Scheduling method, scheduling equipment and semiconductor process equipment

Abstract

The invention relates to a scheduling method, scheduling equipment and semiconductor process equipment. The scheduling method comprises the following steps: acquiring available process chamber resources; the available process chamber resource comprises a pre-release process chamber; the acquisition process of the pre-release process chamber comprises the following steps: if it is detected that the last wafer of the current production task is discharged, releasing the process chamber occupied by the current production task to obtain the pre-release process chamber; on the basis of a process path of a target process task in the to-be-allocated production task and available process chamber resources, resource allocation is performed on the target process task; and generating a corresponding scheduling sequence based on the target process task of the obtained resource allocation. Therefore, when the last wafer of the production task is discharged, the process chamber occupied by the production task is released, so that the process chamber resources can be ensured to be continuously used, the utilization rate of the chamber resources is effectively improved, and a guarantee is provided for improving the preparation efficiency of a semiconductor.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a scheduling method, scheduling equipment and semiconductor process equipment. Background Art

[0002] With the continuous progress of scientific and technological productivity, the whole society is becoming more and more information-based and intelligent, and the demand for semiconductors is becoming more and more vigorous. Among them, how to improve the utilization rate of chamber resources in the semiconductor preparation process is of great significance to improving the efficiency of semiconductor preparation. Summary of the invention

[0003] In view of this, the present application is committed to providing a scheduling method, scheduling equipment and semiconductor process equipment, which can improve the utilization rate of chamber resources and thus improve the production efficiency of semiconductors.

[0004] A first aspect of the present application provides a scheduling method, which is applied to a semiconductor process equipment, wherein the semiconductor process equipment is equipped with at least one process chamber; the method comprises:

[0005] Obtaining available process chamber resources; the available process chamber resources include a pre-release process chamber; the acquisition process of the pre-release process chamber includes: if it is detected that the last wafer of the current production task is out, the process chamber occupied by the current production task is released to obtain the pre-release process chamber;

[0006] Allocate resources for the target process task based on the process path of the target process task in the production task to be allocated and the available process chamber resources;

[0007] Based on the target process task for resource allocation, a corresponding scheduling sequence is generated; the scheduling sequence is used to schedule wafers and allocated chamber resources.

[0008] Optionally, the acquisition process of the pre-release process chamber further includes:

[0009] If it is detected that there are multiple occupied parallel process chambers, and the number of parallel process chambers used by the wafers participating in the scheduling in the current process task is less than the number of the multiple parallel process chambers, the remaining process times of the multiple parallel process chambers are calculated respectively, and the parallel process chambers used by the wafers participating in the scheduling are determined from short to long according to the remaining process times, and the resources of the remaining parallel process chambers are released to obtain the pre-released process chambers.

[0010] Optionally, before allocating resources for the target process task based on the process path of the target process task in the production task to be allocated and the available process chamber resources, the method further includes:

[0011] If a production task is received, each process task in the received production task will be added to the task queue in the order in which it is received.

[0012] Optionally, allocating resources for the process tasks based on the process path of the target process tasks in the production tasks to be allocated and the available process chamber resources includes:

[0013] Retrieving the process tasks from the task queue in sequence according to the order in which they are added, and determining the retrieved process tasks as the target process tasks;

[0014] Based on the process path of the target process task in the production tasks to be allocated and the available process chamber resources, resources are allocated for the target process task.

[0015] Optionally, the number of the target process tasks includes multiple;

[0016] The allocating resources for the target process task based on the process path of the target process task in the production task to be allocated and the available process chamber resources includes:

[0017] Based on the available process chamber resources, after allocating resources to the target process task by using the process path of the target process task in the production task to be allocated, the available process chamber resources are occupied by using the production task to be allocated;

[0018] Based on the occupied available process chamber resources, resources are allocated in sequence to the remaining target process tasks in the to-be-allocated production tasks according to the corresponding process paths and retrieval sequences.

[0019] Optionally, it also includes:

[0020] If it is detected that among the production tasks to be allocated, there is a process task whose process path uses resources in a manner that is the same as the resource usage of the corresponding process path in the pre-released process chamber resources, then based on the pre-released process chamber resources, resource allocation can be prioritized for the process tasks with the same resource usage in the production tasks to be allocated.

[0021] Optionally, the resource usage mode includes a process mode and a process recipe;

[0022] The resource usage mode of the process path of the process task is the same as the resource usage mode of the corresponding process path in the pre-release process chamber resources, including: the process mode and process recipe of the process path of the process task are the same as the process mode and process recipe of the corresponding process path in the pre-release process chamber resources.

[0023] Optionally, it also includes:

[0024] If the available process chamber resources do not meet the resource allocation requirement of the current target process task, the allocation of the available process chamber resources is suspended until the available process chamber resources meet the resource allocation requirement of the current target process task.

