Glass-based display panel and preparation method thereof

Abstract

The invention relates to the technical field of circuit boards, solves the problem that different conductive circuit layers cannot be reliably conducted in the prior art, and provides a glass-based display panel and a preparation method thereof. The glass-based display panel comprises a first glass substrate and a second glass substrate which are mutually pressed and stacked in parallel; a plurality of first guide contact terminals on the first glass substrate and a plurality of second guide contact terminals on the second glass substrate are opposite in pairs at intervals, and each first guide contact terminal and each second guide contact terminal which are opposite in pairs form a guide contact terminal pair; the circuit conduction layer is extruded between the first glass substrate and the second glass substrate which are laminated, the circuit conduction layer is provided with conductive particles, and the particle size value of the conductive particles is larger than the distance value of the conductive contact terminal pair in the vertical direction perpendicular to the plane where the first glass substrate and the second glass substrate are located; and the conductive particles are crushed so as to conduct the corresponding conductive contact terminal pairs. The method has the advantage that different conductive circuit layers can be reliably conducted.

Description

[0001] This application is a divisional application of the invention patent application filed on December 29, 2023, with the invention name “A glass-based circuit board and its preparation method” and application number 202311868487.0. Technical Field

[0002] The present invention relates to the technical field of circuit boards, and in particular to a glass-based display panel and a preparation method thereof. Background Art

[0003] Traditional PCB boards achieve the conduction of electrical signals between multi-layer substrates by laminating first and then drilling. However, due to the limitation of its own heat dissipation, the substrate is prone to warping and deformation in actual applications. For glass-based display panels with, for example, two layers of glass substrates, glass substrates have the advantages of high thermal conductivity, strong heat dissipation and low thermal expansion rate. However, the drilling of holes on each glass substrate needs to be achieved through a laser process, and the current laser process is basically unable to simultaneously drill holes in two layers of glass substrates that have been laminated together and are too thick, resulting in great difficulty in drilling holes. In addition, since a PP layer needs to be set between the two layers of glass substrates, the strength of the glass substrate and the PP layer is inconsistent. Even when drilling holes at the same time and drilling multiple holes, it is difficult for the laser process to take into account the inconsistent strength of the glass substrate and the PP layer, resulting in a decrease in drilling accuracy. At present, although laser drilling is performed on two glass substrates separately, so that the laser process can meet the needs of drilling holes in a single glass substrate with a relatively thin thickness, when the two glass substrates with holes are pressed together, in order to ensure the conduction of the conductive circuit layers relative to the two glass substrates, the two conductive circuit layers need to be accurately aligned up and down in parallel, which places high requirements on positioning accuracy. However, it is difficult to avoid positioning tolerances in existing equipment, and it is difficult to ensure that the two conductive circuit layers can be accurately aligned each time the two glass substrates are pressed together, resulting in the situation that the two glass substrates cannot be reliably conductive, and then there is a situation where the glass-based display panel operates abnormally due to abnormal conduction.

[0004] Therefore, there is an urgent need to provide a glass-based display panel with reliable conduction between different conductive circuit layers and a preparation method thereof. Summary of the invention

[0005] The present invention aims to solve the problem that different conductive circuit layers of the existing glass-based display panel in the prior art cannot be reliably connected. To achieve one purpose of the present invention, a glass-based display panel is provided, comprising:

[0006] A first glass substrate and a second glass substrate are laminated and arranged in parallel with each other;

[0007] The plurality of first conductive contact terminals on the first glass substrate and the plurality of second conductive contact terminals on the second glass substrate are spaced apart from each other in pairs, and each pair of first conductive contact terminals and second conductive contact terminals facing each other form a conductive contact terminal pair;

[0008] A circuit conductive layer is squeezed between the pressed first glass substrate and the second glass substrate, the circuit conductive layer has conductive particles, the particle size of the conductive particles is greater than the spacing value of the conductive contact terminal pair in the vertical direction perpendicular to the plane where the first glass substrate and the second glass substrate are located, and the conductive particles located between the conductive contact terminal pairs are crushed to connect the corresponding conductive contact terminal pairs.

[0009] Furthermore, a third glass substrate is provided, and two opposite conductive circuit layers of two adjacent glass substrates are respectively provided with a plurality of conductive terminals, and the conductive terminals are paired in pairs to form a plurality of conductive terminal pairs, so that each conductive terminal pair is squeezed and connected through the circuit conductive layer located therebetween.

[0010] Further, the first glass substrate and the second glass substrate are stacked in parallel, the first conductive circuit layer and the second conductive circuit layer are respectively arranged on the opposite sides of the first glass substrate, the third conductive circuit layer and the fourth conductive circuit layer are respectively arranged on the opposite sides of the second glass substrate, and the arrangement of each conductive circuit layer includes an indirect contact arrangement with the side surface of the corresponding glass substrate through a functional layer having an aluminum oxide film layer; the first glass substrate and the second glass substrate are both provided with a plurality of through holes, the inner walls of the through holes are copper plated, and the through holes are filled with a non-conductive resin, the first conductive circuit layer and the second conductive circuit layer are connected through the through holes on the first glass substrate, and the third conductive circuit layer and the fourth conductive circuit layer are connected through the through holes on the second glass substrate, and in the vertical direction, the projection of each through hole on the first glass substrate does not overlap with the projection of each first conductive contact terminal, and the projection of each through hole on the second glass substrate does not overlap with the projection of each second conductive contact terminal.

[0011] Furthermore, a plurality of light-emitting chips electrically connected to the first conductive circuit layer are arranged on the first conductive circuit layer, a plurality of electronic components electrically connected to the first conductive circuit layer are arranged on the fourth conductive circuit layer, and the second conductive circuit layer is connected to the third conductive circuit layer through the conductive contact terminal pairs, so that the electronic components and the light-emitting chips are connected through the conductive contact terminal pairs and the through holes.

