FINEPITCH through hole connector welding method

Abstract

The invention relates to a FINE PITCH through hole connector welding method, which comprises the following steps of: inserting pins of a connector into corresponding electroplating through holes in a PCB (Printed Circuit Board), placing a template on one side surface of the PCB, enabling coating holes in the template to correspond to the electroplating through holes in the PCB, fully coating one sides of the coating holes of the template with solder paste, then scraping one side of the template, taking down the template, and welding the FINE PITCH through hole connector on the PCB. The PCB is welded, so that the connector and the PCB are electrically connected, the pins of the connector are located between the solder pastes during welding, the pins are not prone to deflection and deviation during welding, and the method has the advantage that the welding quality of the connector is stable.

Description

Technical Field

[0001] The present application relates to the field of fine pitch connectors, and in particular to a FINE PITCH through-hole connector welding method. Background Art

[0002] Fine pitch connectors are electronic components whose main feature is that the spacing between terminals is very small, thus achieving more compact and higher density connections. With the miniaturization of electronic devices, the spacing of connectors is getting finer and finer, which puts higher requirements on the connector welding technology. At present, traditional welding methods have problems such as high welding difficulty and unstable welding quality when dealing with fine pitch connectors.

[0003] The existing technology usually uses manual welding, hot air welding and other methods to weld fine pitch connectors. However, the existing fine pitch connector welding methods are complicated to operate, with low welding efficiency, and are prone to thermal deformation during welding, which may cause the connector pins to shift in position, often resulting in inaccurate welding, large heat-affected zones, and other problems, affecting the welding quality and the electrical performance of the connector. Summary of the invention

[0004] In order to solve the technical problems of low welding accuracy and unstable welding quality in the welding process of fine pitch connectors, the present application provides a FINE PITCH through-hole connector welding method.

[0005] A FINE PITCH through-hole connector welding method provided in this application adopts the following technical solution: A FINE PITCH through-hole connector welding method comprises the following steps: S1: Insert the connector pins into the corresponding plated through holes on the PCB board; S2: placing the template on one side of the PCB board, and making the coating holes on the template correspond to the positions of the plated through holes on the PCB board one by one; S3: coating one side of the coating hole of the template with solder paste, and then flattening one side of the template; S4: After removing the template, the PCB board is welded to make the connector and the PCB board electrically connected.

[0006] By adopting the above technical solution, the pins of the connector are located at the plated through holes on the PCB board. When the solder paste is scraped on the template, the solder paste enters the plated through holes on the PCB board along the coating holes. During welding, the connector pins are located between the solder pastes. During welding, the pins are not prone to distortion and offset, and the connector welding quality is stable.

[0007] Optionally, in step S1, the connector is placed on a fixed mold, and one end of the connector pin is inserted into the plated through hole from the bottom side of the PCB board.

[0008] By adopting the above technical solution, the bottom-placed pins are inserted into the electroplated through holes of the PCB board, which facilitates the scraping operation on one side of the PCB board.

[0009] Optionally, in step S2, one end of the pin passes through the plated through hole of the PCB board and is located on the outside of the PCB board, and one end of the pin is located at the coating hole of the template.

[0010] By adopting the above technical solution, one end of the pin is located on the outside of the PCB board, which facilitates the welding operation and reduces the problem of cold soldering.

[0011] Optionally, in step S2, there is a gap between the electroplated through hole and the pin, and the aperture of the coating hole on the template is larger than the aperture of the electroplated through hole.

[0012] By adopting the above technical solution, when scraping and applying solder paste, the solder paste is squeezed by the scraping and the dual influence of gravity into the plated through hole and covers the circumferential side wall of the pin, which makes it less likely that the solder paste in the plated through hole will have insufficient tin, resulting in cold solder joints and short circuits.

[0013] Optionally, in step S2, the template and the connector are respectively located at opposite sides of the PCB board, and the position of the template is limited between the PCB board and the positioning piece.

[0014] By adopting the above technical solution, the position between the template and the PCB board is limited by the positioning piece, which facilitates the rapid positioning of the coating holes and the electroplated through holes.