[0025] A second aspect of the present application provides a scheduling device, including:

[0026] A processor, and a memory connected to the processor;

[0027] The memory is used to store computer programs;

[0028] The processor is used to call and execute the computer program in the memory to perform the scheduling method as described in the first aspect of the present application.

[0029] A third aspect of the present application provides a semiconductor process device, comprising at least one process chamber, and a scheduling device as described in the second aspect of the present application.

[0030] In the scheme of the present application, the scheduling method can be applied to semiconductor process equipment, and the semiconductor process equipment is equipped with at least one process chamber. When implemented, available process chamber resources can be obtained; available process chamber resources include pre-release process chambers; the acquisition process of pre-release process chambers includes: if it is detected that the last wafer of the current production task is out, the process chamber occupied by the current production task is released to obtain the pre-release process chamber; then based on the process path and available process chamber resources of the target process task in the production task to be allocated, resources are allocated for the target process task; finally, based on the target process task with resource allocation, a corresponding scheduling sequence is generated; the scheduling sequence is used to schedule wafers and allocated chamber resources. In this way, when the last wafer of the production task is out, the process chamber occupied by the production task is released. Compared with the traditional method of releasing the process chamber resources after the wafer is used, it can ensure that the process chamber resources can be used continuously, reduce the time from the wafer of the process task in the next production task to the wafer being transferred to the process chamber, effectively improve the utilization rate of chamber resources, and provide a guarantee for improving the preparation efficiency of semiconductors. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 It is a structural schematic diagram of semiconductor process equipment.

[0033] Figure 2 It is a flowchart of a scheduling method provided by an embodiment of the present application.

[0034] Figure 3 It is a structural schematic diagram of a semiconductor process equipment provided by an embodiment of the present application.

[0035] Figure 4 It is a structural diagram of a computing device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0036] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this specification shall have the common meanings understood by persons with ordinary skills in the field to which this specification belongs. The words "first", "second" and similar words used in the embodiments of this specification do not indicate any order, quantity or importance, but are only used to avoid confusion of constituent elements.

[0037] Unless the context requires otherwise, throughout the specification, "plurality" means "at least two", and "including" is interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" are intended to indicate that a particular feature, structure, material or characteristic associated with the embodiment or example is included in at least one embodiment or example of the specification. The schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0038] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0039] refer to Figure 1 , taking cluster equipment as an example, Figure 1 The structure diagram of a semiconductor process equipment is shown, and the semiconductor process equipment may include a first robot 10, a second robot 20, a wafer loading and unloading position 21, a calibration module 22, a cooling plate 23, a buffer module 24, a vacuum lock 25 and a plurality of process chambers 11; wherein,

[0040] Each wafer loading and unloading position 21 can hold a wafer box, and each wafer box can hold multiple wafers.

[0041] The calibration module 22 may include a slot, and the calibration module 22 may calibrate the wafer placed in the slot.

[0042] Processing chamber 11 (Processing Module), each process chamber 11 may have at least one slot (such as Figure 1 Each process chamber 11 has four slots), and each slot can hold a wafer for processing.

[0043] The cooling plate 23 (Cooler) is used to cool the wafer after processing.

[0044] The first robot 10 can be a double-arm robot. The two arms of the double-arm robot can be 180° and fixed. Each arm has a slot, and each slot can hold a wafer. Generally, the two arms cannot perform wafer picking and placing operations at the same time; the first robot 10 is responsible for transporting wafers between the vacuum lock 25 and multiple process chambers 11.

[0045] The vacuum lock (LoadLock) 25 may have two slots, each slot may hold a wafer, and the vacuum lock 25 may switch between atmospheric state and vacuum state, wherein when the vacuum lock state is switched to atmospheric state, the wafer located on the side of the second robot 20 may be sent into the vacuum lock 25; when the vacuum lock 25 is switched to vacuum state, the wafer located on the side of the first robot 10 may be sent into the vacuum lock 25. The second robot 20 may be a single-arm robot, and the second robot 20 may have a slot, which may hold a wafer, and the second robot 20 may be responsible for transporting wafers between the wafer loading and unloading position 11, the calibration module 22 and the vacuum lock 25.

[0046] The buffer module (Buffer) 24, also known as a material buffer, can load multiple wafers and can be used to prevent the wafer loading and unloading position 21 from storing both processed wafers and unprocessed wafers.

[0047] Understandably, Figure 1 The following is only used to exemplify the feasible structure of the semiconductor process equipment. In other embodiments, the semiconductor process equipment may include more or fewer types of equipment modules. For example, some semiconductor process equipment may include a first robot 10, a second robot 20, a wafer loading and unloading position 21, a calibration module 22, a cooling plate 23, a buffer module 24, a vacuum lock 25 and at least some equipment modules in multiple process chambers 11; the number of equipment modules of the same type included in the semiconductor process equipment may also be different, for example, in Figure 1In the semiconductor process equipment shown, the number of wafer loading and unloading positions 21 is 3, the number of buffer modules 24 is 4, the number of vacuum locks 25 is 2, the number of process chambers 11 is 4, and the number of slots in each process chamber 11 is 4. However, in other embodiments, the number of wafer loading and unloading positions 21 of the semiconductor process equipment can be 2 or 4, etc., the number of buffer modules 24 is 6 or 8, etc., the number of vacuum locks 25 can be 3 or 4, the number of slots in each process chamber 11 is 1 or 2, etc., and the number of process chambers 11 can be 6 or 8, etc. This specification does not limit this and it depends on the actual situation.

