the rotating rod 37 to rotate, the rotating rotating rod 37 drives the driving gear 38 to rotate, the rotating driving gear 38 drives the inner toothed ring 39 to rotate by mutual meshing with the inner toothed ring 39, the rotating inner toothed ring 39 drives the temperature sensor 41 to rotate through the mounting block 40, and the temperature sensor 41 performs cyclic detection around the substrate 4.

[0074] A method for using a high uniformity wafer heater comprises the following steps

[0075] S1: Place the wafer on the substrate 4, start the switch of the cylinder 15, the piston of the cylinder 15 drives the push rod 16 to move, and the push rod 16 is slidably connected to the positioning rod 14 through the slider 17, so that the positioning rod 14 can be driven to change its angle. At the same time, the four positioning rods 14 are fixedly connected to the rotating ring 13, so that the other three positioning rods 14 can be driven to rotate. The positioning rod 14 drives the connecting block 11 to move through the pull rod 19. The setting of the four clamping blocks 12 can facilitate the clamping of the wafer, so that the wafer is in the middle part of the substrate 4, which is convenient for processing operations, and the sliding hole 9 and the sliding rod 10 are slidably connected to the connecting block 11, so that the clamping block 12 can be limited;

[0076] S2: The U-shaped resistance wire 7 is energized by the controller 42. The setting of the U-shaped resistance wire 7 can facilitate heating of the substrate 4. Meanwhile, the setting of the eight guide grooves 5 and the eight U-shaped resistance wires 7 can form the substrate 4 into eight parts, and the substrate 4 is evenly heated by the U-shaped resistance wires 7. The setting of the guide grooves 5 and the ventilation holes 6 can facilitate the flow of the blown air, so that when the air is blown to cool down, a reflux can be quickly formed, so that the wafer can quickly and evenly dissipate heat;

[0077] S3: When cooling is required, the switch of the first motor 27 is started again, and the output shaft of the first motor 27 drives the active rod 28 to rotate. The rotating active rod 28 can drive the rotating shaft 25 to rotate through the mutual meshing of the first bevel gear 29 and the second bevel gear 30. At the same time, the setting of the connecting box 31 can stabilize the state between the active rod 28 and the rotating shaft 25, and position the first bevel gear 29 and the second bevel gear 30. The rotating rotating shaft 25 drives the fan blades 26 to rotate, and the rotating fan blades 26 form air flow and take in air through the air inlet hole 32. At the same time, the dustproof net 33 performs gas filtering. The air in the placement box 2 is introduced into the annular exhaust box 20 through the through hole 22 and the annular connecting hole 23, and is introduced into the base plate 4 through the air inlet pipe 34. At the same time, because the air inlet pipe 34 is set at a forty-five degree angle, the incoming air can accelerate the flow, thereby increasing the cooling effect. At the same time, the air inside the annular exhaust box 20 can be discharged through multiple exhaust pipes 35;

[0078] S4: When heating is performed, the switch of the second motor 36 is started, and the output shaft of the second motor 36 drives the rotating rod 37 to rotate, and the rotating rotating rod 37 drives the driving gear 38 to rotate, and the rotating driving gear 38 drives the inner gear ring 39 to rotate by mutual engagement with the inner gear ring 39, and the rotating inner gear ring 39 drives the temperature sensor 41 to rotate through the mounting block 40, and the temperature sensor 41 performs cyclic detection around the substrate 4.

[0079] Embodiment 2

[0080] The difference between this embodiment and the first embodiment is that the air inlet pipe 34 is rotatably connected to the annular exhaust box 20, and the annular exhaust box 20 is provided with an angle adjustment mechanism, which is transmission-connected to the plurality of air inlet pipes 34. The setting of the angle adjustment mechanism can control the blowing angle of the air inlet pipe 34, so that air can be blown to different positions of the substrate 4. All structures in this application can be selected in terms of material and length according to actual usage. The accompanying drawings are all schematic structural diagrams, and the specific actual dimensions can be appropriately adjusted.