[0015] Optionally, the positioning member includes a clip and a positioning column, the positioning column is threadedly mounted on the template, a clip is rotatably mounted on one end of the positioning column, a side surface of the clip is located on one side of the PCB board, and a clamping groove for clamping one side of the clip is provided on one side surface of the PCB board.

[0016] By adopting the above technical solution, when the template is located on the upper side of the PCB board, the positioning column is rotated to drive the clamp to move. When the clamp moves to the clamping groove side of the PCB board, the clamp clamps the PCB board and the template, and the positioning operation is convenient.

[0017] Optionally, in step S4, the welding method adopted is laser welding.

[0018] By adopting the above technical solutions, laser welding is suitable for large-scale production, with high accuracy, repeatability and high production efficiency.

[0019] In summary, the present application includes at least one of the following beneficial technical effects: 1. The pins of the connector are located at the plated through holes on the PCB board. When the solder paste is scraped on the template, the solder paste enters the plated through holes on the PCB board along the coating holes. During welding, the connector pins are located between the solder pastes. During welding, the pins are not prone to bend or deflection, and the connector welding quality is stable; 2. When the template is located on the upper side of the PCB board, rotate the positioning column to drive the clamp to move. When the clamp moves to the clamping groove side of the PCB board, the clamp clamps the PCB board and the template, making the positioning operation convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the pin welding of this application.

[0021] Figure 2 It is a schematic diagram of the template of the present application being placed on a PCB board and solder paste being scraped and applied.

[0022] Figure 3 It is a cross-sectional view of the template positioning member of the present application.

[0023] Those skilled in the art will appreciate that the elements in the drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the size and position of some elements in the drawings may be exaggerated relative to other elements to help improve understanding of the embodiments of the present invention.

[0024] Figure numerals: 1, pin; 2, PCB board; 21, plated through hole; 211, plating layer; 22, clamping groove; 3, template; 31, coating hole; 4, positioning piece; 41, clip; 42, positioning column. DETAILED DESCRIPTION

[0025] The present application is further described in detail below in conjunction with the accompanying drawings.

[0026] The present application embodiment discloses a FINE PITCH through-hole connector welding method, referring to Figure 1 and Figure 2 , including the following steps: S1: Insert pin 1 of the connector into the corresponding plated through hole 21 on the PCB board 2; S2: placing the template 3 on one side of the PCB board 2, and making the coating holes 31 on the template 3 correspond to the electroplated through holes 21 on the PCB board 2 one by one; S3: coating one side of the coating hole 31 of the template 3 with solder paste, and then smoothing one side of the template 3; S4: After removing the template 3 , soldering is performed on the PCB board 2 to ensure electrical connection between the connector and the PCB board 2 .

[0027] The pin 1 of the connector is located at the plated through hole 21 on the PCB board 2. When the solder paste is scraped on the template 3, the solder paste enters the plated through hole 21 on the PCB board 2 along the coating hole 31. During welding, the connector pin 1 is located between the solder pastes. During welding, the pin 1 is not prone to distortion and offset, and the connector welding quality is stable.

[0028] Reference Figure 2 and Figure 3 The template 3 is located at the upper side of the PCB board 2, and positioning members 4 are provided on the template 3 at two opposite sides. The positioning members 4 include a clip 41 and a positioning column 42. The positioning column 42 is threadedly installed on the template 3, and the clip 41 is rotatably installed on the downward end of the positioning column 42. A clamping groove 22 is provided on the downward side of the PCB board 2; when the template 3 is located on the upper side of the PCB board 2, the positioning column 42 is rotated to drive the clip 41 to move. When the clip 41 moves to the side of the clamping groove 22 on the PCB board 2, the clip 41 clamps the PCB board 2 and the template 3, and the position between the template 3 and the PCB board 2 is limited, which is convenient for quickly positioning the coating hole 31 and the electroplated through hole 21.