[0048] The process route of a wafer refers to the path and required time of the wafer in the semiconductor process equipment determined based on the process requirements such as the process recipe corresponding to the wafer. For example, it may include multiple equipment modules that the wafer passes through in the semiconductor process equipment and the process time required for the wafer to pass through each equipment module. The process route can be generated by a scheduling algorithm based on the process recipe. For example, the wafer process path may include: wafer loading and unloading position->second robot (3 seconds)->calibration module (1 second)->second robot (3 seconds)->vacuum lock (3 seconds)->first robot (3 seconds)->first process chamber (60 seconds)->first robot (3 seconds)->second process chamber (120 seconds)->first robot (3 seconds)->third process chamber (60 seconds)->first robot (3 seconds)->fourth process chamber (60 seconds)->first robot (3 seconds)->vacuum lock (3 seconds)->second robot (3 seconds)->cooling plate (1 second)->second robot (3 seconds)—> Wafer loading and unloading position, where the equipment module passed through each step can be called a process node. The wafer consumes time in the process of each process node. The time marked in brackets can be the time required for the process node. The wafer can be processed in parallel or serially in multiple process chambers 11. In the above process path example, if the first process chamber to the fourth process chamber are all different process chambers, the above process path can be called a serial process path; if there are at least two identical process chambers 11 in the first process chamber to the fourth process chamber, the above process path can be called a re-entrant process path. In addition to the serial process path and the re-entrant process path, if there are multiple process chambers 11 that can be selected for a certain process node, the process path can be called a parallel process path.

[0049] When the process time required for the wafer in the process chamber is relatively long (for example, in the example provided above, the process time of the wafer in the process chamber is significantly longer than the time required for the wafer in the handling step (for example, the step in which the robot grabs the wafer from each equipment module)), the process path corresponding to the wafer can be called a long process time path, and when the process time required for the wafer in the process chamber is relatively short (for example, assuming that the process time of the wafer in the process chamber is similar to the duration of the handling step, for example, in the above example, when the process time of the wafer in the process chamber is 10 seconds or less, the process time of the wafer in the process chamber is not significantly or much longer than the time required for the wafer handling step), the process path corresponding to the wafer can be called a short process time path.

[0050] During the wafer scheduling process, the upper computer of the semiconductor process equipment can use the scheduling algorithm to generate a corresponding process path for each wafer, and generate an execution action based on the process path and the status of the wafer in the semiconductor process equipment and send it to the lower computer. The lower computer can execute the corresponding action on the wafer based on the execution action.

[0051] As the scale of the semiconductor industry continues to grow, people's requirements for production capacity are also increasing. In the design of semiconductor process equipment, the platform architecture of the equipment can have 6K, 8K, and 12K cascade platforms, which can improve the process production capacity of semiconductor process equipment by mounting more process chambers; inside the process chamber, the process chamber capacity is increased by expanding the number of wafers carried inside the same process chamber. Similarly, software control also improves the utilization rate of process chambers and thus increases production capacity through iterative optimization algorithms in scheduling. Therefore, how to improve the optimal ratio of algorithms in automatic tasks and further improve the utilization rate of process chambers to increase production capacity has always been the focus of people's attention.

[0052] The inventors have found that in the existing scheduling methods, scheduling is completed by controlling the wafers to participate in scheduling calculations based on different scheduling modes of tasks. Scheduling modes mainly include pipeline mode, concurrent mode, and serial mode. When a task is in pipeline mode, the task starts to participate in scheduling calculations after waiting for the last wafer of the previous task to leave the wafer transfer box (Foup) and enter the next chamber; when the task is in concurrent mode, the task and other already running tasks immediately participate in scheduling calculations; when the task is in serial mode, the task starts and participates in scheduling calculations after waiting for all wafers of the previous task to return to Foup. However, the scheduling mode of the task is a global variable, and switching the scheduling mode of the task is relatively inconvenient, which can easily cause the parallel chamber to be idle for a long time, making it impossible to fully utilize the resources of each chamber, and even more impossible to meet the production capacity requirements.

[0053] To this end, an embodiment of the present application provides a scheduling method, which can be applied to a semiconductor process device, wherein the semiconductor process device is configured with at least one process chamber; Figure 2 As shown, the scheduling method may at least include the following steps:

[0054] S201, obtaining available process chamber resources; the available process chamber resources include pre-release process chambers; the process of obtaining pre-release process chambers includes: if it is detected that the last wafer of the current production task is out, the process chamber occupied by the current production task is released to obtain the pre-release process chamber.

