Scheduling method, scheduling equipment and semiconductor process equipment

Abstract

The invention relates to a scheduling method, scheduling equipment and semiconductor process equipment, and the scheduling method comprises the steps: detecting whether a target acid process tank exists or not based on a first scheduling sequence of a process object; in response to the existence of the target acid process tank, delaying the starting time of the first scheduling sequence by a delay duration, so that when the process object is scheduled based on the delayed first scheduling sequence, the acid replacement time of the target acid process tank and the process time of the process object in the acid process tank are mutually staggered; and in response to the expiration of the starting time for delaying the delay duration, scheduling the process object based on the updated first scheduling sequence. Therefore, after existence of the target acid process tank is detected, the first scheduling sequence can be adjusted, so that the conflict between the process time of the acid process tank and the acid exchange time is eliminated, waste chips caused by excessive soaking in the acid process tank are avoided, and the preparation efficiency and the yield are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a scheduling method, scheduling equipment and semiconductor process equipment. Background Art

[0002] With the continuous progress of scientific and technological productivity, the whole society is becoming more and more information-based and intelligent, and the demand for semiconductors is becoming more and more vigorous. Among them, how to balance the safety and production capacity of the processing object in the semiconductor preparation process is of great significance to improving the preparation efficiency and product quality of semiconductors. Summary of the invention

[0003] In view of this, the present application is committed to providing a scheduling method, scheduling equipment and semiconductor process equipment, which can take into account the safety and production capacity of the processing object and improve product quality and product preparation efficiency.

[0004] A first aspect of the present application provides a scheduling method, which is applied to a semiconductor process equipment, wherein the semiconductor process equipment includes a plurality of acid process tanks and at least one water process tank; the method includes:

[0005] Based on a first scheduling sequence of the process object, detecting whether there is a target acid process tank; wherein the first scheduling sequence includes: the start time of the first scheduling sequence, the scheduling order and scheduling time of each process node in the process path corresponding to the process object, the scheduling time of the acid process tank includes the acid change time of the acid process tank and the process time of the process object in the acid process tank; the target acid process tank is the acid process tank in which the process time of the process object in which the process is performed conflicts with the corresponding acid change time;

[0006] In response to the existence of the target acid process tank, the start time of the first scheduling sequence is delayed by a delay time, so that when the process object is scheduled based on the delayed first scheduling sequence, the acid replacement time of the target acid process tank and the process time of the process object in the acid process tank are staggered;

[0007] In response to expiration of the start time delayed by the delay time, scheduling the process objects based on the updated first scheduling sequence.

[0008] Optionally, the detecting whether there is a target acid process tank includes:

[0009] Based on the first scheduling sequence, each acid process tank in the process path is detected in turn to confirm whether there is an acid process tank whose process time conflicts with the corresponding acid replacement time;

[0010] In response to the presence of an acid process tank whose process time conflicts with the corresponding acid exchange time, it is determined that the target acid process tank exists.

[0011] Optionally, the confirming whether there is an acid process tank whose process time conflicts with the corresponding acid exchange time specifically includes:

[0012] Based on the first scheduling sequence, if it is determined that the process time of the process object in an acid process tank at least partially overlaps with the acid change time of the acid process tank, the acid process tank is confirmed to be an acid process tank whose process time conflicts with the corresponding acid change time.

[0013] Optionally, in response to the existence of the target acid process tank, delaying the start time of the first scheduling sequence by a delay time specifically includes:

[0014] In response to the existence of the target acid process tank and based on the first scheduling sequence, it is determined that there is no parallel acid process tank of the target acid process tank in the process path, the start time of the first scheduling sequence is delayed by the delay time.

[0015] Optionally, it also includes:

[0016] In response to the existence of the target acid process tank and the existence of a parallel acid process tank with the target acid process tank in the process path based on the first scheduling sequence, determining whether a process time of the process object in the parallel acid process tank conflicts with an acid replacement time of the parallel acid process tank;

[0017] In response to the process time of the process object in the parallel acid process tank being staggered with the acid change time of the parallel acid process tank, the first scheduling sequence is updated so that the parallel acid process tank replaces the target process tank as the process node to process the process object.

[0018] Optionally, it also includes:

[0019] In response to the conflict between the process time of the process object in the parallel acid process tank and the acid change time of the parallel acid process tank, respectively calculating the delay time required to stagger the acid change time and the corresponding process time, updating the first scheduling sequence, and selecting the acid process tank with a relatively small delay time value among the target acid process tank and the parallel acid process tank as the target acid process tank;

[0020] Delaying the start time of the first scheduling sequence by a delay time includes:

[0021] The start time delay value of the updated first scheduling sequence is delayed by a relatively small delay duration.

[0022] Optionally, it also includes:

[0023] In the process of scheduling the process object based on the first scheduling sequence, in response to determining that the acid process tank that is located after the current process node in the process path and closest to the current process node is the target acid process tank, the first scheduling sequence is updated so that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank are staggered.

[0024] Optionally, the updating of the first scheduling sequence includes: based on the first scheduling sequence and the residence time constraint of the current process node, if it is determined that the process time of the process object at the current process node can be extended so that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank are staggered without violating the residence time constraint, then the process time of the process object in the first scheduling sequence at the current process node is extended so that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank are staggered, and the process time of the process object at the current process node satisfies the residence time constraint of the current process node.

[0025] Optionally, updating the first scheduling sequence includes:

[0026] Based on the first scheduling sequence and the residence time constraint of the current process node, if it is determined that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank cannot be staggered by extending the process time of the process object at the current process node without violating the residence time constraint, then the acid change time of the target acid process tank in the scheduling sequence is adjusted to after the process time of the process object in the target acid process tank.

[0027] Optionally, before updating the first scheduling sequence, the method further includes:

[0028] Determine whether there is a parallel acid process tank with the target acid process tank in the process path based on the first scheduling sequence;

[0029] The updating of the first scheduling sequence specifically includes: determining that there is no parallel acid process tank of the target acid process tank in the process path, and then updating the first scheduling sequence.

[0030] Optionally, it also includes:

[0031] In response to determining that there is a parallel acid process tank with the target acid process tank in the process path, determining whether a process time of the process object in the parallel acid process tank conflicts with an acid replacement time of the parallel acid process tank;

[0032] The updating of the first scheduling sequence specifically includes: in response to the process time of the process object in the parallel acid process tank being staggered with the acid changing time of the parallel acid process tank, updating the first scheduling sequence so that the parallel acid process tank replaces the target acid process tank as a process node to process the process object.

[0033] Optionally, the acid change time includes the acid change start time and the acid change end time; the process time includes the process start time and the process end time;

[0034] The process time of the process object in an acid process tank at least partially overlaps with the acid replacement time of the acid process tank, specifically including:

[0035] The process end time of the process performed by the process object in the acid process tank is later than the acid change start time of the acid process tank, and the acid change end time of the acid process tank is later than the process start time of the process performed by the process object in the acid process tank.