[0012] Furthermore, the glass-based display panel also includes a solder resist ink layer, which is arranged on the surface of the second conductive circuit layer on the side away from the first glass substrate, and the top surface of the first contact terminal is higher than the surface of the solder resist ink layer, and the solder resist ink layer is arranged on the surface of the third conductive circuit layer on the side away from the second glass substrate, and the top surface of the second contact terminal is higher than the surface of the solder resist ink layer.

[0013] Furthermore, in the vertical direction, the thickness of the circuit conduction layer located between the two solder resist ink layers is set to 3 to 15 μm, the thickness of each conductive circuit layer is set to 1 to 3 μm, the thickness of the solder resist ink layer is 1 to 5 μm, and the particle size of the conductive particles is set to 2 to 8 μm, and the height of the first contact terminal and the second contact terminal protruding from the conductive circuit layer on which they are arranged is set to 2 to 5 μm.

[0014] To achieve another object of the present invention, a method for preparing a glass-based display panel is provided, comprising the following steps:

[0015] Laying a first glass substrate and a second glass substrate in parallel and laminating them together, so that a plurality of first contact terminals on the first glass substrate and a plurality of second contact terminals on the second glass substrate are spaced apart from each other in pairs to form a plurality of contact terminal pairs;

[0016] A preset pressing force is applied to the circuit conductive layer between each pair of the conductive contact terminals, so that the spacing value of the conductive contact terminal pairs in a direction perpendicular to the plane where the first glass substrate and the second glass substrate are located is smaller than the particle size value of the conductive particles in the circuit conductive layer, and the conductive particles located between the conductive contact terminal pairs are crushed.

[0017] Furthermore, before laminating the first glass substrate and the second glass substrate in parallel so that the plurality of first contact terminals on the first glass substrate and the plurality of second contact terminals on the second glass substrate are spaced apart from each other in pairs to form a plurality of contact terminal pairs, the method further includes:

[0018] providing a first glass substrate and a second glass substrate;

[0019] A first conductive circuit layer and a second conductive circuit layer are respectively formed on two opposite sides of the first glass substrate, and a third conductive circuit layer and a fourth conductive circuit layer are respectively formed on two opposite sides of the second glass substrate;

[0020] providing a third glass substrate;

[0021] A plurality of conductive contact terminals are respectively protrudingly provided on two opposite conductive circuit layers of two adjacent glass substrates, and each conductive contact terminal is paired in pairs to form a plurality of conductive contact terminal pairs;

[0022] The circuit conducting layer between each pair of contact terminals is pressed to achieve conduction.

[0023] Further, the first glass substrate and the second glass substrate are laminated and pressed in parallel so that a plurality of first contact terminals on the first glass substrate and a plurality of second contact terminals on the second glass substrate are spaced apart from each other in pairs to form a plurality of contact terminal pairs, comprising:

[0024] The first glass substrate located relatively above in the vertical direction is heated to 160-200° C. and the second glass substrate located relatively below is heated to 60-80° C.;

[0025] A pressure of 1 to 2 MPa is applied to the first glass substrate for a duration of 2 to 10 seconds, and a pressure of 0.5 to 1.5 MPa is applied to the second glass substrate for a duration of 2 to 5 seconds.

[0026] Further, the first conductive circuit layer and the second conductive circuit layer are respectively formed on the opposite sides of the first glass substrate, and the third conductive circuit layer and the fourth conductive circuit layer are respectively formed on the opposite sides of the second glass substrate, including:

[0027] Forming copper layers on opposite surfaces of the first glass substrate and the second glass substrate respectively by physical vapor deposition;

[0028] Etching each of the copper layers to obtain corresponding copper layers with patterns;

[0029] Performing a first thickening on each of the copper layers, thereby obtaining a first conductive circuit layer and a second conductive circuit layer on opposite sides of the first glass substrate, and obtaining a third conductive circuit layer and a fourth conductive circuit layer on opposite sides of the second glass substrate;

[0030] After the first conductive circuit layer and the second conductive circuit layer are respectively formed on the opposite sides of the first glass substrate, and the third conductive circuit layer and the fourth conductive circuit layer are respectively formed on the opposite sides of the second glass substrate, the method further includes:

[0031] The areas corresponding to the first contact terminals and the second contact terminals located relatively on the second conductive circuit layer and the third conductive circuit layer and having undergone the first thickening are respectively subjected to the second thickening, and the first contact terminals and the second contact terminals are cylindrical in shape with a top circle diameter of 0.5 mm-3 mm and a height of 2 to 5 μm.

[0032] The beneficial effects of the present invention are:

[0033] The glass-based display panel and the preparation method thereof provided by the present invention include: a first glass substrate and a second glass substrate which are laminated and stacked in parallel with each other; a plurality of first contact terminals on the first glass substrate and a plurality of second contact terminals on the second glass substrate are spaced and opposed to each other in pairs, and each pair of first contact terminals and second contact terminals opposed to each other form a contact terminal pair; a circuit conduction layer which is squeezed between the laminated first glass substrate and the second glass substrate, the circuit conduction layer having conductive particles, the particle size of the conductive particles being greater than the spacing value of the contact terminal pair in a direction perpendicular to the plane where the first glass substrate and the second glass substrate are located, and the conductive particles located between the contact terminal pairs are crushed to connect the corresponding contact terminal pairs. The present invention utilizes the circuit conduction layer located between the pair of conductive contact terminals to be squeezed to achieve conduction in the protruding directions of the first conductive contact terminal and the second conductive contact terminal, thereby relatively easily obtaining a multi-layer conductive circuit layer and ensuring excellent conduction of each conductive circuit layer, especially relative to the two conductive circuit layers. While taking into account the high flatness of the glass-based display panel, it meets the requirements of circuit refinement and complexity, thereby obtaining a very high-quality glass-based display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0035] Figure 1 A schematic structural diagram of a glass-based display panel provided by an embodiment of the present invention before the first glass substrate and the second glass substrate are pressed together;

[0036] Figure 2 A schematic diagram of the comparative structure of a first glass substrate and a second glass substrate of a glass-based display panel provided by an embodiment of the present invention before and after lamination;

[0037] Figure 3 for Figure 2 A schematic diagram of the local enlarged structure at point A in the middle;

[0038] Figure 4 A schematic flow chart of a method for preparing a glass-based display panel provided in an embodiment of the invention.