[0055] Among them, wafer out refers to the wafer leaving the Foup, which is located at the wafer loading and unloading position. The last wafer out marks the last wafer in the Foup entering the process chamber.

[0056] In the related art, when the process chamber resources are used by the wafer, the resources will be released to other process tasks. However, for semiconductor process equipment with multiple process chambers, if there is only one wafer left in the current production task to be put into multiple process chambers, and the multiple process chambers are released only after the wafer completes the process, it often causes a waste of resources. Take four chambers, and each chamber has 4 slots as an example. If only one wafer enters the chamber and is released after the process is completed, then the three slots of the chamber will be wasted, and the production capacity will be reduced by 3. According to 25 wafers per box, the production capacity will be reduced by 3 for each box. If calculated according to the process time of 2 hours (excluding the transfer time), the full production of 24 hours should be 24 / 2*4=48 wafers, but due to the late release of resources, only 45 wafers can be produced. In order to improve the utilization rate of the chamber, releasing resources in advance can significantly improve the efficiency of resource allocation.

[0057] Pre-release means that the resource is reallocated to the subsequent production task while ensuring that it is still occupied by the current production task. Pre-release can ensure the continuity of wafer output. In other words, after the resource is allocated to the production task, the chamber is released after the last wafer using the resource is out of Foup.

[0058] A production task is a collection of tasks. When the user (such as the factory) dispatches semiconductor process equipment, one or more process tasks are combined into a production task. The production task focuses on the control of the overall production plan, and it can specify the order in which the various process tasks are called.

[0059] A process task refers to the task that a wafer needs to perform at the semiconductor process equipment end, and can also be understood as a task (job) for wafers with the same process flow.

[0060] The available chamber resources may further include a process chamber in an idle state. The process chamber in an idle state refers to a process chamber that is not currently performing a process task.

[0061] Accordingly, obtaining available process chamber resources may include obtaining pre-release process chambers and process chambers in an idle state, thereby laying a foundation for subsequent use of available process chamber resources and improving chamber utilization.

[0062] Moreover, in the process of acquiring the pre-released process chamber, after the last wafer of the current production task is output, the process chamber occupied by the current production task is released. Compared with the prior art, the process chamber is released after the process chamber resources are used up by the wafers. This can effectively save the time of waiting for the wafers of the process task in the new production task to be transferred from the Foup to the process chamber in sequence, ensuring that the Foup can output wafers continuously, thereby improving the utilization rate of the chamber resources.

[0063] S202 . Allocate resources for the target process task based on the process path and available process chamber resources of the target process task in the production tasks to be allocated.

[0064] The target process task refers to the process task to which resources should be allocated in sequence among the various process tasks of the production tasks to be allocated.

[0065] For example, the production task Cjob has three process tasks, one of which is Pjob1. When resources are to be allocated to Pjob1, Pjob1 is the target process task. The process path of Pjob1 is Ch1->Ch2. Based on the process path Ch1->Ch2 and the available process chamber resources, resources of Ch1 and Ch2 can be allocated to Pjob1.

[0066] During implementation, after the available process chamber resources are acquired, the available process chamber resources may be cached in a resource list (ResouceList), and the resources may be allocated according to the process path of the target process task.

[0067] S203 . Generate a corresponding scheduling sequence based on the target process task for resource allocation; the scheduling sequence is used to schedule wafers and allocated chamber resources.

[0068] During implementation, the state of the target process task assigned to the resources changes to the running state, and its process path is adjusted according to the actual allocated resources. The process chambers that are not allocated resources in the parallel process chambers are removed from the process path. Based on the adjusted process path and the allocated resources, a corresponding scheduling sequence can be generated. Using this scheduling sequence, wafers and allocated chamber resources can be scheduled to achieve the target process task. In this way, the scheduling algorithm is optimized from the software aspect, and the utilization rate of chamber resources is improved.

[0069] In this embodiment, firstly, available process chamber resources can be obtained; available process chamber resources include pre-release process chambers; the acquisition process of pre-release process chambers includes: if it is detected that the last wafer of the current production task is out, the process chamber occupied by the current production task is released to obtain the pre-release process chamber; then based on the process path and available process chamber resources of the target process task in the production task to be allocated, resources are allocated for the target process task; finally, based on the target process task with resource allocation, a corresponding scheduling sequence is generated; the scheduling sequence is used to schedule wafers and allocated chamber resources. In this way, the process chamber occupied by the production task is released when the last wafer of the production task is out. Compared with the traditional method of releasing the process chamber resources after the wafers have been used, it can ensure that the process chamber resources can be used continuously, reduce the time from the wafer of the process task in the next production task to the wafer being transferred into the process chamber, effectively improve the utilization rate of chamber resources, and provide a guarantee for improving the preparation efficiency of semiconductors.