[0036] Optionally include:

[0037] Calculate the interval between the acid change completion time of the target acid process tank and the process completion time of the first water process tank, and determine the value of the interval as the minimum value of the delay duration; the first water process tank is included in the process path corresponding to the process object, and the scheduling order is located before the target acid process tank and is closest to the target acid process tank.

[0038] A second aspect of the present application provides a scheduling device, including:

[0039] A processor, and a memory connected to the processor;

[0040] The memory is used to store computer programs;

[0041] The processor is used to call and execute the computer program in the memory to perform the process scheduling method as described in the first aspect of the present application.

[0042] The third aspect of the present application provides a semiconductor process equipment, including multiple acid process tanks, at least one water process tank, and the scheduling equipment as described in the second aspect of the present application.

[0043] In the scheme of the present application, the process scheduling method can be applied to semiconductor process equipment, and the semiconductor process equipment includes multiple acid process tanks and at least one water process tank. During implementation, it can be detected whether there is a target acid process tank based on the first scheduling sequence of the process object; wherein, the first scheduling sequence includes: the start time of the first scheduling sequence, the scheduling order and scheduling time of each process node in the process path corresponding to the process object, and the scheduling time of the acid process tank includes the acid change time of the acid process tank and the process time of the process object in the acid process tank; the target acid process tank is the acid process tank in which the process time of the process object in which the process is carried out conflicts with the corresponding acid change time; in response to the existence of the target acid process tank, the start time of the first scheduling sequence is delayed by a delay time, so that when the process object is scheduled based on the delayed first scheduling sequence, the acid change time of the target acid process tank and the process time of the process object in the acid process tank are staggered; in response to the expiration of the start time of the delayed delay time, the process object is scheduled based on the updated first scheduling sequence. In this way, after the existence of the target acid process tank is detected, the start time of the first scheduling sequence can be adjusted so that the end of the acid change of the target acid process tank is staggered with the process time, thereby eliminating the conflict between the process time of the acid process tank and the acid change time, avoiding waste of sheets caused by over-bubbling in the acid process tank, taking into account the safety and production capacity of the process object, and improving the preparation efficiency and yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0045] Figure 1 It is a structural schematic diagram of semiconductor process equipment.

[0046] Figure 2 It is a flowchart of a scheduling method provided by an embodiment of the present application.

[0047] Figure 3 It is a simplified schematic diagram of a process path provided by an embodiment of the present application.

[0048] Figure 4 It is a schematic diagram of adjustment comparison of a first scheduling sequence provided by an embodiment of the present application.

[0049] Figure 5 It is a flowchart of a scheduling method provided by another embodiment of the present application.

[0050] Figure 6It is a schematic diagram of adjustment comparison of a target scheduling sequence provided by an embodiment of the present application.

[0051] Figure 7 It is a structural schematic diagram of a semiconductor process equipment provided by an embodiment of the present application.

[0052] Figure 8 It is a structural diagram of a computing device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0053] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this specification shall have the common meanings understood by persons with ordinary skills in the field to which this specification belongs. The words "first", "second" and similar words used in the embodiments of this specification do not indicate any order, quantity or importance, but are only used to avoid confusion of constituent elements.

[0054] Unless the context requires otherwise, throughout the specification, "plurality" means "at least two", and "including" is interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" are intended to indicate that a particular feature, structure, material or characteristic associated with the embodiment or example is included in at least one embodiment or example of the specification. The schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0055] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0056] In the field of semiconductor manufacturing, the manufacturing of highly integrated electronic devices poses a challenge to efficient semiconductor processing. In order to meet this demand, cleaning equipment in semiconductor process equipment has become one of the key tools in semiconductor manufacturing. Taking tank cleaning equipment as an example, tank cleaning equipment is a multifunctional device used in semiconductor manufacturing processes. It can effectively clean process objects (such as wafers) by controlling parameters such as temperature, pressure, and cleaning liquid concentration. This type of equipment usually consists of multiple studios or modules, each of which is responsible for different cleaning processes.

[0057] refer to Figure 1 , Figure 1A schematic structural diagram of a tank cleaning device is shown. The tank cleaning device may include a transfer area module and a process area module.

[0058] The process area module may include: a process tank module.

[0059] by Figure 1 For example, there are 10 tanks in the process area module, including Tank, EEWD (hand washing tank) and Dry (drying tank) for corresponding process operations. Among them, Tank1, Tank3, Tank4, Tank5, and Tank7 on the machine are acid process tanks, Tank2, Tank6, and Tank8 are water process tanks, EEWD is a hand washing tank, and Tank9 is a drying process tank. Among them, the type of cleaning liquid contained in the water process tank is different from the type of cleaning liquid contained in the acid process tank. For example, the water process tank can be used to contain water (such as deionized water) or other cleaning liquids that do not react with the wafer process (such as some alkaline cleaning liquids).

[0060] During implementation, the process path for wafer processing in the process area is: Tank1–Tank2–Tank3–Tank4–Tank5–Tank6–Tank7–Tank8–Dry. The wafer has a residence time constraint in each process tank. The residence time constraint is used to characterize the maximum time that the wafer is allowed to stay in the process tank after completing the process in the process tank. That is to say, if the preset residence time constraint of the wafer in the process tank is 10 seconds, it is required that the wafer must be removed from the process tank within 10 seconds after the process in the process tank is completed, otherwise the wafer will be damaged. For example, semiconductor process equipment usually constrains the residence time of the water process tank to between 100 seconds and 1800 seconds, and constrains the residence time of the acid process tank to 0 seconds. Compared with the water process tank, the residence constraint of the acid process tank is more stringent.

[0061] Due to the complexity and precision of the semiconductor manufacturing process, the time of each processing step needs to be strictly controlled to ensure the quality and consistency of the final product. However, in semiconductor process equipment, in order to ensure the process quality of the product, the acid process tank must be automatically replaced within a specified time period or process number. Since the automatic acid replacement operation may cause delays and failures in acid replacement, it will also affect the overall process quality and efficiency of the product.

[0062] At present, when planning the scheduling sequence based on the start time of the process task, if the calculated process time of the wafer conflicts with the acid change time of the acid process tank, the planning of the scheduling sequence of the process task will be stopped. After waiting for the acid change to be completed, the start time of the process task and the corresponding scheduling sequence will be replanned to ensure the safety of the processed wafers.

[0063] However, waiting for the acid change to be completed before planning the start time of the process task and the corresponding scheduling sequence will cause the process task to start later, thus affecting production capacity. In other words, the existing processing method cannot take into account both the safety and production capacity of processed wafers, which has an adverse impact on the semiconductor preparation efficiency and product quality.