[0039] Description of reference numerals:

[0040] 11-first glass substrate; 12-first conductive circuit layer; 13-second conductive circuit layer; 14-first contact terminal; 21-second glass substrate; 22-third conductive circuit layer; 23-fourth conductive circuit layer; 24-second contact terminal; 3-contact terminal pair; 4-circuit conduction layer; 41-conductive particles; 5-through hole; 6-solder resist ink layer. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described in conjunction with the drawings in the embodiment of the present invention. It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. Moreover, the terms "comprises", "includes" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element limited by the sentence "comprising..." does not exclude the presence of other identical elements in the process, method, article or device including the element. If there is no conflict, the embodiments of the present invention and the various features in the embodiments can be combined with each other, all within the scope of protection of the present invention.

[0042] refer to Figures 1 to 3As an object of the present invention, a glass-based display panel is provided, which includes a first glass substrate 11, a second glass substrate 21, a first conductive circuit layer 12, a second conductive circuit layer 13, a first contact terminal 14, a third conductive circuit layer 22, a fourth conductive line layer 23, a second contact terminal 24 and a circuit conductive layer 4. The first glass substrate 11 and the second glass substrate 21 are stacked in parallel, the first conductive circuit layer 12 and the second conductive circuit layer 13 are respectively arranged on the opposite sides of the first glass substrate 11, and the third conductive circuit layer 22 and the fourth conductive circuit layer 23 are respectively arranged on the opposite sides of the second glass substrate 21. It should be noted that the arrangement of each conductive circuit layer can be either a direct contact arrangement with the corresponding glass substrate side surface or an indirect contact arrangement with the corresponding glass substrate side surface through another functional layer such as an aluminum oxide film layer with improved thermal conductivity and adhesion. A plurality of first contact terminals 14 are protrudingly arranged on the second conductive circuit layer 13, so that each first contact terminal 14 is connected to the second conductive circuit layer 13, and a plurality of second contact terminals 24 are protrudingly arranged on the third conductive circuit layer 22, so that each second contact terminal 24 is connected to the third conductive circuit layer 22. For the first glass substrate 11 and the second glass substrate 21 that are laminated and stacked in parallel, the plurality of first contact terminals 14 on the first glass substrate 11 and the plurality of second contact terminals 24 on the second glass substrate 21 are spaced and opposite to each other in pairs, and each pair of first contact terminals 14 and second contact terminals 24 that are opposite to each other form a contact terminal pair 3. The material of each conductive circuit layer can be copper with good conductivity. The circuit conductive layer 4 is squeezed between the laminated first glass substrate 11 and the second glass substrate 21, and the circuit conductive layer 4 located between each contact terminal pair 3 is squeezed to connect each contact terminal pair 3. In addition, in order to obtain more layers of conductive circuit layers, a third glass substrate can be set in the same manner as described above, and the multiple conductive contact terminals protruding from the two opposite conductive circuit layers of the two adjacent glass substrates are paired in pairs to form a plurality of conductive contact terminal pairs, so that each conductive contact terminal pair achieves conduction by squeezing the circuit conductive layer located therebetween, and so on.Therefore, by respectively arranging two conductive circuit layers on the first glass substrate 11 and the second glass substrate 21, more layers of conductive circuit layers are obtained, and the conductive terminal pair 3 is formed by using the first conductive contact terminals 14 and the second conductive contact terminals 24 on the second conductive circuit layer 13 and the third conductive circuit layer 22. The first glass substrate 11 and the second glass substrate 21, more specifically, the second conductive circuit layer 13 and the third conductive circuit layer 22 are pressed and fixed to each other through the circuit conductive layer 4, and the first glass substrate 11 and the second glass substrate 21 can be punched separately and then pressed to each other, so that the difficulty of punching is significantly reduced, and the circuit conductive layer 4 located between the conductive terminal pair 3 is squeezed to break the conductive particles 41 with conductive function of the circuit conductive layer 4, so as to realize the conduction of the second conductive circuit layer 13 and the third conductive circuit layer 22 in the protruding direction of the paired first conductive contact terminals 14 and the second conductive terminal 24. In addition, as another embodiment, the circuit conduction layer can also use a conductive medium with different thicknesses corresponding to different conductivity coefficients, and the lower the thickness of the conductive medium, the higher the conductivity coefficient. In this case, the thickness of the circuit conduction layer between the contact terminal pairs under the extrusion effect is significantly lower than the thickness of the circuit conduction layer in other areas, so that only the circuit conduction layer with a sufficiently high conductivity between the contact terminal pairs can conduct the contact terminal pairs, and the purpose of conducting the two relative conductive circuit layers can also be achieved. Therefore, it is relatively easy to obtain a multi-layer conductive circuit layer, and use a plurality of contact terminal pairs 3 to conduct the two relative conductive circuit layers. Since the two relative top surfaces of the contact terminal pairs 3 used to squeeze the circuit conduction layer 4 have a certain surface area, the two relative top surfaces overlap in the protruding direction to play a squeezing role, thereby reducing the requirements for the precise alignment of the two conductive circuit layers when the two glass substrates are pressed together, not only ensuring the excellent conduction of each conductive circuit layer, especially the two relative conductive circuit layers, but also avoiding the situation in the prior art where the two glass substrates cannot be reliably conducted due to the inability to ensure the precise alignment of the two conductive circuit layers. Moreover, while taking into account the high flatness of the glass-based display panel, the requirements for circuit refinement and complexity are met, thereby obtaining a glass-based display panel that works reliably.