[0070] In a feasible embodiment, the process of obtaining a pre-released process chamber may further include: if it is detected that there are multiple occupied parallel process chambers, and the number of parallel process chambers used by the wafers participating in the scheduling in the current process task is less than the number of multiple parallel process chambers, then the remaining process time of the multiple parallel process chambers is calculated respectively, and the parallel process chambers used by the wafers participating in the scheduling are determined from short to long according to the remaining process time, and the resources of the remaining parallel process chambers are released to obtain a pre-released process chamber.

[0071] Among them, when calculating the remaining process time of the parallel process chamber, it can be determined based on information such as the available status of the parallel process chamber, available free space, whether cleaning is triggered, the average time used to execute the process, and the current position of the robot, and no specific limitation is made here.

[0072] During implementation, by calculating the remaining process time of multiple parallel process chambers respectively, it is possible to determine which parallel process chamber consumes less time, which helps to select a more efficient process chamber, and allocate the parallel process chamber with less time consumption to the wafers participating in the scheduling of the current production task. Compared with randomly allocating parallel process chambers, it can not only meet the resource allocation needs of the current production task, but also improve the production efficiency of the current production task. In addition, by releasing the resources of the remaining unused parallel process chambers, it can avoid the remaining unused parallel process chambers from being idle due to being occupied, which can further improve the chamber utilization rate.

[0073] For example, the process path of the process task Pjob is Ch1||Ch2||Ch3 (that is, Ch1, Ch2 and Ch3 are parallel process chambers), the number of wafers is 1, among which, Ch1 needs to do switchClean (cleaning) before placing the wafer, and the process time is about 200s; Ch2 is doing IdlePurge (purge) at this time, and the remaining time is 500s; Ch3 needs to do coating (warm chamber), and the process time is about 100s. The parallel process chambers are arranged from short to long according to the remaining process time: Ch3<Ch1<Ch2, and the number of wafers is only 1. Therefore, Pjob only needs to use 1 process chamber, then Ch3 can be selected as the process chamber of the wafer, and the unused process chambers Ch1 and Ch2 can be released to obtain the pre-release process chambers Ch1 and Ch2.

[0074] In a feasible embodiment, before allocating resources for the target process task based on the process path and available process chamber resources of the target process task in the production task to be assigned, the scheduling method also includes: if a production task is received, each process task in the received production task is added to the task queue in sequence according to the order of receipt.

[0075] In actual applications, after receiving the production task sent by the user, each process task in the production task can be added to the task queue in the order of receiving. The arrangement order of each process task in the task queue represents the order in which the chamber resources are allocated to each process task.

[0076] In this way, adding each process task to the task queue provides a guarantee for the resource allocation of each process task in the production task in sequence, avoids the situation where the process task cannot be allocated chamber resources for a long time, improves the efficiency of chamber resource allocation for production tasks, and lays the foundation for improving production capacity.

[0077] Correspondingly, when allocating resources for process tasks based on the process path and available process chamber resources of the target process tasks in the production tasks to be allocated, the process tasks can be first retrieved from the task queue in sequence according to the order of joining, and the retrieved process tasks can be determined as the target process tasks; and then, based on the process path and available process chamber resources of the target process tasks in the production tasks to be allocated, resources can be allocated for the target process tasks.

[0078] Retrieving process tasks from the task queue in the order in which they are added can ensure that the tasks that come first can obtain chamber resources first, thus ensuring the orderly allocation of chamber resources.

[0079] In a feasible implementation manner, the number of target process tasks may include multiple ones.

[0080] Accordingly, when allocating resources for the target process task based on the process path of the target process task in the production task to be assigned and the available process chamber resources, the process path of the target process task in the production task to be assigned can be utilized based on the available process chamber resources to allocate resources to the target process task, and then the available process chamber resources can be occupied by the production task to be assigned; based on the occupied available process chamber resources, resources are allocated in sequence to the remaining target process tasks in the production task to be assigned according to the corresponding process path and retrieval order.

[0081] Specifically, after an available process chamber resource is allocated to a process task, the production task to which it belongs will immediately occupy the available process chamber resource, and the process tasks of other production tasks need to wait for the production task to release the resource before they can obtain the available process chamber resource. In this way, it can effectively ensure that the production tasks with a higher ranking can be allocated chamber resources first and end first, thereby improving the efficiency of resource allocation. If the rule of giving priority to the production tasks with a higher ranking is not followed, some process tasks in the production task may be completed, but the remaining process tasks cannot obtain resources and are in a long-term waiting situation, resulting in the inability to end the production tasks and low efficiency of resource allocation.

[0082] For example, production task CJob1 has process tasks PJob1 and Pjob2, and production task Cjob2 has process task PJob3. The process paths of each process task are as follows: PJob1: Ch1; PJob2: Ch1->Ch2; PJob3: Ch1->Ch3. PJob1 is assigned Ch1 resources. At this time, PJob2 cannot start because it needs to wait for Ch1 resources of PJob1; CJob2 needs to wait for Ch1 resources of PJob1 and PJob2 in CJob1. When PJob1 of CJob1 releases Ch1, PJob2 of CJob1 takes priority to occupy Ch1 resources, and Ch1 needs to wait until all PJobs in CJob1 are used up before it can be released by Cjob1. After Cjob1 releases Ch1, Ch1 can be assigned to Pjob3 of Cjob2 behind Cjob1.