[0064] In view of this, an embodiment of the present application provides a scheduling method, which can be applied to semiconductor process equipment, wherein the semiconductor process equipment includes multiple acid process tanks and at least one water process tank, such as Figure 2 As shown, the scheduling method may at least include the following steps:

[0065] S201. Detect whether there is a target acid process tank based on a first scheduling sequence of the process object; wherein the first scheduling sequence includes: the start time of the first scheduling sequence, the scheduling order and scheduling time of each process node in the process path corresponding to the process object, the scheduling time of the acid process tank includes the acid change time of the acid process tank and the process time of the process object in the acid process tank; the target acid process tank is the acid process tank in which the process time of the process object performing the process conflicts with the corresponding acid change time.

[0066] The process object may be set according to process requirements, for example, the process object may be a wafer, etc.

[0067] Since the first scheduling sequence includes the start time of the first scheduling sequence, the scheduling order and scheduling time of each process node in the process path corresponding to the process object, based on the first scheduling sequence of the process object, the start time of the first scheduling sequence, the process time of the process object in each process tank, the acid change time of each acid process tank, and the transmission time of the process object between adjacent process tanks, etc. can be determined. Accordingly, based on the process time of the process object in each acid process tank and the acid change time corresponding to the acid process tank, it can be detected whether there is a target acid process tank, thereby providing a basis for subsequent adjustment of the first scheduling sequence, thereby avoiding the occurrence of over-bubbling of the process object in the acid process tank.

[0068] S202. In response to the existence of a target acid process tank, the start time of the first scheduling sequence is delayed by a delay time, so that when the process object is scheduled based on the delayed first scheduling sequence, the acid change time of the target acid process tank and the process time of the process object in the acid process tank are staggered.

[0069] The delay time can be the delay time of the start time of the first scheduling sequence, or the delay time of the process object staying in the first water process tank. The first water process tank is included in the process path corresponding to the process object, and is the water process tank that is located before the target acid process tank in the scheduling order and is closest to the target acid process tank.

[0070] When it is determined that there is a target acid process tank, the delay time of the process object in the first water process tank may be calculated, that is, the delay time of the process object in the nearest water process tank before the acid process tank where the acid exchange conflict occurs may be calculated.

[0071] It should be understood that the calculation of the delay time of the process object in the first water process tank refers to the calculation of the time added to the original residence time of the process object in the first water process tank. By increasing the delay time in the first water process tank, the process time of the target acid process tank located after the first water process tank can be changed, that is, by delaying the process end time of the process object in the first water process tank, the process start time of the process object in the target acid process tank can be delayed, and then the process time of the process object in the target acid process tank and the corresponding acid change time of the target acid process tank are staggered, which lays the foundation for avoiding conflicts between the process time of the target acid process tank and the corresponding acid change time.

[0072] Specifically, when the residence time of the process object in the first water process tank is increased based on the original residence time, the acid replacement end time of the target acid process tank can be matched with the process end time of the first water process tank.

[0073] The end time of acid change of the target acid process tank matches the end time of the process of the first water process tank, which means that the end time of acid change of the target acid process tank is consistent with the end time of the process of the process object in the first water process tank, or the end time of acid change of the target acid process tank is not later than the end time of the process of the process object in the first water process tank and the difference between the two is less than or equal to the preset time difference. In this way, it can be ensured that the end time of acid change of the target acid process tank is consistent or nearly consistent with the end time of the process of the process object in the first water process tank, thereby avoiding the situation where the process time of the process object in the target acid process tank conflicts with the acid change time of the target acid process tank. Among them, the preset time difference can be set according to actual needs as the allowed time error, and is not specifically limited here.

[0074] For example, if the process object is a wafer, the path recipe for the wafer is: Shelf–Opener2–Pusher–Aligner–Tank1–Tank2–Tank3–Tank4–Tank5–Tank6–Tank7–Tank8–Dry–

[0075] Pusher–Opener2–Shelf. Figure 3The figure shows a simplified diagram of the process path, t0 is the start time of the first scheduling sequence (the time when the job (process task) leaves the buffer (buffer module) shown in the figure), and the process end time t3 of Tank5 can be calculated based on t0. If t3>Tank5 acid change start time t2, then there is a conflict between the process time of Tank5 and the acid change time, that is, Tank5 is the target acid process tank, such as Figure 4 The part indicated by A. Figure 4 In the part indicated by B, since the process time of Tank5 conflicts with the acid change time, it can be determined that Tank2 is the first water process tank, and the wafers need to be planned from Tank2 to Tank3 (T2-T3) after the acid change is completed, and the wafer residence time of Tank2 is calculated as t=Tank5 acid change end time-Tank2 process end time; Figure 4 In the part indicated by C, in order to avoid the wafer violating the residence time constraint in Tank2, the start time of the first scheduling sequence can be updated to: t0 + Tank2 wafer residence time t. In this way, the arrival time of the wafer in Tank2 can be delayed, so that the wafer can be moved from the water process tank to the next acid process tank after the acid change is completed without violating the residence time constraint.

[0076] S203: In response to expiration of the start time of the delayed delay time, schedule the process objects based on the updated first scheduling sequence.

[0077] Specifically, after the start time of the first scheduling sequence is delayed, the acid change end time of the target acid process tank can be matched with the process end time of the process object in the first water process tank. Such a setting can not only avoid the conflict between the process time of the process object in the target acid process tank and the acid change time of the target acid process tank to ensure the safety of the process object; but also ensure that the current residence position of the process object is the first water process tank when there is an acid change delay or acid change failure in automatic acid change. Compared with the residence position being the acid process tank, this can better ensure the safety of the process object and avoid the occurrence of over-bubbling of the process object in the acid process tank.

[0078] In this embodiment, it is possible to detect whether a target acid process tank exists based on a first scheduling sequence of the process object; wherein the first scheduling sequence includes: the start time of the first scheduling sequence, the scheduling order and scheduling time of each process node in the process path corresponding to the process object, and the scheduling time of the acid process tank includes the acid change time of the acid process tank and the process time of the process object in the acid process tank; the target acid process tank is an acid process tank in which the process time of the process object performing the process conflicts with the corresponding acid change time; in response to the existence of the target acid process tank, the start time of the first scheduling sequence is delayed by a delay time, so that when the process object is scheduled based on the delayed first scheduling sequence, the acid change time of the target acid process tank and the process time of the process object in the acid process tank are staggered; in response to the expiration of the start time delayed by the delay time, the process object is scheduled based on the updated first scheduling sequence. In this way, after the existence of the target acid process tank is detected, the start time of the first scheduling sequence can be adjusted so that the end of the acid change of the target acid process tank is staggered with the process time, thereby eliminating the conflict between the process time of the acid process tank and the acid change time, avoiding waste of sheets caused by over-bubbling in the acid process tank, taking into account the safety and production capacity of the process object, and improving the preparation efficiency and yield rate.

[0079] In some implementations, the scheduling method may further include: if the target acid process tank does not exist, using the first scheduling sequence as the target scheduling sequence, and using the target scheduling sequence to schedule the process objects.