[0043] Please refer to the following for further reference Figure 2 and Figure 3 Specifically, the circuit conductive layer 4 has conductive particles 41, and the particle size of the conductive particles 41 is greater than the spacing value of the conductive contact terminal pair 3 in the vertical direction perpendicular to the plane where the first glass substrate 11 and the second glass substrate 21 are located. Figure 3As shown, the conductive particles 41 between the conductive contact terminal pairs 3 are crushed to conduct the corresponding conductive contact terminal pairs 3. In this way, by setting the spacing value of the conductive contact terminal pairs 3 to be smaller than the particle size value of the conductive particles 41, it is ensured that the conductive particles 41 of the circuit conductive layer 4 between the conductive contact terminal pairs 3 are crushed to achieve the conduction function, and the spacing value of the second conductive circuit layer 13 and the third conductive circuit layer 22 in the area other than the conductive contact terminal pairs 3 is greater than or equal to the particle size value of the conductive particles 41, so that except for each conductive contact terminal pair 3, no conduction can be conducted, which can improve the reliability of conduction and avoid current leakage and overcurrent damage to the conductive circuit layer.

[0044] Specifically, the first glass substrate 11 and the second glass substrate 21 are both provided with a plurality of through holes 5, which are preferably cylindrical. The first conductive circuit layer 12 and the second conductive circuit layer 13 are connected through the through holes 5 on the first glass substrate 11, and the third conductive circuit layer 22 and the fourth conductive circuit layer 23 are connected through the through holes 5 on the second glass substrate 21. It can be seen that the inner wall of the through hole 5 is copper plated to achieve the connection of the conductive circuit layers arranged on the two surfaces of the glass substrate, and the through hole is filled with a non-conductive resin. In the vertical direction, the projection of each through hole 5 on the first glass substrate 11 does not overlap with the projection of each first contact terminal 14, and the projection of each through hole 5 on the second glass substrate 21 does not overlap with the projection of each second contact terminal 24. Specifically, the number of through holes 5 is as high as about two thousand, and the number of first contact terminals 14 and second contact terminals 24 are both hundreds or thousands. The number of through holes 5, first contact terminals 14 and second contact terminals 24 is determined by the complexity of the circuit. The smaller the point spacing, the more complex the circuit. For example, when the point spacing is P0.9, the number of through holes 5 is at least one thousand or more. Since the projection of the through hole 5 is outside the projection of the first conductive terminal 14 or the second conductive terminal 24 in the vertical direction, that is, the projections of the through holes 5 and the first conductive terminal 14 or the second conductive terminal 24 on the same glass substrate on the same surface of the circuit conductive layer have no overlapping parts, during the pressing process of the first glass substrate 11 and the second glass substrate 21, the reaction force of the through holes 5 from the first conductive terminal 14 or the second conductive terminal 24 on the same glass substrate is at a certain distance from the through holes 5 themselves, compared with the situation where the projection of the through holes 5 at least partially overlaps with the projection of the first conductive terminal 14 or the second conductive terminal 24 in the vertical direction, the adverse situation that the through holes 5 are deformed or even cracked by force can be prevented, thereby ensuring that each conductive terminal pair 3 can reliably conduct electricity. In addition, it is known that a plurality of light-emitting chips electrically connected thereto can be arranged on the first conductive circuit layer 12, and a plurality of electronic components such as ICs electrically connected thereto can be arranged on the fourth conductive line layer 23, and the second conductive circuit layer 13 and the third conductive circuit layer 22 are connected through the conductive contact terminal pairs 3, so that the electronic components and the light-emitting chips can be connected through the conductive contact terminal pairs 3 and the through holes 5. Figure 1Preferably, the glass-based display panel further comprises a solder resist ink layer 6, a solder resist ink layer 6 is arranged on the surface of the side of the second conductive circuit layer 13 away from the first glass substrate 11, and the top surface of the first conductive terminal 14 is higher than the surface of the solder resist ink layer 6, and a solder resist ink layer 6 is arranged on the surface of the side of the third conductive circuit layer 22 away from the second glass substrate 21, and the top surface of the second conductive terminal 24 is higher than the surface of the solder resist ink layer 6. In this case, since the top surfaces of the first conductive terminal 14 and the second conductive terminal 24 are not provided with the solder resist ink layer 6, each conductive terminal pair 3 can have excellent conductive performance, and the solder resist ink layer 6 is prevented from coating each first conductive terminal 14 and each second conductive terminal 24. The conductive circuits other than the first conductive terminal 14 or the second conductive terminal 24 on each glass substrate can play the role of insulation and reflow resistance on the one hand, and can also protect the conductive circuits and increase the life of the glass substrate on the other hand.

[0045] Specifically, the circuit conductive layer 4 is prepared by anisotropic conductive adhesive (ACF), and the anisotropic conductive adhesive adopts a single-layer, double-layer or three-layer structure. In comparison, the larger the number of layers of the anisotropic conductive adhesive, the higher the bonding force can be obtained for the first glass substrate 11 and the second glass substrate 21, especially the second conductive circuit layer 13 and the third conductive circuit layer 22, and the possibility of the second conductive circuit layer 13 and the third conductive circuit layer 22 can be reduced. Therefore, in the present invention, the circuit conductive layer 4 adopts a three-layer anisotropic conductive adhesive. The first contact terminal 14 and the second contact terminal 24 are both set to a cylindrical shape, so as to avoid the problem of tip discharge between the first contact terminal 14 and the second contact terminal 24. With reference to the following Table 1, after many experiments by the applicant, since the top surface of the cylinder is a circular plane and the diameter of the top surface circle is set to 0.5 mm-3 mm, it is not only suitable for various layers of circuit conductive layers 4, but also can make the relative area of ​​the contact terminal pair 3 reasonably large enough after pressing to achieve a better pressing effect for the circuit conductive layer 4 therebetween, so that under the premise that the peeling strength between the circuit conductive layer 4 and each connected glass substrate member is sufficient, the first contact terminal 14 and the second contact terminal will not be easily deformed, occupy the wiring position and affect the circuit routing. In addition, referring to Table 1, for the contact terminals corresponding to the first contact terminal 14 and the second contact terminal 24, when the diameter of the top surface circle of the cylinder is set to 0.5 mm, there is an unfavorable situation that the contact terminal is easily deformed, and when the diameter of the top surface circle of the cylinder is set to 3 mm, there is an unfavorable situation that the conductive circuit layer occupies too much wiring position and affects the circuit routing. Therefore, further, in order to avoid the above two unfavorable situations and according to further experiments of the applicant, the diameter of the top surface circle of the contact terminal can preferably be set to 1 mm-2.5 mm.