[0083] In a feasible embodiment, the scheduling method may further include: if it is detected that among the production tasks to be assigned, there is a process task whose process path uses resources in a manner that is the same as the resource usage of the corresponding process path in the pre-released process chamber resources, then based on the pre-released process chamber resources, resource allocation may be prioritized for the process tasks with the same resource usage in the production tasks to be assigned.

[0084] During implementation, a resource mapping table (ResourceMap) can be used to record resource allocation. For available process chamber resources, when resources are allocated to process task PJob1 of production task Cjob1, if process task PJob2 of production task Cjob2 uses resources differently from process task PJob1, process chamber sharing is not possible; however, if process task PJob2 uses resources the same way as process task PJob1, process chamber sharing is possible and added to the resource mapping table.

[0085] Process chamber sharing means that the same process chamber can be used, but not at the same time. Two process tasks that can share a process chamber have priority over the process chamber.

[0086] Specifically, for two process tasks belonging to different production tasks, when the resource usage methods are the same, the process task first allocated to the process chamber can be preferentially allocated to the subsequent process task after the process chamber is released, making the process chamber a pre-release process chamber.

[0087] Among them, resource usage methods may include process modes and process recipes.

[0088] Correspondingly, the resource usage mode of the process path of the process task is the same as the resource usage mode of the corresponding process path in the pre-release process chamber resources, including: the process mode and process recipe of the process path of the process task are the same as the process mode and process recipe of the corresponding process path in the pre-release process chamber resources.

[0089] The process mode refers to the configuration or operation mode of the equipment. For example, the process mode is 1*4 mode, which means that the equipment can process 4 wafers at the same time, and these wafers are arranged in a process chamber to perform the same process steps. During implementation, the process mode may also include 2*2 mode, and / or single-side mode, etc. Similarly, the process recipe may include residence constraints, and / or queue time (Qtime) constraints, etc.

[0090] For example, production task CJob1 has process task PJob1, which has parallel process path: Ch1||Ch2, the usage mode is 1*4 mode, and the process recipe is rcp1; production task CJob2 has process task PJob2, which has parallel process path Ch2||Ch3, the usage mode is 1*4 mode, and the process recipe is rcp1. Then process task PJob1 of production task CJob1 and process task PJob2 of production task CJob2 can share Ch2. When the resource allocation order is production task Cjob1 first and then production task Cjob2, Ch2 is first allocated to process task PJob1 of production task CJob1, and when the last wafer corresponding to Ch2 of production task CJob1 is released, so that Ch2 becomes the pre-release process chamber, Ch2 can be preferentially allocated to process task PJob2 of production task CJob2.

[0091] In a feasible implementation, the scheduling method may further include: if the available process chamber resources do not meet the resource allocation requirements of the current target process task, suspending the allocation of the available process chamber resources until the available process chamber resources meet the resource allocation requirements of the current target process task.

[0092] For example, the process path of process task Pjob1 is a serial path of LA->Ch1->Ch2->LB. When the resources of process task Pjob1 are not met, if there is only one Ch1 that belongs to the available process chamber resources, no resources will be allocated to the subsequent PJob2, otherwise it will cause a resource allocation deadlock.

[0093] As another optional implementation of the content disclosed in the present application, an embodiment of the present application also provides a scheduling device, which can be applied to semiconductor process equipment, and the semiconductor process equipment is equipped with at least one process chamber. Specifically, the scheduling device may include: an acquisition module for acquiring available process chamber resources; the available process chamber resources include pre-release process chambers; the acquisition process of the pre-release process chamber includes: if the last wafer of the current production task is detected to be out, the process chamber occupied by the current production task is released to obtain a pre-release process chamber; a resource allocation module for allocating resources for the target process task based on the process path and available process chamber resources of the target process task in the production task to be allocated; a generation module for generating a corresponding scheduling sequence based on the target process task to which the resource allocation is obtained; the scheduling sequence is used to schedule wafers and allocated chamber resources.

[0094] Optionally, the acquisition module can also be used for: if it is detected that there are multiple occupied parallel process chambers, and the number of parallel process chambers used by the wafers participating in the scheduling in the current process task is less than the number of multiple parallel process chambers, then the remaining process time of the multiple parallel process chambers is calculated respectively, and the parallel process chambers used by the wafers participating in the scheduling are determined from short to long according to the remaining process time, and the resources of the remaining parallel process chambers are released to obtain a pre-released process chamber.

[0095] Optionally, the scheduling device may further include a receiving module, which may be used to: if a production task is received, add each process task in the received production task to the task queue in sequence according to the order of receipt.