[0080] During implementation, if there is no target acid process tank, it means that the current first scheduling sequence will not cause the process time of the process object in the acid process tank to conflict with the acid change time corresponding to the acid process tank. At this time, using the first scheduling sequence as the target scheduling sequence can not only avoid the problem of conflict between the process time of the process object in the acid process tank and the acid change time corresponding to the acid process tank, but also take into account the safety and production capacity of the process object.

[0081] In actual applications, due to factors such as unstable machine transmission time and manual modification of acid change configuration, when scheduling process objects based on the target scheduling sequence, there will be a situation where the actual execution time is inconsistent with the planned time of the target scheduling sequence. Specifically, taking the process object as a wafer, when the wafer enters the process area for processing, the process time of the wafer in the acid process tank planned by the target scheduling sequence does not conflict with the corresponding acid change time, but due to action drift, there may be an abnormal scenario in which the process time of the wafer in the acid process tank conflicts with the corresponding acid change time, and when the wafer enters the process area for processing, the acid change time of the acid process tank changes due to manual modification of the acid change configuration, causing the process time of the wafer in the acid process tank to conflict with the acid change time. For the above two abnormal scenarios, if the wafer is made to wait for the acid change to end before entering the corresponding acid process tank for processing, it will cause the wafer to stay in the current process tank for a period of time that exceeds the residence time constraint.

[0082] To this end, in some implementations, Figure 5 As shown, the scheduling method may also include the following implementation steps:

[0083] S501: The start time of the first scheduling sequence expires, and a process object is scheduled based on the first scheduling sequence.

[0084] S502 . In the process of scheduling the process object, it is detected whether the acid process tank located after the current process node in the process path and closest to the current process node is the target acid process tank.

[0085] During the scheduling of the process object, it is detected whether the next acid process tank that is about to arrive is the target acid process tank, so that real-time monitoring of the target acid process tank can be realized during the scheduling process, and then it can be discovered in time that the process time of the process object in the acid process tank conflicts with the corresponding acid change time due to inconsistency with the planned time during the actual processing process, which provides a guarantee and basis for subsequent timely resolution of the problem.

[0086] S503. If it is determined that the acid process tank that is located after the current process node in the process path and closest to the current process node is the target acid process tank, update the first scheduling sequence so that the acid change time of the target acid process tank is staggered with the process time of the process object in the target acid process tank.

[0087] During implementation, updating the first scheduling sequence may specifically include: based on the first scheduling sequence and the residence time constraint of the current process node, if it is determined that the process time of the process object at the current process node can be extended without violating the residence time constraint, so that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank are staggered, then the process time of the process object in the first scheduling sequence at the current process node is extended, so that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank are staggered, and the process time of the process object at the current process node satisfies the residence time constraint of the current process node.

[0088] Among them, the acid change time of the target acid process tank and the process time of the process object in the target acid process tank can be staggered by extending the process time of the process object at the current process node, which means that extending the process time of the process object at the current process node has the effect of staggering the acid change time of the target acid process tank and the process time of the process object in the target acid process tank.

[0089] On the other hand, updating the first scheduling sequence may further include: based on the first scheduling sequence and the residence time constraint of the current process node, if it is determined that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank cannot be staggered by extending the process time of the process object at the current process node without violating the residence time constraint, then the acid change time of the target acid process tank in the first scheduling sequence may be adjusted to after the process time of the process object in the target acid process tank.

[0090] In order to improve the accuracy of scheduling and ensure the yield rate, when scheduling the process objects based on the first scheduling sequence, it can be determined based on the residence time constraint of the first scheduling sequence and the current process tank whether the acid change time of the target acid process tank and the process time of the process object in the target acid process tank can be staggered by extending the time of the process object at the current process node without violating the residence time constraint. If not, the acid change time corresponding to the target acid process tank in the first scheduling sequence is adjusted to after the process time of the process object in the target acid process tank (i.e., delayed acid change), thereby obtaining an updated first scheduling sequence, and the process objects are continuously scheduled based on the updated first scheduling sequence; if so, the process time of the process object in the first scheduling sequence at the current process node can be directly extended, so that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank are staggered, and the process time of the process object at the current process node satisfies the residence time constraint of the current process node; the residence time constraint represents the maximum time allowed for the process object to reside in the process tank after the process is completed; the current process node includes the node corresponding to the process tank where the process object is located at the current moment.

[0091] Specifically, in the first scheduling sequence, the process time of process object in target acid process tank is located after the acid change time corresponding to target acid process tank, that is, after detecting that the next acid process tank to be arrived is the target acid process tank, it is necessary to increase the residence time of process object in current process tank, that is, extend the time of process object in current process node, so that the process time of target acid process tank can be delayed, and then the process time of process object in target acid process tank is located after the acid change time corresponding to target acid process tank. Meanwhile, it is also necessary to detect whether the residence time of increasing process object in current process tank can make process object violate the residence time constraint of current process tank. If it can cause process object to violate the residence time constraint of current process tank, it is illustrated that the scheme of increasing the residence time of process object in current process tank is not feasible, then the acid change time corresponding to target acid process tank can be adjusted to process object after the process time of target acid process tank, that is, delay the acid change time, so as to avoid conflict between acid change time and process time, obtain the first scheduling sequence after updating. If the process object does not violate the residence time constraint of the current process tank, it means that the current solution to increase the residence time of the process object in the current process tank is feasible. In this case, extending the time of the process object in the current process node can avoid the occurrence of the above-mentioned target acid process tank.

[0092] For example, the path recipe of the wafer is: Shelf–Opener2–Pusher–Aligner–Tank1–Tank2–Tank3–Tank4–Tank5–Tank6–Tank7–Tank8–Dry–Pusher–

[0093] Opener2–Shelf, after the wafer enters the process area for processing, the current position is below Tank4. Tank is referred to as T. Figure 6As shown in the figure, the target scheduling sequence plans the wafer scheduling as indicated by a. The acid change of T5 is located after the wafer is transferred from T5 to T6 (T5-T6), thus avoiding the conflict between the T5 process time and the acid change time of T5. However, since the loaded transmission time from T3 to T4 (T3-T4) during the actual execution of the machine is greater than the target scheduling sequence planning time, as shown in the part indicated by b, the T5 process time conflicts with the T5 acid change time. At this time, as shown in the part indicated by c, the T5 process time is adjusted to after the T5 acid change time, and the updated first scheduling sequence can be obtained. It can be seen from the part shown in c that if the loaded transmission of T4-T5 is planned after the acid change of T5 is completed, the wafer will be over-bubbled at T4. Since T4 is an acid process tank and the residence time constraint of T4 is 0, the updated first scheduling sequence will cause the wafer to violate the residence time constraint of T4, so the updated first scheduling sequence is not feasible. At this time, the acid change time needs to be delayed, as indicated in part d. The acid change should be performed after the wafer goes from T5 to T6, that is, the acid change should be performed after the wafer completes the T5 process. This can avoid the conflict between the T5 process time and the T5 acid change time and ensure the safety of the wafer.