[0029] Reference Figure 2 The connector is placed on a fixed mold, and one end of the connector pin 1 is inserted into the plated through hole 21 from the lower side of the PCB board 2. The lower pin 1 is inserted into the plated through hole 21 of the PCB board 2, which is convenient for scraping and coating on one side of the PCB board 2.

[0030] Reference Figure 2 One end of the pin 1 passes through the plated through hole 21 of the PCB board 2 and is located on the outside of the PCB board 2, and one end of the pin 1 is located at the coating hole 31 of the template 3. One end of the pin 1 is located on the outside of the PCB board 2, which facilitates the welding operation and reduces the problem of cold soldering.

[0031] Reference Figure 2 A plating layer 211 is provided inside the plated through hole 21, and there is a gap between the plating layer 211 and the pin 1. The aperture of the coating hole 31 on the template 3 is larger than the aperture of the plating layer 211 at the plated through hole 21. When the solder paste is scraped and applied, the solder paste enters the plated through hole 21 under the dual influence of scraping, extrusion and gravity and covers the circumferential side wall of the pin 1. It is not easy to have insufficient solder paste at the plated through hole 21, resulting in cold solder joints and short circuits.

[0032] The welding method adopted is laser welding, which is suitable for large-scale production, with high precision, repeatability and production efficiency.

[0033] The implementation principle of a FINE PITCH through-hole connector welding method in an embodiment of the present application is as follows: the connector is placed on a fixed mold, the pin 1 is inserted into the corresponding plated through hole 21 on the PCB board 2, the template 3 is placed on one side of the PCB board 2 and limited, so that the coating holes 31 on the template 3 correspond to the positions of the plated through holes 21 on the PCB board 2 one by one, one side of the coating holes 31 of the template 3 is coated with solder paste, and then one side of the template 3 is scraped flat, and after the template 3 is removed, the PCB board 2 is welded to make the connector and the PCB board 2 electrically connected.

[0034] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A FINE PITCH through-hole connector welding method, characterized in that: The following steps are involved: S1: Insert the pins (1) of the connector into the corresponding plated through holes (21) on the PCB (2); S2: placing a template (3) on one side of the PCB board (2), and making the coating holes (31) on the template (3) correspond to the positions of the electroplated through holes (21) on the PCB board (2); S3: coating one side of the coating hole (31) of the template (3) with solder paste, and then smoothing one side of the template (3); S4: After removing the template (3), the PCB board (2) is welded so that the connector and the PCB board (2) are electrically connected.

2. A FINE PITCH through-hole connector welding method according to claim 1, characterized in that: In step S1, the connector is placed on a fixed mold, and one end of the connector pin (1) is inserted into the electroplated through hole (21) from the bottom side of the PCB board (2).

3. A FINE PITCH through-hole connector welding method according to claim 1, characterized in that: In step S2, one end of the pin (1) passes through the plated through hole (21) of the PCB board (2) and is located outside the PCB board (2), and one end of the pin (1) is located in the coating hole (31) of the template (3).

4. A FINE PITCH through-hole connector welding method according to claim 1, characterized in that: In step S2, there is a gap between the electroplated through hole (21) and the lead (1), and the diameter of the coating hole (31) on the template (3) is larger than the diameter of the electroplated through hole (21).

5. A FINE PITCH through-hole connector welding method according to claim 1, characterized in that: In step S2, the template (3) and the connector are respectively located at opposite sides of the PCB board (2), and the position of the template (3) and the PCB board (2) is limited by a positioning member (4).

6. A FINE PITCH through-hole connector welding method according to claim 5, characterized in that: The positioning member (4) comprises a clip (41) and a positioning column (42), wherein the positioning column (42) is threadedly mounted on the template (3), and a clip (41) is rotatably mounted on one end of the positioning column (42), and a side surface of the clip (41) is located at one side of the PCB board (2), and a clamping groove (22) for clamping one side of the clip (41) is provided on one side surface of the PCB board (2).

7. A FINE PITCH through-hole connector welding method according to claim 1, characterized in that: In step S4, the welding method adopted is laser welding.

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