[0096] Optionally, the resource allocation module can be specifically used to: retrieve process tasks from the task queue in sequence according to the order in which they were added, and determine the retrieved process tasks as target process tasks; and allocate resources to the target process tasks based on the process path and available process chamber resources of the target process tasks in the production tasks to be allocated.

[0097] Optionally, the number of target process tasks may include multiple ones; when allocating resources for the target process tasks based on the process path of the target process tasks in the production tasks to be allocated and the available process chamber resources, the resource allocation module can be specifically used to: based on the available process chamber resources, utilize the process path of the target process tasks in the production tasks to be allocated, allocate resources to the target process tasks, and then utilize the production tasks to be allocated to occupy the available process chamber resources; based on the occupied available process chamber resources, allocate resources in sequence to the remaining target process tasks in the production tasks to be allocated according to the corresponding process paths and retrieval order.

[0098] Optionally, the resource allocation module can also be used for: if it is detected that in the production tasks to be allocated, the resource usage mode of the process path of the process task is the same as the resource usage mode of the corresponding process path in the pre-released process chamber resources, then based on the pre-released process chamber resources, resource allocation can be given priority to the process tasks with the same resource usage mode in the production tasks to be allocated.

[0099] Optionally, the resource usage method may include a process mode and a process recipe; the resource usage method of the process path of the process task is the same as the resource usage method of the corresponding process path in the pre-release process chamber resources, including: the process mode and process recipe of the process path of the process task are the same as the process mode and process recipe of the corresponding process path in the pre-release process chamber resources.

[0100] Optionally, the resource allocation module may be specifically configured to: if the available process chamber resources do not meet the resource allocation requirements of the current target process task, suspend allocation of the available process chamber resources until the available process chamber resources meet the resource allocation requirements of the current target process task.

[0101] For the specific definition of the scheduling device, please refer to the definition of the scheduling method above, which will not be repeated here. Each module in the above scheduling device can be implemented in whole or in part by software, hardware and a combination thereof. The above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0102] Another embodiment of the present application further provides a scheduling device, including: a processor and a memory;

[0103] Wherein, a memory is connected to the processor, and the memory is used to store a computer program;

[0104] The processor is used to implement the scheduling method as described in any of the above embodiments by running the computer program stored in the memory.

[0105] The embodiment of the present application also provides a semiconductor process equipment, such as Figure 3 As shown, the semiconductor process equipment 100 may include a scheduling device 1001 and a controlled module 1002 as described in any of the above embodiments.

[0106] The controlled module 1002 may include: a first robot 10 , a second robot 20 , a wafer loading and unloading position 21 , a calibration module 22 , a cooling plate 23 , a buffer module 24 , a vacuum lock 25 and a plurality of process chambers 11 .

[0107] Another embodiment of the present application further provides a computing device, see Figure 4 As shown, an exemplary embodiment of the present specification also provides a computing device, including: a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the steps of the scheduling method according to various embodiments of the present specification described in the above embodiments of the present specification are executed.

[0108] The internal structure of the computing device can be as follows Figure 4 As shown, the computing device includes a processor, a memory, a network interface and an input device connected through a system bus. Among them, the processor of the computing device is used to provide computing and control capabilities. The memory of the computing device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computing device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, the steps in the scheduling method according to various embodiments of the present application described in the above embodiments of this specification are performed.

[0109] The processor may include a main processor and may also include a baseband chip, a modem, etc.

[0110] The memory stores a program for executing the technical solution of the present application, and may also store an operating system and other key services. Specifically, the program may include a program code, and the program code includes computer operation instructions. More specifically, the memory may include a read-only memory (ROM), other types of static storage devices that can store static information and instructions, a random access memory (RAM), other types of dynamic storage devices that can store information and instructions, a disk storage, a flash, and the like.

[0111] The processor may be a general-purpose processor, such as a general-purpose central processing unit (CPU), a microprocessor, etc., or an application-specific integrated circuit (ASIC), or one or more integrated circuits for controlling the execution of the program of the scheme of the present invention. It may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component.

[0112] The input device may include a device for receiving data and information input by a user, such as a keyboard, a mouse, a camera, a scanner, a light pen, a voice input device, a touch screen, a pedometer, or a gravity sensor.

[0113] Output devices may include means that allow information to be output to a user, such as display screens, printers, speakers, etc.

[0114] The communication interface may include using any transceiver or the like to communicate with other devices or communication networks, such as Ethernet, Radio Access Network (RAN), Wireless Local Area Network (WLAN), etc.

[0115] The processor executes the program stored in the memory and calls other devices, which can be used to implement each step of any scheduling method provided in the above embodiments of the present application.

[0116] The computing device may also include a display component and a voice component. The display component may be a liquid crystal display or an electronic ink display. The input device of the computing device may be a touch layer covered on the display component, or a button, trackball or touchpad provided on the housing of the computing device, or an external keyboard, touchpad or mouse.