[0094] In this embodiment, by performing real-time detection of the target acid process tank during the process processing and adjusting the first scheduling sequence after the existence of the target acid process tank is detected, it is possible to avoid conflicts between the processing time of the acid process tank and the acid change time due to factors such as unstable machine transmission and manual modification of the acid change configuration during the actual processing process, thereby further improving the safety and stability of the processing process.

[0095] In some implementations, in order to further optimize the first scheduling sequence, before updating the first scheduling sequence, the scheduling method may further include: determining whether there is a parallel acid process tank of the target acid process tank in the process path based on the first scheduling sequence.

[0096] Accordingly, updating the first scheduling sequence may specifically include: determining that there is no parallel acid process tank of the target acid process tank in the process path, and then updating the first scheduling sequence.

[0097] If there is no parallel acid process tank for the target acid process tank in the process path, it means that the target acid process tank is irreplaceable. Only by updating the first scheduling sequence can the acid change time of the target acid process tank be staggered with the acid change time of the target acid process tank of the process object, thereby avoiding the occurrence of acid change conflicts.

[0098] In some embodiments, the scheduling method may further include: in response to determining that there is a parallel acid process tank of the target acid process tank in the process path, judging whether the process time of the process object in the parallel acid process tank conflicts with the acid change time of the parallel acid process tank; accordingly, the above-mentioned updating of the first scheduling sequence may specifically include: in response to the process time of the process object in the parallel acid process tank and the acid change time of the parallel acid process tank being staggered with each other, updating the first scheduling sequence so that the parallel acid process tank replaces the target acid process tank as the process node to process the process object.

[0099] If there is a parallel acid process tank of target acid process tank in the process path, it is explained that the target acid process tank has substitutability, and the parallel acid process tank has the possibility of replacing the target acid process tank. Therefore, by judging whether the process time of the process object in the parallel acid process tank and the acid change time of the parallel acid process tank conflict, it can be determined whether the parallel acid process tank can be used to replace the target acid process tank. Therefore, when the process time of the process object in the parallel acid process tank and the acid change time of the parallel acid process tank stagger each other, it is explained that the use of the parallel acid process tank will not occur the situation of acid change conflict, that is, the parallel acid process tank can replace the target acid process tank, then the first scheduling sequence can be updated, so that the parallel acid process tank replaces the target acid process tank, as a process node, the process object is processed. In this way, while ensuring the safety of the process object, process efficiency and yield rate can be improved.

[0100] In some embodiments, the above-mentioned detection of whether there is a target acid process tank can be based on the first scheduling sequence, and each acid process tank in the process path is detected in turn to confirm whether there is an acid process tank whose process time conflicts with the corresponding acid change time; if there is an acid process tank whose process time conflicts with the corresponding acid change time, then in response to the existence of an acid process tank whose process time conflicts with the corresponding acid change time, it is determined that there is a target acid process tank, and the acid process tank with the conflict is determined to be the target acid process tank.

[0101] During implementation, when each acid process tank in the process path is detected in turn based on the first scheduling sequence, the scheduling order of the first scheduling sequence is used as the detection order, and the process time of each acid process tank in the process path corresponding to the process object is detected to confirm whether the process time of the acid process tank conflicts with the corresponding acid change time.

[0102] Specifically, the first scheduling sequence records the scheduling order of each process node, and the scheduling order of the first scheduling sequence is used as the detection order. The acid process tank of each process node is detected based on the scheduling order of each process node. For example, Tank1, Tank3, Tank4, Tank5, and Tank7 are acid process tanks that are performed sequentially during the scheduling process. Tank1 is first detected to determine whether the process time of Tank1 conflicts with the corresponding acid change time. If the process time of Tank1 conflicts with the corresponding acid change time, it means that the process time of the acid process tank conflicts with the corresponding acid change time, and Tank1 can be determined as the target acid process tank; if the process time of Tank1 does not conflict with the corresponding acid change time, Tank3 can be continued to be detected to determine whether the process time of Tank3 conflicts with the corresponding acid change time; in this way, sequential detection is performed, and the acid process tank whose process time conflicts with the corresponding acid change time for the first time detected during the detection process is determined as the target acid process tank.

[0103] It should be noted that, after determining that the first process time conflicts with the corresponding acid change time, there is no need to continue to detect for subsequent acid process tank, because for the first acid process tank (i.e. target acid process tank) that the process time conflicts with the corresponding acid change time, the first scheduling sequence can be adjusted, thereby avoiding the process time of the acid process tank to conflict with the corresponding acid change time. And the adjustment of the first scheduling sequence will affect the process time of each process tank after the target acid process tank, and therefore, if conflict detection is continued to be carried out to each acid process tank, the detection result of the acid process tank after the target acid process tank detected before may be changed due to the process time causing inaccurate. In the embodiment of the present application, after only detecting the first process time and the acid process tank that conflicts with the acid change time, just confirm that the acid process tank is the target acid process tank, and stop the continued detection of the subsequent acid process tank, can save scheduling time, improve the accuracy and scheduling efficiency of scheduling.

[0104] In order to improve the accuracy of scheduling, the above-mentioned confirmation whether there is an acid process tank whose process time conflicts with the corresponding acid change time may specifically include: based on the first scheduling sequence, if it is determined that the process time of the process object in an acid process tank at least partially overlaps with the acid change time of the acid process tank, then confirming that the acid process tank is the acid process tank whose process time conflicts with the corresponding acid change time.

[0105] Among them, the acid change time may include the acid change start time and the acid change end time; the process time may include the process start time and the process end time.

[0106] Correspondingly, the process time of the above-mentioned process object in an acid process tank at least partially overlaps with the acid change time of the acid process tank, and specifically may include: the process end time of the process object in the acid change process tank is later than the acid change start time of the acid process tank, and the acid change end time of the acid process tank is later than the process start time of the process object in the acid process tank.

[0107] In some cases, the process end time being later than the acid change start time does not necessarily lead to a conflict between the process time and the corresponding acid change time. For example, in some cases, if the process end time is later than the acid change start time, but the acid change end time is earlier than the process start time, the acid change has been completed before the process starts, and there is no conflict between the process time and the corresponding acid change time. Therefore, in this embodiment, the process end time is later than the acid change start time, and the acid change end time is later than the process start time as the judgment condition for the acid change conflict. In this way, it can be more accurately judged whether there is a conflict between the process time and the corresponding acid change time, thereby providing a guarantee for taking into account the safety and production capacity of the processing technology object.

[0108] In some embodiments, the scheduling method may further include: calculating the interval between the acid replacement completion time of the target acid process tank and the process completion time of the first water process tank, and determining the value of the interval as the minimum value of the delay time.

[0109] For example, the process end time of the first water process tank is 9:00, the process time of the target acid process tank is 9:30-9:55, and the acid change time corresponding to the target acid process tank is: 9:25-9:45. It can be calculated that the interval between the acid change end time and the process end time of the first water process tank is 45 minutes, that is, the minimum value of the delay time is 45 minutes.