[0046] Table 1: Comparison of applicability of different top surface diameter values ​​of contact terminals

[0047]

[0048]

[0049] Specifically, the following specific values ​​are determined based on repeated experiments by the applicant: in the vertical direction, the thickness of the circuit conductive layer 4 is set to 3-15 μm, the thickness of each conductive circuit layer is set to 1-3 μm, and the thickness of the solder resist ink layer 6 is 1-5 μm, and the particle size of the conductive particles 41 is set to 2-8 μm, and the height of the first contact terminal 14 and the second contact terminal 24 protruding from the conductive circuit layer where they are set is set to 2-5 μm. In this way, setting the circuit conductive layer 4 to a relatively thin thickness of 3-15 μm can ensure that the conductive particles in the circuit conductive layer 4 can be crushed by the contact terminal pair 3 under the normal pressing force of the two glass substrates, thereby improving the conductive reliability. Setting the conductive circuit layer to a relatively thin thickness of 1-3 μm can reduce the geometric size of the circuit, which helps to improve the resolution and density of the circuit. Setting the thickness of the solder resist ink layer to a moderate thickness of 1-5 μm is both easier to weld and can provide better protection. The particle size of the conductive particles 41 is set to 2-8 μm, which is conducive to uniform filling in the circuit conductive layer 4 and ensures that the compression deformation caused by the pressing force of the circuit conductive layer 4 is sufficient to crush the conductive particles 41. The protruding height of the first conductive contact terminal 14 and the second conductive contact terminal 24 is set to 2-5 μm, which can make the first conductive contact terminal 14 and the second conductive contact terminal 24 easy to process and have sufficient strength while maintaining the overall thickness of the glass-based display panel obtained after pressing. Therefore, the best performance and reliability can be achieved through the specific and coordinated setting of each value. When the first glass substrate 11 and the second glass substrate 21 are pressed together and the circuit conductive layer 4 between the two glass substrates is squeezed, as long as the pressing force applied ensures that the spacing value between the contact terminal pairs 3 is less than the particle size value of the conductive particles 41, the conductive particles 41 can be crushed. For example, in the case where the height of the first contact terminal 14 and the second contact terminal 24 protruding from the conductive circuit layer where they are arranged is 2μm, the thickness of the solder resist ink layer 6 is 1μm, and the particle size value of the conductive particles 41 is set to 2μm, the thickness of the circuit conductive layer 4 can be set to 3μm, and the first contact terminal 14 and the second contact terminal 24 on each glass substrate protrude 2-1=1μm relative to the solder resist ink layer, so that the spacing value of the contact terminal pairs 3 is d=3-1×2=1μm, and the spacing value d=1μm<the particle size value of the conductive particles 41=2μm, so that the conductive particles 41 between the contact terminal pairs 3 are crushed. In addition, for other situations, by analogy, the thickness of the circuit conductive layer 4 can be set with reference. In addition, in order to ensure a more reliable crushing of the conductive particles 41, it is preferred that the spacing value is less than the particle size value of the conductive particles 41 × 50%. For example, when the particle size value of the conductive particles 41 is set to 6 μm, the spacing value d of the conductive contact terminal pair 3 is preferably set to ≤ 6 μm × 50% = 3 μm.

[0050] As an optional further improvement, at least one white balance resistor with a resistance of thousands of ohms is arranged on at least one conductive circuit layer of the glass-based display panel. For the circuit conduction layer 4 prepared with anisotropic conductive glue, it is configured so that the resistance can be maintained below 2 ohms for a long time after the conductive particles 41 are crushed, thereby having little effect on the resistance of the entire circuit, thereby causing very little energy loss and heat generation, and also not producing a substantial voltage division effect on the driving voltage of the light-emitting chip. Therefore, the use of the circuit conduction layer 4 with conductive particles 41 will not affect the precise current value required for the constant current drive of each LED chip by the driving circuit of the glass-based display panel, thereby ensuring the consistency of brightness and color of each LED chip.

[0051] As another optional further improvement, in order to cope with the extremely low probability of unexpected situations in which the conductive particles 41 in the circuit conduction layer 4 are not crushed, for example, because the light-emitting chips located in the central area of ​​the glass-based display panel have a relatively greater impact on the display effect, a plurality of pairs of conductive contact terminals 3 connected in parallel with the conductive circuit layer can be arranged in the central area corresponding to the glass substrate. In this way, on the one hand, each conductive contact terminal pair 3 can have a voltage-dividing effect, and on the other hand, even if a certain conductive contact terminal pair 3 is not conductive due to failure to crush the conductive particles 41, other conductive contact terminal pairs 3 connected in parallel can also ensure the conduction of the conductive circuit layer, ensuring that there will be no light-emitting chips that cannot be lit, especially in the central area of ​​the glass-based display panel.