[0117] Those skilled in the art will understand that Figure 4 The structure shown in the figure is only a block diagram of a part of the structure related to the scheme of this specification, and does not constitute a limitation on the computing device to which the scheme of this application is applied. The specific computing device may include more or fewer components than shown in the figure, or combine certain components, or have a different arrangement of components.

[0118] Exemplary computer program products and storage media

[0119] In addition to the above-mentioned methods and devices, the scheduling method provided in the embodiments of the present application may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the scheduling method according to various embodiments of the present specification described in the above "Exemplary Method" section of the present specification.

[0120] The computer program product may be implemented in hardware, software or a combination thereof. In one optional embodiment, the computer program product is implemented as a computer storage medium. In another optional embodiment, the computer program product is implemented as a software product, such as a software development kit (SDK).

[0121] The computer program product may be written in any combination of one or more programming languages ​​to write program code for performing the operations of the embodiments of the present specification, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0122] In addition, an embodiment of the present specification also provides a computer-readable storage medium on which a computer program is stored, and the computer program is executed by a processor to execute the steps of the scheduling method according to various embodiments of the present specification described in the above "Exemplary Method" section of the present specification.

[0123] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this specification can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0124] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0125] The above-mentioned embodiments only express several implementation methods of this specification, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the solutions provided by the embodiments of this specification. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of this specification, which all belong to the protection scope of this specification. Therefore, the protection scope of the patent of this specification shall be based on the attached claims.

Claims

1. A scheduling method, characterized in that: Applied to semiconductor process equipment, the semiconductor process equipment is equipped with at least one process chamber; the method comprises: Obtaining available process chamber resources; the available process chamber resources include a pre-release process chamber; the acquisition process of the pre-release process chamber includes: if it is detected that the last wafer of the current production task is out, the process chamber occupied by the current production task is released to obtain the pre-release process chamber; Allocating resources for the target process task based on the process path of the target process task in the production task to be allocated and the available process chamber resources; Based on the target process task for resource allocation, a corresponding scheduling sequence is generated; the scheduling sequence is used to schedule wafers and allocated chamber resources.

2. The method according to claim 1, characterized in that The acquisition process of the pre-release process chamber also includes: If it is detected that there are multiple occupied parallel process chambers, and the number of parallel process chambers used by the wafers participating in the scheduling in the current process task is less than the number of the multiple parallel process chambers, the remaining process times of the multiple parallel process chambers are calculated respectively, and the parallel process chambers used by the wafers participating in the scheduling are determined from short to long according to the remaining process times, and the resources of the remaining parallel process chambers are released to obtain the pre-released process chambers.

3. The method according to claim 1, characterized in that Before allocating resources for the target process task based on the process path of the target process task in the production task to be allocated and the available process chamber resources, the method further includes: If a production task is received, each process task in the received production task will be added to the task queue in the order in which it is received.

4. The method according to claim 3, characterized in that: The allocating resources for the process tasks based on the process path of the target process tasks in the production tasks to be allocated and the available process chamber resources includes: Retrieving the process tasks from the task queue in sequence according to the order in which they are added, and determining the retrieved process tasks as the target process tasks; Based on the process path of the target process task in the production tasks to be allocated and the available process chamber resources, resources are allocated for the target process task.

5. The method according to any one of claims 1 to 4, characterized in that: The number of the target process tasks includes multiple; The allocating resources for the target process task based on the process path of the target process task in the production task to be allocated and the available process chamber resources includes: Based on the available process chamber resources, after allocating resources to the target process task by using the process path of the target process task in the production task to be allocated, the available process chamber resources are occupied by using the production task to be allocated; Based on the occupied available process chamber resources, resources are allocated in sequence to the remaining target process tasks in the production tasks to be allocated according to the corresponding process paths and retrieval order.

6. The method according to claim 1, characterized in that Also includes: If it is detected that among the production tasks to be allocated, there is a process task whose process path uses resources in a manner that is the same as the resource usage of the corresponding process path in the pre-released process chamber resources, then based on the pre-released process chamber resources, resource allocation can be prioritized for the process tasks with the same resource usage in the production tasks to be allocated.

7. The method according to claim 6, characterized in that The resource usage method includes process mode and process recipe; The resource usage mode of the process path of the process task is the same as the resource usage mode of the corresponding process path in the pre-release process chamber resources, including: the process mode and process recipe of the process path of the process task are the same as the process mode and process recipe of the corresponding process path in the pre-release process chamber resources.

8. The method according to claim 1, characterized in that Also includes: If the available process chamber resources do not meet the resource allocation requirement of the current target process task, the allocation of the available process chamber resources is suspended until the available process chamber resources meet the resource allocation requirement of the current target process task.

9. A scheduling device, characterized in that: include: A processor, and a memory connected to the processor; The memory is used to store computer programs; The processor is used to call and execute the computer program in the memory to perform the scheduling method according to any one of claims 1 to 8.

10. A semiconductor process equipment, characterized in that: The process comprises at least one process chamber and the scheduling device as claimed in claim 9.

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