[0110] By calculating the interval between the acid change completion time of the target acid process tank and the process completion time of the first water process tank, a basis can be provided for the subsequent updating of the first scheduling sequence, thereby ensuring that the process time of the target acid process tank and the corresponding acid change time can be staggered with each other, thereby improving the safety and production capacity of the process object.

[0111] In some embodiments, in response to the existence of a target acid process tank, when the start time of the first scheduling sequence is delayed for a delay period, the start time of the first scheduling sequence can be delayed for a delay period in response to the existence of a target acid process tank and the absence of a parallel acid process tank for the target acid process tank in the process path determined based on the first scheduling sequence.

[0112] Specifically, if the target acid process tank has a parallel acid process tank, it means that the target acid process tank is substitutable; if the target acid process tank does not have a parallel acid process tank, it means that the target acid process tank is not substitutable, and the delay operation can only be delayed based on the first scheduling sequence using the target acid process tank in the process path.

[0113] Correspondingly, the scheduling method may further include: in response to the existence of a target acid process tank and determining based on the first scheduling sequence that there is a parallel acid process tank with the target acid process tank in the process path, judging whether the process time of the process object in the parallel acid process tank conflicts with the acid change time of the parallel acid process tank; in response to the process time of the process object in the parallel acid process tank and the acid change time of the parallel acid process tank being staggered with each other, updating the first scheduling sequence so that the parallel acid process tank replaces the target process tank as a process node to process the process object.

[0114] Specifically, if the target acid process tank has a parallel acid process tank, it can be detected whether the process time of the parallel acid process tank and the acid change time of the corresponding parallel acid process tank are staggered; if the process time of the parallel acid process tank and the acid change time of the corresponding parallel acid process tank are staggered, it means that the use of the parallel acid process tank will not cause acid change conflicts, and the first scheduling sequence can be updated so that the parallel acid process tank replaces the target acid process tank as a process node to process the process object.

[0115] If the process time of the parallel acid process tank conflicts with the acid change time of the corresponding parallel acid process tank, it means that even if a replaceable parallel acid process tank is used, the acid change conflict will occur. In response to the conflict between the process time of the process object in the parallel acid process tank and the acid change time of the parallel acid process tank, the delay time required to stagger the acid change time and the corresponding process time can be calculated respectively, the first scheduling sequence is updated, and the acid process tank with a relatively small delay time value is selected as the target acid process tank among the target acid process tank and the parallel acid process tanks.

[0116] Correspondingly, when the start time of the first scheduling sequence is delayed by a delay time, the delay time may be a relatively small delay time for the start time of the updated first scheduling sequence.

[0117] For example, the process path is: Tank2-Tank3 / Tank4–Tank5–Tank6, where Tank3 and Tank4 are parallel acid process tanks. When scheduling, any of the parallel process tanks can be processed. If the acid process tank planned in the original first scheduling sequence is Tank3, when it is detected that there is a conflict between the process time of Tank3 and the acid change time, and there is no conflict between the process time and the acid change time of Tank4, the original first scheduling sequence can be updated. After the process object is moved out of Tank2, it will be changed from entering Tank3 to entering Tank4. In this way, there is no need to re-plan the scheduling time. When it is detected that there is a conflict between the process time of Tank3 and the acid change time, and there is also a conflict between the process time of Tank4 and the acid change time, the delay time required to stagger the acid change time and the corresponding process time can be calculated for Tank3 and Tank4 respectively, and the acid process tank with the smallest delay time value is selected as the acid process tank that the process object needs to enter after this planning, and the update of the first scheduling sequence is completed.

[0118] For another example, the process path is: Tank2-Tank3 / Tank4–Tank5–Tank6, where Tank3 and Tank4 are parallel acid process tanks. If the acid process tank planned in the original target scheduling sequence is Tank3, during the scheduling of the process object, it is detected that there is a conflict between the process time of Tank3 and the acid change time, and there is no conflict between the process time of Tank4 and the acid change time, the original target scheduling sequence can be updated, and the process object can be planned to change from entering Tank3 to entering Tank4. In this way, there is no need to re-plan the scheduling time or delay the acid change.

[0119] As another optional implementation of the content disclosed in the present application, an embodiment of the present application further provides a scheduling device, which is applied to semiconductor process equipment, wherein the semiconductor process equipment includes multiple acid process tanks and at least one water process tank; the scheduling device may include: a detection module, which is used to detect whether there is a target acid process tank based on a first scheduling sequence of a process object; wherein the first scheduling sequence includes: the start time of the first scheduling sequence, the scheduling order and scheduling time of each process node in the process path corresponding to the process object, and the scheduling time of the acid process tank includes the acid change time of the acid process tank and the process time of the process object in the acid process tank; the target acid process tank is an acid process tank in which the process time of the process object performing the process conflicts with the corresponding acid change time; a delay module, which is used to delay the start time of the first scheduling sequence by a delay time in response to the existence of the target acid process tank, so that when the process object is scheduled based on the delayed first scheduling sequence, the acid change time of the target acid process tank and the process time of the process object in the acid process tank are staggered; and a scheduling module, which is used to schedule the process object based on the updated first scheduling sequence in response to the expiration of the start time of the delay time.

[0120] Optionally, when detecting whether there is a target acid process tank, the detection module can be specifically used to: based on the first scheduling sequence, detect each acid process tank in the process path in turn to confirm whether there is an acid process tank whose process time conflicts with the corresponding acid change time; in response to the existence of an acid process tank whose process time conflicts with the corresponding acid change time, determine the existence of a target acid process tank.

[0121] Optionally, when confirming whether there is an acid process tank whose process time conflicts with the corresponding acid change time, the detection module can be specifically used to: based on the first scheduling sequence, if it is determined that the process time of the process object in an acid process tank at least partially overlaps with the acid change time of the acid process tank, then confirm that the acid process tank is an acid process tank whose process time conflicts with the corresponding acid change time.

[0122] Optionally, the delay module can be specifically used to: in response to the existence of a target acid process tank and the absence of a parallel acid process tank of the target acid process tank in the process path determined based on the first scheduling sequence, delay the start time of the first scheduling sequence by a delay duration.

[0123] Optionally, the scheduling module may further include an update module, which may be used to: in response to the existence of a target acid process tank and determining based on the first scheduling sequence that there is a parallel acid process tank with the target acid process tank in the process path, determine whether a process time for the process object to be processed in the parallel acid process tank conflicts with an acid change time of the parallel acid process tank; in response to the process time for the process object to be processed in the parallel acid process tank and the acid change time of the parallel acid process tank being staggered with each other, update the first scheduling sequence so that the parallel acid process tank replaces the target process tank as a process node to process the process object.

[0124] Optionally, the update module can also be used to: in response to the conflict between the process time of the process object in the parallel acid process tank and the acid change time of the parallel acid process tank, respectively calculate the delay time required to stagger the acid change time and the corresponding process time, update the first scheduling sequence, and select the acid process tank with a relatively small delay time value among the target acid process tank and the parallel acid process tanks as the target acid process tank; accordingly, when the start time of the first scheduling sequence is delayed by a delay time, the delay module can be used to: delay the start time of the updated first scheduling sequence by a delay time value with a relatively small delay time.