[0052] As another object of the present invention, in conjunction with reference Figure 4 The present invention also provides a method for preparing a glass-based display panel. In the absence of conflict, the preparation method described below is applicable to the glass-based display panels of the above embodiments, and the relevant repeated contents are not repeated here. The preparation method comprises the following steps:

[0053] S10: providing a first glass substrate 11 and a second glass substrate 21;

[0054] Specifically, each glass substrate is made of ordinary white glass, which is not only lower in cost but also easier to punch.

[0055] S20: forming a first conductive circuit layer 12 and a second conductive circuit layer 13 on opposite sides of the first glass substrate 11, and forming a third conductive circuit layer 22 and a fourth conductive circuit layer 23 on opposite sides of the second glass substrate 21;

[0056] Specifically, physical vapor deposition (PVD), etching, and thickening processes may be combined to form each conductive circuit layer of a metal layer on a conductive metal such as copper.

[0057] S30: forming a plurality of protruding first contact terminals 14 on the second conductive circuit layer 13, and forming a plurality of protruding second contact terminals 24 on the third conductive circuit layer 22;

[0058] Specifically, the metal layer may be further thickened to form each first contact terminal 14 and each second contact terminal 24 .

[0059] S40: Arranging a circuit conducting layer 4 on the first glass substrate 11 and / or the second glass substrate 21;

[0060] Specifically, an anisotropic conductive paste having conductive particles 41 is provided as the circuit conducting layer 4 .

[0061] S50: Laying the first glass substrate 11 and the second glass substrate 21 in parallel and stacking them, so that the first contact terminals 14 of the second conductive circuit layer 13 and the second contact terminals 24 on the third conductive circuit layer 22 are spaced and opposed to each other to form a plurality of contact terminal pairs 3;

[0062] Specifically, when the first glass substrate 11 and the second glass substrate 21 are pressed together, the corresponding contact terminal pairs 3 are aligned.

[0063] S60: applying a preset pressing force to the circuit conductive layer 4 between each pair of conductive contact terminals 3, so that each pair of conductive contact terminals 3 is conductive;

[0064] Specifically, when the first glass substrate 11 and the second glass substrate 21 are pressed together, the circuit conductive layer 4 between each contact terminal pair 3 is subjected to a preset pressing force, so that the circuit conductive layer 4 is compressed and deformed by the extrusion, and then the conductive particles 41 of the anisotropic conductive glue as an example of the circuit conductive layer 4 are crushed, so that the second conductive circuit layer 13 and the third conductive circuit layer 22 are connected in the protruding directions of the first contact terminal 14 and the second contact terminal 24, respectively, so that each conductive circuit layer can be electrically connected to each other when the glass-based display panel receives power. It should be noted that the preset pressing force can also be understood as a force applied to the opposite surfaces of the first glass substrate 11 and the second glass substrate 21 to fully press the two glass substrates.

[0065] Therefore, the preparation method of the glass-based display panel provided by the present invention can first independently process the first glass substrate 11 and the second glass substrate 21 and then press the two together, so that the difficulty of pressing is significantly reduced, and the conductive contact terminal pair 3 is conducted by squeezing the circuit conductive layer 4 by the conductive contact terminal pair 3, which is beneficial to ensure the excellent conduction of each conductive circuit layer, so that a multi-layer conductive circuit layer is obtained relatively easily, and then a high-quality glass-based display panel is obtained.

[0066] Specifically, step S60 includes: applying a preset pressing force so that the spacing value of the conductive contact terminal pairs 3 in the vertical direction perpendicular to the plane where the first glass substrate 11 and the second glass substrate 21 are located is smaller than the particle size value of the conductive particles 41 of the circuit conductive layer 4, thereby crushing the conductive particles 41 located between the conductive contact terminal pairs 3. In this way, by controlling the preset pressing force applied, it is possible to ensure that the conductive particles 41 of the circuit conductive layer 4 located between the conductive contact terminal pairs 3 are crushed to achieve the conduction function, and it is also possible to ensure that the second conductive circuit layer 13 and the third conductive circuit layer 22 cannot be conductive except for the conductive contact terminal pairs 3, thereby improving the reliability of the conduction between two adjacent glass substrates.

[0067] Preferably, step S50 further comprises:

[0068] S51: heating the first glass substrate 11 located relatively above in the vertical direction to 160-200° C. and heating the second glass substrate 21 located relatively below to 60-80° C.;

[0069] Specifically, the heating temperature difference between the first glass substrate 11 and the second glass substrate 21 helps achieve better adhesion between the glass substrates. The higher heating temperature of the first glass substrate 11 can make it easier to deform, thereby better adapting to the surface shape of the second glass substrate 21.

[0070] S52: applying a pressure of 1-2 MPa to the first glass substrate 11 for a period of 2-10 seconds, and applying a pressure of 0.5-1.5 MPa to the second glass substrate 21 for a period of 2-5 seconds.

[0071] Specifically, applying a relatively greater pressure to the first glass substrate 14 heated at a relatively higher temperature helps to promote better lamination between the two glass substrates and improve the lamination quality. The duration of the application can affect the diffusion and reaction of the substance, thereby affecting the final lamination quality. Applying a relatively smaller pressure to the second glass substrate 24 heated at a relatively lower temperature can more accurately control the lamination process, which helps to prevent excessive deformation or damage to the circuit structure.