[0081] The above description is only a preferred specific implementation manner of this embodiment, but the protection scope of this embodiment is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of this embodiment within the technical scope disclosed in this embodiment, and they should be covered by the protection scope of this embodiment.

Claims

1. A high uniformity wafer heater, characterized in that: include: Bottom box (1); A placement box (2) is installed on the top of the base box (1); an annular exhaust box (20) is fixedly installed on the top of the placement box (2); a support shaft (3) is fixedly installed on the top of the placement box (2); a base plate (4) is fixedly installed on the support shaft (3); a heat insulation board (8) is fixedly installed on the support shaft (3); a controller (42) is fixedly installed on the outside of the placement box (2); a transformer (43) is installed on the outside of the placement box (2); a plurality of air inlet holes (32) are opened on the base box (1); a dustproof net (33) is fixedly installed on the inner wall of the air inlet hole (32); a first motor (27) is fixedly installed on one side of the base box (1); an active rod (28) is fixedly installed on the output shaft of the first motor (27); a second motor (36) is fixedly installed on the bottom of the placement box (2); and the top of the base box (1) is open; A heating mechanism is mounted on the substrate (4) and cooperates with the transformer (43); A positioning mechanism is installed on the base plate (4); the top of the placement box (2) is rotatably connected to a cylinder (15); and the cylinder (15) is transmission-connected to the positioning mechanism; A cooling mechanism is installed in the bottom box (1) and is drivingly connected to the active rod (28); The temperature measuring mechanism is installed on the inner wall of the placement box (2) and cooperates with the base plate (4).

2. A high uniformity wafer heater according to claim 1, characterized in that: The heating mechanism comprises eight U-shaped resistance wires (7), the eight U-shaped resistance wires (7) are installed at the bottom of the base plate (4), eight guide grooves (5) are opened on the top of the base plate (4), and the U-shaped resistance wire (7) is located between two adjacent guide grooves (5).

3. A high uniformity wafer heater according to claim 2, characterized in that: The eight guide grooves (5) are evenly distributed in a ring shape on the base plate (4), and a plurality of ventilation holes (6) are provided on the inner wall of the bottom of the guide groove (5).

4. The high uniformity wafer heater according to claim 1, characterized in that: The positioning mechanism comprises four symmetrically arranged clamping blocks (12); the top of the base plate (4) is provided with four symmetrically arranged sliding holes (9); a sliding rod (10) is fixedly mounted on the inner wall of the sliding hole (9); a connecting block (11) is slidably connected to the sliding rod (10); and the clamping block (12) is fixedly connected to the connecting block (11).

5. The high uniformity wafer heater according to claim 4, characterized in that: A swivel (13) is rotatably connected to the support shaft (3), four symmetrically arranged positioning rods (14) are fixedly installed on the side of the swivel (13), a stopper (18) is fixedly installed on one end of the positioning rod (14), a pull rod (19) is rotatably connected to the positioning rod (14), and the pull rod (19) is rotatably connected to the corresponding connecting block (11), a push rod (16) is fixedly installed on the piston of the cylinder (15), a slider (17) is rotatably connected to the piston of the push rod (16), and the slider (17) is slidably connected to the corresponding positioning rod (14).

6. The high uniformity wafer heater according to claim 1, characterized in that: The top of the placement box (2) is provided with a plurality of through holes (22); the bottom of the annular exhaust box (20) is provided with an annular connection hole (23); the annular connection hole (23) is interconnected with the plurality of through holes (22); a plurality of air inlet pipes (34) are installed on the inner side of the annular exhaust box (20); the air inlet pipes (34) and the inner side of the annular exhaust box (20) are arranged at an angle of forty-five degrees; a plurality of air exhaust pipes (35) are installed on the annular exhaust box (20); the air exhaust pipes (35) and the air inlet pipes (34) cooperate with each other.

7. The high uniformity wafer heater according to claim 1, characterized in that: The air intake mechanism comprises a fan blade (26), a mounting rod (24) is fixedly mounted on the inner wall of the bottom box (1), a rotating shaft (25) is rotatably connected to the mounting rod (24), and the fan blade (26) is fixedly connected to the rotating shaft (25).