[0125] Optionally, the update module can also be used to: in the process of scheduling process objects based on the first scheduling sequence, in response to determining that the acid process tank that is located after the current process node in the process path and closest to the current process node is the target acid process tank, update the first scheduling sequence so that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank are staggered.

[0126] Optionally, when updating the first scheduling sequence, the update module can be specifically used to: based on the first scheduling sequence and the residence time constraint of the current process node, if it is determined that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank can be staggered by extending the process time of the process object at the current process node without violating the residence time constraint, then the process time of the process object in the first scheduling sequence at the current process node is extended, so that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank are staggered, and the process time of the process object at the current process node satisfies the residence time constraint of the current process node.

[0127] Optionally, when updating the first scheduling sequence, the update module can also be used to: based on the first scheduling sequence and the residence time constraint of the current process node, if it is determined that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank cannot be staggered by extending the process time of the process object at the current process node without violating the residence time constraint, then the acid change time of the target acid process tank in the scheduling sequence is adjusted to after the process time of the process object in the target acid process tank.

[0128] Optionally, before updating the first scheduling sequence, the update module can also be used to: determine whether there is a parallel acid process tank with the target acid process tank in the process path based on the first scheduling sequence; accordingly, when updating the first scheduling sequence, the update module can be specifically used to: determine that there is no parallel acid process tank with the target acid process tank in the process path, then update the first scheduling sequence.

[0129] Optionally, the update module can also be used to: in response to determining that there is a parallel acid process tank with the target acid process tank in the process path, determine whether the process time for the process object to be processed in the parallel acid process tank conflicts with the acid change time of the parallel acid process tank; accordingly, when updating the first scheduling sequence, the update module can be specifically used to: in response to the process time for the process object to be processed in the parallel acid process tank and the acid change time of the parallel acid process tank being staggered with each other, update the first scheduling sequence so that the parallel acid process tank replaces the target acid process tank as the process node to process the process object.

[0130] Optionally, the acid change time includes the acid change start time and the acid change end time; the process time includes the process start time and the process end time; the process time of the process object in an acid process tank at least partially overlaps with the acid change time of the acid process tank, specifically including: the process end time of the process object in the acid process tank is later than the acid change start time of the acid process tank, and the acid change end time of the acid process tank is later than the process start time of the process object in the acid process tank.

[0131] Optionally, the scheduling device may further include a calculation module, which may be specifically used to: calculate the interval between the acid change completion time of the target acid process tank and the process completion time of the first water process tank, and determine the value of the interval as the minimum value of the delay time; the first water process tank is included in the process path corresponding to the process object, and is a water process tank that is located before the target acid process tank in the scheduling order and is closest to the target acid process tank.

[0132] For the specific definition of the scheduling device, please refer to the definition of the scheduling method above, which will not be repeated here. Each module in the above scheduling device can be implemented in whole or in part by software, hardware and a combination thereof. The above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0133] As another optional implementation of the disclosure of the present application, an embodiment of the present application further provides a scheduling device for updating a first scheduling sequence for executing a process path when a process time of an acid process tank conflicts with a corresponding acid exchange time to obtain a target scheduling sequence. The scheduling device may include a processor and a memory connected to the processor; the memory is used to store a computer program; the processor is used to call and execute the computer program in the memory to execute the process scheduling method as described in any of the above embodiments.

[0134] As another optional implementation of the disclosure of the present application, the embodiment of the present application further provides a semiconductor process equipment, such as Figure 7 As shown, the semiconductor process equipment 100 may include: a scheduling device 101 and a controlled module 102 as described in any of the above embodiments; the controlled module 102 may include a plurality of acid process tanks and at least one water process tank.

[0135] For example, the plurality of acid process tanks may include Tank1, Tank3, Tank4, Tank5, and Tank7, and the at least one water process tank may include Tank2, Tank6, and Tank8.

[0136] The scheduling device 101 is configured to update the first scheduling sequence for executing the process path when a conflict occurs between the process time of the acid process tank and the corresponding acid change time, so that when the process object is scheduled based on the updated first scheduling sequence, the acid change time of the acid process tank and the process time of the process object in the acid process tank are staggered.

[0137] As another optional implementation of the content disclosed in this application, another embodiment of this application also proposes a computing device, see Figure 8 As shown, the computing device may include: a memory and a processor, the memory stores a computer program, and when the processor executes the computer program, it executes the steps of the process scheduling method according to various embodiments of this specification described in the above embodiments of the present application.

[0138] The internal structure of the computing device can be as follows Figure 8 As shown, the computing device includes a processor, a memory, a network interface and an input device connected through a system bus. Among them, the processor of the computing device is used to provide computing and control capabilities. The memory of the computing device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computing device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, the steps of the process scheduling method according to various embodiments of the present specification described in the above embodiments of the present specification are performed.

[0139] The processor may include a main processor and may also include a baseband chip, a modem, etc.

[0140] The memory stores a program for executing the technical solution of the present invention, and may also store an operating system and other key services. Specifically, the program may include a program code, and the program code includes computer operation instructions. More specifically, the memory may include a read-only memory (ROM), other types of static storage devices that can store static information and instructions, a random access memory (RAM), other types of dynamic storage devices that can store information and instructions, a disk storage, a flash, and the like.

[0141] The processor may be a general-purpose processor, such as a general-purpose central processing unit (CPU), a microprocessor, etc., or an application-specific integrated circuit (ASIC), or one or more integrated circuits for controlling the execution of the program of the scheme of the present invention. It may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component.

[0142] The input device may include a device for receiving data and information input by a user, such as a keyboard, a mouse, a camera, a scanner, a light pen, a voice input device, a touch screen, a pedometer, or a gravity sensor.

[0143] Output devices may include means that allow information to be output to a user, such as display screens, printers, speakers, etc.

[0144] The communication interface may include using any transceiver or the like to communicate with other devices or communication networks, such as Ethernet, Radio Access Network (RAN), Wireless Local Area Network (WLAN), etc.

[0145] The processor executes the program stored in the memory and calls other devices, which can be used to implement each step of any process scheduling method provided in the above embodiments of the present application.

[0146] The computing device may also include a display component and a voice component. The display component may be a liquid crystal display or an electronic ink display. The input device of the computing device may be a touch layer covered on the display component, or a button, trackball or touchpad provided on the housing of the computing device, or an external keyboard, touchpad or mouse.

[0147] Those skilled in the art will understand that Figure 8 The structure shown in the figure is only a block diagram of a part of the structure related to the scheme of this specification, and does not constitute a limitation on the computing device to which the scheme of this specification is applied. The specific computing device may include more or fewer components than shown in the figure, or combine certain components, or have a different arrangement of components.