[0072] Through repeated experiments by the applicant, on the basis of heating each glass substrate at the above-mentioned specific heating temperature, the first glass substrate 11 and the second glass substrate 21 are respectively pressed with corresponding pressure values ​​and duration values, so that the first glass substrate 11 and the second glass substrate 21 together with the circuit conductive layer 4 therebetween are reliably pressed and fixed, and the circuit conductive layer 4 between the conductive contact terminal pairs 3 that need to be conductive is squeezed to conduct each conductive contact terminal pair 3. In addition, it should be noted that in the above-mentioned specific embodiment: the thickness of the circuit conductive layer 4 is set to 3-15 μm, the thickness of each conductive circuit layer is set to 1-3 μm, the particle size of the conductive particles 41 is set to 2-8 μm, the height of the first conductive contact terminal 14 and the second conductive contact terminal 24 protruding from the conductive circuit layer where they are arranged is set to 2-5 μm, and the thickness of the solder resist ink layer 6 is 1-5 μm. Then, a preset pressing force is applied in steps S51 and S52 to make the thickness of the circuit conductive layer 4 between the two solder resist ink layers 6 be 3-15 μm, thereby ensuring that the spacing value of the conductive contact terminal pairs 3 is smaller than the particle size value of the conductive particles, thereby crushing the conductive particles between the conductive contact terminal pairs 3.

[0073] Specifically, step S20 includes:

[0074] S21: Copper layers are formed on the opposite surfaces of the first glass substrate 11 and the second glass substrate 21 by physical vapor deposition. In addition, preferably, aluminum oxide film layers are first formed on the opposite surfaces by physical vapor deposition, and then copper layers are formed on each aluminum oxide film layer by physical vapor deposition.

[0075] S22: etching each copper layer to obtain a corresponding copper layer with a pattern. Specifically, the copper layer can be etched by laser etching.

[0076] S23: performing a first thickening on each copper layer, so as to obtain a first conductive circuit layer 12 and a second conductive circuit layer 13 on opposite sides of the first glass substrate 11, and obtain a third conductive circuit layer 22 and a fourth conductive circuit layer 23 on opposite sides of the second glass substrate 21. Specifically, the first thickening of the copper layer with a pattern can be performed by chemical plating.

[0077] Step S30 includes:

[0078] S31: Performing second thickening on the areas corresponding to the first contact terminals 14 and the second contact terminals 24 located relatively on the second conductive circuit layer 13 and the third conductive circuit layer 22 after the first thickening, respectively, to obtain cylindrical first contact terminals 14 and second contact terminals 24 with a top circle diameter of 0.5 mm-3 mm and a height of 2 to 5 μm.

[0079] In addition, the method for preparing a glass-based display panel further includes, after step S10 and before step S20, forming a through hole 5 on the first glass substrate 11 and the second glass substrate 21 by laser drilling and copper plating the inner wall of the through hole 5, so that each conductive circuit layer formed by the above-mentioned subsequent steps is connected through the corresponding through hole 5.

[0080] In addition, the method for preparing a glass-based display panel further includes: applying solder resist ink on the first glass substrate 11 and the second glass substrate 21 on which each conductive circuit layer is formed to form a solder resist ink layer 6. In particular, the number of times the side surfaces of each first conductive contact terminal 14 and each second conductive contact terminal 24 are coated is greater than the number of times the top surface is coated, so that the thickness of the solder resist ink layer 6 formed on the side surfaces of the first conductive contact terminal 14 and the second conductive contact terminal 24 is greater than the thickness of the solder resist ink layer 6 formed on the top surface, and the greater width is preferably 30% or more, which can help enhance the adhesion effect of the solder resist ink layer 6 on the side surfaces.

[0081] The above-mentioned method for preparing a glass-based display panel has at least the following advantages:

[0082] 1. By first processing the first glass substrate 11 and the second glass substrate 21 separately and then pressing the two together, the first glass substrate 11 and the second glass substrate 21 can be made of thinner glass substrates, and the defects caused by the existing processing technology for too thick glass, such as punching, will not occur, so that the difficulty of pressing the two glass substrates is significantly reduced.

[0083] 2. The preparation method of the glass-based display panel is simple in process. A plurality of first contact terminals 14 and second contact terminals 24 are formed on each conductive circuit layer to form a contact terminal pair 3. During the pressing process, the circuit conductive layer 4 between the contact terminal pairs 3 is squeezed to achieve the purpose of conducting two relatively conductive circuit layers. The requirements of circuit refinement and complexity can be met at the same time. Different conductive circuit layers can be reliably conducted, so that the glass-based display panel has a very high quality.

[0084] Finally, it should be noted that the conduction described in the present invention can be understood as electrical conduction for conducting current, and the number of contact terminals, contact terminal pairs and the number of circuit conduction layers can be determined according to actual needs. The number of glass substrates can be set to 2, 4, 6 and other multiples of 2 to obtain more layers of conductive circuits that may be desired to facilitate the arrangement of more light-emitting chips electrically connected to the multi-layer conductive circuits on the glass-based display panel, thereby obtaining a higher display resolution. In addition, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention is described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some or all of the technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A glass-based display panel, characterized in that: include: A first glass substrate and a second glass substrate are laminated and arranged in parallel with each other; The plurality of first conductive contact terminals on the first glass substrate and the plurality of second conductive contact terminals on the second glass substrate are spaced apart from each other in pairs, and each pair of first conductive contact terminals and second conductive contact terminals facing each other form a conductive contact terminal pair; A circuit conductive layer is squeezed between the pressed first glass substrate and the second glass substrate, the circuit conductive layer has conductive particles, the particle size of the conductive particles is greater than the spacing value of the conductive contact terminal pair in the vertical direction perpendicular to the plane where the first glass substrate and the second glass substrate are located, and the conductive particles located between the conductive contact terminal pairs are crushed to connect the corresponding conductive contact terminal pairs.

2. The glass-based display panel according to claim 1, characterized in that: A third glass substrate is provided, and two opposite conductive circuit layers of two adjacent glass substrates are respectively provided with a plurality of conductive terminals, and the conductive terminals are paired in pairs to form a plurality of conductive terminal pairs, so that each conductive terminal pair is squeezed through the circuit conductive layer located therebetween to conduct.