8. The high uniformity wafer heater according to claim 7, characterized in that: A first bevel gear (29) is fixedly mounted on one end of the active rod (28), a second bevel gear (30) is fixedly mounted on the rotating shaft (25), the first bevel gear (29) and the second bevel gear (30) are meshed with each other, a connecting box (31) is rotatably connected to the active rod (28), the connecting box (31) is rotatably connected to the rotating shaft (25), and the first bevel gear (29) and the second bevel gear (30) are located in the connecting box (31).

9. The high uniformity wafer heater according to claim 1, characterized in that: The temperature measuring mechanism comprises a temperature sensor (41); an inner toothed ring (39) is rotatably connected to the inner wall of the annular exhaust box (20); a mounting block (40) is mounted on the top of the inner toothed ring (39); the temperature sensor (41) is fixedly connected to the mounting block (40); a rotating rod (37) is fixedly mounted on the output shaft of the second motor (36); a driving gear (38) is fixedly mounted on the rotating rod (37); and the driving gear (38) and the inner toothed ring (39) are meshed with each other.

10. A method for using a high uniformity wafer heater, wherein the high uniformity wafer heater is a high uniformity wafer heater according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: placing a wafer on the substrate (4), starting the switch of the cylinder (15), the piston of the cylinder (15) drives the push rod (16) to move, the push rod (16) is slidably connected to the positioning rod (14) through the slider (17), thereby driving the positioning rod (14) to change its angle, and at the same time, the four positioning rods (14) are fixedly connected to the rotating ring (13), thereby driving the other three positioning rods (14) to rotate, the positioning rod (14) drives the connecting block (11) to move through the pull rod (19), the arrangement of the four clamping blocks (12) can facilitate the clamping of the wafer, so that the wafer is located in the middle part of the substrate (4), which is convenient for processing operations, and the sliding hole (9) and the sliding rod (10) are slidably connected to the connecting block (11), thereby limiting the clamping block (12); S2: The U-shaped resistance wire (7) is energized by the controller (42). The U-shaped resistance wire (7) is arranged so as to facilitate heating of the substrate (4). Meanwhile, the eight guide grooves (5) and the eight U-shaped resistance wires (7) are arranged so as to form the substrate (4) into eight parts, and the U-shaped resistance wires (7) are used to uniformly heat the substrate. The guide grooves (5) and the ventilation holes (6) are arranged so as to facilitate the flow of the blown air, so as to quickly form a reflux when the air is blown to cool the substrate, so that the wafer can quickly and uniformly dissipate heat. S3: When cooling is required, the switch of the first motor (27) is started again, and the output shaft of the first motor (27) drives the active rod (28) to rotate. The rotating active rod (28) is meshed with the first bevel gear (29) and the second bevel gear (30), thereby driving the rotating shaft (25) to rotate. At the same time, the setting of the connecting box (31) can stabilize the state between the active rod (28) and the rotating shaft (25), and position the first bevel gear (29) and the second bevel gear (30). The rotating rotating shaft (25) drives the fan blades (26) The fan (26) rotates to form air flow, and air is taken in through the air inlet (32). At the same time, the dust screen (33) filters the air. The air in the placement box (2) is introduced into the annular exhaust box (20) through the through hole (22) and the annular connecting hole (23), and is introduced into the base plate (4) through the air inlet pipe (34). At the same time, because the air inlet pipe (34) is set at a 45-degree angle, the incoming air can flow faster, thereby increasing the cooling effect. At the same time, the air inside the annular exhaust box (20) can be discharged through multiple exhaust pipes (35); S4: When heating is performed, the switch of the second motor (36) is started, the output shaft of the second motor (36) drives the rotating rod (37) to rotate, the rotating rotating rod (37) drives the driving gear (38) to rotate, the rotating driving gear (38) drives the inner gear ring (39) to rotate by mutual engagement with the inner gear ring (39), the rotating inner gear ring (39) drives the temperature sensor (41) to rotate through the mounting block (40), and the temperature sensor (41) performs cyclic detection around the substrate (4).

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