[0148] In addition to the above-mentioned methods and devices, the process scheduling method provided in the embodiments of this specification may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the process scheduling method according to various embodiments of this specification described in the above "Exemplary Method" section of this specification.

[0149] The computer program product may be written in any combination of one or more programming languages ​​to write program code for performing the operations of the embodiments of the present specification, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0150] In addition, an embodiment of the present specification also provides a computer-readable storage medium on which a computer program is stored, and the computer program is executed by a processor to execute the steps of the process scheduling method according to various embodiments of the present specification described in the above "Exemplary Method" section of the present specification.

[0151] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this specification can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0152] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0153] The above-mentioned embodiments only express several implementation methods of this specification, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the solutions provided by the embodiments of this specification. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of this specification, which all belong to the protection scope of this specification. Therefore, the protection scope of the patent of this specification shall be based on the attached claims.

Claims

1. A scheduling method, characterized in that: Applied to semiconductor process equipment, the semiconductor process equipment comprises a plurality of acid process tanks and at least one water process tank; The method comprises: Based on a first scheduling sequence of the process object, detecting whether there is a target acid process tank; wherein the first scheduling sequence includes: the start time of the first scheduling sequence, the scheduling order and scheduling time of each process node in the process path corresponding to the process object, the scheduling time of the acid process tank includes the acid change time of the acid process tank and the process time of the process object in the acid process tank; the target acid process tank is the acid process tank in which the process time of the process object in which the process is performed conflicts with the corresponding acid change time; In response to the existence of the target acid process tank, the start time of the first scheduling sequence is delayed by a delay time, so that when the process object is scheduled based on the delayed first scheduling sequence, the acid replacement time of the target acid process tank and the process time of the process object in the acid process tank are staggered; In response to expiration of the start time delayed by the delay time, scheduling the process objects based on the updated first scheduling sequence.

2. The method according to any one of claim 1, characterized in that: The detecting whether there is a target acid process tank comprises: Based on the first scheduling sequence, each acid process tank in the process path is detected in turn to confirm whether there is an acid process tank whose process time conflicts with the corresponding acid replacement time; In response to the presence of an acid process tank whose process time conflicts with the corresponding acid exchange time, it is determined that the target acid process tank exists.

3. The method according to claim 2, characterized in that The step of confirming whether there is an acid process tank whose process time conflicts with the corresponding acid replacement time specifically includes: Based on the first scheduling sequence, if it is determined that the process time of the process object in an acid process tank at least partially overlaps with the acid change time of the acid process tank, the acid process tank is confirmed to be an acid process tank whose process time conflicts with the corresponding acid change time.

4. The method according to claim 1, characterized in that: In response to the existence of the target acid process tank, delaying the start time of the first scheduling sequence by a delay time specifically includes: In response to the existence of the target acid process tank and based on the first scheduling sequence, it is determined that there is no parallel acid process tank of the target acid process tank in the process path, the start time of the first scheduling sequence is delayed by the delay time.

5. The method according to claim 4, characterized in that Also includes: In response to the existence of the target acid process tank and the existence of a parallel acid process tank with the target acid process tank in the process path based on the first scheduling sequence, determining whether a process time of the process object in the parallel acid process tank conflicts with an acid replacement time of the parallel acid process tank; In response to the process time of the process object in the parallel acid process tank being staggered with the acid change time of the parallel acid process tank, the first scheduling sequence is updated so that the parallel acid process tank replaces the target process tank as the process node to process the process object.

6. The method according to claim 5, characterized in that Also includes: In response to the conflict between the process time of the process object in the parallel acid process tank and the acid change time of the parallel acid process tank, respectively calculating the delay time required to stagger the acid change time and the corresponding process time, updating the first scheduling sequence, and selecting the acid process tank with a relatively small delay time value among the target acid process tank and the parallel acid process tank as the target acid process tank; Delaying the start time of the first scheduling sequence by a delay time includes: The start time delay value of the updated first scheduling sequence is delayed by a relatively small delay duration.

7. The method according to claim 1, characterized in that Also includes: In the process of scheduling the process object based on the first scheduling sequence, in response to determining that the acid process tank that is located after the current process node in the process path and closest to the current process node is the target acid process tank, the first scheduling sequence is updated so that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank are staggered.

8. The method according to claim 7, characterized in that The updating of the first scheduling sequence includes: based on the first scheduling sequence and the residence time constraint of the current process node, if it is determined that the process time of the process object at the current process node can be extended so that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank are staggered without violating the residence time constraint, then the process time of the process object in the first scheduling sequence at the current process node is extended so that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank are staggered, and the process time of the process object at the current process node satisfies the residence time constraint of the current process node.

9. The method according to claim 8, characterized in that The updating of the first scheduling sequence comprises: Based on the first scheduling sequence and the residence time constraint of the current process node, if it is determined that the acid change time of the target acid process tank and the process time of the process object in the target acid process tank cannot be staggered by extending the process time of the process object at the current process node without violating the residence time constraint, then the acid change time of the target acid process tank in the first scheduling sequence is adjusted to after the process time of the process object in the target acid process tank.

10. The method according to claim 7, characterized in that Before updating the first scheduling sequence, the method further includes: Determine whether there is a parallel acid process tank of the target acid process tank in the process path based on the first scheduling sequence; The updating of the first scheduling sequence specifically includes: determining that there is no parallel acid process tank with the target acid process tank in the process path, and then updating the first scheduling sequence.

11. The method according to claim 10, characterized in that Also includes: In response to determining that there is a parallel acid process tank with the target acid process tank in the process path, determining whether a process time of the process object in the parallel acid process tank conflicts with an acid replacement time of the parallel acid process tank; The updating of the first scheduling sequence specifically includes: in response to the process time of the process object in the parallel acid process tank being staggered with the acid changing time of the parallel acid process tank, updating the first scheduling sequence so that the parallel acid process tank replaces the target acid process tank as a process node to process the process object.

12. The method according to claim 3, characterized in that The acid exchange time includes the acid exchange start time and the acid exchange end time; the process time includes the process start time and the process end time; The process time of the process object in an acid process tank at least partially overlaps with the acid replacement time of the acid process tank, specifically including: The process end time of the process performed by the process object in the acid process tank is later than the acid change start time of the acid process tank, and the acid change end time of the acid process tank is later than the process start time of the process performed by the process object in the acid process tank.

13. The method according to claim 12, characterized in that include: Calculate the interval between the acid change completion time of the target acid process tank and the process completion time of the first water process tank, and determine the value of the interval as the minimum value of the delay duration; the first water process tank is included in the process path corresponding to the process object, and the scheduling order is located before the target acid process tank and is closest to the target acid process tank.

14. A scheduling device, characterized in that: include: A processor, and a memory connected to the processor; The memory is used to store computer programs; The processor is used to call and execute the computer program in the memory to perform the process scheduling method as described in any one of claims 1-13.

15. A semiconductor process equipment, characterized in that: It comprises a plurality of acid process tanks, at least one water process tank, and the dispatching device as claimed in claim 14.

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