3. The glass-based display panel according to claim 1, characterized in that: The first glass substrate and the second glass substrate are stacked in parallel, the first conductive circuit layer and the second conductive circuit layer are respectively arranged on the opposite sides of the first glass substrate, the third conductive circuit layer and the fourth conductive circuit layer are respectively arranged on the opposite sides of the second glass substrate, and the arrangement of each conductive circuit layer includes an indirect contact arrangement with the side surface of the corresponding glass substrate through a functional layer having an aluminum oxide film layer; the first glass substrate and the second glass substrate are both provided with a plurality of through holes, the inner walls of the through holes are copper plated, and the through holes are filled with a non-conductive resin, the first conductive circuit layer and the second conductive circuit layer are connected through the through holes on the first glass substrate, and the third conductive circuit layer and the fourth conductive circuit layer are connected through the through holes on the second glass substrate, and in the vertical direction, the projection of each through hole on the first glass substrate does not overlap with the projection of each first conductive contact terminal, and the projection of each through hole on the second glass substrate does not overlap with the projection of each second conductive contact terminal.

4. The glass-based display panel according to claim 3, characterized in that: A plurality of light-emitting chips electrically connected to the first conductive circuit layer are arranged on the first conductive circuit layer, a plurality of electronic components electrically connected to the fourth conductive circuit layer are arranged on the fourth conductive circuit layer, and the second conductive circuit layer is connected to the third conductive circuit layer through the conductive contact terminal pairs, so that the electronic components and the light-emitting chips are connected through the conductive contact terminal pairs and the through holes.

5. The glass-based display panel according to claim 1, characterized in that: The glass-based display panel also includes a solder resist ink layer, which is arranged on a surface of the second conductive circuit layer on a side away from the first glass substrate, and the top surface of the first contact terminal is higher than the surface of the solder resist ink layer, and the solder resist ink layer is arranged on a surface of the third conductive circuit layer on a side away from the second glass substrate, and the top surface of the second contact terminal is higher than the surface of the solder resist ink layer.

6. The glass-based display panel according to claim 4, characterized in that: In the vertical direction, the thickness of the circuit conduction layer located between the two solder resist ink layers is set to 3 to 15 μm, the thickness of each conductive circuit layer is set to 1 to 3 μm, the thickness of the solder resist ink layer is 1 to 5 μm, and the particle size of the conductive particles is set to 2 to 8 μm, and the height of the first contact terminal and the second contact terminal protruding from the conductive circuit layer where they are arranged is set to 2 to 5 μm.

7. A method for preparing a glass-based display panel, characterized in that: The steps include: Laying a first glass substrate and a second glass substrate in parallel and laminating them together, so that a plurality of first contact terminals on the first glass substrate and a plurality of second contact terminals on the second glass substrate are spaced apart from each other in pairs to form a plurality of contact terminal pairs; A preset pressing force is applied to the circuit conductive layer between each pair of the conductive contact terminals, so that the spacing value of the conductive contact terminal pairs in a direction perpendicular to the plane where the first glass substrate and the second glass substrate are located is smaller than the particle size value of the conductive particles in the circuit conductive layer, and the conductive particles located between the conductive contact terminal pairs are crushed.

8. The method for preparing a glass-based display panel according to claim 7, characterized in that: Before laminating the first glass substrate and the second glass substrate in parallel so that the plurality of first contact terminals on the first glass substrate and the plurality of second contact terminals on the second glass substrate are spaced apart from each other in pairs to form a plurality of contact terminal pairs, the method further comprises: providing a first glass substrate and a second glass substrate; A first conductive circuit layer and a second conductive circuit layer are respectively formed on two opposite sides of the first glass substrate, and a third conductive circuit layer and a fourth conductive circuit layer are respectively formed on two opposite sides of the second glass substrate; providing a third glass substrate; A plurality of conductive contact terminals are respectively protrudingly provided on two opposite conductive circuit layers of two adjacent glass substrates, and each conductive contact terminal is paired in pairs to form a plurality of conductive contact terminal pairs; The circuit conducting layer between each pair of contact terminals is pressed to achieve conduction.

9. The method for preparing a glass-based display panel according to claim 7, characterized in that: The method of laminating the first glass substrate and the second glass substrate in parallel so that the plurality of first contact terminals on the first glass substrate and the plurality of second contact terminals on the second glass substrate are spaced apart from each other in pairs to form a plurality of contact terminal pairs comprises: The first glass substrate located relatively above in the vertical direction is heated to 160-200° C. and the second glass substrate located relatively below is heated to 60-80° C.; A pressure of 1 to 2 MPa is applied to the first glass substrate for a duration of 2 to 10 seconds, and a pressure of 0.5 to 1.5 MPa is applied to the second glass substrate for a duration of 2 to 5 seconds.

10. The method for preparing a glass-based display panel according to claim 8, characterized in that: The steps of forming a first conductive circuit layer and a second conductive circuit layer on opposite sides of the first glass substrate, and forming a third conductive circuit layer and a fourth conductive circuit layer on opposite sides of the second glass substrate include: Forming copper layers on opposite surfaces of the first glass substrate and the second glass substrate respectively by physical vapor deposition; Etching each of the copper layers to obtain corresponding copper layers with patterns; Performing a first thickening on each of the copper layers, thereby obtaining a first conductive circuit layer and a second conductive circuit layer on opposite sides of the first glass substrate, and obtaining a third conductive circuit layer and a fourth conductive circuit layer on opposite sides of the second glass substrate; After the first conductive circuit layer and the second conductive circuit layer are respectively formed on the opposite sides of the first glass substrate, and the third conductive circuit layer and the fourth conductive circuit layer are respectively formed on the opposite sides of the second glass substrate, the method further includes: The areas corresponding to the first contact terminals and the second contact terminals located relatively on the second conductive circuit layer and the third conductive circuit layer and having undergone the first thickening are respectively subjected to the second thickening, and the first contact terminals and the second contact terminals are cylindrical in shape with a top circle diameter of 0.5 mm-3 mm and a height of 2 to 5 μm.

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